WO2011162137A1

WO2011162137A1 - Bonded material, and process for production thereof

Info

Publication number: WO2011162137A1
Application number: PCT/JP2011/063643
Authority: WO
Inventors: 朋之石松
Original assignee: ソニーケミカル＆インフォメーションデバイス株式会社
Priority date: 2010-06-22
Filing date: 2011-06-15
Publication date: 2011-12-29
Also published as: TW201204557A; CN102948265A; KR20130029804A; TWI513583B; CN102948265B; JP2010251789A

Abstract

Disclosed is a process for producing a bonded material in which a first circuit member and a second circuit member are electrically bonded to each other through an anisotropic conductive film comprising electrically conductive particles and a photocurable resin. The process comprises the steps of: arranging the first circuit member, the anisotropic conductive film and the second circuit member in this order; pressure-welding the first circuit member to the second circuit member through the anisotropic conductive film while applying an ultrasonic wave; and, subsequent to the application of the ultrasonic wave, irradiating the anisotropic conductive film with light while carrying out the pressure-welding of the first circuit member to the second circuit member through the anisotropic conductive film.

Description

CONNECTED BODY AND METHOD FOR PRODUCING THE SAME

The present invention relates to a joined body and a manufacturing method thereof.

Conventionally, as a means for connecting electronic components, a tape-like connecting material (for example, anisotropic conductive film (ACF)) in which a resin in which conductive particles are dispersed is applied to a release film has been used. Yes.

This anisotropic conductive film is used when, for example, a terminal of an electronic component (IC chip) or a flexible printed circuit board (FPC) is connected to an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. First, it is used when various terminals are bonded and electrically connected to produce a joined body.

In particular, COG mounting for mounting an IC chip on an LCD panel or the like using the anisotropic conductive film, and IC bonded to a flexible tape having metal wiring on the LCD panel or the like using the anisotropic conductive film COF mounting for mounting a chip has been attracting attention as liquid crystal displays have become higher definition, thinner and have a narrower frame.
However, in the current COG mounting, heat is applied at a temperature of 150 ° C. to 250 ° C. for 5 seconds to 10 seconds, and the panel is warped due to the thermal expansion / contraction difference between the IC chip and the panel, resulting in uneven screen display. There is a problem that it occurs. Furthermore, even in the current COF mounting, the connection is made by applying heat for 5 to 10 seconds at a temperature of 150 ° C to 250 ° C, and the alignment is shifted due to thermal expansion and contraction of the IC chip bonded to the flexible tape. Therefore, there is a problem that a connection failure or a short circuit between terminals occurs.

As a means for solving the above problems, attention has been focused on anisotropic conductive connection using photocuring and ultrasonic application.

For example, a technique has been proposed in which ultrasonic waves are applied to an anisotropic conductive film containing an organic peroxide as a curing agent to connect the substrates (see, for example, Patent Document 1).
However, this technique has a problem that the problem due to thermal expansion and contraction still cannot be solved because the anisotropic conductive film is thermally cured.

Further, a technique has been proposed in which an ultraviolet (UV) curable resin is applied between circuit boards, terminals of the circuit board are joined with ultrasonic waves, and the ultraviolet (UV) curable resin is cured with ultraviolet (UV). (For example, refer to Patent Document 2).
However, this technique has a problem that sufficient bonding strength cannot be obtained and connection reliability is low.

Furthermore, a technique for applying ultrasonic waves while heating by irradiating an anisotropic conductive film with a light beam generated by a YAG laser, a xenon lamp, a halogen lamp, or the like has been proposed (for example, see Patent Document 3). ).
However, in this technique, when an anisotropic conductive film containing a photocurable resin that is cured by light irradiation (see, for example, Patent Document 4) is used, the bonding (adhesion) strength is not sufficient, and the electrical characteristics are further improved. There is a problem of being inferior.

JP 2010-4067 A JP 2005-209704 A JP-A-8-146451 JP 2010-16388 A

This invention makes it a subject to solve the said various problems in the past and to achieve the following objectives. That is, an object of the present invention is to provide a joined body that has excellent electrical characteristics, suppresses warpage, and can improve connection reliability and a method for manufacturing the joined body.

