JP2012069913A - 太陽電池電極用接着フィルム及びそれを用いた太陽電池モジュールの製造方法 - Google Patents
太陽電池電極用接着フィルム及びそれを用いた太陽電池モジュールの製造方法 Download PDFInfo
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- JP2012069913A JP2012069913A JP2011151932A JP2011151932A JP2012069913A JP 2012069913 A JP2012069913 A JP 2012069913A JP 2011151932 A JP2011151932 A JP 2011151932A JP 2011151932 A JP2011151932 A JP 2011151932A JP 2012069913 A JP2012069913 A JP 2012069913A
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- epoxy resin
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 92
- 239000003822 epoxy resin Substances 0.000 claims abstract description 91
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims description 31
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 23
- 229920000800 acrylic rubber Polymers 0.000 claims description 20
- 229920000058 polyacrylate Polymers 0.000 claims description 20
- 229930185605 Bisphenol Natural products 0.000 claims description 19
- 229920006287 phenoxy resin Polymers 0.000 claims description 19
- 239000013034 phenoxy resin Substances 0.000 claims description 19
- 239000003566 sealing material Substances 0.000 claims description 17
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 16
- 238000007789 sealing Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 12
- 150000001875 compounds Chemical class 0.000 claims description 11
- 235000010290 biphenyl Nutrition 0.000 claims description 8
- 239000004305 biphenyl Substances 0.000 claims description 8
- 230000002411 adverse Effects 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 7
- 230000015572 biosynthetic process Effects 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 40
- 238000002844 melting Methods 0.000 description 24
- 230000008018 melting Effects 0.000 description 24
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 21
- 239000002245 particle Substances 0.000 description 21
- 239000000853 adhesive Substances 0.000 description 20
- 239000004593 Epoxy Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 18
- 238000002788 crimping Methods 0.000 description 13
- 239000005038 ethylene vinyl acetate Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 10
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 10
- 239000011521 glass Substances 0.000 description 10
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 10
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 8
- -1 CIGS Inorganic materials 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 238000010030 laminating Methods 0.000 description 7
- 229910052709 silver Inorganic materials 0.000 description 7
- 239000004332 silver Substances 0.000 description 7
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000007334 copolymerization reaction Methods 0.000 description 5
- 125000000524 functional group Chemical group 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000005341 toughened glass Substances 0.000 description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 230000004913 activation Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000000113 differential scanning calorimetry Methods 0.000 description 4
