WO2013016953A1 - 一种贴片式led灯泡 - Google Patents

一种贴片式led灯泡 Download PDF

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Publication number
WO2013016953A1
WO2013016953A1 PCT/CN2012/072095 CN2012072095W WO2013016953A1 WO 2013016953 A1 WO2013016953 A1 WO 2013016953A1 CN 2012072095 W CN2012072095 W CN 2012072095W WO 2013016953 A1 WO2013016953 A1 WO 2013016953A1
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Prior art keywords
led
lamp
chip
surface mount
base
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PCT/CN2012/072095
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English (en)
French (fr)
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罗东明
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惠州市东扬科技有限公司
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Publication of WO2013016953A1 publication Critical patent/WO2013016953A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to the field of illumination, and in particular to a patch LED light bulb.
  • LED is one of the best illumination sources at present, and it has the advantages of high brightness and long service life.
  • the temperature of the LED light source is high.
  • the LED is usually attached to a heat sink, and the heat sink is used to dissipate the heat in the LED.
  • the existing LED light source is an LED bulb with direct illumination structure.
  • the LED bulb usually consists of a heat sink, an LED light source patch attached to the end surface of the cylindrical heat sink, and a driver mounted on the other end of the heat sink.
  • the lamp holder is installed at both ends of the heat sink, and the heat sink usually has a certain length, otherwise the heat dissipation requirement of the LED operation will not be achieved.
  • the current LED bulb body is usually longer than the ordinary bulb, and can not be the same as the existing ordinary bulb.
  • the LED bulb with a long lamp body is not only limited in scope of use.
  • the present invention provides a chip type LED bulb with reasonable structure, high luminous efficiency, uniform heat dissipation, high heat dissipation efficiency and long service life.
  • a chip type LED bulb comprises a lamp cap, a lamp cover, a lamp cup connecting the lamp cap and the lamp cover, wherein the lamp cap is provided with a control circuit component, and the LED chip is disposed in the lamp cover, and the LED chip is electrically connected with the control circuit component.
  • a cylindrical base is mounted on the lamp cover, and a chip holder is fixed on the base, and the LED patch is attached to the side surface and the end surface of the chip holder; the chip holder 6 adopts a solid structure or a heat sink. To form a centrally derived heat sink structure.
  • the patch holder is a cylinder, a polygonal cylinder, a platform or a combination of two or three of the foregoing.
  • a substrate is mounted on the base, and the chip holder is fixed on the substrate.
  • a heat sink may be disposed in the base.
  • the susceptor, the substrate and the mount are made of aluminum or copper or ceramic.
  • the lampshade is made of glass or plastic material and is in the form of olive, sphere or column.
  • the invention has the advantages of beautiful appearance, compact and reasonable structure, low manufacturing cost, and adopts a centrally-derived heat dissipation structure instead of the conventional convection type and direct contact type, so that the heat generated by the LED can be dissipated in time, so that the LED
  • the uniform heat dissipation of the bulb improves the heat dissipation performance of the lamp, effectively extending the service life of the LED bulb and improving reliability.
  • the LED patch adopts a multi-angle bonding method, the LED bulb realizes near-spherical illumination, so that the illumination of the LED lamp is more uniform, and the illumination effect is more ideal.
  • Embodiment 1 is a schematic cross-sectional structural view of Embodiment 1 of the present invention.
  • Figure 2 is a schematic cross-sectional view showing a second embodiment of the present invention.
  • Fig. 3 is a cross-sectional structural view showing a third embodiment of the present invention.
  • a chip type LED bulb includes a lamp cap 1 , a lamp cover 2 , a lamp cup 3 connecting the lamp cap 1 and the lamp cover 2 , and the lamp cap 1 is provided with a control circuit component, and the lamp cover 2 is provided with an LED sticker.
  • the LED patch 4 is electrically connected to the control circuit assembly.
  • the lamp cover 2 is mounted with a cylindrical base 5, and the base 5 is fixed with a patch holder 6, and the LED patch 4 is attached to the patch. On the side and end faces of the seat 6.
  • the number of the LED patches 4 is several, which is the main light-emitting element of the present invention, and has the characteristics of high luminous efficiency.
  • the control circuit assembly includes at least one circuit board.
  • a substrate 7 is mounted on the base 5.
  • the cylindrical base 5 is open at both ends, and the mounting position of the substrate 7 is provided on the inner side thereof for fixing to the substrate 7.
  • the chip holder 6 is fixed on the substrate 7, and a portion of the chip holder 6 to which the LED chip 4 is pasted protrudes outside the base 5.
  • the susceptor 5 and the substrate 7 are made of an aluminum material with good heat dissipation effect or other high thermal conductive materials such as copper material or ceramics, so that the heat dissipation effect of the LED patch 4 can be enhanced.
  • the base 5 and the substrate 7 may be made of the same metal material or different metal materials.
  • the chip holder 6 adopts a solid structure or a heat sink built therein to form a centrally-derived heat dissipation structure.
  • the patch holder 6 is a cylinder, a polygonal cylinder, a table body or a combination of two or three of the foregoing.
  • the patch holder 6 is a combination of a cylinder and a truncated cone, and has a flared design.
  • One end of the LED strip 4 is cylindrical, and a plurality of LED patches 4 are evenly attached to the end surface of the patch holder 6 and On the side of the end. Since the LED patch adopts a multi-angle bonding method, the LED bulb realizes nearly 360-degree illumination, that is, near-spherical illumination, so that the illumination of the LED lamp is more uniform, and the illumination effect is more ideal.
  • the LED lamp uses a centrally-derived heat sink structure instead of the traditional convection and direct contact.
  • the chip holder 6 is made of an aluminum material with good heat dissipation effect or other high heat conductive material such as copper material or ceramic.
  • the heat generated by the LED chip 4 is conducted to the substrate 7 through the chip holder 6 for heat dissipation.
  • the gradual design of the patch holder 6 is more favorable for the heat dissipation of the LED patch 4, so that the heat is more efficiently radiated and conducted.
  • the lampshade 2 is made of glass or plastic material, olive type, spherical shape or column shape, and the like, especially the olive type lamp cover, so that the bulb can be entirely candle-shaped, which is very beautiful.
  • the lampshade 2 is of an olive-shaped design.
  • the lampshade 2 adopts a spherical design.
  • the patch holder 6 has a truncated cone shape.
  • the chip holder 6 is fixed on the substrate 7, and a portion of the chip holder 6 to which the LED chip 4 is pasted protrudes outside the base 5.
  • the other side of the substrate 7 is provided with a heat sink, and heat generated when the LED patch 4 operates can be transmitted to the heat sink through the substrate 7.
  • the lampshade 2 is of an olive type design.
  • the patch holder 6 is a combination of a prism, a polygonal column and a cylinder. One end of the LED patch 4 is ribbed, and the LED patch 4 is pasted on the end surface and each side.
  • the lamp cap 1 is used for realizing electrical connection with an external power source, and may be a universal lamp cap with external threads or a universal lamp cap with a buckle on the outer wall, so that the application range of the invention is wider.