Means for solving the above problems are as follows. That is,
<1> In the method for manufacturing a joined body in which the first circuit member and the second circuit member are electrically joined via an anisotropic conductive film containing conductive particles and a photocurable resin, A step of arranging the first circuit member, the anisotropic conductive film and the second circuit member in this order; and the anisotropic conductive film comprising the first circuit member and the second circuit member. A step of applying an ultrasonic wave during pressure welding, and after applying the ultrasonic wave, the first circuit member and the second circuit member are pressure-contacted via the anisotropic conductive film. However, the manufacturing method of the conjugate | zygote characterized by including the process of irradiating light to the said anisotropic conductive film.
<2> The method for producing a bonded body according to <1>, wherein the anisotropic conductive film is irradiated with ultrasonic waves from one side and the anisotropic conductive film is irradiated with light from the other side. It is.
<3> The method for producing a joined body according to any one of <1> to <2>, wherein the wavelength of the irradiated light is 200 nm to 750 nm.
<4> The method for producing a bonded body according to any one of <1> to <3>, wherein the photocurable resin includes at least one of a photocationic curable resin and a photoradical curable resin.
<5> The method according to any one of <1> to <4>, wherein the application time of the ultrasonic wave is 0.1 second to 2.0 seconds, and the light irradiation time is 1.0 second to 5.0 seconds. This is a manufacturing method of the joined body.
<6> A joined body produced by the production method according to any one of <1> to <5>.

According to the present invention, it is possible to solve the above-described problems in the related art, achieve the above-described object, and have excellent electrical characteristics, suppress warpage, and improve connection reliability and a method for manufacturing the same. Can be provided.

FIG. 1 is a schematic explanatory view showing a joined body of the present invention.

(Joint)
The joined body of the present invention includes at least a first circuit member, a second circuit member, and an anisotropic conductive film, and further includes other members appropriately selected as necessary. Become.

<First and second circuit members>
There is no restriction | limiting in particular as said 1st and 2nd circuit member, According to the objective, it can select suitably, For example, a wiring board, an electronic component, a flexible wiring board (FPC) etc. are mentioned.

There is no restriction | limiting in particular as said wiring board, According to the objective, it can select suitably, For example, an LCD board | substrate, a PDP board | substrate, an organic electroluminescent board | substrate etc. are mentioned.
There is no restriction | limiting in particular as a material of the said wiring board, Although it can select suitably according to the objective, Glass, a transparent plastic, etc. are preferable at the point which is a light transmittance.
The transmittance of light having a wavelength of 200 nm to 750 nm of the wiring board is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 50% to 100%, more preferably 70% to 100%.
When the transmittance is less than 50%, it becomes easy to form a portion with a low curing rate of the binder, which may cause poor connection. On the other hand, when the transmittance is within the particularly preferable range, it is advantageous in that a uniform cured state can be easily obtained as a whole and a good connection state can be maintained.
Further, even when there is a portion (non-light-transmitting portion) that does not partially transmit light due to a metal wiring or the like on the glass substrate, it can be suitably used. The ratio of the non-translucent portion in the substrate is preferably 50% or less, and more preferably 30% or less, from the viewpoint of satisfactory binder curing.

Examples of the electronic component include an IC chip and a TAB tape on which the IC chip is mounted.

<Anisotropic conductive film>
The anisotropic conductive film includes at least a conductive layer, and further includes other layers as necessary.
The anisotropic conductive film of the present invention preferably contains at least a film-forming resin (thermoplastic resin), a photocurable resin, conductive particles, and a curing agent.

-Conductive layer-
The conductive layer includes at least conductive particles and a photocurable resin, and may further include a curing agent, a thermoplastic resin, and other components as necessary.

--- Conductive particles--
There is no restriction | limiting in particular as said electroconductive particle, According to the objective, it can select suitably, For example, metal particles, such as solder, nickel, gold | metal | money, silver, copper; Metal (Nickel, gold | metal | money, silver, palladium, aluminum) Organic fillers such as resin particles coated (plated) with copper; inorganic fillers such as glass particles and ceramic particles coated (plated) with metal (nickel, gold, silver, palladium, aluminum, copper, etc.) And so on.
The particle size of the conductive particles is not particularly limited and may be appropriately selected depending on the intended purpose. For example, the volume average particle size is preferably 2 μm to 10 μm, more preferably 2 μm to 4 μm.
If the volume average particle size is less than 2 μm, classification treatment and acquisition are difficult, and if it exceeds 10 μm, it becomes difficult to cope with the narrowing of the junction terminals due to the fine pitch of the junction terminals. There is.
There is no restriction | limiting in particular as specific gravity of the said electroconductive particle, According to the objective, it can select suitably.

