WO2013031702A1 - Procédé permettant de fabriquer une structure de connexion de cellules solaires - Google Patents

Procédé permettant de fabriquer une structure de connexion de cellules solaires Download PDF

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Publication number
WO2013031702A1
WO2013031702A1 PCT/JP2012/071497 JP2012071497W WO2013031702A1 WO 2013031702 A1 WO2013031702 A1 WO 2013031702A1 JP 2012071497 W JP2012071497 W JP 2012071497W WO 2013031702 A1 WO2013031702 A1 WO 2013031702A1
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WIPO (PCT)
Prior art keywords
adhesive
connection structure
manufacturing
conductive particles
connection
Prior art date
Application number
PCT/JP2012/071497
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English (en)
Japanese (ja)
Inventor
明典 横山
Original Assignee
旭化成イーマテリアルズ株式会社
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Filing date
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Publication of WO2013031702A1 publication Critical patent/WO2013031702A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to a connection structure, and more particularly, to a method for manufacturing a connection structure between a solar battery cell, a solar battery module and the like and a tab wire.
  • a solar cell module has a structure in which a plurality of solar cells are connected in series and / or in parallel via tab wires (wiring members) electrically connected to their surface electrodes. ing.
  • solder has been used to connect the surface electrode of the solar battery cell and the tab wire when manufacturing this solar battery module. Solder is widely used because it is excellent in connection reliability such as conductivity and fixing strength, is inexpensive, and is versatile.
  • Patent Document 1 the method using a conductive adhesive can be connected at a lower temperature than the method using a solder, and thus is suitable for electrical connection of thinned solar cells. It is thought that.
  • Patent Document 2 discloses a method for connecting thin solar cells.
  • an object of the present invention is to provide a connection structure that exhibits good connection conductivity and does not cause cracking of a substrate even in a thinned solar battery cell.
  • the present invention is as follows.
  • connection step including a connection step of connecting the surface electrode conductive wiring of the solar battery cell having a substrate thickness of 40 ⁇ m to 190 ⁇ m and the tab wire with an adhesive containing conductive particles having a Vickers hardness of 100 MPa to 600 MPa.
  • connection structure according to [1], wherein the conductive particles have an oxygen content of 10 ppm to 10,000 ppm.
  • connection structure according to [1] or [2], wherein the conductive particles are an alloy having a silver or copper component.
  • connection structure according to any one of [1] to [3], wherein the adhesive includes 0.1% by volume to 20% by volume of conductive particles.
  • connection structure according to any one of [1] to [4], wherein the adhesive includes a thermosetting resin and is pressurized and heated in the connection step.
  • a solar cell module including a connection structure manufactured by the manufacturing method according to any one of [1] to [5].
  • a method for producing a connection structure including a surface electrode conductive wiring of a solar battery cell, a tab wire, and a cured adhesive electrically connecting them the following steps: A method for producing the connection structure, comprising a step of setting the curing rate of the adhesive to 20% to 90% by curing the adhesive.
  • the light receiving part side of the solar battery cell is a convex surface, and the warpage of the convex surface at 50 ° C. is 0. 1 cm per length to the both ends of the tab wire.
  • connection structure according to [7] or [8], wherein the elastic modulus of the cured adhesive is 0.1 to 6.0 GPa.
  • connection structure according to any one of [7] to [9], wherein the solar cell substrate has a thickness of 40 ⁇ m to 190 ⁇ m.
  • connection structure that exhibits good connection conductivity and does not cause cracking of the substrate when the solar cell using a thin substrate and the wiring member are connected.
  • connection step of connecting the surface electrode conductive wiring of the solar battery cell having a substrate thickness of 40 ⁇ m to 190 ⁇ m and the tab wire with an adhesive containing conductive particles having a Vickers hardness of 100 MPa to 600 MPa A method for manufacturing a connection structure is provided.
  • connection structure containing the surface electrode conductive wiring of a photovoltaic cell, a tab line, and the hardened adhesive which has electrically connected them, Comprising: By hardening an adhesive, an adhesive There is also provided a method for producing the connection structure, which includes a step of setting the curing rate of 20% to 90%.
  • the solar battery cell in the present embodiment has a substrate and a surface electrode conductive wiring.
