WO2011141995A1 - Dispositif et procédé de transfert, et programme informatique - Google Patents

Dispositif et procédé de transfert, et programme informatique Download PDF

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Publication number
WO2011141995A1
WO2011141995A1 PCT/JP2010/057952 JP2010057952W WO2011141995A1 WO 2011141995 A1 WO2011141995 A1 WO 2011141995A1 JP 2010057952 W JP2010057952 W JP 2010057952W WO 2011141995 A1 WO2011141995 A1 WO 2011141995A1
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WO
WIPO (PCT)
Prior art keywords
mold
holding
transfer
pressing
deformation
Prior art date
Application number
PCT/JP2010/057952
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English (en)
Japanese (ja)
Inventor
哲也 今井
良明 小島
孝幸 糟谷
Original Assignee
パイオニア株式会社
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Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2010/057952 priority Critical patent/WO2011141995A1/fr
Publication of WO2011141995A1 publication Critical patent/WO2011141995A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/305—Mounting of moulds or mould support plates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424—Moulding surfaces provided with means for marking or patterning

Definitions

  • the present invention relates to a transfer apparatus and method for transferring a concavo-convex pattern to a transfer target by pressing a mold on which the concavo-convex pattern is formed to the transfer target, and a technical field of a computer program.
  • the holding member that holds the mold and the holding member that holds the transferred object are moved so as to approach each other, thereby closely contacting and pressing the mold and the transferred object. Then, by separating the closely attached mold and transferred object (so-called mold release operation), a pattern formed on the mold surface is transferred to the transferred object surface. At this time, the mold and the transfer target are close to each other in parallel and closely contacted in parallel, and are released in parallel. For this reason, as the area of the mold increases, entrainment of bubbles between the mold and the transfer target increases, resulting in a technical problem that the accuracy of the transferred pattern deteriorates.
  • Patent Document 1 discloses an apparatus configuration in which a mold is bent and deformed by fixing the mold to a holding member having a slope formed in advance. Discloses an apparatus configuration including means for bending a mold using air pressure. As an apparatus for separating the closely attached mold and transferred object, Patent Document 3 discloses a configuration of a peeling apparatus that bends the mold by applying a negative pressure in the chamber.
  • the present invention has been made in view of the above-described technical problems.
  • a mold, a transferred object, or a mold can be obtained by more suitably performing deformation of the mold. It is an object of the present invention to provide a transfer apparatus and method, and a computer program that can appropriately suppress the pattern formed on the pattern and the pattern transferred to the transfer target from being damaged, and that can accurately transfer the pattern. To do.
  • a first transfer device of the present invention is a transfer device that transfers a pattern formed on a mold to a transfer target, a mold holding means for holding the mold, and the transfer target.
  • a second transfer apparatus of the present invention transfers a pattern formed on a first mold to a first surface of a transfer target, and the pattern formed on a second mold.
  • a transfer device for transferring to a second surface of the transfer object wherein the first mold holding means for holding the first mold, the second mold holding means for holding the second mold, and the transfer target
  • the first mold and the transfer object are mutually
  • the first deformation means for moving the first mold holding means to deform the first mold at the time of contact immediately before being pressed and at the time of releasing after pressing, the second mold,
  • a second deforming means for deforming the second mold by moving the second mold holding means at at least one of the time immediately before the transfer body is pressed against each other and at the time of releasing after pressing. .
  • a third transfer device of the present invention is a transfer device that operates in response to an instruction from a control device and transfers a pattern formed on a mold to a transfer target.
  • a mold holding means for holding the mold In accordance with an instruction from the control device, a mold holding means for holding the mold, a transferred object holding means for holding the transferred object in accordance with an instruction from the control device, and an instruction from the control device
  • the mold holding means is moved to deform the mold at least one of contact immediately before the mold and the transfer object are pressed against each other and release after pressing.
  • the And a deformation means that.
  • a first transfer method of the present invention is a transfer method in a transfer apparatus that transfers a pattern formed on a mold to a transfer target, a mold holding step for holding the mold, A transferred object holding process for holding the transferred object; a pressing process for bringing the mold and the transferred object into contact with each other and pressing each other; a mold releasing process for releasing the mold and the transferred object that are in close contact with each other; In at least one of the pressing step and the mold releasing step, a deformation step of deforming the mold by moving a member holding the mold is provided.
  • a second transfer method of the present invention transfers a pattern formed on a first mold to a first surface of a transfer target, and the pattern formed on a second mold.
  • a transfer method in a transfer device for transferring to a second surface of the transfer object a first mold holding step for holding the first mold, a second mold holding step for holding the second mold, A transferred object holding step for holding the transferred object, a first pressing step for contacting and pressing the first mold and the transferred object, and a contact between the second mold and the transferred object.
  • a step, the first pressing step and the first In at least one of the mold process, in at least one of the first deformation process of deforming the first mold by moving a member holding the first mold, the second pressing process, and the second mold release process, A second deformation step of deforming the second mold by moving a member holding the second mold.
  • a computer program of the present invention is a computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer target, and a mold holding step for holding the mold; A transferred object holding process for holding the transferred object, a pressing process for bringing the mold and the transferred object into contact with each other, and pressing the mold and the transferred object, and releasing the mold.
  • the transfer device is caused to execute a deformation step of moving the member holding the mold to deform the mold.
  • FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation.
  • FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. It is a graph which illustrates the time change of the pressing force of a mold clamp controlled by a control part.
  • Embodiment which concerns on the transfer apparatus of this invention is a transfer apparatus which transfers the pattern formed in the mold to a to-be-transferred body, Comprising: The mold holding means by which the said mold is hold
  • the mold held by the mold holding unit is pressed against the transfer target held by the transfer target holding unit, so that the unevenness formed on the mold, etc.
  • the pattern is transferred to the transfer target.
  • the mold holding means is provided with a suction mechanism including a mold, for example, a vacuum pump described in detail later.
  • the transferred object holding means is a member configured to hold and fix the transferred object so as not to hinder the close contact with the mold.
  • the transferred object holding means may be configured to hold the transferred object by holding the transferred object from two opposite directions.
  • the pressing means moves one or both of the mold and the transferred body that are held as described above to move the surface on which the pattern of the mold is formed (hereinafter referred to as a pattern surface) and the transferred body.
  • the surface to which the pattern is transferred (hereinafter referred to as a transfer surface) is in close contact with each other and can be pressed against each other.
  • the pressing unit is, for example, an actuator that realizes the above-described pressing by moving the mold holding unit or the transfer target holding unit. Further, the configuration and operation of the pressing means may be the same as the pressing means provided in a known transfer device.
  • the mold release means is configured to release the mold in close contact and the transfer target.
  • the release means fixes one of the mold holding means and the transfer target holding means and applies a force (hereinafter referred to as a release force) in a direction to separate the other, thereby releasing the mold. Realize the mold.
  • the deformation means is configured to move the mold holding means and perform an operation that causes deformation of the mold.
  • the “deformation of the mold” typically means that at least a part of the pattern surface of the mold held relative to the transfer surface of the transfer object has a predetermined angle with respect to the transfer surface. And showing a tilted deformation. More generally, a part of the pattern surface of the mold faces the transfer surface of the transfer object, and at the same time, the other part does not face the transfer surface of the transfer object.
  • the cross-sectional shape or three-dimensional appearance shape that intersects the pattern surface typically changes somewhat compared to the pattern surface of the mold before deformation, which is typically parallel to the transfer surface in the entire region. means.
  • Such “deformation of the mold” is reversible and can be released by the deformation means returning the position of the mold holding means to the position before the deformation of the mold as will be described later.
  • the deformation may be a plastic or elastic deformation that occurs in the mold.
  • the deformation means of the present embodiment is, for example, a mechanism that changes the position of the mold holding means in a direction perpendicular to the surface to be bent so that the mold is placed on a flat surface. It may be.
  • the deformation means performs the above-described deformation of the mold at least one of when the mold and the transfer target are in contact immediately before being pressed against each other and at the time of releasing after pressing. In other words, in a state where the mold is deformed by the operation of the deforming means, at least one of the operation of bringing the mold and the transferred body into contact with the pressing means and the operation of releasing the mold and the transferred body by the releasing means. Is implemented.
  • the mold is deformed by the above-described operation of the deforming means when the mold and the transferred object are in contact with each other, the pattern surface of the mold that is inclined due to the deformation is close to the transferred surface of the transferred object. It will contact sequentially from the side.
  • the deforming means moves the mold holding means so that the outer peripheral portion of the mold is pressed or pulled in the direction opposite to the transfer target, the mold has a relative outer periphery of the pattern surface with respect to the transfer target. And the center part is deformed so as to be relatively close to the transfer target.