-Photocurable resin-
There is no restriction | limiting in particular as said photocurable resin, According to the objective, it can select suitably, For example, photoradical curable resin, photocationic curable resin, etc. are mentioned.
There is no restriction | limiting in particular as said radical photocurable resin, According to the objective, it can select suitably, For example, epoxy (meth) acrylates, urethane (meth) acrylates, (meth) acrylate oligomer etc. are mentioned. .
The photo-radical curable resin is not particularly limited and may be appropriately selected depending on the purpose. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol Diacrylate, trimethylolpropane triacrylate, dimethyloltricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diaacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl ] Propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclodecanyl acrylate, tris (acryloxyethyl) ) Isocyanurate, urethane acrylate, and the like. These may be used individually by 1 type and may use 2 or more types together.
Furthermore, as said radical photocurable resin, what made the said acrylate into the methacrylate is mentioned, These may be used individually by 1 type and may use 2 or more types together.
The photocationic curable resin is not particularly limited and may be appropriately selected depending on the intended purpose. For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, oxetane resin, alicyclic type Examples thereof include epoxy resins and modified epoxy resins thereof. These may be used individually by 1 type and may use 2 or more types together.
Further, a photo radical curable resin or a photo cation curable resin may be mixed and used together.

--- Curing agent-
The curing agent is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a curing agent that generates active cationic species or radical species by light having a wavelength range of 200 nm to 750 nm.
There is no restriction | limiting in particular as a photocationic hardening | curing agent which generate | occur | produces a cationic seed | species, According to the objective, it can select suitably, For example, a sulfonium salt, onium salt, etc. are mentioned. These can well cure various epoxy resins.
There is no restriction | limiting in particular as a radical photocuring agent which generate | occur | produces radical seed | species, According to the objective, it can select suitably, For example, an alkyl phenone type photoinitiator, an acyl phosphine oxide type photoinitiator, a titanocene type | system | group Examples thereof include a polymerization initiator and an oxime ester photopolymerization initiator. These can well cure various acrylates.
Examples of the curing agent that generates active cationic species or radical species by light in the wavelength region of 200 nm to 750 nm include, for example, a photo radical curing agent (trade name: Irgacure 651, manufactured by Ciba Specialty Chemicals), a photo cation. Examples thereof include a curing agent (trade name: Irgacure 369, manufactured by Ciba Specialty Chemicals).
Moreover, you may use together, such as mixing a radical photocuring agent and a photocationic curing agent.

--- Thermoplastic resin (film-forming resin) ---
There is no restriction | limiting in particular as said thermoplastic resin, According to the objective, it can select suitably, For example, a phenoxy resin, a urethane resin, a polyester resin, a styrene isoprene resin, a nitrile butadiene resin etc. are mentioned.

-Other ingredients-
There is no restriction | limiting in particular as said other component, According to the objective, it can select suitably, For example, a pigment, a silane coupling agent, an inorganic filler, an organic filler, etc. are mentioned.

--- Pigment ---
The pigment is not particularly limited and may be appropriately selected depending on the intended purpose. For example, titanium dioxide, zinc oxide, ultramarine, bengara, lithopone, lead, cadmium, iron, cobalt, aluminum, hydrochloride, sulfate Inorganic pigments such as azo pigments, organic pigments such as copper phthalocyanine pigments, and the like.

---Silane coupling agent---
The silane coupling agent is not particularly limited and may be appropriately selected depending on the intended purpose. For example, vinyltris (2-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane, 3-styryltrimethoxy Silane, 3-methacryloxypropyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, N-2- (aminoethyl)- 3-aminopropyltrimethoxysilane, N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, 3-aminopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, 3-mercaptopropyltri Methoxysilane 3-chloropropyl trimethoxy silane, and the like.

---- Inorganic filler ---
The inorganic filler is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include silica, alumina, titanium oxide, barium sulfate, talc, calcium carbonate, glass powder, and quartz powder.

--- Organic filler ---
There is no restriction | limiting in particular as said organic filler, According to the objective, it can select suitably, For example, urethane powder, acrylic powder, silicone powder, etc. are mentioned.

