WO2011155035A1

WO2011155035A1 - Transfer device

Info

Publication number: WO2011155035A1
Application number: PCT/JP2010/059782
Authority: WO
Inventors: 哲也今井; 良明小島; 孝幸糟谷
Original assignee: パイオニア株式会社
Priority date: 2010-06-09
Filing date: 2010-06-09
Publication date: 2011-12-15

Abstract

Disclosed is a transfer device (1) that transfers a pattern formed on a mold (200) to an object to which the pattern is to be transferred (300). The transfer device comprises a first stage (150a), a second stage (150b), a plurality of shafts (101a to 101d) provided between the first stage and the second stage, and first clamps (153a) provided on the first stage and that grip the mold. The first clamps are positioned outside a predetermined region that connects a central region of a pressurizing surface, which is the central region of the pressurizing surface of the mold during transfer, and the shafts. This configuration enables the stress to be concentrated locally inside the mold during pattern transfer, which suitably prevents mold damage.

Description

Transfer device

The present invention relates to a technical field of a transfer apparatus that transfers a concavo-convex pattern onto a surface of a transfer target by pressing a mold against the transfer target.

In a typical transfer apparatus, the mold and the transfer target are brought into close contact with each other by moving the holding member that holds the mold and the holding member that holds the transfer target, thereby realizing transfer.

Among the prior art documents shown below, Patent Document 1 discloses a configuration in which a disk-shaped transfer object is disposed in an apparatus and a mold is pressed from above and below. Patent Documents 2 and 3 disclose a technique for weakening the adhesion force by elastically deforming the mold so that a gap is generated on the adhesion surface when the adhered mold and the transfer target are separated.

Japanese Patent No. 4267991 JP 2007-136810 A US Pat. No. 7,363,854

By the way, for example, a pressing mechanism that moves one or both of the mold and the transfer target member in a direction perpendicular to the opposing surface to bring them closer to each other and closely contact each other is often used. At this time, stress concentrates locally in the mold, and damage may occur. In particular, as described in Patent Documents 2 and 3 described above, in an apparatus for elastically deforming a mold, the force applied for the elastic deformation is further affected, so that stress is more concentrated in the mold. There is a risk that.

The present invention has been made in view of the technical problems described above, and an object of the present invention is to provide a transfer device that can prevent damage to the mold due to local concentration of stress inside the mold.

In order to solve the above problems, a first transfer device of the present invention is a transfer device for transferring a pattern formed on a mold onto a transfer target, and includes a first stage, a second stage, and the first stage. A plurality of shafts provided between the stage and the second stage; and a first clamp provided on the first stage for gripping the mold, wherein the first clamp applies the mold during transfer. It arrange | positions outside the predetermined area | region which connects the pressurization surface center area | region which is a center area | region of a pressurization surface, and the said shaft.

In order to solve the above problems, the second transfer apparatus of the present invention transfers the pattern formed on the first mold to the first surface of the transfer target, and the pattern formed on the second mold A transfer device for transferring to a second surface of a transfer object, wherein a first stage, a second stage, a plurality of shafts provided between the first stage and the second stage, and the first stage The first clamp that is provided on one stage and grips the first mold, and the second clamp that is provided on the second stage and grips the second mold. And the second clamp is disposed outside the first region connecting the first pressure surface central region, which is the central region of the pressure surface of the first mold, and the shaft, and the second clamp is the pressure surface of the second mold during transfer Center of Wherein the second pressing surface central region is disposed in the second region outside connecting the shaft.

In order to solve the above-described problem, a third transfer apparatus of the present invention is a transfer apparatus that transfers a pattern formed on a mold to a transfer target, and includes a first stage, a second stage, and the first stage. A plurality of shafts provided between a stage and the second stage; and a first clamp provided on the first stage and gripping the mold, wherein the first clamp is on the first stage. It arrange | positions out of the predetermined area | region containing the line which connects a predetermined location and the said shaft.

The operation and other gains of the present invention will be described together with embodiments shown below.

It is a schematic diagram which shows the basic structural example of the imprint apparatus of embodiment. It is a schematic diagram which shows the aspect of the holding | maintenance of the mold on a stage. It is a schematic diagram which shows the shape of the base of an imprint apparatus. It is a figure which shows the example of the positional relationship of the ball screw and mold clamp in an imprint apparatus. It is a figure which shows the example of the positional relationship of the ball screw and mold clamp in an imprint apparatus. It is a figure which shows the example of the positional relationship of the ball screw and mold clamp in an imprint apparatus. It is a flowchart which shows a series of flows of transfer operation | movement by the imprint apparatus of this invention. FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. It is a schematic diagram which shows the pressing force which arises in the inside of a mold at the time of pressing operation. It is a schematic diagram which shows the basic structural example of the 1st modification of an imprint apparatus.

1st Embodiment which concerns on the transfer apparatus of this invention is a transfer apparatus which transfers the pattern formed in the mold to a to-be-transferred body, Comprising: 1st stage, 2nd stage, said 1st stage, and said 2nd A plurality of shafts provided between the stage and a first clamp provided on the first stage and gripping the mold, wherein the first clamp includes a central region of the pressing surface of the mold during transfer; It arrange | positions out of the predetermined area | region which connects the said shaft.

According to the first embodiment of the transfer apparatus of the present invention, the mold held on the first stage by the first clamp is pressed against the transfer target, thereby forming irregularities formed on the mold surface. The pattern is transferred onto the surface of the transfer target.

The first clamp is a clamp mechanism provided on the first stage, and holds the mold by pressing it against the mounting surface on the first stage. The first stage may further include auxiliary holding means for fixing the mold by, for example, vacuum suction in order to ensure the holding of the mold.

The second stage is a member for sandwiching and pressing the mold and the transfer object between the first stage. The second stage has, for example, a flat surface facing the mold placement surface on the first stage, and the transfer is realized by pressing the transfer target in the mold direction with the flat surface. For this reason, it is preferable that the transfer device further includes a member that holds the transfer object between the first stage and the second stage.

In order to press the mold and the transfer object, a plurality of shafts are provided between the first stage and the second stage. The shaft is a member on an axis provided in the transfer apparatus, and is arranged with an axis parallel to a straight line connecting the mold held on the first stage, the transfer target, and the second stage. Is done. For example, the first stage and the second stage are configured to have a mechanism that can move so as to approach and separate from each other along the shaft.

At the time of transfer, the first stage and the second stage move along the shaft, and press the mold and the transfer target each other. The plurality of shafts are arranged so as to be parallel to each other, and more preferably, the shafts are uniformly arranged so that an even pressure acts on the contact surface when the mold and the transfer target are in close contact with each other.

In the transfer apparatus according to the first embodiment, outside the region connecting the plurality of shafts provided between the first stage and the second stage and the center of the pressing surface of the mold pressed by the first stage and the second stage. A first clamp is disposed. Specifically, the first clamp provided on the first stage has a center of the pressing surface when pressing the mold on the first stage and a region where each of the plurality of shafts on the first stage is provided. Provided outside the area to be connected. In other words, the first clamp is not disposed in a region connecting each shaft and the center of the pressing surface of the mold.

When the mold and the transfer target are in close contact with each other for the transfer operation, the mold and the transfer target are pressed against each other by the first stage and the second stage. At this time, with respect to the mold, a pressing force for holding by the first clamp (typically, a pressing force toward the first stage) and a pressing force for transfer (typically the first force) The pressing force in the second stage direction by the stage and the pressing force in the first stage direction by the second stage) act. As described above, when a plurality of pressing forces act simultaneously, stress may locally concentrate inside the mold.

