WO2011162137A1 - Matériau lié et procédé de production associé - Google Patents

Matériau lié et procédé de production associé Download PDF

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Publication number
WO2011162137A1
WO2011162137A1 PCT/JP2011/063643 JP2011063643W WO2011162137A1 WO 2011162137 A1 WO2011162137 A1 WO 2011162137A1 JP 2011063643 W JP2011063643 W JP 2011063643W WO 2011162137 A1 WO2011162137 A1 WO 2011162137A1
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WO
WIPO (PCT)
Prior art keywords
circuit member
anisotropic conductive
conductive film
joined body
light
Prior art date
Application number
PCT/JP2011/063643
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English (en)
Japanese (ja)
Inventor
朋之 石松
Original Assignee
ソニーケミカル＆インフォメーションデバイス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by ソニーケミカル＆インフォメーションデバイス株式会社 filed Critical ソニーケミカル＆インフォメーションデバイス株式会社
Priority to KR1020137001548A priority Critical patent/KR20130029804A/ko
Priority to CN201180030491.9A priority patent/CN102948265B/zh
Publication of WO2011162137A1 publication Critical patent/WO2011162137A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays

Definitions

  • the present invention relates to a joined body and a manufacturing method thereof.
  • a tape-like connecting material for example, anisotropic conductive film (ACF)
  • ACF anisotropic conductive film
  • This anisotropic conductive film is used when, for example, a terminal of an electronic component (IC chip) or a flexible printed circuit board (FPC) is connected to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. First, it is used when various terminals are bonded and electrically connected to produce a joined body.
  • IC chip electronic component
  • FPC flexible printed circuit board
  • COF mounting for mounting a chip has been attracting attention as liquid crystal displays have become higher definition, thinner and have a narrower frame.
  • heat is applied at a temperature of 150 ° C. to 250 ° C. for 5 seconds to 10 seconds, and the panel is warped due to the thermal expansion / contraction difference between the IC chip and the panel, resulting in uneven screen display. There is a problem that it occurs.
  • connection is made by applying heat for 5 to 10 seconds at a temperature of 150 ° C to 250 ° C, and the alignment is shifted due to thermal expansion and contraction of the IC chip bonded to the flexible tape. Therefore, there is a problem that a connection failure or a short circuit between terminals occurs.
  • an object of the present invention is to provide a joined body that has excellent electrical characteristics, suppresses warpage, and can improve connection reliability and a method for manufacturing the joined body.
  • Means for solving the above problems are as follows. That is, ⁇ 1> In the method for manufacturing a joined body in which the first circuit member and the second circuit member are electrically joined via an anisotropic conductive film containing conductive particles and a photocurable resin, A step of arranging the first circuit member, the anisotropic conductive film and the second circuit member in this order; and the anisotropic conductive film comprising the first circuit member and the second circuit member. A step of applying an ultrasonic wave during pressure welding, and after applying the ultrasonic wave, the first circuit member and the second circuit member are pressure-contacted via the anisotropic conductive film.
  • zygote characterized by including the process of irradiating light to the said anisotropic conductive film.
  • ⁇ 2> The method for producing a bonded body according to ⁇ 1>, wherein the anisotropic conductive film is irradiated with ultrasonic waves from one side and the anisotropic conductive film is irradiated with light from the other side. It is.
  • ⁇ 3> The method for producing a joined body according to any one of ⁇ 1> to ⁇ 2>, wherein the wavelength of the irradiated light is 200 nm to 750 nm.
  • ⁇ 4> The method for producing a bonded body according to any one of ⁇ 1> to ⁇ 3>, wherein the photocurable resin includes at least one of a photocationic curable resin and a photoradical curable resin.
  • ⁇ 5> The method according to any one of ⁇ 1> to ⁇ 4>, wherein the application time of the ultrasonic wave is 0.1 second to 2.0 seconds, and the light irradiation time is 1.0 second to 5.0 seconds. This is a manufacturing method of the joined body.
  • ⁇ 6> A joined body produced by the production method according to any one of ⁇ 1> to ⁇ 5>.
  • FIG. 1 is a schematic explanatory view showing a joined body of the present invention.
  • the joined body of the present invention includes at least a first circuit member, a second circuit member, and an anisotropic conductive film, and further includes other members appropriately selected as necessary. Become.
  • said wiring board there is no restriction
  • the transmittance of light having a wavelength of 200 nm to 750 nm of the wiring board is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 50% to 100%, more preferably 70% to 100%.
