WO2011118005A1

WO2011118005A1 - Transfer apparatus and method, and computer program

Info

Publication number: WO2011118005A1
Application number: PCT/JP2010/055248
Authority: WO
Inventors: 正藤縄; 孝幸糟谷; 房男原川
Original assignee: パイオニア株式会社
Priority date: 2010-03-25
Filing date: 2010-03-25
Publication date: 2011-09-29

Abstract

Disclosed is a transfer apparatus (1) which transfers a pattern formed on a mold (200a) to a subject to which the pattern is to be transferred (300). The transfer apparatus is provided with: a first supporting means (120a) which supports the subject from the first direction; a second supporting means (120b) which fixes the subject to the first supporting means by applying a force to the subject, which is supported by means of the first supporting means, from the second direction different from the first direction; and fixing means (102, 144, 146) which fix the position of the first supporting means, while the second supporting means is applying the force to the subject.

Description

Transfer apparatus and method, and computer program

The present invention relates to a technical field of a transfer apparatus, a transfer method, and a computer program that transfer a concavo-convex pattern onto a surface of a transfer target by pressing a mold having a concavo-convex pattern on the surface of the transfer target.

In this type of transfer device, the uneven pattern formed on the mold surface is transferred to the surface of the transfer target. In particular, in one field called nanoimprint technology, it is possible to transfer nano-scale fine uneven patterns. In recent years, a transfer apparatus that simultaneously transfers a pattern onto both surfaces of a transfer target is also known. Patent Documents 1 to 3 each disclose a transfer device capable of realizing such double-sided transfer.

JP 2009-60091 A International Publication No. 2007/067488 JP 2008-12859 A

In the configuration disclosed in the above-mentioned patent document, for example, the transfer target is held from below by a support member fixed to the transfer device, and can be sandwiched by two molds. In such a configuration, the two-sided transfer of the pattern can be performed by pressing the object to be transferred held by the support member from the upper side and the lower side and then pressing it so as to be sandwiched. Thereafter, by separating the mold from the transfer target to the upper side and the lower side, so-called mold release is performed, and the transfer operation is completed.

However, as described above, in the configuration in which the transfer target is simply held by the support member from the lower side, the transfer target is damaged by a pressing force applied from the mold when the mold is pressed or released. May occur.

The present invention has been made in view of the above-described technical problems, and provides a transfer apparatus and method, and a computer program that can realize suitable holding of a transferred object without causing distortion or the like. Is an issue.

In order to solve the above-described problems, a first transfer device of the present invention is a transfer device that transfers a pattern formed on a mold to a transfer target, and supports the transfer target from a first direction. A force applied to the transfer body from a second direction different from the first direction with respect to the support body and the transfer body supported by the first support means; The second support means for fixing the first support means to the first support means, and the fixing means for fixing the position of the first support means while the second support means applies a force to the transfer target.

In order to solve the above problems, the second transfer apparatus of the present invention transfers the pattern formed on the first mold to the first surface of the transfer target, and the pattern formed on the second mold A transfer device for transferring to a second surface of a transfer object, the transfer object holding means for holding the transfer object, a first support means for supporting the transfer object from a first direction, A force is applied to the transferred object from a second direction different from the first direction with respect to the transferred object supported by the first supporting means, thereby to move the transferred object to the first supporting means. And a fixing means for fixing the position of the first support means while the second support means applies a force to the transfer target.

In order to solve the above-described problem, a third transfer device of the present invention is a transfer device that operates in accordance with an instruction from a control device and transfers a pattern formed on a mold to a transfer target. In response to an instruction from the apparatus, a first support means for supporting the object to be transferred from a first direction, and to the object to be transferred supported by the first support means in accordance with an instruction from the control device , Applying a force to the transferred body from a second direction different from the first direction to fix the transferred body to the first supporting means, and following the instructions of the control device Accordingly, the second support means includes a fixing means for fixing the position of the first support means while applying a force to the transfer target.

In order to solve the above problems, a first transfer method of the present invention is a transfer method in a transfer apparatus that transfers a pattern formed on a mold to a transfer target, and the first transfer means is used to transfer the pattern to the transfer target. The first support step for supporting the transfer body from the first direction and the transfer target body supported by the first support means from the second direction different from the first direction. A second supporting step for fixing the transferred body to the first supporting means by applying a force to the first supporting means, and during applying a force to the transferred body in the second supporting step, A fixing step of fixing the position.

In order to solve the above-described problems, the second transfer method of the present invention transfers the pattern formed on the first mold to the first surface of the transfer object, and the pattern formed on the second mold A transfer method in a transfer device for transferring to a second surface of a transfer object, the first support step of supporting the transfer object from a first direction using a first support means, and the first support The transfer target is fixed to the first support unit by applying a force to the transfer target from a second direction different from the first direction with respect to the transfer target supported by the unit. A second support step; and a fixing step of fixing a position of the first support means while applying a force to the transfer target in the second support step.

In order to solve the above problems, a computer program of the present invention is a computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer target, using a first support means, and A first support step for supporting the transfer object from a first direction and the transfer object supported by the first support means from a second direction different from the first direction. A second supporting step of fixing the transferred body to the first supporting means by applying a force to the body, and the first supporting means while applying a force to the transferred body in the second supporting step. And a fixing step of fixing the position of the transfer device.

The operation and other gains of the present invention will be described together with embodiments shown below.

It is a schematic diagram which shows the basic structural example of the imprint apparatus of this invention. It is a schematic diagram which shows the aspect of a mold holding | maintenance by a mold holding means. It is a schematic diagram which shows the shape of the base of an imprint apparatus. It is a schematic diagram which shows the example of a structure and operation | movement of a lower side center pin and a center pin drive part. It is a flowchart which shows a series of flows of the transfer operation by an imprint apparatus. FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. It is a graph which shows the time change of the position of the lower center pin and upper center pin control part in transfer operation. It is a schematic diagram which shows the basic structural example of the 1st modification of an imprint apparatus. It is a schematic diagram which shows the basic structural example of the 2nd modification of an imprint apparatus. It is a schematic diagram which shows the basic structural example of the 3rd and 4th modification of an imprint apparatus.

1st Embodiment which concerns on the transfer apparatus of this invention is a transfer apparatus which transfers the pattern formed in the mold to a to-be-transferred body, Comprising: The 1st support means which supports the said to-be-transferred body from a 1st direction, A force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means, thereby supporting the transfer object to the first support. Second support means for fixing to the means, and fixing means for fixing the position of the first support means while the second support means applies a force to the transfer target.

According to the first embodiment of the transfer device of the present invention, a mold, which is an imprint mold having a pattern formed on the surface thereof, is pressed against the transfer target, so that the pattern on the mold surface is applied to the transfer target. Transcribed.

In the present embodiment, the first support means supports the object to be transferred from the first direction, and the second support means presses the object to be transferred from the second direction, whereby the object to be transferred is held. . The “first direction” is intended to indicate that it is arranged in a predetermined direction which is the “first direction” with respect to the transfer object. That is, the first support means is configured to approach the transfer target from the first direction and to contact and press the transfer target. For example, the “first direction” is a vertically downward direction with respect to the transfer target. On the other hand, the “second direction” is intended to indicate a direction different from the first direction when viewed from the transfer target.

Further, in the present embodiment, the transferred body is fixed to the first supporting means by exerting a force on the transferred body from the second direction while the second supporting means is in contact with the transferred body. For example, the second support unit is configured to press the transfer target member in the first support unit direction from a second direction that is opposite to the first direction in which the first support unit supports the transfer target member. The transferred object is fixed to the first support means.

Also, the position of the first support means is fixed by the operation of the fixing means at least while the second support means applies a force to the transfer target in this way. For example, the fixing means includes a servo unit including a position sensor that detects the position of the first support means and an actuator that moves the first support means, and fixes the position so that the first support means does not move.

Such an operation of the fixing means not only does the first support means not move so that the position of the first support means changes, but also suppresses a change in position due to an external force applied to the first support means. To do. As an example of the external force applied to the first support means, for example, as described in detail later, there is a force applied by the second support means to the transfer target.