  • the pressing means contacts the mold and the transfer object in this state, the mold first comes into contact with the transfer surface of the transfer object at the center of the pattern surface, and then the contact sequentially proceeds toward the outer periphery.
  • the deforming means it is possible to suitably suppress the vacancy generated on the close contact surface as the contact between the mold and the transfer target proceeds, and appropriately leaving the vacancy on the close contact surface after the close contact. .
  • the holes mixed in the contact portion are pushed out to the outer peripheral portion as the contact proceeds, and the adhesion surface Removed from.
  • the pattern of the holes cannot be accurately transferred, which may lead to a decrease in yield.
  • the alignment of the mold and the transfer object performed after the transfer object is installed can be performed with high accuracy in a short time. These are useful in the operation of a nanoimprint transfer apparatus that is expected to process a large amount of transfer target material by continuous transfer.
  • the mold release means releases the mold and the transferred object while the deformation means deforms the mold and simultaneously moves the mold holding means.
  • the deformation causes an inclination of the pattern surface of the mold with respect to the transfer surface.
  • a part of the pattern surface that is relatively separated from the transfer surface of the transfer target due to the inclination is peeled off from the transfer surface and released.
  • the mold deformed as described above is released from the transfer surface of the transfer object in a part of the outer peripheral portion of the pattern surface, and there is a gap on the contact surface. Arise.
  • the close contact force acts on the close contact surface so as to maintain the close contact state.
  • the mold release means it is necessary for the mold release means to perform pressing and traction for mold release with a force larger than the adhesion force applied to the adhesion surface between the mold and the transfer object. It is known that such an adhesive force varies depending on the precision of the pattern transferred between the mold and the transfer target and the degree of deterioration of the release agent formed on the pattern surface of the mold.
  • the contact surface when there is a gap on the contact surface, the contact surface does not act on the portion corresponding to the gap, so the contact force is relatively weak in the vicinity of the gap, and the mold can be easily released. Yes.
  • the gap generated by the deformation of the mold as a release start point that triggers the release, it is possible to realize the release between the mold and the transfer target with a relatively weak force.
  • the mold is deformed so as to form a gap in the outer periphery of the pattern surface of the mold as described above, the end of the contact surface between the pattern surface and the transfer surface of the transfer object is released from the mold at the outer periphery of the mold. Since the gap is formed by the mold release, the mold can be deformed with a relatively weak force.
  • the mold since the mold is deformed by the operation of the mold holding means, it is possible to apply a desired amount of deformation to the mold at a desired timing. For this reason, unlike the conventional configuration in which the amount of deformation is determined according to the adhesive force on the adhesive surface between the mold and the transfer target, for example, the deterioration of the release agent formed on the pattern surface of the mold by continuous transfer. Accordingly, the technical problem that the adhesive force on the adhesive surface changes and as a result the amount of deformation of the mold changes can be solved preferably. For this reason, stable deformation of the mold can be realized.
  • the deforming means is configured to hold the mold and the transfer target body against the mold holding means for holding while the mold and the transfer target are pressed against each other. The mold is not deformed while the mold is attached and while the mold held by the mold holding means is removed.
  • the mold when the mold is attached to the mold holding means, it may be required to adjust the mold alignment with respect to the mold holding means.
  • By performing the alignment adjustment it is possible to align the pattern surface of the held mold at a desired position by moving the mold holding means thereafter. At this time, when the mold is deformed, it is not possible to appropriately adjust the alignment between the mold holding means and the pattern on the mold. Therefore, it is preferable that the mold is attached without being deformed.
  • the mold holding means is also required to maintain a shape corresponding to the deformation of the mold at least during the attaching or removing operation. .
  • the shape of a mold holding means will be restrict
  • the deformation of the mold is performed for the purpose of eliminating voids generated on the contact surface with the transfer target and creating a mold release starting point that triggers mold release.
  • the amount of deformation of the mold for achieving the above may be affected by the material of the mold and transfer conditions. For this reason, the amount of deformation of the mold is not necessarily constant.
  • the shape of the mold holding means when the shape of the mold holding means is determined in accordance with the deformation of one mold, the desired deformation cannot be realized with respect to another mold. In some cases, it may not be possible to hold. Specifically, when the shape of the mold holding means is determined according to the deformation of the mold, conditions such as the material and thickness of the mold that can be held are determined. It will be limited. In the transfer using a mold, various different molds may be used. Therefore, it is not preferable in terms of use of the apparatus to limit the conditions of a usable mold.
  • the mold is not deformed when being attached to and removed from the mold holding means, and the mold is deformed according to the conditions of the mold by the subsequent operation of the mold holding means.
  • the transfer operation can be realized using various molds without limiting the conditions.
  • the transfer device further includes a mounting unit on which the mold is mounted, and the deformation unit is provided on a surface of the mounting unit on which the mold is mounted. The mold is deformed by pressing the mold in a perpendicular direction.
  • the mold is held by the mold holding means while being placed on the mold placing means. At this time, the mold is typically in contact with and supported by the mold mounting means on the surface opposite to the pattern surface. “Placing” in this aspect does not necessarily indicate a state in which the mold is disposed vertically above the mold mounting means, but includes a state in which the mold is supported by contacting each other as described above. It is a comprehensive concept.
  • the mold holding means of this aspect is, for example, provided on the mounting means, and is configured to realize holding by some means with respect to the mold.
  • Such mold holding means is configured to be movable by pressing the mold by the deformation means.
  • the mold holding means has a mechanism that can move in a direction perpendicular to the mounting surface on which the mold of the mounting means formed on the mounting means is placed, and the mold is moved along with the movement. Is configured to be deformable.
  • the mold holding means holds the mold on the same surface as the surface of the mounting means on which the mold is mounted, and the deformation means includes the mold of the mounting means.
  • the mold may be deformed by moving the mold holding means so as to form a recess with respect to the surface to be placed.
  • the mold holding means in a state where the deformation of the mold by the deformation means is not performed, the mold holding means forms a surface substantially the same as the mold placement surface, and holds the surface in contact with the mold on the surface.
  • the mold holding means is moved in a direction away from the mold so as to form a recess with respect to the substantially same surface as the mold mounting surface.
  • the mold Due to the action of these two forces, the mold is bent in such a manner that the portion held by the mold holding means is pulled in the direction in which the mold holding means moves.
  • the mold holding means of this aspect may be an aspect that is disposed in a recess formed in advance on the mounting means. According to such an aspect, the above-described configuration can be realized relatively easily by moving the mold holding means within the recess. In particular, in the case where the deforming means has a configuration such as a clamp that presses the mold holding means through the mold as described above, the above-described configuration can be more suitably realized.
  • an elastic member is arranged at the bottom of the recess formed in the mounting means, and the mold holding means is arranged as instructed by the elastic member.
  • the elastic member is deformed such as contraction in accordance with the movement of the mold holding unit by the deforming unit. For this reason, when the mold holding means is moved in the elastic member direction by the deformation means, the mold holding means receives a predetermined elastic force from the elastic member.
  • the spring coefficient that determines the elastic force of the elastic member is determined based on the upper limit of the deformation amount of the mold based on the material of the mold. Preferably, at a position where the predetermined amount of deformation of the mold reaches an upper limit, the force acting on the mold holding means moved by the deformation means is balanced with the elastic force acting on the mold holding means by the elastic member. Is done. Note that the upper limit of the deformation amount of the mold at this time is an allowable amount set with a margin with respect to the deformation amount that causes damage such as damage to the mold.
  • the elastic member serves as a cushion against deformation of the mold. For this reason, the mold does not deform beyond the upper limit of the predetermined deformation amount determined according to the elastic force of the elastic member or the like by the movement of the mold holding means by the deformation means. For this reason, it can avoid suitably that a break etc. arise in a mold.
  • This configuration makes it possible to realize the operation of deforming the mold with a relatively simple configuration, which is beneficial in terms of the device configuration.
  • the deforming means releases the deformation of the mold after the mold and the transfer target body are in contact with each other.
  • the deformation means moves the mold holding means so as to release the deformation of the mold after the pattern surface of the mold comes into contact with the transfer surface of the transfer target. For this reason, at the time of pressing for the transfer between the mold and the transferred object by the subsequent pressing means, the mold is pressed against the transferred object in a flat state with no deformation.
  • the pressing by the pressing means for transferring the mold and the transferred body means that the mold and the transferred body are moved after a part or the whole of the pattern surface of the mold comes into contact with the transferred body by the operation of the pressing means. It is the meaning which shows the state which has exerted pressure mutually in the state pressurized by the press means. Therefore, in this aspect, the mold holding unit releases the deformation of the mold after the mold is brought into contact with the transfer target by the pressing unit, and the transfer by pressurization is performed after the deformation is released.
