WO2012025331A1 - Verfahren zur herstellung einer keramischen grünfolie - Google Patents
Verfahren zur herstellung einer keramischen grünfolie Download PDFInfo
- Publication number
- WO2012025331A1 WO2012025331A1 PCT/EP2011/063044 EP2011063044W WO2012025331A1 WO 2012025331 A1 WO2012025331 A1 WO 2012025331A1 EP 2011063044 W EP2011063044 W EP 2011063044W WO 2012025331 A1 WO2012025331 A1 WO 2012025331A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- ceramic
- sch
- functional material
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Definitions
- Method for Producing a Ceramic Green Film Ceramic components comprise one or more layers of a ceramic material and planar or structured conductor structures arranged thereon, usually made of
- a ceramic material with purely dielectric properties can serve to insulate the conductor structures.
- a component manufactured therefrom can be a ceramic
- Ceramic materials having particular electrical properties can be used in conjunction with corresponding deposited conductor structures to produce capacitances, inductances, and resistive elements.
- Green films produced The conductor structures are respectively applied to the green sheets or integrated into these.
- Green foil stack is then laminated and sintered.
- the ladder structures can in the simplest case by
- the conductive structures have a larger size
- the ratio of the conductor thickness to the thickness of the ceramic green sheet is the ratio of the conductor thickness to the thickness of the ceramic green sheet
- the object of the present invention is to provide a process for the production of green films with integrated structures, which can produce green films with flat surfaces in a simple manner.
- a method is proposed in which first a carrier, a slurry of a ceramic base material and a functional material are provided. At first it becomes: a structure of the functional material generated on the carrier. Subsequently, with the slurry on the support and over the structure, a slurry layer is applied so that the structure is completely separated from the slurry layer covered and thus completely embedded in the slurry layer.
- Functional material is arranged is completely flat, or has the usually planar topography of the carrier.
- Slip layer may vary depending on the application method
- the ceramic base material has any mix ⁇ setting, but usually has a dielectric character and serves both for insulation and for mechanical stabilization of the later ceramics.
- the functional material differs from the ceramic base material in that the from the Functional material formed structure an electrical
- a simple combination of base material and functional ⁇ material are, for example, dielectric and electrical conductors.
- An interaction of functional material or structure of functional material and ceramic base material can also lead to an electrical component, in the ceramic base material beyond the electrical insulation ⁇ going function goes.
- capacitive, inductive and resistive devices can be fabricated with electrically conductive structures made from the functional material.
- the ceramic base material may also have hot or cold conductive properties or comprise a varistor material. From this, it is then possible to generate PTC (positive temperature coefficient) or NTC (negative temperature coefficient) elements or varistors.
- the base material can also have magnetic properties
- magnets or inductive components can be produced.
- Structures produced from conductive functional material can in all cases be used as electrode layers for the
- the functional material is provided in the form of a printable, preferably viscous or pasty mass and then as a structure on a support
- the structure can be a desired fine
- Structuring or larger areas include.
- On the surface of the support may be a release layer
- the properties of the separating layer are adjusted so that both the structure of functional material and the slip layer have sufficient adhesion to the separating layer,
- green film is understood to mean the combination of slip layer and embedded structure in the state in which all the solvent is removed from the structure and the slip layer, ie in which the layers of ceramic base material and functional material have dried.
- a further possibility for producing the structure from the functional material is to apply the functional material not structured but to apply whole or large area as a layer to the carrier and only then to structure this layer to form the structure.
- a sinterable green film it is a prerequisite that all components of the green film are sintered or a
- Green films with a small thickness of less than 50 ⁇ are especially with such thin green sheets leads a
- Green films with an embedded structure according to the invention lead to the lamination of film stacks to
- Outer structures such as in particular the upper ⁇ or bottom or on the side surfaces of the
- the structures of functional material in ceramic multi-layer components usually from foil to foil
- films with and without embedded structure can alternate.
- the green sheets can be provided with vias prior to stacking and laminating. These can first be generated mechanically as holes and punched out, for example, and then with a
- the proposed method is particularly suitable for the production of LTCC (Low Temperature Co-fired Ceramic) or HTCC (High Temperature Co-fired Ceramic) ceramics.
- Such ceramic multilayer substrates which themselves already represent multilayer components or at least can fulfill electrical subfunctions, contain in particular metallic structures made of functional material, wherein the
- Metal at LTCC may be selected from silver, palladium or platinum.
- Metal at LTCC may be selected from silver, palladium or platinum.
- HTCC ceramics which are only affected by the LTCC due to the increased sintering temperature.
- another electrode material adapted to the higher sintering temperatures is required.