Temporarily, in a configuration that does not employ the aspect of the present embodiment described above, in particular, a configuration in which the position of the first support means is not fixed by the fixing means, the transferred object is pressed by the first support means from the first direction, Furthermore, the situation which receives the press by the 2nd support means from the 2nd direction can be considered. For this reason, a pressing force is applied to the transferred body from the first direction and the second direction, and distortion or damage may occur depending on the material or structure of the transferred body.

However, in this embodiment, while the second support unit applies a force to the transfer target, the fixing unit fixes the position of the first support unit, so that the transfer target simultaneously applies the force from a plurality of directions. By receiving it, it is possible to suppress an excessively strong force from acting. In addition, since one of the first support means is fixed and the second support means presses the transfer medium against the first support means, the thickness (that is, the first support means and the second support means It is possible to always realize holding with an appropriate pressing force even for a transfer object having different thicknesses in the sandwiching direction.

In one aspect of the first embodiment of the transfer apparatus according to the present invention, the fixing means is arranged such that the position of the first support means is such that the first support means does not move due to the force applied by the second support means. Fix it.

According to this aspect, the fixing means fixes the position of the first support means so that the first support means does not move by the force applied from the second support means to the first support means via the transfer target. To do. For example, the fixing means holds the first support means with a stronger force than the force applied from the second support means to the first support means via the transfer medium, thereby suppressing the movement of the first support means. . Further, the fixing means has the same strength as the force applied from the second support means to the first support means via the transfer target, and the force in the direction from the first support means toward the transfer target is the first. The first support means may be fixed by adding to the support means.

By configuring in this way, the first support means is prevented from being pushed and moved by the second support means, and the object to be held is held as the first support means and the second support means move. It can suppress suitably that a transfer body moves. For this reason, it is possible to suitably prevent the transfer from being performed during the transfer operation or the release operation so that appropriate transfer cannot be performed.

In another aspect of the first embodiment according to the transfer device of the present invention, the first direction and the second direction are opposite to each other.

In this aspect, the object to be transferred supported by the first support means is pressed in the direction of the first support means by the second support means, so that the object to be transferred can be held and a suitable holding can be realized. For this reason, it is possible to hold the transfer object firmly with a relatively simple configuration.

In another aspect of the first embodiment of the transfer apparatus according to the present invention, the transfer target is a disk substrate having a through hole, and the first support means is configured to provide the through hole on one surface of the disk substrate. The second support means applies a force at the peripheral portion of the through hole on the other surface of the disk substrate in contact with the peripheral portion to support the transferred object.

According to this aspect, the first support means and the second support means make contact with and support the peripheral portion of the through hole formed in the transfer body to hold the transfer body. Here, the through-hole is an opening formed continuously from one surface of the transfer target to the other surface on the opposite side.

In this aspect, the first support means is configured such that the first support means supports the peripheral portion of the through hole on one surface, and the second support means is the first support means from the peripheral portion of the through hole on the opposite surface. The object to be transferred is held by pressing in the direction. For this reason, it is possible to hold the transfer object firmly with a relatively simple configuration.

In another aspect of the first embodiment of the transfer apparatus of the present invention, the transfer device further includes a first drive unit that moves the first support unit, and a second drive unit that moves the second support unit. The second driving unit moves the second support unit in the direction of the transfer target, thereby pressing the transfer target against the first support and fixing the transfer target to the first support.

According to this aspect, the first supporting means moved by the first driving means supports the transfer target body from the first direction, and the second supporting means moved by the second driving means is covered by the second direction. By supporting the transfer body, it is possible to hold the transfer body. The first driving means of this aspect includes an actuator configured to move the first support means, and the second driving means includes an actuator configured to move the second support means in the same manner. It is the composition which includes.

In such a configuration, proper holding is not always performed due to a difference between a mechanism for moving the first support means in the first drive means and a mechanism for moving the second support means in the second drive means. There is. For example, if there is a difference in the pressing force between the two support means due to the difference between the mechanisms, the transfer medium and the other support means are pushed by the one support means having a large pressing force. At this time, a large pressing force acts on the member to be transferred, and there is a possibility that damage such as distortion may occur depending on the material and structure of the member to be transferred.

On the other hand, in this aspect, even if a difference occurs in the mechanism between the first drive means and the second drive means, the position of the first support means moved by the first drive means is fixed, The fixing is performed by pressing the transfer medium against the first support means by the second support means moved by the two drive means. For this reason, the force applied to the transfer object is basically due to the second driving means, and it is possible to suitably suppress the transfer object from being distorted or damaged by the action of excessive force.

The first driving means includes a braking unit for braking the operation of the first driving means itself or the operation of the first supporting means moved by the first driving means, and fixing the first supporting means. May be. Such a braking unit is, for example, an electromagnetic brake or the like provided in the actuator of the first drive means, and applies a frictional force to the rotor in the actuator in response to the supply of current to brake the actuator drive. 1 Support means is fixed.

Further, the second driving means may include a control unit for controlling the force applied by the second support means to the transfer target. Such a control part controls the rotational torque of the actuator of the 2nd drive means by adjusting the electric current supplied to the actuator of the 2nd drive means, for example, and controls the force which a 2nd support means applies.

In addition, each of the first driving unit and the second driving unit in this aspect is not limited to the configuration as long as the various operations described above can be realized, and may have a configuration other than the above, and any known It may be configured as follows.

In another aspect of the first embodiment of the transfer apparatus of the present invention, the transfer device further includes control means for controlling the force applied to the transfer target by the second support means.

According to this aspect, the control unit controls the force applied by the second support unit to the transfer target so that it typically does not exceed a preset threshold value. For this reason, according to this aspect, the first support means whose position is fixed in the first direction is arranged, and the object to be transferred is transferred by the second support means in which the pressing force is appropriately adjusted from the direction opposite to the first direction. By pressing the body, the object to be transferred can be held by being sandwiched.

In this aspect, the force that the second support means applies to the transfer target is preferably capable of holding the transfer target sufficiently and being held between the first support and the second support. It is set to such an extent that distortion and damage do not occur on the transfer body. Therefore, the threshold value that is the upper limit of such force is set with a sufficient margin for the upper limit force that causes distortion or damage to the transferred body, at least according to the characteristics of the material and structure of the transferred body. It is preferable.

With such a configuration, it is possible to always hold the plurality of types of transferred objects having different thicknesses in the direction sandwiched between the first support means and the second support means by appropriate pressing force. .

In another aspect of the first embodiment of the transfer apparatus of the present invention, the control means controls the position of the second support means so that the second support means approaches a predetermined distance from the transfer target. And after the second support means approaches the predetermined distance, control of the pressing force of the second support means is started.

According to this aspect, the control means is configured such that the force that the second support means applies to the transferred body until the second support means approaches a predetermined distance from the transferred body (in other words, the second support means is transferred to the transferred body). Do not start control of thrust to move in the body direction. Therefore, the control unit controls the movement of the second support unit by, for example, position control based on the position of the second support unit until the second support unit approaches a predetermined distance from the transfer target.

With this configuration, the second support unit moves by position control of the control unit until it approaches the vicinity of the transfer target. Further, when approaching to a predetermined distance, the control unit controls the operation so that the force controlled as described above is applied to the second support unit.

In the second embodiment of the transfer apparatus of the present invention, the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the first surface of the transfer object. A transfer device for transferring to the second surface, a transfer object holding means for holding the transfer object, a first support means for supporting the transfer object from a first direction, and a first support means. A second force fixing the transferred body to the first support means by applying a force to the transferred body from a second direction different from the first direction with respect to the supported transferred body. A support unit; and a fixing unit that fixes a position of the first support unit while the second support unit applies a force to the transfer target.

According to the second embodiment of the transfer apparatus of the present invention, it has means for holding two molds, a first mold holding means for holding the first mold and a second mold holding means for holding the second mold. . Of these two molds, the first mold was pressed against the first surface of the transferred body and the second mold was pressed against the second surface of the transferred body, thereby forming each mold. Pattern transfer is performed on both sides of the transfer object. At this time, each pressing may be performed in succession, or may be performed simultaneously. For example, when using a transfer object in which the first surface and the second surface are provided on opposite sides, the transfer object is sandwiched between the first mold and the second mold, and the transfer is performed simultaneously by pressing from both surfaces. You may do it.

