WO2011061884A1 - ワーク表面の異物研磨方法及び異物研磨装置 - Google Patents
ワーク表面の異物研磨方法及び異物研磨装置 Download PDFInfo
- Publication number
- WO2011061884A1 WO2011061884A1 PCT/JP2010/005395 JP2010005395W WO2011061884A1 WO 2011061884 A1 WO2011061884 A1 WO 2011061884A1 JP 2010005395 W JP2010005395 W JP 2010005395W WO 2011061884 A1 WO2011061884 A1 WO 2011061884A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- height
- foreign matter
- workpiece
- tape
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/004—Machines or devices using grinding or polishing belts; Accessories therefor using abrasive rolled strips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Definitions
- the present invention relates to a foreign matter polishing method and apparatus for polishing and correcting foreign matter on a workpiece surface.
- a color liquid crystal display device which has been widely used conventionally, liquid crystal is sealed between two glass substrates, a color filter substrate and an array substrate.
- a transparent electrode film is formed on the color filter element of the color filter substrate, but when manufacturing the color filter substrate, various fibers generated from clothing etc. on the substrate surface, skin tissue of workers, metal pieces, When a foreign substance such as a glass piece adheres, a protruding defect is formed. When such a projecting defect occurs, the defect comes into contact with the counter electrode, resulting in a defect that an image is not formed at that portion. For this reason, for example, as in Patent Document 1, in the color filter manufacturing process, the shape and address of the protruding defect are detected by a defect inspection apparatus, and the protruding defect is corrected or removed in the correcting process. Yes.
- the polishing tape is fed out from the supply reel, and while being wound up by the take-up reel, the polishing tape between the supply reel and the take-up reel is pressed by the polishing head to individually grind and correct foreign matters on the workpiece surface. There is a need.
- the polishing tape 8 may be cut by pressing the polishing head 12 strongly in an attempt to polish faster than the polishing capability of the polishing tape 8.
- the present invention has been made in view of such points, and the object of the present invention is to reduce the processing capacity as much as possible even when a large and high hardness foreign matter adheres to the work surface, and to break the polishing tape.
- An object of the present invention is to prevent the occurrence of drag marks.
- a foreign object that needs to be corrected is automatically determined, and it is determined whether or not the foreign object can be actually cut by slightly removing the foreign object.
- the polishing tape between the supply reel and the take-up reel While removing the polishing tape from the supply reel and winding it with the take-up reel, press the polishing tape between the supply reel and the take-up reel with the polishing head to polish and correct the foreign matter on the work surface. For polishing method.
- the above-mentioned foreign material polishing method is: Defect capturing step for capturing defects on the workpiece surface and creating information for correction; A height measurement process for measuring the height of a foreign object that needs to be corrected based on the above information; When the measured height is less than the first reference, the process proceeds to a normal polishing process. When the measured height is greater than or equal to the first reference and less than the second reference, the process proceeds to a temporary polishing process. Including a height determination step, In the temporary polishing step, the polishing head is lowered by a predetermined amount to grind the foreign matter, and it is checked whether the height of the foreign matter has changed. If the height has changed, the normal polishing step is performed. If there is no change in the height, the structure is not polished.
- the polishing head is lowered by a predetermined amount so as not to damage the polishing tape or to drag the foreign material, and the foreign material is scraped off. Then, if the height is measured again and the height has changed, it is determined that the polishing is possible, and the polishing is performed by moving to a normal polishing process. If there is no change in height, the hardness is too high and exceeds the processing capacity of the polishing tape, so the polishing is stopped. Since these determinations are performed automatically, the foreign matter polishing apparatus is not stopped more than necessary, and the process time is significantly shortened as compared with the prior art. And since it does not grind exceeding the processing capability of an abrasive tape, a fracture
- the workpiece is a glass substrate after forming a polyimide resin film.
- the glass substrate after the polyimide resin film is formed cannot be cleaned on the entire surface of the substrate by brush scrubbing or ultrasonic cleaning to protect the surface layer. Even if a foreign substance with high hardness adheres, it is possible to respond individually, so the foreign substance polishing equipment will not be stopped more than necessary, the process time will be shorter than before, and the processing capacity of the polishing tape will be exceeded. Therefore, the abrasive tape is not broken or dragged.
