WO2011145517A1 - Composant électronique - Google Patents

Composant électronique Download PDF

Info

Publication number
WO2011145517A1
WO2011145517A1 PCT/JP2011/061041 JP2011061041W WO2011145517A1 WO 2011145517 A1 WO2011145517 A1 WO 2011145517A1 JP 2011061041 W JP2011061041 W JP 2011061041W WO 2011145517 A1 WO2011145517 A1 WO 2011145517A1
Authority
WO
WIPO (PCT)
Prior art keywords
coil
electronic component
axis direction
conductor
coil conductor
Prior art date
Application number
PCT/JP2011/061041
Other languages
English (en)
Japanese (ja)
Inventor
薫 立花
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2011145517A1 publication Critical patent/WO2011145517A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core

Definitions

  • the present invention relates to an electronic component, and more particularly to an electronic component having a built-in coil.
  • a multilayer chip inductor described in Patent Document 1 As a conventional electronic component, for example, a multilayer chip inductor described in Patent Document 1 is known.
  • a spiral coil is formed by connecting a U-shaped coil pattern. Each coil pattern is connected in parallel with a coil pattern having the same shape. Thus, the coil has a double spiral structure.
  • the DC resistance of the coil is reduced by making the coil have a double spiral structure.
  • the multilayer chip inductor described in Patent Document 1 has a problem that the inductance value of the coil decreases.
  • the size of the chip is predetermined. Therefore, the number of coil patterns that can be provided in the multilayer chip inductor is limited. Therefore, in the multilayer chip inductor in which the coil patterns are connected in parallel, the number of turns of the coil is reduced compared to the multilayer chip inductor in which the coil patterns are not connected in parallel. As a result, in the multilayer chip inductor described in Patent Document 1, the inductance value of the coil is reduced.
  • an object of the present invention is to provide an electronic component capable of reducing the resistance of the coil while suppressing a decrease in the inductance value of the coil.
  • An electronic component includes a laminated body in which a plurality of insulating layers are laminated, and is built in the laminated body and swivels in a predetermined direction when viewed in plan from the lamination direction And a plurality of coil conductors having the same shape in a partial region of the coil. It is characterized by being connected in parallel.
  • FIG. 1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on one Embodiment. It is a disassembled perspective view of the laminated body of the electronic component which concerns on other embodiment. It is the graph which showed the simulation result.
  • FIG. 1 is an external perspective view of an electronic component 10 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the multilayer body 12 of the electronic component 10 according to the embodiment.
  • the stacking direction of the electronic component 10 is defined as the z-axis direction, and the directions along the long side and the short side of the surface of the electronic component 10 on the positive direction side are the x-axis direction and the y-axis direction, respectively.
  • the x-axis direction, the y-axis direction, and the z-axis direction are orthogonal to each other.
  • the electronic component 10 includes a laminated body 12, external electrodes 14 (14a, 14b), connection portions 20 (20a, 20b), and a coil L.
  • the laminate 12 has a rectangular parallelepiped shape and incorporates a coil L.
  • the stacked body 12 is configured by stacking the insulator layers 16 (16a to 16q) so that they are arranged in this order from the positive side in the z-axis direction to the negative direction.
  • the insulator layer 16 is a rectangular layer made of a magnetic material (for example, Ni—Cu—Zn based ferrite).
  • the magnetic material means a material that functions as a magnetic material in a temperature range of ⁇ 55 ° C. or higher and + 125 ° C. or lower.
  • the surface on the positive side in the z-axis direction of the insulator layer 16 is referred to as a front surface
  • the surface on the negative direction side in the z-axis direction of the insulator layer 16 is referred to as a back surface.
  • the surface located in the both ends of az axis direction is called an upper surface and a lower surface