- HTCC ceramics contain z.
- Figure 1 shows a arranged on a support
- FIGS. 2A to 2D show different method steps in the production of this green sheet
- FIGS. 3A and 3B show two method steps in FIG.
- FIGS. 4A and 4B show two process steps in the
- FIG. 1 shows a green sheet GF produced according to the invention on a support TR.
- a structure ST is arranged, which either comprises a ceramic mass or sinterable to conductive structures
- FIGS. 2A to 2D show two different process stages in the production of a green film according to the invention.
- a support TR which consists of any solid, but preferably flexible material such as a plastic film, a release layer is first applied. This serves to create the structure to be created on it and the
- Slip layer releasably stick.
- the release layer is selected depending on the materials of the green sheet and then has suitable adhesion and release properties.
- FIG. 2A shows the thus produced layer SCS of FIG.
- the process step according to FIG. 2B can also be achieved by directly generating the structure, eg. B. can be achieved by printing.
- a slurry layer SCH of a slurry of a ceramic base material is applied over the entire surface, for example by means of film casting or
- FIG. 2D shows a slurry layer with a leveled surface.
- the slip layer SCH can also be produced directly with a correspondingly flat surface.
- the green sheet so cast or drawn is allowed to dry first until the solvent, usually
- FIG. 3A shows a corresponding green sheet. As can be seen, this green sheet has two almost completely flat and mutually parallel surface. This plane parallelism makes it possible to increase the height proportion of the structure of functional material relative to the total layer thickness of the green sheet to values of 20% and more without the green sheet thereby losing stability or being produced therefrom
- Multi-layer devices show excessively high failure rates during lamination and sintering.
- an assumed layer thickness h s of a structure ST of metallic functional material of about 10 ⁇ m it is thus possible, for example, to produce green sheets with a layer thickness h F of 50 ⁇ m and less, as used in particular for the production of highly integrated substrates made of LTCC ceramic.
- FIG. 3B shows a film stack FS, in which here five green films GF1 to GF5 are stacked on top of one another. Due to the plane-parallel surfaces of this film stack FS has no gaps and can therefore be laminated to a stress-free laminate. Independent of
- FIG. 4A clearly shows that the structure ST with its entire layer thickness is above the
- the invention is not limited to the embodiments illustrated in the embodiments. Rather, it is possible to process not only the same material, but also made of different materials green sheets to a film stack and further to a multilayer ceramic component.
- Foil stacks These structures can be applied before or after sintering. Such structures can also be produced by means other than thick film processes, for example by vapor deposition, sputtering and / or electroless or galvanic deposition or amplification. Reference sign list
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Producing Shaped Articles From Materials (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Description
Claims
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013525211A JP5859540B2 (ja) | 2010-08-26 | 2011-07-28 | セラミックグリーンシートの製造方法 |
| US13/816,201 US20130200545A1 (en) | 2010-08-26 | 2011-07-28 | Method for the Production of a Ceramic Green Sheet |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102010035488.0A DE102010035488B4 (de) | 2010-08-26 | 2010-08-26 | Herstellung von keramischen Grünfolien sowie deren Verwendung zur Herstellung von Keramiken |
| DE102010035488.0 | 2010-08-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2012025331A1 true WO2012025331A1 (de) | 2012-03-01 |
Family
ID=44653261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2011/063044 Ceased WO2012025331A1 (de) | 2010-08-26 | 2011-07-28 | Verfahren zur herstellung einer keramischen grünfolie |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20130200545A1 (de) |