- the first standard is 10 ⁇ m
- the second reference is 50 ⁇ m.
- a small foreign substance having a height of less than 10 ⁇ m can be sufficiently polished in a normal polishing process. Even if the hardness is high, there is no need to increase the polishing speed more than necessary, and the polishing tape The possibility of leaving scratches on the substrate is limited due to the breakage or the foreign matter is displaced. If it is a foreign substance with a height larger than 50 micrometers, even if it is low hardness, it must grind many times, and it can be judged that it is inefficient and does not grind from the beginning.
- the present invention is intended for a foreign object polishing apparatus including a moving device that moves the polishing head to an arbitrary position on the surface of the workpiece.
- polishing apparatus is A defect capturing mechanism for capturing defects on the workpiece surface and creating information for correction; A height measurement mechanism that measures the height of a foreign object that needs to be corrected based on the above information; When the measured height is less than the first reference, the process proceeds to a normal polishing process. When the measured height is greater than or equal to the first reference and less than the second reference, the process proceeds to a temporary polishing process. In the temporary polishing step, the polishing head is lowered by a predetermined amount by the moving device to grind the foreign matter, and it is checked whether the height of the foreign matter has changed. When the normal polishing process is started and the height does not change, a control device that does not polish is provided.
- the height of the foreign matter that needs to be polished captured in the defect capturing step is measured, and if the foreign matter is lower than the first reference, normal polishing is performed. If the foreign material is too large, polishing is not performed, and when it is not less than the first reference and less than the second reference, the polishing head is lowered by a predetermined amount in the temporary polishing process to determine whether or not polishing is possible. Even when a large-sized and high-hardness foreign matter adheres to the workpiece surface, the processing capacity is not reduced as much as possible, and the abrasive tape can be prevented from being broken or dragged.
- FIG. 2 shows a foreign substance polishing apparatus 1 according to an embodiment of the present invention.
- the foreign substance polishing apparatus 1 includes a base portion 2 having a frame structure, for example, and a flat surface on which a workpiece W is placed on the upper surface of the base portion 2.
- a work stage 3 is provided.
- the workpiece W is an array substrate after a polyimide resin film is formed.
- the work stage 3 is provided with a plurality of through holes (not shown), and the work W is fixed on the work stage 3 by sucking air.
- a moving device 5 that supports the head body 4 so as to be movable in the X direction, the Y direction, and the Z direction.
- the moving device 5 moves along the Y direction along a pair of rail portions 5a arranged along the Y direction on the opposite side surfaces of the base portion 2, and moves the head body 4 along the X direction and the Z direction.
- a gantry portion 5b that is movably supported in a direction and a plurality of motors (not shown) are provided, and the head body 4 can be moved to an arbitrary position on the work stage 3.
- the head body 4 includes a polishing cassette 7 shown in FIG.
- the polishing cassette 7 has a shape similar to that of a normal audio tape, and includes a supply reel 9 around which the polishing tape 8 is wound, and a take-up reel 10 around which the polishing tape 8 is wound.
- the supply reel 9 and the take-up reel 10 are driven by a motor (not shown) provided in the head body 4, and a pair of guide rollers 11 for guiding the polishing tape 8 is provided between the reels 9 and 10.
- a polishing head 12 that is disposed between the pair of guide rollers 11 and presses the polishing tape 8 against the workpiece W.
- the polishing tape 8 is prepared by putting polishing powder on a weakly sticky surface layer, and most of the polished material generated by polishing is taken into the polishing cassette 7 while adhering to the polishing tape 8. .
- a protrusion 12a is formed on the lower surface of the polishing head 12, and a foreign material is polished by pressing a polishing tape 8 in contact with the protrusion 12a against an object to be polished.
- the foreign matter polishing apparatus 1 includes a control device 14 at an arbitrary position of the base portion 2, and the control device 14 is connected to the main server 15.
- the main server 15 stores defect information for correcting defects such as the size and position of defects on the surface of the workpiece W captured by the defect capturing mechanism 16 in the previous process.
- the configuration of the defect capturing mechanism 16 is not particularly limited, and it is only necessary that the surface of the workpiece W can be scanned by known image processing.