Furthermore, according to the second embodiment of the transfer device of the present invention, various effects similar to those of the first embodiment of the transfer device of the present invention described above can be enjoyed.

In the third embodiment related to the transfer device of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

The third embodiment according to the transfer device of the present invention is a transfer device that operates in accordance with an instruction from a control device and transfers a pattern formed on a mold to a transfer target, and in response to an instruction from the control device. The first support means for supporting the transfer body from the first direction, and the first transfer means supported by the first support means in response to an instruction from the control device A second support means for fixing the transfer body to the first support means by applying a force to the transfer body from a second direction different from the direction; and the second support means according to an instruction from the control device. And a fixing unit that fixes the position of the first supporting unit while the supporting unit applies a force to the transfer target.

According to the third embodiment of the transfer device of the present invention, operations similar to those in the first embodiment of the transfer device of the present invention described above are performed based on instructions from a control device connected to the transfer device. It can be implemented. For this reason, according to 3rd Embodiment which concerns on the transfer apparatus of this invention, the various effects similar to 1st Embodiment which concerns on the transfer apparatus of this invention mentioned above can be enjoyed.

1st Embodiment which concerns on the transfer method of this invention is a transfer method in the transfer apparatus which transfers the pattern formed in the mold to a to-be-transferred body, Comprising: The said to-be-transferred object is 1st using a 1st support means. Applying a force to the transferred object from a second direction different from the first direction with respect to the first supporting step of supporting from the first direction and the transferred object supported by the first supporting means. And a second supporting step for fixing the transferred body to the first supporting means, and a fixing for fixing the position of the first supporting means while applying a force to the transferred body in the second supporting step. A process.

According to the first embodiment of the transfer method of the present invention, various effects similar to those of the first embodiment of the transfer apparatus of the present invention described above can be enjoyed.

In the first embodiment related to the transfer method of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

In the second embodiment of the transfer method of the present invention, the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the first surface of the transfer object. A transfer method in a transfer device for transferring to a second surface, wherein a first support step is used to support the transfer object from a first direction by using a first support means, and the first support means supports the transfer object. A second support step of fixing the transferred body to the first support means by applying a force to the transferred body from a second direction different from the first direction with respect to the transferred body; A fixing step of fixing the position of the first support means while applying a force to the transfer target in the second support step.

According to the second embodiment of the transfer method of the present invention, various effects similar to those of the second embodiment of the transfer apparatus of the present invention described above can be enjoyed.

In the second embodiment related to the transfer method of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

An embodiment according to the computer program of the present invention is a computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer object, and the transfer object is transferred using a first support means. A force is applied to the transferred object from a second direction different from the first direction, with respect to the first supporting step of supporting from the first direction and the transferred object supported by the first supporting means. In addition, the position of the first support means is fixed while a force is applied to the transfer object in the second support process, and a second support process for fixing the transfer object to the first support means. And a fixing process to be executed by the transfer device.

According to the embodiment of the computer program of the present invention, the computer program is read from a recording medium such as a ROM, a CD-ROM, a DVD-ROM, and a hard disk that stores the computer program, and executed. If the computer program is executed after being downloaded to a computer via communication means, the transfer device can execute the various operations in the above-described transfer method according to the present invention relatively easily.

In the embodiment relating to the computer program of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment relating to the transfer method of the present invention described above.

As described above, the first embodiment, the second embodiment, and the third embodiment according to the transfer apparatus of the present invention include the first support means, the second support means, and the fixing means. The first and second embodiments according to the transfer method of the present invention include a first support step, a second support step, and a fixing step. The embodiment according to the computer program of the present invention causes the transfer apparatus to execute the first support process, the second support process, and the fixing process. Therefore, it is possible to appropriately adjust the holding mode so that various transfer materials having various thicknesses are not damaged.

The operation and other gains of various embodiments relating to the transfer apparatus and method and the computer program of the present invention will be described in more detail with reference to the following examples.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(1) Basic Configuration Example First, the basic configuration of the transfer apparatus of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 used in a manufacturing process of a hard disk such as a discrete track medium (DTM) or a bit patterned medium (BPM), which is an embodiment of a transfer apparatus of the present invention. FIG.

The imprint apparatus 1 shown in FIG. 1 is a UV-type transfer apparatus that transfers a pattern on a mold to a transfer target having a transfer layer that is cured by UV irradiation. Further, the imprint apparatus 1 uses the lower mold 200a and the upper mold 200b on which patterns such as unevenness to be transferred are formed, and the lower transfer layer 301a and the upper surface formed on the lower surface of the substrate 300 that is a transfer target. In this configuration, transfer is performed on both of the upper transfer layer 301b formed on the substrate.

1 shows the imprint apparatus 1 in a state where the lower mold 200a, the upper mold 200b, and the substrate 300 are installed.

As shown in FIG. 2A, the lower mold 200a has a disk shape having a center hole in the center or a shape similar to the disk, and a pattern such as irregularities is formed near the center hole on the pattern surface. A pattern area is constructed. At least a portion corresponding to the pattern region of each mold is made of a material that transmits UV light, such as quartz glass, and is preferably hardly affected by a change in character due to irradiation with UV light. For convenience, the outside of the pattern area on the pattern surface is referred to as a non-pattern area. The upper mold 200b has the same configuration as the lower mold 200a. Further, the pattern surface of the lower mold 200a and the upper mold 200b is subjected to a surface treatment for the purpose of improving mold releasability of the mold and the substrate at the time of mold release described later, for example, a surface treatment with a silane coupling agent or the like, A release layer having a thickness of a single molecule to several molecules is formed.

In this embodiment, the lower mold 200a is a specific example of the “mold” or “second mold” of the present invention, and the upper mold 200b is a specific example of the “mold” or “first mold” of the present invention. It is an example.

The substrate 300 has a disk shape having a center hole having a diameter smaller than that of the center hole of the mold at the center. For example, the lower transfer layer 301a and the upper transfer layer 301a made of a material that is cured by UV irradiation are formed on the lower and upper surfaces of the glass substrate. The transfer layer 301b is applied.

As shown in FIG. 1, the imprint apparatus 1 connects a lower mechanism part A including a lower base 110a, an upper mechanism part B including an upper base 110b, and the lower base 110a and the upper base 110b. A ball screw 101 that rotates, an actuator 104 that rotates the ball screw, a control unit 102 that controls the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation unit that can input user instructions to the control unit 102 103.

The lower mechanism A is provided on the upper surface of the lower base 110a, and includes a lower center pin 120a, a lower UV irradiation unit 130a, a lower center pin driving unit 140a, a lower mounting table 150a, A side mold holding part 152a and a lower mold clamp 153a are provided. A plurality of lower mold clamps 153a are provided, and are arranged at positions shown in FIG.

The lower base 110a is a member on the board. The lower base 110a is provided with a lower mounting table 150a and a lower opening 151a, and has a screw hole portion in which a screw groove into which the ball screw 101 is screwed is cut. .

The lower center pin 120a is a member that constitutes a specific example of the “transfer object holding unit” of the present invention, and includes a cylindrical tip portion 121a, a substrate support portion 122a, and a mold support portion 123a having different diameters. It is a member having. The lower center pin 120a is connected to a lower center pin driving unit 140a, which will be described later, and penetrates a center hole and a lower opening 151a of the lower mounting table 150a, which will be described later. It is supported so as to be perpendicular to the surface Sa.

The diameter of the tip 121a of the lower center pin 120a is smaller than the diameter of the substrate support 122a and the center hole of the substrate 300 described later. The diameter of the substrate support portion 122a is larger than the diameter of the center hole of the substrate 300, and smaller than the diameters of the center holes of the mold support portion 123a, the lower mold 200a and the upper mold 200b described later. Moreover, the diameter of the mold support part 123a is larger than the diameters of the center holes of the lower mold 200a and the upper mold 200b and smaller than the diameters of the center hole and the lower opening 151a of the lower mounting table 150a.