  • the surface which connects an upper surface and a lower surface is called a side surface.
  • the external electrode 14a is provided so as to cover the upper surface of the multilayer body 12, as shown in FIG. As shown in FIG. 1, the external electrode 14 b is provided so as to cover the lower surface of the multilayer body 12. Further, the external electrodes 14a and 14b are folded back with respect to the side surfaces adjacent to the upper surface and the lower surface.
  • the external electrodes 14 a and 14 b function as connection terminals that electrically connect a circuit outside the electronic component 10 and the coil L.
  • the coil L is built in the laminate 12 and is composed of coil conductors 18 (18a to 18g), 19 (19a, 19b, 19f, 19g) and via-hole conductors v4 to v17 as shown in FIG.
  • the coil L is formed in a spiral shape by connecting the coil conductors 18 and 19 and the via-hole conductors v4 to v17, and has a coil axis extending in the z-axis direction (that is, parallel to the z-axis direction).
  • the coil conductors 18a to 18g are provided on the surfaces of the insulator layers 16e, 16g to 16j, 16l, and 16n, respectively, and turn clockwise when viewed in plan from the z-axis direction.
  • This is a U-shaped linear conductor. More specifically, the coil conductors 18a to 18g have a number of turns of 3/4 and are along the three sides of the insulator layer 16.
  • the coil conductor 18a is provided along three sides other than the short side on the negative direction side in the x-axis direction in the insulator layer 16e.
  • the coil conductor 18b is provided along three sides of the insulator layer 16g other than the long side on the negative direction side in the y-axis direction.
  • the coil conductor 18c is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 16h.
  • the coil conductor 18d is provided along three sides of the insulator layer 16i other than the long side on the positive direction side in the y-axis direction.
  • the coil conductor 18e is provided along three sides of the insulator layer 16j other than the short side on the negative direction side in the x-axis direction.
  • the coil conductor 18f is provided along three sides of the insulator layer 16l other than the long side on the negative direction side in the y-axis direction.
  • the coil conductor 18g is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 16n.
  • the coil conductors 19a, 19b, 19f, and 19g are provided on the surfaces of the insulator layers 16d, 16f, 16k, and 16m, respectively, and when viewed in plan from the z-axis direction, It is a U-shaped linear conductor layer that swivels in a straight line. More specifically, the coil conductors 19a, 19b, 19f, and 19g have a number of turns of 3/4, and are along the three sides of the insulator layers 16d, 16f, 16k, and 16m. The coil conductor 19a is provided along three sides of the insulator layer 16d other than the short side on the negative direction side in the x-axis direction.
  • the coil conductor 19a has the same shape as the coil conductor 18a, and overlaps in a matched state when viewed from the positive side in the z-axis direction.
  • the coil conductor 19b is provided along three sides of the insulator layer 16f other than the long side on the negative direction side in the y-axis direction.
  • the coil conductor 19b has the same shape as the coil conductor 18b, and overlaps in a matched state when viewed from the positive side in the z-axis direction.
  • the coil conductor 19f is provided along three sides of the insulator layer 16k other than the long side on the negative direction side in the y-axis direction.
  • the coil conductor 19f has the same shape as the coil conductor 18f, and overlaps in a matched state when viewed from the positive side in the z-axis direction.
  • the coil conductor 19g is provided along three sides other than the short side on the positive direction side in the x-axis direction in the insulator layer 16m.
  • the coil conductor 19g has the same shape as the coil conductor 18g, and overlaps in a matched state when viewed from the positive side in the z-axis direction.
  • the end portion on the upstream side in the clockwise direction is the upstream end
  • the end portion on the downstream side in the clockwise direction is the downstream end.
  • the number of turns of the coil conductors 18 and 19 is not limited to 3/4 turns. Therefore, the number of turns of the coil conductors 18 and 19 may be, for example, 1/2 turn or 7/8 turn.
