WO2011155035A1 - Dispositif de transfert - Google Patents

Dispositif de transfert Download PDF

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Publication number
WO2011155035A1
WO2011155035A1 PCT/JP2010/059782 JP2010059782W WO2011155035A1 WO 2011155035 A1 WO2011155035 A1 WO 2011155035A1 JP 2010059782 W JP2010059782 W JP 2010059782W WO 2011155035 A1 WO2011155035 A1 WO 2011155035A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
stage
clamp
transfer
region
Prior art date
Application number
PCT/JP2010/059782
Other languages
English (en)
Japanese (ja)
Inventor
哲也 今井
良明 小島
孝幸 糟谷
Original Assignee
パイオニア株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2010/059782 priority Critical patent/WO2011155035A1/fr
Publication of WO2011155035A1 publication Critical patent/WO2011155035A1/fr

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855—Coating only part of a support with a magnetic layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/305—Mounting of moulds or mould support plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/263—Preparing and using a stamper, e.g. pressing or injection molding substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003—Discharging moulded articles from the mould

Definitions

  • FIG. 1 It is a schematic diagram which shows the basic structural example of the imprint apparatus of embodiment. It is a schematic diagram which shows the aspect of the holding
  • the second stage is a member for sandwiching and pressing the mold and the transfer object between the first stage.
  • the second stage has, for example, a flat surface facing the mold placement surface on the first stage, and the transfer is realized by pressing the transfer target in the mold direction with the flat surface.
  • the transfer device further includes a member that holds the transfer object between the first stage and the second stage.
  • a first clamp is disposed outside the region connecting the plurality of shafts provided between the first stage and the second stage and the center of the pressing surface of the mold pressed by the first stage and the second stage.
  • a first clamp is disposed outside the region connecting the plurality of shafts provided between the first stage and the second stage and the center of the pressing surface of the mold pressed by the first stage and the second stage.
  • the first clamp provided on the first stage has a center of the pressing surface when pressing the mold on the first stage and a region where each of the plurality of shafts on the first stage is provided.
  • the first clamp is not disposed in a region connecting each shaft and the center of the pressing surface of the mold.
  • the pressing surface center region is a region having the same diameter as the shaft, and the predetermined region is the pressing surface center region and each of the plurality of shafts. This is the area connecting
  • the first clamp it is possible to suitably determine a region where stress is concentrated in the first stage and the second stage pressed along the plurality of shafts. Therefore, by disposing the first clamp while avoiding the region, it is possible to suitably prevent the first clamp from pressing a portion where stress is concentrated on the mold, and it is possible to prevent damage to the mold. .
  • At least one of the first stage and the second stage moves along the shaft.
  • the first clamp can suitably prevent bubbles from entering the contact surface by elastically deforming the mold when the mold and the transfer target are brought into contact with each other during transfer. Further, when releasing the mold from the state where the mold and the transfer target are in close contact with each other, the mold is elastically deformed to create a void in the close contact surface, thereby facilitating the release.
  • the first surface and the second surface of the transfer object are provided on opposite surfaces, and are held on the first stage and the second stage.
  • the transferred object is sandwiched between the second mold and pressed from both sides, whereby the pattern is simultaneously transferred onto both the first surface and the second surface.
  • the first clamp provided on the first stage is the first pressure surface that is the center of the pressure surface when pressing the mold on the first stage. It is provided outside the first region connecting the central region and the region where each of the plurality of shafts on the first stage is provided.
  • the second clamp provided on the second stage includes a second pressurizing surface center region that is the center of the pressurizing surface when pressing the mold on the second stage, and a plurality of shafts on the second stage. It is provided outside the second region connecting the provided region.
  • the first embodiment according to the transfer apparatus of the present invention includes the first stage, the second stage, the plurality of shafts, and the first clamp.
  • the second embodiment according to the transfer apparatus of the present invention includes a first stage, a second stage, a plurality of shafts, a first clamp, and a second clamp.
  • the third embodiment according to the transfer apparatus of the present invention includes a first stage, a second stage, a first clamp, and a plurality of shafts. Therefore, it is possible to suppress the local concentration of stress inside the mold during transfer, and to suitably prevent the mold from being damaged.
  • the lower UV irradiation unit 130a is electrically connected to the control unit 102 via a signal line (not shown), and the lower transfer layer 301a of the substrate 300 is applied in accordance with a control signal supplied from the control unit 102.
  • the lower transfer layer 301a of the substrate 300 is irradiated with UV light to be cured through the lower opening 151a and the UV light transmission region of the lower mounting table 150a described later.
  • the lower UV irradiation unit 130a may be configured to be retracted except when necessary, such as when UV light is irradiated in the transfer operation.