The lower UV irradiation unit 130a is electrically connected to the control unit 102 via a signal line (not shown), and the lower transfer layer 301a of the substrate 300 is applied in accordance with a control signal supplied from the control unit 102. The lower transfer layer 301a of the substrate 300 is irradiated with UV light to be cured through the lower opening 151a and the UV light transmission region of the lower mounting table 150a described later. The lower UV irradiation unit 130a may be configured to be retracted except when necessary, such as when UV light is irradiated in the transfer operation.

The lower center pin driving unit 140a constitutes a part of a specific example of the “transfer object holding unit” of the present invention in the lower mechanism unit A, and the lower center pin driving unit 140a corresponds to a lower control signal supplied from the controller 102. The side center pin 120a is moved in the axial direction, that is, in a direction perpendicular to the lower mold holding surface Sa of the lower mounting table 150a.

In addition, the lower center pin driving unit 140a moves the lower center pin 120a vertically upward when releasing the lower mold 200a and the substrate 300 after a transfer operation described later. The mold 200a is released from the mold 200a, and is also a specific example of "release means" or "second release means" in this embodiment.

The lower center pin driving unit 140a of the present embodiment includes a lower pressure sensor 141a. The lower pressure sensor 141a is a specific example of “detecting means” in the lower mechanism portion A of the present embodiment, and detects the pressure applied to the lower center pin 120a connected to the lower center pin driving portion 140a. Then, the detected pressure information is transmitted to the control unit 102. Here, the pressure applied to the lower center pin 120a is, for example, a force that resists the upward movement of the lower center pin 120a in contact with the substrate 300 in close contact with the lower mold 200a. In other words, the pressure applied to the lower center pin 120a due to the force acting on the contact surface between the lower mold 200a and the substrate 300 is shown.

The lower mounting table 150a has a flat lower mold holding surface Sa for holding the lower mold 200a, and the lower mold holding surface Sa is provided with a center hole in the center portion, and a lower side. A mold holding part 152a and a lower mold clamp 153a are provided. Further, the lower mold holding surface Sa of the lower mounting table 150a is typically configured wider than the pattern area of the lower mold 200a. The lower mounting table 150a is configured to be capable of alignment adjustment in the direction of the lower mold holding surface Sa in order to align the lower mold 200a with the substrate 300.

Of the lower mounting table 150a, at least the region corresponding to the region where the pattern of the lower mold 200a to be mounted is formed is transparent to UV light such as quartz glass, and has a phenotypic change by irradiation with UV light. This is a UV light transmission region made of a material that is difficult to generate. The opening 151a of the lower base 110a is formed in a region corresponding to the UV light transmission region of the lower mounting table 150a.

The lower mold holding part 152a is a specific example of the "mold holding means" or "second mold holding means" of the present invention in the lower mechanism part A, and holds the lower mold 200a by vacuum suction or the like. A suction portion 154a having a suction groove 155a and an elastic member 156a that supports the suction portion 154a.

FIG. 2B shows the lower mounting table 150a upward (more specifically, vertically upward with respect to the lower mold holding surface Sa. Hereinafter, the vertical upper direction or simply upward will be described. It is a schematic diagram which shows arrangement | positioning of each part at the time of seeing from the perpendicular | vertical downward direction or the downward direction.

As shown in FIG. 2B, the suction portion 154a is a groove formed in a corresponding region of the lower mold holding surface Sa so as to perform suction at the outer peripheral edge portion of the lower mold 200a to be placed. Placed inside. The suction portion 154a is preferably configured with, for example, a flexible resin member so as not to damage the lower mold 200a at the contact portion.

The suction groove 155a is configured to be able to suck the lower mold 200a to the suction portion 154a by reducing the atmospheric pressure in the groove by the operation of a decompression mechanism (not shown) such as a connected vacuum pump.

The elastic member 156a is disposed in a groove formed in the lower mold holding surface Sa and supports the suction portion 154a. The elastic member 156a is configured to be able to bias an elastic force between the adsorbing portion 154a and the lower mounting table 150a by a member having elasticity such as a resin or a mechanical structure such as a spring. Due to the presence of the elastic member 156a, the suction portion 154a is pressed vertically downward by, for example, a lower mold clamp 153a to be described later, so that the force for pressing and the elastic force from the elastic member 156a are balanced. Moving.

In addition, it is preferable that the shape of the lower mold holding part 152a and the lower mounting table 150a is a shape suitable for deformation of the lower mold 200a described later, and such a shape will be described in detail later.

The lower mold clamp 153a is a specific example of the “mold holding unit” or the “second mold holding unit” of the present invention in the lower mechanism portion A, and the lower mold 200a on the lower mounting table 150a is placed on the lower mold clamp 153a. A plurality of clamping mechanisms are provided on the outer peripheral edge portion further than the position to be provided. The lower mold clamp 153a is configured to hold the lower mold 200a by pressing the non-pattern area of the lower mold 200a downward with pressure according to a control signal from the control unit 102. Further, the lower mold clamp 153a presses the lower mold 200a with a force stronger than the pressing force required to hold the lower mold 200a in accordance with a control signal from the control unit 102, thereby lowering the lower mold. The lower mold 200a can be elastically deformed together with the elastic member 156a of the holding portion 152a. Hereinafter, the pressing force for holding the mold is described as holding force, and the pressing force for deforming the mold is described as deformation force.

Here, the structure and arrangement of the lower mold clamp 153a will be described with reference to FIG. FIG. 2C is a schematic view of the lower mold clamp 153a in a state where the lower mold 200a is being pressed as viewed from the vertically upward direction, and further illustrates the arrangement position of the upper mold clamp 153b described later. It is a figure. The lower mold clamp 153a is composed of a plurality of arc-shaped members arranged concentrically with the lower mold 200a in accordance with the disk shape in order to press the lower mold 200a.

The upper mold clamp 153b is also composed of a plurality of arc-shaped members arranged on the same circle. Further, as shown in FIG. 2C, the lower mold clamp 153a and the upper mold clamp 153b are configured such that respective arc-shaped fan-shaped members are mutually inserted and are parallel to the lower mold holding surface Sa. Even when projecting onto a surface, they are arranged so as not to overlap each other.

Subsequently, returning to FIG. 1, the upper mechanism B will be described.

The upper mechanism B is provided on the lower surface of the upper base 110b, and includes an upper center pin 120b, an upper UV irradiation unit 130b, an upper center pin driving unit 140b, an upper mounting table 150b, an upper mold holding unit 152b, And an upper mold clamp 153b.

The upper base 110b is a member on the board, and is provided with an upper mounting table 150b and an upper opening 151b, and there is a screw hole portion in which a screw groove into which the ball screw 101 is screwed is cut.

The upper center pin 120b is a member that constitutes a specific example of the “transfer object holding unit” of the present invention, and has a cylindrical shape having a tip portion having a diameter similar to that of the substrate support portion 122a of the lower center pin 120a. It is a member. The upper center pin 120b is connected to an upper center pin driving unit 140b, which will be described later, and penetrates a center hole and an upper opening 151b of the upper mounting table 150b, which will be described later. It is supported so as to be perpendicular to the mold holding surface Sb.

The upper UV irradiation unit 130b is electrically connected to the control unit 102 via a signal line (not shown) and the like, and the upper transfer layer 301b of the substrate 300 is cured in accordance with a control signal supplied from the control unit 102. The upper transfer layer 301b of the substrate 300 is irradiated with UV light through the upper opening 151b and a UV light transmission region of the upper mounting table 150b described later. The upper UV irradiation unit 130b may be retracted except when necessary, such as when UV light is irradiated in the transfer operation.

The upper center pin driving unit 140b constitutes a part of a specific example of the “transfer object holding unit” of the present invention in the upper mechanism unit B, and the upper center pin driving unit 140b corresponds to a control signal supplied from the control unit 102. 120b is moved in the axial direction, that is, in a direction perpendicular to the upper mold holding surface Sb of the upper mounting table 150b.