  • the transmittance When the transmittance is less than 50%, it becomes easy to form a portion with a low curing rate of the binder, which may cause poor connection. On the other hand, when the transmittance is within the particularly preferable range, it is advantageous in that a uniform cured state can be easily obtained as a whole and a good connection state can be maintained. Further, even when there is a portion (non-light-transmitting portion) that does not partially transmit light due to a metal wiring or the like on the glass substrate, it can be suitably used.
  • the ratio of the non-translucent portion in the substrate is preferably 50% or less, and more preferably 30% or less, from the viewpoint of satisfactory binder curing.
  • Examples of the electronic component include an IC chip and a TAB tape on which the IC chip is mounted.
  • the anisotropic conductive film includes at least a conductive layer, and further includes other layers as necessary.
  • the anisotropic conductive film of the present invention preferably contains at least a film-forming resin (thermoplastic resin), a photocurable resin, conductive particles, and a curing agent.
  • the conductive layer includes at least conductive particles and a photocurable resin, and may further include a curing agent, a thermoplastic resin, and other components as necessary.
  • Conductive particles-- There is no restriction
  • the particle size of the conductive particles is not particularly limited and may be appropriately selected depending on the intended purpose.
  • the volume average particle size is preferably 2 ⁇ m to 10 ⁇ m, more preferably 2 ⁇ m to 4 ⁇ m.
  • volume average particle size is less than 2 ⁇ m, classification treatment and acquisition are difficult, and if it exceeds 10 ⁇ m, it becomes difficult to cope with the narrowing of the junction terminals due to the fine pitch of the junction terminals.
  • photocurable resin there is no restriction
  • the photo-radical curable resin is not particularly limited and may be appropriately selected depending on the purpose.
  • the photocationic curable resin is not particularly limited and may be appropriately selected depending on the intended purpose.
  • bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, oxetane resin, alicyclic type Examples thereof include epoxy resins and modified epoxy resins thereof. These may be used individually by 1 type and may use 2 or more types together.
  • a photo radical curable resin or a photo cation curable resin may be mixed and used together.
  • the curing agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a curing agent that generates active cationic species or radical species by light having a wavelength range of 200 nm to 750 nm. There is no restriction
  • radical photocuring agent which generate
  • group examples thereof include a polymerization initiator and an oxime ester photopolymerization initiator. These can well cure various acrylates.
  • Examples of the curing agent that generates active cationic species or radical species by light in the wavelength region of 200 nm to 750 nm include, for example, a photo radical curing agent (trade name: Irgacure 651, manufactured by Ciba Specialty Chemicals), a photo cation. Examples thereof include a curing agent (trade name: Irgacure 369, manufactured by Ciba Specialty Chemicals). Moreover, you may use together, such as mixing a radical photocuring agent and a photocationic curing agent.
  • thermoplastic resin film-forming resin
  • thermoplastic resin film-forming resin
  • a phenoxy resin for example, a phenoxy resin, a urethane resin, a polyester resin, a styrene isoprene resin, a nitrile butadiene resin etc. are mentioned.
  • the pigment is not particularly limited and may be appropriately selected depending on the intended purpose.
  • silane coupling agent is not particularly limited and may be appropriately selected depending on the intended purpose.
  • the inorganic filler is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include silica, alumina, titanium oxide, barium sulfate, talc, calcium carbonate, glass powder, and quartz powder.
  • Organic filler There is no restriction
  • a peeling layer can be mentioned.
  • the shape, structure, size, thickness, material (material), etc. of the release layer are not particularly limited and can be appropriately selected according to the purpose.
  • a transparent release PET (polyethylene terephthalate) sheet coated with a release agent such as silicone is preferable.
  • a PTFE (polytetrafluoroethylene) sheet may be used.
  • the joined body 100 of the present invention includes an LCD panel 10 as a first circuit member, an IC chip 11 as a second circuit member, and an anisotropic conductive film 12.
  • the terminals 11a in the IC chip 11, the conductive particles 12a in the anisotropic conductive film 12, and the terminals (not shown) in the LCD panel 10 are electrically connected, whereby the LCD panel 10 and the IC chip 11 are electrically connected. Connected.
  • the method for producing a joined body of the present invention includes at least an arrangement step, an ultrasonic wave application step, and a light irradiation step, and further includes other steps that are appropriately selected as necessary.
