WO2011141996A1 - Transfer device and method, and computer program - Google Patents

Transfer device and method, and computer program Download PDF

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Publication number
WO2011141996A1
WO2011141996A1 PCT/JP2010/057953 JP2010057953W WO2011141996A1 WO 2011141996 A1 WO2011141996 A1 WO 2011141996A1 JP 2010057953 W JP2010057953 W JP 2010057953W WO 2011141996 A1 WO2011141996 A1 WO 2011141996A1
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WO
WIPO (PCT)
Prior art keywords
mold
holding
transfer
contact surface
lower
Prior art date
Application number
PCT/JP2010/057953
Other languages
French (fr)
Japanese (ja)
Inventor
今井 哲也
小島 良明
孝幸 糟谷
Original Assignee
パイオニア株式会社
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Publication date
Application filed by パイオニア株式会社 filed Critical パイオニア株式会社
Priority to PCT/JP2010/057953 priority Critical patent/WO2011141996A1/en
Publication of WO2011141996A1 publication Critical patent/WO2011141996A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/30Mounting, exchanging or centering
    • B29C33/305Mounting of moulds or mould support plates
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11BINFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/855Coating only part of a support with a magnetic layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B29C35/0805Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation
    • B29C2035/0827Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using electromagnetic radiation using UV radiation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023Microembossing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/42Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B29C33/424Moulding surfaces provided with means for marking or patterning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0003Discharging moulded articles from the mould

Abstract

Disclosed is a transfer device (1) for transferring a pattern formed on a mold (200a) to a transfer reception body (300), wherein the transfer device is provided with a first mold holding means (154a) which holds the mold by a first contact surface (Sa1), a second mold holding means (150a) which holds the mold by a second contact surface (Sa2), and a transfer means (104) which transfers the pattern to the transfer reception body, and wherein relative positions of the first mold holding means and the second mold holding means change in the direction perpendicular to the first contact surface.

Description

Transfer apparatus and method, and computer program

The present invention relates to a transfer device and method for transferring a concavo-convex pattern onto a surface of a transfer target by pressing a mold having a concavo-convex pattern formed on the surface of the transfer target, and a computer program technical field.

In this type of transfer apparatus, the mold is held in such a manner that a uniform pressure distribution can be controlled with respect to the mold in order to uniformly press the mold surface against the surface of the transfer target. For example, Patent Documents 1 and 2 disclose a configuration in which a mold is held by a mold holding unit having a flat holding surface in accordance with the back surface structure of the mold and the pressure distribution during pressing is uniform.

JP 2006-326927 A International Publication No. 2007/105474

When holding the mold on a flat holding surface, the mold may slide on the holding surface depending on the material and characteristics of the mold and the holding member. When the mold slides on the holding surface, it is difficult to fix the mold at a desired position on the holding member, and therefore, the alignment operation for aligning the pattern on the mold surface with the desired position on the transfer target cannot be performed properly. This leads to technical problems. Further, the mold and the holding member may be damaged due to friction caused by the sliding of the mold.

The present invention has been made in view of the above-described technical problems, and an object of the present invention is to provide a transfer apparatus and method, and a computer program that can suitably execute installation and holding of a mold.

In order to solve the above problems, a first transfer device of the present invention is a transfer device that transfers a pattern formed on a mold onto a transfer target, and the first transfer device holds the mold on a first contact surface. A mold holding means; a second mold holding means for holding the mold on a second contact surface; and a transfer means for transferring the pattern to the transfer target, the first mold holding means and the second mold. The relative position with respect to the holding means is variable.

In order to solve the above problems, the second transfer apparatus of the present invention transfers the pattern formed on the first mold to the first surface of the transfer target, and the pattern formed on the second mold A transfer device for transferring to a second surface of a transfer target, wherein the first mold is held by a first contact surface, and the first mold is held by a second contact surface. Second mold holding means, third mold holding means for holding the second mold on a third contact surface, fourth mold holding means for holding the second mold on a fourth contact surface, and the pattern Transfer means for transferring to the transfer object, the relative positions of the first mold holding means and the second mold holding means are variable, the third mold holding means and the fourth mold holding means. Can be positioned relative to I am.

In order to solve the above-described problem, a third transfer device of the present invention is a transfer device that operates in accordance with an instruction from a control device and transfers a pattern formed on a mold to a transfer target. First mold holding means for holding the mold on the first contact surface in accordance with an instruction from the apparatus, and second mold holding means for holding the mold on the second contact surface in accordance with an instruction from the control apparatus And transfer means for transferring the pattern onto the transfer target body in accordance with an instruction from the control device, and in accordance with an instruction from the control device, the first mold holding means and the second mold holding means, Change the relative position of.

In order to solve the above problems, a first transfer method of the present invention is a transfer method in a transfer apparatus that transfers a pattern formed on a mold to a transfer target, and the mold is held on the first contact surface. A first holding step, a second holding step for holding the mold on a second contact surface, and a transfer step for transferring the pattern to the transfer target, the first mold holding means and the second The relative position with the mold holding means is changed.

In order to solve the above-described problems, the second transfer method of the present invention transfers the pattern formed on the first mold to the first surface of the transfer object, and the pattern formed on the second mold A transfer device for transferring to a second surface of a transfer object, wherein a first holding step of holding the first mold on a first contact surface, and a first holding step of holding the first mold on a second contact surface. A second holding step, a third holding step for holding the second mold on a third contact surface, a fourth holding step for holding the second mold on a fourth contact surface, and the pattern to be transferred. A transfer process for transferring the first mold holding means and the second mold holding means, and a relative position between the third mold holding means and the fourth mold holding means. Change at least one.

In order to solve the above-described problems, a computer program according to the present invention is a computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer target, and the mold is moved on the first contact surface. A first holding step for holding; a second holding step for holding the mold on a second contact surface; and a transfer step for transferring the pattern onto the transfer target body. The relative position between the holding means and the second mold holding means is changed.

The operation and other gains of the present invention will be described together with embodiments shown below.

It is a schematic diagram which shows the basic structural example of the imprint apparatus of this invention. It is a schematic diagram which shows the aspect of a mold holding | maintenance by a mold holding means. It is a schematic diagram which shows the shape of the base of an imprint apparatus. It is a schematic diagram which shows the example of the shape and operation | movement of a mounting base, a mold holding part, and a mold clamp. It is a flowchart which shows a series of flows of the transfer operation by an imprint apparatus. FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. FIG. 6 is a schematic diagram showing the operation of each part of the imprint apparatus in a transfer operation. It is a schematic diagram which shows the basic structural example of the 1st modification of an imprint apparatus. It is a schematic diagram which shows the basic structural example of the 2nd modification of an imprint apparatus. It is a schematic diagram which shows the basic structural example of the 3rd and 4th modification of an imprint apparatus.

An embodiment according to the transfer apparatus of the present invention is a transfer apparatus that transfers a pattern formed on a mold to a transfer target, and includes a first mold holding unit that holds the mold on a first contact surface, and the mold. A second mold holding means for holding the pattern on the second contact surface, and a transfer means for transferring the pattern onto the transfer target, and the relative relationship between the first mold holding means and the second mold holding means. The position is variable.

According to the embodiment of the transfer apparatus of the present invention, the mold held by the first mold holding means and the second mold holding means is pressed against the transfer object by the operation of the transfer means, so that the mold surface The pattern is transferred to the transfer target. As described above, in the present embodiment and each aspect described later, the first mold holding means and the second mold holding means are used to hold one mold. In view of such a configuration, hereinafter, the term “holding member” including the first mold holding means and the second mold holding means is used for the purpose of the member that holds the mold.

The first mold holding means of the present embodiment is a member that makes contact with the mold at the “first contact surface” and realizes holding of the mold. Here, the “first contact surface” is a surface formed by at least a portion in contact with the mold among the members constituting the first mold holding means, and typically the first mold holding means. It is a surface including all points where the component and the mold contact. For example, in the case of the first mold holding means that includes a plurality of suction nozzles, and that is in contact with the back surface of the mold at the front ends of the plurality of suction nozzles and realizes the holding by suction, formed by the front ends of the plurality of suction nozzles The surface to be used becomes the first contact surface.

On the other hand, the second mold holding means of the present embodiment is a member that realizes holding of the mold by contacting the back surface of the mold at the “second contact surface”. Here, the “second contact surface” is a surface formed by at least a portion in contact with the mold among the members constituting the second mold holding means, and typically constitutes the second mold holding means. It is a surface comprising all points where the member to be in contact with the mold. For example, in the case of the 2nd mold holding means which has a flat surface and contacts the back surface of a mold in the surface, the flat surface which touches a mold serves as the 2nd contact surface.

The transfer unit performs an operation of pressing the mold held by the first mold holding unit and the second mold holding unit against the surface of the transfer target. The pressing operation is preferably performed after an appropriate pressing force, pressing time, or other conditions are set so that the pattern formed on the mold surface is sufficiently transferred to the surface of the transfer target. To be implemented. The transfer unit may perform the pressing operation described above by operating, for example, the first mold holding unit and the second mold holding unit. On the other hand, the transfer unit holds the transfer target and holds the transfer target. You may implement pressing operation by making it operate | move so that it may press on the mold hold | maintained at a 1st mold holding means and a 2nd mold holding means.

The transfer apparatus according to the present embodiment is configured such that the relative position between the first contact surface formed by the first mold holding unit and the second contact surface formed by the second mold holding unit changes. . For example, when the first mold holding means moves relative to the second mold holding means, the first contact surface moves with respect to the second contact surface, and the relative positions of the first contact surface change. .

The relative positions of the first contact surface and the second contact surface are typically the first contact surface and the second contact surface that are formed in a state of maintaining a mutually parallel positional relationship. The position in the direction perpendicular to each of these is shown. That is, the relative position between the first contact surface and the second contact surface is preferably changed in a direction perpendicular to each of the first contact surface and the second contact surface (hereinafter, “high” This is to indicate that the mutual position (hereinafter referred to as “height”) in the “direction” is changed. However, the present invention is not limited to such a position change in the height direction, and may indicate a position change in a direction parallel to each of the first contact surface and the second contact surface.