  • the via-hole conductors v4 to v17 are provided so as to penetrate the insulating layers 16d to 16m in the z-axis direction. More specifically, the via-hole conductor v4 penetrates the insulator layer 16d in the z-axis direction and is connected to the upstream end of the coil conductor 19a and the upstream end of the coil conductor 18a.
  • the via-hole conductor v5 penetrates the insulator layer 16d in the z-axis direction, and is connected to the downstream end of the coil conductor 19a and the downstream end of the coil conductor 18a.
  • the via-hole conductor v6 passes through the insulator layer 16e in the z-axis direction, and is connected to the downstream end of the coil conductor 18a and the upstream end of the coil conductor 19b.
  • the via-hole conductor v7 penetrates the insulator layer 16f in the z-axis direction, and is connected to the upstream end of the coil conductor 19b and the upstream end of the coil conductor 18b.
  • the via-hole conductor v8 passes through the insulator layer 16f in the z-axis direction, and is connected to the downstream end of the coil conductor 19b and the downstream end of the coil conductor 18b.
  • the via-hole conductor v9 penetrates the insulator layer 16g in the z-axis direction and is connected to the downstream end of the coil conductor 18b and the upstream end of the coil conductor 18c.
  • the via-hole conductor v10 passes through the insulator layer 16h in the z-axis direction, and is connected to the downstream end of the coil conductor 18c and the upstream end of the coil conductor 18d.
  • the via-hole conductor v11 penetrates the insulator layer 16i in the z-axis direction and is connected to the downstream end of the coil conductor 18d and the upstream end of the coil conductor 18e.
  • the via-hole conductor v12 penetrates the insulator layer 16j in the z-axis direction and is connected to the downstream end of the coil conductor 18e and the upstream end of the coil conductor 19f.
  • the via-hole conductor v13 penetrates the insulator layer 16k in the z-axis direction, and is connected to the upstream end of the coil conductor 19f and the upstream end of the coil conductor 18f.
  • the via-hole conductor v14 passes through the insulator layer 16k in the z-axis direction, and is connected to the downstream end of the coil conductor 19f and the downstream end of the coil conductor 18f.
  • the via-hole conductor v15 passes through the insulator layer 16l in the z-axis direction, and is connected to the downstream end of the coil conductor 18f and the upstream end of the coil conductor 19g.
  • the via-hole conductor v16 passes through the insulator layer 16m in the z-axis direction, and is connected to the upstream end of the coil conductor 19g and the upstream end of the coil conductor 18g.
  • the via-hole conductor v17 penetrates the insulator layer 16m in the z-axis direction, and is connected to the downstream end of the coil conductor 19g and the downstream end of the coil conductor 18g.
  • both ends of the coil conductor 18a and both ends of the coil conductor 19a are connected by via-hole conductors v4 and v5 provided in the insulator layer 16d, respectively. Thereby, the coil conductor 18a and the coil conductor 19a are connected in parallel. Further, both ends of the coil conductor 18b and both ends of the coil conductor 19b are connected by via-hole conductors v7 and v8 provided in the insulator layer 16f, respectively. Thereby, the coil conductor 18b and the coil conductor 19b are connected in parallel. Further, both ends of the coil conductor 18f and both ends of the coil conductor 19f are connected by via-hole conductors v13 and v14 provided in the insulator layer 16k, respectively.
  • both ends of the coil conductor 18g and both ends of the coil conductor 19g are connected by via-hole conductors v16 and v17 provided in the insulator layer 16m, respectively. Thereby, the coil conductor 18g and the coil conductor 19g are connected in parallel.
  • an end on the positive direction side in the z-axis direction is defined as an end t1
  • an end on the negative direction side in the z-axis direction is defined as an end t2.
  • the end t1 coincides with the upstream end of the coil conductor 19a
  • the end t2 coincides with the downstream end of the coil conductor 18g.
  • a region including the end t1 is defined as a region A1