  • the arrangement step is a step of arranging the first circuit member, the anisotropic conductive film, and the second circuit member in this order.
  • the ultrasonic wave applying step is a step of applying ultrasonic waves when the first circuit member and the second circuit member are pressure-contacted via an anisotropic conductive film.
  • the pressure contact means that the first circuit member and the second circuit member can conduct through the anisotropic conductive film, that is, the conductive particles in the anisotropic conductive film are the first and second conductive members. It means that the circuit member is in contact with the connection terminal.
  • the pressure contact is performed by pressing either the first circuit member or the second circuit member using a pressing member (20 in FIG. 1) such as a heat tool, for example.
  • a buffer material such as Teflon (registered trademark) may be interposed between the second circuit member and the second circuit member. By interposing the cushioning material, it is possible to reduce the pressure variation and prevent the heat tool from becoming dirty.
  • the tip shape of the pressing member is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a planar shape and a curved surface shape. In addition, when the said front-end
  • the pressing force at the time of pressing is not particularly limited and varies depending on the type and purpose of the circuit member, and the range of the pressing force can be selected as appropriate.
  • the optimum curing rate varies depending on the type of connection material and circuit member, but is preferably 60% to 100%, and more preferably 70% to 100%. If the curing rate is less than 60%, connection failure may occur.
  • the frequency of the ultrasonic wave is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10 kHz to 100 kHz, and more preferably 20 kHz to 60 kHz.
  • the frequency is less than 10 kHz, the force for pushing the circuit member is insufficient, and connection failure may occur.
  • the frequency exceeds 100 kHz the junction terminal of the circuit member may be deformed to cause short circuit or connection failure. .
  • the vibration direction of the ultrasonic wave is not particularly limited and can be appropriately selected according to the purpose.
  • the horizontal vibration or the vertical vibration with respect to the plane of the first circuit member or the second circuit member is possible. Any of these may be used.
  • Horizontal vibration is preferable from the viewpoint of reducing damage to the first circuit member or the second circuit member, and vertical vibration is preferable from the viewpoint of preventing misalignment of fine pitch connection.
  • the ultrasonic wave application time is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.1 second to 2.0 seconds, and more preferably 0.5 seconds to 1.0 second. If the ultrasonic wave application time is less than 0.1 seconds, the circuit member may be insufficiently pushed. If it exceeds 2.0 seconds, the wiring of the circuit member may be deformed.
  • the metal melts, for example, the bond between gold in the conductive particles and gold in the junction terminals (bumps) of the circuit members, and the gold in the conductive particles and tin in the junction terminals (bumps) of the circuit members.
  • the ultrasonic application means According to the objective, it can select suitably, For example, the press member (20 in FIG. 1) etc. which can incorporate the ultrasonic wave etc. are mentioned. .
  • the light irradiation step is a step of irradiating light to the anisotropic conductive film while applying ultrasonic waves and then pressing the first circuit member and the second circuit member through the anisotropic conductive film. is there.
  • the pressure contact means that the first circuit member and the second circuit member can conduct through the anisotropic conductive film, that is, the conductive particles in the anisotropic conductive film are the first and second conductive members. It means that the circuit member is in contact with the connection terminal. In order to press-contact the first circuit member and the second circuit member through the anisotropic conductive film, for example, at least one of the first circuit member and the second circuit member is pressed.
  • the light is not particularly limited as long as it is light capable of curing the photocurable resin, and can be appropriately selected according to the purpose, but light (ultraviolet light) having a wavelength of 200 nm to 750 nm is preferable.
  • a light source (30 in FIG. 1) which emits the said light, According to the objective, it can select suitably, For example, an LED light source, a UV lamp light source, etc. are mentioned.
  • the first circuit member and the second circuit member are pressed through an anisotropic conductive film by pressing and ultrasonic irradiation, and then light irradiation is performed.
  • the application of ultrasonic waves is stopped during light irradiation. This is because if an ultrasonic wave is applied in a photocured state, a crack may occur in the bonded body, resulting in a decrease in connection reliability.
  • a perpendicular direction may be sufficient with respect to an irradiation object, Moreover, with respect to the said perpendicular direction It may be an inclined direction.
  • the light irradiation may be performed for 0.5 seconds or more. Thereby, it can harden
  • the pressing force at the time of pressing is not particularly limited and varies depending on the type and purpose of the circuit member, and the range of the pressing force can be selected as appropriate.