According to the holding member of this embodiment having such a configuration, when holding the mold, the first mold holding means first contacts the mold on the first contact surface to hold the first stage, and then By the relative movement of the first contact surface, the mold comes into contact with the second mold holding means on the second contact surface, and the second stage holding by the second mold holding means is performed. In this case, in the first stage holding, the mold only comes into contact with the first contact surface of the first mold holding means, and the first mold holding means is a part that comes into contact with the mold in the second stage holding. The area is small compared to the first contact surface and the second contact surface of the second mold holding means.

The holding member typically contacts the mold on the back surface (that is, the non-pattern surface) of the surface on which the mold pattern is formed, and holds the mold by suction or the like. At this time, the non-pattern surface of the mold is often configured as a flat surface for easy holding and for uniform pressure distribution during pressing. Similarly, the contact surface that contacts the mold of the holding member that holds the mold is also configured to have a flat surface that matches the shape of the non-patterned surface of the mold. For this reason, when the mold having the flat back surface is brought into contact with the holding member having a flat surface when the mold is installed on the holding member, there is a possibility that slip occurs on the contact surface between the mold and the holding member. is there. Such slipping may be caused by, for example, an air flow generated between opposing contact surfaces when the mold and the holding member are in contact with each other.

When slip occurs on the contact surface between the mold and the holding member, the mold is not fixed at a desired position on the holding member, and the alignment operation for aligning the pattern on the mold surface with the desired position on the transfer target can be performed appropriately. Therefore, there is a possibility that the operation of the apparatus is disadvantageous such as re-installation of the mold on the holding member. For this reason, there is a possibility that the efficiency of the transfer operation is lowered and the yield is deteriorated.

According to the configuration of the transfer device of the present embodiment, the first stage is compared with all the parts (that is, the first contact surface and the second contact surface) prepared for holding the mold in the holding member. The area of the part that comes into contact with the mold during holding (that is, the first contact surface) is relatively small. For this reason, the pressure exerted on the mold from the holding member at the time of contact between the mold and the holding member (that is, the first mold holding means) increases as the area of the contact surface decreases. Thereby, the frictional force generated on the first contact surface of the mold and the first mold holding means increases, and as a result, the occurrence of slipping in the direction parallel to the first contact surface of the mold can be suppressed. In this way, by suppressing the slip on the contact surface between the mold and the first mold holding means, it is possible to realize the holding after suitably fixing the mold at a desired position in the first mold holding means when the mold is installed. It becomes possible. As a result, it is possible to suppress damage to the mold and the first mold holding means and misalignment due to slippage.

Further, after the second stage holding, when the mold is pressed against the transfer object by the transfer means, the tip of the suction nozzle of the first mold holding means has the same height as the flat surface on the second mold holding means. Thus, relative movement between the first mold holding means and the second mold holding means is performed. For this reason, the mold contacts and holds the first mold holding means and the second mold holding means at a portion having a larger area on the second contact surface than the contact portion with the first mold holding means at the time of installation. Is done.

According to such a configuration, the mold is held in a wider area using both the first mold holding means and the second mold holding means as compared to when the mold and the first mold holding means are in contact with each other. Thus, the mold can be pressed. For this reason, it is possible to make the distribution of the pressing force applied to the mold more uniform when pressing the transfer target. Therefore, transfer of a suitable pattern can be realized, which leads to an improvement in yield by the transfer device.

In one aspect of the first embodiment of the transfer apparatus according to the present invention, the mold holding unit further includes a mold holding control unit that controls a position of at least one of the first mold holding unit and the second mold holding unit. The control means changes a distance between the mold held by the first contact surface and the second contact surface in a direction perpendicular to the first contact surface.

According to this aspect, at least relative movement between the first contact surface and the second contact surface causes the positional relationship between the mold and the second contact surface to change so as to approach or separate from each other. For this reason, the above-described two-stage mold holding can be realized relatively easily.

In order to realize the relative movement between the first contact surface and the second contact surface, the mold holding control means changes the relative positions of the first mold holding means and the second mold holding means. It is a member to make. For example, the mold holding control unit changes the relative position between the first mold holding unit and the second mold holding unit by pressing the first mold holding unit in the direction of the second contact surface of the second mold holding unit. Give rise to

In another aspect of the first embodiment according to the transfer device of the present invention, the first mold holding means includes a distance between the mold and the first contact surface, and a distance between the mold and the second contact surface. In a state where the distance is different, the mold is held, and the transfer unit is configured such that the distance between the mold and the first contact surface and the distance between the mold and the second contact surface are equal. Is transferred to the transfer target.

According to this aspect, when the first mold holding means holds the mold and when the transfer means presses the mold against the transfer target, the contact between the mold and each contact surface is different. The relative position of the mold holding means defining the surface has changed.

Here, the distance between the mold and the first contact surface and the distance between the mold and the second contact surface are intended to indicate the distance between each contact surface and the mold in a direction perpendicular to each contact surface. . Therefore, the state where the distance between the mold and the first contact surface and the distance between the mold and the second contact surface are different is that the first contact surface and the second contact surface are different from each other from the mold. It is a state to be arranged. On the other hand, when the distance between the mold and the first contact surface and the distance between the mold and the second contact surface are equal, the first contact surface and the second contact surface are approximately the same distance from the mold. This is a state in which the first contact surface and the second contact surface are disposed on the same plane. Note that “the distances are equal” does not necessarily indicate a state in which the distances are completely coincident with each other, but the distances between the two are slightly different as long as the effects of the transfer device of the present embodiment can be enjoyed. It may be.

When the mold is held with respect to the first mold holding means, typically, the first contact surface is disposed at a position closer to the mold than the second contact surface. Specifically, since the first mold holding means is held in contact with the mold, the distance between the first contact surface and the mold is substantially zero, while the second contact surface is against the mold. Since it is in a state of being arranged at a position different from the first contact surface, it is located at a predetermined distance from the mold and the first contact surface.

Thereafter, when the relative position between the first contact surface and the second contact surface changes due to the operation of the first mold holding means or the second mold holding means, and the mold is pressed by the transfer means. The first contact surface and the second contact surface are arranged at the same distance with respect to the mold. Specifically, with respect to one surface of the mold, the first mold holding means on the first contact surface and the second mold holding means on the second contact surface are in contact with each other and held, The transfer unit presses the mold against the transfer target.

According to the configuration of the transfer apparatus of the present embodiment, as described above, the area of the first mold holding means (that is, the area of the first contact surface) that comes into contact with the mold (in other words, receives the mold at the time of contact). Can be made relatively small, so that it is possible to reduce the influence of the slip that occurs in the direction parallel to the first contact surface of the mold. In this way, by suppressing the slip on the contact surface between the mold and the first mold holding means, it is possible to realize the holding after suitably fixing the mold at a desired position in the first mold holding means when the mold is installed. It becomes possible. As a result, it is possible to suppress damage to the mold and the first mold holding means due to the slip, and relatively easily align the mold on the first mold holding means.

When the mold is pressed by the transfer means, the control means moves the first mold holding means so that the tip of the suction nozzle of the first mold holding means is flush with the flat surface on the second mold holding means. For this reason, the mold contacts and holds the first mold holding means and the second mold holding means at a portion having a larger area on the second contact surface than the contact portion with the first mold holding means at the time of installation. Is done.

According to such a configuration, the mold is held in a wider area using both the first mold holding means and the second mold holding means as compared to when the mold and the first mold holding means are in contact with each other. Thus, the mold can be pressed. For this reason, it is possible to make the distribution of the pressing force applied to the mold more uniform when pressing the transfer target. Therefore, transfer of a suitable pattern can be realized, which leads to an improvement in yield by the transfer device.

In another aspect of the first embodiment of the transfer device of the present invention, the first contact surface is in contact with a region where the pattern is not formed on a surface of the mold where the pattern is not formed, The second contact surface is in contact with a region including a region where the pattern is formed on a surface of the mold where the pattern is not formed.

According to this aspect, the first mold holding means is configured and arranged to come into contact with the mold and realize holding in a region corresponding to a region where the pattern of the pattern surface is not formed on the non-pattern surface of the mold. Has been. Further, the second mold holding means is configured to contact the mold and realize holding at least in a region corresponding to a region including a region where a pattern is formed on the pattern surface in the non-pattern surface of the mold, and Has been placed. The “area where the pattern is formed” on the pattern surface of the mold is intended to indicate an area where a pattern to be actually transferred is formed by being pressed against the transfer target. On the other hand, even in a region where some pattern structure is formed on the pattern surface, such a pattern structure is formed if the pattern structure is not intended to be transferred to the transfer target. The region to be processed may be treated as “a region where a pattern is not formed”.

With this configuration, when the mold is pressed against the transfer target, the first mold holding means comes into contact with the mold at least in a region including a region corresponding to the region where the pattern is formed. For this reason, it is possible to realize the pressing to the transfer body through the first mold holding means so that the pressure distribution at the time of pressing on the surface on which the pattern of the mold is formed becomes uniform. For this reason, it becomes possible to appropriately transfer the pattern on the pattern surface to the transfer target, leading to an improvement in yield by the transfer device.

In another aspect of the first embodiment of the transfer device of the present invention, the first contact surface is in contact with the mold at an outer peripheral portion of a surface of the mold where the pattern is not formed, and the second contact surface The contact surface is in contact with the mold at the inner periphery of the surface of the mold where the pattern is not formed.

According to this aspect, the first mold holding means is configured and arranged so as to come into contact with the mold at the outer peripheral portion on the back surface of the mold and to further realize the holding. Further, the second mold holding means is configured and arranged so as to come into contact with the mold and realize holding at the inner peripheral portion on the back surface of the mold.

With this configuration, the first stage holding of the mold by the first mold holding means can be performed at the outer peripheral portion of the mold, and the holding is relatively stable as compared with the holding at the inner peripheral portion. Can be realized.

In general, the pattern of the mold is often provided on the inner peripheral side of the mold on the pattern surface. Therefore, by performing the first stage holding on the outer peripheral portion of the mold, the pattern on the non-pattern surface as described above. An effect equivalent to that in the case where holding is performed in a region corresponding to a region in which no is formed can be obtained.