  • FIG. 2C is a schematic view of the lower mold clamp 153a in a state where the lower mold 200a is being pressed as viewed from the vertically upward direction, and further illustrates the arrangement position of the upper mold clamp 153b described later. It is a figure.
  • the lower mold clamp 153a is composed of a plurality of arc-shaped members arranged concentrically with the lower mold 200a in accordance with the disk shape in order to press the lower mold 200a.
  • the upper mold clamp 153b is also composed of a plurality of arc-shaped members arranged on the same circle. Further, as shown in FIG. 2C, the lower mold clamp 153a and the upper mold clamp 153b are configured such that respective arc-shaped fan-shaped members are mutually inserted and are parallel to the lower mold holding surface Sa. Even when projecting onto a surface, they are arranged so as not to overlap each other.
  • the upper mold holding part 152b includes a suction part 154b having a suction groove 155b for holding the upper mold 200b by vacuum suction or the like, and an elastic member 156b that supports the suction part 154b.
  • Each of the suction portion 154b, the suction groove 155b, and the elastic member 156b has the same configuration as the suction portion 154a, the suction groove 155a, and the elastic member 156a of the upper mechanism portion A.
  • the actuator 104 is a mechanism such as a motor that can move the upper mounting table 150b toward or away from the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. Specifically, the actuator 104 rotates the ball screw 101 in accordance with a control signal supplied from the control unit 102, whereby the upper base 110b engaged with the ball screw 101 is changed to the upper mounting base 150b and the lower mounting base. It moves in the vertical direction while maintaining the parallel positional relationship with 150a. At this time, for example, four ball screws 101 are provided so as to connect the four corners of the lower base 110a and the upper base 110b, and a plurality of actuators 104 are also provided to rotate the corresponding ball screws 101. Yes.
  • the actuator 104 is connected to each of the pole screws 101 arranged at the four corners of the lower base 110a, and the pole screws are rotated based on a control signal from the control unit 102.
  • the upper base 110b and the upper mechanism B are also configured in the same manner as the lower base 110a and the lower mechanism A, and are vertically upward from the lower base 110a at the four corners of the square upper base 110b.
  • Four pole screws 101 extending in the direction are screwed together.
  • the lower mold clamp 153a includes the center position of the ball screw 101h-i on the lower mold holding surface Sa2 (that is, a predetermined position on the lower mounting table 150a), the ball screw It is not arranged on the line (dotted line portion) connecting the respective centers of 101h-i.
  • the upper mold clamp 153b is not on a line connecting the center position of the ball screw 101h-i on the upper mold holding surface Sb (that is, a predetermined position on the upper mounting table 150b) and the center of each ball screw 101h-i. Not placed.
  • FIG. 7 is a flowchart showing a series of transfer operations by the imprint apparatus 1.
  • FIG. 8 to FIG. 9 are schematic views showing the operation of each part of the imprint apparatus 1 in each process during the transfer operation.
  • control unit 102 transmits a control signal to the lower mold clamp 153a, and gradually increases the force pressing the lower mold 200a from the holding force to the deforming force, thereby deforming the lower mold 200a.
  • control unit 102 changes the pressing force of the upper mold clamp 153b and the lower mold clamp 153a to the holding force for holding the mold, and releases the deformation of the lower mold 200a and the upper mold 200b. (Step S113, FIG. 9 [State 16]).
  • the pattern formed on the surface of the lower mold 200a is transferred to the lower transfer surface 301a of the substrate 300. Then, the pattern formed on the surface of the upper mold 200b is transferred to the upper transfer surface 301b.
  • the center positions of the lower mold 200a and the upper mold 200b, and the center positions (that is, predetermined positions on the lower mounting table 150a and predetermined positions on the upper mounting table 150b) and the respective axial centers of the ball screws 101 A stronger pressing force acts on the line connecting the two than the other parts.
  • the lower base 110a is pressed against the upper base 110b by a stronger pressing force than other parts in the region indicated by the alternate long and short dash line and the shaded portion. Is done.
  • two pressing forces acting in opposite directions act on the mold, and stress concentrates on the portion pressed by the mold clamp.
  • the stress may be further concentrated so as to cancel the deformation by pressing the lower base 110a and the upper base 110b.
  • the imprint apparatus 1 shown in FIG. 11 is configured with a lower mold 200a with respect to a lower transfer layer 301a configured on the lower surface of a substrate 300 ′ that is a transfer target (in other words, arranged facing downward).
  • 2 is a transfer device for transferring a pattern formed on the substrate.
  • this modification and FIG. 11 about the structure similar to the imprint apparatus 1 shown by FIG. 1, the same number is attached
  • the imprint apparatus 1 includes a lower mechanism part A including a lower base 110a, an upper mechanism part B ′ including an upper base 110b, a lower base 110a and an upper base 110b.
  • a ball screw 101 to be connected an actuator 104 for rotating the ball screw, a control unit 102 for controlling the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation capable of inputting a user instruction to the control unit 102 Unit 103.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