- the height measuring mechanism 17 includes a known digital micromirror device.
- This digital micromirror device is a kind of display element in which a number of micro mirror surfaces (micromirrors) (not shown) are arranged in a plane.
- the so-called confocal method makes it possible to grasp the height distribution of foreign matter at each coordinate. It is configured.
- the control device 14 is configured to move the head body 4 to a foreign object that needs to be corrected based on the defect information stored in the main server 15 and measure the height of the foreign object with the height measuring mechanism 17. Yes.
- the control device 14 performs the height determination based on the defect information obtained by the defect capturing mechanism 16 by the automatic mode sequence, based on the first reference and the second reference set in advance, and based on the determination result.
- the foreign matter polishing apparatus 1 is controlled.
- the first reference and the second reference may be arbitrarily set according to the polishing ability of the foreign substance polishing apparatus 1. For example, it is preferable that the first reference is 10 ⁇ m and the second reference is 50 ⁇ m.
- the workpiece W is an array substrate after the polyimide resin film is formed.
- step S01 defects are captured on the array substrate after the polyimide resin film is formed by the defect capturing mechanism 16.
- the position and size of the foreign matter that needs to be corrected on the substrate are captured and stored in the main server 15. At this stage, the height is not captured accurately.
- step S02 it is determined based on the defect information (foreign material position, size, etc.) whether foreign material polishing is necessary. If there is no defect or a defect that does not need to be polished, the process proceeds to step S03, and the process proceeds to an accepted cassette storage process. In step S04, a color filter substrate (not shown) is placed on a normal production line. Can be pasted together. On the other hand, if there is a defect that needs to be polished, in step S05, the process proceeds to the cassette housing process for correction. Therefore, the defective array substrate is stored in a cassette that goes to the correction process, and is put into the correction process in step S06.
- the defect information foreign material position, size, etc.
- the control device 14 controls the foreign matter polishing apparatus 1 according to the sequence of the automatic mode.
- the foreign substance polishing apparatus 1 acquires defect information from the main server 15.
- the foreign substance size is determined. If the maximum size of the foreign material in plan view is less than 10 ⁇ m, it can be polished sufficiently by a normal polishing process. Even if the hardness is high, the polishing tape 8 may be cut or the foreign material may be displaced and become on the substrate. Since the possibility of leaving scratches is limited, the process proceeds to step S13 and a normal polishing process is performed.
- step S14 If it is 10 micrometers or more and less than 50 micrometers, it will progress to step S14 and a temporary grinding
- step S13 the moving device 5 performs centering on the foreign matter.
- step S16 the center height of the centered foreign matter is accurately measured by the digital micromirror device.
- step S17 a normal polishing process is performed in step S17.
- the polishing tape 8 is fed out from the supply reel 9 and the polishing tape 8 between the supply reel 9 and the take-up reel 10 is pressed by the polishing head 12 while being taken up by the take-up reel 10. Polish and correct the foreign material on the surface.
- the amount of pressing is based on the average surface of the array substrate, and the polishing tape 8 is run to a height of about 1 to 2 ⁇ m from the reference.
- step S18 again, a height measurement step is performed, and the height after normal polishing is measured.
- step S19 if the height is, for example, 3 ⁇ m or more, it is determined that polishing is still necessary, and the process returns to step S17 again to perform normal polishing. If the height is less than 3 ⁇ m, the process proceeds to step S20. Although not shown, if step S17 is repeated a plurality of times at the same coordinates, if there is no change in height, it is determined that further polishing will not be effective, and the procedure jumps to step 15 or step S20. Good.
- step S14 the moving device 5 performs centering of foreign matter.
- step S22 the height of the centered foreign matter at the coordinates is measured in the height measurement step of step S22.
- step S23 while the polishing tape 8 is being fed, the moving head 5 slowly lowers the polishing head 12 in the Z direction by, for example, 1 to 2 ⁇ m so that the polishing tape 8 does not break.
- step S24 the descent of the polishing head 12 is stopped, and the height is measured again in step S24.