In another aspect of the first embodiment relating to the transfer device of the present invention, the mold held by the first mold holding means is pressed so that the first in the direction perpendicular to the first contact surface is obtained. The relative position between the first contact surface and the second contact surface changes.

The transfer device according to this aspect includes a pressing member such as a clamp mechanism, and moves the first mold holding means for holding the mold by pressing the mold with the clamp mechanism.
At this time, the clamp mechanism presses the mold in the direction from the first contact surface toward the second contact surface against the mold in contact with the first mold holding unit on the first contact surface. The first mold holding means moves in the direction of the second contact surface by this pressing force, and the relative position between the first contact surface and the second contact surface formed by the first mold holding means changes. . At this time, publicly, the first contact surface and the second contact surface are the same surface.

It becomes possible to provide the structure for enjoying the effect mentioned above comparatively easily by comprising in this way. Moreover, since the clamp mechanism mentioned above is a structure which adds pressing force with respect to a mold, it can be used also for the purpose of strengthening holding | maintenance of a mold.

Further, according to the transfer device of the present embodiment, it is possible to confirm whether or not the mold is in contact with the first mold holding means from the position of the first mold holding means. That is, since the first mold holding means moves in accordance with the mold contact and holding mode, the mold is moved to the first mold holding means by detecting the position of the first mold holding means and the applied pressure. It is possible to detect whether contact has been made.

If comprised in this way, sensors, such as a pressure sensor for detecting whether a mold is contacting each mold holding means, Preferably it is for detecting the position and pressure of a 1st mold holding means. On the other hand, it is not necessary to arrange a device such as a pressure sensor in a portion of the first mold holding means and the second mold holding means that contacts the mold. For this reason, even when heating or UV light irradiation is performed to cure the transfer layer of the transfer target, it is possible to place sensors in a position that is not affected by heat or UV light. There is no need for a special structure to prevent the effects of heat and UV light on the varieties. Further, by arranging the sensors at a position other than the portion in contact with the mold in the first mold holding means and the second mold holding means, the structure of each holding means can be made relatively simple.

At this time, the first mold holding means may be supported by an elastic member provided between the second mold holding means.

In such a configuration, the vertical position between the first contact surface and the second contact surface of the first mold holding means can be changed with the deformation of the elastic member.

More specifically, when the clamp mechanism is not pressing the mold, the tip of the first mold holding means protrudes from the surface of the second mold holding means to form the first contact surface.

On the other hand, when the clamp mechanism presses the mold, a pressing force is applied to the elastic member via the mold and the first mold holding means. According to this configuration, for example, deformation such as contraction occurs in the elastic member in accordance with such a pressing force, and the first mold holding means supported by the elastic member moves in accordance with the deformation. The elastic member of this aspect is an elastic body that generates an elastic force corresponding to a predetermined spring coefficient in response to an external force such as pressing due to mechanical or some other factor. At this time, the pressing force of the clamp mechanism and the elastic force of the elastic member are set so that at least the first contact surface formed by the tip of the first mold holding means has the same height as the second contact surface. Various conditions are set. In other words, when the elastic member is deformed so that the first contact surface formed by the first mold holding means is at the same height as the second contact surface, the elastic force of the elastic member is It is set to balance with pressure.

It becomes possible to provide the structure for enjoying the effect mentioned above comparatively easily by comprising in this way. Further, the operation of setting the first contact surface of the first mold holding means and the second contact surface of the second mold holding means to the same height can be easily realized without providing a dedicated actuator. It is beneficial in construction.

Further, the second mold holding means may have a recess in the second contact surface, and the first mold holding means may be supported by the elastic member in the recess.

If comprised in this way, the structure which makes a 1st contact surface and a 2nd contact surface the same surface by a comparatively simple structure by adjusting the depth of a recessed part and the elastic coefficient and size of an elastic member. It can be realized.

In another aspect of the first embodiment of the transfer device of the present invention, the first mold holding means holds the mold by suction.

The first mold holding means in this aspect is, for example, an adsorption member having an adsorption groove connected to a vacuum pump or the like, and the adsorption portion comes into contact with the negative pressure in the adsorption groove due to the operation of the vacuum pump. The mold surface (that is, the back surface of the surface on which the pattern in the mold is formed) is adsorbed. By such an adsorbing portion, holding of the mold is realized.

With such a configuration, it is possible to realize the holding of the mold relatively easily and enjoy the effects according to the various aspects described above. Note that the first mold holding means may realize holding of the mold by using other holding members in addition to such holding members by suction.

In the second embodiment of the transfer apparatus of the present invention, the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the first surface of the transfer object. A transfer device for transferring to a second surface, wherein the first mold holding means for holding the first mold on a first contact surface, and the second mold holding means for holding the first mold on a second contact surface. A third mold holding means for holding the second mold on a third contact surface; a fourth mold holding means for holding the second mold on a fourth contact surface; and the pattern on the transfer object. A transfer means for transferring, the relative positions of the first mold holding means and the second mold holding means being variable, and the relative relationship between the third mold holding means and the fourth mold holding means. The position is variable.

According to the second embodiment of the transfer apparatus of the present invention, it has means for holding two molds, a first mold holding means for holding the first mold and a second mold holding means for holding the second mold. . Of these two molds, the first mold was pressed against the first surface of the transferred body and the second mold was pressed against the second surface of the transferred body, thereby forming each mold. Pattern transfer is performed on both sides of the transfer object. At this time, each pressing may be performed in succession, or may be performed simultaneously. For example, when using a transfer object in which the first surface and the second surface are provided on opposite sides, the transfer object is sandwiched between the first mold and the second mold, and the transfer is performed simultaneously by pressing from both surfaces. You may do it.

Furthermore, according to the second embodiment of the transfer device of the present invention, various effects similar to those of the first embodiment of the transfer device of the present invention described above can be enjoyed.

In the third embodiment related to the transfer device of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

The third embodiment according to the transfer device of the present invention is a transfer device that operates in accordance with an instruction from a control device and transfers a pattern formed on a mold to a transfer target, and in response to an instruction from the control device. A first mold holding means for holding the mold on the first contact surface; a second mold holding means for holding the mold on the second contact surface in response to an instruction from the control device; and the control device. And a transfer unit that transfers the pattern to the transfer target according to the instruction of the control unit, and a relative position between the first mold holding unit and the second mold holding unit according to the instruction of the control device. To change.

According to the third embodiment of the transfer apparatus of the present invention, each part in the first embodiment of the transfer apparatus of the present invention and one aspect thereof based on an instruction from a control device connected to the transfer apparatus. The same operation can be performed. For this reason, according to 3rd Embodiment which concerns on the transfer apparatus of this invention, the various effects similar to 1st Embodiment and its one aspect | mode which concern on the transfer apparatus of this invention mentioned above can be enjoyed.

In the third embodiment related to the transfer device of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

1st Embodiment which concerns on the transfer method of this invention is a transfer method in the transfer apparatus which transfers the pattern formed in the mold to a to-be-transferred body, Comprising: The 1st holding process hold | maintains the said mold on a 1st contact surface A second holding step for holding the mold on a second contact surface, a transfer step for transferring the pattern onto the transfer target, and the mold held on the first contact surface, The relative positions of the first mold holding means and the second mold holding means are changed.

According to the first embodiment of the transfer method of the present invention, various effects similar to those of the first embodiment and one aspect thereof of the transfer apparatus of the present invention described above can be enjoyed.

In the first embodiment related to the transfer method of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

In the second embodiment of the transfer method of the present invention, the pattern formed on the first mold is transferred to the first surface of the transfer object, and the pattern formed on the second mold is transferred to the first surface of the transfer object. A transfer device that transfers to the second surface, a first holding step of holding the first mold on a first contact surface, a second holding step of holding the first mold on a second contact surface, A third holding step for holding the second mold on a third contact surface; a fourth holding step for holding the second mold on a fourth contact surface; and a transfer step for transferring the pattern to the transfer target. And changing at least one of a relative position between the first mold holding means and the second mold holding means and a relative position between the third mold holding means and the fourth mold holding means. .

According to the second embodiment of the transfer method of the present invention, the same various effects as those of the second embodiment and the first embodiment of the transfer apparatus of the present invention described above can be enjoyed. .

In the second embodiment related to the transfer method of the present invention, it is possible to adopt various aspects similar to the various aspects of the first embodiment related to the transfer apparatus of the present invention described above.

An embodiment according to the computer program of the present invention is a computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer target, and the first is to hold the mold on a first contact surface. Causing the transfer device to execute a holding step, a second holding step for holding the mold on a second contact surface, and a transfer step for transferring the pattern to the transfer target, and the first mold holding means and the The relative position with respect to the second mold holding means is changed.

According to the embodiment of the computer program of the present invention, the computer program is read from a recording medium such as a ROM, a CD-ROM, a DVD-ROM, and a hard disk that stores the computer program, and executed. If the computer program is executed after being downloaded to the computer via the communication means, the transfer apparatus can execute the various operations in the first embodiment according to the transfer method of the present invention described above relatively easily. I can do it.

As described above, the first embodiment and the third embodiment according to the transfer apparatus of the present invention include the first mold holding means, the second mold holding means, and the transfer means. The second embodiment according to the transfer apparatus of the present invention includes a first mold holding means, a second mold holding means, a third mold holding means, a fourth mold holding means, and a transfer means. The first embodiment according to the transfer method of the present invention includes a first mold holding step, a second mold holding step, a transfer step, and mold holding control. The second embodiment according to the transfer method of the present invention includes a first mold holding step, a second mold holding step, a third mold holding step, a fourth mold holding step, a transfer step, and a first mold holding control. A process and a second mold holding control process. The embodiment according to the computer program of the present invention causes the transfer device to execute the first mold holding step, the second mold holding step, the transfer step, and the mold holding control. Therefore, it is possible to provide a transfer device capable of suppressing a slip of the mold on the contact surface between the member holding the mold and the mold in the transfer device and performing a suitable transfer operation.

The operation and other gains of the various embodiments according to the transfer device of the present invention will be described in more detail using the following examples.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(1) Basic Configuration Example First, the basic configuration of the transfer apparatus of the present invention will be described with reference to FIG. FIG. 1 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 which is an embodiment of a transfer apparatus of the present invention.