  • a region including the end t2 is defined as a region A3.
  • a region sandwiched between the region A1 and the region A3 in the z-axis direction is defined as a region A2.
  • the coil conductors 18a and 18b and the coil conductors 19a and 19b having the same shape are connected in parallel in the region A1.
  • the coil conductors 18f and 18g having the same shape and the coil conductors 19f and 19g are connected in parallel.
  • the coil conductors 18c to 18e are not connected in parallel. That is, in the electronic component 10, the coil conductors 18 and 19 having the same shape are connected in parallel in the partial areas A1 and A3 of the coil L.
  • the connecting portion 20a connects the external electrode 14a and the end t1 of the coil L, and is configured by via-hole conductors v1 to v3.
  • the via-hole conductors v1 to v3 penetrate the insulator layers 16a to 16c in the z-axis direction and are connected to each other to constitute one via-hole conductor.
  • the connecting portion 20b connects the external electrode 14b and the end t2 of the coil L, and is composed of via-hole conductors v19 to v21.
  • the via-hole conductors v19 to v21 penetrate the insulator layers 16o to 16q in the z-axis direction, and are connected to each other to constitute one via-hole conductor.
  • a ceramic green sheet to be the insulator layer 16 is prepared. Specifically, ferric oxide (Fe 2 O 3 ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. Then, the calcined powder is wet pulverized by a ball mill, dried and crushed to obtain a ferrite ceramic powder.
  • ferric oxide Fe 2 O 3
  • zinc oxide ZnO
  • NiO nickel oxide
  • CuO copper oxide
  • a binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material and a dispersing agent are added and mixed with a ball mill, and then defoamed under reduced pressure.
  • the obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the insulator layer 16.
  • via-hole conductors v1 to v21 are formed in each of the ceramic green sheets to be the insulator layer 16. Specifically, a via hole is formed by irradiating a ceramic green sheet to be the insulator layer 16 with a laser beam. Further, the via hole is filled with a paste made of a conductive material such as Ag, Pd, Cu, Au, or an alloy thereof by a method such as printing and coating to form the via hole conductors v1 to v21.
  • the coil conductors 18 and 19 are formed by applying a paste made of a conductive material on the ceramic green sheets to be the insulator layers 16d to 16n by a method such as a screen printing method or a photolithography method.
  • the paste made of a conductive material is obtained by adding varnish and a solvent to Ag, for example.
  • step of forming the coil conductor 18 and the step of filling the via hole with a paste made of a conductive material may be performed in the same step.
  • ceramic green sheets to be the insulator layer 16 are laminated one by one and temporarily pressed to obtain an unfired mother laminate. Specifically, the ceramic green sheets to be the insulator layer 16 are laminated one by one and temporarily bonded. Then, this press-bonding is performed on the unfired mother laminate by an isostatic press.
  • the unfired mother laminate is cut into a predetermined size to obtain a plurality of unfired laminates 12.
  • the unfired laminate 12 is subjected to binder removal processing and firing.
  • the binder removal treatment is performed, for example, in a low oxygen atmosphere at 850 ° C. for 2 hours. Firing is performed at 900 ° C. to 930 ° C. for 2.5 hours, for example. Thereafter, the surface of the laminate 12 is subjected to barrel polishing to chamfer.
  • an electrode paste made of a conductive material mainly composed of Ag is applied to the upper and lower surfaces of the laminate 12. Then, the applied electrode paste is baked at a temperature of about 800 ° C. for 1 hour. Thereby, the silver electrode which should become the external electrode 14 is formed. Further, the external electrode 14 is formed by performing Ni plating / Sn plating on the surface of the silver electrode to be the external electrode 14. Through the above steps, the electronic component 10 is completed.