The pressing force for the transfer is based on the first stage and the second stage that move along the shaft. In particular, the pressing surface center region that is typically the center of a plurality of shafts, and the center of the pressing surface In a region connecting the region and each of the plurality of shafts, a relatively strong pressing force acts as compared with other regions. At this time, when the pressing force by the first clamp is applied to the mold in the region connecting the center of the pressing surface and each of the plurality of shafts, the mold may be damaged by locally concentrated stress. .

However, as described above, by arranging the first clamp to press the mold while avoiding the area connecting the center of the pressing surface and each of the plurality of shafts, the stress generated inside the mold can be suitably suppressed. I can do it. For this reason, it is possible to prevent the mold from being damaged and to realize a stable transfer operation.

In one aspect of the first embodiment of the transfer apparatus of the present invention, the pressing surface center region is a region having the same diameter as the shaft, and the predetermined region is the pressing surface center region and each of the plurality of shafts. This is the area connecting

According to this aspect, it is possible to suitably determine a region where stress is concentrated in the first stage and the second stage pressed along the plurality of shafts. Therefore, by disposing the first clamp while avoiding the region, it is possible to suitably prevent the first clamp from pressing a portion where stress is concentrated on the mold, and it is possible to prevent damage to the mold. .

In another aspect of the first embodiment of the transfer device of the present invention, the center area of the pressing surface is an area equidistant from the plurality of shafts.

In another aspect of the first embodiment of the transfer apparatus of the present invention, the first clamp presses the mold in a direction perpendicular to the surface on which the mold of the first stage is placed. Fix the mold.

In this aspect, the mold is placed with a surface on which a pattern is not formed (hereinafter referred to as a non-pattern surface) in contact with the first stage. Typically, the non-pattern surface is a back surface of a surface on which a mold pattern is formed (hereinafter referred to as a pattern surface).

The first clamp realizes holding so as to press the mold against the first stage by pressing the pattern surface of the mold against the surface on which the mold on the first stage is placed. For this reason, an appropriate mold can be held.

In another aspect of the first embodiment of the transfer apparatus of the present invention, at least one of the first stage and the second stage moves along the shaft.

In the case of such a configuration, the mold held on the stage can move as the first stage or the second stage moves. By this movement, the mold can be moved toward and away from the transfer object relatively easily. As an example for realizing such a configuration, a configuration in which the first stage and the second stage are screwed onto a plurality of ball screw-shaped shafts is conceivable. In this case, each stage can be moved along with the rotation of the shaft by providing an actuator for rotating the ball screw-shaped shaft.

In another aspect of the first embodiment according to the transfer device of the present invention, the first clamp holds an outer edge portion of the mold.

According to this aspect, the first clamp realizes the holding by pressing the outer edge portion of the region where the mold pattern is formed. For this reason, the mold can be held more stably.

In another aspect of the first embodiment of the transfer device of the present invention, the first clamp elastically deforms the mold by pressing with a stronger force than the mold is held.

According to this aspect, for example, the first clamp can suitably prevent bubbles from entering the contact surface by elastically deforming the mold when the mold and the transfer target are brought into contact with each other during transfer. Further, when releasing the mold from the state where the mold and the transfer target are in close contact with each other, the mold is elastically deformed to create a void in the close contact surface, thereby facilitating the release.

When the mold is deformed, the first clamp applies a stronger pressing force than the holding of the mold. Therefore, the first clamp is elastic while the mold and the transfer target are pressed against the first stage and the second stage during the transfer. When the deformation is performed, the stress concentrated locally in the mold becomes stronger. However, as described above, the stress concentrated in the mold can be suppressed by arranging the position where the first clamp presses the mold so as to avoid the region connecting the center position and each of the plurality of movement axes. I can do it. For this reason, the possibility of damage to the mold is reduced, and a stable transfer operation can be realized.

In the second embodiment of the transfer apparatus of the present invention, the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the first surface of the transfer object. A transfer device for transferring to the second surface, the first stage, the second stage, a plurality of shafts provided between the first stage and the second stage, and the first stage; The first clamp for holding the first mold, and the second clamp provided on the second stage for holding the second mold, wherein the first clamp is the first mold at the time of transfer. The second clamp is a central region of the pressure surface of the second mold at the time of transfer, and is disposed outside the first region connecting the first pressure surface central region, which is the central region of the pressure surface, and the shaft. 2nd It is disposed in the second region outside connecting the plane central region and the shaft.

According to the second embodiment of the transfer apparatus of the present invention, the first mold is gripped by the first clamp provided on the first stage. Further, the second mold is gripped by the second clamp provided on the second stage. The first stage and the second stage are arranged with a plurality of shafts therebetween. In the transfer apparatus according to the second embodiment, the first stage and the second stage move along the shaft, the first mold is placed on the first surface of the transferred body, and the second mold is moved on the first side of the transferred body. By pressing each of the two surfaces, the pattern can be transferred to the two surfaces of the mold. Incidentally, the transfer of the pattern to each surface may be performed in succession or simultaneously.

Typically, the first surface and the second surface of the transfer object are provided on opposite surfaces, and are held on the first stage and the second stage. The transferred object is sandwiched between the second mold and pressed from both sides, whereby the pattern is simultaneously transferred onto both the first surface and the second surface.

Further, according to the second embodiment of the transfer apparatus of the present invention, the first clamp provided on the first stage is the first pressure surface that is the center of the pressure surface when pressing the mold on the first stage. It is provided outside the first region connecting the central region and the region where each of the plurality of shafts on the first stage is provided. In addition, the second clamp provided on the second stage includes a second pressurizing surface center region that is the center of the pressurizing surface when pressing the mold on the second stage, and a plurality of shafts on the second stage. It is provided outside the second region connecting the provided region. According to such a configuration, various effects similar to those of the first embodiment according to the transfer device of the present invention described above can be obtained.

In the second embodiment related to the transfer device of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

In one aspect of the second embodiment according to the transfer device of the present invention, the first clamp and the second clamp are in a positional relationship where they do not contact at the time of transfer.

With this configuration, even when the first stage and the second stage are close to each other for transfer, the first clamp and the second clamp are not in contact with each other, and the transfer is affected. There is no. For example, when the first clamp and the second clamp are projected on the same plane, it is preferable that the first clamp and the second clamp be arranged so as to be mutually offset with a predetermined interval.

The third embodiment according to the transfer apparatus of the present invention is a transfer apparatus that transfers a pattern formed on a mold to a transfer target, and includes a first stage, a second stage, the first stage, and the second stage. A plurality of shafts provided between the stage and a first clamp provided on the first stage and gripping the mold, wherein the first clamp includes a predetermined position on the first stage and the shaft; Are arranged outside a predetermined area including a line connecting the two.

According to the third embodiment of the transfer apparatus of the present invention, as in the first embodiment of the transfer apparatus described above, the arrangement position where stress is locally concentrated inside the mold during transfer is avoided, and One clamp can be arranged. Furthermore, in the third embodiment, outside a predetermined region including a line connecting each shaft that is a starting point for applying a pressing force to the mold via the first stage and a predetermined portion that can be arbitrarily set on the first stage. A first clamp is disposed. For this reason, the first clamp can be arranged avoiding a region where the pressing force acting on the mold is relatively strong, such as a region connecting the shafts, in addition to the region connecting the center of the pressing surface and each shaft. . For this reason, it becomes possible to suppress the concentration of local stress inside the mold during transfer more preferably.