Further, the upper center pin driving unit 140b presses the upper center pin 120b in the vertical downward direction when the upper mold 200b and the substrate 300 after the transfer operation described later are released, thereby causing the vertical position of the substrate 300 to move. Is configured to constitute a part of the “release means” or the “first release means” in the present embodiment.

The upper center pin driving unit 140b according to the present embodiment includes an upper pressure sensor 141b. The upper pressure sensor 141b is a specific example of “detection means” in the upper mechanism B of the present embodiment, and detects and detects the pressure applied to the upper center pin 120b connected to the upper center pin driving unit 140b. The pressure information is transmitted to the control unit 102. Here, the pressure applied to the upper center pin 120b is, for example, a force that resists the downward movement of the upper center pin 120b in contact with the substrate 300 in close contact with the upper mold 200b. The purpose is to indicate the pressure applied to the upper center pin 120b by the force acting on the contact surface between 200b and the substrate 300.

The upper mounting table 150b has a flat upper mold holding surface Sb for holding the upper mold 200b. The upper mold holding surface Sb is provided with a center hole in the center portion, and the upper mold holding portion 152b. An upper mold clamp 153b is provided. In addition, the upper mold holding surface Sb of the upper mounting table 150b is typically configured to be wider than the pattern region of the upper mold 200b. The upper mounting table 150b is configured to be capable of alignment adjustment in the direction of the upper mold holding surface Sb in order to align the upper mold 200b with the substrate 300.

Of the upper mounting table 150b, at least a region corresponding to a region where the pattern of the upper mold 200b to be mounted is formed transmits UV light such as quartz glass, and changes in characteristics are caused by irradiation of the UV light. This is a UV light transmission region made of a difficult material. The opening 151b of the upper base 110b is formed in a region corresponding to the UV light transmission region of the upper mounting table 150b.

The upper mold holding part 152b is a specific example of the “mold holding means” or “first mold holding means” of the present invention in the upper mechanism part B, and is a suction groove for holding the upper mold 200b by vacuum suction or the like. A suction portion 154b having 155b and an elastic member 156b that supports the suction portion 154b are provided. Each of the suction portion 154b, the suction groove 155b, and the elastic member 156b has the same configuration as the suction portion 154a, the suction groove 155a, and the elastic member 156a of the upper mechanism portion A.

The upper mold clamp 153b is a specific example of the “mold holding unit” or the “first mold holding unit” of the present invention in the upper mechanism B, and is from a position where the upper mold 200b on the upper mounting table 150b is mounted. Furthermore, it is a clamp mechanism provided at the outer peripheral edge. Similar to the lower mold clamp, a plurality of upper mold clamps 153b are also provided. The upper mold clamp 153b is configured to hold the upper mold 200b by pressing the non-pattern area of the upper mold 200b upward with pressure according to a control signal from the control unit 102. Further, the upper mold clamp 153b presses the upper mold 200b with a force stronger than the pressing force necessary to hold the upper mold 200b in accordance with a control signal from the control unit 102, so that the upper mold holding unit 152b The upper mold 200b can be elastically deformed together with the elastic member 156b.

The control unit 102 is an information processing device such as a CPU (Central Processing Unit), for example, and the lower UV irradiation unit of the lower mechanism unit A according to an input signal indicating a user instruction supplied from the operation unit 103. 130a, the lower center pin driving unit 140a and the lower mold clamp 153a, the upper UV irradiation unit 130b of the upper mechanism B, the upper center pin driving unit 140a and the upper mold clamp 153b, and the control for controlling the operation of each part of the actuator 104. Supply the signal.

The operation unit 103 includes a plurality of buttons or a keyboard that can input an instruction by the user, and supplies an input signal corresponding to the input user instruction to the control unit 102. The control unit 102 reads an operation processing program stored in an internal memory or the like according to the input signal, generates a control signal according to the instruction, and supplies the control signal to each unit.

The actuator 104 is a mechanism such as a motor that can move the upper mounting table 150b toward or away from the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. Specifically, the actuator 104 rotates the ball screw 101 in accordance with a control signal supplied from the control unit 102, whereby the upper base 110b engaged with the ball screw 101 is changed to the upper mounting base 150b and the lower mounting base. It moves in the vertical direction while maintaining the parallel positional relationship with 150a. At this time, for example, four ball screws 101 are provided so as to connect the four corners of the lower base 110a and the upper base 110b, and a plurality of actuators 104 are also provided to rotate the corresponding ball screws 101. Yes.

According to such an operation of the actuator 104, by moving the upper base 110b in the vertical upward direction, the upper mounting base 150b is separated from the lower mounting base 150a, and the upper base 110b is moved in the vertical downward direction. Thus, the upper mounting table 150b comes close to the lower mounting table 150a.

The actuator 140 moves the upper mounting table 150b vertically downward in a transfer operation described later, thereby pressing the upper mold 200b and the substrate 300 to each other, and further pressing the lower mold 200a and the substrate 300 to each other. To do.

The actuator 104 is also a specific example of the “mold release unit” or “first mold release unit” of the present invention. When the upper mold 200b and the substrate 300 after the transfer operation described later are released, the upper mold is used. The upper mold 200b is released from the substrate 300 by moving the upper mounting table 150b in the vertical upward direction while holding 200b.

FIG. 3 is a schematic transmission diagram when the lower base 110a, the lower mechanism A, and the surrounding configuration are viewed from the vertically upward direction. Note that FIG. 3 does not show the lower mold holding portion 152a and the lower mold clamp 153a provided on the lower mounting table 150a.

As shown in FIG. 3, in the imprint apparatus 1, four pole screws 101 are screwed into the four corners of the lower base 110a of the square.

The actuator 104 is connected to each of the pole screws 101 arranged at the four corners of the lower base 110a, and the pole screws are rotated based on a control signal from the control unit 102.

The upper base 110b and the upper mechanism B are also configured in the same manner as the lower base 110a and the lower mechanism A, and are vertically upward from the lower base 110a at the four corners of the square upper base 110b. Four pole screws 101 extending in the direction are screwed together.

Subsequently, the structure of the center

pin driving units

140a and 140b in the present embodiment will be described together with the operation based on the control of the control unit 102 with reference to FIG. FIG. 4 is a schematic diagram showing a detailed configuration example of the center pin driving unit 140a.

As shown in FIG. 4A, the center pin drive unit 140a of this embodiment includes a motor 141, a shaft 142, an electromagnet 143, a brake plate 144, and a disk 145. The motor 141 rotates in a manner capable of at least rotational speed control and torque control in accordance with the supplied current. The shaft 142 is engaged so as to be able to rotate together with the rotation shaft of the motor 141 and is screwed so that the center pin 120 can be moved in the axial direction according to the rotation. The electromagnet 143 is, for example, an electromagnetic coil that generates a magnetic field according to a supplied current. When a magnetic field is not generated in the electromagnet 143, the brake plate 144 is pressed against the disk 145 by an unillustrated elastic member or the like to brake the rotation of the disk 145 by friction, and when a magnetic field is generated in the electromagnet 143, The electromagnet 143 is pulled away from the disk 145. The disk 145 is engaged with the shaft 142 so as to be able to rotate together with the rotation of the motor 141. In addition, the control unit 102 may control the torque output of the motor 141 by adjusting the amount of current supplied to the motor 141. If comprised in this way, the pressing force of the lower center pin 120a which changes typically according to the torque output of the motor 141 can be controlled suitably.

With this configuration, the lower center pin 120a can be moved and fixed in the vertical direction. The center pin driving unit 140a may be configured to notify the control unit 102 of the position of the lower center pin 120a detected by a position sensor (not shown) or the like. The control unit 102 detects the position of the lower center pin 120a according to the position information notified in this way or some other information, and rotates the motor 141 to move or fix the lower center pin 120a. The magnetic field of the electromagnet 143 is controlled. For this reason, it is possible to appropriately control the position of the lower center pin 120a.

Further, as another configuration example of the center pin driving unit 140a, a center pin driving unit 140'a shown in FIG. 4B may be employed. As shown in FIG. 4B, the center pin drive unit 140'a includes a motor 141, a shaft 142, and a brake 146. In FIG. 4B, the same components as those in FIG. 4A are denoted by the same reference numerals and description thereof is omitted. The brake 146 is an electrical or mechanical brake mechanism, and is pressed against the shaft 142 based on a control signal from the control unit 102, brakes the rotation of the shaft 142 by friction, and the lower center pin 120a Brakes movement.