The imprint apparatus 1 shown in FIG. 1 is a UV-type transfer apparatus that transfers a pattern on a mold to a transfer target having a transfer layer that is cured by UV irradiation. Further, the imprint apparatus 1 uses the lower mold 200a and the upper mold 200b on which patterns such as unevenness to be transferred are formed, and the lower transfer layer 301a and the upper surface formed on the lower surface of the substrate 300 that is a transfer target. In this configuration, transfer is performed on both of the upper transfer layer 301b formed on the substrate.

1 shows the imprint apparatus 1 in a state where the lower mold 200a, the upper mold 200b, and the substrate 300 are installed.

As shown in FIG. 2A, the lower mold 200a has a disk shape having a center hole in the center or a shape similar to the disk, and a pattern such as irregularities is formed near the center hole on the pattern surface. A pattern area is constructed. At least a portion corresponding to the pattern region of each mold is made of a material that transmits UV light, such as quartz glass, and is preferably hardly affected by a change in character due to irradiation with UV light. For convenience, the outside of the pattern area on the pattern surface is referred to as a non-pattern area. The upper mold 200b has the same configuration as the lower mold 200a. Further, the pattern surface of the lower mold 200a and the upper mold 200b is subjected to a surface treatment for the purpose of improving mold releasability of the mold and the substrate at the time of mold release described later, for example, a surface treatment with a silane coupling agent or the like, A release layer having a thickness of a single molecule to several molecules is formed.

In this embodiment, the lower mold 200a is a specific example of the “mold” or “second mold” of the present invention, and the upper mold 200b is a specific example of the “mold” or “first mold” of the present invention. It is an example.

The substrate 300 has a disk-like shape having a center hole whose diameter is smaller than the center hole of the mold at the center, and has a lower transfer layer 301a and an upper transfer layer 301b made of a material that is cured by UV irradiation on the lower surface and the upper surface. .

As shown in FIG. 1, the imprint apparatus 1 connects a lower mechanism part A including a lower base 110a, an upper mechanism part B including an upper base 110b, and the lower base 110a and the upper base 110b. A ball screw 101 that rotates, an actuator 104 that rotates the ball screw, a control unit 102 that controls the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation unit that can input user instructions to the control unit 102 103.

The lower mechanism A is provided on the upper surface of the lower base 110a, and includes a lower center pin 120a, a lower UV irradiation unit 130a, a lower center pin driving unit 140a, a lower mounting table 150a, A side mold holding part 152a and a lower mold clamp 153a are provided.

The lower base 110a is a member on the board. The lower base 110a is provided with a lower mounting table 150a and a lower opening 151a, and has a screw hole portion in which a screw groove into which the ball screw 101 is screwed is cut. .

The lower center pin 120a is a member having a cylindrical tip portion 121a, a substrate support portion 122a, and a mold support portion 123a having different diameters. The lower center pin 120a is connected to a lower center pin driving unit 140a, which will be described later, and penetrates a center hole and a lower opening 151a of the lower mounting table 150a, which will be described later. It is supported so as to be perpendicular to the surface Sa2.

The diameter of the tip 121a of the lower center pin 120a is smaller than the diameter of the substrate support 122a and the center hole of the substrate 300 described later. The diameter of the substrate support portion 122a is larger than the diameter of the center hole of the substrate 300, and smaller than the diameters of the center holes of the mold support portion 123a, the lower mold 200a and the upper mold 200b described later. Moreover, the diameter of the mold support part 123a is larger than the diameters of the center holes of the lower mold 200a and the upper mold 200b and smaller than the diameters of the center hole and the lower opening 151a of the lower mounting table 150a.

The lower UV irradiation unit 130a is electrically connected to the control unit 102 via a signal line (not shown), and the lower transfer layer 301a of the substrate 300 is applied in accordance with a control signal supplied from the control unit 102. The lower transfer layer 301a of the substrate 300 is irradiated with UV light to be cured through the lower opening 151a and the UV light transmission region of the lower mounting table 150a described later. The lower UV irradiation unit 130a may be configured to be retracted except when necessary, such as when UV light is irradiated in the transfer operation.

The lower center pin driving unit 140a moves the lower center pin 120a in the axial direction, that is, in a direction perpendicular to the lower mold holding surface Sa2 of the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. To do.

In addition, the lower center pin driving unit 140a moves the lower center pin 120a vertically upward when releasing the lower mold 200a and the substrate 300 after a transfer operation described later. In this configuration, the mold is released from the mold 200a.

The lower mounting table 150a is the "second mold holding means" of the present invention in the lower mechanism portion A according to the first embodiment of the transfer apparatus, or the "fourth mold holding means" according to the second embodiment of the transfer apparatus. And has a flat lower mold holding surface Sa2 for holding the lower mold 200a, and the lower mold holding surface Sa2 is provided with a center hole at the center, A side mold holding part 152a and a lower mold clamp 153a are provided. Further, the lower mold holding surface Sa2 of the lower mounting table 150a is typically configured wider than the pattern area of the lower mold 200a. The lower mounting table 150a is configured to be movable in two-dimensional directions (X, Y) of the lower mold holding surface Sa2 in order to align the lower mold 200a and the substrate 300. The lower mold holding surface Sa2 is a specific example of the second contact surface in the lower mechanism portion of the present embodiment, and the lower mounting table 150a is used when holding the lower mold 200a as described later. The lower mold holding surface Sa2 comes into contact with the mold.

Of the lower mounting table 150a, at least the region corresponding to the region where the pattern of the lower mold 200a to be mounted is formed is transparent to UV light such as quartz glass, and has a phenotypic change by irradiation with UV light. This is a UV light transmission region made of a material that is difficult to generate. The opening 151a of the lower base 110a is formed in a region corresponding to the UV light transmission region of the lower mounting table 150a.

The lower mold holding part 152a is the "first mold holding means" of the present invention in the lower mechanism part A according to the first embodiment of the transfer device, or the "third mold holding means" according to the second embodiment of the transfer device. A lower suction portion 154a having a lower suction groove 155a for holding the lower mold 200a by vacuum suction or the like, and an elastic member 156a that supports the lower suction portion 154a. Prepare.

FIG. 2B shows the lower mounting table 150a upward (more specifically, vertically upward with respect to the lower mold holding surface Sa2, hereinafter referred to as a vertically upward direction or simply upward). It is a schematic diagram which shows arrangement | positioning of each part at the time of seeing from the perpendicular | vertical downward direction or the downward direction.

As shown in FIG. 2B, the lower suction portion 154a is formed in a corresponding region of the lower mold holding surface Sa2 so as to perform suction at the outer peripheral edge portion of the lower mold 200a to be placed. Arranged in the groove. The lower suction portion 154a is preferably configured with, for example, a flexible resin member so as not to damage the lower mold 200a at the contact portion. Further, as described in detail later, the tip of the lower suction portion 154a (that is, the portion where the lower suction groove 155a for sucking the lower mold 200a is formed) is the first mechanism of the present invention in the lower mechanism portion A. A lower mold suction surface Sa1 that is in contact with the lower mold 200a is formed.

The lower suction groove 155a is configured to be able to suck the lower mold 200a to the lower suction portion 154a by reducing the atmospheric pressure in the groove by the operation of a decompression mechanism (not shown) such as a connected vacuum pump. The

The elastic member 156a is disposed in a groove formed in the lower mold holding surface Sa2, and supports the lower suction portion 154a. The elastic member 156a is configured to be able to bias an elastic force between the lower suction portion 154a and the lower mounting table 150a by a member having elasticity such as a resin or a mechanical structure such as a spring. Due to the presence of the elastic member 156a, the lower suction portion 154a is pressed vertically downward by, for example, a lower mold clamp 153a described later, so that the force for pressing and the elastic force from the elastic member 156a are balanced. Move to position.

The lower mold clamp 153a is a clamp mechanism that is provided on the outer peripheral edge portion further than the position on the lower mounting table 150a where the lower mold 200a is mounted. The lower mold clamp 153a is configured to hold the lower mold 200a by pressing the non-pattern area of the lower mold 200a downward with pressure according to a control signal from the control unit 102. Further, the lower mold clamp 153a presses the lower mold 200a with a force stronger than the pressing force required to hold the lower mold 200a in accordance with a control signal from the control unit 102, thereby lowering the lower mold. The lower mold 200a can be elastically deformed together with the elastic member 156a of the holding portion 152a. Hereinafter, the pressing force for holding the mold is described as holding force, and the pressing force for deforming the mold is described as deformation force.

Here, the structure and arrangement of the lower mold clamp 153a will be described with reference to FIG. FIG. 2C is a schematic view of the lower mold clamp 153a in a state where the lower mold 200a is being pressed as viewed from the vertically upward direction, and further illustrates the arrangement position of the upper mold clamp 153b described later. It is a figure. The lower mold clamp 153a is composed of a plurality of arc-shaped members arranged concentrically with the lower mold 200a in accordance with the disk shape in order to press the lower mold 200a.

The upper mold clamp 153b is also composed of a plurality of arc-shaped members arranged on the same circle. Further, as shown in FIG. 2C, the lower mold clamp 153a and the upper mold clamp 153b are configured such that respective arc-shaped fan-shaped members are mutually inserted and are parallel to the lower mold holding surface Sa2. Even when projecting onto a surface, they are arranged so as not to overlap each other.

Subsequently, returning to FIG. 1, the upper mechanism B will be described.

The upper mechanism B is provided on the lower surface of the upper base 110b, and includes an upper center pin 120b, an upper UV irradiation unit 130b, an upper center pin driving unit 140b, an upper mounting table 150b, an upper mold holding unit 152b, And an upper mold clamp 153b.

The upper base 110b is a member on the board, and is provided with an upper mounting table 150b and an upper opening 151b, and there is a screw hole portion in which a screw groove into which the ball screw 101 is screwed is cut.