In the third embodiment related to the transfer device of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

As described above, the first embodiment according to the transfer apparatus of the present invention includes the first stage, the second stage, the plurality of shafts, and the first clamp. The second embodiment according to the transfer apparatus of the present invention includes a first stage, a second stage, a plurality of shafts, a first clamp, and a second clamp. The third embodiment according to the transfer apparatus of the present invention includes a first stage, a second stage, a first clamp, and a plurality of shafts. Therefore, it is possible to suppress the local concentration of stress inside the mold during transfer, and to suitably prevent the mold from being damaged.

The operation and other gains of the various embodiments according to the transfer device of the present invention will be described in more detail using the following examples.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(1) Basic Configuration Example First, the basic configuration of the transfer apparatus of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 which is an embodiment of a transfer apparatus of the present invention.

The imprint apparatus 1 shown in FIG. 1 is a UV-type transfer apparatus that transfers a pattern on a mold to a transfer target having a transfer layer that is cured by UV irradiation. Further, the imprint apparatus 1 uses the lower mold 200a and the upper mold 200b on which patterns such as unevenness to be transferred are formed, and the lower transfer layer 301a and the upper surface formed on the lower surface of the substrate 300 that is a transfer target. In this configuration, transfer is performed on both of the upper transfer layer 301b formed on the substrate.

1 shows the imprint apparatus 1 in a state where the lower mold 200a, the upper mold 200b, and the substrate 300 are installed.

As shown in FIG. 2A, the lower mold 200a has a disk shape having a center hole in the center or a shape similar to the disk, and a pattern such as irregularities is formed near the center hole on the pattern surface. A pattern area is constructed. At least a portion corresponding to the pattern region of each mold is made of a material that transmits UV light, such as quartz glass, and is preferably hardly affected by a change in character due to irradiation with UV light. For convenience, the outside of the pattern area on the pattern surface is referred to as a non-pattern area. The upper mold 200b has the same configuration as the lower mold 200a. Further, the pattern surface of the lower mold 200a and the upper mold 200b is subjected to a surface treatment for the purpose of improving mold releasability of the mold and the substrate at the time of mold release described later, for example, a surface treatment with a silane coupling agent or the like, A release layer having a thickness of a single molecule to several molecules is formed.

In this embodiment, the lower mold 200a is a specific example of the “mold” or “second mold” of the present invention, and the upper mold 200b is a specific example of the “mold” or “first mold” of the present invention. It is an example.

The substrate 300 has a disc shape having a center hole having a smaller diameter than the center hole of the mold at the center, and has a lower transfer layer 301a and an upper transfer layer 301b made of a UV curable material on the lower surface and the upper surface.

As shown in FIG. 1, the imprint apparatus 1 connects a lower mechanism part A including a lower base 110a, an upper mechanism part B including an upper base 110b, and the lower base 110a and the upper base 110b. A ball screw 101 that rotates, an actuator 104 that rotates the ball screw, a control unit 102 that controls the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation unit that can input user instructions to the control unit 102 103.

In this embodiment, the lower mechanism portion A including the lower base 110a is a specific example of the “second stage” of the present invention, and the upper mechanism portion B including the upper base 110b is the “second stage” of the present invention. This is a specific example of “first stage”. Further, the ball screw 101 is a specific example of the “shaft” of the present invention.

The lower mechanism A is provided on the upper surface of the lower base 110a, and includes a lower center pin 120a, a lower UV irradiation unit 130a, a lower center pin driving unit 140a, a lower mounting table 150a, A side mold holding part 152a and a lower mold clamp 153a are provided.

The lower base 110a is a member on the board, and is provided with a lower mounting table 150a having a center hole at the center and a lower opening 151a, and a screw groove into which the ball screw 101 is screwed is cut. There are screw holes.

The lower center pin 120a is a member having a cylindrical tip portion 121a, a substrate support portion 122a, and a mold support portion 123a having different diameters. The lower center pin 120a is connected to a lower center pin driving unit 140a, which will be described later, and penetrates a center hole and a lower opening 151a of the lower mounting table 150a, which will be described later. It is supported so as to be perpendicular to the surface Sa.

The diameter of the tip 121a of the lower center pin 120a is smaller than the diameter of the substrate support 122a and the center hole of the substrate 300 described later. The diameter of the substrate support portion 122a is larger than the diameter of the center hole of the substrate 300, and smaller than the diameters of the center holes of the mold support portion 123a, the lower mold 200a and the upper mold 200b described later. Moreover, the diameter of the mold support part 123a is larger than the diameters of the center holes of the lower mold 200a and the upper mold 200b and smaller than the diameters of the center hole and the lower opening 151a of the lower mounting table 150a.

The lower UV irradiation unit 130a is electrically connected to the control unit 102 via a signal line (not shown), and the lower transfer layer 301a of the substrate 300 is applied in accordance with a control signal supplied from the control unit 102. The lower transfer layer 301a of the substrate 300 is irradiated with UV light to be cured through the lower opening 151a and the UV light transmission region of the lower mounting table 150a described later. The lower UV irradiation unit 130a may be configured to be retracted except when necessary, such as when UV light is irradiated in the transfer operation.

The lower center pin driving unit 140a moves the lower center pin 120a in the axial direction, that is, in a direction perpendicular to the lower mold holding surface Sa of the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. To do.

In addition, the lower center pin driving unit 140a moves the lower center pin 120a vertically upward when releasing the lower mold 200a and the substrate 300 after a transfer operation described later. In this configuration, the mold is released from the mold 200a.

The lower mounting table 150a has a flat lower mold holding surface Sa for holding the lower mold 200a, and the lower mold holding surface Sa is provided with a center hole in the center portion, and a lower side. A mold holding part 152a and a lower mold clamp 153a are provided. Further, the lower mold holding surface Sa of the lower mounting table 150a is typically configured wider than the pattern area of the lower mold 200a. The lower mounting table 150a is configured to be movable in two-dimensional directions (X, Y) of the lower mold holding surface Sa in order to align the lower mold 200a and the substrate 300.

Of the lower mounting table 150a, at least the region corresponding to the region where the pattern of the lower mold 200a to be mounted is formed is transparent to UV light such as quartz glass, and has a phenotypic change by irradiation with UV light. This is a UV light transmission region made of a material that is difficult to generate. The opening 151a of the lower base 110a is formed in a region corresponding to the UV light transmission region of the lower mounting table 150a.

The lower mold holding part 152a includes a suction part 154a having a suction groove 155a for holding the lower mold 200a by vacuum suction or the like, and an elastic member 156a that supports the suction part 154a.

FIG. 2B shows the lower mounting table 150a upward (more specifically, vertically upward with respect to the lower mold holding surface Sa. Hereinafter, the vertical upper direction or simply upward will be described. It is a schematic diagram which shows arrangement | positioning of each part at the time of seeing from the perpendicular | vertical downward direction or the downward direction.

As shown in FIG. 2B, the suction portion 154a is a groove formed in a corresponding region of the lower mold holding surface Sa so as to perform suction at the outer peripheral edge portion of the lower mold 200a to be placed. Placed inside. The suction portion 154a is preferably configured with, for example, a flexible resin member so as not to damage the lower mold 200a at the contact portion.

The suction groove 155a is configured to be able to suck the lower mold 200a to the suction portion 154a by reducing the atmospheric pressure in the groove by the operation of a decompression mechanism (not shown) such as a connected vacuum pump.

