WO2012026187A1 - 放射線検出器 - Google Patents
放射線検出器 Download PDFInfo
- Publication number
- WO2012026187A1 WO2012026187A1 PCT/JP2011/063968 JP2011063968W WO2012026187A1 WO 2012026187 A1 WO2012026187 A1 WO 2012026187A1 JP 2011063968 W JP2011063968 W JP 2011063968W WO 2012026187 A1 WO2012026187 A1 WO 2012026187A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- scintillator layer
- radiation detector
- light receiving
- receiving elements
- support substrate
- Prior art date
Links
- 230000005855 radiation Effects 0.000 title claims abstract description 80
- 239000000758 substrate Substances 0.000 claims abstract description 92
- 239000010410 layer Substances 0.000 claims description 85
- 239000011241 protective layer Substances 0.000 claims description 24
- 238000005520 cutting process Methods 0.000 claims description 12
- 229920006254 polymer film Polymers 0.000 claims description 8
- 239000013078 crystal Substances 0.000 abstract description 18
- 238000001514 detection method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 12
- 239000012790 adhesive layer Substances 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 9
- 238000005452 bending Methods 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000037303 wrinkles Effects 0.000 description 4
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 description 2
- -1 polyparaxylylene Polymers 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002591 computed tomography Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000002600 positron emission tomography Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/20—Measuring radiation intensity with scintillation detectors
- G01T1/202—Measuring radiation intensity with scintillation detectors the detector being a crystal
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B6/00—Apparatus or devices for radiation diagnosis; Apparatus or devices for radiation diagnosis combined with radiation therapy equipment
- A61B6/02—Arrangements for diagnosis sequentially in different planes; Stereoscopic radiation diagnosis
- A61B6/03—Computed tomography [CT]
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
- G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
- G01T1/16—Measuring radiation intensity
- G01T1/161—Applications in the field of nuclear medicine, e.g. in vivo counting
Definitions
- the present invention relates to a radiation detector used for detecting radiation.
- Patent Document 1 a radiation detector using a polymer film as a support substrate that supports a scintillator layer that converts radiation into light is known (for example, see Patent Document 1).
- the radiation flat panel detector described in Patent Document 1 includes a support substrate made of a polymer film, a scintillator layer made of columnar crystals formed on the support substrate, a moisture-proof protective film that wraps the substrate and the scintillator layer, A light receiving element disposed on the side opposite to the support substrate with respect to the scintillator layer and detecting light generated in the scintillator layer on the light receiving surface.
- a radiation detector that employs a resin substrate as a support substrate is known (see, for example, Patent Document 2).
- a radiation detector there is known a radiation detector in which a plurality of light receiving elements are arranged in a tile shape in order to enlarge the detector screen (see, for example, Patent Documents 3 to 6).
- a radiation detector in which a protective film is filled between columnar crystals forming a scintillator layer is known (see, for example, Patent Document 7).
- the polymeric film which has flexibility is employ
- a support substrate and a scintillator layer are deform
- the support substrate and the scintillator layer are deformed to make the distance between the scintillator layer and the light receiving surface uniform, thereby improving the resolution for radiation detection.
- an object of the present invention is to provide a radiation detector capable of improving reliability while achieving a large screen by using a plurality of light receiving elements.
- the radiation detector is composed of a flexible substrate having a radiation incident surface and a radiation surface, a plurality of columnar bodies that are crystal-grown on the radiation surface, and a scintillator layer that generates light by radiation incidence, and covers the scintillator layer.
- a moisture-proof protective layer filled between the plurality of columnar bodies, and a plurality of light receiving elements arranged to face the scintillator layer and detecting light generated in the scintillator layer.
- this radiation detector since a plurality of light receiving elements are used, it is possible to realize a large screen at a lower cost than in the case of using one light receiving element.
- a flexible flexible substrate is adopted as a member for supporting the scintillator layer, even if there is a step between adjacent light receiving elements, the step between the flexible substrate and the scintillator layer is made. It can be deformed following the above. Thereby, in this radiation detector, since the influence of a level
- the moisture-proof protective layer is filled between the columnar bodies of the scintillator layer, the bending of the scintillator layer is compared with the case where the moisture-proof protective layer is not filled between the columnar bodies.
- the strength against deformation can be improved. Therefore, according to this radiation detector, by improving the strength of the scintillator layer against bending deformation, it is possible to avoid the occurrence of problems such as breakage of the scintillator layer 6 due to the deformation, so that the reliability of the radiation detector can be improved. Can be planned.
- the flexible substrate may be composed of a polymer film. According to this radiation detector, a flexible substrate having appropriate strength and flexibility for supporting the scintillator layer can be easily manufactured. In addition, design changes are relatively easy compared to other materials.