-Other layers-
There is no restriction | limiting in particular as said other layer, According to the objective, it can select suitably, For example, a peeling layer can be mentioned.
The shape, structure, size, thickness, material (material), etc. of the release layer are not particularly limited and can be appropriately selected according to the purpose. For example, a transparent release PET (polyethylene terephthalate) sheet coated with a release agent such as silicone is preferable. Further, a PTFE (polytetrafluoroethylene) sheet may be used.

As shown in FIG. 1, the joined body 100 of the present invention includes an LCD panel 10 as a first circuit member, an IC chip 11 as a second circuit member, and an anisotropic conductive film 12. The terminals 11a in the IC chip 11, the conductive particles 12a in the anisotropic conductive film 12, and the terminals (not shown) in the LCD panel 10 are electrically connected, whereby the LCD panel 10 and the IC chip 11 are electrically connected. Connected.

(Method of manufacturing joined body)
The method for producing a joined body of the present invention includes at least an arrangement step, an ultrasonic wave application step, and a light irradiation step, and further includes other steps that are appropriately selected as necessary.

<Arrangement process>
The arrangement step is a step of arranging the first circuit member, the anisotropic conductive film, and the second circuit member in this order.

<Ultrasonic application process>
The ultrasonic wave applying step is a step of applying ultrasonic waves when the first circuit member and the second circuit member are pressure-contacted via an anisotropic conductive film.

The pressure contact means that the first circuit member and the second circuit member can conduct through the anisotropic conductive film, that is, the conductive particles in the anisotropic conductive film are the first and second conductive members. It means that the circuit member is in contact with the connection terminal.
The pressure contact is performed by pressing either the first circuit member or the second circuit member using a pressing member (20 in FIG. 1) such as a heat tool, for example. A buffer material such as Teflon (registered trademark) may be interposed between the second circuit member and the second circuit member. By interposing the cushioning material, it is possible to reduce the pressure variation and prevent the heat tool from becoming dirty.

There is no restriction | limiting in particular as said press member, According to the objective, it can select suitably, You may perform a press once using the press member which is a larger area than a press target, Alternatively, pressing may be performed in several times using a pressing member having a small area.

The tip shape of the pressing member is not particularly limited and may be appropriately selected depending on the intended purpose. Examples thereof include a planar shape and a curved surface shape. In addition, when the said front-end | tip shape is a curved surface shape, you may press along the said curved surface shape.

The pressing force at the time of pressing is not particularly limited and varies depending on the type and purpose of the circuit member, and the range of the pressing force can be selected as appropriate.

It is preferred to maintain the pressure until an optimum cure rate is reached. The optimum curing rate varies depending on the type of connection material and circuit member, but is preferably 60% to 100%, and more preferably 70% to 100%.
If the curing rate is less than 60%, connection failure may occur.

The frequency of the ultrasonic wave is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 10 kHz to 100 kHz, and more preferably 20 kHz to 60 kHz.
When the frequency is less than 10 kHz, the force for pushing the circuit member is insufficient, and connection failure may occur. When the frequency exceeds 100 kHz, the junction terminal of the circuit member may be deformed to cause short circuit or connection failure. .

The vibration direction of the ultrasonic wave is not particularly limited and can be appropriately selected according to the purpose. For example, the horizontal vibration or the vertical vibration with respect to the plane of the first circuit member or the second circuit member is possible. Any of these may be used. Horizontal vibration is preferable from the viewpoint of reducing damage to the first circuit member or the second circuit member, and vertical vibration is preferable from the viewpoint of preventing misalignment of fine pitch connection.

The ultrasonic wave application time is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 0.1 second to 2.0 seconds, and more preferably 0.5 seconds to 1.0 second.
If the ultrasonic wave application time is less than 0.1 seconds, the circuit member may be insufficiently pushed. If it exceeds 2.0 seconds, the wiring of the circuit member may be deformed.

By the application of ultrasonic waves, the metal melts, for example, the bond between gold in the conductive particles and gold in the junction terminals (bumps) of the circuit members, and the gold in the conductive particles and tin in the junction terminals (bumps) of the circuit members. Can be formed.
There is no restriction | limiting in particular as said ultrasonic application means, According to the objective, it can select suitably, For example, the press member (20 in FIG. 1) etc. which can incorporate the ultrasonic wave etc. are mentioned. .