The elastic member 156a is disposed in a groove formed in the lower mold holding surface Sa and supports the suction portion 154a. The elastic member 156a is configured to be able to bias an elastic force between the adsorbing portion 154a and the lower mounting table 150a by a member having elasticity such as a resin or a mechanical structure such as a spring. Due to the presence of the elastic member 156a, the suction portion 154a is pressed vertically downward by, for example, a lower mold clamp 153a to be described later, so that the force for pressing and the elastic force from the elastic member 156a are balanced. Moving.

In addition, it is preferable that the shape of the lower mold holding | maintenance part 152a and the lower stage mounting base 150a is a shape suitable for a deformation | transformation of the lower mold 200a mentioned later.

The lower mold clamp 153a is a specific example of the “first clamp” of the present invention, and is a clamp mechanism provided at the outer peripheral edge portion of the lower mounting table 150a further than the position where the lower mold 200a is mounted. is there. The lower mold clamp 153a is configured to be able to grip the lower mold 200a by pressing the non-pattern area of the lower mold 200a downward with pressure according to a control signal from the control unit 102. Further, the lower mold clamp 153a presses the lower mold 200a with a force stronger than the pressing force required to hold the lower mold 200a in accordance with a control signal from the control unit 102, thereby lowering the lower mold. The lower mold 200a can be elastically deformed together with the elastic member 156a of the holding portion 152a. Hereinafter, the pressing force for holding the mold is described as holding force, and the pressing force for deforming the mold is described as deformation force.

Here, the structure and arrangement of the lower mold clamp 153a will be described with reference to FIG. FIG. 2C is a schematic view of the lower mold clamp 153a in a state where the lower mold 200a is being pressed as viewed from the vertically upward direction, and further illustrates the arrangement position of the upper mold clamp 153b described later. It is a figure. The lower mold clamp 153a is composed of a plurality of arc-shaped members arranged concentrically with the lower mold 200a in accordance with the disk shape in order to press the lower mold 200a.

The upper mold clamp 153b is also composed of a plurality of arc-shaped members arranged on the same circle. Further, as shown in FIG. 2C, the lower mold clamp 153a and the upper mold clamp 153b are configured such that respective arc-shaped fan-shaped members are mutually inserted and are parallel to the lower mold holding surface Sa. Even when projecting onto a surface, they are arranged so as not to overlap each other.

Subsequently, returning to FIG. 1, the upper mechanism B will be described.

The upper mechanism B is provided on the lower surface of the upper base 110b, and includes an upper center pin 120b, an upper UV irradiation unit 130b, an upper center pin driving unit 140b, an upper mounting table 150b, an upper mold holding unit 152b, And an upper mold clamp 153b.

The upper base 110b is a member on the board, and is provided with an upper mounting table 150b and an upper opening 151b, and there is a screw hole portion in which a screw groove into which the ball screw 101 is screwed is cut.

The upper center pin 120b is a cylindrical member having a tip portion having a diameter similar to that of the substrate support portion 122a of the lower center pin 120a. The upper center pin 120b is connected to an upper center pin driving unit 140b, which will be described later, and penetrates a center hole and an upper opening 151b of the upper mounting table 150b, which will be described later. It is supported so as to be perpendicular to the mold holding surface Sb.

The upper UV irradiation unit 130b is electrically connected to the control unit 102 via a signal line (not shown) and the like, and the upper transfer layer 301b of the substrate 300 is cured in accordance with a control signal supplied from the control unit 102. The upper transfer layer 301b of the substrate 300 is irradiated with UV light through the upper opening 151b and a UV light transmission region of the upper mounting table 150b described later. The upper UV irradiation unit 130b may be retracted except when necessary, such as when UV light is irradiated in the transfer operation.

The upper center pin driving unit 140b moves the upper center pin 120b in the axial direction, that is, in a direction perpendicular to the upper mold holding surface Sb of the upper mounting table 150b in accordance with a control signal supplied from the control unit 102.

Further, the upper center pin driving unit 140b presses the upper center pin 120b in the vertical downward direction when the upper mold 200b and the substrate 300 after the transfer operation described later are released, thereby causing the vertical position of the substrate 300 to move. Is fixed.

The upper mounting table 150b has a flat upper mold holding surface Sb for holding the upper mold 200b. The upper mold holding surface Sb is provided with a center hole in the center portion, and the upper mold holding portion 152b. An upper mold clamp 153b is provided. In addition, the upper mold holding surface Sb of the upper mounting table 150b is typically configured to be wider than the pattern region of the upper mold 200b. The upper mounting table 150b is configured to be movable in two-dimensional directions (X, Y) of the upper mold holding surface Sb in order to align the upper mold 200b and the substrate 300.

Of the upper mounting table 150b, at least a region corresponding to a region where the pattern of the upper mold 200b to be mounted is formed transmits UV light such as quartz glass, and changes in characteristics are caused by irradiation of the UV light. This is a UV light transmission region made of a difficult material. The opening 151b of the upper base 110b is formed in a region corresponding to the UV light transmission region of the upper mounting table 150b.

The upper mold holding part 152b includes a suction part 154b having a suction groove 155b for holding the upper mold 200b by vacuum suction or the like, and an elastic member 156b that supports the suction part 154b. Each of the suction portion 154b, the suction groove 155b, and the elastic member 156b has the same configuration as the suction portion 154a, the suction groove 155a, and the elastic member 156a of the upper mechanism portion A.

The upper mold clamp 153b is a specific example of the “second clamp” of the present invention, and is a clamp mechanism provided on the outer peripheral edge portion of the upper mounting table 150b further than the position where the upper mold 200b is mounted. The upper mold clamp 153b is configured to be able to hold the upper mold 200b by pressing the non-pattern area of the upper mold 200b upward with pressure according to a control signal from the control unit 102. Further, the upper mold clamp 153b presses the upper mold 200b with a force stronger than the pressing force necessary to hold the upper mold 200b in accordance with a control signal from the control unit 102, so that the upper mold holding unit 152b The upper mold 200b can be elastically deformed together with the elastic member 156b.

The control unit 102 is an information processing device such as a CPU (Central Processing Unit), for example, and the lower UV irradiation unit of the lower mechanism unit A according to an input signal indicating a user instruction supplied from the operation unit 103. 130a, the lower center pin driving unit 140a and the lower mold clamp 153a, the upper UV irradiation unit 130b of the upper mechanism B, the upper center pin driving unit 140a and the upper mold clamp 153b, and the control for controlling the operation of each part of the actuator 104. Supply the signal.

The operation unit 103 includes a plurality of buttons or a keyboard that can input an instruction by the user, and supplies an input signal corresponding to the input user instruction to the control unit 102. The control unit 102 reads an operation processing program stored in an internal memory or the like according to the input signal, generates a control signal according to the instruction, and supplies the control signal to each unit.

The actuator 104 is a mechanism such as a motor that can move the upper mounting table 150b toward or away from the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. Specifically, the actuator 104 rotates the ball screw 101 in accordance with a control signal supplied from the control unit 102, whereby the upper base 110b engaged with the ball screw 101 is changed to the upper mounting base 150b and the lower mounting base. It moves in the vertical direction while maintaining the parallel positional relationship with 150a. At this time, for example, four ball screws 101 are provided so as to connect the four corners of the lower base 110a and the upper base 110b, and a plurality of actuators 104 are also provided to rotate the corresponding ball screws 101. Yes.

