WO2011111248A1 - カメラモジュール - Google Patents

カメラモジュール Download PDF

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Publication number
WO2011111248A1
WO2011111248A1 PCT/JP2010/064020 JP2010064020W WO2011111248A1 WO 2011111248 A1 WO2011111248 A1 WO 2011111248A1 JP 2010064020 W JP2010064020 W JP 2010064020W WO 2011111248 A1 WO2011111248 A1 WO 2011111248A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cable
camera module
holder
optical system
Prior art date
Application number
PCT/JP2010/064020
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
真野　伸之
雅樹 土屋
真義 鹿嶋
Original Assignee
Smk株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010052786A external-priority patent/JP4788009B2/ja
Priority claimed from JP2010054790A external-priority patent/JP2011191328A/ja
Priority claimed from JP2010054081A external-priority patent/JP4788010B2/ja
Application filed by Smk株式会社 filed Critical Smk株式会社
Priority to CN201080008628.6A priority Critical patent/CN102326382B/zh
Priority to EP10844959A priority patent/EP2451147A4/en
Priority to US13/192,409 priority patent/US20110279675A1/en
Publication of WO2011111248A1 publication Critical patent/WO2011111248A1/ja

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B13/00—Optical objectives specially designed for the purposes specified below
    • G02B13/001—Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/02—Bodies
    • G03B17/08—Waterproof bodies or housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • the present invention mainly relates to a camera module used for in-vehicle use.
  • This type of camera module uses a mold case composed of an upper case and a lower case, and a substrate on which an image sensor such as a CCD or CMOS is mounted in an upper case having a lens barrel portion to which a lens unit is fixed. It is fixed and accommodated in a predetermined orientation.
  • this type of in-vehicle camera module is constructed by incorporating various electronic circuit components and optical components in a watertight outer case, supplying power to the internal electronic circuit from the outer case, A cable for exchanging data has been derived.
  • a potting material has been used in order to ensure the water tightness of the cable lead-out portion in this in-vehicle camera module (for example, Patent Document 3).
  • the conventional camera module uses a simple function such as an imaging function only and a multi-function module equipped with a DSP because the number of substrates incorporated in the mold case is different. It was necessary to form a plurality of mold cases with different heights depending on the number of sheets. For this reason, the mold case is divided into an upper case and a lower case, and the lower case having a suitable size is individually manufactured according to the required area of the substrate depending on the required function.
  • the boards housed in a stacked arrangement are connected using a board-to-board electrical connector, so a connector is mounted.
  • the usable area of the substrate surface is reduced, and this has been a factor limiting size reduction.
  • the potting material is poured in a state where the cable is passed through the cable through hole formed in the bottom surface of the space.
  • the potting material to be used is limited to those having a viscosity that does not flow out from the gap between the cable and the cable through hole, and there is a problem that it takes time to fill the potting material and it is difficult to sufficiently fill the details.
  • the present invention reduces the manufacturing cost of a camera module and reduces the manufacturing cost of the camera module when the number of built-in substrates changes when manufacturing a plurality of types of camera modules having different functions.
  • a functional camera module the area required for electrical connection between multiple substrates is reduced as much as possible to reduce the size of the camera module.
  • a low viscosity material can be used for the potting material. It was made for the purpose of providing an in-vehicle camera module that is good and that does not impair the appearance of the potting material leaking out or the potting material adhering portion being pulled out, and has a low risk of disconnection of the drawn cable. It is.
  • An in-vehicle camera having an optical system holder composed of a lens unit fixing part having a shape, an image sensor holding substrate on which the lens unit is supported in the lens unit fixing part, and an image sensor is mounted in the substrate support part
  • a substrate holder is connected to an end portion of the substrate support portion of the optical system holder, and the circuit component holding substrate is supported inside the substrate holder.
  • a feature of the invention described in claim 2 is that, in addition to the configuration of claim 1, a plurality of the substrate holders are used, and each of the substrate holders has a coupling structure for connecting adjacent substrate holders.
  • the invention according to claim 3 is characterized in that, in addition to the configuration of claim 1 or 2, the substrate holder has an outer peripheral surface formed in the same shape as the outer peripheral surface of the substrate support portion of the optical system holder, By connecting the substrate holder to the optical system holder, the substrate support portion of the optical system holder has an extended shape.
  • each of the holders is integrally provided with a substrate fixing step portion on an inner peripheral surface thereof. Each substrate is brought into contact with each other to position the substrate.