<Light irradiation process>
The light irradiation step is a step of irradiating light to the anisotropic conductive film while applying ultrasonic waves and then pressing the first circuit member and the second circuit member through the anisotropic conductive film. is there.
The pressure contact means that the first circuit member and the second circuit member can conduct through the anisotropic conductive film, that is, the conductive particles in the anisotropic conductive film are the first and second conductive members. It means that the circuit member is in contact with the connection terminal.
In order to press-contact the first circuit member and the second circuit member through the anisotropic conductive film, for example, at least one of the first circuit member and the second circuit member is pressed.

The light is not particularly limited as long as it is light capable of curing the photocurable resin, and can be appropriately selected according to the purpose, but light (ultraviolet light) having a wavelength of 200 nm to 750 nm is preferable.
Moreover, there is no restriction | limiting in particular as a light source (30 in FIG. 1) which emits the said light, According to the objective, it can select suitably, For example, an LED light source, a UV lamp light source, etc. are mentioned.

As the timing of light irradiation, the first circuit member and the second circuit member are pressed through an anisotropic conductive film by pressing and ultrasonic irradiation, and then light irradiation is performed. In addition, the application of ultrasonic waves is stopped during light irradiation. This is because if an ultrasonic wave is applied in a photocured state, a crack may occur in the bonded body, resulting in a decrease in connection reliability.

There is no restriction | limiting in particular as an irradiation direction of the said light irradiation, According to irradiation efficiency etc., it can select suitably, For example, a perpendicular direction may be sufficient with respect to an irradiation object, Moreover, with respect to the said perpendicular direction It may be an inclined direction.

Furthermore, after irradiating light while pressing the first circuit member and the second circuit member through the anisotropic conductive film, do not further press the second circuit member toward the first circuit member. The light irradiation may be performed for 0.5 seconds or more. Thereby, it can harden | cure further in the state which the stress to push in reduced, and can improve connection reliability further.

The light irradiation time is not particularly limited and may be appropriately selected depending on the intended purpose, but is preferably 1.0 second to 10.0 seconds, and more preferably 1.0 second to 5.0 seconds.
If the light irradiation time is less than 1.0 second, it may not be sufficiently photocured, and if it exceeds 10.0 seconds, the short-time connection becomes impossible and the tact time increases, resulting in an increase in cost. May end up.

The application of ultrasonic waves and light irradiation are preferably performed from opposite directions with respect to the anisotropic conductive film. For example, it is preferable to apply ultrasonic waves from one circuit member (electronic component or FCP) side and to perform light irradiation from the other circuit member (wiring board) side.
By performing light irradiation from the other circuit member, the pressing member for pressing one circuit member does not block light, so that the light irradiation efficiency can be improved and photocured while pressing. Can do.

For example, in COG mounting in which a glass wiring board and an IC chip are connected, an anisotropic conductive film containing an ultraviolet curable resin is disposed on the glass wiring board, and the anisotropic conductive film is ultrasonically applied from the IC chip side. After the IC chip is melted and the IC chip is pushed in, the glass wiring board and the IC chip are connected without heating by irradiating with ultraviolet rays from the side of the glass substrate under pressure and curing. As a result, panel warpage due to thermal shrinkage can be prevented, and the problem of display unevenness can be solved.
Further, in COF mounting in which the glass wiring board and the COF are connected, misalignment due to thermal expansion and contraction can be reduced by the same connection method, and a sufficient connection area can be secured and terminal short-circuit can be prevented.
For the purpose of promoting the melting of the anisotropic conductive film, mounting may be performed by supplementarily applying heat of 60 ° C. to 100 ° C.

Examples of the present invention will be described below, but the present invention is not limited to the following examples.

(Production Example 1)
60 parts by mass of a phenoxy resin (trade name: YP50, manufactured by Tohto Kasei Co., Ltd.), 35 parts by mass of a radical photopolymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.), and a silane coupling agent (trade name: KBM) -503, manufactured by Shin-Etsu Chemical Co., Ltd.) and an adhesive containing 2 parts of a photo radical curing agent (trade name: Irgacure 651, manufactured by Ciba Specialty Chemicals Co., Ltd.), gold-plated conductive particles (trade name: A film-like connecting material A having a thickness of 20 μm was obtained in which AUL704 (manufactured by Sekisui Chemical Co., Ltd.) was dispersed so as to have a particle density of 20,000 particles / mm ² .