According to such an operation of the actuator 104, by moving the upper base 110b in the vertical upward direction, the upper mounting base 150b is separated from the lower mounting base 150a, and the upper base 110b is moved in the vertical downward direction. Thus, the upper mounting table 150b comes close to the lower mounting table 150a.

The actuator 140 moves the upper mounting table 150b vertically downward in a transfer operation described later, thereby pressing the upper mold 200b and the substrate 300 to each other, and further pressing the lower mold 200a and the substrate 300 to each other. To do.

The actuator 104 moves the upper mold table 150b vertically upward while holding the upper mold 200b when the upper mold 200b and the substrate 300 after the transfer operation described later are released. Release from the substrate 300.

FIG. 3 is a schematic transmission diagram when the lower base 110a, the lower mechanism A, and the surrounding configuration are viewed from the vertically upward direction. Note that FIG. 3 does not show the lower mold holding portion 152a and the lower mold clamp 153a provided on the lower mounting table 150a.

As shown in FIG. 3, in the imprint apparatus 1, four pole screws 101 are screwed into the four corners of a square lower base 110a, and the bottom is a square at the center and smaller in area than the lower base 110a. A side mounting table 150a is arranged. In addition, a circular opening 151a is formed in a central portion of the lower base 110a and at least a portion corresponding to a pattern region of the lower mold 200a placed on the lower placement base 150a. A lower UV irradiation part 130a is formed below the part 151a.

The actuator 104 is connected to each of the pole screws 101 arranged at the four corners of the lower base 110a, and the pole screws are rotated based on a control signal from the control unit 102.

The upper base 110b and the upper mechanism B are also configured in the same manner as the lower base 110a and the lower mechanism A, and are vertically upward from the lower base 110a at the four corners of the square upper base 110b. Four pole screws 101 extending in the direction are screwed together.

(2) Arrangement Example of Ball Screw and Mold Clamp Next, the positional relationship between the ball screw 101, the lower mold clamp 153a, and the upper mold clamp 153b in the present embodiment will be described with reference to FIGS. 4 to 6 are views when the lower mounting table 150a of the imprint apparatus 1 is viewed from vertically above as in FIG. FIGS. 4 to 6 show the positional relationship of the lower mold clamp 153a that holds the lower mold 200a, and the arrangement position of the upper mold clamp 153b that holds the upper mold 200b in an overlapping manner. FIGS. 4 to 6 show configuration examples in the case where four, three, and two ball screws 101 for connecting the lower base 110a and the upper base 110b are provided in order. In FIGS. 4 to 6, in order to make it easy to visually recognize the characteristic configuration, the description of the members relatively thin with the arrangement example of the ball screw 101 and the lower mold clamp 153 a and the upper mold clamp 153 b is omitted. is doing.

In the configuration example shown in FIG. 4, ball screws 101 are arranged at the four corners of the lower base 110a, as in FIG. In FIG. 4, the four ball screws are denoted as

ball screws

101a, 101b, 101c, and 101d, respectively. As shown in FIG. 4, the lower mold clamp 153a is arranged in three locations so as to press the outer edge portion of the lower mold 200a in accordance with the shape of the lower mold 200a. Similarly, the upper mold clamp 153b is also arranged in three locations so as to press the outer edge portion that is concentric with the upper mold 200b and has an arc shape of the upper mold 200b in accordance with the shape of the upper mold 200b.

As shown in FIG. 4, when four ball screws 101a-d are used, the ball screws 101a-d are usually arranged at the four corners of the lower base 110a with the center of the mold 200a attached to the transfer device as the center. . In the transfer operation, when the lower base 110a and the upper base 110b are pressed, a force is applied to the respective movement axes of the ball screws 101a-d, and the movement axes of the respective ball screws 101a-d. The pressing force concentrates at a position (that is, a predetermined location on the lower mounting table 150a and the upper mounting table 150b) that is the center of the. For this reason, a strong pressing force acts on the line connecting the movement axis of 101a-d and the central position as compared with other parts. Hereinafter, the center position will be referred to as a pressure surface center region. In particular, the corresponding position on the upper mounting table 150b is the first pressing surface center region, and the corresponding position on the lower mounting table 150a is the second. This is referred to as a pressure surface center region.

In the example shown in FIG. 4, the lower mold clamp 153a includes the center position of the ball screw 101a-d on the lower mold holding surface Sa (that is, a predetermined position on the lower mounting table 150a) and the ball screw 101a-d, respectively. It is not arranged on the line (dotted line part) connecting with the center of. Similarly, the upper mold clamp 153b is not on a line connecting the center position of the ball screw 101a-d on the upper mold holding surface Sb (that is, a predetermined position on the upper mounting table 150b) and the center of each of the ball screws 101a-d. Not placed. Accordingly, the lower mold clamp 153a and the upper mold clamp 153a and the upper mold clamp line 153a are arranged on a line connecting the position where the ball screw 101a-d applies a force for pressing the lower base 110a and the upper base 110b and the center position of the ball screw 101a-d. The mold clamps 153b do not apply pressing force to the corresponding molds. Therefore, for example, even when a force for elastic deformation is applied to the corresponding mold by the mold clamp 153a and the upper mold clamp 153b when the lower base 110a and the upper base 110b are pressed, the mold It is possible to prevent local concentration of stress in the interior, and it is possible to suitably suppress the influence of mold breakage and the like.

Further, in a more preferable configuration that follows the above-described features, it corresponds to a region where the ball screw 101a-d and the lower mounting table 150a are engaged (that is, the diameter of each ball screw 101a-d on the lower mounting table 150a). Region) and a region having the same diameter as the ball screw 101a-d in the pressure surface central region (that is, the second pressure surface central region) of the lower mounting table 150a (a specific example of the second region of the present invention) 4 is a lower mold clamp 153a. Similarly, a region where the ball screw 101a-d and the upper mounting table 150b are engaged (that is, a region corresponding to the diameter of each ball screw 101a-d on the upper mounting table 150b) and the center of the pressing surface of the upper mounting table 150b. Outside the region (that is, the first pressure surface center region) having the same diameter as the ball screw 101a-d (a specific example of the first region of the present invention, which is shown as a shaded portion in FIG. 4), An upper mold clamp 153b is preferably installed.

Here, the center area of the pressing surface of the mold 200a corresponds to the intersection (area shown as a circle in FIG. 4) of the area connecting the ball screw 101a and the ball screw 101c and the area connecting the ball screw 101b and the ball screw 101d. In other words, it can be said that the region is at the same distance from each of the ball screws 101a to 101d. The same applies to FIGS. 5 and 6 described later.

In the configuration example shown in FIG. 5, the three

ball screws

101e, 101f, 101g are arranged in a triangle centered on the center of the lower base 110a. At this time, similarly to the example shown in FIG. 4, the lower mold clamp 153a includes the center position of the ball screw 101e-g on the lower mold holding surface Sa (that is, a predetermined position on the lower mounting table 150a), the ball screw 101e-g is not arranged on a line (dotted line portion) connecting with the center of each. Similarly, the upper mold clamp 153b is not on a line connecting the center position of the ball screw 101e-g (that is, a predetermined position on the upper mounting table 150b) on the upper mold holding surface Sb and the center of each of the ball screws 101e-g. Not placed.