  • the imaging element holding substrate and the circuit component holding substrate are arranged between at least two rigid portions and each rigid portion.
  • Each rigid part of the rigid flex board composed of the connected flexible parts is configured, and the flexible part of the rigid flex board is bent in a U shape so that the rigid parts are arranged in parallel to each other and fixed in the holder. is there.
  • the substrate holder is connected to an optical system holder in which a lens unit is mounted on the substrate support. In other words, it is accommodated in the outer case in a state where the watertightness is maintained.
  • a cable through hole for leading a cable out of the outer case is provided at the bottom of the outer case, and the outer case has the cable through hole on the bottom surface.
  • an elastic bush made of a rubber-like elastic material into which the cable is inserted in a liquid-tight state is fitted into the cable through hole, and the elastic bush and the cable The potting material is filled in the potting material filling recess with the cable through hole sealed.
  • the elastic bush is formed in a cylindrical shape having a tapered outer peripheral surface, and the inner peripheral edge of the cable through hole is densely formed on the outer periphery of the base end portion.
  • An annular groove is formed so as to be fitted with the taper, and a tapered tip end side protrudes outside the bottom surface of the outer case.
  • an optical system holder comprising a substrate support portion having a rectangular box shape with a downward opening, and a cylindrical lens unit fixing portion integrally provided at the center of the top portion, and a lens is provided in the lens unit fixing portion.
  • An in-vehicle camera module in which a unit is supported and an image sensor holding substrate in which an image sensor is mounted in the substrate support is fixed, and the substrate holder is connected to the end of the substrate support of the optical system holder.
  • each of the substrate holders has a coupling structure for connecting the substrate holders adjacent to each other, thereby providing a circuit board for making the camera module multifunctional. Easy to add.
  • the substrate holder has an outer peripheral surface formed in the same shape as the outer peripheral surface of the substrate support portion of the optical system holder, and the substrate holder is connected to the optical system holder so that the substrate of the optical system holder
  • each holder is integrally provided with a substrate fixing step on its inner peripheral surface, and the substrate can be positioned by bringing the substrate into contact with the step, thereby facilitating assembly. Become.
  • the imaging element holding substrate and the circuit component holding substrate are configured with each rigid portion of a rigid flex substrate including at least two rigid portions and a flexible portion connecting the rigid portions, and the rigid flex substrate
  • the flexible part By bending the flexible part into a U-shape and arranging the rigid parts in parallel with each other and fixing them in the holder, the mounting area occupied by the board-to-board electrical connector as in the past becomes unnecessary, and in some cases The distance between the substrates can also be reduced, which can greatly contribute to the miniaturization of the camera module.
  • the substrate holder is connected to an optical system holder in which a lens unit is mounted on the substrate support part, and these are accommodated in an external case while maintaining watertightness, so that the whole is exposed to wind and rain. It can be used safely even under adverse conditions.
  • the installation location can be selected arbitrarily.
  • a cable through hole for leading the cable out of the outer case is provided at the bottom of the outer case, and the outer case has a potting material filling recess with the cable through hole opened on the bottom surface.
  • the potting material filling recess an elastic bush made of a rubber-like elastic material inserted in a liquid-tight state is fitted, and the cable through hole is sealed by the elastic bush and the cable. Since the potting material is filled, when the potting material is injected into the potting material filling recess, the cable through hole at the bottom of the recess can be closed in a substantially completely liquid-tight state.
  • the cable is temporarily fixed by the elastic bush, and after the potting material is filled, the cable and the bush can be structured not to move relatively even with a slight external force even before complete solidification. Therefore, before the potting material is completely solidified, the process can proceed to the next step, and the workability is improved.
  • the elastic bushing is formed in a cylindrical shape having a tapered outer peripheral surface, and an annular concave groove in which the inner peripheral edge of the cable through hole is closely fitted is formed on the outer periphery of the base end portion, and the tapered tip is formed.
  • FIG. 2 is a perspective view showing a holder portion from which an outer case of the camera module shown in FIG. 1 is removed.
  • FIG. 2 is a perspective view of the optical system holder used in the camera module shown in FIG. 1 from obliquely above. It is a perspective view from the diagonal lower side of the optical system part holder.