With such a configuration, even when pressure is applied to the lower center pin 120a via the transfer body 300 by the upper center pin 120b shown in the drawing, the lower center pin is reliably in a predetermined position by the braking action of the brake 146. Fixed. Therefore, the position near the center hole of the transfer object can be reliably fixed at the time of transfer or release.

Note that the upper center pin 120b and the center pin drive unit 140b also have the same configuration as that of the lower center pin 120a and the center pin drive unit 140a unless otherwise specified.

(2) Basic Operation Example Next, a series of transfer operations performed by the imprint apparatus 1 will be described with reference to FIGS. FIG. 5 is a flowchart showing a series of transfer operations by the imprint apparatus 1. 6 to 7 are schematic views showing the operation of each part of the imprint apparatus 1 in each process during the transfer operation. FIG. 8 is a graph showing changes in the position of the lower center pin 120a and the upper center pin 120b in the vertical direction during the transfer operation.

Here, the flow of the operation shown in the flowchart of FIG. 5 will be described with reference to the operation of each part of the imprint apparatus 1 shown in FIGS. In FIGS. 6 to 7, the same components as those in the schematic diagram shown in FIG. 1 are denoted by the same reference numerals, and some of the thin members related to the operation to be described are partially described. The illustration is omitted.

In the flow of the transfer operation, first, the upper mold 200b is attached to the initial imprint apparatus 1 (FIG. 6 [state 1]) in which none of the upper mold 200b, the lower mold 200a, and the substrate 300 is installed. (Step S101). More specifically, in step S101, first, the upper mold 200b is moved by the operation of a mold conveying device (not shown) such that the tip 121a of the lower center pin 120a penetrates the center hole of the upper mold 200b. It is installed on the mold support part 123a of the side center pin 120a (FIG. 6 [state 2]).

Subsequently, the control unit 102 operates the actuator 104 to vertically move the upper mounting table 150b so that the upper mold holding surface Sb of the upper mounting table 150b is in contact with the upper surface of the upper mold 200b (that is, the back surface of the pattern surface). Move down. After the upper mounting table 150b and the upper mold 200b come into contact with each other, the control unit 102 operates a decompression unit (not shown) to adsorb and hold the upper mold 200b on the adsorption unit 154b of the upper mounting table 150b. Further, a control signal is transmitted to the upper mold clamp 153b, and the upper mold 200b is pressed vertically upward to be fixed to the upper mounting table 150b (FIG. 6 [State 3]). Thereafter, the control unit 102 operates the actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction (FIG. 6 [state 4]).

Subsequently, the lower mold 200a is attached to the imprint apparatus 1 (step S102). More specifically, in step S102, first, the lower mold 200a is moved in such a manner that the front end portion 121a of the lower center pin 120a penetrates the center hole of the lower mold 200a by an operation of a not-shown mold conveyance device or the like. Then, the lower center pin 120a is installed on the mold support part 123a (FIG. 6 [state 5]).

Subsequently, the control unit 102 operates the lower center pin driving unit 140a so that the lower mold holding surface Sa of the lower mounting table 150a contacts the lower surface of the lower mold 200a (that is, the back surface of the pattern surface). The lower center pin 120a is moved vertically downward. After the lower mounting table 150a and the lower mold 200a come into contact with each other, the control unit 102 operates a decompression means such as a vacuum pump (not shown) to cause the upper mold 200a to move to the suction unit 154a of the lower mounting table 150a. Is adsorbed and retained. Further, a control signal is transmitted to the lower mold clamp 153a, and the lower mold 200a is pressed vertically downward to be fixed to the lower mounting table 150a (FIG. 6 [State 6]).

Next, by the operation of a substrate transfer device (not shown), the substrate 300 is placed on the substrate support portion 122a of the lower center pin 120a so that the tip 121a of the lower center pin 120a penetrates the center hole of the substrate 300. (Step S103, FIG. 6 [State 7]). At this time, the control unit 102 may align the lower mold 200a and the upper mold 200b with the substrate 300 as necessary.

Subsequently, the control unit 102 transmits a control signal to the lower mold clamp 153a, and gradually increases the force pressing the lower mold 200a from the holding force to the deforming force, thereby deforming the lower mold 200a.

At the same time or before and after, the control unit 102 transmits a control signal to the upper mold clamp 153b, and gradually increases the force pressing the upper mold 200b from the pressing force to the deformation force, thereby deforming the upper mold 200b. (Step S104, FIG. 6 [State 8]).

Subsequently, the control unit 102 operates the lower center pin driving unit 140a to move the lower center pin 120a vertically downward, and the pattern of the lower transfer layer 301a and the lower mold 200a to be supported is supported. The surface is brought into contact (step S105, FIG. 7 [state 9]). Further, the control unit 102 operates the actuator 104 to move the upper mounting table 150b vertically downward to bring the pattern surface of the upper mold 200b into contact with the upper transfer layer 301b of the substrate 300 (FIG. 7 [state] 10]).

As described above, when deformation such as bending occurs in the mold, when the mold comes into contact with the transfer layer, contact is sequentially made from the side closer to the transfer layer on the pattern surface of the mold that is inclined due to deformation. To do. For example, when the central part of the pattern surface of the mold is bent by the pressing force of the mold clamp so as to be closer to the transfer layer, the mold sequentially contacts the peripheral part from the central part when contacting the transfer layer. .

The deformation of each mold and the contact with the substrate 300 may be performed in the above-described order. Also, the deformation of the lower mold 200a, the contact between the lower mold 200a and the substrate 300, the deformation of the upper mold 200b, You may perform from one side in the order of contact with the upper mold 200b and the board | substrate 300. FIG.

After the contact between each mold and the substrate 300, the control unit 102 transmits a control signal to the lower mold clamp 153a and the upper mold clamp 153b, and gradually reduces the pressing force pressing each mold from the deformation force to the holding force. The deformation of each mold is released (step S106, FIG. 7 [state 11]).

Next, the control unit 102 operates the actuator 104 to move the upper mounting table 150 b vertically downward, and the upper mold 200 b is moved to the upper transfer layer 301 b on the upper surface of the substrate 300, and the lower mold 200 a is moved to the lower surface of the substrate 300. The lower transfer layer 301a is pressed with a predetermined pressing force (step S107). Further, the control unit 102 emits UV light from the lower UV irradiation unit 130a and the upper UV irradiation unit 130b in order to cure the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 while maintaining the pressed state. Let By this operation, the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 are cured in accordance with the pattern formed on the surface of each mold, and the pattern is transferred (step S108). In addition, it is preferable that the pressure and pressing time during pressing, the intensity of UV irradiation, and the irradiation time are appropriately set according to the characteristics of the transfer layer.

After a series of operations related to transfer such as a predetermined pressing time and UV irradiation is completed, a mold release process for releasing the lower mold 200a and the upper mold 200b from the substrate 300 is performed.

In the mold release operation, the control unit 102 first stops the operation of the actuator 104 that presses the upper mounting table 150b, and releases the pressing state between each mold and the substrate 300. At the same time or before and after, the control unit 102 operates the upper center pin driving unit 140b so that the tip of the upper center pin presses the substrate 300 vertically downward at a predetermined pressure (Step S109, FIG. 7 [ State 12]).

At this time, the substrate 300 is sandwiched between the lower center pin 120a and the upper center pin 120b. The control unit 102 controls the driving modes of the lower center pin driving unit 140a and the upper center pin driving unit 140b so that excessive pressure is not applied to the sandwiched substrate 300.

Here, referring to FIG. 8, under the control of the control unit 102, the lower center pin 120a and the upper center pin 120b that are moved by the operations of the lower center pin driving unit 140a and the upper center pin driving unit 140b, respectively. A change in position will be described.