More preferably, a region where the ball screw 101e-g and the lower mounting table 150a are engaged (that is, a region corresponding to the diameter of each ball screw 101e-g on the lower mounting table 150a), and a lower mounting table. An area having the same diameter as that of the ball screw 101e-g in the center area of the pressure surface in the mounting table 150a (that is, the center area of the second pressure surface) is a specific example of the second area of the present invention and is shown as a shaded portion in FIG. The lower mold clamp 153a is installed outside. Similarly, a region where the ball screw 101e-g and the upper mounting table 150b are engaged (that is, a region corresponding to the diameter of each ball screw 101e-g on the upper mounting table 150b) and the center of the pressing surface of the upper mounting table 150b. Outside the region (that is, the first pressing surface center region) having the same diameter as the ball screw 101e-g (a specific example of the first region of the present invention, which is shown as a shaded portion in FIG. 5), An upper mold clamp 153b is preferably installed.

In the configuration example shown in FIG. 6, two ball screws 101h and 101i are arranged at the outer edge portion sandwiching the center of the lower base 110a. At this time, similarly to the example shown in FIG. 4, the lower mold clamp 153a includes the center position of the ball screw 101h-i on the lower mold holding surface Sa2 (that is, a predetermined position on the lower mounting table 150a), the ball screw It is not arranged on the line (dotted line portion) connecting the respective centers of 101h-i. Similarly, the upper mold clamp 153b is not on a line connecting the center position of the ball screw 101h-i on the upper mold holding surface Sb (that is, a predetermined position on the upper mounting table 150b) and the center of each ball screw 101h-i. Not placed.

More preferably, a region where the ball screw 101h-i and the lower mounting table 150a are engaged (that is, a region corresponding to the diameter of each ball screw 101h-i on the lower mounting table 150a), and the lower mounting table 150a. An area having the same diameter as the ball screw 101h-i in the center area of the pressure surface in the mounting table 150a (that is, the second pressure surface center area) is a specific example of the second area of the present invention and is shown as a shaded portion in FIG. The lower mold clamp 153a is installed outside. Similarly, a region where the ball screw 101h-i and the upper mounting table 150b are engaged (that is, a region corresponding to the diameter of each ball screw 101h-i on the upper mounting table 150b) and the center of the pressing surface of the upper mounting table 150b. Outside the region (that is, the first pressing surface center region) having the same diameter as the ball screw 101h-i (a specific example of the first region of the present invention, which is shown as a shaded portion in FIG. 6), An upper mold clamp 153b is preferably installed.

The arrangement of the ball screw and the lower and upper mold clamps employed in the imprint apparatus 1 shown in FIG. 1 may be any of those shown in FIGS. 4 to 6 and follows the above-described features. As long as the configuration includes other number of ball screws, a configuration may be adopted. The predetermined location on the stage is not limited to the center position of the arranged ball screw. The predetermined location includes the position where the pressing force is concentrated on the stage and the position where the pressing force is first received on the stage. You may adopt.

(3) Basic Operation Example Next, a series of transfer operations performed by the imprint apparatus 1 will be described with reference to FIGS. FIG. 7 is a flowchart showing a series of transfer operations by the imprint apparatus 1. FIG. 8 to FIG. 9 are schematic views showing the operation of each part of the imprint apparatus 1 in each process during the transfer operation.

Here, the flow of the operation shown in the flowchart of FIG. 7 will be described with reference to the operation of each part of the imprint apparatus 1 shown in FIGS. In FIGS. 8 to 9, the same components as those in the schematic diagram shown in FIG. 1 are denoted by the same reference numerals, and some of the thin members related to the operation to be described are partially described. The illustration is omitted.

In the flow of the transfer operation, first, the upper mold 200b is attached to the initial imprint apparatus 1 (FIG. 8 [State 1]) in which none of the upper mold 200b, the lower mold 200a, and the substrate 300 is installed. (Step S101). More specifically, in step S101, first, the upper mold 200b is moved by the operation of a mold conveying device (not shown) such that the tip 121a of the lower center pin 120a penetrates the center hole of the upper mold 200b. It is installed on the mold support part 123a of the side center pin 120a (FIG. 8 [state 2]).

Subsequently, the control unit 102 operates the actuator 104 to vertically move the upper mounting table 150b so that the upper mold holding surface Sb of the upper mounting table 150b is in contact with the upper surface of the upper mold 200b (that is, the back surface of the pattern surface). Move down. After the upper mounting table 150b and the upper mold 200b come into contact with each other, the control unit 102 operates a decompression unit (not shown) to adsorb and hold the upper mold 200b on the adsorption unit 154b of the upper mounting table 150b. Further, a control signal is transmitted to the upper mold clamp 153b, and the upper mold 200b is pressed vertically upward to be fixed to the upper mounting table 150b (FIG. 8 [State 3]). Thereafter, the control unit 102 operates the actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction (FIG. 8 [state 4]).

Subsequently, the lower mold 200a is attached to the imprint apparatus 1 (step S102). More specifically, in step S102, first, the lower mold 200a is moved in such a manner that the front end portion 121a of the lower center pin 120a penetrates the center hole of the lower mold 200a by an operation of a not-shown mold conveyance device or the like. The lower center pin 120a is installed on the mold support part 123a (FIG. 8 [state 5]).

Subsequently, the control unit 102 operates the lower center pin driving unit 140a so that the lower mold holding surface Sa of the lower mounting table 150a contacts the lower surface of the lower mold 200a (that is, the back surface of the pattern surface). The lower center pin 120a is moved vertically downward. After the lower mounting table 150a and the lower mold 200a come into contact with each other, the control unit 102 operates a decompression unit (not shown) to adsorb the upper mold 200a to the adsorption unit 154a of the lower mounting table 150a and hold it. Let Further, a control signal is transmitted to the lower mold clamp 153a, and the lower mold 200a is pressed vertically downward to be fixed to the lower mounting table 150a (FIG. 8 [State 6]).

Next, by the operation of a substrate transfer device (not shown), the substrate 300 is placed on the substrate support portion 122a of the lower center pin 120a so that the tip 121a of the lower center pin 120a penetrates the center hole of the substrate 300. (Step S103, FIG. 8 [State 7]). At this time, the control unit 102 may align the lower mold 200a and the upper mold 200b with the substrate 300 as necessary.

Subsequently, the control unit 102 transmits a control signal to the lower mold clamp 153a, and gradually increases the force pressing the lower mold 200a from the holding force to the deforming force, thereby deforming the lower mold 200a.

At the same time or before and after, the control unit 102 transmits a control signal to the upper mold clamp 153b, and gradually increases the force pressing the upper mold 200b from the pressing force to the deformation force, thereby deforming the upper mold 200b. (Step S104, FIG. 8 [State 8]).

Subsequently, the control unit 102 operates the lower center pin driving unit 140a to move the lower center pin 120a vertically downward, and the pattern of the lower transfer layer 301a and the lower mold 200a to be supported is supported. The surface is brought into contact (step S105, FIG. 9 [state 9]). Further, the control unit 102 operates the actuator 104 to move the upper mounting table 150b vertically downward to bring the pattern surface of the upper mold 200b into contact with the upper transfer layer 301b of the substrate 300 (FIG. 9 [state] 10]).

As described above, when deformation such as bending occurs in the mold, when the mold comes into contact with the transfer layer, contact is sequentially made from the side closer to the transfer layer on the pattern surface of the mold that is inclined due to deformation. To do. For example, when the central part of the pattern surface of the mold is bent by the pressing force of the mold clamp so as to be closer to the transfer layer, the mold sequentially contacts the peripheral part from the central part when contacting the transfer layer. .

The deformation of each mold and the contact with the substrate 300 may be performed in the above-described order. Also, the deformation of the lower mold 200a, the contact between the lower mold 200a and the substrate 300, the deformation of the upper mold 200b, You may perform from one side in the order of contact with the upper mold 200b and the board | substrate 300. FIG.