  • FIG. 2 is a perspective view from above of a substrate holder used in the camera module shown in FIG. It is a perspective view from diagonally lower of the same substrate holder.
  • FIG. 2 is a perspective view showing an image sensor holding substrate and a circuit component holding substrate used in the camera module shown in FIG.
  • FIG. 10 is a perspective view showing the rigid flex substrate in FIG. 9. It is a longitudinal cross-sectional view which shows the rigid flex board same as the above.
  • FIG. 2 is a longitudinal sectional view showing an example in which the camera module shown in FIG. 1 is transformed into a single-function camera module that accommodates only an image sensor holding substrate. Furthermore, it is a longitudinal cross-sectional view which shows the other Example of the camera module which concerns on this invention.
  • reference numeral 1a denotes an outer case main body
  • 1b denotes an outer case bottom lid for closing the bottom opening of the outer case main body 1a.
  • Both the outer case main body 1a and the outer case bottom lid 1b are molded by a synthetic resin, and constitute the outer case 1 with these.
  • a molded optical system holder 2 and a substrate holder 5 are accommodated in combination with each other.
  • the optical system holder 2 is composed of a substrate support part 2a having a rectangular box shape with a downward opening and a cylindrical lens unit fixing part 2b integrally provided at the center of the top part. One end of the lens unit 3 is screwed into the screw.
  • the lens unit 3 has a structure in which a lens group is incorporated in the lens holding cylinder, and the end of the lens holding cylinder is screwed into the lens unit fixing portion 2b. Yes.
  • the substrate supporting portion 2a has a substrate fixing step 4 formed on the inner peripheral surface thereof, and the image sensor holding substrate 6 is in contact with the substrate supporting portion 2a, and is fixed so as not to fall off by an adhesive.
  • An image sensor 7 is mounted on the surface of the image sensor holding substrate 6 on the lens unit 3 side.
  • the outer peripheral surface of the substrate holder 5 has a cylindrical shape that is the same shape as the outer peripheral surface of the substrate support portion of the optical system holder.
  • a substrate fixing step 8 is formed at an intermediate position in the axial direction, and a circuit component holding substrate 9 is brought into contact therewith and fixed by an adhesive.
  • An engagement piece 10 protrudes from the end surface of the substrate holder 5 on the optical system holder 2 side, and the engagement piece 10 is inserted into the insertion groove 11 formed on the inner peripheral surface of the optical system holder 2. is doing.
  • the engagement piece 10 is formed with a check claw 10a at its tip, and the insertion groove 11 is formed with an engagement step portion 11a with which the check claw 10a is engaged.
  • the check claw 10a is engaged with the engagement step portion 11a, and the substrate holder 5 and the optical system holder 2 are connected in an inseparable state. .
  • a window hole 12 that is open to the inside and outside of the optical system holder 2 is formed on the back side of the engagement step portion 11a. Even after the optical claw holder 2 and the substrate holder 5 are connected by inserting a jig into the window hole 12 and displacing the check claw 10a in a direction away from the engaging step portion 11a. Both can be separated.
  • the structure is such that the optical system holder 2 and the substrate holder 5 can be separated even after they are connected as described above, but there is no need to separate them after they are connected.
  • the optical system holder 2 and the substrate holder 5 may be connected by means such as adhesion or welding.
  • circuit components such as a DSP, a memory, and a preset circuit are mounted on the substrates 6 and 9.
  • a connector member and a cable connector 13 for connecting between the circuits of both the boards 6 and 9 are mounted, and a cable 14 leading out is connected.
  • both the boards 6 and 9 may be constituted by a single rigid flex board 20 as shown in FIGS. 8 to 10 without using a connector member for connecting the circuits of the boards 6 and 9. Good.
  • the rigid flex board 20 is composed of two rigid parts 20 a and 20 b and a flex part 20 c that connects the rigid parts 20 a and 20 b, and the structure thereof is provided at both ends of an FPC (flexible printed circuit board) 21.
  • a rigid board 22 using an insulative base material having no flexibility is bonded to the front and back, and the pattern 23 of the FPC 21 and the pattern 24 of each rigid board 22 are electrically connected by a through hole 25.
  • the image sensor 7 and other various circuit components are mounted on each pattern 24 of the rigid substrate 22.
  • One rigid portion 20a of the two rigid portions is used as the above-described imaging element holding substrate 6, and the other rigid portion 20b is used as the circuit component holding substrate 9. Then, in a state where the flex portion 20c is curved in a U-shape and the curved outer surface is aligned with the inner surfaces of the holders 2 and 5, the rigid portions 20a and 20b are arranged in parallel and are held by the holders 2 and 5, respectively. ing.
  • reference numeral 15 denotes an O-ring for maintaining water tightness between the outer case main body 1a and the lens unit 3
  • 16 denotes water tightness between the outer case main body 1a and the outer case bottom lid 1b.