  • the deformation means may be configured to release the deformation of the mold, except when the advantage is not obtained by the above-described deformation of the mold. Specifically, after being separated from the transfer medium by a releasing operation by the releasing means, the deforming means may move the mold holding means so as to release the deformation of the mold.
  • the deforming means moves the mold holding means to deform the mold by pressing the mold against the mold holding means. .
  • the deforming means of this aspect applies a pressing force to the mold holding means indirectly by pressing the mold held by the mold holding means in the direction of the mold holding means, thereby causing the movement.
  • the deformation means of this aspect includes, for example, a pressing member such as a clamp mechanism that contacts the mold and can press the mold.
  • the deforming means presses the mold held by the mold holding means in a direction perpendicular to the surface and toward the surface.
  • the deforming means presses the mold with a predetermined pressing force set in advance, and moves the position of the mold holding means by a desired distance by the pressing.
  • the mold bends with a deformation amount corresponding to the pressing force in accordance with the movement of the mold holding means and the pressing by the deformation means. In this way, the deformation means realizes a desired deformation amount of the mold.
  • transformation means mentioned above is a structure which applies a pressing force with respect to a mold, it can be used also for the purpose of strengthening holding
  • the mold holding means holds the mold by suction.
  • the mold holding means of this aspect is, for example, an adsorption member having an adsorption groove connected to a vacuum pump or the like, and the mold is brought into contact with the adsorption part when the inside of the adsorption groove becomes negative pressure by the operation of the vacuum pump Adsorb the back side.
  • an adsorbing portion holding of the mold is realized.
  • holding of the mold relatively easily and enjoy the effects according to the various aspects described above.
  • holding of the mold may be realized by using other members.
  • the mold holding means may be configured to suck the mold at the outer peripheral portion of the surface on which the pattern of the mold is not formed.
  • the mold when the mold is deformed, the position is changed by the deforming means while the mold holding means holds the outer periphery of the mold. According to such deformation, the mold is deformed in such a manner that the position of the outer peripheral portion of the pattern surface with respect to the transfer object changes relative to the central portion.
  • the deformation means is the above-described clamp mechanism, the deformation is performed so that the outer peripheral portion of the mold is relatively separated from the transfer target.
  • the holes generated in the close contact surface move to the outer periphery of the mold as the contact between the mold and the transfer target proceeds, and are suitably excluded from the close contact surface.
  • release is caused by deformation at the outer peripheral portion of the pattern surface which is relatively easy to release, so that easy deformation is possible.
  • the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the transfer object.
  • a transfer device for transferring to a second surface wherein the first mold holding means for holding the first mold, the second mold holding means for holding the second mold, and the transferred body are held.
  • first mold release means for releasing the first mold and the transfer target
  • second mold release means for releasing the second mold and the transfer target
  • the first deformation means for moving the first mold holding means to deform the first mold, and the second mold and the transfer object are mutually connected at least one of when contacting and after releasing.
  • a second deformation means for moving the second mold holding means to deform the second mold at the time of contact immediately before being pressed and at the time of releasing after pressing.
  • the transfer apparatus of the present invention there are two types of molds, such as a first mold holding means for holding the first mold and a second mold holding means for holding the second mold. There is a means for holding each. Of these two molds, the first mold was pressed against the first surface of the transferred body and the second mold was pressed against the second surface of the transferred body, thereby forming each mold. Pattern transfer is performed.
  • the first pressing means operates at least one of the first mold holding means and the transferred object holding means to bring the first mold and the first surface of the transferred object into close contact and press each other.
  • the second pressing means operates at least one of the second mold holding means and the transferred object holding means to bring the second mold and the second surface of the transferred object into close contact and press each other.
  • Each pressing may be performed in succession or may be performed simultaneously.
  • the first pressing means and the second pressing means are configured to transfer the transferred body between the first mold and the second mold. Transfer may be performed by sandwiching and pressing from both sides simultaneously.
  • the first mold release unit operates at least one of the first mold holding unit and the transfer target holding unit to release the first mold from the transfer target.
  • the second mold release means operates at least one of the second mold holding means and the transferred object holding means to release the second mold from the transferred object.
  • Each mold release is preferably performed in a row, but may be performed at the same time.
  • the first mold release unit releases the first mold from the object to be transferred in a state where the object to be transferred and the second mold are fixed.
  • the first mold holding means is moved in the direction to be moved.
  • the second release means performs the release by moving the holding means for holding the other in the direction to release the mold while one of the transfer object and the second mold is fixed.
  • the first deformation means moves the first mold holding means for deforming the first mold, as in the transfer device of the first embodiment described above. Specifically, the first deforming means is at least when the first mold is contacted with the first mold by the first pressing means, and when the first mold is released from the transferred object by the first mold means. At one timing, the first mold holding means is moved to deform the first mold.
  • the second deformation means also moves the second mold holding means for deforming the second mold.
  • the second deforming means is at least one of when the second pressing means contacts the second mold and the transferred object, and when the second mold releasing means releases the second mold and the transferred object. At this timing, the second mold holding means is moved to deform the second mold.
  • the first deforming unit releases the deformation of the first mold after the first mold and the transfer target are in contact with each other
  • the second deformation means releases the deformation of the second mold after the second mold and the transfer target body are in contact with each other.
  • the mold is not deformed at the time of attachment to and removal from each mold holding means, and the subsequent operation of the mold holding means. It is the structure which deform
  • the third embodiment according to the transfer device of the present invention is a transfer device that operates in response to an instruction from a control device and transfers a pattern formed on a mold to a transfer target.
  • a mold holding means for holding the mold a transferred object holding means for holding the transferred object according to an instruction from the control device, and a mold and the mold according to an instruction from the control device
  • a pressing means for bringing the transferred bodies into contact with each other a mold release means for releasing the mold and the transferred body in close contact with each other according to instructions from the control device, and instructions from the control device
  • a deformation means for deforming the mold by moving the mold holding means at least one of when the mold and the transferred object are in contact immediately before being pressed against each other and at the time of releasing after pressing.
  • Embodiment which concerns on the transfer method of this invention is a transfer method in the transfer apparatus which transcribe
  • the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the transfer object.
  • a transfer method in a transfer device for transferring to a second surface wherein a first mold holding step for holding the first mold, a second mold holding step for holding the second mold, and holding the transfer object A transferred object holding process, a first pressing process for contacting and pressing the first mold and the transferred object, and a second pressing the second mold and the transferred object and pressing each other.
  • the second A second deformation step of deforming the second mold by moving a member holding the mold in at least one of the first deforming step of deforming the first mold by moving the member holding the first mold, the second pressing step, and the second mold releasing step, the second A second deformation step of deforming the second mold by moving a member holding the mold.
  • An embodiment according to the computer program of the present invention is a computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer target, the mold holding step for holding the mold, and the transfer target A transferred body holding step for holding the body, a pressing step for bringing the mold and the transferred body into contact with each other and pressing each other, a releasing step for releasing the mold and the transferred body that are in close contact with each other, and the pressing
  • the transfer device is caused to perform a deformation step of moving the member holding the mold to deform the mold.
  • the computer program is read from a recording medium such as a ROM, a CD-ROM, a DVD-ROM, and a hard disk that stores the computer program, and executed. If the computer program is executed after being downloaded to the computer via the communication means, the transfer apparatus can execute the various operations in the first embodiment according to the transfer method of the present invention described above relatively easily. I can do it.
  • the first embodiment and the third embodiment according to the transfer apparatus of the present invention include the mold holding means, the transferred object holding means, the pressing means, the release means, and the deformation means.
  • a second embodiment of the transfer apparatus of the present invention includes a first mold holding unit, a second mold holding unit, a transfer object holding unit, a first pressing unit, a second pressing unit, and a first separation unit.
  • a mold means, a second mold release means, a first deformation means, and a second deformation means are provided.
  • 1st Embodiment which concerns on the transfer method of this invention is equipped with a mold holding process, a to-be-transferred object holding process, a press process, a mold release process, and a deformation
  • the second embodiment according to the transfer method of the present invention includes a first mold holding step, a second mold holding step, a transferred object holding step, a first pressing step, a second pressing step, and a first separation step.
  • the embodiment according to the computer program of the present invention causes the transfer apparatus to execute a mold holding process, a transfer object holding process, a pressing process, a mold releasing process, and a deformation process.
  • FIG. 1 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 which is an embodiment of a transfer apparatus of the present invention.
  • the imprint apparatus 1 shown in FIG. 1 is a UV-type transfer apparatus that transfers a pattern on a mold to a transfer target having a transfer layer that is cured by UV irradiation. Further, the imprint apparatus 1 uses a lower mold 200a and an upper mold 200b on which a pattern such as a concavo-convex structure to be transferred is formed, and a lower transfer layer 301a and a lower transfer layer 301a formed on the lower surface of the substrate 300 that is a transfer target. In this configuration, transfer is performed on both of the upper transfer layer 301b formed on the upper surface.