- 238000005304 joining Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 125000000129 anionic group Chemical group 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002966 varnish Substances 0.000 description 3
- 125000006527 (C1-C5) alkyl group Chemical group 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- DYCOQZIBHVOFLQ-UHFFFAOYSA-N Cc(cc(Cc(cc1C)cc(C)c1OCC1OC1)cc1C)c1OCC1OC1 Chemical compound Cc(cc(Cc(cc1C)cc(C)c1OCC1OC1)cc1C)c1OCC1OC1 DYCOQZIBHVOFLQ-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000004455 differential thermal analysis Methods 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 239000002648 laminated material Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- KYPOHTVBFVELTG-UPHRSURJSA-N (z)-but-2-enedinitrile Chemical compound N#C\C=C/C#N KYPOHTVBFVELTG-UPHRSURJSA-N 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910004613 CdTe Inorganic materials 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 229910005965 SO 2 Inorganic materials 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000001506 calcium phosphate Substances 0.000 description 1
- 229910000389 calcium phosphate Inorganic materials 0.000 description 1
- 235000011010 calcium phosphates Nutrition 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- WJRBRSLFGCUECM-UHFFFAOYSA-N hydantoin Chemical compound O=C1CNC(=O)N1 WJRBRSLFGCUECM-UHFFFAOYSA-N 0.000 description 1
- 229940091173 hydantoin Drugs 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 231100000989 no adverse effect Toxicity 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000003505 polymerization initiator Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003553 thiiranes Chemical group 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- QORWJWZARLRLPR-UHFFFAOYSA-H tricalcium bis(phosphate) Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QORWJWZARLRLPR-UHFFFAOYSA-H 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L7/00—Compositions of natural rubber
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Chemical & Material Sciences (AREA)
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Abstract
【解決手段】 太陽電池電極用接着フィルムは、太陽電池セルの表面電極と、配線部材とを電気的に接続するために用いられる接着フィルムであって、結晶性エポキシ樹脂、硬化剤、及びフィルム形成材を含有してなる。
【選択図】なし
Description
目標圧力=0.3MPa(≒3kgf/cm2)
接合面積=0.15cm×15.6cm=2.34cm2
加圧力=(接合面積)×(目標圧力)=2.34cm2×3kgf/cm2=7.02kgf
(実施例1)
フェノキシ樹脂(製品名:PKHC、ユニオンカーバイド社製、重量平均分子量45,000)を酢酸エチルに溶解して45質量%溶液6.67gを調製した。次いで、この溶液に、マイクロカプセル型潜在性硬化剤を含有する液状エポキシ樹脂(製品名:ノバキュアHX−3941HP、旭化成ケミカルズ社製、エポキシ当量185)4.5g、固形エポキシ樹脂であるCre−NovEp(製品名:YDCN−703、東都化成社製)1.5g、ビスフェノールF型エポキシ樹脂(製品名:YL983、JER社製)0.9g、ビスフェノール型結晶性エポキシ(製品名:YSLV−80XY、東都化成社製、融点80℃)0.9gを加えて攪拌し、接着剤組成物を得た。
実施例1と同様にして調製した接着剤組成物6.0gに、直径10μmのNi粒子を0.83g加えて攪拌して得られたワニスを用いて接着フィルムを作製した以外は実施例1と同様にして、太陽電池モジュールを作製した。得られた太陽電池モジュールについて、上記と同様にして曲線因子F.F.を求めた。
実施例1の接着剤組成物におけるビスフェノール型結晶性エポキシ(製品名:YSLV−80XY、東都化成社製、融点80℃)の配合量を0.5gに変更した以外は実施例1と同様にして、太陽電池モジュールを作製した。得られた太陽電池モジュールについて、上記と同様にして曲線因子F.F.を求めた。
実施例1の接着剤組成物におけるビスフェノール型結晶性エポキシ(製品名:YSLV−80XY、東都化成社製、融点80℃)の配合量を1.3gに変更した以外は実施例1と同様にして、太陽電池モジュールを作製した。得られた太陽電池モジュールについて、上記と同様にして曲線因子F.F.を求めた。