(Production Example 2)
60 parts by mass of phenoxy resin (trade name: YP50, manufactured by Toto Kasei Co., Ltd.), 35 parts by mass of photocation curable resin (liquid epoxy resin) (trade name: JER-828, manufactured by Japan Epoxy Resin Co., Ltd.), and silane coupling In an adhesive containing 1 part of an agent (trade name: KBM-403, manufactured by Shin-Etsu Chemical Co., Ltd.) and 2 parts of a photocationic curing agent (trade name: Irgacure 369, manufactured by Ciba Specialty Chemicals) A film-like connecting material B having a thickness of 20 μm was obtained in which conductive particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.) were dispersed to a particle density of 20,000 particles / mm ² .

(Production Example 3)
60 parts by mass of a phenoxy resin (trade name: YP50, manufactured by Tohto Kasei Co., Ltd.), 35 parts by mass of a photo radical curable resin (trade name: EB-600, manufactured by Daicel Cytec), and a silane coupling agent (trade name: KBM) -503, manufactured by Shin-Etsu Chemical Co., Ltd.) and an adhesive containing 2 parts of a thermal radical curing agent (trade name: Perbutyl O, manufactured by NOF Corporation), gold-plated conductive particles (trade name: AUL704, Sekisui) A film-like connecting material C having a thickness of 20 μm in which a particle density of 20,000 particles / mm ² was dispersed was obtained.

(Production Example 4)
In Production Example 2, a film-like connecting material D was obtained in the same manner as in Production Example 2 except that the gold-plated conductive particles were not dispersed.

(Production Example 5)
In Production Example 2, a film-like connection material E was obtained in the same manner as in Production Example 2 except that silver-plated conductive particles were used instead of gold-plated conductive particles.

(Production Example 6)
In Production Example 2, a film-like connection material F was obtained in the same manner as in Production Example 2 except that copper-plated conductive particles were used instead of gold-plated conductive particles.

(Production Example 7)
In Production Example 2, a film-like connecting material G was obtained in the same manner as in Production Example 2 except that nickel-plated conductive particles were used instead of gold-plated conductive particles.

(Production Example 8)
In Production Example 2, a film-like connection material H was obtained in the same manner as in Production Example 2 except that palladium-plated conductive particles were used instead of gold-plated conductive particles.

Example 1
On the aluminum wiring pattern glass substrate corresponding to the pattern of the IC chip (trade name: 1737F, manufactured by Corning, size: 50 mm × 30 mm × 0.5 mm), the film-like connecting material A produced in Production Example 1 is placed, An IC chip (dimensions: 1.8 mm × 20.0 mm, thickness: 0.5 mm, gold bump size: 30 μm × 85 μm, bump height: 15 μm, pitch: 50 μm) is arranged on the film-like connection material A, and the IC When the chip and the aluminum wiring pattern glass substrate are pressed through the film-like connecting material A, an ultrasonic wave is applied for 1.0 second under conditions of vibration 50 Hz, amplitude 2 μm, and pressing force 60 MPa, and then the pressing force 60 MPa is maintained. As it is, UV light is applied from the aluminum wiring pattern glass substrate side using a metal halide lamp (trade name: MLDS250, manufactured by Iwasaki Electric Co., Ltd.). 5.0 seconds, and irradiated light amount 5,000 mJ / cm ^2, to produce a bonded structure 1.

(Example 2)
In Example 1, instead of using the film-like connection material A, a joined body 2 was produced in the same manner as in Example 1 except that the film-like connection material B produced in Production Example 2 was used.

(Example 3)
In Example 1, instead of using the film-like connection material A, a joined body 3 was produced in the same manner as in Example 1 except that the film-like connection material E produced in Production Example 5 was used.

Example 4
In Example 1, instead of using the film-like connection material A, a joined body 4 was produced in the same manner as in Example 1 except that the film-like connection material F produced in Production Example 6 was used.

(Example 5)
In Example 1, instead of using the film-like connection material A, a joined body 5 was produced in the same manner as in Example 1 except that the film-like connection material G produced in Production Example 7 was used.

(Example 6)
In Example 1, instead of using the film-like connection material A, a joined body 6 was produced in the same manner as in Example 1 except that the film-like connection material H produced in Production Example 8 was used.

(Comparative Example 1)
Using the film-like connection material C produced in Production Example 3, an IC chip (dimensions: 1.8 mm × 20.0 mm, thickness: 0.5 mm, gold bump size: 30 μm × 85 μm, bump height: 15 μm, pitch : 50 μm) and an aluminum wiring pattern glass substrate (product name: 1737F, manufactured by Corning, size: 50 mm × 30 mm × 0.5 mm) corresponding to the IC chip pattern, 170 ° C., 80 MPa, 10.0 seconds connection The joined body 7 was produced under the conditions.