  • the optimum curing rate varies depending on the type of connection material and circuit member, but is preferably 60% to 100%, and more preferably 70% to 100%. If the curing rate is less than 60%, connection failure may occur.
  • the light irradiation time is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 1.0 second to 10.0 seconds, and more preferably 1.0 second to 5.0 seconds. If the light irradiation time is less than 1.0 second, it may not be sufficiently photocured, and if it exceeds 10.0 seconds, the short-time connection becomes impossible and the tact time increases, resulting in an increase in cost. May end up.
  • the application of ultrasonic waves and light irradiation are preferably performed from opposite directions with respect to the anisotropic conductive film.
  • FCP electronic component
  • the other circuit member wiring board
  • the pressing member for pressing one circuit member does not block light, so that the light irradiation efficiency can be improved and photocured while pressing. Can do.
  • an anisotropic conductive film containing an ultraviolet curable resin is disposed on the glass wiring board, and the anisotropic conductive film is ultrasonically applied from the IC chip side. After the IC chip is melted and the IC chip is pushed in, the glass wiring board and the IC chip are connected without heating by irradiating with ultraviolet rays from the side of the glass substrate under pressure and curing. As a result, panel warpage due to thermal shrinkage can be prevented, and the problem of display unevenness can be solved.
  • mounting in which the glass wiring board and the COF are connected, misalignment due to thermal expansion and contraction can be reduced by the same connection method, and a sufficient connection area can be secured and terminal short-circuit can be prevented.
  • mounting may be performed by supplementarily applying heat of 60 ° C. to 100 ° C.
  • Production Example 4 a film-like connecting material D was obtained in the same manner as in Production Example 2 except that the gold-plated conductive particles were not dispersed.
  • Production Example 5 a film-like connection material E was obtained in the same manner as in Production Example 2 except that silver-plated conductive particles were used instead of gold-plated conductive particles.
  • Production Example 6 a film-like connection material F was obtained in the same manner as in Production Example 2 except that copper-plated conductive particles were used instead of gold-plated conductive particles.
  • Production Example 7 a film-like connecting material G was obtained in the same manner as in Production Example 2 except that nickel-plated conductive particles were used instead of gold-plated conductive particles.
  • Production Example 8 In Production Example 2, a film-like connection material H was obtained in the same manner as in Production Example 2 except that palladium-plated conductive particles were used instead of gold-plated conductive particles.
  • Example 1 On the aluminum wiring pattern glass substrate corresponding to the pattern of the IC chip (trade name: 1737F, manufactured by Corning, size: 50 mm ⁇ 30 mm ⁇ 0.5 mm), the film-like connecting material A produced in Production Example 1 is placed, An IC chip (dimensions: 1.8 mm ⁇ 20.0 mm, thickness: 0.5 mm, gold bump size: 30 ⁇ m ⁇ 85 ⁇ m, bump height: 15 ⁇ m, pitch: 50 ⁇ m) is arranged on the film-like connection material A, and the IC When the chip and the aluminum wiring pattern glass substrate are pressed through the film-like connecting material A, an ultrasonic wave is applied for 1.0 second under conditions of vibration 50 Hz, amplitude 2 ⁇ m, and pressing force 60 MPa, and then the pressing force 60 MPa is maintained.
  • an ultrasonic wave is applied for 1.0 second under conditions of vibration 50 Hz, amplitude 2 ⁇ m, and pressing force 60 MPa, and then the pressing force 60 MPa is maintained.
  • UV light is applied from the aluminum wiring pattern glass substrate side using a metal halide lamp (trade name: MLDS250, manufactured by Iwasaki Electric Co., Ltd.). 5.0 seconds, and irradiated light amount 5,000 mJ / cm 2, to produce a bonded structure 1.
  • a metal halide lamp (trade name: MLDS250, manufactured by Iwasaki Electric Co., Ltd.). 5.0 seconds, and irradiated light amount 5,000 mJ / cm 2, to produce a bonded structure 1.
  • Example 2 In Example 1, instead of using the film-like connection material A, a joined body 2 was produced in the same manner as in Example 1 except that the film-like connection material B produced in Production Example 2 was used.
  • Example 3 In Example 1, instead of using the film-like connection material A, a joined body 3 was produced in the same manner as in Example 1 except that the film-like connection material E produced in Production Example 5 was used.