- step S25 it is determined whether there is a change in height. If the height measured in step S25 is lower than the height measured in step S22, foreign matter can be polished by the polishing tape 8, and therefore the process proceeds to step S17 and the above-described normal polishing process is performed. If the height has not decreased, it is determined that the polishing with the polishing tape 8 is impossible due to the hardness being too high, and the process proceeds to step S15 and polishing is not performed.
- step S20 it is determined whether there is an uncorrected defect based on the defect information. If there is an uncorrected defect, the process returns to step S12 and the steps after the determination of the foreign substance size are repeated. If not, it is determined that all polishing corrections have been made, and in step S21, the process is put into the bonding process in step S04.
- the foreign matter polishing method and foreign matter polishing apparatus 1 on the surface of the workpiece W according to the present embodiment even when a large and high hardness foreign matter adheres to the array substrate, the processing capability is not reduced as much as possible, and the polishing tape 8 Breakage and drag can be prevented from occurring.
- the present invention may be configured as follows with respect to the above embodiment.
- the workpiece W is the array substrate after the polyimide resin film is formed in the liquid crystal display device, but is not limited thereto, and may be an array substrate before the polyimide resin film is formed or a color filter substrate. Good. Furthermore, the present invention can also be applied to plasma display substrates other than liquid crystal display devices.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
供給リールから研磨テープを繰り出すと共に、巻取リールで巻き取りながら、該供給リールと巻取リールとの間の研磨テープを研磨ヘッドで押し付けてワーク表面の異物を研磨して修正するワーク表面の異物研磨方法を対象とする。
上記ワーク表面の欠陥を捕捉し、修正のための情報を作成する欠陥捕捉工程と、
上記情報を基に修正が必要な異物の高さを計測する高さ計測工程と、
上記計測した高さが、第1基準未満のときには、通常の研磨工程に移り、第1基準以上第2基準未満のときには、仮研磨工程に移り、第2基準以上のときには、研磨しない判定をする高さ判定工程とを含み、
上記仮研磨工程では、所定量のみ上記研磨ヘッドを下降させて上記異物を研削し、該異物の高さに変化が生じたかを調べ、高さに変化が生じたときには、上記通常の研磨工程に移り、高さに変化が生じないときには、研磨しない構成とする。
上記ワークは、ポリイミド樹脂膜を形成後のガラス基板とする。
上記第1基準は、10μmであり、
上記第2基準は、50μmである。
ワークが載置されるワークステージと、
研磨テープが巻かれた供給リールと、
該研磨テープを巻き取る巻取リールと、
該供給リールと巻取リールとの間に配置され、該研磨テープを上記ワークに対して押し付ける研磨ヘッドと、
該研磨ヘッドを上記ワーク表面の任意の位置に移動させる移動装置とを備えた異物研磨装置を対象とする。
上記ワーク表面の欠陥を捕捉し、修正のための情報を作成する欠陥捕捉機構と、
上記情報を基に修正が必要な異物の高さを計測する高さ計測機構と、
上記計測した高さが、第1基準未満のときには、通常の研磨工程に移り、第1基準以上第2基準未満のときには、仮研磨工程に移り、第2基準以上のときには、研磨しない判定をし、上記仮研磨工程では、上記移動装置により所定量のみ上記研磨ヘッドを下降させて上記異物を研削し、該異物の高さに変化が生じたかを調べ、高さに変化が生じたときには、上記通常の研磨工程に移り、高さに変化が生じないときには、研磨しない制御装置とを備えている。