The upper center pin 120b is a cylindrical member having a tip portion having a diameter similar to that of the substrate support portion 122a of the lower center pin 120a. The upper center pin 120b is connected to an upper center pin driving unit 140b, which will be described later, and penetrates the center hole and the upper opening 151b of the upper mounting table 150b, which will be described later, and the lower mold holding surface Sa2 and the upper side, which will be described later. It is supported so as to be perpendicular to the mold holding surface Sb2.

The upper UV irradiation unit 130b is electrically connected to the control unit 102 via a signal line (not shown) and the like, and the upper transfer layer 301b of the substrate 300 is cured in accordance with a control signal supplied from the control unit 102. The upper transfer layer 301b of the substrate 300 is irradiated with UV light through the upper opening 151b and a UV light transmission region of the upper mounting table 150b described later. The upper UV irradiation unit 130b may be retracted except when necessary, such as when UV light is irradiated in the transfer operation.

The upper center pin driving unit 140b moves the upper center pin 120b in the axial direction, that is, in a direction perpendicular to the upper mold holding surface Sb of the upper mounting table 150b in accordance with a control signal supplied from the control unit 102.

Further, the upper center pin driving unit 140b presses the upper center pin 120b in the vertical downward direction when the upper mold 200b and the substrate 300 after the transfer operation described later are released, thereby causing the vertical position of the substrate 300 to move. Is fixed.

The upper mounting table 150b is one of the “second mold holding means” of the present invention in the upper mechanism portion A according to the first embodiment of the transfer apparatus or the “second mold holding means” according to the second embodiment of the transfer apparatus. It is a specific example, and has a flat upper mold holding surface Sb2 for holding the upper mold 200b. The upper mold holding surface Sb2 is provided with a center hole at the center, and an upper mold holding portion 152b. An upper mold clamp 153b is provided. The upper mold holding surface Sb2 of the upper mounting table 150b is typically configured to be wider than the pattern area of the upper mold 200b. The upper mounting table 150b is configured to be movable in two-dimensional directions (X, Y) of the upper mold holding surface Sb2 in order to align the upper mold 200b and the substrate 300. The upper mold holding surface Sb2 is a specific example of the fourth contact surface in the upper mechanism portion B of the present embodiment, and the upper mounting table 150b has an upper side when holding the upper mold 200b, as will be described later. The mold holding surface Sb2 comes into contact with the mold.

Of the upper mounting table 150b, at least a region corresponding to a region where the pattern of the upper mold 200b to be mounted is formed transmits UV light such as quartz glass, and changes in characteristics are caused by irradiation of the UV light. This is a UV light transmission region made of a difficult material. The opening 151b of the upper base 110b is formed in a region corresponding to the UV light transmission region of the upper mounting table 150b.

The upper mold holding part 152b is a specific example of the “first mold holding unit” according to the first embodiment of the transfer device of the present invention or the “first mold holding unit” according to the second embodiment of the transfer device. And an upper suction part 154b having an upper suction groove 155b for holding the upper mold 200b by vacuum suction or the like, and an upper elastic member 156b that supports the upper suction part 154b. Each of the upper suction portion 154b, the upper suction groove 155b, and the upper elastic member 156b has the same configuration as the lower suction portion 154a, the lower suction groove 155a, and the lower elastic member 156a of the upper mechanism portion A.

The upper mold clamp 153b is a clamp mechanism that is provided at the outer peripheral edge portion further than the position on the upper mounting table 150b where the upper mold 200b is mounted. The upper mold clamp 153b is configured to hold the upper mold 200b by pressing the non-pattern area of the upper mold 200b upward with pressure according to a control signal from the control unit 102. Further, the upper mold clamp 153b presses the upper mold 200b with a force stronger than the pressing force necessary to hold the upper mold 200b in accordance with a control signal from the control unit 102, so that the upper mold holding unit 152b The upper mold 200b can be elastically deformed together with the upper elastic member 156b. The tip of the upper suction portion 154b (that is, the portion where the upper suction groove 155b that sucks the upper mold 200b is formed) is a specific example of the first contact surface in the upper mechanism portion B of the present embodiment. Thus, the upper mold suction surface Sb1 that contacts the upper mold 200b is formed.

The control unit 102 is an information processing apparatus such as a CPU (Central Processing Unit), for example, and is a specific example of the “mold holding control unit” in the present embodiment. By supplying control signals to the lower mold clamp 153a of A and the upper mold clamp 153b of the upper mechanism portion B, the position of each mold holding portion is controlled to control the holding of the mold or the deformation of the mold. In addition to this, the control unit 102 determines the lower UV irradiation unit 130a, the lower center pin driving unit 140a, and the lower side of the lower mechanism unit A according to an input signal indicating a user instruction supplied from the operation unit 103. Control signals for controlling the operations of the mold clamp 153 a, the upper UV irradiation unit 130 b of the upper mechanism B, the upper center pin driving unit 140 b and the upper mold clamp 153 b, and the actuator 104 are supplied.

The operation unit 103 includes a plurality of buttons or a keyboard that can input an instruction by the user, and supplies an input signal corresponding to the input user instruction to the control unit 102. The control unit 102 reads an operation processing program stored in an internal memory or the like according to the input signal, generates a control signal according to the instruction, and supplies the control signal to each unit.

The actuator 104 is a mechanism such as a motor that can move the upper mounting table 150b toward or away from the lower mounting table 150a in accordance with a control signal supplied from the control unit 102. Specifically, the actuator 104 rotates the ball screw 101 in accordance with a control signal supplied from the control unit 102, whereby the upper base 110b engaged with the ball screw 101 is changed to the upper mounting base 150b and the lower mounting base. It moves in the vertical direction while maintaining the parallel positional relationship with 150a. At this time, for example, four ball screws 101 are provided so as to connect the four corners of the lower base 110a and the upper base 110b, and a plurality of actuators 104 are also provided to rotate the corresponding ball screws 101. Yes.

According to such an operation of the actuator 104, by moving the upper base 110b in the vertical upward direction, the upper mounting base 150b is separated from the lower mounting base 150a, and the upper base 110b is moved in the vertical downward direction. Thus, the upper mounting table 150b comes close to the lower mounting table 150a.

The actuator 140 moves the upper mounting table 150b vertically downward in a transfer operation described later, thereby pressing the upper mold 200b and the substrate 300 to each other, and further pressing the lower mold 200a and the substrate 300 to each other. To do.

The actuator 104 moves the upper mold table 150b vertically upward while holding the upper mold 200b when the upper mold 200b and the substrate 300 after the transfer operation described later are released. Release from the substrate 300.

FIG. 3 is a schematic transmission diagram when the lower base 110a, the lower mechanism A, and the surrounding configuration are viewed from the vertically upward direction. Note that FIG. 3 does not show the lower mold holding portion 152a and the lower mold clamp 153a provided on the lower mounting table 150a.

As shown in FIG. 3, in the imprint apparatus 1, four pole screws 101 are screwed into the four corners of a square lower base 110a, and the bottom is a square at the center and smaller in area than the lower base 110a. A side mounting table 150a is arranged. In addition, a circular opening 151a is formed in a central portion of the lower base 110a and at least a portion corresponding to a pattern region of the lower mold 200a placed on the lower placement base 150a. A lower UV irradiation part 130a is formed below the part 151a.

The actuator 104 is connected to each of the pole screws 101 arranged at the four corners of the lower base 110a, and the pole screws are rotated based on a control signal from the control unit 102.

The upper base 110b and the upper mechanism B are also configured in the same manner as the lower base 110a and the lower mechanism A, and are vertically upward from the lower base 110a at the four corners of the square upper base 110b. Four pole screws 101 extending in the direction are screwed together.

Subsequently, the structure of the lower mold holding portion 152a and the lower mold clamp 153a provided on the lower mounting table 150a will be described with reference to FIG. FIGS. 4A to 4C are schematic views showing the structures of the lower mounting table 150a and the lower mold holding part 152a in plan, respectively.

As shown in FIG. 4A, the front end portion of the lower suction portion 154a held by the lower elastic member 156a is positioned vertically upward with respect to the lower mold holding surface Sa2 of the lower mounting table 150a. Are arranged as follows. Here, the surface formed by the tip of the lower suction portion 154a shown in FIG. 4A (that is, the portion where the lower suction groove 155a for sucking the lower mold 200a is formed) is defined as the lower mold suction surface. Sa1. On the other hand, the surface of the lower mounting table 150a that is in contact with the lower mold 200a, and preferably the surface formed by the region on the lower mold holding surface Sa2, is referred to as the lower mold holding surface Sa2. The lower mold suction surface Sa1 is a specific example of the first contact surface in the present embodiment, and the lower suction portion 154a constitutes a specific example of the first mold holding means in the present embodiment. The lower mold holding surface Sa2 is a specific example of the second contact surface in the present embodiment, and the lower mounting table 150a constitutes a specific example of the second mold holding means in the present embodiment. At this time, the lower mold suction surface Sa1 and the lower mold holding surface Sa2 form a lower mold holding surface Sa2 with respect to the lower mold 200a held at least on the lower mold suction surface Sa1. The side mounting tables 150a are separated so as not to contact each other. For example, the distance between the two is preferably 100 micrometers or more.

The lower suction portion 154a is connected to the lower mounting table 150a by a lower elastic member 156a. At least the lower elastic member 156a is, for example, pressed so that the tip of the lower suction portion 154a has the same height as the lower mold holding surface Sa2 in the lower mounting table 150a (that is, the lower mold suction surface). It is made of a deformable material (so that Sa1 has the same height as the lower mold holding surface Sa2).

In order to realize such deformation with high accuracy, the lower elastic member 156a is adjusted with a stripper bolt or shim. The lower elastic member 156a preferably has a structure in which galling is unlikely to occur on the contact surface with the lower mounting table 150a. For example, the lower elastic member 156a is made of a metal material different from that of the lower mounting table 150a, In addition, a combination of shafts and a retainer structure are employed. The lower elastic member 156a is not limited to the deformable material shown above, and may be a mechanical mechanism that can be similarly deformed or moved.

In the lower mold holding part 152a having such a structure, the control unit 102 operates the lower mold 200a placed on the lower suction part 154a by operating a vacuum pump (not shown) or the like. The inside of 155a is depressurized and adsorbed. At this time, as shown in FIG. 4B, the lower mold 200a is held by suction on the lower mold suction surface Sa1.