  • Example 4 In Example 1, instead of using the film-like connection material A, a joined body 4 was produced in the same manner as in Example 1 except that the film-like connection material F produced in Production Example 6 was used.
  • Example 5 In Example 1, instead of using the film-like connection material A, a joined body 5 was produced in the same manner as in Example 1 except that the film-like connection material G produced in Production Example 7 was used.
  • Example 6 In Example 1, instead of using the film-like connection material A, a joined body 6 was produced in the same manner as in Example 1 except that the film-like connection material H produced in Production Example 8 was used.
  • Example 2 In Example 1, instead of using the film-like connection material A, a joined body 8 was produced in the same manner as in Example 1 except that the film-like connection material D produced in Production Example 4 was used.
  • Example 3 (Comparative Example 3) In Example 1, after applying ultrasonic waves for 1.0 second and then irradiating ultraviolet rays for 5.0 seconds, ultrasonic wave application and ultraviolet irradiation are simultaneously performed for 1.0 seconds, and only ultraviolet irradiation is performed for 4.0 seconds. A bonded body 9 was produced in the same manner as in Example 1 except for the above.
  • Example 4 (Comparative Example 4) In Example 1, after applying the ultrasonic wave for 1.0 second and then irradiating the ultraviolet ray for 5.0 second, after irradiating the ultraviolet ray for 5.0 second and then applying the ultrasonic wave for 1.0 second, A joined body 10 was produced in the same manner as in Example 1.
  • connection resistance ⁇ Measurement of connection resistance> Using a digital multimeter (trade name: Digital Multimeter 7561, manufactured by Yokogawa Electric Corporation), connection resistance ( ⁇ ) after initial connection resistance ( ⁇ ) and environmental test (85 ° C./85%/500 hr) ) was measured. The results are shown in Table 1.
  • the method for producing a joined body of the present invention can be suitably used for producing, for example, an IC tag, an IC card, a memory card, a flat panel display, and the like.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Non-Insulated Conductors (AREA)
  • Combinations Of Printed Boards (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne un procédé pour produire un matériau lié dans lequel un premier élément de circuit et un second élément de circuit sont électriquement interconnectés par un film conducteur anisotrope comprenant des particules électroconductrices et une résine photodurcissable. Le procédé comprend les étapes consistant à : disposer le premier élément de circuit, le film conducteur anisotrope et le second élément de circuit dans cet ordre ; souder par pression le premier élément de circuit avec le second élément de circuit à travers le film conducteur anisotrope tout en appliquant une onde ultrasonique ; et, après l'application de l'onde ultrasonique, irradier le film conducteur anisotrope avec de la lumière tout en réalisant le soudage par pression du premier élément de circuit avec le second élément de circuit à travers le film conducteur anisotrope.
PCT/JP2011/063643 2010-06-22 2011-06-15 Matériau lié et procédé de production associé WO2011162137A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020137001548A KR20130029804A (ko) 2010-06-22 2011-06-15 접합체 및 그의 제조 방법
CN201180030491.9A CN102948265B (zh) 2010-06-22 2011-06-15 接合体及其制造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010142012A JP2010251789A (ja) 2010-06-22 2010-06-22 接合体及びその製造方法
JP2010-142012 2010-06-22

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WO2011162137A1 true WO2011162137A1 (fr) 2011-12-29

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JP (1) JP2010251789A (fr)
KR (1) KR20130029804A (fr)
CN (1) CN102948265B (fr)
TW (1) TWI513583B (fr)
WO (1) WO2011162137A1 (fr)

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KR102196229B1 (ko) 2011-10-26 2020-12-30 쇼와덴코머티리얼즈가부시끼가이샤 회로 부품 및 그의 제조 방법
CN102768419B (zh) * 2011-12-05 2015-05-20 北京京东方光电科技有限公司 一种cog绑定工艺方法
JP2014039016A (ja) * 2012-07-06 2014-02-27 Hitachi Chemical Co Ltd 半導体装置の製造方法及び半導体装置
JP6291165B2 (ja) * 2013-03-15 2018-03-14 デクセリアルズ株式会社 接続体の製造方法、及び電子部品の接続方法
JP6231394B2 (ja) * 2014-02-03 2017-11-15 デクセリアルズ株式会社 アクリル系接着剤の反応率測定方法、及びアクリル系接着剤
CN113613391B (zh) * 2021-07-29 2023-11-24 宁波甬强科技有限公司 降低层压板翘曲度的方法

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