After the contact between each mold and the substrate 300, the control unit 102 transmits a control signal to the lower mold clamp 153a and the upper mold clamp 153b, and gradually reduces the pressing force pressing each mold from the deformation force to the holding force. The deformation of each mold is released (step S106).

Next, the control unit 102 operates the actuator 104 to move the upper mounting table 150 b vertically downward, and the upper mold 200 b is moved to the upper transfer layer 301 b on the upper surface of the substrate 300, and the lower mold 200 a is moved to the lower surface of the substrate 300. The lower transfer layer 301a is pressed with a predetermined pressing force (step S107). Further, the control unit 102 emits UV light from the lower UV irradiation unit 130a and the upper UV irradiation unit 130b in order to cure the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 while maintaining the pressed state. Let By this operation, the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 are cured in accordance with the pattern formed on the surface of each mold, and the pattern is transferred (step S108, FIG. 9 [state 11]). In addition, it is preferable that the pressure and pressing time during pressing, the intensity of UV irradiation, and the irradiation time are appropriately set according to the characteristics of the transfer layer.

After a series of operations related to transfer such as a predetermined pressing time and UV irradiation is completed, a mold release process for releasing the lower mold 200a and the upper mold 200b from the substrate 300 is performed.

In the mold release operation, the control unit 102 first stops the operation of the actuator 104 that presses the upper mounting table 150b, and releases the pressing state between each mold and the substrate 300. At the same time or before and after, the control unit 102 operates the upper center pin driving unit 140b so that the tip of the upper center pin presses the substrate 300 vertically downward at a predetermined pressure (step S109, FIG. 9 [ State 12]).

Subsequently, the control unit 102 performs the deformation of the lower mold 200a and the upper mold 200b by the same operation as the above-described step S104 (step S110, FIG. 9 [state 13]). At this time, the pressing force of each mold clamp is controlled to gradually increase from the holding force to the deformation force.

As shown in FIG. 9 [State 13], a part of the contact surface between each mold and the substrate 300 is peeled off according to the deformation of the mold, and a gap is generated. When such a gap exists on the contact surface, it becomes a mold release start point in the subsequent mold release, and the adhesion force acting between the mold and the transfer layer of the substrate is reduced.

Subsequently, the control unit 102 operates the upper center pin 120b actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction. At this time, the upper mold 200b moves vertically upward while being held by the upper mounting table 150b, while the substrate 300 is pressed vertically downward (in other words, fixed) by the upper center pin 120b. Therefore, the upper mold 200b and the upper transfer layer 301b of the substrate 300 are released (step S111, FIG. 9 [state 14]). At this time, the control unit 102 fixes the position of the lower center pin 120a and controls the force with which the upper center pin 120b presses the substrate 300 in the vertical downward direction by torque control.

Next, the control unit 102 holds the upper center pin 120b and the lower center pin 120a holding the substrate 300 up to the initial position of the lower center pin 120a in the vertical upward direction while maintaining the state in which the substrate 300 is held. The lower mold 200a and the substrate 300 are released from each other (step S112, FIG. 9 [state 15]).

After the mold release, the control unit 102 changes the pressing force of the upper mold clamp 153b and the lower mold clamp 153a to the holding force for holding the mold, and releases the deformation of the lower mold 200a and the upper mold 200b. (Step S113, FIG. 9 [State 16]).

The substrate 300 released from the lower mold 200a and the upper mold 200b is removed from the lower center pin 120a by an operation of a substrate transfer device (not shown) (step S114). In addition, when performing transfer using the same lower mold 200a and upper mold 200b for another substrate 300 (step S115: No), the steps from step S103 to step S114 for placing the substrate 300 are performed. Run repeatedly. After all the transfer is completed (step S115: Yes), the lower mold 200a is removed (step S116) and the upper mold 200b is removed (step S117) by an operation of a mold conveyance device (not shown).

According to the configuration described above, according to the imprint apparatus 1 that is an embodiment of the transfer apparatus of the present invention, the pattern formed on the surface of the lower mold 200a is transferred to the lower transfer surface 301a of the substrate 300. Then, the pattern formed on the surface of the upper mold 200b is transferred to the upper transfer surface 301b.

In the transfer operation by the imprint apparatus 1, when the lower mold 200a and the upper mold 200b are pressed against the substrate 300 (FIG. 7, step S106), the actuator 104 rotates the ball screw 101 under the control of the control unit 102. Thus, the upper base 110b approaches the lower base 110a. Accordingly, when pressed, a pressing force acts along the axis of the ball screw 101 arranged at the peripheral edge of each base as shown by the black arrow in FIG. Specifically, the lower base 110a receives a pressing force from the vertically upward direction, and the upper base 110b receives a pressing force from the vertically downward direction. Due to such pressing force, the entire lower base 110a is pressed against the entire upper base 110b.

At this time, the center positions of the lower mold 200a and the upper mold 200b, and the center positions (that is, predetermined positions on the lower mounting table 150a and predetermined positions on the upper mounting table 150b) and the respective axial centers of the ball screws 101 A stronger pressing force acts on the line connecting the two than the other parts. For example, in the example shown in FIG. 10 (b), the lower base 110a is pressed against the upper base 110b by a stronger pressing force than other parts in the region indicated by the alternate long and short dash line and the shaded portion. Is done.

On the other hand, in the transfer operation by the imprint apparatus 1, the lower mold 200a is pressed toward the lower mounting table 150a by the lower mold clamp 153a that prevents air bubbles from entering the transfer layer, and the upper mold 200b is pressed by the upper mold clamp 153b. It is pressed toward the upper mounting table 150b. At this time, as indicated by the dotted arrow in FIG. Specifically, the lower mold 200a receives a mold clamp pressing force directed vertically downward by the lower mold clamp 153a, while the upper mold 200b receives a mold clamp pressing force directed vertically upward by the upper mold clamp 153b. Receive.

As shown in FIG. 10 (a), two pressing forces acting in opposite directions act on the mold, and stress concentrates on the portion pressed by the mold clamp. In particular, when the mold clamp is elastically deforming the mold, the stress may be further concentrated so as to cancel the deformation by pressing the lower base 110a and the upper base 110b.

FIG. 10B is a diagram showing a case where a mold clamp is arranged on a line connecting the center position of each ball screw 101 and the center of each ball screw 101, unlike the examples shown in FIGS. is there. In FIG. 10B, the lower mold clamp 153a and the upper mold clamp 153b surrounded by black circles press the respective molds on the line (dotted line) connecting the center and the center position of each ball screw 101. ing.

For this reason, a stronger stress is concentrated in the mold parts pressed by the mold clamps surrounded by the black circles in FIG. Therefore, a technical problem arises that the mold is easily damaged at the portion due to the concentration of the stronger stress.

In the imprint apparatus 1 according to the present embodiment, as shown in FIGS. 4 to 6, the mold clamp has the center and center position of each ball screw 101 (that is, a predetermined place on the lower mounting table 150 a and an upper mounting table). Since the arrangement is made so as to avoid the line connecting the predetermined portion on 150b, it is possible to avoid such excessive stress concentration. Therefore, the possibility of damage to the mold can be suppressed, and a more stable transfer operation can be realized.