Further, the control unit 102 operates the lower mold clamp 153a and presses the lower mold 200a against the lower mounting table 150a in the vertical lower direction, so that the space between the lower mold clamp 153a and the lower mounting table 150a is increased. To hold the lower mold 200a. At this time, the lower mold 200a is pressed vertically downward (arrow direction in FIG. 4C) by the lower mold clamp 153a, so that the lower elastic member 156a pressed through the lower mold 200a is pressed. Deformation occurs, and the lower suction part 154a is pushed vertically downward. As shown in FIG. 4C, the distal end portion of the lower suction portion 154a that has been pushed in (that is, the portion that forms the lower mold suction surface Sa1) is located at the lower mold holding surface Sa2 of the lower mounting table 150a. The lower mold suction surface Sa1 and the lower mold holding surface Sa2 become the same height.

The structures of the lower mounting table 150a and the lower mold holding part 152a are not limited to the structure shown in FIG. 4A, and any structure may be used as long as the above-described operation can be performed. . For example, as shown in FIG. 4D, the lower mounting table 150a has a predetermined upper surface on the upper surface in a direction perpendicular to the outer peripheral side from the outer diameter of the substrate 300 and toward the peripheral edge. It may be a step structure having a depth. The depth of the step structure may be arbitrarily set according to the distance between the lower mold suction surface Sa1 and the lower mold holding surface Sa2, and at least the lower mold 200a held on the lower mold suction surface Sa1. On the other hand, it is preferable that the lower mounting table 150a is not in contact, for example, 100 micrometers apart. The shape of the step structure is such that the lower mold holding surface 150a is not in contact with the lower mold 200a held on the lower mold suction surface Sa1, and the lower mold clamp surface 153a is operated to operate the lower mold suction surface. Any shape may be used as long as it does not hinder Sa1 and the lower mold holding surface Sa2 from having the same height.

Further, as shown in FIG. 4 (e), the lower mounting table 150a may be formed of different members at the position where the lower elastic member 156a and the lower suction portion 154a are arranged. For example, in the case of the UV-type imprint apparatus 1, the hatched portion on the inner peripheral side from the lower elastic member 156a and the lower suction portion 154a is formed of a transparent material such as quartz glass, and the plain portion on the outer peripheral side is a metal material It is good also as a structure which comprises by combining both. With such a structure, the shape processing of the lower mounting table 150a becomes easier, which is effective in terms of cost reduction in the apparatus configuration. Each of the upper mounting table 150b and the upper mold holding unit 152b may have a structure according to the structure of the lower mounting table 150a and the lower mold holding unit 152a.

Note that the structures of the upper mounting table 150b, the upper mold holding part 152b, and the upper mold clamp 153b may be the same as those of the lower mechanism part A unless otherwise specified.

(2) Basic Operation Example Next, a series of transfer operations by the imprint apparatus 1 will be described with reference to FIGS. FIG. 5 is a flowchart showing a series of transfer operations performed by the imprint apparatus 1, and FIGS. 6 and 7 are diagrams schematically showing the operation of each part of the imprint apparatus 1 in each process during the transfer operation. is there. Here, the operation flow of each process shown in the flowchart of FIG. 5 will be described with reference to the operation of the imprint apparatus 1 shown in FIGS. 6 and 7.
Lower elastic member 156a Lower adsorption portion 154a Upper elastic member 156b Upper adsorption portion 154b Upper adsorption portion 154b Upper adsorption portion 154b Upper adsorption portion 154b Upper elastic member 156b Upper adsorption portion 154b Upper adsorption portion 154b Lower adsorption portion 154a Upper adsorption portion 154b Upper suction part 154b Lower elastic member 156a Lower suction part 154a Lower suction part 154a In the flow of the transfer operation, first, the upper mold 200b, the lower mold 200a and the substrate 300 are not installed. The upper mold 200b is attached to the printing apparatus 1 (FIG. 6 [state 1]) (step S101). Here, in the imprint apparatus 1 in the initial state, the lower elastic member 156a of the lower mold holding portion 152a is not deformed, and the lower suction portion 154a is held on the lower mold in the lower mounting table 150a. It protrudes vertically upward from the surface Sa2 (in other words, the lower mold holding surface Sa2) to form the lower mold suction surface Sa1. Similarly, the upper elastic member 156b of the upper mold holding portion 152b is not deformed, and the upper suction portion 154b is vertically below the upper mold holding surface Sb2 (in other words, the upper mold holding surface Sb2) of the upper mounting table 150b. Projecting in the direction to form the upper mold suction surface Sb1.

In step S101, first, the upper mold 200b is moved by the operation of a mold conveying device (not shown) so that the tip 121a of the lower center pin 120a penetrates the center hole of the upper mold 200b. It is installed on the mold support part 123a (FIG. 6 [state 2]).

Subsequently, the control unit 102 operates the actuator 104 so that the upper mold suction surface Sb1 of the upper suction unit 154b is in contact with the upper surface of the upper mold 200b (that is, the back surface of the surface on which the pattern is formed). The mounting table 150b is moved vertically downward. After the upper mold suction surface Sb1 of the upper suction part 154b comes into contact with the upper mold 200b, the control unit 102 operates a decompression unit (not shown) and the like so that the upper mold 200b is moved by the upper suction part 154b of the upper mounting table 150b. Adsorb and hold.
Then, the control unit 102 transmits a control signal to the upper mold clamp 153b and fixes the upper mold 200b to the upper mounting table 150b by pressing the upper mold 200b vertically upward (FIG. 6 [State 3]). At this time, the upper elastic member 156b is deformed by being pressed by the upper mold clamp 153b, and the front end portion of the upper suction portion 154b is disposed at the same height as the upper mounting table 150b. That is, the upper mold suction surface Sb1 formed by the upper suction portion 154b and the upper mold holding surface Sb2 formed by the upper mounting table 150b have the same height. After that, under the control of the control unit 103, the lower mounting member 154a lower adsorbing part 154a lower adsorbing part 154a in which the upper mounting table 150b rises to the initial arrangement position by the operation of the actuator 102 (FIG. 6 [state 4]) .

Subsequently, the lower mold 200a is attached to the imprint apparatus 1 (step S102). More specifically, in step S102, first, the lower mold 200a is moved in such a manner that the front end portion 121a of the lower center pin 120a penetrates the center hole of the lower mold 200a by an operation of a not-shown mold conveyance device or the like. Then, the lower center pin 120a is installed on the mold support part 123a (FIG. 6 [state 5]).

Subsequently, the control unit 102 operates the lower center pin driving unit 140a so that the lower mold suction surface Sa1 of the lower suction unit 154a is the lower surface of the lower mold 200a (that is, the back surface of the surface on which the pattern is formed). ), The lower center pin 120a is moved vertically downward. After the lower mold suction surface Sa1 of the lower suction part 154a and the lower mold 200a come into contact with each other, the control unit 102 operates a decompression unit (not shown) to lower the lower suction part 154a of the lower mounting table 150a. The upper mold 200a is adsorbed and held.

Then, the control unit 102 transmits a control signal to the lower mold clamp 153a and presses the lower mold 200a vertically downward to fix it to the lower mounting table 150a (FIG. 6 [state 6]). . At this time, the lower elastic member 156a is deformed by being pressed by the lower mold clamp 153a, and the tip of the lower suction portion 154a is disposed at the same height as the lower mounting table 150a. That is, the lower mold suction surface Sa1 formed by the lower suction portion 154a and the lower mold holding surface Sa2 formed by the lower mounting table 150a have the same height.

Next, by the operation of a substrate transfer device (not shown), the substrate 300 is placed on the substrate support portion 122a of the lower center pin 120a so that the tip 121a of the lower center pin 120a penetrates the center hole of the substrate 300. (Step S103, FIG. 6 [State 7]). At this time, the control unit 102 may align the lower mold 200a and the upper mold 200b with the substrate 300 as necessary.

Subsequently, the control unit 102 transmits a control signal to the lower mold clamp 153a, and gradually increases the force pressing the lower mold 200a from the holding force to the deforming force, thereby deforming the lower mold 200a.

At the same time or before and after, the control unit 102 transmits a control signal to the upper mold clamp 153b, and gradually increases the force pressing the upper mold 200b from the pressing force to the deformation force, thereby deforming the upper mold 200b. (Step S104, FIG. 6 [State 8]).

Subsequently, the control unit 102 operates the lower center pin driving unit 140a to move the lower center pin 120a vertically downward, and the pattern of the lower transfer layer 301a and the lower mold 200a to be supported is supported. The surface is brought into contact (step S105, FIG. 7 [state 9]). Further, the control unit 102 operates the actuator 104 to move the upper mounting table 150b vertically downward to bring the pattern surface of the upper mold 200b into contact with the upper transfer layer 301b of the substrate 300 (FIG. 7 [state] 10]).

As described above, when deformation such as bending occurs in the mold, when the mold comes into contact with the transfer layer, contact is sequentially made from the side closer to the transfer layer on the pattern surface of the mold that is inclined due to deformation. To do. For example, when the central part of the pattern surface of the mold is bent by the pressing force of the mold clamp so as to be closer to the transfer layer, the mold sequentially contacts the peripheral part from the central part when contacting the transfer layer. .

The deformation of each mold and the contact with the substrate 300 may be performed in the above-described order. Also, the deformation of the lower mold 200a, the contact between the lower mold 200a and the substrate 300, the deformation of the upper mold 200b, You may perform from one side in the order of contact with the upper mold 200b and the board | substrate 300. FIG.

After the contact between each mold and the substrate 300, the control unit 102 transmits a control signal to the lower mold clamp 153a and the upper mold clamp 153b, and gradually reduces the pressing force pressing each mold from the deformation force to the holding force. The deformation of each mold is released (step S106, FIG. 7 [state 11]).