  • the thickness of the substrate is preferably 40 ⁇ m to 190 ⁇ m, more preferably 50 ⁇ m to 180 ⁇ m, and still more preferably 60 ⁇ m to 175 ⁇ m.
  • a thickness of the substrate of 190 ⁇ m or less is preferable from the viewpoint of performance and cost of the connection structure.
  • the thickness of the substrate is 40 ⁇ m or more, it is preferable from the viewpoint of utilization efficiency of sunlight.
  • the substrate examples include polycrystalline, single crystal, and amorphous silicon substrates, InGaAs substrates, GaAs substrates, CIGS substrates, and the like.
  • substrate a melting
  • the surface of the substrate can be roughened, an antireflection film can be applied, or a surface shaping process can be performed.
  • the substrate can be doped with a small amount of additive to make a pn junction.
  • the solar battery cell of this embodiment has a conductive wiring as a surface electrode on a substrate.
  • the width of the surface electrode conductive wiring is preferably 0.2 ⁇ m to 2 mm, and more preferably 10 ⁇ m to 1 mm.
  • the conductive wiring can be formed through holes or side surfaces from the front surface to the back surface of the substrate.
  • the thickness of the surface electrode conductive wiring is preferably 0.1 ⁇ m to 50 ⁇ m, and more preferably 0.1 ⁇ m to 30 ⁇ m.
  • the conductive wiring preferably includes at least one selected from the group consisting of silver, gold, copper, and aluminum. Furthermore, in the conductive bonding between the conductive wiring and the conductive particles, from the viewpoint of obtaining a stable connection by suppressing diffusion of the components forming the conductive wiring and / or conductive particles, the components of the conductive particles and the conductive wiring are: More preferably, they are identical or close to each other.
  • the adhesive forming the connection structure includes conductive particles and an organic binder.
  • the content ratio of the conductive particles is preferably 0.1% by volume to 20% by volume, and preferably 0.1% by volume to 2.% by volume based on the total volume of the adhesive. It is more preferably 5% by volume, and further preferably 0.1% by volume to 1.6% by volume.
  • a silane coupling agent, an aluminum coupling agent, a titanium coupling agent, a silicone pressure-sensitive adhesive, and an epoxy-modified silicone resin can be added to the adhesive from the viewpoint of adhesion.
  • a thickener, an antifoamer, a dispersing agent, etc. can be added to an adhesive agent as needed.
  • the content of other components is not particularly limited, but is preferably 20% by volume or less, more preferably 0.001% by volume to 20% by volume based on the total volume of the adhesive.
  • the conductive particles are conductive particles.
  • the Vickers hardness of the conductive particles is preferably 100 MPa to 600 MPa.
  • the Vickers hardness is a hardness calculated from a size traced by the diamond indenter by applying a weight to the material with the diamond indenter. From the viewpoint of preventing cracking of the substrate of the solar battery cell, the Vickers hardness of the conductive particles is preferably 600 MPa or less, more preferably 550 MPa or less, and further preferably 500 MPa or less.
  • the Vickers hardness is preferably 100 MPa or more, more preferably 200 MPa or more, and more preferably 300 MPa or more from the viewpoint of connection while eliminating the insulating resin component in the adhesive and obtaining good connection conductivity. More preferably, it is more preferably 400 MPa or more.
  • the Vickers hardness of the conductive particles can be measured by preparing a measurement sample having the same composition as the conductive particles and using a microhardness meter.
  • the conductive particles can be formed from a single component or a plurality of components.
  • the conductive particles preferably include at least one selected from, for example, copper, silver, gold, tin and the like.
  • Conductive particles formed from a plurality of components have appropriate hardness and softness, have both desired conductivity and desired Vickers hardness, and are alloyed to achieve appropriate conductivity and hardness. Can be adjusted, which is preferable. Therefore, the conductive particles are preferably an alloy composed of about 2 to 4 components.
  • the main component in the alloy composition of the conductive particles is preferably, for example, Cu—Ag, Cu—Au, Cu—Sn, Cu—Ag—Au, Ni—Au, and the like.
  • Cu—Ag, Ni—Au, Cu—Au and Cu—Sn are more preferable.
  • conductive particles of an alloy in which an additive component of about several percent by volume is added to conductive particles having these main components can also be used. Further, by mixing an appropriate amount of oxygen, the hardness of the conductive particles can be designed to a preferable value.