次に、本実施形態にかかるワークW表面の異物研磨方法について説明する。ワークWは、ポリイミド樹脂膜を形成後のアレイ基板とする。
次いで、ステップS12において、異物サイズの判定を行う。異物の平面視での最大サイズが10μm未満であれば、通常の研磨工程で十分研磨可能であり、仮に高硬度であっても、研磨テープ8が切れたり、異物がずれてしまって基板上に傷を残す可能性が限定されるので、ステップS13に進んで通常の研磨工程が行われる。10μm以上50μm未満であれば、ステップS14に進み仮研磨工程が行われる。50μm以上であれば、仮に低硬度であっても何度も研磨しなければならず、非効率的であり、最初から研磨しないという判断が行えるので、ステップS15に進み、研磨せず、例えば異物研磨装置1が停止され、警報等により、作業者に通知される。
本発明は、上記実施形態について、以下のような構成としてもよい。
3 ワークステージ
5 移動装置
8 研磨テープ
9 供給リール
10 巻取リール
12 研磨ヘッド
14 制御装置
16 欠陥捕捉機構
17 高さ測定機構
Claims (4)
- 供給リールから研磨テープを繰り出すと共に、巻取リールで巻き取りながら、該供給リールと巻取リールとの間の研磨テープを研磨ヘッドで押し付けてワーク表面の異物を研磨して修正するワーク表面の異物研磨方法であって、
上記ワーク表面の欠陥を捕捉し、修正のための情報を作成する欠陥捕捉工程と、
上記情報を基に修正が必要な異物の高さを計測する高さ計測工程と、
上記計測した高さが、第1基準未満のときには、通常の研磨工程に移り、第1基準以上第2基準未満のときには、仮研磨工程に移り、第2基準以上のときには、研磨しない判定をする高さ判定工程とを含み、
上記仮研磨工程では、所定量のみ上記研磨ヘッドを下降させて上記異物を研削し、該異物の高さに変化が生じたかを調べ、高さに変化が生じたときには、上記通常の研磨工程に移り、高さに変化が生じないときには、研磨しない
ことを特徴とするワーク表面の異物研磨方法。 - 請求項1に記載のワーク表面の異物研磨方法において、
上記ワークは、ポリイミド樹脂膜を形成後のガラス基板である
ことを特徴とするワーク表面の異物研磨方法。 - 請求項1又は2に記載のワーク表面の異物研磨方法において、
上記第1基準は、10μmであり、
上記第2基準は、50μmである
ことを特徴とするワーク表面の異物研磨方法。 - ワークが載置されるワークステージと、
研磨テープが巻かれた供給リールと、
該研磨テープを巻き取る巻取リールと、
該供給リールと巻取リールとの間に配置され、該研磨テープを上記ワークに対して押し付ける研磨ヘッドと、
該研磨ヘッドを上記ワーク表面の任意の位置に移動させる移動装置とを備えた異物研磨装置であって、
上記ワーク表面の欠陥を捕捉し、修正のための情報を作成する欠陥捕捉機構と、
上記情報を基に修正が必要な異物の高さを計測する高さ計測機構と、
上記計測した高さが、第1基準未満のときには、通常の研磨工程に移り、第1基準以上第2基準未満のときには、仮研磨工程に移り、第2基準以上のときには、研磨しない判定をし、上記仮研磨工程では、上記移動装置により所定量のみ上記研磨ヘッドを下降させて上記異物を研削し、該異物の高さに変化が生じたかを調べ、高さに変化が生じたときには、上記通常の研磨工程に移り、高さに変化が生じないときには、研磨しない制御装置とを備えている
ことを特徴とする異物研磨装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080047892.0A CN102666011B (zh) | 2009-11-20 | 2010-09-01 | 工件表面的异物研磨方法和异物研磨装置 |
JP2011541790A JP5372169B2 (ja) | 2009-11-20 | 2010-09-01 | ワーク表面の異物研磨方法及び異物研磨装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-265526 | 2009-11-20 | ||
JP2009265526 | 2009-11-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011061884A1 true WO2011061884A1 (ja) | 2011-05-26 |
Family
ID=44059372
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/005395 WO2011061884A1 (ja) | 2009-11-20 | 2010-09-01 | ワーク表面の異物研磨方法及び異物研磨装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5372169B2 (ja) |
CN (1) | CN102666011B (ja) |
WO (1) | WO2011061884A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6113552B2 (ja) * | 2013-03-29 | 2017-04-12 | 株式会社荏原製作所 | 研磨装置及び摩耗検知方法 |
CN106680288A (zh) * | 2017-01-03 | 2017-05-17 | 京东方科技集团股份有限公司 | 一种研磨设备及研磨方法 |
CN108406527B (zh) * | 2018-03-05 | 2020-08-07 | 惠科股份有限公司 | 修复设备的控制方法、修复设备 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1190796A (ja) * | 1997-09-13 | 1999-04-06 | Think Lab Kk | 円筒体の砥石研磨方法 |