  • the imprint apparatus 1 includes a lower mechanism part A including a lower base 110a, an upper mechanism part B including an upper base 110b, and a lower base 110a. And a ball screw 101 that connects the upper base 110b, an actuator 104 that rotates the ball screw, a control unit 102 that controls the operation of the lower mechanism unit A and the upper mechanism unit B, and a user instruction to the control unit 102 An operation unit 103 that can be input is provided.
  • the imprint apparatus 1 shown in FIG. 1 shows a state where the lower mold 200a, the upper mold 200b, and the substrate 300 are installed.
  • the lower mold 200a is held on the lower mounting table 150a of the lower mechanism portion A so that the pattern surface faces upward.
  • the upper mold 200b is held on the upper mounting table 150b of the upper mechanism B so that the pattern surface faces downward.
  • the lower mold 200a and the upper mold 200b have a disk shape having a center hole at the center or a shape similar to a disk, and patterns such as irregularities are formed near the center hole on the pattern surface.
  • a pattern region in which is formed is configured.
  • At least a portion corresponding to the pattern region of each mold is made of a material that transmits UV light, such as quartz glass, and is preferably hardly affected by a change in character due to irradiation with UV light.
  • a material that transmits UV light such as quartz glass
  • the outside of the pattern area on the pattern surface is referred to as a non-pattern area.
  • the pattern surface of the lower mold 200a and the upper mold 200b is subjected to a surface treatment for the purpose of improving mold releasability of the mold and the substrate at the time of mold release described later, for example, a surface treatment with a silane coupling agent or the like, A release layer having a thickness of a single molecule to several molecules is formed.
  • the lower mold 200a is a specific example of the “mold” or “second mold” of the present invention
  • the upper mold 200b is a specific example of the “mold” or “first mold” of the present invention. It is an example.
  • the substrate 300 which is a transfer target has a UV curable lower transfer layer 301a and an upper transfer layer 301b on the upper surface and the lower surface, and the lower mold 200a and the upper mold 200b in the center.
  • a disk-shaped configuration having a center hole with a diameter smaller than that of the center hole is used.
  • the lower mechanism A is provided on the upper surface of the lower base 110a, and includes a lower center pin 120a, a lower UV irradiation unit 130a, a lower center pin driving unit 140a, a lower mounting table 150a, A side mold holding part 152a and a lower mold clamp 153a are provided.
  • the lower base 110a is provided with a lower opening 111a and is connected to a lower mounting table 150a having a center hole at the center. Further, the lower base 110a is provided with a screw hole portion in which a screw groove is cut at a position where the ball screw 101 is screwed.
  • the lower opening 111a is formed at a position corresponding to the center hole of the lower mounting table 150a, and includes a lower center pin 120a and a lower center pin driving unit 140a.
  • the lower opening 111a typically has a lower UV irradiator 130a that can irradiate at least the region of the substrate 300 where the pattern of the lower transfer layer 301a is formed with UV light. It is formed wider than the region where the pattern is formed.
  • the lower mounting table 150a is a circular member having a diameter larger than that of the substrate 300, and includes a lower mold holding part 152a and a lower mold clamp 153a.
  • the lower mounting table 150a has a flat lower mold holding surface Sa for holding the lower mold 200a.
  • the lower mold holding surface Sa is provided with a center hole at the center. .
  • at least a portion corresponding to a region where the pattern of the lower mold 200a to be mounted transmits UV light such as quartz glass and is irradiated with UV light. It is made of a material that is unlikely to cause phenotypic changes, and is configured to be able to irradiate the lower transfer layer 301a with UV light emitted from the lower UV irradiator 130a.
  • the lower mold holding part 152a is a specific example of the "mold holding means” or “second mold holding means” of the present invention in the lower mechanism part A, and holds the lower mold 200a by vacuum suction or the like.
  • a suction portion 154a having a suction groove 155a and an elastic member 156a that supports the suction portion 154a.
  • FIG. 2B shows the lower mounting table 150a upward (more specifically, vertically upward with respect to the lower mold holding surface Sa.
  • the vertical upper direction or simply upward will be described.
  • It is a schematic diagram which shows arrangement
  • the suction portion 154a is a groove formed in a corresponding region of the lower mold holding surface Sa so as to perform suction at the outer peripheral edge portion of the lower mold 200a to be placed. Placed inside.
  • the suction portion 154a is preferably configured with, for example, a flexible resin member so as not to damage the lower mold 200a at the contact portion.
  • the suction groove 155a is configured to be able to suck the lower mold 200a to the suction portion 154a by reducing the atmospheric pressure in the groove by the operation of a decompression mechanism (not shown) such as a connected vacuum pump.
  • the elastic member 156a is disposed in a groove formed in the lower mold holding surface Sa and supports the suction portion 154a.
  • the elastic member 156a is configured to be able to bias an elastic force between the adsorbing portion 154a and the lower mounting table 150a by a member having elasticity such as a resin or a mechanical structure such as a spring.
  • a member having elasticity such as a resin or a mechanical structure such as a spring.
  • the shape of the lower mold holding part 152a and the lower mounting table 150a is a shape suitable for deformation of the lower mold 200a described later, and such a shape will be described in detail later.
  • the lower mold clamp 153a is a specific example constituting the “deformation means” or “second deformation means” of the present invention in the lower mechanism portion A, and is a pressing force based on a control signal supplied from the control unit 102.
  • the lower mold 200a can be pressed vertically downward.
  • a plurality of lower mold clamps 153a are typically arranged on the lower mounting table 150a, and the lower mold 200a can be elastically deformed by pressing a peripheral portion which is a non-pattern region of the lower mold 200a. Configured to be possible.
  • the lower mold clamp 153a is configured to be able to hold and fix the lower mold 200a with the lower mounting table 150a.
  • FIG. 2C is a diagram in which an arrangement position of an upper mold clamp 153b (described later) viewed from the same direction is superimposed on a configuration when the lower mold clamp 153a is viewed from vertically above the lower mold holding surface Sa. It is.
  • the lower mold clamp 153a has a fan-like shape that is arranged concentrically with the lower mold 200a so that the lower mold 200a can be suitably gripped in accordance with the shape of the disk-shaped lower mold 200a. Yes.
  • the upper mold clamp 153b has a sector shape that is concentrically arranged with the upper mold 200b so that the upper mold 200b can be suitably gripped in accordance with the shape of the disk-shaped upper mold 200b.
  • the lower mold clamp 153a and the upper mold clamp 153b have three fan-shaped members arranged so as to be mutually inserted, and they are connected to the lower mold holding surface Sa. Are arranged so as not to overlap each other even when projected onto a plane parallel to the.
  • the lower center pin 120a is a specific example constituting the “transfer object holding means” of the present invention, and is a cylindrical member having a tip portion 121a, a substrate support portion 122a, and a mold support portion 123a having different diameters.
  • the lower end is connected to a lower center pin driving unit 140a, which will be described later, and the upper end passes through the center hole and the lower opening 111a of the lower mounting table 150a and is perpendicular to the lower mold holding surface Sa. It is supported to become.
  • the diameter of the front end portion 121a of the lower center pin 120a is smaller than the diameter of the substrate support portion 122a and larger than the diameter of the center hole of the substrate 300 described later.
  • the diameter of the substrate support part 122a is smaller than the diameter of the mold support part 123a and larger than the diameter of the center hole of the lower mold 200a described later.
  • the diameter of the mold support portion 123a is smaller than the diameter of each of the center hole of the lower mounting table 150a and the lower opening 111a.
  • the lower UV irradiation unit 130a is electrically connected to the control unit 102 via a signal line (not shown), and the lower transfer layer 301a of the substrate 300 is cured in accordance with a control signal supplied from the control unit 102.
  • the UV light to be irradiated is irradiated to the lower transfer layer 301a of the substrate 300 through the lower opening 111a and the center hole of the lower mounting table 150a.
  • the lower UV irradiation unit 130a may be configured to be retracted except when necessary, such as when UV light is irradiated in the transfer operation.
  • the lower center pin drive unit 140a is a specific example that constitutes a part of the “transfer object holding unit” in the lower mechanism unit A of the present embodiment, and corresponds to a control signal supplied from the control unit 102.
  • the lower center pin 120a is moved in the axial direction, that is, in a direction perpendicular to the lower mold holding surface Sa of the lower mounting table 150a.
  • the lower center pin driver 140a moves the lower center pin 120a vertically upward when releasing the lower mold 200a and the substrate 300 after a transfer operation described later, thereby moving the substrate 300 to the lower mold 200a.
  • release means or “second release means” in this embodiment.