Next, the control unit 102 operates the actuator 104 to move the upper mounting table 150 b vertically downward, and the upper mold 200 b is moved to the upper transfer layer 301 b on the upper surface of the substrate 300, and the lower mold 200 a is moved to the lower surface of the substrate 300. The lower transfer layer 301a is pressed with a predetermined pressing force (step S107). Further, the control unit 102 emits UV light from the lower UV irradiation unit 130a and the upper UV irradiation unit 130b in order to cure the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 while maintaining the pressed state. Let By this operation, the lower transfer layer 301a and the upper transfer layer 301b of the substrate 300 are cured in accordance with the pattern formed on the surface of each mold, and the pattern is transferred (step S108). In addition, it is preferable that the pressure and pressing time during pressing, the intensity of UV irradiation, and the irradiation time are appropriately set according to the characteristics of the transfer layer.

After a series of operations related to transfer such as a predetermined pressing time and UV irradiation is completed, a mold release process for releasing the lower mold 200a and the upper mold 200b from the substrate 300 is performed.

In the mold release operation, the control unit 102 first stops the operation of the actuator 104 that presses the upper mounting table 150b, and releases the pressing state between each mold and the substrate 300. At the same time or before and after, the control unit 102 operates the upper center pin driving unit 140b so that the tip of the upper center pin presses the substrate 300 vertically downward at a predetermined pressure (Step S109, FIG. 7 [ State 12]).

At this time, the substrate 300 is sandwiched between the lower center pin 120a and the upper center pin 120b. The control unit 102 controls the driving modes of the lower center pin driving unit 140a and the upper center pin driving unit 140b so that excessive pressure is not applied to the sandwiched substrate 300.

Subsequently, the control unit 102 performs deformation of the lower mold 200a and the upper mold 200b by the same operation as the above-described step S104 (step S110, FIG. 7 [state 13]). At this time, the pressing force of each mold clamp is controlled to gradually increase from the holding force to the deformation force.

Dependent on the deformation of the mold, as shown in FIG. 7 [State 13], a part of the contact surface between each mold and the substrate 300 is peeled off, resulting in a gap. When such a gap exists on the contact surface, it becomes a mold release start point in the subsequent mold release, and the adhesion force acting between the mold and the transfer layer of the substrate is reduced.

Subsequently, the control unit 102 operates the upper center pin 120b and the actuator 104 to move the upper mounting table 150b to the initial position in the vertical upward direction. At this time, the upper mold 200b moves vertically upward while being held by the upper mounting table 150b, while the substrate 300 is pressed vertically downward (in other words, fixed) by the upper center pin 120b. Therefore, the upper mold 200b and the upper transfer layer 301b of the substrate 300 are released (Step S111, FIG. 7 [State 14]). At this time, the control unit 102 fixes the position of the lower center pin 120a and controls the force with which the upper center pin 120b presses the substrate 300 in the vertical downward direction by torque control.

Next, the control unit 102 holds the upper center pin 120b and the lower center pin 120a holding the substrate 300 up to the initial position of the lower center pin 120a in the vertical upward direction while maintaining the state in which the substrate 300 is held. The lower mold 200a and the substrate 300 are released from each other (step S112, FIG. 7 [state 15]).

After the mold release, the control unit 102 changes the pressing force of the upper mold clamp 153b and the lower mold clamp 153a to the holding force for holding the mold, and releases the deformation of the lower mold 200a and the upper mold 200b. (Step S113, FIG. 7 [State 16]).

The substrate 300 released from the lower mold 200a and the upper mold 200b is removed from the lower center pin 120a by an operation of a substrate transfer device (not shown) (step S114). In addition, when performing transfer using the same lower mold 200a and upper mold 200b for another substrate 300 (step S115: No), the steps from step S103 to step S114 for placing the substrate 300 are performed. Run repeatedly. After all the transfer is completed (step S115: Yes), the lower mold 200a is removed (step S116) and the upper mold 200b is removed (step S117) by an operation of a mold conveyance device (not shown).

Through the series of operations described above, according to the imprint apparatus 1 which is an embodiment of the transfer apparatus of the present invention, the lower mold 200a and the upper mold 200b are placed on the surfaces of the transfer surfaces 301a and 301b of the substrate 300. The formed pattern is transferred.

According to the imprint apparatus 1 of the present embodiment, as described above, in the upper mounting table 150b, the upper suction unit 154b is not pressed by the upper mold clamp 153b in the upper mold 200b direction ( That is, it protrudes vertically downward). For this reason, in the [state 3] where the upper suction portion 154b comes into contact with and sucks the upper mold 200b, the upper mold suction surface Sb1 formed by the upper suction portion 154b is the upper mold holding surface Sb2 formed by the upper mounting table 150b. More apart. On the other hand, in [state 4] in which the upper mold clamp 153b holds the upper mold 200b, the upper elastic member 156b is deformed by the pressing of the upper mold clamp 153b, and the upper mold suction surface Sb1 formed by the upper suction portion 154b. Is the same height as the upper mold holding surface Sb2 formed by the upper mounting table 150b. Therefore, in [State 4], the upper mold 200b is sucked and held by the upper suction portion 154b on the upper mold holding surface Sb2, and is held by the upper mounting table 150b.

Similarly, when the lower mounting table 150a is not pressed by the lower mold clamp 153a, the lower mold suction surface Sa1 formed by the lower suction unit 154a is the lower side formed by the lower mounting table 150a. It is separated from the mold holding surface Sa2 ([state 7]). On the other hand, in [state 8] in which the lower mold clamp 153a holds the lower mold 200a, the lower elastic member 156a is deformed by the pressing of the lower mold clamp 153a, and the lower suction portion 154a is formed. The lower mold suction surface Sa1 has the same height as the lower mold holding surface Sa2 formed by the lower mounting table 150a. Therefore, in [State 8], the lower mold 200a is sucked and held by the lower suction portion 154a on the lower mold holding surface Sa2, and is held by the lower mounting table 150a.

Thus, in the imprint apparatus 1 of the present embodiment, the lower suction part having a relatively small area in the state where the molds 200a and 200b are installed and sucked on any of the mounting tables 150a and 150b. 154a and 154b are in contact with the molds 200a and 200b. And after mold 200a, 200b is hold | maintained by adsorption | suction, it is a mold in mounting base 200a, 200b which has this relatively lower area including this lower adsorption | suction part 154a, 154b by the press of clamp mold 153a, 153b. Holding is realized by contact.

For this reason, it is possible to suitably prevent the molds 200a and 200b from sliding on the surfaces in contact with the mounting tables 150a and 150b (that is, the lower mold holding surface Sa2 and the upper mold holding surface Sb2). On the other hand, when the substrate 300 is pressed, the molds 200a and 200b are held by the mounting tables 150a and 150b on the lower mold holding surface Sa2 and the upper mold holding surface Sb2 and receive the pressing force. Distributed. For this reason, the patterns on the surfaces of the molds 200a and 200b are appropriately pressed against the substrate 300, and appropriate transfer can be realized.

In the imprint apparatus 1 of the present embodiment, the mold is further detected by detecting the suction pressure at the lower suction portions 154a and 154b, the positions of the lower suction portions 154a and 154b, the form of the lower elastic members 156a and 156b, and the like. It can be determined whether or not 200a and 200b are appropriately held. For this reason, it is possible to check the holding state appropriately without incorporating a sensor or the like without complicating the structure of the apparatus.

In addition, when sensors for detecting the respective operations are incorporated into the lower suction portions 154a and 154b or the lower elastic members 156a and 156b, the holding state of the molds 200a and 200b can be monitored in more detail. As a result, it is possible to more suitably prevent problems during transfer.

(3) First Modification Next, a basic configuration of an imprint apparatus 1 ′, which is a first modification of the transfer apparatus according to the present invention, will be described with reference to FIG. FIG. 8 is a schematic view schematically showing a configuration of an imprint apparatus 1 ′ which is a first modification of the transfer apparatus of the present invention.

The imprint apparatus 1 shown in FIG. 8 is configured on the lower surface of the substrate 300 ′ that is a transfer target (in other words, the lower mold 200a with respect to the lower transfer layer 301a that is disposed facing downward). 2 is a transfer device for transferring a pattern formed on the substrate. In addition, in this modification and FIG. 8, about the structure similar to the imprint apparatus 1 shown by FIG. 1, the same number is attached | subjected and description is abbreviate | omitted.

As shown in FIG. 1, the imprint apparatus 1 includes a lower mechanism part A including a lower base 110a, an upper mechanism part B ′ including an upper base 110b, a lower base 110a and an upper base 110b. A ball screw 101 to be connected, an actuator 104 for rotating the ball screw, a control unit 102 for controlling the operation of the lower mechanism unit A and the upper mechanism unit B, and an operation capable of inputting a user instruction to the control unit 102 Unit 103.

In the imprint apparatus 1 ′ shown in FIG. 8, a state in which the lower mold 200 a and the substrate 300 ′ are installed is illustrated. The lower mold 200a is held on the lower mounting table 150a of the lower mechanism portion A so that the surface on which the pattern is formed faces upward. Further, the upper base 110b has a pressing portion 120b so as to form a convex portion with respect to the lower mold holding surface Sa2 of the lower mounting table 150a.

The lower mechanism part A has the same configuration as the lower mechanism part A of the imprint apparatus 1 shown in FIG.

On the other hand, the upper mechanism part B 'of the present modification is provided on the lower surface of the upper base 110b, and includes a pressing part 112b, an upper center pin 120b, and an upper center pin driving part 140b.

The pressing portion 112b is a portion provided to form a convex portion downward on the lower surface of the upper base 110b. During the transfer operation, the pressing portion 112b presses the substrate 300 ′ downward by the operation of the actuator 104, so that the lower side Adhere to the mold 200a. The pressing part 112b has a center hole for placing the upper center pin 120b. The pressing portion 112b is flat and preferably has a lower surface that is wider than at least a region where the lower transfer layer 301a of the substrate 300 'is formed.

According to such an imprint apparatus 1 ', the actuator 104 moves the upper base 110b vertically downward, so that the lower surface of the pressing portion 112b presses the substrate 300' vertically downward. Therefore, the lower transfer layer 301a of the substrate 300 'is brought into close contact with the pattern surface of the lower mold 200a, and the pattern is transferred. Further, the actuator 102 moves the upper base 110b vertically upward, so that the pressing force for mutual pressing between the lower mold 200a and the substrate 300 'is released.