Abstract

一种贴片式LED灯泡，包括灯头（1）、灯罩（2）和连接灯头（1）与灯罩（2）的灯杯（3）。所述灯头（1）内设有控制电路组件，灯罩（2）内设置LED贴片（4），该LED贴片（4）与控制电路组件电连接。所述灯罩（2）内安装有一筒状基座（5），该基座（5）上固定有一贴片座（6），所述LED贴片（4）粘贴于贴片座（6）的侧面及端面上。该LED灯泡采用中心导出式散热结构，可及时将LED产生的热量散去，提高了灯具的散热性能，有效延长了LED灯泡的使用寿命和提高可靠性。由于LED贴片采用多角度的粘贴方式，该LED灯泡实现近球状发光，光照更为均匀，光照效果更理想。

Description

一种贴片式LED灯泡
技术领域
本发明涉及照明领域，尤其涉及一种贴片式LED灯泡。
背景技术
传统的白炽灯通常耗电量大，且温度高，不利于节能。随着LED技术的发展，人们发现LED是目前最好的照明光源之一，它具有发光亮度高、使用寿命长等优点。但是LED光源运行时的温度较高，为改善LED运行环境，通常都会将LED贴在一散热器，利用散热器来散发LED中的热量。现有以LED为光源的照明灯是一种直接照射结构的LED灯泡，这种LED灯泡通常由一散热器、粘贴在筒状散热器端面的LED光源贴片、安装在散热器另一端的驱动器和灯头安装在散热器的两端，散热器通常具有一定的长度，否则将达不到LED运行散热要求。受限于LED运行散热要求，目前LED灯泡的灯体通常较普通灯泡长，尚无法做到与现有普通灯泡相同。这种灯体较长的LED灯泡不仅使用范围受到限制，在现有灯具上安装时，裸露于灯罩外的灯泡光照直晃人眼，会给人造成不适感，且旋置在灯座上的LED灯泡的驱动器暴露在外，显得既不协调，又不美观。
发明内容
为克服现有技术的不足及存在的问题，本发明提供一种结构合理，发光效率高，散热均匀，散热效率高，使用寿命长的贴片式 LED 灯泡 。
本发明是通过以下技术方案实现的： 一种贴片式LED灯泡，包括灯头、灯罩、连接灯头与灯罩的灯杯，所述灯头内设有控制电路组件，灯罩内设置LED贴片，该LED贴片与控制电路组件电连接，所述灯罩内安装有一筒状基座，该基座上固定有一贴片座，所述LED贴片粘贴于贴片座的侧面及端面上；所述贴片座6采用实心结构或内设散热片以形成中心导出式散热结构。
所述贴片座为圆柱体、多边柱体、台体或者前述两种或三种的组合。
所述基座上安装有一基板，该贴片座固定在该基板上。所述基座内可设有散热器。所述基座、基板和贴片座为铝质材料或者铜质材料或者陶瓷材料。
所述灯罩采用玻璃或塑料材料，呈橄榄型、球状或者柱状等。
本发明与现有技术比较，外形美观，结构紧凑合理，制造成本不高，采用中心导出式散热结构，而非传统的对流式和直接接触式，可及时将LED产生的热量散去，使得LED灯泡均匀散热，提高了灯具的散热性能，有效延长了LED灯泡的使用寿命和提高可靠性。此外，由于LED贴片采用多角度的粘贴方式，使LED灯泡实现近球状发光，使该LED灯的光照更为均匀，光照效果更理想。
附图说明
图1是 本发明实施例1的剖面结构示意图 ；