  • the upper mechanism B is provided on the lower surface of the upper base 110b, and includes an upper center pin 120b, an upper UV irradiation unit 130b, an upper center pin driving unit 140b, an upper mounting table 150b, an upper mold holding unit 152b, And an upper mold clamp 153b.
  • An upper opening 111b is provided on the upper base 110b, and an upper mounting table 150b having a center hole at the center is connected to the upper base 110b.
  • the upper base 110b is provided with a screw hole portion in which a screw groove is cut at a position where the ball screw 101 is screwed.
  • the upper opening 111b is formed at a position corresponding to the center hole of the upper mounting table 150b, and includes an upper center pin 120b and an upper center pin driving unit 140b.
  • the upper opening 111b typically has a pattern that allows the upper UV irradiator 130b to irradiate at least a region of the substrate 300 where the pattern of the upper transfer layer 301b is formed. It is formed wider than the region to be formed.
  • the upper mounting table 150b is a circular member having a diameter larger than that of the substrate 300, and includes an upper mold holding part 152b and an upper mold clamp 153b.
  • the upper mounting table 150b has a flat upper mold holding surface Sb for holding the upper mold 200b, and the upper mold holding surface Sb is provided with a center hole at the center. Note that at least a portion of the upper mounting table 150b corresponding to a region where the pattern of the upper mold 200b to be mounted is formed transmits UV light such as quartz glass and changes its characteristics by irradiation with UV light.
  • the upper transfer layer 301b can be irradiated with UV light irradiated from the upper UV irradiation unit 130b.
  • the upper mold holding part 152b is a specific example of the “mold holding means” or the “first mold holding means” of the present invention in the upper mechanism part B, and is a suction part for holding the upper mold 200b by vacuum suction or the like. 154b, an adsorption groove 155b, and an elastic member 156b. Unless otherwise specified, the configuration of the upper mold holding portion 152b, the suction portion 154b, the suction groove 155b, and the elastic member 156b are the same as the suction portion 154a of the lower mold holding portion 152a shown in FIG. The configuration is the same as that of the suction groove 155a and the elastic member 156a.
  • the suction portion 154b is disposed in a groove formed in a corresponding region of the upper mold holding surface Sb so as to perform suction at the outer peripheral edge portion of the placed upper mold 200b.
  • the adsorbing part 154b is preferably composed of a flexible resin member or the like so as not to damage the upper mold 200b at the contact part.
  • the suction groove 155b is connected to decompression means such as a vacuum pump (not shown), and is configured to be able to suck and hold the upper mold 200b by lowering the atmospheric pressure in the groove by the operation of the decompression means.
  • the elastic member 156a is disposed in a groove formed in the upper mold holding surface Sb and supports the suction portion 154b.
  • the elastic member 156b is configured to be able to bias an elastic force between the adsorbing portion 154b and the upper mounting table 150b by a member having elasticity such as a resin or a mechanical structure such as a spring.
  • a member having elasticity such as a resin or a mechanical structure such as a spring.
  • the shape of the upper mold holding part 152b and the upper mounting table 150b is a shape suitable for deformation of the upper mold 200b described later, and such a shape will be described in detail later.
  • the upper mold clamp 153b is a specific example that constitutes the “deformation means” or “first deformation means” of the present invention in the upper mechanism B, and the upper mold clamp 153b is moved upward by a pressing force based on a control signal supplied from the control unit 102. It is a member capable of pressing the mold 200b vertically upward.
  • a plurality of upper mold clamps 153b are typically arranged on the upper mounting table 150b, and are configured to be capable of elastically deforming the upper mold 200b by pressing the peripheral portion of the upper mold 200b.
  • the upper mold clamp 153b is configured to be able to hold and fix the upper mold 200b with the upper mounting table 150b.
  • the upper center pin 120b is one specific example that constitutes the “transfer object holding unit” of the present invention, and is a cylindrical member having a tip portion 121b, a substrate support portion 122b, and a mold support portion 123b having different diameters.
  • the upper end is connected to an upper center pin driving unit 140b, which will be described later, and the lower end passes through the center hole and the upper opening 111b of the upper mounting table 150b and is supported to be perpendicular to the upper mold holding surface Sb. ing.
  • the diameter of the tip 121b of the upper center pin 120b is smaller than the diameter of the substrate support 122b and larger than the diameter of the center hole of the substrate 300 described later.
  • the diameter of the substrate support part 122b is smaller than the diameter of the mold support part 123b and larger than the diameter of the center hole of the upper mold 200b described later.
  • the diameter of the mold support portion 123b is smaller than the diameter of each of the center hole of the upper mounting table 150b and the upper opening 111b.
  • the upper UV irradiation unit 130b is electrically connected to the control unit 102 via a signal line (not shown), and UV for curing the upper transfer layer 301b of the substrate 300 in accordance with a control signal supplied from the control unit 102. Light is applied to the upper transfer layer 301b of the substrate 300 through the upper opening 111b and the center hole of the upper mounting table 150b.
  • the upper UV irradiation unit 130b may be retracted except when necessary, such as when UV light is irradiated in the transfer operation.
  • the upper center pin driving unit 140b constitutes a part of a specific example of the “transfer object holding unit” of the present invention in the upper mechanism unit B, and the upper center pin driving unit 140b corresponds to a control signal supplied from the control unit 102. 120b is moved in the axial direction, that is, in a direction perpendicular to the upper mold holding surface Sb of the upper mounting table 150b.
  • the upper center pin driving unit 140b presses the upper center pin 120b in the vertical downward direction when the upper mold 200b and the substrate 300 after the transfer operation described later are released, thereby causing the vertical position of the substrate 300 to move.
  • release means or “first release means” in the present embodiment.
  • the control unit 102 is an information processing apparatus such as a CPU (Central Processing Unit).
  • the control unit 102 controls the position of each mold holding unit by supplying control signals to the lower mold clamp 153a of the lower mechanism unit A and the upper mold clamp 153b of the upper mechanism unit B, and holds the mold. Alternatively, the deformation of the mold is controlled.
  • the control unit 102 responds to an input signal indicating a user instruction supplied from the operation unit 103, and includes a lower UV irradiation unit 130a, a lower center pin driving unit 140a, an upper UV irradiation unit 130b, and an upper center.
  • a control signal for controlling the operation of each part of the pin driver 140b and the actuator 104 is supplied.
  • the operation unit 103 includes a plurality of buttons or a keyboard that can be input by the user, and supplies a signal for instructing an operation in accordance with the input user instruction to the control unit 102.
  • the control unit 102 reads an operation processing program stored therein to generate a control signal corresponding to the instruction and supply it to each unit.
  • the actuator 104 is a mechanism such as a motor that can move the upper mounting table 150b toward or away from the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. Specifically, the actuator 104 rotates the ball screw 101 in accordance with a control signal supplied from the control unit 102, so that the upper base 110 b engaged with the ball screw 101 is moved to the upper mold holding surface Sb and the lower mold. It moves in the vertical direction with respect to the upper mold holding surface Sb while maintaining the parallel positional relationship with the holding surface Sa. According to such an operation of the actuator 104, the upper base 110b moves vertically upward, so that the upper base 150b is separated from the lower base 150a in a direction perpendicular to the upper mold holding surface Sb. To move.
  • the upper base 110b moves vertically downward
  • the upper stage 150b moves so as to be close to the lower mounting table 150a in a direction perpendicular to the upper mold holding surface Sb.
  • four ball screws 101 are provided so as to connect the four corners of the lower base 110a and the upper base 110b, and a plurality of actuators 104 are also provided to rotate the corresponding ball screws 101.
  • the actuator 140 moves the upper mounting table 150b vertically downward in a transfer operation described later, thereby pressing the upper mold 200b and the substrate 300 to each other, and further pressing the lower mold 200a and the substrate 300 to each other.
  • the actuator 104 constitutes a specific example of “pressing means” or “first pressing means” and “second pressing means” in the present embodiment.
  • the actuator 104 moves the upper mold table 150b vertically upward while holding the upper mold 200b when the upper mold 200b and the substrate 300 after the transfer operation described later are released.
  • This is a structure for releasing from the substrate 300, and constitutes a specific example of “release means” or “first release means” in the present embodiment.
  • FIG. 3 is a schematic transmission diagram when the lower base 110a, the lower mechanism A, and the surrounding configuration are viewed from the vertically upward direction. Note that FIG. 3 does not show the lower mold holding portion 152a and the lower mold clamp 153a provided on the lower mounting table 150a.
  • the actuator 104 is connected to each of the pole screws 101 arranged at the four corners of the lower base 110a, and the pole screws are rotated based on a control signal from the control unit 102.
  • the upper base 110b and the upper mechanism B are also configured in the same manner as the lower base 110a and the lower mechanism A, and are vertically upward from the lower base 110a at the four corners of the square upper base 110b.