  • the gasket 17 for maintaining the property is an elastic bushing for maintaining the water tightness of the cable penetration portion of the outer case bottom lid 1b.
  • the camera module configured as described above is a multi-function type that accommodates a plurality of substrates 6 and 9 in a parallel arrangement as described above, but this is a single-function type having only an imaging function.
  • the image sensor holding substrate 6 is held by using only the optical system holder 2 without using the substrate holder 5 described above, and the back surface of the substrate 6
  • the cable connector 13 may be mounted on the cable 14 and the cable 14 led out to the outside may be connected.
  • the outer case 1 may be the same as described above, and in this case, the outer case main body 1a is made as low as the thickness not using the substrate holder 5.
  • the case where two substrates are accommodated in parallel is shown. However, in the case where one or more substrates are used in addition to this, they are not shown in the figure.
  • the substrate holders 5 are used for the number of substrates to be increased, and the substrate holders 5 and 5 adjacent to each other are connected to each other in the same manner as the coupling structure of the optical system holder 2 and the substrate holder 5 described above.
  • the circuit board 9 may be held every five.
  • a substrate having three rigid portions and two flex portions that connect adjacent rigid portions may be used.
  • a substrate having a rigid portion corresponding to the number of substrates to be used and a flex portion that connects adjacent rigid portions may be used.
  • the camera module configured as described above has a structure in which the substrate holder 5 is connected to the optical system holder 2 in the case of a multi-function type using a plurality of substrates 6 and 9 as described above.
  • the circuit board 9 can be added only by connecting the substrate holder 5 to the optical system holder 2, and only a single image sensor holding substrate 6 can be added. Parts can be shared with the camera module using this, and the manufacturing cost is reduced.
  • a rigid flex substrate 20 including two rigid portions 20a and 20b and a flexible portion 20c connecting both rigid portions is used, and one rigid portion 20a is used as an image sensor holding substrate.
  • the other rigid part 20b is the circuit component holding substrate 9
  • the flexible part 20c is bent in a U shape, and both rigid parts are arranged parallel to each other and fixed in the holders 2, 5
  • a connector for connecting the boards 6 and 9 is not required, and the board can be reduced in size, and the distance between the boards can be reduced, contributing to the downsizing of the camera module.
  • this in-vehicle camera module has the lens unit 3 held by the optical system holder 2, the image pickup element holding board 6 and the circuit component holding board 9 held therein. Watertightness is maintained by fitting the outer case bottom lid 1b with the board holder 5 connected and inserted into the outer case body 1 and the cable 14 connected by the cable connector 13 is passed through the bottom surface. You may make it assemble in the state leaned.
  • a potting material filling recess 30 is formed on the bottom surface of the outer case bottom lid 1b, and a cable through hole 31 is opened in the bottom surface of the potting material filling recess 30.
  • An elastic bush 32 is fitted in the cable through hole 31 in a compressed state, and the cable 14 is inserted through the center thereof.
  • the cable 14 is inserted through the center of the cable 14 while being elastically tightened by the elastic bush 32, so that the liquid-tightness between the two is maintained.
  • the elastic bush 32 is formed in a cylindrical shape with a tapered outer peripheral surface, and the cable 14 is inserted in a liquid-tight state in a through hole at the center thereof, and the inner periphery of the cable through hole 31 is formed on the outer periphery of the base end portion.
  • An annular groove 33 that is elastically fitted so as to maintain a liquid-tight state at the periphery is formed, and a tapered tip end side 32a protrudes outside the bottom surface of the outer case bottom lid 1b.
  • a lead wire 34 constituting the cable 14 is led out from the end of the cable 14 inside the case into the recess 30.
  • a potting material 35 is filled in the potting material filling recess 30 so as to embed the lead wires 34. By filling the potting material 35, the cable lead portion of the outer case bottom lid 1b is completely sealed.
  • the leading end of the lead wire 14 is pulled out into the outer case bottom lid 1b and connected to the cable connector 13 at the leading end.
  • the potting material 35 is injected by fitting the bush 32 having the cable 14 inserted into the through hole in the center portion into the cable through hole 31, thereby temporarily closing the cable through hole 31 and connecting the cable 14 to the outer case. Temporarily fixed to the bottom lid 1b. In this state, the potting material 35 is injected into the recess 30 for filling the potting material.
  • the injected potting material 35 does not leak downward even when a low-viscosity material is used.
  • the cable 14 is temporarily fixed to the outer case bottom lid 1a via the elastic bush 32, it can be easily pulled out even before the potting material 35 is solidified and filled. The next process work can proceed before the potting material 35 is sufficiently solidified.