- the flexible substrate may have a configuration in which four corners of a rectangular plate are cut with straight lines. According to this radiation detector, the generation of wrinkles at corners due to bending deformation can be reduced as compared with a rectangular plate-like flexible substrate. As a result, in this radiation detector, it is possible to avoid the occurrence of defects such as distortion in the scintillator layer due to the generation of wrinkles on the flexible substrate, so that the reliability of the radiation detector can be improved.
- the radiation detector may further include a base that is disposed on the opposite side of the scintillator layer with respect to the plurality of light receiving elements and supports the plurality of light receiving elements. According to this radiation detector, since the plurality of light receiving elements can be reliably supported by the base, the durability of the radiation detector can be improved. In addition, this reduces the possibility that the positional relationship of the light receiving elements will be shifted when subjected to an external impact, thereby reducing the performance of the radiation detector, thereby contributing to the improvement of the reliability of the radiation detector. .
- the reliability of the radiation detector can be improved while increasing the screen size by using a plurality of light receiving elements.
- the radiation detector 1 is for detecting radiation such as X-rays.
- a PET [Positron Emission Tomography] apparatus or a CT [Computed Tomography] Used in equipment.
- the radiation detector 1 includes a scintillator panel 2, a light detection unit 3, and an adhesive layer 4.
- the scintillator panel 2 is a panel that converts radiation such as X-rays into light.
- the scintillator panel 2 includes a support substrate 5, a scintillator layer 6, and a moisture-proof protective layer 7.
- the support substrate 5 is a flexible substrate made of, for example, a polymer film. An example of the polymer constituting the support substrate 5 is polyimide.
- the support substrate 5 is a radiation transmission substrate that transmits radiation such as X-rays.
- the support substrate 5 has an incident surface 5a on which radiation is incident and an output surface 5b on which incident radiation is emitted.
- the support substrate 5 is a member obtained by cutting four corners of a rectangular plate shape with straight lines.
- the support substrate 5 is formed in a thin dish shape that covers the scintillator layer 6. That is, on the outer peripheral side of the support substrate 5, an outer edge portion 5c inclined to the emission surface 5b side and an opposed end portion 5d provided in a flange shape outside the outer edge portion 5c are formed.
- the outer edge portion 5 c reaches the side surface 6 c of the scintillator layer 6.
- the facing end 5d is formed to face the light detection unit 3 in the thickness direction of the support substrate 5.
- the support substrate 5 has eight side surfaces S1 to S8. These side surfaces S1 to S8 are formed by cutting the four corners of the rectangular plate shape with straight lines.
- the first side surface S1 and the second side surface S2 are surfaces substantially parallel to each other.
- the third side surface S3 is a surface that is substantially orthogonal to the first side surface S1.
- the fourth side surface S4 is a surface substantially orthogonal to the first side surface S1 and substantially parallel to the third side surface S3.
- the fifth side surface S5 is a plane that connects the first side surface S1 and the third side surface S3.
- the sixth side surface S6 is a plane connecting the first side surface S1 and the fourth side surface S4, and the seventh side surface S7 is a plane connecting the second side surface S2 and the third side surface S3.
- the eighth side S8 is a plane that connects the second side S2 and the fourth side S4.
- the first side surface S1 to the fourth side surface S4 have substantially the same area. Further, the fifth side surface S5 to the eighth side surface S8 also have substantially the same area. The areas of the first side surface S1 to the fourth side surface S4 are larger than the areas of the fifth side surface S5 to the eighth side surface S8.
- the support substrate 5 corresponds to the flexible substrate described in the claims.
- the scintillator layer 6 is made of, for example, a columnar crystal H of CsI (cesium iodide) doped with Tl (thallium) (see FIGS. 3 and 4).
- the scintillator layer 6 is formed by growing a plurality of columnar crystals H on the emission surface 5b of the support substrate 5 by vapor deposition.
- the columnar crystals H correspond to the columnar bodies described in the claims.
- the scintillator layer 6 has a substantially quadrangular pyramid shape.
- the scintillator layer 6 having a substantially quadrangular pyramid shape has an entrance surface 6a and an exit surface 6b that are substantially parallel to each other, and a side surface 6c.
- the thickness of the scintillator layer 6 is about 200 ⁇ m.
- the incident surface 6 a is a surface on which the radiation transmitted through the support substrate 5 is incident.
- the entrance surface 6 a is formed along the exit surface 5 b of the support substrate 5.
- the emission surface 6b is a surface from which light generated in the scintillator layer 6 by the incidence of radiation is emitted.
- the exit surface 6b is formed on the side opposite to the entrance surface 6a.
- the exit surface 6b has a larger area than the entrance surface 6a.
- the side surface 6c is a surface inclined with respect to the entrance surface 6a and the exit surface 6b (see FIG. 4).