  • Four pole screws 101 extending in the direction are screwed together.
  • FIGS. 4A to 4E are schematic views showing the structures of the lower mounting table 150a and the lower mold holding part 152a in plan, respectively.
  • the structures of the upper mounting table 150b, the upper mold holding portion 152b, and the upper mold clamp 153b are the same as those on the lower side.
  • the outer diameter of the suction part 154a constituting the mold holding part 152a is larger than the outer diameter of the lower mold 200a, and the outer diameter of the suction groove 155a is smaller than that of the lower mold 200a. Smaller than outer diameter.
  • the top of the suction portion 154a supported by the elastic member 156a is vertically downward (hereinafter referred to as a vertical downward direction) with respect to the lower mold holding surface Sa from the lower mold holding surface Sa in the lower mounting table 150a. It is formed in a concave shape, and the depth of the concave portion is an appropriate depth that does not interfere with the mounting of the lower mold 200a. For example, the mold is not deformed, and the mold is sufficiently adsorbed when vacuum suction is activated. It is set within the possible 10 micrometers. In order to realize the depth set in this manner with high accuracy, the elastic member 156a is adjusted by a stripper bolt, a shim, or the like. Further, the elastic member 156a preferably has a structure in which galling is unlikely to occur on the contact surface with the lower mounting table 150a. A combination of the above and a retainer structure are adopted.
  • the lower mold 200a is adsorbed by the negative pressure in the adsorption groove 155a and vertically lowered by the lower mold clamp 153a as shown in FIG. 4B. It is gripped by being pressed in the direction.
  • the lower mold clamp 153a increases the pressing force for pressing the lower mold 200a vertically downward when instructed by the control signal supplied from the control unit 102 to deform the lower mold 200a.
  • the lower mold 200a With such a pressing force, the lower mold 200a is bent so as to incline from the central portion toward the peripheral portion, and the peripheral portion is strongly pressed against the suction portion 154a.
  • the elastic member 156a that holds the suction portion 154a contracts, thereby serving as a cushion against the pressing force of the lower clamp mold.
  • the elastic force and size of the elastic member 156a are adjusted so that the pressing force of the lower clamp mold and the elastic force are balanced at a position where a predetermined amount of mold deformation is realized. For this reason, the lower mold 200a is not deformed beyond the set amount of deformation of the mold, and the breakage of the mold can be suitably suppressed.
  • the deformation operation of the lower mold 200a is performed.
  • the lower mold clamp 153a has at least a pressing force for gripping the lower mold 200a and a pressing force stronger than the pressing force for gripping the lower mold 200a.
  • the lower mold 200a can be pressed with two kinds of forces.
  • the lower mold clamp 153a presses the lower mold 200a with the above-described at least two types of pressing forces in accordance with a control signal supplied from the control unit 102.
  • the lower mold clamp 153a presses the lower mold 200a with a gripping force that is a pressing force for gripping according to a gripping control signal, and with a deformation force that is a pressing force for deformation according to a deformation control signal.
  • the lower mold 200a is pressed.
  • the upper mold clamp 153b presses the upper mold 200b with a gripping force that is a pressing force for gripping according to the gripping control signal, and the upper mold clamp 153b with a deformation force that is a pressing force for deformation according to the deformation control signal.
  • the mold 200b is pressed.
  • the structures of the lower mounting table 150a and the lower mold holding portion 152a are not limited to the structure shown in FIG. 4A, and may be any structure as long as the above-described deformation operation can be performed. Absent.
  • the substrate 300 is approximately 100 micrometers from the outer diameter toward the peripheral portion from the outer peripheral portion, and vertically downward from the other portions.
  • a step structure having a predetermined depth may be used. The depth of the step structure may be arbitrarily set according to the deformation amount of the lower mold 200a. For example, the maximum deformation amount due to the bending of the lower mold 200a having a size of 4 inches and a thickness of 1 mm is 200.
  • the depth of the step structure is set to about 100 micrometers.
  • the shape of the step structure may be any shape as long as the deformation of the lower mold 200a is not hindered, and may be, for example, an inclined or curved surface structure.
  • suction part 154a is higher than the lower side of a level
  • the lower mounting table 150a may be formed of different members at the position where the elastic member 156a and the suction portion 154a are arranged.
  • the hatched portion on the inner peripheral side from the elastic member 156a and the suction portion 154a is formed of a transparent material such as quartz glass, and the plain portion on the outer peripheral side is formed of a metal material or the like. It is good also as a structure which combines both. With such a structure, the shape processing of the lower mounting table 150a becomes easier, which is effective in terms of cost reduction in the apparatus configuration.
  • Each of the upper mounting table 150b and the upper mold holding unit 152b may have a structure according to the structure of the lower mounting table 150a and the lower mold holding unit 152a.
  • the lower mold clamp 153a of the lower mechanism portion A is pressed with a pressing force that is weaker than the pressing force for elastically deforming the lower mold 200a.
  • the holding of the lower mold 200a may be realized by sandwiching it with the mounting table 150a.
  • the upper mechanism B may have the same configuration.
  • the lower mold 152a placed on the lower placement table 150a is pressed vertically downward by the lower mold clamp 153a, thereby lowering the lower mold 152a.
  • Deformation is realized.
  • the elastic deformation of the lower mold 200a may be realized by moving the suction portion 154a that is sucked to the lower mold 200a. Specifically, even if the suction part 154a is attracted to the peripheral part of the lower mold 200a, a mechanism for moving the suction part 154a vertically downward is provided in the lower mold holding part 152a. Good.
  • the suction portion 154a moves vertically downward, whereby the peripheral portion of the lower mold 200a is drawn vertically downward, and elastic deformation occurs in the lower mold 200a.
  • the upper mechanism B may have the same configuration.
  • the lower mold 200a is moved in the vertical direction relative to the suction portion 154a.
  • the elastic deformation may be realized.
  • a vertical position difference is generated between the suction portion 154a that is attracted to the peripheral portion of the lower mold 200a and the lower mold holding surface Sa of the lower mounting table 150a that is in contact with the lower surface of the lower mold 200a.
  • achieve the elastic deformation of the lower mold 200a mentioned above by means, such as, may be provided.
  • FIG. 5 is a flowchart showing a series of transfer operations performed by the imprint apparatus 1
  • FIGS. 6 and 7 are diagrams schematically showing the operation of each part of the imprint apparatus 1 in each process during the transfer operation. is there.
  • the operation flow of each process shown in the flowchart of FIG. 5 will be described with reference to the operation of the imprint apparatus 1 shown in FIGS. 6 and 7.
  • the upper mold 200b is attached to the initial imprint apparatus 1 (FIG. 6 [state 1]) in which none of the upper mold 200b, the lower mold 200a, and the substrate 300 is installed.
  • Step S101 More specifically, in step S101, first, the upper mold 200b is moved by the operation of a mold conveying device (not shown) so that the front end portion 121a of the lower center pin 120a penetrates the center hole, and the lower center pin 120a.
  • the control unit 102 operates the actuator 104 so that the upper mold holding surface Sb of the upper mounting table 150b is in contact with the upper surface of the upper mold 200b (that is, the back surface of the surface on which the pattern is formed).
  • the mounting table 150b is moved vertically downward.
  • the control unit 102 operates a decompression unit (not shown) to adsorb and hold the upper mold 200b on the adsorption unit 154b of the upper mounting table 150b.
  • a grip control signal is transmitted to the upper mold clamp 153b, and the upper mold 200b is pressed vertically upward to be fixed to the upper mounting table 150b (FIG. 6 [State 3]).
  • the control unit 102 operates the actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction (FIG. 6 [state 4]).
  • step S102 the lower mold pin 200a is formed so that the tip 121a of the lower center pin 120a penetrates the center hole by an operation of a mold conveying device (not shown). It is installed on the mold support part 123a of 120a (FIG. 6 [state 5]).
  • the control unit 102 operates the lower center pin driving unit 140a so that the lower mold holding surface Sa of the lower mounting table 150a is the lower surface of the lower mold 200a (that is, the back surface of the surface on which the pattern is formed). ), The lower center pin 120a is moved vertically downward.
  • the control unit 102 operates a decompression unit (not shown) to adsorb the upper mold 200a to the adsorption unit 154a of the lower mounting table 150a and hold it.
  • a grip control signal is transmitted to the lower mold clamp 153a, and the lower mold 200a is pressed vertically downward to be fixed to the lower mounting table 150a (FIG. 6 [State 6]).
  • FIG. 8 is an example of a graph showing temporal changes in the pressing force acting on each of the upper mold clamp 153b and the lower mold clamp 153a in a series of flows of the transfer operation of the present embodiment.
  • FIG. 8A shows a temporal change in the pressing force of the upper mold clamp 153b
  • FIG. 8B shows a temporal change in the pressing force of the lower mold clamp 153a.