First, the control unit 102 performs position control for fixing the position of the lower center pin 120a with respect to the lower center pin driving unit 140a from the start of the mold release operation. Specifically, the control unit 102 supplies electric power to the brake mechanism (for example, the electromagnet 143 or the brake 146) in the lower center pin driving unit 140a, and the like. The driving is stopped and the lower center pin 120a is fixed so as not to move. Further, the control unit 102 may fix the lower center pin 120a by more simply controlling the amount of power supplied to the lower center pin driving unit 140a.

While fixing the lower center pin 120a, the control unit 102 moves vertically downward to a position where the tip of the upper center pin 120b contacts the substrate 300 (FIG. 8, upper center pin substrate holding position). Position control is performed on the upper center pin driving unit 140b.

After the tip of the upper center pin 120b has moved to a position where it contacts the substrate 300, the control unit 102 changes the operation mode of the upper center pin driving unit 140b from the position control according to the position of the upper center pin 120b to the upper center pin. The torque control is switched according to the pressing force exerted by the pin 120b in the vertical downward direction. In such torque control, the center pin drive unit 140b controls the drive torque so that the pressing force with which the upper center pin 120 presses the substrate 300 vertically downward does not exceed a predetermined threshold.

The threshold value of the pressing force at this time is an upper limit value that is set sufficiently low with respect to the pressing force that causes distortion or damage to the substrate 300 held by the pressing of the upper center pin 120b, for example.

For this reason, after the upper center pin 120 is in contact with the substrate 300, the substrate 300 is pressed between the lower center pin 120a whose position is fixed by pressing the substrate 300 vertically downward with a pressing force that does not exceed the threshold value. Hold 300.

Subsequently, the control unit 102 performs deformation of the lower mold 200a and the upper mold 200b by the same operation as the above-described step S104 (step S110, FIG. 7 [state 13]). At this time, the pressing force of each mold clamp is controlled to gradually increase from the holding force to the deformation force.

Dependent on the deformation of the mold, as shown in FIG. 7 [State 13], a part of the contact surface between each mold and the substrate 300 is peeled off, resulting in a gap. When such a gap exists on the contact surface, it becomes a mold release start point in the subsequent mold release, and the adhesion force acting between the mold and the transfer layer of the substrate is reduced.

Subsequently, the control unit 102 operates the upper center pin 120b actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction. At this time, the upper mold 200b moves vertically upward while being held by the upper mounting table 150b, while the substrate 300 is pressed vertically downward (in other words, fixed) by the upper center pin 120b. Therefore, the upper mold 200b and the upper transfer layer 301b of the substrate 300 are released (Step S111, FIG. 7 [State 14]). At this time, the control unit 102 fixes the position of the lower center pin 120a and controls the force with which the upper center pin 120b presses the substrate 300 in the vertical downward direction by torque control.

Next, the control unit 102 holds the upper center pin 120b and the lower center pin 120a holding the substrate 300 up to the initial position of the lower center pin 120a in the vertical upward direction while maintaining the state in which the substrate 300 is held. The lower mold 200a and the substrate 300 are released from each other (step S112, FIG. 7 [state 15]). Specifically, as shown in FIG. 8, the control unit 102 controls the position of the lower center pin driving unit 140a so that the lower center pin 120a moves to the lower center pin initial position. On the other hand, the control unit 102 moves the upper center pin 120b so as to move to a position corresponding to the lower center pin initial position (that is, above the lower center pin initial position by the thickness of the substrate 300). The mode of operation of the drive unit 140a is switched from torque control to position control.

After the mold release, the control unit 102 changes the pressing force of the upper mold clamp 153b and the lower mold clamp 153a to the holding force for holding the mold, and releases the deformation of the lower mold 200a and the upper mold 200b. (Step S113, FIG. 7 [State 16]).

The substrate 300 released from the lower mold 200a and the upper mold 200b is removed from the lower center pin 120a by an operation of a substrate transfer device (not shown) (step S114). In addition, when performing transfer using the same lower mold 200a and upper mold 200b for another substrate 300 (step S115: No), the steps from step S103 to step S114 for placing the substrate 300 are performed. Run repeatedly. After all the transfer is completed (step S115: Yes), the lower mold 200a is removed (step S116) and the upper mold 200b is removed (step S117) by an operation of a mold conveyance device (not shown).

Through the series of operations described above, according to the imprint apparatus 1 which is an embodiment of the transfer apparatus of the present invention, the lower mold 200a and the upper mold 200b are placed on the surfaces of the

transfer surfaces

301a and 301b of the substrate 300. The formed pattern is transferred.

In particular, in this embodiment, the substrate is formed by the lower center pin 120a whose position is fixed under the control of the control unit 102 and the upper center pin 120b that presses the substrate 300 with a predetermined pressing force during the mold release operation. 300 is pinched. For this reason, the board | substrate 300 is suitably protected from the damage by the addition of excessive pressing force, etc. In addition, when using substrates of different thicknesses and materials, appropriate holding of the substrate can be realized by changing a threshold value or the like in torque control of the upper center pin 120b according to the characteristics of the substrate.

Since the substrate 300 is appropriately held in this manner, the control unit 102 moves the upper stage 150b, to which the upper mold 200b is fixed, in the vertical upward direction, so that the upper mold 200b and the substrate 300 can be separated relatively easily. A mold can be realized. Further, the control unit 102 moves the lower center pin 120a and the upper center pin 120b in the vertical upward direction while maintaining the state of holding the substrate 300, so that the lower mold 200a and the substrate 300 can be relatively easily moved. Can be realized.

(3) First Modification Next, a basic configuration of an imprint apparatus 1 ′, which is a first modification of the transfer apparatus according to the present invention, will be described with reference to FIG. FIG. 9 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 ′ which is a first modification of the transfer apparatus of the present invention.

The imprint apparatus 1 shown in FIG. 9 has a lower mold 200a with respect to a lower transfer layer 301a configured on the lower surface of a substrate 300 ′ that is a transfer target (in other words, arranged facing downward). 2 is a transfer device for transferring a pattern formed on the substrate. Note that, in this modification and FIG. 9, the same components as those of the imprint apparatus 1 shown in FIG.

As shown in FIG. 1, the imprint apparatus 1 includes a lower mechanism part A including a lower base 110a, an upper mechanism part B ′ including an upper base 110b, a lower base 110a and an upper base 110b. A ball screw 101 to be connected, an actuator 104 for rotating the ball screw, a control unit 102 for controlling the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation capable of inputting a user instruction to the control unit 102 Unit 103.

The imprint apparatus 1 ′ shown in FIG. 9 shows a state where the lower mold 200 a and the substrate 300 ′ are installed. The lower mold 200a is held on the lower mounting table 150a of the lower mechanism portion A so that the surface on which the pattern is formed faces upward. Further, the upper base 110b has a pressing portion 120b so as to form a convex portion with respect to the lower mold holding surface Sa of the lower mounting table 150a.

The lower mechanism part A has the same configuration as the lower mechanism part A of the imprint apparatus 1 shown in FIG.

On the other hand, the upper mechanism part B 'of the present modification is provided on the lower surface of the upper base 110b, and includes a pressing part 112b, an upper center pin 120b, and an upper center pin driving part 140b.

The pressing portion 112b is a portion provided to form a convex portion downward on the lower surface of the upper base 110b. During the transfer operation, the pressing portion 112b presses the substrate 300 ′ downward by the operation of the actuator 104, so that the lower side Adhere to the mold 200a. The pressing part 112b has a center hole for placing the upper center pin 120b. The pressing portion 112b is flat and preferably has a lower surface that is wider than at least a region where the lower transfer layer 301a of the substrate 300 'is formed.

According to such an imprint apparatus 1 ', the actuator 104 moves the upper base 110b vertically downward, so that the lower surface of the pressing portion 112b presses the substrate 300' vertically downward. Therefore, the lower transfer layer 301a of the substrate 300 'is brought into close contact with the pattern surface of the lower mold 200a, and the pattern is transferred. Further, the actuator 102 moves the upper base 110b vertically upward, so that the pressing force for mutual pressing between the lower mold 200a and the substrate 300 'is released.

Thereafter, under the control of the control unit 102, the lower center pin 120a and the upper center pin 120b are moved vertically upward while holding the substrate 300 ′, so that the substrate 300 ′ is released from the lower mold 200a. To do.