- the side surface 6c is inclined outward as it goes from the incident surface 6a to the exit surface 6b.
- the side surface 6 c is covered with the outer edge portion 5 c of the support substrate 5. The radiation transmitted through the support substrate 5 is incident on the side surface 6c.
- the moisture-proof protective layer 7 is a protective film for preventing moisture from entering the scintillator layer 6.
- the moisture-proof protective layer 7 is made of, for example, polyparaxylylene.
- the moisture-proof protective layer 7 covers the outside of the support substrate 5 and the scintillator layer 6.
- the support substrate 5 and the scintillator layer 6 are sealed with a moisture-proof protective layer 7.
- the moisture-proof protective layer 7 is filled between a plurality of columnar crystals H constituting the scintillator layer 6. In other words, the moisture-proof protective layer 7 penetrates between the columnar crystals H from the tip side and reaches the root of the columnar crystals H (that is, the emission surface 5b).
- the moisture-proof protective layer 7 encloses each of the columnar crystals H.
- the support substrate 5 and the scintillator layer 6 have flexibility in a state of being sealed with a moisture-proof protective layer 7. That is, the scintillator panel 2 has flexibility.
- the light detection unit 3 is an image sensor that detects light emitted from the emission surface 6 b of the scintillator layer 6.
- the light detection unit 3 includes four light receiving elements 8A to 8D, a mount substrate 9, and an adhesive unit 10.
- the light receiving elements 8A to 8D are photoelectric conversion elements made of photodiodes or the like.
- the light receiving elements 8A to 8D have a rectangular plate shape.
- the light receiving elements 8A to 8D convert light incident on the light receiving surface R into electric energy.
- the light receiving elements 8A to 8D have a bonding pad portion P for electrically connecting to an external device.
- the bonding pad portion P is composed of a plurality of bonding pads.
- the light receiving elements 8A to 8D output the electric energy generated by the photoelectric conversion through the bonding pad portion P to the outside.
- the mount substrate 9 is a plate-like member made of an insulating material such as glass.
- the mount substrate 9 is disposed on the side opposite to the scintillator panel 2 with respect to the light receiving elements 8A to 8D.
- the mount substrate 9 has a support surface 9a that is a plane that supports the light receiving elements 8A to 8D.
- the mount substrate 9 supports the light receiving elements 8A to 8D so as to face the scintillator layer 6.
- the mount substrate 9 corresponds to a base described in the claims.
- the light receiving elements 8A to 8D are tiled on the support surface 9a of the mount substrate 9. That is, the light receiving elements 8A to 8D are arranged in a tile shape on the support surface 9a.
- the light receiving elements 8A to 8D are arranged such that each light receiving surface R forms a large area light receiving surface with the joint C interposed therebetween.
- the light receiving elements 8A to 8D are arranged so that two sides are adjacent to other light receiving elements.
- the light receiving elements 8A to 8D are arranged such that the light receiving surface R faces the emission surface 6b of the scintillator layer 6 on the support surface 9a.
- a step of about several tens of ⁇ m may be formed at the joint portion C of the light receiving elements 8A to 8D (see FIG. 3).
- the support surface 9a of the mount substrate 9 and the light receiving elements 8A to 8D are bonded and fixed by the bonding portion 10.
- the bonding portion 10 is made of a resin adhesive, and a plurality of bonding portions 10 are provided at predetermined intervals on the support surface 9a.
- the adhesive layer 4 is a layer that bonds the scintillator panel 2 and the light detection unit 3 together.
- the adhesive layer 4 is made of, for example, an adhesive made of low moisture permeability resin.
- the adhesive layer 4 is bonded to the emission surface 6 b of the scintillator layer 6 through the moisture-proof protective layer 7.
- the adhesive layer 4 is bonded to the opposite end 5d of the support substrate 5 through the moisture-proof protective layer 7 (see FIG. 4).
- the adhesive layer 4 is bonded to the support substrate 5 and the scintillator layer 6 through the moisture-proof protective layer 7 and is bonded to the light receiving elements 8A to 8D of the light detection unit 3 so that the scintillator panel is attached to the light detection unit 3. 2 is bonded and fixed.
- FIG. 6 is a diagram for explaining a scintillator forming step of forming the scintillator layer 6 on the support substrate 5.
- FIG. 7 is a view for explaining a cutting process for cutting four corners of the rectangular plate-like support substrate 5.
- FIG. 8 is a diagram for explaining a protective film forming step for forming the moisture-proof protective layer 7.
- FIG. 9 is a diagram for explaining an adhesion process for adhering the support substrate 5 and the scintillator layer 6 to the light detection unit 3.
- FIG. 10A and FIG. 10B are diagrams for explaining a deformation process for deforming the support substrate 5 and the scintillator layer 6. Specifically, FIG. 10A shows the state of the scintillator panel 2 at the start of the deformation process. FIG. 10B shows the state of the scintillator panel 2 at the end of the deformation process.
- the scintillator layer 6 is formed on the emission surface 5b of the support substrate 5 in the scintillator layer forming step shown in FIG.
- the support substrate 5 made of a polymer film is fixed to a reinforcing plate having sufficient rigidity.
- the support substrate 5 has a rectangular plate shape.
- the scintillator layer 6 is formed by vapor-depositing CsI doped with Tl on the emission surface 5b in a state where the support substrate 5 is rotated together with the reinforcing plate.
- the scintillator layer 6 formed in the scintillator layer forming step has a substantially square frustum shape that widens toward the entrance surface 6a from the exit surface 6b.
- the area of the incident surface 6a is larger than the area of the output surface 6b, and the inclined state of the side surface 6d is different from the side surface 6c of FIG.
- the side surface 6d protrudes outward as it goes from the exit surface 6b to the entrance surface 6a.
- the support substrate 5 has a shape formed by cutting the four corners of the rectangular plate with straight lines, and eight side surfaces S1 to S8 are formed on the support substrate 5.
- the expression that the support substrate 5 is formed by cutting the four corners of the rectangular plate in a straight line is not an expression limited to the support substrate in which the shape before the formation is a rectangular plate shape, and any shape before the formation is formed. However, if the shape after formation is a rectangular plate having four corners cut by straight lines, it is included in this expression.
- a moisture-proof protective layer 7 is formed in the protective film forming step shown in FIG.
- the support substrate 5 on which the scintillator layer 6 is formed is placed in a vapor deposition chamber of a CVD [Chemical Vapor Deposition] apparatus.
- the moisture-proof protective layer 7 which covers the outer side of the support substrate 5 and the scintillator layer 6 is formed by CVD method which exposes the support substrate 5 in the vapor
- the support substrate 5 and the scintillator layer 6 are sufficiently flexible when covered with the moisture-proof protective layer 7.
- the scintillator panel 2 having flexibility is formed.
- the scintillator panel 2 is bonded to the light detection unit 3 in the bonding step shown in FIG.
- the adhesive layer 4 is formed on the surfaces of the light receiving elements 8A to 8D of the light detection unit 3.
- the scintillator panel 2 is bonded to the light detection unit 3 so that the emission surface 6b of the scintillator layer 6 and the light receiving surfaces R of the light receiving elements 8A to 8D face each other.
- the scintillator panel 2 is deformed along the surfaces of the light receiving elements 8A to 8D.
- the support substrate 5 and the scintillator layer 6 having flexibility are deformed by applying pressure to the light detection unit 3.
- the support substrate 5 and the scintillator layer 6 are deformed from the state shown in FIG. 10A to the state shown in FIG.
- the scintillator layer 6 is deformed so as to be in close contact with the light receiving elements 8A to 8D.
- the side surface 6d is pressed against the light receiving surface R of the light receiving elements 8A to 8D, and is deformed to the same surface as the emission surface 6b. At the same time, a part of the incident surface 6a of the scintillator layer 6 is deformed to form a side surface 6c.
- the support substrate 5 is deformed from the flat plate shape shown in FIG. 10A to the substantially shallow dish shape shown in FIG. By this deformation, the outer edge portion 5 c and the opposite end portion 5 d are formed on the outer peripheral side of the support substrate 5.
- the adhesive layer 4 is cured, and a predetermined finishing process is performed to obtain the radiation detector 1 shown in FIG.
- the radiation detector 1 since a plurality of light receiving elements 8A to 8D are used, it is possible to easily realize a large screen at a lower cost than in the case of using one light receiving element. it can. Moreover, according to the radiation detector 1, since the support substrate 5 that supports the scintillator layer 6 has flexibility, even if there is a step between the adjacent light receiving elements 8A to 8D, the support substrate 5 and The scintillator layer 6 can be deformed following the step. Thereby, the influence of the step can be suppressed and the distance between the light receiving elements 8A to 8D and the scintillator layer 6 can be made uniform, so that the resolution of the radiation detector 1 can be improved.
- this radiation detector 1 since the moisture-proof protective layer 7 is filled between the columnar crystals H of the scintillator layer 6, compared with the case where the moisture-proof protective layer 7 is not filled between the columnar crystals H. Thus, the strength of the scintillator layer 6 against bending deformation can be improved. That is, even when the scintillator layer 6 is bent and deformed, since the moisture-proof protective layer 7 is filled between the columnar crystals H, it is possible to prevent the columnar crystals H from coming into contact with each other and being damaged. Therefore, according to this radiation detector 1, since the strength against bending deformation of the scintillator layer 6 can be improved, it is possible to avoid the occurrence of problems such as breakage of the scintillator layer 6 due to the deformation. Can be improved.