  • the pressing force of the upper mold clamp 153b is gradually increased by supplying the grip control signal.
  • the lower mold clamp 153a The pressing force gradually increases, and the lower mold 200a is gripped with a desired gripping force.
  • the substrate 300 is placed on the substrate support portion 122a of the lower center pin 120a in such a manner that the tip portion 121a of the lower center pin 120a penetrates the center hole by the operation of a substrate transfer device (not shown).
  • a substrate transfer device not shown.
  • the control unit 102 may align the lower mold 200a and the upper mold 200b with the substrate 300 as necessary.
  • the control unit 102 transmits a deformation control signal to the lower mold clamp 153a and the upper mold clamp 153b to cause the lower mold 200a and the upper mold 200b to be deformed (Step S104, FIG. 6 [State 8] ]).
  • the upper mold clamp 153b that has received the deformation control signal deforms the upper mold 200b by pressing it with a deformation force, while the lower mold clamp 153a presses the lower mold 200a with a deformation force.
  • the lower mold 200a is deformed.
  • the pressing force of each mold clamp is controlled so as to gradually increase from the gripping force to the deformation force, as shown in FIGS. 8 (a) and 8 (b).
  • control unit 102 is supported by operating the lower center pin driving unit 140a to move the lower center pin 120a vertically downward while maintaining the deformed state of the lower mold 200a and the upper mold 200b.
  • the lower transfer layer 301a of the substrate 300 is brought into contact with the pattern surface of the lower mold 200a (FIG. 7 [State 9]).
  • control unit 102 operates the lower center pin driving unit 140a to move the lower center pin 120a vertically downward, and the pattern of the lower transfer layer 301a and the lower mold 200a to be supported is supported. The surface is brought into contact (step S105, FIG. 7 [state 9]). Further, the control unit 102 operates the actuator 104 to move the upper mounting table 150b vertically downward to bring the pattern surface of the upper mold 200b into contact with the upper transfer layer 301b of the substrate 300 (FIG. 7 [state] 10]).
  • each mold and the contact with the substrate 300 may be performed in the above-described order. Also, the deformation of the lower mold 200a, the contact between the lower mold 200a and the substrate 300, the deformation of the upper mold 200b, You may perform from one side in the order of contact with the upper mold 200b and the board
  • the control unit 102 transmits a control signal to the lower mold clamp 153a and the upper mold clamp 153b to release the deformation of the lower mold 200a and the upper mold 200b (step S106). ).
  • the controller 102 changes the pressing force of the upper mold clamp 153b and the lower mold clamp 153a from the deformation force to the gripping force as shown in FIGS. 8 (a) and 8 (b).
  • a grip control signal is transmitted so as to gradually decrease.
  • the grip control signal that gradually decreases from the deformation force to the grip force may be synchronized with the lower center pin drive unit 140a and the actuator 104 that are operated to bring each mold into contact with the substrate 300.
  • the control unit 102 A grip control signal for releasing the deformation of the mold may not be transmitted.
  • the control unit 102 operates the actuator 104 to move the upper mounting table 150b vertically downward, and the upper mold 200b is placed on the upper transfer layer 301b on the upper surface of the substrate 300, and the lower mold 200a is moved.
  • the lower transfer layer 301a of the lower surface of the substrate 300 is pressed with a predetermined pressing force (Step S107, FIG. 7 [State 11]).
  • the control unit 102 emits UV light from the lower UV irradiation unit 130a and the upper UV irradiation unit 130b in order to cure the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 while maintaining the pressed state.
  • the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 are cured in accordance with the pattern formed on the surface of each mold, and the pattern is transferred (step S108).
  • the pressure and pressing time during pressing, and the intensity and irradiation time of UV irradiation are preferably set as appropriate according to the size and shape of the transfer pattern, the characteristics of the transfer layer, and the like.
  • a mold release operation is performed to release the lower mold 200a and the substrate 300 and the upper mold 200b and the substrate 300 which are in close contact with each other. Is called.
  • control unit 102 In the mold release operation, the control unit 102 first stops the operation of the actuator 104 that presses the upper mounting table 150b, and releases the pressing state between each mold and the substrate 300. At the same time or before and after, the control unit 102 operates the upper center pin driving unit 140b so that the tip of the upper center pin presses the substrate 300 vertically downward at a predetermined pressure (step S109, FIG. S2 [ State 12]).
  • the substrate 300 is sandwiched between the lower center pin 120a and the upper center pin 120b.
  • the control unit 102 controls the lower center pin driving unit 140a and the upper center so that excessive pressure is not applied to the substrate 300 held between the lower center pin 120a and the upper center pin 120b.
  • drive control such as torque control is performed on at least one of the pin drive units 140b.
  • control unit 102 performs deformation of the lower mold 200a and the upper mold 200b by the same operation as the above-described step S104 (step S110, FIG. 7 [state 13]). At this time, the pressing force of each mold clamp is controlled to gradually increase from the gripping force to the deformation force.
  • the control unit 102 operates the upper center pin 120b and the actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction.
  • the upper mold 200b moves vertically upward while being held by the upper mounting table 150b, while the substrate 300 is pressed vertically downward (in other words, fixed) by the upper center pin 120b. Therefore, the upper mold 200b and the upper transfer layer 301b of the substrate 300 are released (Step S111, FIG. 7 [State 14]).
  • control unit 102 moves the lower center pin 120a supporting the substrate 300 to the initial position in the vertical upward direction, and releases the lower mold 200a and the substrate 300 (Step S112, FIG. 7 [State 15 ]).
  • control unit 102 changes the pressing force of the upper mold clamp 153b and the lower mold clamp 153a to a gripping force for gripping the mold, and releases the deformation of the lower mold 200a and the upper mold 200b. (Step S113, FIG. 7 [State 16]).
  • step S114 The substrate 300 released from the lower mold 200a and the upper mold 200b is removed from the lower center pin 120a by an operation of a substrate transfer device (not shown) (step S114).
  • step S115: No when performing transfer using the same lower mold 200a and upper mold 200b for another substrate 300 (step S115: No), the steps from step S103 to step S114 for placing the substrate 300 are performed. Run repeatedly. After all the transfer is completed (step S115: Yes), the lower mold 200a is first removed (step S116) and then the upper mold 200b is removed (step S117) by the operation of a mold conveyance device (not shown). .
  • the lower mold 200a and the upper mold 200b are moved relative to the transfer surface 301a and the upper transfer layer 301b of the substrate 300.
  • the pattern formed on the surface is transferred.
  • each of the lower mold 200a and the upper mold 200b is brought into contact with the substrate 300 in a state where the bending occurs.
  • the for this reason particularly as shown in FIG. 7 [State 10], in each of the lower mold 200a and the upper mold 200b, bending occurs so as to sequentially contact the substrate 300 from the central portion toward the peripheral portion.
  • the holes mixed in the contact portion are pushed out to the peripheral edge as the contact proceeds, and are removed from the contact surface.
  • the transfer pattern on the substrate obtained by the transfer operation is not possible for the pattern of the portion where the holes are generated. Deficiency may occur.
  • the lower transfer layer 301a and the upper transfer layer 301b provided on the substrate 300 may be made of a material having fluidity, which is particularly effective when such a material is used. This is beneficial in the operation of the nanoimprint transfer apparatus, which is expected to process a large amount of transferred material by continuous transfer.
  • a mold release starting point is formed between the mold and the transfer layer. Is done. Specifically, in the case of the lower mold 200a, the peripheral portion bends in the vertical downward direction by a predetermined amount of deformation, so that the lower mold 200a and the lower transfer layer 301a are peeled off by a minute amount. The point peeled in this way becomes the mold release start point, and the peel state can be advanced with a weaker force than the case where the mold release start point does not exist from the peripheral part of the lower mold 200a toward the center part. It becomes possible.
  • the mold and the substrate can be released with a weaker force than when the release start point does not exist, and the contact surface between the mold and the substrate transfer layer is released. It is possible to suitably suppress the occurrence of damage to the pattern formed on the mold, the substrate itself, or both due to the concentration of the force, and the pattern can be transferred accurately.
  • the amount of deformation of the mold is determined by the shapes of the lower mounting table 150a and the lower mold holding unit 152a, the upper mounting table 150b and the upper mold holding unit 152b shown in each drawing of FIG. 4, and the lower mold clamp 153a. And it becomes possible to set appropriately according to the pressing force of the upper mold clamp 153b. For this reason, when aligning the mold and the substrate, the alignment mark formed on the mold is not distorted, and the mold and the substrate can be aligned with high accuracy, and a fine pattern can be accurately transferred. Is feasible. In addition, it is possible to relatively easily set the optimal deformation amount according to the material and thickness of the mold and the substrate and the transfer conditions for enjoying the above-described effects more remarkably.