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Studio Devices (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
PCT/JP2010/064020 2010-03-10 2010-08-19 カメラモジュール WO2011111248A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201080008628.6A CN102326382B (zh) 2010-03-10 2010-08-19 摄像机模块
EP10844959A EP2451147A4 (en) 2010-03-10 2010-08-19 CAMERA MODULE
US13/192,409 US20110279675A1 (en) 2010-03-10 2011-07-27 Camera module

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2010052786A JP4788009B2 (ja) 2010-03-10 2010-03-10 カメラモジュール
JP2010-052786 2010-03-10
JP2010-054790 2010-03-11
JP2010-054081 2010-03-11
JP2010054790A JP2011191328A (ja) 2010-03-11 2010-03-11 カメラモジュール
JP2010054081A JP4788010B2 (ja) 2010-03-11 2010-03-11 電子機器モジュールのケーブル引き出し部防水構造

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/192,409 Continuation US20110279675A1 (en) 2010-03-10 2011-07-27 Camera module

Publications (1)

Publication Number Publication Date
WO2011111248A1 true WO2011111248A1 (ja) 2011-09-15

Family

ID=44563088

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/064020 WO2011111248A1 (ja) 2010-03-10 2010-08-19 カメラモジュール

Country Status (4)

Country Link
US (1) US20110279675A1 (zh)
EP (1) EP2451147A4 (zh)
CN (2) CN102326382B (zh)
WO (1) WO2011111248A1 (zh)

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US9814371B2 (en) 2012-03-30 2017-11-14 Fujikura Ltd. Imaging module, lens-attached imaging module, endoscope, method of manufacturing imaging module, and flexible wiring substrate formation apparatus

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EP2451147A1 (en) 2012-05-09
CN102611838A (zh) 2012-07-25
EP2451147A4 (en) 2012-12-05
US20110279675A1 (en) 2011-11-17
CN102326382B (zh) 2016-04-13
CN102611838B (zh) 2014-11-26

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