WO2012015263A3 - 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 - Google Patents

투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 Download PDF

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Publication number
WO2012015263A3
WO2012015263A3 PCT/KR2011/005581 KR2011005581W WO2012015263A3 WO 2012015263 A3 WO2012015263 A3 WO 2012015263A3 KR 2011005581 W KR2011005581 W KR 2011005581W WO 2012015263 A3 WO2012015263 A3 WO 2012015263A3
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WO
WIPO (PCT)
Prior art keywords
conductive film
transparent conductive
manufacturing
forming
manufactured
Prior art date
Application number
PCT/KR2011/005581
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English (en)
French (fr)
Other versions
WO2012015263A2 (ko
Inventor
정광춘
조현남
유지훈
정윤호
Original Assignee
주식회사 잉크테크
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 잉크테크 filed Critical 주식회사 잉크테크
Priority to JP2013523087A priority Critical patent/JP5613331B2/ja
Priority to CN201180037671.XA priority patent/CN103189928B/zh
Priority to US13/813,253 priority patent/US9299483B2/en
Publication of WO2012015263A2 publication Critical patent/WO2012015263A2/ko
Publication of WO2012015263A3 publication Critical patent/WO2012015263A3/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C20/00—Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Paints Or Removers (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

본 발명은, a) 기재 상에 투명 도전막용 코팅액을 도포하여 코팅막을 형성하는 코팅막 형성단계로서, 비극성용매; 극성용매; 전도성 금속 잉크; 및 계면활성제를 포함하는 상기 투명 도전막용 코팅액을 도포하는 코팅막 형성단계 및 b) 상기 코팅막을 건조 및 소성하여, 상기 기재 상에, 홀(hole)형태의 투과부 빛 상기 전도성 금속잉크로 형성된 패턴부를 갖는 전도성 패턴을 형성하는 전도성패턴 형성단계를 포함하는 것을 특징으로 하는 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막을 제공한다.
PCT/KR2011/005581 2010-07-30 2011-07-28 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막 WO2012015263A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013523087A JP5613331B2 (ja) 2010-07-30 2011-07-28 透明導電膜の製造方法およびそれにより製造された透明導電膜
CN201180037671.XA CN103189928B (zh) 2010-07-30 2011-07-28 透明导电膜的制备方法及由其制备的透明导电膜
US13/813,253 US9299483B2 (en) 2010-07-30 2011-07-28 Method for manufacturing transparent conductive film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0074393 2010-07-30
KR20100074393A KR101487342B1 (ko) 2010-07-30 2010-07-30 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막

Publications (2)

Publication Number Publication Date
WO2012015263A2 WO2012015263A2 (ko) 2012-02-02
WO2012015263A3 true WO2012015263A3 (ko) 2012-05-31

Family

ID=45530624

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/005581 WO2012015263A2 (ko) 2010-07-30 2011-07-28 투명 도전막의 제조방법 및 이에 의해 제조된 투명 도전막

Country Status (5)

Country Link
US (1) US9299483B2 (ko)
JP (1) JP5613331B2 (ko)
KR (1) KR101487342B1 (ko)
CN (1) CN103189928B (ko)
WO (1) WO2012015263A2 (ko)

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WO2014046306A1 (ja) 2012-09-21 2014-03-27 住友化学株式会社 導電性膜形成用の組成物
CN103862860B (zh) * 2012-12-12 2016-05-04 中国科学院理化技术研究所 透明导电薄膜室温沉积装置及方法
JP5610359B2 (ja) * 2012-12-21 2014-10-22 株式会社フェクト 銀鏡膜層形成組成液、銀鏡膜層形成組成液の製造方法及び銀鏡膜塗面の形成方法
CN106460175B (zh) * 2014-02-28 2019-03-05 国立大学法人大阪大学 电介质基材表面的金属化方法以及附有金属膜的电介质基材
JP6289988B2 (ja) * 2014-04-25 2018-03-07 トッパン・フォームズ株式会社 銀インク組成物の製造方法
KR102335627B1 (ko) 2016-08-11 2021-12-08 한국전자통신연구원 투명 전도성 구조체를 포함하는 전자 소자의 제조방법
CN106752381A (zh) * 2016-12-02 2017-05-31 东北大学 无颗粒银墨水及其制备方法和透明银导电薄膜及其制备方法
DE102017005949A1 (de) * 2017-06-23 2018-12-27 Forschungszentrum Jülich GmbH Verfahren zur Herstellung einer Tinte und Tinte
KR102667496B1 (ko) * 2018-01-19 2024-05-20 에이지씨 가부시키가이샤 수지 부착 금속박의 제조 방법
TWI825140B (zh) * 2018-08-03 2023-12-11 加拿大國家研究委員會 Uv-可燒結分子油墨和其使用廣譜uv光之加工
RU2765126C1 (ru) * 2021-06-28 2022-01-25 федеральное государственное автономное образовательное учреждение высшего образования "Московский физико-технический институт (национальный исследовательский университет)" Способ получения растворных функциональных чернил для формирования плёнок на основе серебра

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Also Published As

Publication number Publication date
CN103189928A (zh) 2013-07-03
CN103189928B (zh) 2016-02-10
US20130118786A1 (en) 2013-05-16
KR20120021453A (ko) 2012-03-09
US9299483B2 (en) 2016-03-29
JP5613331B2 (ja) 2014-10-22
KR101487342B1 (ko) 2015-01-30
WO2012015263A2 (ko) 2012-02-02
JP2013539163A (ja) 2013-10-17

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