Thereafter, under the control of the control unit 102, the lower center pin 120a and the upper center pin 120b are moved vertically upward while holding the substrate 300 ′, so that the substrate 300 ′ is released from the lower mold 200a. To do.

For this reason, according to the imprint apparatus 1 ′, the pattern formed on the surface of the lower mold 200a is transferred to the transfer layer 301a of the substrate 300 ′ while enjoying the same effect as the imprint apparatus 1 described above. I can do it.

(4) Other Modifications Next, other modifications of the transfer device according to the present invention will be described with reference to FIGS.

FIG. 9 is a schematic diagram schematically showing a configuration of an imprint apparatus 1 ″ and a control apparatus 400 which are a second modified example of the transfer apparatus of the present invention. Note that, in this modification and FIG. 9, the same components as those of the imprint apparatus 1 shown in FIG.

The imprint apparatus 1 ″ has a configuration that does not include the control unit 102 and the operation unit 103 in the imprint apparatus 1 illustrated in FIG. 1. Other parts may be equivalent to the imprint apparatus 1.

The control device 400 includes a control unit 102 ′ and an operation unit 103 ′ having the same configuration as the control unit 102 and the operation unit 103 of the imprint apparatus 1, and is electrically connected to each unit of the imprint apparatus 1 ″. Is done. In this configuration, the control unit 102 ′ of the control device 400 controls the operation by supplying a control signal to each unit of the imprint apparatus 1 ″.

According to the second modification of the transfer device of the present invention, the imprinting device 1 ″ and the control device 400 are arranged at separate positions, and the same effect as that obtained by the imprinting device 1 described above is obtained. You can enjoy it.

As a third modification, there is a device configuration in which one control device 400 is connected to a plurality of imprint devices and controls the operation of each imprint device. In this modification, as shown in FIG. 10A, one control device 400 is provided for n imprint devices 1 ″ -1, 2,... Control of the operation of each imprint apparatus is performed by supplying control signals to the imprint apparatuses 1 ″ -1, 2,... N.

Further, as a fourth modified example, there is an apparatus configuration in which a user's instruction for controlling operations is input by a single operation unit to a plurality of control units respectively connected to a plurality of imprint apparatuses. is there. In this modification, as shown in FIG. 10B, for each of the n imprint apparatuses 1 ″ -1, 2,... N, the individual control units 102′-1, 2,. Are connected to control the operation of each imprint apparatus 1 ″ -1, 2,... N. The operation unit 103 ′ is connected to each of the control units 102 ′-1, 2,... N, and inputs an instruction by a user operation.

According to the third and fourth modifications of the transfer device of the present invention, one control device 400 or operation unit 103 ′ is used for each of the plurality of imprint devices 1 ″ -1, 2,. User instructions can be input. For this reason, centralized management is possible in a factory where many imprint apparatuses are required to operate simultaneously. Moreover, it is useful also in terms of apparatus configuration and cost.

The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the gist or concept of the invention that can be read from the claims and the entire specification, and a transfer apparatus accompanying such a change. And methods, computer programs, and the like are also included in the technical scope of the present invention.

1 imprint device,
101 ball screw,
102 control unit,
103 operation unit,
104 actuator,
110a Lower base,
110b upper base,
120a Lower center pin,
120b upper center pin,
130a Lower UV irradiation part,
130b Upper UV irradiation part,
140a Lower center pin drive unit,
140b upper center pin drive unit,
150a Lower mounting table,
150b upper mounting table,
151a lower opening,
151b upper opening,
152a Lower mold holding part,
152b Upper mold holding part,
153a Lower mold clamp,
153b Upper mold clamp,
154a Lower suction part,
154b upper suction part,
155a Lower suction groove,
155b upper suction groove,
156a lower elastic member,
156b upper elastic member,
200a lower mold,
200b Upper mold,
300 substrates,
301a transfer layer,
301b Transfer layer.

Claims (14)

  1. A transfer device for transferring a pattern formed on a mold to a transfer target,
    First mold holding means for holding the mold on a first contact surface;
    Second mold holding means for holding the mold on a second contact surface;
    A transfer means for transferring the pattern to the transfer object,
    The transfer apparatus characterized in that a relative position between the first mold holding means and the second mold holding means is variable.
  2. A mold holding control means for controlling the position of at least one of the first mold holding means and the second mold holding means;
    The mold holding control means changes a distance between the mold held by the first contact surface and the second contact surface in a direction perpendicular to the first contact surface. The transfer apparatus according to claim 1.
  3. The first mold holding means holds the mold in a state in which the distance between the mold and the first contact surface and the distance between the mold and the second contact surface are different,
    The transfer means transfers the pattern to the transfer object in a state where the distance between the mold and the first contact surface and the distance between the mold and the second contact surface are equal. The transfer device according to claim 1 or 2.
  4. The first contact surface is in contact with a region where the pattern is not formed on a surface of the mold where the pattern is not formed, and the second contact surface is not formed with the pattern of the mold. 4. The transfer device according to claim 1, wherein the transfer device is in contact with a region including a region where the pattern is formed on a surface. 5.
  5. The first contact surface is in contact with the mold at an outer peripheral portion of the surface of the mold where the pattern is not formed, and the second contact surface is an inner surface of the mold where the pattern is not formed. The transfer device according to claim 1, wherein the transfer device is in contact with the mold at a peripheral portion.
  6. A relative position between the first contact surface and the second contact surface in a direction perpendicular to the first contact surface by pressing the mold held by the first mold holding means. The transfer apparatus according to any one of claims 1 to 5, wherein the change is made.
  7. The transfer apparatus according to any one of claims 1 to 6, wherein the first mold holding unit is supported by an elastic member provided between the second mold holding unit and the second mold holding unit.
  8. The second mold holding means has a recess in the second contact surface,
    The transfer device according to claim 7, wherein the first mold holding unit is supported by the elastic member in the concave portion.
  9. The transfer device according to any one of claims 1 to 8, wherein the first mold holding unit holds the mold by suction.
  10. A transfer device for transferring a pattern formed on a first mold to a first surface of a transfer object and transferring a pattern formed on a second mold to a second surface of the transfer object;
    First mold holding means for holding the first mold on a first contact surface;
    Second mold holding means for holding the first mold on a second contact surface;
    Third mold holding means for holding the second mold on a third contact surface;
    A fourth mold holding means for holding the second mold on a fourth contact surface;
    A transfer means for transferring the pattern to the transfer object,
    The relative position between the first mold holding means and the second mold holding means is variable, and the relative position between the third mold holding means and the fourth mold holding means is variable. The transfer device.
  11. A transfer device that operates according to an instruction from a control device and transfers a pattern formed on a mold to a transfer target,
    First mold holding means for holding the mold on the first contact surface in accordance with an instruction from the control device;
    A second mold holding means for holding the mold on the second contact surface in accordance with an instruction from the control device;
    Transfer means for transferring the pattern to the transfer object in accordance with an instruction from the control device;
    A transfer apparatus that changes a relative position between the first mold holding means and the second mold holding means in accordance with an instruction from the control device.
  12. A transfer method in a transfer device for transferring a pattern formed on a mold to a transfer target,
    A first holding step of holding the mold on a first contact surface;
    A second holding step of holding the mold on a second contact surface;
    A transfer step of transferring the pattern onto the transfer object,
    A transfer method, wherein a relative position between the first mold holding means and the second mold holding means is changed.
  13. A transfer device for transferring a pattern formed on a first mold to a first surface of a transfer object and transferring a pattern formed on a second mold to a second surface of the transfer object;
    A first holding step of holding the first mold on a first contact surface;
    A second holding step of holding the first mold on a second contact surface;
    A third holding step for holding the second mold on a third contact surface;
    A fourth holding step of holding the second mold on a fourth contact surface;
    A transfer step of transferring the pattern onto the transfer object,
    At least one of a relative position between the first mold holding unit and the second mold holding unit and a relative position between the third mold holding unit and the fourth mold holding unit is changed. Transfer method.
  14. A computer program for operating a transfer device that transfers a pattern formed on a mold to a transfer target,
    A first holding step of holding the mold on a first contact surface;
    A second holding step of holding the mold on a second contact surface;
    A transfer step of transferring the pattern onto the transfer object,
    A computer program for changing a relative position between the first mold holding means and the second mold holding means.
PCT/JP2010/057953 2010-05-11 2010-05-11 Transfer device and method, and computer program WO2011141996A1 (en)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246810A (en) * 1999-03-03 2000-09-12 Sharp Corp Device and method for producing optical element
JP2007165812A (en) * 2005-12-09 2007-06-28 Obducat Ab Pattern duplicating device using intermediate stamp
JP2008524854A (en) * 2004-12-16 2008-07-10 エーエスエムエル ホールディング エヌ.ブイ. System and method for forming nanodisks used in imprint lithography and nanodisks and memory disks formed thereby
JP2009123318A (en) * 2007-10-23 2009-06-04 Tdk Corp Imprinting method, method of manufacturing information recording medium, and imprinting system
JP2009141328A (en) * 2007-10-11 2009-06-25 Asml Netherlands Bv Imprint lithography
JP2010089327A (en) * 2008-10-07 2010-04-22 Japan Steel Works Ltd:The Molding device and method of manufacturing molding using the same

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000246810A (en) * 1999-03-03 2000-09-12 Sharp Corp Device and method for producing optical element
JP2008524854A (en) * 2004-12-16 2008-07-10 エーエスエムエル ホールディング エヌ.ブイ. System and method for forming nanodisks used in imprint lithography and nanodisks and memory disks formed thereby
JP2007165812A (en) * 2005-12-09 2007-06-28 Obducat Ab Pattern duplicating device using intermediate stamp
JP2009141328A (en) * 2007-10-11 2009-06-25 Asml Netherlands Bv Imprint lithography
JP2009123318A (en) * 2007-10-23 2009-06-04 Tdk Corp Imprinting method, method of manufacturing information recording medium, and imprinting system
JP2010089327A (en) * 2008-10-07 2010-04-22 Japan Steel Works Ltd:The Molding device and method of manufacturing molding using the same

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