  • the oxygen concentration in the conductive particles is preferably 10 ppm or more, more preferably 200 ppm or more, and even more preferably 500 ppm or more. It is preferably 1000 ppm or more.
  • the oxygen concentration is preferably 10,000 ppm or less, more preferably 5000 ppm or less, and more preferably 3000 ppm or less from the viewpoint of preventing the hardness of the conductive particles from becoming excessively high and maintaining conductivity. More preferred is 2000 ppm or less.
  • the conductive particles preferably include particles having an average particle diameter of 1 ⁇ m to 30 ⁇ m.
  • a spherical shape, a substantially spherical shape, an indefinite shape, a fiber shape, a disk shape, or the like can be used.
  • the shape of the conductive particles is preferably spherical or substantially spherical.
  • the conductive particles can be produced using a method such as melting, chemical reduction, gas phase synthesis, or plating.
  • a particularly preferable method for producing conductive particles is a method in which a metal component is melted and solidified to an appropriate size.
  • a metal component containing one or more kinds selected from copper, silver, gold, aluminum and tin is once several hundred degrees or higher, preferably 500 ° C. or higher, more preferably 700 ° C. or higher, particularly preferably 900 ° C. or higher. Dissolve with to mix evenly.
  • a base material having such a composition that has been melt-mixed is rapidly solidified into a fine powder state by a known inert gas.
  • oxygen can be uniformly contained in the conductive alloy particles by containing a small amount of oxygen in the inert gas atmosphere. Also, water is sprayed on the dissolved base material to rapidly cool and solidify, so that oxygen is contained in the conductive powder, and then a reducing gas (for example, hydrogen gas) is sprayed, or in the reducing gas.
  • a reducing gas for example, hydrogen gas
  • a method of suitably controlling the oxygen concentration of the metal composition can be employed by leaving it to stand. By appropriately controlling the oxygen concentration, the Vickers hardness and conductivity of the conductive particles can be designed to a preferable level.
  • organic binder for example, at least selected from an epoxy resin, a polyimide resin, an acrylic resin, a phenoxy resin, a polyester resin, a urethane resin, a polyamide resin, a silicone resin, a modified resin, a thermosetting resin, and the like.
  • the organic binder is preferably one containing an epoxy resin and / or a silicone resin.
  • the curing agent can be added to the adhesive as a one-pack type, or can be added separately when the adhesive is cured as a two-pack type. Further, from the viewpoint of obtaining a reliable conductive connection, the organic binder more preferably contains a curing agent for curing the organic binder with heat. Therefore, the organic binder is more preferably a thermosetting resin. As the curing agent, an epoxy microcapsule type curing agent is particularly preferable from the viewpoint of achieving both reactivity and storage stability.
  • a known tab line can be used as the tab line.
  • the tab wire include a metal wire containing copper, silver, gold, tin, and the like.
  • a tab wire subjected to solder plating, tin plating, zinc plating or the like can be used as necessary.
  • the thickness of the tab line is 0.1 ⁇ m to 500 ⁇ m and the width of the tab line is 0.2 ⁇ m to 10 mm from the viewpoint of the handleability (handleability) of the tab line.
  • connection structure can be manufactured by connecting the surface electrode conductive wiring formed on the substrate of the solar battery cell and the tab wire with an adhesive containing conductive particles.
  • the adhesive the conductive particles and the organic binder are dispersed by adding an appropriate solvent, and the paste is used as it is in a paste state, or an inert film for the adhesive (for example, polyethylene terephthalate (PET). ), Polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polycarbonate (PC) film, etc.), a paste (for example, dispersion liquid) is applied, and the solvent is dried and scattered (volatilized) to form a film.
  • PET polyethylene terephthalate
  • PEN Polyethylene naphthalate
  • PPS polyphenylene sulfide
  • PC polycarbonate
  • the adhesive can be used as an adhesive (for example, an adhesive film).
  • the solvent include ethyl acetate and toluene.
  • a mixed solvent can also be used.
  • the thickness of the adhesive film is preferably 1 ⁇ m to 100 ⁇ m for handling, and the width of the adhesive film is preferably 0.5 mm to 50 mm for handling.
  • the adhesive paste or film is used by being applied or pasted onto the surface electrode conductive wiring of the solar battery cell, and is preferably cured by known heat, electron beam, light, cation, radical curing reaction or the like.