  • the imprint apparatus 1 it is possible to realize the deformation of the mold without additionally using a dedicated actuator for deforming the mold or a structure for deforming the mold with a negative pressure. For this reason, it is possible to realize an apparatus configuration capable of enjoying the above-described effects with an inexpensive and relatively simple configuration. This is also advantageous in that maintenance for maintenance of the apparatus can be easily performed.
  • FIG. 9 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 ′ which is a modification of the transfer apparatus of the present invention. Note that, in this modification and FIG. 9, the same components as those of the imprint apparatus 1 shown in FIG.
  • the imprint apparatus 1 ′ shown in FIG. 9 is a UV-type transfer apparatus that transfers the pattern on the surface of the lower mold 200 a to the substrate 300 including the lower transfer layer 301 a that is cured by UV irradiation.
  • the imprint apparatus 1 ′ includes a lower mechanism A configured on the lower base 110a, an upper base 110b, and a ball screw 101 that connects the lower base 110a and the upper base 110b.
  • the control unit 102 controls the operation of the lower mechanism unit A, and the operation unit 103 can input a user instruction to the control unit 102.
  • the imprint apparatus 1 ′ shown in FIG. 9 shows a state where the lower mold 200 a and the substrate 300 are installed.
  • the lower mold 200a is held on the lower mounting table 150a of the lower mechanism portion A so that the surface on which the pattern is formed faces upward.
  • the actuator 104 rotates the ball screw 101 under the control of the control unit 102, whereby the upper base 110b, the upper mold holding surface Sb of the upper mounting table 150b, and the lower mounting table are rotated.
  • 150a is moved in a direction perpendicular to the upper mold holding surface Sb while maintaining parallel to the lower mold holding surface Sa.
  • the upper base 110b moves vertically upward, so that the upper base 150b is separated from the lower base 150a in a direction perpendicular to the upper mold holding surface Sb.
  • the upper base 110b moves vertically downward, so that the upper stage 150b moves closer to the lower stage 150a in the direction perpendicular to the upper mold holding surface Sb.
  • the imprint apparatus 1 ′ which is a modification of the transfer apparatus according to the present invention described above, has various effects similar to those of the imprint apparatus 1 described above, while being lower than the lower transfer layer 301 a of the substrate 300. A pattern formed on the surface of the mold 200a can be transferred.
  • the substrate 300 is deformed using a configuration similar to that of a mold clamp or the like, and the lower mold 200a is contacted and released while the deformation is maintained. There may be. Even in such a configuration, the pattern formed on the surface of the lower mold 200a can be transferred to the lower transfer layer 301a of the substrate 300 while enjoying various effects similar to those of the imprint apparatus 1 described above. .
  • FIG. 10 is a schematic diagram schematically showing the configuration of an imprint apparatus 1 ′′ and a control apparatus 400, which are a second modification of the transfer apparatus of the present invention. Note that, in this modification and FIG. 10, the same components as those of the imprint apparatus 1 shown in FIG.
  • the imprint apparatus 1 '' is a configuration that does not include the control unit 102 and the operation unit 103 in the imprint apparatus 1 shown in FIG. Other parts may be equivalent to the imprint apparatus 1.
  • the control device 400 includes a control unit 102 ′ and an operation unit 103 ′ having the same configuration as the control unit 102 and the operation unit 103 of the imprint apparatus 1, and is electrically connected to each unit of the imprint apparatus 1 ′′. Is done. In this configuration, the control unit 102 ′ of the control device 400 controls the operation by supplying a control signal to each unit of the imprint apparatus 1 ′′.
  • the imprinting device 1 ′′ and the control device 400 are arranged at separate positions, and the same effect as that obtained by the imprinting device 1 described above is obtained. You can enjoy it.
  • one control device 400 is connected to a plurality of imprint devices and controls the operation of each imprint device.
  • one control device 400 is provided for n imprint devices 1 ′′ -1, 2,...
  • the operation of each imprint apparatus is controlled by supplying control signals to the imprint apparatuses 1 ′′ -1, 2,... N.
  • one control device 400 supplies control signals to a plurality of n imprint devices 1 ′′ -1, 2,... N, and the like, as shown in FIGS. Centralized control is performed so that each process related to the transfer operation is performed.
  • a fourth modified example there is an apparatus configuration in which a user's instruction for controlling operations is input by a single operation unit to a plurality of control units respectively connected to a plurality of imprint apparatuses. is there.
  • the individual control units 102′-1, 2,. are connected to control the operation of each imprint apparatus 1 ′′ -1, 2,... N.
  • the operation unit 103 ′ is connected to each of the control units 102′-1, 2,... N, and inputs an instruction by a user operation.
  • the user concentrates settings such as operation start, operation stop, and the number of substrates to be transferred in each imprint apparatus 1 ′′ -1, 2,... N by using one operation unit 103 ′.
  • the operation unit 103 ′ inputs the set instruction content to the control units 102′-1, 2,... N of the imprint apparatuses 1 ′′ -1, 2,.
  • control units 102′-1, 2,... N of the respective imprint apparatuses 1 ′′ -1, 2,... N respectively correspond to the corresponding imprint apparatuses 1 ′′ -1, 2,.
  • a control signal is supplied so that n performs each step related to the transfer operation shown in FIGS.
  • one control device 400 or operation unit 103 ′ is used for each of the plurality of imprint devices 1 ′′ -1, 2,.
  • User instructions can be input. For this reason, centralized management is possible in a factory where many imprint apparatuses are required to operate simultaneously. Moreover, it is useful also in terms of apparatus configuration and cost.
  • the UV type imprint apparatus has been described as an example.
  • 1 imprint device 101 ball screw, 102 actuator, 103 control unit, 104 operation unit, 110a Lower base, 110b upper base, 120a Lower center pin, 120b upper center pin, 130a Lower UV irradiation part, 130b Upper UV irradiation part, 140a Lower center pin drive unit, 140b upper center pin drive unit, 150a Lower mounting table, 150b upper mounting table, 151a lower opening, 151b upper opening, 152a Lower mold holding part, 152b Upper mold holding part, 153a Lower mold clamp, 153b Upper mold clamp, 154a Lower suction part, 154b upper suction part, 155a Lower suction groove, 155b upper suction groove, 156a lower elastic member, 156b upper elastic member, 200a lower mold, 200b Upper mold, 300 substrates, 301a Lower transfer layer, 301b Upper transfer layer.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Abstract

La présente invention se rapporte à un dispositif de transfert (1) destiné à transférer un motif formé sur un moule (200) sur un corps de réception de transfert (300). Le dispositif de transfert est pourvu d'un moyen de maintien de moule (154a) destiné à maintenir un moule, d'un moyen de maintien de corps de réception de transfert (120a, 120b) destiné à maintenir le corps de réception de transfert, d'un moyen de pressage (104) destiné à amener le moule et le corps de réception de transfert en contact l'un avec l'autre et à presser ces derniers, d'un moyen de séparation (104, 140a, 140b) destiné à séparer le moule et le corps de réception de transfert étroitement fixés, et d'un moyen de déformation (153a) destiné à déformer le moule soit au moment du contact juste avant que le moule et le corps de réception de transfert ne soient mutuellement pressés, soit au moment de la séparation après le pressage. Le moyen de déformation ne déforme pas le moule pendant que le moule et le corps de réception de transfert sont mutuellement pressés, le moule est fixé au moyen de maintien de moule destiné au maintien, et le moule maintenu par le moyen de maintien de moule est retiré.
PCT/JP2010/057952 2010-05-11 2010-05-11 Dispositif et procédé de transfert, et programme informatique WO2011141995A1 (fr)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008524854A (ja) * 2004-12-16 2008-07-10 エーエスエムエル ホールディング エヌ．ブイ． インプリントリソグラフィに使用されるナノディスクを形成するためのシステムおよび方法ならびにそれによって形成されたナノディスクおよびメモリディスク
JP2009123318A (ja) * 2007-10-23 2009-06-04 Tdk Corp インプリント方法、情報記録媒体製造方法およびインプリントシステム
JP2009141328A (ja) * 2007-10-11 2009-06-25 Asml Netherlands Bv インプリントリソグラフィ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008524854A (ja) * 2004-12-16 2008-07-10 エーエスエムエル ホールディング エヌ．ブイ． インプリントリソグラフィに使用されるナノディスクを形成するためのシステムおよび方法ならびにそれによって形成されたナノディスクおよびメモリディスク
JP2009141328A (ja) * 2007-10-11 2009-06-25 Asml Netherlands Bv インプリントリソグラフィ
JP2009123318A (ja) * 2007-10-23 2009-06-04 Tdk Corp インプリント方法、情報記録媒体製造方法およびインプリントシステム

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