Also in the imprint apparatus 1 ′, during the mold release operation, the position of the lower center pin 120a is controlled under the control of the control unit 102, and the force with which the upper center pin 120b presses the substrate 300 is controlled by torque control. Is done. According to such position control and torque control, it is possible to suitably suppress the occurrence of distortion and damage due to the substrate 300 being held between the lower center pin 120a and the upper center pin 120b with an excessive force.

For this reason, according to the imprint apparatus 1 ′, the pattern formed on the surface of the lower mold 200a is transferred to the transfer layer 301a of the substrate 300 ′ while enjoying the same effect as the imprint apparatus 1 described above. I can do it.

(4) Other Modifications Next, other modifications of the transfer device according to the present invention will be described with reference to FIGS.

FIG. 10 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 ″ and a control apparatus 400, which is a second modification of the transfer apparatus of the present invention. Note that, in this modification and FIG. 10, the same components as those of the imprint apparatus 1 shown in FIG.

The imprint apparatus 1 ″ has a configuration that does not include the control unit 102 and the operation unit 103 in the imprint apparatus 1 illustrated in FIG. 1. Other parts may be equivalent to the imprint apparatus 1.

The control device 400 includes a control unit 102 ′ and an operation unit 103 ′ having the same configuration as the control unit 102 and the operation unit 103 of the imprint apparatus 1, and is electrically connected to each unit of the imprint apparatus 1 ″. Is done. In this configuration, the control unit 102 ′ of the control device 400 controls the operation by supplying a control signal to each unit of the imprint apparatus 1 ″.

According to the second modification of the transfer device of the present invention, the imprinting device 1 ″ and the control device 400 are arranged at separate positions, and the same effect as that obtained by the imprinting device 1 described above is obtained. You can enjoy it.

As a third modification, there is a device configuration in which one control device 400 is connected to a plurality of imprint devices and controls the operation of each imprint device. In this modified example, as shown in FIG. 11A, one control device 400 is provided for n imprint devices 1 ″ -1, 2,... The operation of each imprint apparatus is controlled by supplying control signals to the imprint apparatuses 1 ″ -1, 2,... N. Specifically, one control device 400 supplies control signals to a plurality of n imprint devices 1 ″ -1, 2,... N, and the like, as shown in FIGS. Centralized control is performed so that each process related to the transfer operation is performed.

Further, as a fourth modified example, there is an apparatus configuration in which a user's instruction for controlling operations is input by a single operation unit to a plurality of control units respectively connected to a plurality of imprint apparatuses. is there. In this modification, as shown in FIG. 11B, for each of the n imprint apparatuses 1 ″ -1, 2,... N, the individual control units 102′-1, 2,. Are connected to control the operation of each imprint apparatus 1 ″ -1, 2,... N. The operation unit 103 ′ is connected to each of the control units 102 ′-1, 2,... N, and inputs an instruction by a user operation.

Specifically, the user concentrates settings such as operation start, operation stop, and the number of substrates to be transferred in each imprint apparatus 1 ″ -1, 2,... N by using one operation unit 103 ′. The operation unit 103 ′ inputs the set instruction contents to the control units 102′-1, 2,... N of the imprint apparatuses 1 ″ -1, 2,.
The control units 102′-1, 2,... N of the respective imprint apparatuses 1 ″ -1, 2,... N respectively correspond to the corresponding imprint apparatuses 1 ″ -1, 2,. A control signal is supplied so that n performs each step related to the transfer operation shown in FIGS.

According to the third and fourth modifications of the transfer device of the present invention, one control device 400 or operation unit 103 ′ is used for each of the plurality of imprint devices 1 ″ -1, 2,. User instructions can be input. For this reason, centralized management is possible in a factory where many imprint apparatuses are required to operate simultaneously. Moreover, it is useful also in terms of apparatus configuration and cost.
In the above-described embodiments, the UV type imprint apparatus has been described as an example.

The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification, and a transfer apparatus accompanying such a change. And methods, computer programs, and the like are also included in the technical scope of the present invention.

1 imprint device,
101 ball screw,
102 control unit,
103 operation unit,
104 actuator,
110a Lower base,
110b upper base,
120a Lower center pin,
120b upper center pin,
130a UV irradiation unit,
130b UV irradiation unit,
140a Center pin drive unit,
140b center pin drive unit,
150a lower stage,
150b upper stage,
151a lower opening,
151b upper opening,
152a Lower mold holding part,
152b Upper mold holding part,
153a Lower mold clamp,
153b Upper mold clamp,
154a adsorption part,
154b adsorption part,
155a suction groove,
155b suction groove,
156a elastic member,
156b elastic member,
200a lower mold,
200b Upper mold,
300 substrates,
301a transfer layer,
301b Transfer layer.

Claims

A transfer device for transferring a pattern formed on a mold to a transfer target,
First support means for supporting the transfer object from a first direction;
A force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means, thereby supporting the transfer object to the first support. Second support means fixed to the means;
A transfer device comprising: fixing means for fixing a position of the first support means while the second support means applies a force to the transfer target.
2. The transfer apparatus according to claim 1, wherein the fixing means fixes the position of the first support means so that the first support means does not move due to a force applied by the second support means.
3. The transfer apparatus according to claim 1, wherein the first direction and the second direction are directions opposite to each other.
The transfer object is a disk substrate having a through hole,
The first support means supports the transferred body in contact with a peripheral portion of the through hole on one surface of the disk substrate,
The transfer device according to claim 1, wherein the second support unit applies a force at a peripheral portion of the through hole on the other surface of the disk substrate.
First drive means for moving the first support means;
A second drive means for moving the second support means;
The second driving unit moves the second support unit in the direction of the transfer target, thereby pressing the transfer target to the first support and fixing the transfer target to the first support. The transfer device according to claim 1, wherein:
2. The transfer apparatus according to claim 1, further comprising a control unit that controls a force applied by the second support unit to the transfer target.
The control means starts to control the force applied by the previous second support means to the transferred body after the second supporting means approaches a predetermined distance from the transferred body. The transfer device according to claim 6.
A transfer device for transferring a pattern formed on a first mold to a first surface of a transfer object and transferring a pattern formed on a second mold to a second surface of the transfer object;
A transferred object holding means for holding the transferred object;
First support means for supporting the transfer object from a first direction;
A force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means, thereby supporting the transfer object to the first support. Second support means fixed to the means;
A transfer device comprising: fixing means for fixing a position of the first support means while the second support means applies a force to the transfer target.
A transfer device that operates according to an instruction from a control device and transfers a pattern formed on a mold to a transfer target,
First support means for supporting the transfer object from a first direction in accordance with an instruction from the control device;
In response to an instruction from the control device, a force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means. Second support means for fixing the transfer object to the first support means;
A transfer device comprising: fixing means for fixing a position of the first support means while the second support means applies a force to the transfer target body in accordance with an instruction from the control device.
A transfer method in a transfer device for transferring a pattern formed on a mold to a transfer target,
A first support step of supporting the transfer object from a first direction using a first support means;
A force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means, thereby supporting the transfer object to the first support. A second support step for fixing to the means;
A fixing step of fixing a position of the first support means while applying a force to the transfer target in the second support step.
A transfer method in a transfer apparatus for transferring a pattern formed on a first mold to a first surface of a transfer object and transferring a pattern formed on a second mold to a second surface of the transfer object. And
A first support step of supporting the transfer object from a first direction using a first support means;
A force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means, thereby supporting the transfer object to the first support. A second support step for fixing to the means;
A fixing step of fixing a position of the first support means while applying a force to the transfer target in the second support step.
A computer program for operating a transfer device for transferring a pattern formed on a mold to a transfer object,
A first support step of supporting the transfer object from a first direction using a first support means;
A force is applied to the transfer object from a second direction different from the first direction with respect to the transfer object supported by the first support means, thereby supporting the transfer object to the first support. A second support step for fixing to the means;
A computer program causing the transfer apparatus to execute a fixing step of fixing a position of the first support means while applying a force to the transfer target in the second support step.