图2是 本发明实施例2的剖面结构示意图 ；
图3是 本发明实施例3的剖面结构示意图 。
图中 ：1-灯头，2-灯罩，3-灯杯，4-LED贴片， 5-基座，6-贴片座，7-基板。
具体实施方式
为了便于本领域技术人员的理解，以下结合附图和具体实施例对本发明作进一步详细描述。应当指出，此处所描述的具体实施例仅仅用于解释本发明，并不用于限定本发明。
实施例1 如附图1所示，一种贴片式LED灯泡，包括灯头1、灯罩2、连接灯头1与灯罩2的灯杯3，所述灯头1内设有控制电路组件，灯罩2内设置LED贴片4，该LED贴片4与控制电路组件电连接，所述灯罩2内安装有一筒状基座5，该基座5上固定有一贴片座6，所述LED贴片4粘贴于贴片座6的侧面及端面上。该LED贴片4的数量为若干个，是本发明的主要发光元件，具有发光效率高的特点。所述控制电路组件包括至少一块电路板。
所述基座5上安装有一基板7。该筒状基座5两端开口，且其内侧设有基板7的安装位用于固定于基板7。所述贴片座6固定在该基板7上，该贴片座6粘贴有LED贴片4的部分伸出基座5外。
所述基座5、基板7采用散热效果良好的铝质材料或者铜质材料或者陶瓷等其他高导热材料制造，从而可增强LED贴片4的散热效果。所述基座5、基板7可采用相同金属材料或不同金属材料。
所述贴片座6采用实心结构或内设散热片，形成中心导出式散热结构。所述贴片座6为圆柱体、多边柱体、台体或者前述两种或三种的组合。在本实施例中，贴片座6为圆柱与圆台的组合，采用喇叭形设计，粘贴LED贴片4的一端呈圆柱形，若干个LED贴片4均匀粘贴于贴片座6的端面及该端的侧面上。由于LED贴片采用多角度的粘贴方式，使LED灯泡实现了将近360度发光，即近球状发光，使该LED灯的光照更为均匀，光照效果更理想。
该LED灯采用中心导出式散热结构，而非传统的对流式和直接接触式。所述贴片座6采用散热效果良好的铝质材料或者铜质材料或者陶瓷等其他高导热材料制造，LED贴片4产生的热量通过该贴片座6传导至基板７进行散热。该贴片座6喇叭形的渐变设计更有利于LED贴片4的散热，使热量更高效地散发和传导。
所述灯罩2采用玻璃或塑料材料，橄榄型、球状或者柱状等，尤其是橄榄型的灯罩，可使灯泡整体呈现蜡烛型，十分具有美感。在本实施例中，灯罩2采用橄榄型的造型设计。
实施例2 如附图2所示，在本实施例中，灯罩2采用球形的造型设计。所述贴片座6呈圆台体状。所述贴片座6固定在该基板7上，该贴片座6粘贴有LED贴片4的部分伸出基座5外。所述基座5内，基板7的另一侧设有散热器，LED贴片4工作时产生的热量可通过基板7传输到散热器。
实施例3 如附图3所示，在本实施例中，灯罩2采用橄榄型的设计。所述贴片座6为棱台、多边形柱和圆柱的依次组合，粘贴LED贴片4的一端呈棱台形，于端面及各个侧面上粘贴LED贴片4。
所述灯头1用于实现与外部电源的电连接，可以是带有外螺纹的通用灯头，也可以是外壁带有卡扣的通用灯头，使得本发明的应用范围更广。
上述实施例中提到的内容并非是对本发明的限定，在不脱离本发明的发明构思的前提下，任何显而易见的替换均在本发明的保护范围之内。