フェノキシ樹脂(製品名:PKHC、ユニオンカーバイド社製、重量平均分子量45,000)を酢酸エチルに溶解して45質量%溶液7.78gを調製した。次いで、この溶液に、マイクロカプセル型潜在性硬化剤を含有する液状エポキシ樹脂(製品名:ノバキュアHX−3941HP、旭化成ケミカルズ社製、エポキシ当量185)5.0g、ビスフェノール型結晶性エポキシ(製品名:YSLV−80XY、東都化成社製、融点80℃)1.0g、アクリルゴム(製品名:HTR−P3−TEA DR、日立化成工業社製、重量平均分子量850,000)をトルエンと酢酸エチルに溶解した15質量%溶液3.33gを加えて攪拌し、接着剤組成物を得た。
アクリルゴム(製品名:KS8200H、日立化成工業社製、分子量:85万)125gと、フェノキシ樹脂(製品名:PKHC、ユニオンカーバイド社製、重量平均分子量45,000)50gとを、酢酸エチル400gに溶解し、30質量%溶液を得た。次いで、この溶液に、マイクロカプセル型潜在性硬化剤を含有する液状エポキシ樹脂(製品名:ノバキュアHX−3941HP、旭化成ケミカルズ社製、エポキシ当量185)325gを加えて撹拌し、接着剤組成物を得た。さらに、この接着剤組成物に、直径10μm程度のNi粒子を56g加え攪拌した。
接着剤組成物にビスフェノール型結晶性エポキシ(製品名:YSLV−80XY、東都化成社製、融点80℃)を配合しなかった以外は実施例1と同様にして、太陽電池モジュールを作製した。得られた太陽電池モジュールについて、上記と同様にして曲線因子F.F.を求めた。
比較例1で得られた接着フィルムを用いて実施例5と同様にして2行2列の太陽電池モジュールを作製した。この太陽電池モジュールに対して実施例5と同様の評価を行った。
Claims (20)
- 太陽電池セルの表面電極と、配線部材とを電気的に接続するために用いられる接着フィルムであって、
結晶性エポキシ樹脂、硬化剤、及びフィルム形成材を含有してなる、太陽電池電極用接着フィルム。 - 前記硬化剤が潜在性硬化剤である、請求項1に記載の太陽電池電極用接着フィルム。
- 前記結晶性エポキシ樹脂が、ビスフェノール型エポキシ樹脂又はビフェニル型エポキシ樹脂である、請求項1又は2に記載の太陽電池電極用接着フィルム。
- 前記結晶性エポキシ樹脂が、ビスフェノール型エポキシ樹脂である、請求項1又は2に記載の太陽電池電極用接着フィルム。
- 前記フィルム形成材がフェノキシ樹脂を含む、請求項1〜5のいずれか一項に記載の太陽電池電極用接着フィルム。
- 前記フィルム形成材がフェノキシ樹脂及びアクリルゴムを含む、請求項1〜5のいずれか一項に記載の太陽電池電極用接着フィルム。
- 複数の太陽電池セルと、該太陽電池セル同士を電気的に接続する配線部材と、を備える太陽電池モジュールの製造方法であって、
太陽電池セルの表面電極、請求項1〜7のいずれか一項に記載の太陽電池電極用接着フィルム、及び配線部材をこの順に配し、前記表面電極と前記配線部材とを160℃以下の温度で接合する、太陽電池モジュールの製造方法。 - 複数の太陽電池セルと、該太陽電池セル同士を電気的に接続する配線部材と、を備える太陽電池モジュールの製造方法であって、
太陽電池セルの表面電極、請求項1〜7のいずれか一項に記載の太陽電池電極用接着フィルム、及び配線部材をこの順に配し、前記表面電極と前記配線部材とを0.2MPa以下の圧力で接合する、太陽電池モジュールの製造方法。 - 複数の太陽電池セルと、該太陽電池セル同士を電気的に接続する配線部材と、を備える太陽電池モジュールの製造方法であって、
太陽電池セルの表面電極、請求項1〜7のいずれか一項に記載の太陽電池電極用接着フィルム、及び配線部材をこの順に配し、前記表面電極と前記配線部材とを0.3MPa以下の圧力で接合する、太陽電池モジュールの製造方法。 - 前記表面電極と前記配線部材とを160℃以下の温度で接合する、請求項9又は10に記載の太陽電池モジュールの製造方法。
- ラミネータにより前記太陽電池セル及び前記配線部材を封止材で封止する封止工程を備え、
前記封止工程で前記表面電極と前記配線部材とを接合する、請求項8〜11のいずれか一項に記載の太陽電池モジュールの製造方法。 - 請求項8〜12のいずれか一項に記載の方法により得られる、太陽電池モジュール。
- 結晶性エポキシ樹脂、硬化剤、及びフィルム形成材を含有してなる接着フィルムの、太陽電池セルの表面電極と、配線部材とを電気的に接続するための使用。
- 前記硬化剤が潜在性硬化剤である、請求項14に記載の使用。
- 前記結晶性エポキシ樹脂が、ビスフェノール型エポキシ樹脂又はビフェニル型エポキシ樹脂である、請求項14又は15に記載の使用。
- 前記結晶性エポキシ樹脂が、ビスフェノール型エポキシ樹脂である、請求項14又は15に記載の使用。
- 前記フィルム形成材がフェノキシ樹脂を含む、請求項14〜18のいずれか一項に記載の使用。
- 前記フィルム形成材がフェノキシ樹脂及びアクリルゴムを含む、請求項14〜18のいずれか一項に記載の使用。
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CN201110253434.9A CN102399502B (zh) | 2010-08-26 | 2011-08-24 | 太阳能电池电极用粘接膜及使用其的太阳能电池模块的制造方法 |
DE202011110111U DE202011110111U1 (de) | 2010-08-26 | 2011-08-25 | Adhäsivfilm für Solarzellenelektrode |
US13/217,666 US20120048332A1 (en) | 2010-08-26 | 2011-08-25 | Adhesive film for solar cell electrode and method for manufacturing solar cell module using the same |
DE102011081551A DE102011081551A1 (de) | 2010-08-26 | 2011-08-25 | Adhäsivfilm für Solarzellenelektrode und Verfahren zur Herstellung eines Solarzellenmoduls mit deren Verwendung |
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JP5889738B2 (ja) * | 2012-07-10 | 2016-03-22 | デクセリアルズ株式会社 | 太陽電池モジュール及びその製造方法 |
JP6620744B2 (ja) * | 2014-07-11 | 2019-12-18 | 横浜ゴム株式会社 | 太陽電池集電電極形成用導電性組成物、太陽電池セルおよび太陽電池モジュール |
CN104178040B (zh) * | 2014-09-07 | 2016-01-20 | 尹红 | 光伏组件用密封胶及其制备方法 |