  • the curing rate of the adhesive is preferably in the range of 20% to 90%. From the viewpoint of giving the cured adhesive an appropriate flexibility and preventing cracking of the substrate of the solar battery cell, the curing rate of the adhesive is preferably 90% or less, more preferably 88% or less. Preferably, it is 85% or less. From the viewpoint of realizing reliable connection, the curing rate of the adhesive is preferably 20% or more, more preferably 30% or more, further preferably 40% or more, and 50% or more. Is particularly preferred. For example, in the case of a thermosetting binder, the curing rate of the adhesive can be adjusted by the heating temperature and the heating time.
  • heating the adhesive it is preferable to heat in the range of 0.1 second to 60 seconds from the viewpoint of productivity and connection conductivity.
  • a heating method for example, a heating body such as hot air, metal, ceramics or the like can be used.
  • the heating temperature of the adhesive is preferably a temperature at which the temperature of the adhesive itself is 100 ° C. to 400 ° C. from the viewpoint of preventing the substrate of the solar battery cell from being cracked by heating and obtaining good connection conductivity.
  • a temperature at which the temperature of the adhesive itself is 100 ° C. to 300 ° C. is more preferable, and a temperature at which the temperature of the adhesive itself is 100 ° C. to 200 ° C. is more preferable.
  • the warping direction of the connection body is convex on the light receiving portion side in order to obtain good solar cell performance by expanding the light receiving area.
  • the amount of warpage of the connection body is preferably 0.013 mm or more per 1 cm length between both ends of the tab line on the cell surface, more preferably from the viewpoint of obtaining good solar cell performance by expanding the light receiving area. 0.067 mm or more, more preferably 0.10 mm or more.
  • it is preferably 0.33 mm or less per 1 cm length between both ends of the tab line on the cell surface.
  • the length between both ends of the tab line on the cell surface means the length from one side of the tab line of the cell substrate to the other end side of the tab line in the direction in which the tab line is attached.
  • the amount of warpage of the solar battery cell can be measured as follows: After the adhesive is cured, the cell is placed on a smooth surface with the convex portion facing upward, and the maximum value of the distance from the smooth surface to the wiring having the copper component on the concave portion side is measured to obtain the magnitude of warpage.
  • the amount of warpage per 1 cm is calculated by measuring 10 times and dividing the average warpage size by the length between both ends of the tab line on the cell surface. The measurement can be performed in an environment of 50 ° C.
  • the amount of warpage of the solar battery cell can be adjusted by the curing rate of the cured adhesive and the elastic modulus (Young's modulus) at 50 ° C.
  • the preferable range of the curing rate is as described above, and can be appropriately adjusted according to the elastic modulus at 50 ° C. of the cured adhesive.
  • the elastic modulus at 50 ° C. of the cured adhesive is preferably from 0.1 to 6.0 GPa, more preferably from 0.3 to 5.0 GPa, even more preferably from the viewpoint of obtaining a preferred range of warpage. 1.0 to 4.0 GPa.
  • the elastic modulus at 50 ° C. of the cured adhesive is not the elastic modulus of the organic binder alone, but the elastic modulus of the entire adhesive including the conductive particles, and the influence of the component, size, and volume of the conductive particles has an effect. To do.
  • connection structure can be used for a solar cell or the like that exhibits good connection conductivity and does not crack even when the solar cell is thinned.
  • the physical properties of the conductive particles used were measured by the following methods.
  • the volume integrated average value was measured with a laser diffraction measuring instrument HEROS & RODOS SR type manufactured by Sympatec (Germany), and the particle diameter when the volume integrated value was 50% was defined as the average particle diameter value.
  • Oxygen concentration The oxygen concentration in the conductive particles was heated to 2000 ° C. and measured with EMGA650 (manufactured by Horiba, Ltd.).
  • Vickers hardness A sample for measurement having the same composition and the same oxygen concentration as the conductive particles was prepared.
  • the oxygen concentration of the measurement sample was prepared by high-temperature hydrogen reduction and air oxidation so as to be the same amount (within ⁇ 10%) as the conductive particles.
  • the oxygen concentration of the measurement sample was measured by the method (2) as with the conductive particles.
  • the Vickers hardness of the above measurement sample was measured with an HMV-1 microhardness meter manufactured by Shimadzu Corporation under conditions of a diamond Vickers indenter diagonal of 136 degrees and a test force of 0.098 to 9.8 N automatic switching.