- the support substrate 5 since the polymer film is adopted as the support substrate 5, the support substrate 5 having appropriate strength and flexibility for supporting the scintillator layer 6 can be easily manufactured. Can do. In addition, design changes are relatively easy compared to other materials.
- the radiation detector 1 employs the support substrate 5 having a configuration in which the four corners of the rectangular plate are cut with straight lines, the corners caused by bending deformation are used compared to the case of using the rectangular plate-shaped support substrate. Generation of wrinkles in the part can be reduced. As a result, it is possible to avoid the occurrence of defects such as distortion in the scintillator layer 6 due to the occurrence of wrinkles on the support substrate 5, so that the reliability of the radiation detector 1 can be improved. Moreover, it can shape
- the durability of the radiation detector 1 can be improved.
- this reduces the possibility that the positional relationship between the light receiving elements 8A to 8D will be shifted when subjected to an impact from the outside, thereby reducing the performance of the radiation detector 1. Therefore, the reliability of the radiation detector 1 can be reduced. Contributes to the improvement of sex.
- the present invention is not limited to the embodiment described above.
- the scintillator panel 2 may have a critical edge that is a side where the ends of the support substrate 5 and the scintillator layer 6 coincide.
- the critical edge can be formed, for example, by cutting the opposite end portion 5d of the support substrate 5.
- the degree of freedom in selecting the size of the scintillator panel 2 can be increased by forming the critical edge by cutting or the like.
- the size can be easily adjusted, the mass productivity of products of the same size can be improved.
- a plurality of critical edges may be formed, and all the edges may be critical edges.
- the support substrate 5 may be composed of other than the polymer film.
- the mount substrate 9 is not necessarily provided.
- the light receiving elements may be supported by a simple connecting member or the like.
- the number of light receiving elements is not limited to four and may be two or more. Further, the arrangement of the light receiving elements is not limited to that of the present embodiment.
- the form of the scintillator panel 2 is not limited to that of this embodiment.
- the scintillator panel 2 may include a plurality of moisture-proof protective films, and may include a light reflection layer that reflects light and a light absorption layer that absorbs light on the support substrate 5 side.
- the present invention can be used for a radiation detector.
Landscapes
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- High Energy & Nuclear Physics (AREA)
- Molecular Biology (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Medical Informatics (AREA)
- Engineering & Computer Science (AREA)
- Biomedical Technology (AREA)
- General Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Optics & Photonics (AREA)
- Measurement Of Radiation (AREA)
- Heart & Thoracic Surgery (AREA)
- Radiology & Medical Imaging (AREA)
- Pathology (AREA)
- Surgery (AREA)
- Animal Behavior & Ethology (AREA)
- Public Health (AREA)
- Veterinary Medicine (AREA)
- Biophysics (AREA)
- Apparatus For Radiation Diagnosis (AREA)
- Nuclear Medicine (AREA)
Abstract