In addition, as a modification, for example, a configuration may be provided that includes position detection means such as a camera and position changing means for changing the arrangement position of the mold clamp (for example, a mechanical mechanism for rotating or linearly moving the mold clamp). . In this configuration, at the time of the transfer operation, the center position of the lower mold 200a and the line connecting the center position (that is, a predetermined position on the lower mounting table 150a) and the center of each axis of the ball screw 101, or on the line The lower mold clamp 153a is disposed at a position avoiding the region including the peripheral region of the upper mold 200b, the center position of the upper mold 200b, and the center position (that is, a predetermined position on the upper mounting table 150b) and the respective axes of the ball screw 101. It is preferable that the position changing means is controlled so that the upper mold clamp 153b is arranged at a position avoiding the area including the peripheral area on the line connecting the center and moving the mold clamp itself.

(4) First Modification Next, a basic configuration of an imprint apparatus 1 ′, which is a first modification of the transfer apparatus according to the present invention, will be described with reference to FIG. FIG. 11 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 ′ which is a first modification of the transfer apparatus of the present invention.

The imprint apparatus 1 shown in FIG. 11 is configured with a lower mold 200a with respect to a lower transfer layer 301a configured on the lower surface of a substrate 300 ′ that is a transfer target (in other words, arranged facing downward). 2 is a transfer device for transferring a pattern formed on the substrate. In addition, in this modification and FIG. 11, about the structure similar to the imprint apparatus 1 shown by FIG. 1, the same number is attached | subjected and description is abbreviate | omitted.

As shown in FIG. 1, the imprint apparatus 1 includes a lower mechanism part A including a lower base 110a, an upper mechanism part B ′ including an upper base 110b, a lower base 110a and an upper base 110b. A ball screw 101 to be connected, an actuator 104 for rotating the ball screw, a control unit 102 for controlling the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation capable of inputting a user instruction to the control unit 102 Unit 103.

Note that the imprint apparatus 1 ′ shown in FIG. 11 shows a state where the lower mold 200 a and the substrate 300 ′ are installed. The lower mold 200a is held on the lower mounting table 150a of the lower mechanism portion A so that the surface on which the pattern is formed faces upward. Further, the upper base 110b has a pressing portion 120b so as to form a convex portion with respect to the lower mold holding surface Sa of the lower mounting table 150a.

The lower mechanism part A has the same configuration as the lower mechanism part A of the imprint apparatus 1 shown in FIG. In particular, the lower mold clamp 153a in the lower mechanism portion A is similar to the one shown in FIG. 4, and the center position of the ball screw 101a-d on the lower mold holding surface Sa (that is, a predetermined position on the lower mounting table 150a). And the ball screw 101a-d are arranged in accordance with the arrangement position of the ball screw 101 so as not to be arranged on a region (stipple portion) connecting the ball screw 101a-d. The position of the lower mold clamp 153a disposed on the lower mounting table 150a is, for example, as shown in FIGS.

On the other hand, the upper mechanism part B 'of the present modification is provided on the lower surface of the upper base 110b, and includes a pressing part 112b, an upper center pin 120b, and an upper center pin driving part 140b.

The pressing portion 112b is a portion provided to form a convex portion downward on the lower surface of the upper base 110b. During the transfer operation, the pressing portion 112b presses the substrate 300 ′ downward by the operation of the actuator 104, so that the lower side Adhere to the mold 200a. The pressing part 112b has a center hole for placing the upper center pin 120b. The pressing portion 112b is flat and preferably has a lower surface that is wider than at least a region where the lower transfer layer 301a of the substrate 300 'is formed.

According to such an imprint apparatus 1 ', the actuator 104 moves the upper base 110b vertically downward, so that the lower surface of the pressing portion 112b presses the substrate 300' vertically downward. Therefore, the lower transfer layer 301a of the substrate 300 'is brought into close contact with the pattern surface of the lower mold 200a, and the pattern is transferred. Further, the actuator 102 moves the upper base 110b vertically upward, so that the pressing force for mutual pressing between the lower mold 200a and the substrate 300 'is released.

Thereafter, under the control of the control unit 102, the lower center pin 120a and the upper center pin 120b are moved vertically upward while holding the substrate 300 ′, so that the substrate 300 ′ is released from the lower mold 200a. To do.

For this reason, according to the imprint apparatus 1 ′, the pattern formed on the surface of the lower mold 200a is transferred to the transfer layer 301a of the substrate 300 ′ while enjoying the same effect as the imprint apparatus 1 described above. I can do it.

The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or concept of the invention that can be read from the claims and the entire specification. Moreover, it is included in the technical scope of the present invention.

1 imprint device,
101 ball screw,
102 control unit,
103 operation unit,
104 actuator,
110a Lower base,
110b upper base,
120a Lower center pin,
120b upper center pin,
130a UV irradiation unit,
130b UV irradiation unit,
140a Lower center pin drive unit,
140b upper center pin drive unit,
141a Lower pressure sensor 141a Upper pressure sensor 150a Lower mounting table,
150b upper mounting table,
151a lower opening,
151b upper opening,
152a Lower mold holding part,
152b Upper mold holding part,
153a Lower mold clamp,
153b Upper mold clamp,
154a adsorption part,
154b adsorption part,
155a suction groove,
155b suction groove,
156a elastic member,
156b elastic member,
200a lower mold,
200b Upper mold,
300 substrates,
301a Lower transfer layer,
301b Upper transfer layer.

Claims

A transfer device for transferring a pattern formed on a mold to a transfer object,
The first stage,
The second stage,
A plurality of shafts provided between the first stage and the second stage;
A first clamp that is provided on the first stage and grips the mold;
The transfer device, wherein the first clamp is disposed outside a predetermined region connecting a central area of a pressure surface, which is a central area of a pressure surface of the mold during transfer, and the shaft.
The pressurization surface center region is a region having the same diameter as the shaft, and the predetermined region is a region connecting the pressurization surface center region and each of the plurality of shafts. Transfer device.
3. The transfer device according to claim 1, wherein the central area of the pressing surface is an area equidistant from the plurality of shafts.
The said 1st clamp fixes the said mold by pressing the said mold in the direction orthogonal to the surface where the said mold of the said 1st stage is mounted. The transfer device according to one item.
5. The transfer device according to claim 1, wherein at least one of the first stage and the second stage moves along the shaft.
6. The transfer device according to claim 1, wherein the first clamp grips an outer edge portion of the mold.
The transfer device according to any one of claims 1 to 6, wherein the first clamp elastically deforms the mold by pressing with a stronger force than the mold is gripped.
A transfer device for transferring a pattern formed on a first mold to a first surface of a transfer object and transferring a pattern formed on a second mold to a second surface of the transfer object;
The first stage,
The second stage,
A plurality of shafts provided between the first stage and the second stage;
The first clamp provided on the first stage and gripping the first mold;
The second clamp provided on the second stage and gripping the second mold;
The first clamp is disposed outside a first region that connects the shaft and the first pressing surface center region, which is a central region of the pressing surface of the first mold during transfer, and the second clamp is used during transfer. The transfer device is arranged outside the second region connecting the second pressure surface central region, which is the central region of the pressure surface of the second mold, and the shaft.
11. The transfer device according to claim 10, wherein the first clamp and the second clamp are in a positional relationship where they do not contact at the time of transfer.
A transfer device for transferring a pattern formed on a mold to a transfer object,
The first stage,
The second stage,
A plurality of shafts provided between the first stage and the second stage;
A first clamp that is provided on the first stage and grips the mold;
The transfer device, wherein the first clamp is disposed outside a predetermined region including a line connecting the predetermined portion on the first stage and the shaft.