L'invention porte sur un dispositif de transfert (1), lequel transfère un motif formé sur un moule (200) à un objet auquel le motif doit être transféré (300). Le dispositif de transfert comprend un premier étage (150a), un deuxième étage (150b), une pluralité d'arbres (101a à 101d) disposés entre le premier étage et le deuxième étage, et des premières pinces (153a) disposées sur le premier étage et qui serrent le moule. Les premières pinces sont positionnées à l'extérieur d'une région prédéterminée qui relie une région centrale d'une surface de mise sous pression, laquelle est la région centrale d'une surface de mise sous pression du moule pendant le transfert, aux arbres. Cette configuration permet à la contrainte de se concentrer localement à l'intérieur du moule pendant le transfert du motif, ce qui évite avantageusement les détériorations du moule.
PCT/JP2010/059782 2010-06-09 2010-06-09 Dispositif de transfert WO2011155035A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/059782 WO2011155035A1 (fr) 2010-06-09 2010-06-09 Dispositif de transfert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2010/059782 WO2011155035A1 (fr) 2010-06-09 2010-06-09 Dispositif de transfert

Publications (1)

Publication Number Publication Date
WO2011155035A1 true WO2011155035A1 (fr) 2011-12-15

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ID=45097666

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/059782 WO2011155035A1 (fr) 2010-06-09 2010-06-09 Dispositif de transfert

Country Status (1)

Country Link
WO (1) WO2011155035A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016048762A (ja) * 2014-08-28 2016-04-07 株式会社東芝 パターンデータ作成方法、テンプレートおよび半導体装置の製造方法
EP3456505A4 (fr) * 2016-05-10 2019-05-01 FUJIFILM Corporation Procédé de fabrication d'un moule présentant un motif en creux et procédé de production d'une feuille à motifs
CN110480885A (zh) * 2019-08-27 2019-11-22 安吉天威钢塑制品有限公司 一种椅子生产用工装模具及其使用方法
EP3778169A4 (fr) * 2018-03-27 2021-06-02 FUJIFILM Corporation Procédé de fabrication d'un moule ayant un profil de socle concave et procédé de fabrication d'une feuille à motif

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124654U (ja) * 1983-02-08 1984-08-22 宇部興産株式会社 金型等のクランプ装置
JP2008230027A (ja) * 2007-03-20 2008-10-02 Hitachi High-Technologies Corp 微細構造転写装置および微細構造体の製造方法
WO2010061462A1 (fr) * 2008-11-27 2010-06-03 パイオニア株式会社 Appareil de transfert et procédé de transfert
WO2010061459A1 (fr) * 2008-11-27 2010-06-03 パイオニア株式会社 Procédé de transfert et appareil de transfert

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59124654U (ja) * 1983-02-08 1984-08-22 宇部興産株式会社 金型等のクランプ装置
JP2008230027A (ja) * 2007-03-20 2008-10-02 Hitachi High-Technologies Corp 微細構造転写装置および微細構造体の製造方法
WO2010061462A1 (fr) * 2008-11-27 2010-06-03 パイオニア株式会社 Appareil de transfert et procédé de transfert
WO2010061459A1 (fr) * 2008-11-27 2010-06-03 パイオニア株式会社 Procédé de transfert et appareil de transfert

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016048762A (ja) * 2014-08-28 2016-04-07 株式会社東芝 パターンデータ作成方法、テンプレートおよび半導体装置の製造方法
US9971342B2 (en) 2014-08-28 2018-05-15 Toshiba Memory Corporation Pattern data creating method, template, and semiconductor device manufacturing method
EP3456505A4 (fr) * 2016-05-10 2019-05-01 FUJIFILM Corporation Procédé de fabrication d'un moule présentant un motif en creux et procédé de production d'une feuille à motifs
US11141887B2 (en) 2016-05-10 2021-10-12 Fujifilm Corporation Production method of mold having recessed pattern, and manufacturing method of pattern sheet
EP3778169A4 (fr) * 2018-03-27 2021-06-02 FUJIFILM Corporation Procédé de fabrication d'un moule ayant un profil de socle concave et procédé de fabrication d'une feuille à motif
CN110480885A (zh) * 2019-08-27 2019-11-22 安吉天威钢塑制品有限公司 一种椅子生产用工装模具及其使用方法

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