Description
この放射線検出器によれば、シンチレータ層を支持するための適切な強度及び柔軟性を有するフレキシブル基体を容易に製造することができる。また、他の材料と比べて設計変更も比較的容易である。
この放射線検出器によれば、矩形板状のフレキシブル基体と比べて、曲げ変形による隅部のシワの発生を少なくすることができる。その結果、この放射線検出器では、フレキシブル基体のシワの発生でシンチレータ層に歪み等の不具合が生じることを避けることができるので、放射線検出器の信頼性の向上を図ることができる。
この放射線検出器によれば、基台により複数の受光素子を確実に支持することができるので、放射線検出器の耐久性の向上を図ることができる。また、このことは外部からの衝撃を受けた際に受光素子の位置関係にずれが生じて放射線検出器の性能が低下する可能性を低減させるので、放射線検出器の信頼性の向上に寄与する。
Claims (4)
- 放射線の入射面及び出射面を有するフレキシブル基体と、
前記出射面に結晶成長させられた複数の柱状体からなり、前記放射線の入射によって光を生じさせるシンチレータ層と、
前記シンチレータ層を覆うと共に、前記複数の柱状体の間に充填される防湿性保護層と、
前記シンチレータ層と対向するように並べられ、前記シンチレータ層で生じた光を検出する複数の受光素子と、
を備える、放射線検出器。 - 前記フレキシブル基体は、高分子フィルムからなる、請求項1に記載の放射線検出器。
- 前記フレキシブル基体は、矩形板状の四隅が直線でカットされてなる、請求項1又は請求項2に記載の放射線検出器。
- 前記複数の受光素子に対して前記シンチレータ層と反対側に配置され、前記複数の受光素子を支持する基台を更に備える、請求項1~請求項3のいずれか一項に記載の放射線検出器。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011800329102A CN102985846A (zh) | 2010-08-24 | 2011-06-17 | 放射线检测器 |
KR1020137002710A KR20130139846A (ko) | 2010-08-24 | 2011-06-17 | 방사선 검출기 |
US13/810,236 US9158010B2 (en) | 2010-08-24 | 2011-06-17 | Radiation detector |
EP11819659.1A EP2610642A4 (en) | 2010-08-24 | 2011-06-17 | RADIATION DETECTOR |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010-187447 | 2010-08-24 | ||
JP2010187447A JP2012047487A (ja) | 2010-08-24 | 2010-08-24 | 放射線検出器 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2012026187A1 true WO2012026187A1 (ja) | 2012-03-01 |
Family
ID=45723203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2011/063968 WO2012026187A1 (ja) | 2010-08-24 | 2011-06-17 | 放射線検出器 |
Country Status (6)
Country | Link |
---|---|
US (1) | US9158010B2 (ja) |
EP (1) | EP2610642A4 (ja) |
JP (1) | JP2012047487A (ja) |
KR (1) | KR20130139846A (ja) |
CN (1) | CN102985846A (ja) |
WO (1) | WO2012026187A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014034371A1 (ja) * | 2012-08-29 | 2014-03-06 | 浜松ホトニクス株式会社 | 放射線像変換パネル |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012163396A (ja) * | 2011-02-04 | 2012-08-30 | Toshiba Corp | シンチレータパネル及び放射線検出器 |
WO2013188498A2 (en) * | 2012-06-12 | 2013-12-19 | Arizona Board Of Regents Acting For And On Behalf Of Arizona State University | Imaging system and methods of manufacturing and using the same |
JP6245799B2 (ja) * | 2012-11-29 | 2017-12-13 | キヤノン株式会社 | 放射線撮像装置、及び放射線撮像システム |
JP6102599B2 (ja) | 2013-07-22 | 2017-03-29 | コニカミノルタ株式会社 | 放射線画像検出器 |
JP2015049126A (ja) * | 2013-08-30 | 2015-03-16 | 株式会社東芝 | 検出器モジュール製造方法、検出器モジュール及び医用画像診断装置 |
JP6356442B2 (ja) * | 2014-03-12 | 2018-07-11 | 東芝電子管デバイス株式会社 | 放射線検出器及びその製造方法 |
JP6488635B2 (ja) | 2014-10-23 | 2019-03-27 | コニカミノルタ株式会社 | シンチレータパネル及び放射線検出器 |
JP6676372B2 (ja) * | 2015-12-28 | 2020-04-08 | 株式会社S−Nanotech Co−Creation | シンチレータ及び電子検出器 |
WO2017120201A1 (en) * | 2016-01-05 | 2017-07-13 | Board Of Regents, The University Of Texas System | Apparatus and methods for optical emission detection |
JP6715055B2 (ja) * | 2016-03-30 | 2020-07-01 | 浜松ホトニクス株式会社 | 放射線検出器及びシンチレータパネル |
JP1563937S (ja) * | 2016-04-05 | 2016-11-28 | ||
USD888246S1 (en) * | 2016-08-26 | 2020-06-23 | Rayence Co., Ltd. | Digital X-ray detector |
CN107742628A (zh) * | 2017-09-12 | 2018-02-27 | 奕瑞影像科技(太仓)有限公司 | 柔性闪烁屏、放射线图像传感器及其制备方法 |
JP6433560B1 (ja) * | 2017-09-27 | 2018-12-05 | 浜松ホトニクス株式会社 | シンチレータパネル及び放射線検出器 |
WO2019181641A1 (ja) * | 2018-03-19 | 2019-09-26 | 富士フイルム株式会社 | 放射線検出器、放射線画像撮影装置及び放射線検出器の製造方法 |