(Comparative Example 2)
In Example 1, instead of using the film-like connection material A, a joined body 8 was produced in the same manner as in Example 1 except that the film-like connection material D produced in Production Example 4 was used.

(Comparative Example 3)
In Example 1, after applying ultrasonic waves for 1.0 second and then irradiating ultraviolet rays for 5.0 seconds, ultrasonic wave application and ultraviolet irradiation are simultaneously performed for 1.0 seconds, and only ultraviolet irradiation is performed for 4.0 seconds. A bonded body 9 was produced in the same manner as in Example 1 except for the above.

(Comparative Example 4)
In Example 1, after applying the ultrasonic wave for 1.0 second and then irradiating the ultraviolet ray for 5.0 second, after irradiating the ultraviolet ray for 5.0 second and then applying the ultrasonic wave for 1.0 second, A joined body 10 was produced in the same manner as in Example 1.

The following measurements were performed on the joined bodies 1 to 10 produced in Examples 1 to 6 and Comparative Examples 1 to 4.

<Measurement of reaction rate (curing rate)>
Mounting the reaction rate (curing rate) of the film-like connecting material on the back side of the aluminum wiring pattern on the aluminum wiring pattern glass substrate using an infrared spectrophotometer (Part No. FT / IR-4100, manufactured by JASCO Corporation) It was calculated from the attenuation amount (%) of the epoxy absorption wavelength before and after mounting or the attenuation amount (%) of the absorption wavelength of the unsaturated group. The results are shown in Table 1.

<Measurement of warpage>
Using a stylus type surface roughness meter (trade name: SE-3H, manufactured by Kosaka Laboratory Co., Ltd.), scan from the lower side of the glass substrate, and warp amount of the aluminum wiring pattern glass substrate surface after IC chip pressing (μm ) Was measured. The results are shown in Table 1.

<Measurement of connection resistance>
Using a digital multimeter (trade name: Digital Multimeter 7561, manufactured by Yokogawa Electric Corporation), connection resistance (Ω) after initial connection resistance (Ω) and environmental test (85 ° C./85%/500 hr) ) Was measured. The results are shown in Table 1.

<Measurement of initial adhesive strength>
Initial bond strength (kg / IC) was measured using a die shear measuring machine (trade name: Dage 2400, manufactured by Daisy). The results are shown in Table 1.

From Table 1, it is possible to connect without heating to a high temperature by using a combination of ultrasonic waves and ultraviolet rays, thereby suppressing the warpage of the bonded panel and solving the problem of display unevenness. Can do. Further, since the residual stress of the joined body after mounting is small, the connection reliability is high.

The method for producing a joined body of the present invention can be suitably used for producing, for example, an IC tag, an IC card, a memory card, a flat panel display, and the like.

10 LCD panel (circuit members)
11 IC chip (circuit member)
11a terminal 12 anisotropic conductive film 12a conductive particle 20 pressing member 30 light source 100 joined body

Claims

In the method for manufacturing a joined body in which the first circuit member and the second circuit member are electrically joined via an anisotropic conductive film containing conductive particles and a photocurable resin,
Arranging the first circuit member, the anisotropic conductive film and the second circuit member in this order;
Applying ultrasonic waves when the first circuit member and the second circuit member are pressure-contacted via the anisotropic conductive film;
After applying the ultrasonic wave, irradiating the anisotropic conductive film with light while pressing the first circuit member and the second circuit member through the anisotropic conductive film; The manufacturing method of the conjugate | zygote characterized by including.
The method for producing a joined body according to claim 1, wherein the anisotropic conductive film is irradiated with ultrasonic waves from one side and the anisotropic conductive film is irradiated with light from the other side.
3. The method for producing a joined body according to claim 1, wherein the wavelength of the irradiated light is 200 nm to 750 nm.
The method for producing a joined body according to any one of claims 1 to 3, wherein the photocurable resin includes at least one of a photocationic curable resin and a photoradical curable resin.
The method for producing a joined body according to any one of claims 1 to 4, wherein the ultrasonic wave is applied for 0.1 seconds to 2.0 seconds, and the light irradiation time is 1.0 seconds to 5.0 seconds. .
A joined body produced by the production method according to any one of claims 1 to 5.