  • the Vickers hardness is obtained by the following formula.
  • Vickers hardness HV (MPa) 0.1891 F / d 2
  • F Indenter weight (N)
  • d Diagonal length of traces on metal material by indenter (mm)
  • Table 1 shows the composition, average particle diameter, and Vickers hardness of the conductive particles used.
  • Curing rate (Heat generation amount of uncured adhesive cured to 250 ° C. ⁇ Heat generation amount cured to 250 ° C. by DSC after being immersed in silicone oil bath) / (Heat generation amount of uncured adhesive cured to 250 ° C.) ) X 100%
  • the amount of warpage of the solar battery cell After the adhesive is cured, the cell's convex part is placed on a smooth surface, and the maximum distance from the smooth surface to the wiring having the copper component on the concave side is measured. Say it. The measurement was performed 10 times, and the amount of warpage per 1 cm was calculated by dividing the average warpage size by the length to both ends of the tab line on the cell surface. The measurement was performed in an environment of 50 ° C.
  • Adhesive film is lightly pasted on a 20 ⁇ m thick surface electrode conductive wiring formed of silver paste on a silicon substrate having the thickness shown in Table 3 below, and the PET film is peeled off. After that, the tab wire is opposed to the surface electrode conductive wiring with the adhesive interposed therebetween, and the pressure of the adhesive shown in Table 3 is applied, and the temperature of the adhesive is set to the heating temperature shown in Table 3 for 16 seconds.
  • the tab wire was connected by pressurization and heating. After heating and pressurization, the pressurization location was observed with an optical microscope, and the degree of cracking of the substrate was evaluated according to the following criteria.
  • connection structures prepared in Examples 1 to 9 had sufficient connection conductivity and also had good substrate crack prevention properties.
  • connection structures prepared in Comparative Examples 1 to 3 had insufficient connection conductivity and / or had poor substrate cracking.
  • connection structure of the present invention can be used for a solar cell that exhibits good connection conductivity and does not crack even if it is a thinned solar cell.

Abstract

La présente invention se rapporte à un procédé permettant de fabriquer une structure de connexion qui comprend une étape de connexion consistant à raccorder un câblage conducteur d'électrode de surface de cellules solaires ayant une épaisseur de substrat comprise entre 40 µm et 190 µm et des languettes de connexion au moyen d'un adhésif qui comprend des particules conductrices qui présentent une dureté Vickers comprise entre 100 MPa et 600 MPa.
PCT/JP2012/071497 2011-08-26 2012-08-24 Procédé permettant de fabriquer une structure de connexion de cellules solaires WO2013031702A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011-184885 2011-08-26
JP2011184885 2011-08-26
JP2012050402 2012-03-07
JP2012-050402 2012-03-07

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WO2013031702A1 true WO2013031702A1 (fr) 2013-03-07

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WO2011059084A1 (fr) * 2009-11-16 2011-05-19 日立化成工業株式会社 Matériau de connexion de circuit, et structure de connexion pour élément de circuit utilisant ce matériau
WO2011162137A1 (fr) * 2010-06-22 2011-12-29 ソニーケミカル＆インフォメーションデバイス株式会社 Matériau lié et procédé de production associé
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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009295940A (ja) * 2008-06-09 2009-12-17 Mitsubishi Electric Corp 太陽電池セルおよび太陽電池モジュール
WO2010122863A1 (fr) * 2009-04-21 2010-10-28 ソニーケミカル＆インフォメーションデバイス株式会社 Module de cellule solaire et son procédé de fabrication
WO2011024662A1 (fr) * 2009-08-27 2011-03-03 三洋電機株式会社 Chaîne de cellules solaires et module de cellules solaires utilisant celle-ci
WO2011059084A1 (fr) * 2009-11-16 2011-05-19 日立化成工業株式会社 Matériau de connexion de circuit, et structure de connexion pour élément de circuit utilisant ce matériau
WO2011162137A1 (fr) * 2010-06-22 2011-12-29 ソニーケミカル＆インフォメーションデバイス株式会社 Matériau lié et procédé de production associé
JP2012009706A (ja) * 2010-06-25 2012-01-12 Asahi Kasei E-Materials Corp 太陽電池モジュール及びその製造方法

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