US11428824B2 (en) | 2019-04-09 | 2022-08-30 | Ymit Co., Ltd. | Scintillator module, scintillator sensor unit, and manufacturing method |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09260626A (ja) | 1995-10-20 | 1997-10-03 | Canon Inc | 光電変換装置及びその作製方法及び物質透過撮像装置及び実装装置 |
JPH09257943A (ja) | 1996-03-22 | 1997-10-03 | Canon Inc | 光電変換装置 |
JP2000009845A (ja) * | 1998-06-19 | 2000-01-14 | Hamamatsu Photonics Kk | 放射線イメージセンサ |
JP2000009847A (ja) | 1998-06-23 | 2000-01-14 | Hamamatsu Photonics Kk | シンチレータパネル、放射線イメージセンサ及びその製造方法 |
JP2000131444A (ja) | 1998-10-28 | 2000-05-12 | Canon Inc | 放射線検出装置、放射線検出システム、及び放射線検出装置の製造方法 |
JP2000284053A (ja) * | 1997-02-14 | 2000-10-13 | Hamamatsu Photonics Kk | 放射線検出素子 |
JP2001074846A (ja) | 1999-09-01 | 2001-03-23 | Canon Inc | 半導体装置及びそれを備えた放射線撮像システム |
JP2004061115A (ja) | 2002-07-24 | 2004-02-26 | Canon Inc | シンチレーターパネル、放射線検出装置及び放射線撮像システム |
JP2007285709A (ja) * | 2006-04-12 | 2007-11-01 | Canon Inc | 放射線撮像装置の製造方法及び放射線撮像システム |
WO2008018277A1 (fr) | 2006-08-08 | 2008-02-14 | Konica Minolta Medical & Graphic, Inc. | DÉTECTEUR de panneau plat |
JP2008286785A (ja) * | 2007-04-18 | 2008-11-27 | Canon Inc | 放射線検出装置及び放射線検出システム |
WO2010010726A1 (ja) * | 2008-07-25 | 2010-01-28 | コニカミノルタエムジー株式会社 | 放射線画像検出装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1256596C (zh) * | 1997-02-14 | 2006-05-17 | 浜松光子学株式会社 | 放射线检测元件及其制造方法 |
JPH11223891A (ja) | 1998-02-09 | 1999-08-17 | Konica Corp | 輝尽性蛍光体プレートの断裁方法 |
EP1148349A4 (en) | 1998-12-14 | 2003-07-09 | Hamamatsu Photonics Kk | OPTICAL ELEMENT AND RADIATION DETECTOR APPLYING THE SAME |
US6800362B2 (en) | 2001-12-03 | 2004-10-05 | Agfa Gevaert | Binderless storage phosphor screen having voids filled up to a defined extent |
US7091501B2 (en) | 2002-03-08 | 2006-08-15 | Agfa-Gevaert | Binderless storage phosphor screen on a dedicated support |
CN1626310A (zh) * | 2003-12-09 | 2005-06-15 | 三星康宁精密琉璃株式会社 | 玻璃基板边缘研磨系统及其方法 |
JP2006133152A (ja) | 2004-11-09 | 2006-05-25 | Konica Minolta Medical & Graphic Inc | 放射線画像変換パネル |
JP4406752B2 (ja) | 2005-05-27 | 2010-02-03 | 日本電気硝子株式会社 | ガラス基板の端面加工装置及び端面加工方法 |
JP4621605B2 (ja) | 2006-02-24 | 2011-01-26 | 中村留精密工業株式会社 | 板材の面取装置における加工寸法の計測方法及び補正方法 |
US7375341B1 (en) | 2006-05-12 | 2008-05-20 | Radiation Monitoring Devices, Inc. | Flexible scintillator and related methods |
JP2008107222A (ja) * | 2006-10-26 | 2008-05-08 | Konica Minolta Medical & Graphic Inc | シンチレータパネル |
WO2008090796A1 (ja) * | 2007-01-23 | 2008-07-31 | Konica Minolta Medical & Graphic, Inc. | シンチレータパネル及び放射線フラットパネルディテクタ |
WO2010010728A1 (ja) * | 2008-07-25 | 2010-01-28 | コニカミノルタエムジー株式会社 | 放射線画像変換パネルとそれを用いたx線撮影システム |
JP5702047B2 (ja) | 2008-10-23 | 2015-04-15 | 富士フイルム株式会社 | 放射線変換シートおよび放射線画像検出器 |
JP2013050364A (ja) * | 2011-08-30 | 2013-03-14 | Fujifilm Corp | 放射線画像検出装置 |
-
2010
- 2010-08-24 JP JP2010187447A patent/JP2012047487A/ja active Pending
-
2011
- 2011-06-17 WO PCT/JP2011/063968 patent/WO2012026187A1/ja active Application Filing
- 2011-06-17 EP EP11819659.1A patent/EP2610642A4/en not_active Withdrawn
- 2011-06-17 US US13/810,236 patent/US9158010B2/en active Active
- 2011-06-17 CN CN2011800329102A patent/CN102985846A/zh active Pending
- 2011-06-17 KR KR1020137002710A patent/KR20130139846A/ko not_active Application Discontinuation
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09260626A (ja) | 1995-10-20 | 1997-10-03 | Canon Inc | 光電変換装置及びその作製方法及び物質透過撮像装置及び実装装置 |
JPH09257943A (ja) | 1996-03-22 | 1997-10-03 | Canon Inc | 光電変換装置 |
JP2000284053A (ja) * | 1997-02-14 | 2000-10-13 | Hamamatsu Photonics Kk | 放射線検出素子 |
JP2000009845A (ja) * | 1998-06-19 | 2000-01-14 | Hamamatsu Photonics Kk | 放射線イメージセンサ |