  • the electronic component 10 a decrease in the inductance value of the coil L can be suppressed. More specifically, in the electronic component 10, in the entire coil L (regions A1 to A3), the coil conductor 18 and the coil conductor 19 are not connected in parallel, but a part of the region A1, A1 of the coil L. Only in A3, the coil conductor 18 and the coil conductor 19 are connected in parallel. Accordingly, in the region A2 of the coil L, the coil conductors 18 are not connected in parallel. Thereby, in the electronic component 10, the number of turns of the coil L can be increased when the size of the multilayer body 12 is the same as that of the electronic component in which all the coil conductors are connected in parallel. That is, in the electronic component 10, a large inductance value can be obtained as compared with an electronic component in which all coil conductors are connected in parallel.
  • the electronic component according to the present invention is not limited to the electronic component 10 shown in the embodiment. Therefore, the electronic component according to the present invention can be changed within the scope of the gist.
  • FIG. 3 is an exploded perspective view of the multilayer body 12a of the electronic component 10a according to another embodiment.
  • FIG. 1 is used for the external perspective view of the electronic component 10a.
  • the coil conductor 18 and the coil conductor 19 are connected in parallel in the region A2.
  • the coil conductors 18 and 19 may be connected in parallel in the region A3 other than the regions A1 and A2 including the ends t1 and t2.
  • the electronic component 10 a can reduce the resistance of the coil L while suppressing a decrease in the inductance value of the coil L.
  • the electronic component 10 has excellent high-frequency characteristics as compared with the electronic component 10a, as will be described below. More specifically, in the electronic component 10a, as shown in FIG. 3, the coil conductors 18 are not connected in parallel in the region A1 including the end t1. Therefore, the coil L for one turn is opposed to the external electrode 14a by two layers of coil conductors 18a and 18b from the positive direction side in the z-axis direction. A stray capacitance is generated between the coil L for one turn and the external electrode 14a.
  • the coil conductor 18 and the coil conductor 19 are connected in parallel in a region A1 including the end t1.
  • the coil conductors 18a and 19a for two layers from the positive direction side in the z-axis direction only the coil L for 3/4 turns faces the external electrode 14a.
  • the third-layer coil conductor 19b from the positive side in the z-axis direction faces the external electrode 14a, so that the coil L for one turn faces the external electrode 14a.
  • the coil conductor 19b is located in the third layer from the positive direction side in the z-axis direction, and is far from the coil conductors 18a and 19a.
  • the electronic component 10 the magnitude of the stray capacitance generated between the coil L for one turn and the external electrode 14a is smaller than that in the electronic component 10a. As a result, the electronic component 10 has superior high frequency characteristics compared to the electronic component 10a.
  • the inventor of the present application performed a computer simulation described below.
  • the inventor of the present application has created a first model having the same structure as the electronic component 10 and a second model having the same structure as the electronic component 10a.
  • the number of turns was 33.
  • the number of turns in each of the areas A1 and A3 was 3 turns, and the number of turns in the area A2 was 27 turns.
  • the number of turns in each of the areas A1 and A3 was 13.5 turns, and the number of turns in the area A2 was 6 turns.
  • FIG. 4 is a graph showing simulation results.
  • the vertical axis represents impedance, and the horizontal axis represents frequency.
  • FIG. 4 shows that the first model has better high frequency characteristics than the second model. This is because, as described above, the electronic component 10 has a smaller stray capacitance generated between the coil L for one turn and the external electrode 14a than the electronic component 10a. From the above simulation, it can be seen that the electronic component 10 has superior high-frequency characteristics compared to the electronic component 10a.
  • the present invention is useful for electronic components, and is particularly excellent in that the resistance of the coil can be reduced while suppressing a decrease in the inductance value of the coil.