Claims (1)

1 、一种贴片式LED灯泡，包括灯头（1）、灯罩（2）、连接灯头（1）与灯罩（2）的灯杯（3），所述灯头（1）内设有控制电路组件，灯罩（2）内设置LED贴片（4），该LED贴片（4）与控制电路组件电连接，其特征在于：所述灯罩（2）内安装有一筒状基座（5），该基座（5）上固定有一贴片座（6），所述LED贴片（4）粘贴于贴片座（6）的侧面及端面上；该贴片座（6）采用实心结构或内设散热片，形成中心导出式散热结构。
2 、根据权利要求1所述的贴片式LED灯泡，其特征在于：所述贴片座（6）为圆柱体、多边柱体、台体或者前述两种或三种的组合。
3 、根据权利要求2所述的贴片式LED灯泡，其特征在于：所述基座（5）上安装有一基板（7），该贴片座（6）固定在该基板（7）上。
4 、根据权利要求3所述的贴片式LED灯泡，其特征在于：所述基座（5）内设有散热器。
5 、根据权利要求1至4中任一项所述的贴片式LED灯泡，其特征在于：所述基座（5）、基板（7）和贴片座（6）采用铝质材料或者铜质材料或者陶瓷材料。
6 、根据权利要求1至4中任一项所述的贴片式LED灯泡，其特征在于：所述灯罩（2）呈橄榄型、球状或者柱状。
7 、根据权利要求1至4中任一项所述的贴片式LED灯泡，其特征在于：所述灯罩（2）采用玻璃或塑料材料。
PCT/CN2012/072095 2011-08-02 2012-03-08 一种贴片式led灯泡 WO2013016953A1 (zh)

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CN202140877U (zh) * 2011-08-02 2012-02-08 惠州市东扬科技有限公司 一种贴片式led灯泡
CN103032739A (zh) * 2012-12-26 2013-04-10 惠州市东扬科技有限公司 多面发光的贴片式led灯

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CN201885028U (zh) * 2010-12-11 2011-06-29 山东开元电子有限公司 全方位led球泡灯
CN102135254A (zh) * 2011-04-27 2011-07-27 诠兴开发科技股份有限公司 具有较大照明角度的发光二极管灯具构造
CN202140877U (zh) * 2011-08-02 2012-02-08 惠州市东扬科技有限公司 一种贴片式led灯泡

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