JP2000009847A (ja) | 1998-06-23 | 2000-01-14 | Hamamatsu Photonics Kk | シンチレータパネル、放射線イメージセンサ及びその製造方法 |
JP2000131444A (ja) | 1998-10-28 | 2000-05-12 | Canon Inc | 放射線検出装置、放射線検出システム、及び放射線検出装置の製造方法 |
JP2001074846A (ja) | 1999-09-01 | 2001-03-23 | Canon Inc | 半導体装置及びそれを備えた放射線撮像システム |
JP2004061115A (ja) | 2002-07-24 | 2004-02-26 | Canon Inc | シンチレーターパネル、放射線検出装置及び放射線撮像システム |
JP2007285709A (ja) * | 2006-04-12 | 2007-11-01 | Canon Inc | 放射線撮像装置の製造方法及び放射線撮像システム |
WO2008018277A1 (fr) | 2006-08-08 | 2008-02-14 | Konica Minolta Medical & Graphic, Inc. | DÉTECTEUR de panneau plat |
JP2008286785A (ja) * | 2007-04-18 | 2008-11-27 | Canon Inc | 放射線検出装置及び放射線検出システム |
WO2010010726A1 (ja) * | 2008-07-25 | 2010-01-28 | コニカミノルタエムジー株式会社 | 放射線画像検出装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2610642A4 * |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2014034371A1 (ja) * | 2012-08-29 | 2014-03-06 | 浜松ホトニクス株式会社 | 放射線像変換パネル |
JP2014048058A (ja) * | 2012-08-29 | 2014-03-17 | Hamamatsu Photonics Kk | 放射線像変換パネル |
CN104603639A (zh) * | 2012-08-29 | 2015-05-06 | 浜松光子学株式会社 | 放射线图像变换面板 |
US9417336B2 (en) | 2012-08-29 | 2016-08-16 | Hamamatsu Photonics K.K. | Radiation image conversion panel |
CN104603639B (zh) * | 2012-08-29 | 2017-07-28 | 浜松光子学株式会社 | 放射线图像变换面板 |
Also Published As
Publication number | Publication date |
---|---|
JP2012047487A (ja) | 2012-03-08 |
US9158010B2 (en) | 2015-10-13 |
CN102985846A (zh) | 2013-03-20 |
KR20130139846A (ko) | 2013-12-23 |
US20130112884A1 (en) | 2013-05-09 |
EP2610642A1 (en) | 2013-07-03 |
EP2610642A4 (en) | 2016-11-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2012026187A1 (ja) | 放射線検出器 | |
JP5649872B2 (ja) | 放射線検出器の製造方法 | |
KR100734546B1 (ko) | 방사선 이미지 센서 및 신틸레이터 패널 | |
JP4293299B2 (ja) | 固体放射線撮像装置アセンブリ | |
US20130341516A1 (en) | Radiation detection apparatus, method of manufacturing the same, and imaging system | |
TW201940900A (zh) | 放射線檢測器以及放射線圖像拍攝裝置 | |
US20140091225A1 (en) | Radiation imaging apparatus, radiation imaging system, and radiation imaging apparatus manufacturing method | |
JP6914422B2 (ja) | 放射線検出器、放射線画像撮影装置、及び製造方法 | |
JP7314118B2 (ja) | 放射線検出器、放射線画像撮影装置及び放射線検出器の製造方法 | |
JP7342184B2 (ja) | 放射線検出器、放射線画像撮影装置及び放射線検出器の製造方法 | |
JP2011075390A (ja) | シンチレータパネル、フラットパネル型放射線ディテクタ、シンチレータパネルの製造方法 | |
JPWO2019244610A1 (ja) | 放射線検出器及び放射線画像撮影装置 | |
WO2014013771A1 (ja) | シンチレータパネル及び放射線検出器 | |
JP2015155799A (ja) | シンチレータ、放射線検出装置、放射線検出装置の製造方法及び放射線検出システム | |
US11953631B2 (en) | Scintillator panel, and radiation detector | |
WO2022137843A1 (ja) | 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット | |
US11802980B2 (en) | Radiation detector, radiographic imaging apparatus, and manufacturing method | |
WO2022137846A1 (ja) | 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット | |
JP7457640B2 (ja) | 放射線検出器、及び放射線検出器の製造方法 | |
JP2024063272A (ja) | 放射線画像検出器及び放射線画像検出器の製造方法 | |
JP2011128031A (ja) | 放射線検出器及びシンチレータパネル | |
JP2022099513A (ja) | 放射線検出器、放射線検出器の製造方法、及びシンチレータパネルユニット |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201180032910.2 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 11819659 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13810236 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20137002710 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
REEP | Request for entry into the european phase |
Ref document number: 2011819659 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011819659 Country of ref document: EP |