Abstract

L'invention concerne un composant électronique permettant de réduire la résistance d'une bobine tout en limitant la réduction de sa valeur d'inductance. Un stratifié (12) est constitué d'une pluralité de couches isolantes (16) stratifiées. Une bobine en forme de spirale (L) est contenue dans le stratifié (12) et constituée d'une pluralité de conducteurs de bobine linéaires (18, 19) tournant dans le sens horaire vu en vue planaire à partir de la direction de l'axe z, connectés les uns aux autres. Les conducteurs de bobine (18, 19), ayant la même forme, sont connectés en parallèle dans des zones partielles (A1, A3) de la bobine (L).
PCT/JP2011/061041 2010-05-19 2011-05-13 Composant électronique WO2011145517A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010-115315 2010-05-19
JP2010115315 2010-05-19

Publications (1)

Publication Number Publication Date
WO2011145517A1 true WO2011145517A1 (fr) 2011-11-24

Family

ID=44991623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/061041 WO2011145517A1 (fr) 2010-05-19 2011-05-13 Composant électronique

Country Status (1)

Country Link
WO (1) WO2011145517A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251455A (ja) * 2012-06-01 2013-12-12 Ibiden Co Ltd 電磁コイル
WO2015022889A1 (fr) * 2013-08-13 2015-02-19 株式会社村田製作所 Composant électronique
GB2521559A (en) * 2012-09-28 2015-06-24 Murata Manufacturing Co Impedance conversion circuit and wireless communication device
JP2016139742A (ja) * 2015-01-28 2016-08-04 株式会社村田製作所 コイル部品
CN109119223A (zh) * 2017-06-26 2019-01-01 株式会社村田制作所 层叠电感器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260644A (ja) * 1998-01-08 1999-09-24 Taiyo Yuden Co Ltd 電子部品
JP2001044038A (ja) * 1999-08-03 2001-02-16 Taiyo Yuden Co Ltd 積層電子部品
JP2001244117A (ja) * 1999-12-20 2001-09-07 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法及び積層セラミック電子部品
WO2009016937A1 (fr) * 2007-07-30 2009-02-05 Murata Manufacturing Co., Ltd. Composant de bobine de type puce
JP2009094149A (ja) * 2007-10-04 2009-04-30 Hitachi Metals Ltd 積層インダクタ
JP2011029278A (ja) * 2009-07-22 2011-02-10 Murata Mfg Co Ltd 電子部品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11260644A (ja) * 1998-01-08 1999-09-24 Taiyo Yuden Co Ltd 電子部品
JP2001044038A (ja) * 1999-08-03 2001-02-16 Taiyo Yuden Co Ltd 積層電子部品
JP2001244117A (ja) * 1999-12-20 2001-09-07 Murata Mfg Co Ltd 積層セラミック電子部品の製造方法及び積層セラミック電子部品
WO2009016937A1 (fr) * 2007-07-30 2009-02-05 Murata Manufacturing Co., Ltd. Composant de bobine de type puce
JP2009094149A (ja) * 2007-10-04 2009-04-30 Hitachi Metals Ltd 積層インダクタ
JP2011029278A (ja) * 2009-07-22 2011-02-10 Murata Mfg Co Ltd 電子部品

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013251455A (ja) * 2012-06-01 2013-12-12 Ibiden Co Ltd 電磁コイル
GB2521559A (en) * 2012-09-28 2015-06-24 Murata Manufacturing Co Impedance conversion circuit and wireless communication device
GB2521559B (en) * 2012-09-28 2016-05-11 Murata Manufacturing Co A radio frequency impedance matching circuit and wireless communication apparatus
US9515632B2 (en) 2012-09-28 2016-12-06 Murata Manufacturing Co., Ltd. Impedance transformation circuit and wireless communication apparatus
WO2015022889A1 (fr) * 2013-08-13 2015-02-19 株式会社村田製作所 Composant électronique
CN105408972A (zh) * 2013-08-13 2016-03-16 株式会社村田制作所 电子部件
JP6044716B2 (ja) * 2013-08-13 2016-12-14 株式会社村田製作所 電子部品
JP2016139742A (ja) * 2015-01-28 2016-08-04 株式会社村田製作所 コイル部品
CN109119223A (zh) * 2017-06-26 2019-01-01 株式会社村田制作所 层叠电感器
JP2019009299A (ja) * 2017-06-26 2019-01-17 株式会社村田製作所 積層インダクタ
US11282629B2 (en) 2017-06-26 2022-03-22 Murata Manufacturing Co., Ltd. Multilayer inductor

Similar Documents

Publication Publication Date Title
JP5994933B2 (ja) 電子部品
WO2010092730A1 (fr) Composant électronique
JP5126243B2 (ja) 電子部品
JP5598452B2 (ja) 電子部品及びその製造方法
WO2010079804A1 (fr) Pièce électronique
JP5644957B2 (ja) 電子部品
WO2012023315A1 (fr) Composant électronique et procédé de fabrication associé
WO2011145517A1 (fr) Composant électronique
JP2011187535A (ja) 電子部品及びその製造方法
WO2010084794A1 (fr) Composant électronique et procédé de fabrication associé
JP5494892B2 (ja) 電子部品
JP5327231B2 (ja) 電子部品
WO2010010799A1 (fr) Composant électronique et son procédé de fabrication
WO2010109936A1 (fr) Pièce électronique et son procédé de fabrication
JP2011192737A (ja) 電子部品及びその製造方法
JP5553550B2 (ja) 電子部品
WO2014181756A1 (fr) Composant électronique
JP5957895B2 (ja) 電子部品の製造方法
JP5136065B2 (ja) 電子部品
WO2012020590A1 (fr) Composant électronique
JP2011187897A (ja) 電子部品及びその製造方法
JP2011091221A (ja) 電子部品
JP5637282B2 (ja) 電子部品
JP2012256809A (ja) 積層型コイル
JP2012060049A (ja) 電子部品

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11783451

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11783451

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP