WO2011160592A1 - 已封装的led的安装结构及led照明系统 - Google Patents

已封装的led的安装结构及led照明系统 Download PDF

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Publication number
WO2011160592A1
WO2011160592A1 PCT/CN2011/076177 CN2011076177W WO2011160592A1 WO 2011160592 A1 WO2011160592 A1 WO 2011160592A1 CN 2011076177 W CN2011076177 W CN 2011076177W WO 2011160592 A1 WO2011160592 A1 WO 2011160592A1
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Prior art keywords
led
packaged
packaged led
heat
outer casing
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PCT/CN2011/076177
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English (en)
French (fr)
Inventor
胡秀梅
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Wu Sau Mui
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Publication of WO2011160592A1 publication Critical patent/WO2011160592A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED mounting structure and an LED lighting system.
  • LEDs The light-emitting efficiency of LEDs is rapidly increasing. Different LED products have been used in the market to replace traditional lighting systems such as MR16 spotlights, portable flashlights and the like.
  • Figure 1 shows the existing LED
  • the thermal design of the illumination system, the anode 12 and the cathode 11 of the packaged LED are connected to the circuit board 2 to allow current to pass through the encapsulated LED 1.
  • the circuit board 2 is, for example, an aluminum alloy base copper plate, and the circuit board is generally composed of three layers of materials: an aluminum layer 23, a ceramic layer 22, and a copper layer 21.
  • the LED is fixed on the aluminum alloy base copper plate by using the solder paste 8.
  • the aluminum alloy base copper plate together with the packaged LED is fixed to the heat sink 7 by the heat dissipation oil 4.
  • FIG. 2 and FIG. 3 Another conventional LED lighting system heat dissipation design, as shown in FIG. 2 and FIG. 3, the design is: adding a guiding hole 51 to the circuit board 5, and placing the LED chip 15 above the guiding hole, in the line A heat sink 7 is applied under the board, and a current is passed between the circuit board 5 and the LED chip 15 by means of a gold-plated wire 14, and an optical lens 13 is applied over the chip to form an LED.
  • the LED chip 15 is fixed on the via hole of the wiring board and the heat dissipation adhesive 6.
  • the structure can only fix the chip of the LED on the heat sink by using a heat-dissipating adhesive. Since the heat dissipation effect of the heat-dissipating adhesive is far less than that of the solder paste, the heat dissipation performance of the structure is poor.
  • the object of the present invention is to provide a mounting structure of an encapsulated LED and an LED illumination system capable of improving heat dissipation performance in view of the deficiencies of the prior art.
  • the present invention adopts the following technical solution: a mounting structure of a packaged LED, including a heat conductive member and a packaged LED, the packaged LED being directly mounted on the heat conductive member.
  • the packaged LEDs are directly mounted on the heat-conducting component, so that the direct contact between the two is as large as possible, so that the heat of the packaged LED can be directly radiated through the heat-conducting component, thereby improving the heat dissipation performance.
  • the direct mounting method can be soldering or a mounting structure capable of achieving direct thermal contact between the two.
  • the packaged LED is directly soldered to the thermally conductive component by solder paste.
  • the heat conducting component has a via hole, and the solder paste fills the via hole.
  • the heat conductive member also has at least one heat dissipation hole.
  • the heat conducting component is a housing or a heat sink.
  • the heat conducting component is an outer casing.
  • the outer casing is an aluminum outer casing or a copper outer casing.
  • the outer casing is a heat sink.
  • An LED lighting system comprising the mounted structure of the packaged LED.
  • the thermally conductive component of the packaged structure of the packaged LED is the outer casing of the LED illumination system.
  • the thermally conductive component of the packaged structure of the packaged LED is a heat sink of the LED illumination system.
  • a method of mounting an encapsulated LED that mounts the packaged LED directly to a thermally conductive component.
  • the packaged LED is directly soldered to the thermally conductive component by solder paste.
  • the heat conducting component is a heat sink or a housing.
  • a mounting structure for an encapsulated LED comprising a housing and a packaged LED, the packaged LED being mounted directly to the housing.
  • the packaged LED is soldered directly to the outer casing by solder paste.
  • the outer casing has a guide hole, and the tin slurry fills the guide hole.
  • the housing also has at least one louver.
  • the outer casing is a heat conductor.
  • the outer casing is an aluminum outer casing or a copper outer casing.
  • the outer casing is a heat sink.
  • An LED lighting system includes a mounting structure of the packaged LED.
  • the packaged LED is directly connected to the outer casing, so that the LED and the heat sink or the outer casing have a wide range of direct contact, and the heat generated by the packaged LED can directly radiate out of the outer casing of the product, thereby improving the heat dissipation performance.
  • the heat dissipation performance of the present invention is higher than that of the prior art, and the light extraction rate and lifetime of the LED are also increased as compared with the prior art due to the improvement of heat dissipation performance.
  • FIG. 1 is a schematic structural view of a first LED lighting system of the prior art
  • FIG. 2 is a schematic structural view of a second LED lighting system of the prior art
  • FIG. 3 is a schematic diagram showing an LED package structure of a second LED lighting system of the prior art
  • FIG. 4 is a plan view showing a mounting structure of an LED packaged in the embodiment
  • Figure 5 is a bottom plan view showing the mounting structure of the packaged LED of the present embodiment
  • Fig. 6 is a cross-sectional view showing the mounting structure of the packaged LED of the embodiment.
  • the heat sink or housing 7 is made of a highly thermally conductive material such as aluminum or copper.
  • the center of the heat sink or housing 7 has a pilot hole 71 filled with the solder paste 8 for soldering the packaged LED 1 directly to the heat sink or housing 7.
  • the heat sink or housing 7 can have one or more louvers 72 for auxiliary heat dissipation.
  • the heat sink or housing 7 is made of a highly thermally conductive material such as aluminum or copper.
  • the cathode 11 of the packaged LED and the anode 12 of the packaged LED allow current to pass to the packaged LED 1 to cause the LED to illuminate.
  • the heat sink or housing 7 can have one or more louvers 72 for auxiliary heat dissipation.
  • the entire packaged LED 1 is soldered to the heat sink or housing 7 with solder paste 8 to improve heat dissipation.
  • the heat sink or housing 7 is made of a highly thermally conductive material such as aluminum or copper.
  • the cathode 11 of the packaged LED and the anode 12 of the packaged LED allow current to pass to the packaged LED 1 to cause the LED to illuminate.
  • the center of the heat sink or housing 7 has a pilot hole 71 filled with solder paste for directly soldering the packaged LED 1 to the heat sink or housing 7. The entire packaged LED will be attached to the heat sink or housing 7 to improve heat dissipation.
  • the mounting structure of the packaged LED includes the packaged LED and the housing, and the packaged LED is directly attached to the housing.
  • the directly mounted structure includes: the packaged LED is directly mounted on the outer casing through the guide hole; the packaged LED is directly soldered to the outer casing through the solder paste; the solder paste directly solders the packaged LED to the outer casing through the guide hole.
  • the housing can be a heat sink.
  • the outer casing may be made of a thermally conductive material, and the outer casing made of the thermally conductive material may directly dissipate the heat generated by the encapsulated LED.
  • the heat conductive material is a material having high heat conductivity and high thermal conductivity, such as aluminum or copper.
  • the housing may also be provided with cooling holes for assisting in heat dissipation.
  • An LED lighting system comprising a packaged LED and a housing, the packaged LED being mounted directly on the housing.
  • the outer casing may refer to the casing of the entire lighting system or to the radiator of the lighting system.
  • the LED lighting system is such as a spotlight or a portable flashlight.
  • a method of mounting a packaged LED by soldering the packaged LED directly to the heat sink or housing via solder paste A guide hole is formed in the center of the heat sink or the casing for filling the solder paste to directly fix the packaged LED to the heat sink or the casing.
  • the housing of the mounting method is a heat sink.
  • the raw material of the outer casing of the installation method is a material with high thermal conductivity.
  • the raw material of the outer casing of the mounting method is aluminum or copper.
  • the method of mounting the packaged LED is used as a lighting system.
  • the lighting system is a spotlight or a portable flashlight.
  • the illumination system is an MR16 type spotlight.
  • the lighting system is a portable flashlight.
  • the housing of the mounting method is a heat sink.
  • the raw material of the outer casing of the installation method is a material with high thermal conductivity.
  • the raw material of the outer casing of the mounting method is aluminum or copper.
  • the method of mounting the packaged LED is used as a lighting system.
  • the lighting system is a spotlight or a portable flashlight.
  • the illumination system is an MR16 type spotlight.
  • the lighting system is a portable flashlight.
  • the housing of the mounting method is a heat sink.
  • the raw material of the outer casing of the installation method is a material with high thermal conductivity.
  • the raw material of the outer casing of the mounting method is aluminum or copper.
  • the method of mounting the packaged LED is used as a lighting system.
  • the lighting system is a spotlight or a portable flashlight.
  • the illumination system is an MR16 type spotlight.
  • the lighting system is a portable flashlight.
  • the housing of the mounting method is a heat sink.
  • the raw material of the outer casing of the installation method is a material with high thermal conductivity.
  • the raw material of the outer casing of the mounting method is aluminum or copper.
  • the method of mounting the packaged LED is used as a lighting system.
  • the lighting system is a spotlight or a portable flashlight.
  • the illumination system is an MR16 type spotlight.
  • the lighting system is a portable flashlight.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Description

已封装的LED的安装结构及LED照明系统 技术领域
本发明是关于一种LED的安装结构及LED照明系统。
背景技术
LED的出光效率正在迅速提高，市场上已有不同的LED商品用作代替传统的照明系统例如MR16型射灯、手提电筒等。
由于LED，特别是大功率的LED，在发光的过程中会产生大量热量，如果LED照明系统的散热设计不好，会直接影响LED的出光效率和寿命，甚至LED会因过热而损坏。
图1为现有的LED 照明系统的散热设计，已封装的LED的阳极12和阴极11连接线路板2让电流通过已封装的LED1。线路板2如铝合金基敷铜板，线路板一般由三层物料组成：铝层23、陶瓷层22和铜层21。利用锡浆8把LED固定在铝合金基敷铜板上。铝合金基敷铜板连同已封装的LED利用散热油4固定在散热器7上。在图1的结构中，由于已封装的LED所产生的热能需要经过五层的物料（锡浆－＞铜层－＞陶瓷层－＞铝层－＞散热油）才能到达散热器7上，其散热效能因此大打折扣。不良的散热效果会令LED的出光率大减和寿命缩短，甚至烧掉LED的芯片。
另一种现有的LED照明系统的散热设计，如图2及图3所示，该设计为：在线路板5上加一导孔51，在导孔的上方放上LED芯片15，在线路板下方加上散热器7，利用镀金线14令电流在线路板5与LED芯片15之间通过，在芯片的上方加上光学透镜13制成LED。在线路板上的导孔加上散热黏合剂6固定LED芯片15。但由于在现有技术中还不能把锡浆直接焊在LED的芯片上，所以该结构只能利用散热黏合剂将LED的芯片固定在散热器上。由于散热黏合剂的散热效果远不及锡浆，因此该结构的散热性能较差。
 技术问题
本发明的目的是针对现有技术的不足，提供一种能够提高散热性能的已封装的LED的安装结构及LED照明系统。
技术解决方案
为实现上述目的，本发明采用了以下技术方案：一种已封装的LED的安装结构，包括导热部件和已封装的LED，所述已封装的LED直接安装在所述导热部件。已封装的LED直接安装在所述导热部件上，使两者尽可能大范围的直接接触，使已封装的LED的热量能够通过导热部件直接散热，提高了散热性能。该直接安装的方式可以为焊接或者能够实现两者直接导热接触的安装结构。
所述已封装的LED通过锡浆直接焊接在所述导热部件。
所述导热部件具有导孔，所述锡浆充填所述导孔。
所述导热部件还具有至少一个散热孔。
所述导热部件为外壳或散热器。
所述导热部件为外壳。
所述外壳为铝质外壳或铜质外壳。
所述外壳为散热器。
一种LED照明系统，包括所述的已封装的LED的安装结构。
所述已封装的LED的安装结构的导热部件为LED照明系统的外壳。
所述已封装的LED的安装结构的导热部件为LED照明系统的散热器。
一种已封装的LED的安装方法，将所述已封装的LED直接安装于导热部件。
所述已封装的LED通过锡浆直接焊接于所述导热部件。
所述导热部件为散热器或外壳。
一种所述的已封装的LED的安装结构在LED照明系统上的应用。
一种已封装的LED的安装结构，包括外壳和已封装的LED，所述已封装的LED直接安装在所述外壳。
所述已封装的LED通过锡浆直接焊接在所述外壳。
所述外壳具有导孔，所述锡浆充填所述导孔。
所述外壳还具有至少一个散热孔。
所述外壳为导热体。
所述外壳为铝质外壳或铜质外壳。
所述外壳为散热器。
一种LED照明系统，包括所述已封装的LED的安装结构。
 有益效果
本发明的有益效果是：
1) 已封装的LED与外壳直接相连，令LED和散热器或外壳有大范围的直接的接触，已封装的LED所产生的热量能直接散发出产品的外壳外，提高了散热性能。
2)能够使用导热性高的锡浆代替散热黏合剂把已封装的LED固定在散热器或外壳上，提高了散热性能。
3)本发明的散热性能比现有技术高，由于散热性能提高，LED的出光率和寿命也比现有技术有所增加。
 附图说明
图1是现有技术的第一种LED照明系统的结构示意图；
图2是现有技术的第二种LED照明系统的结构示意图；
图3是反映现有技术的第二种LED照明系统的LED封装结构的示意图；
图4是本实施方式已封装的LED的安装结构的俯视图；
图5是本实施方式已封装的LED的安装结构的仰视图；
图6是本实施方式已封装的LED的安装结构的剖视示意图。
 本发明的实施方式
下面通过具体实施方式结合附图对本发明作进一步详细说明。
如图4至图6所示，散热器或外壳7由高导热性的材料制成，例如铝或铜。散热器或外壳7的中心有一填入锡浆8的导孔71用作将已封装的LED1直接焊接在散热器或外壳7上。散热器或外壳7可有一个或多个散热孔72用作辅助散热。
如图4至图6所示，散热器或外壳7由高导热性的材料制成，例如铝或铜。已封装的LED的阴极11和已封装的LED的阳极12让电流通向已封装的LED1，令LED发光。散热器或外壳7可有一个或多个散热孔72用作辅助散热。整个已封装的LED1会用锡浆8固定在散热器或外壳7上来提高散热性能。
如图4至图6所示，散热器或外壳7由高导热性的材料制成，例如铝或铜。已封装的LED的阴极11和已封装的LED的阳极12让电流通向已封装的LED1，令LED发光。散热器或外壳7的中心有一填入锡浆的导孔71用作将已封装的LED1直接焊接在散热器或外壳7上。整个已封装的LED会被固定在散热器或外壳7上来提高散热性能。
已封装的LED的安装结构包括已封装的LED和外壳，该已封装的LED直接固定在外壳上。该直接安装的结构包括：已封装的LED通过导孔直接安装在外壳；已封装的LED通过锡浆直接焊接在外壳；锡浆通过导孔把已封装的LED直接焊接在外壳。该外壳可以为一个散热器。该外壳可以由导热材料制成，通过该导热材料制成的外壳可以把已封装的LED产生的热量直接散发出。该导热材料如散热性能好的高导热性的材料，如铝或铜。外壳还可以设有用于辅助散热的散热孔。
一种LED照明系统，包括已封装的LED和外壳，该已封装的LED直接安装在外壳上。该外壳可以指整个照明系统的机壳，也可以指照明系统的散热器。该LED照明系统如射灯或手提电筒等。
一种已封装的LED的安装方法，通过锡浆把已封装的LED直接焊接在散热器或外壳上。在散热器或外壳的中心有一导孔用以填入锡浆把已封装的LED直接固定在散热器或外壳上。
一种已封装的LED的安装方法，把已封装的LED直接安装在外壳。所述的安装方法的外壳为一个散热器。所述的安装方法的外壳的原材料为高导热性的物料。所述的安装方法的外壳的原材料为铝或铜。所述的已封装的LED的安装方法用作照明系统。所述的照明系统为射灯或手提电筒。所述的照明系统为MR16型射灯。所述的照明系统为手提电筒。
一种已封装的LED的安装方法，把已封装的LED通过导孔直接安装在外壳。所述的安装方法的外壳为一个散热器。所述的安装方法的外壳的原材料为高导热性的物料。所述的安装方法的外壳的原材料为铝或铜。所述的已封装的LED的安装方法用作照明系统。所述的照明系统为射灯或手提电筒。所述的照明系统为MR16型射灯。所述的照明系统为手提电筒。
一种已封装的LED的安装方法，把已封装的LED利用锡浆直接焊接在外壳。所述的安装方法的外壳为一个散热器。所述的安装方法的外壳的原材料为高导热性的物料。所述的安装方法的外壳的原材料为铝或铜。所述的已封装的LED的安装方法用作照明系统。所述的照明系统为射灯或手提电筒。所述的照明系统为MR16型射灯。所述的照明系统为手提电筒。
一种已封装的LED的安装方法，利用锡浆把已封装的LED通过导孔直接焊接在外壳。所述的安装方法的外壳为一个散热器。所述的安装方法的外壳的原材料为高导热性的物料。所述的安装方法的外壳的原材料为铝或铜。所述的已封装的LED的安装方法用作照明系统。所述的照明系统为射灯或手提电筒。所述的照明系统为MR16型射灯。所述的照明系统为手提电筒。
以上内容是结合具体的实施方式对本发明所作的进一步详细说明，不能认定本发明的具体实施只局限于这些说明。对于本发明所属技术领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干简单推演或替换，都应当视为属于本发明的保护范围。

Claims (15)

  1. 一种已封装的LED的安装结构，包括导热部件和已封装的LED，其特征在于：所述已封装的LED直接安装在所述导热部件。
  2. 根据权利要求1所述的已封装的LED的安装结构，其特征在于：所述已封装的LED通过锡浆直接焊接在所述导热部件。
  3. 根据权利要求2所述的已封装的LED的安装结构，其特征在于：所述导热部件具有导孔，所述锡浆充填所述导孔。
  4. 根据权利要求2所述的已封装的LED的安装结构，其特征在于：所述导热部件还具有至少一个散热孔。
  5. 根据权利要求1-4中任意一项所述的已封装的LED的安装结构，其特征在于：所述导热部件为外壳或散热器。
  6. 根据权利要求5所述的已封装的LED的安装结构，其特征在于：所述导热部件为外壳。
  7. 根据权利要求6所述的已封装的LED的安装结构，其特征在于：所述外壳为铝质外壳或铜质外壳。
  8. 根据权利要求6所述的已封装的LED的安装结构，其特征在于：所述外壳为散热器。
  9. 一种LED照明系统，其特征在于：包括权利要求1-8中任意一项所述的已封装的LED的安装结构。
  10. 根据权利要求9所述的LED照明系统，其特征在于：所述已封装的LED的安装结构的导热部件为LED照明系统的外壳。
  11. 根据权利要求9所述的LED照明系统，其特征在于：所述已封装的LED的安装结构的导热部件为LED照明系统的散热器。
  12. 一种已封装的LED的安装方法，其特征在于：将所述已封装的LED直接安装于导热部件。
  13. 根据权利要求12所述的已封装的LED的安装方法，其特征在于：所述已封装的LED通过锡浆直接焊接于所述导热部件。
  14. 根据权利要求12或13所述的已封装的LED的安装方法，其特征在于：所述导热部件为散热器或外壳。
  15. 一种权利要求1-8中任意一项所述的已封装的LED的安装结构在LED照明系统上的应用。
PCT/CN2011/076177 2010-06-25 2011-06-23 已封装的led的安装结构及led照明系统 WO2011160592A1 (zh)

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