| JP (1) | JP5859540B2 (de) |
| DE (1) | DE102010035488B4 (de) |
| WO (1) | WO2012025331A1 (de) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799984A (en) * | 1987-09-18 | 1989-01-24 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
| US5356512A (en) * | 1991-12-09 | 1994-10-18 | Murata Mfg. Co., Ltd. | Method of stacking ceramic green sheets |
| US5412865A (en) * | 1991-08-30 | 1995-05-09 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer electronic component |
| JP2003017357A (ja) * | 2001-06-29 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
| US20040112504A1 (en) * | 2001-03-20 | 2004-06-17 | Andreas Roosen | Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3618202A (en) * | 1969-05-12 | 1971-11-09 | Mallory & Co Inc P R | Ceramic chip electrical components |
| US3695960A (en) * | 1970-04-08 | 1972-10-03 | Rca Corp | Fabricating relatively thick ceramic articles |
| JPS60203442A (ja) * | 1984-03-28 | 1985-10-15 | 株式会社村田製作所 | セラミツクグリ−ンシ−ト積層体の製造装置 |
| JPH01226140A (ja) * | 1988-03-07 | 1989-09-08 | Matsushita Electric Ind Co Ltd | 績層セラミック電子部品の製造方法 |
| JPH03190703A (ja) * | 1989-12-20 | 1991-08-20 | Nec Corp | 電極形成セラミックグリーンシートの製造方法 |
| JPH06804A (ja) * | 1992-06-17 | 1994-01-11 | Tokin Corp | 積層セラミックグリーンシートの製造方法 |
| JPH09283360A (ja) * | 1996-04-16 | 1997-10-31 | Fuji Elelctrochem Co Ltd | 積層部品用グリーンシートの製造方法 |
| JP3771099B2 (ja) * | 1999-01-27 | 2006-04-26 | 松下電器産業株式会社 | グリーンシート及びその製造方法、多層配線基板の製造方法、両面配線基板の製造方法 |
| CN1178240C (zh) * | 2000-02-03 | 2004-12-01 | 太阳诱电株式会社 | 叠层陶瓷电容器及其制造方法 |
| JP4407781B2 (ja) * | 2000-05-09 | 2010-02-03 | 株式会社村田製作所 | セラミック回路基板の製造方法 |
| JP4072046B2 (ja) * | 2002-11-28 | 2008-04-02 | 京セラ株式会社 | 複合シートの製造方法および積層部品の製造方法 |
| JP3683891B2 (ja) * | 2003-01-31 | 2005-08-17 | Tdk株式会社 | セラミックグリーンシートの製造方法および当該セラミックグリーンシートを用いた電子部品の製造方法 |
| JP2005303008A (ja) * | 2004-04-12 | 2005-10-27 | Sekisui Chem Co Ltd | セラミックペースト及び積層セラミックコンデンサの製造方法 |
| JP2005252218A (ja) * | 2004-02-06 | 2005-09-15 | Matsushita Electric Ind Co Ltd | 電極埋め込みセラミックグリーンシートとその製造方法およびそれを用いた積層セラミック電子部品の製造方法 |
| JP4591151B2 (ja) * | 2005-03-30 | 2010-12-01 | パナソニック株式会社 | 内部電極パターンの形成方法とこれを用いた積層セラミック電子部品の製造方法 |
| JP5342820B2 (ja) * | 2007-07-27 | 2013-11-13 | 日本碍子株式会社 | セラミック成形体、セラミック部品、セラミック成形体の製造方法及びセラミック部品の製造方法 |
| KR100916067B1 (ko) * | 2007-11-28 | 2009-09-08 | 삼성전기주식회사 | 유전체 시트 및 다층 세라믹 기판 제조방법 |
| US8178192B2 (en) * | 2008-03-06 | 2012-05-15 | Ngk Insulators, Ltd. | Ceramic green sheet, ceramic green sheet laminate, production method of ceramic green sheet, and production method of ceramic green sheet laminate |
| JP2009241456A (ja) * | 2008-03-31 | 2009-10-22 | Ngk Insulators Ltd | 誘電体基板 |
| JP2010163313A (ja) * | 2009-01-15 | 2010-07-29 | Denso Corp | 結晶配向セラミックスの製造方法 |
-
2010
- 2010-08-26 DE DE102010035488.0A patent/DE102010035488B4/de not_active Expired - Fee Related
-
2011
- 2011-07-28 JP JP2013525211A patent/JP5859540B2/ja not_active Expired - Fee Related
- 2011-07-28 US US13/816,201 patent/US20130200545A1/en not_active Abandoned
- 2011-07-28 WO PCT/EP2011/063044 patent/WO2012025331A1/de not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4799984A (en) * | 1987-09-18 | 1989-01-24 | E. I. Du Pont De Nemours And Company | Method for fabricating multilayer circuits |
| US5412865A (en) * | 1991-08-30 | 1995-05-09 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer electronic component |
| US5356512A (en) * | 1991-12-09 | 1994-10-18 | Murata Mfg. Co., Ltd. | Method of stacking ceramic green sheets |
| US20040112504A1 (en) * | 2001-03-20 | 2004-06-17 | Andreas Roosen | Method for joining ceramic green bodies using a transfer tape and conversion of bonded green body into a ceramic body |
| JP2003017357A (ja) * | 2001-06-29 | 2003-01-17 | Matsushita Electric Ind Co Ltd | 積層セラミック電子部品の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102010035488A1 (de) | 2012-03-01 |
| JP5859540B2 (ja) | 2016-02-10 |
| JP2013542092A (ja) | 2013-11-21 |
| DE102010035488B4 (de) | 2018-11-15 |
| US20130200545A1 (en) | 2013-08-08 |
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