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FR3043253B1 (fr) * | 2015-10-29 | 2018-03-23 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de fabrication d'un module photovoltaique |
CN106898670A (zh) * | 2017-02-28 | 2017-06-27 | 东汉新能源汽车技术有限公司 | 太阳能芯片封装方法、太阳能芯片总成及太阳能汽车 |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1117206A (ja) * | 1997-06-23 | 1999-01-22 | Fuji Electric Co Ltd | 太陽電池モジュールの外部リード接続方法 |
JP2007112949A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
WO2007125903A1 (ja) * | 2006-04-26 | 2007-11-08 | Hitachi Chemical Company, Ltd. | 接着テープ及びそれを用いた太陽電池モジュール |
WO2009041506A1 (ja) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
JP2009120830A (ja) * | 2007-10-24 | 2009-06-04 | Hitachi Chem Co Ltd | 接着シート及びこれを用いた半導体装置およびその製造方法 |
JP2010024416A (ja) * | 2008-07-24 | 2010-02-04 | Sumitomo Electric Ind Ltd | 電極接続用接着剤 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02224376A (ja) * | 1989-02-27 | 1990-09-06 | Matsushita Electric Ind Co Ltd | 光検知素子の製造方法 |
JP3448924B2 (ja) | 1993-11-25 | 2003-09-22 | 富士電機株式会社 | 薄膜太陽電池モジュールの製造方法 |
JP2000286436A (ja) | 1999-03-31 | 2000-10-13 | Sanyo Electric Co Ltd | 太陽電池出力領域の製造方法 |
EP1090942B1 (en) * | 1999-10-06 | 2004-06-02 | Nitto Denko Corporation | Resin composition for semiconductor encapsulation, semiconductor device comprising the same and process for the production of semiconductor device using the same |
JP2001357897A (ja) | 2000-06-14 | 2001-12-26 | Fuji Xerox Co Ltd | 光電変換モジュール |
JP3879666B2 (ja) | 2002-12-24 | 2007-02-14 | 日立電線株式会社 | 太陽電池接続用リード線 |
JP4329532B2 (ja) | 2003-07-15 | 2009-09-09 | 日立電線株式会社 | 平角導体及びその製造方法並びにリード線 |
JP2005101519A (ja) | 2003-09-05 | 2005-04-14 | Hitachi Chem Co Ltd | 太陽電池ユニット及び太陽電池モジュール |
JP2007214533A (ja) | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
JP5116363B2 (ja) | 2007-05-29 | 2013-01-09 | デクセリアルズ株式会社 | 導体線の製造方法 |
JP2010053184A (ja) * | 2008-08-26 | 2010-03-11 | Nippon Steel Chem Co Ltd | 難燃性接着剤樹脂組成物及びそれを用いたフレキシブルプリント基板用材料 |
US8465666B2 (en) | 2009-02-25 | 2013-06-18 | Panasonic Corporation | Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
-
2011
- 2011-07-08 JP JP2011151932A patent/JP5158238B2/ja not_active Expired - Fee Related
- 2011-08-24 CN CN201110253434.9A patent/CN102399502B/zh not_active Expired - Fee Related
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- 2011-08-25 DE DE202011110111U patent/DE202011110111U1/de not_active Expired - Lifetime
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1117206A (ja) * | 1997-06-23 | 1999-01-22 | Fuji Electric Co Ltd | 太陽電池モジュールの外部リード接続方法 |
JP2007112949A (ja) * | 2005-10-24 | 2007-05-10 | Sumitomo Electric Ind Ltd | 異方導電性接着剤 |
WO2007125903A1 (ja) * | 2006-04-26 | 2007-11-08 | Hitachi Chemical Company, Ltd. | 接着テープ及びそれを用いた太陽電池モジュール |
WO2009041506A1 (ja) * | 2007-09-26 | 2009-04-02 | Hitachi Chemical Company, Ltd. | 導電体接続用部材及びその製造方法、接続構造、並びに、太陽電池モジュール |
JP2009120830A (ja) * | 2007-10-24 | 2009-06-04 | Hitachi Chem Co Ltd | 接着シート及びこれを用いた半導体装置およびその製造方法 |
JP2010024416A (ja) * | 2008-07-24 | 2010-02-04 | Sumitomo Electric Ind Ltd | 電極接続用接着剤 |
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