JP2007237344A (ja) * | 2006-03-09 | 2007-09-20 | Ntn Corp | テープ研磨方法および装置 |
JP2007290092A (ja) * | 2006-04-27 | 2007-11-08 | Nihon Micro Coating Co Ltd | 研磨装置 |
JP2008093740A (ja) * | 2006-10-06 | 2008-04-24 | Lasertec Corp | 突起欠陥補修装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4410042B2 (ja) * | 2004-06-28 | 2010-02-03 | Ntn株式会社 | 微細パターン修正装置 |
KR100807089B1 (ko) * | 2006-06-09 | 2008-02-26 | 에스엔유 프리시젼 주식회사 | 기판 돌기 제거 장치 |
JP2008290166A (ja) * | 2007-05-23 | 2008-12-04 | Lasertec Corp | テープ研磨装置及びガイド工具 |
-
2010
- 2010-09-01 WO PCT/JP2010/005395 patent/WO2011061884A1/ja active Application Filing
- 2010-09-01 JP JP2011541790A patent/JP5372169B2/ja not_active Expired - Fee Related
- 2010-09-01 CN CN201080047892.0A patent/CN102666011B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1190796A (ja) * | 1997-09-13 | 1999-04-06 | Think Lab Kk | 円筒体の砥石研磨方法 |
JP2007237344A (ja) * | 2006-03-09 | 2007-09-20 | Ntn Corp | テープ研磨方法および装置 |
JP2007290092A (ja) * | 2006-04-27 | 2007-11-08 | Nihon Micro Coating Co Ltd | 研磨装置 |
JP2008093740A (ja) * | 2006-10-06 | 2008-04-24 | Lasertec Corp | 突起欠陥補修装置 |
Also Published As
Publication number | Publication date |
---|---|
CN102666011B (zh) | 2016-01-20 |
JP5372169B2 (ja) | 2013-12-18 |
CN102666011A (zh) | 2012-09-12 |
JPWO2011061884A1 (ja) | 2013-04-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4125148B2 (ja) | 基板処理装置 | |
JP5372169B2 (ja) | ワーク表面の異物研磨方法及び異物研磨装置 | |
JP6397667B2 (ja) | 貼合装置、貼合方法、光学表示デバイスの生産システムおよび光学表示デバイスの生産方法 | |
WO2019013042A1 (ja) | 基板処理システム、基板処理方法及びコンピュータ記憶媒体 | |
JP4468435B2 (ja) | 基板処理装置 | |
JP2008068338A (ja) | 研磨装置、研磨方法、および半導体装置の製造方法 | |
JP5442030B2 (ja) | ワーク表面の異物研磨方法及び異物研磨装置 | |
US20210069859A1 (en) | Processing apparatus | |
JP2004118012A (ja) | 液晶パネルへの偏光板貼付け方法 | |
JP6887016B2 (ja) | ゲッタリング層形成装置、ゲッタリング層形成方法及びコンピュータ記憶媒体 | |
WO2011064919A1 (ja) | 異物研磨装置及びワーク上の異物研磨方法 | |
JP2003273047A (ja) | 研磨装置および研磨方法 | |
WO2011111136A1 (ja) | 異物研磨方法及び異物研磨装置 | |
JPH1034522A (ja) | Cmp用研磨装置及びcmp用装置システム | |
JP5442031B2 (ja) | 異物除去装置 | |
WO2011114399A1 (ja) | 異物研磨方法及び異物研磨装置 | |
JPH1071552A (ja) | 微小突起研磨方法及び装置 | |
JP2010092531A (ja) | 磁気ディスクの製造方法およびクリーニング装置 | |
JP7361831B2 (ja) | 情報処理装置、成形装置、成形方法及び物品の製造方法 | |
WO2012053165A1 (ja) | 異物研磨方法 | |
WO2024116448A1 (ja) | ワークの片面研磨装置、ワークの片面研磨方法、シリコンウェーハの製造方法 | |
JP5218892B2 (ja) | 消耗材の評価方法 | |
JPH07148660A (ja) | ウェーハ貼付け方法とウェーハ貼付け装置 | |
WO2021006092A1 (ja) | 分離装置及び分離方法 | |
WO2011001710A1 (ja) | 研磨装置および研磨方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080047892.0 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10831284 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011541790 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 10831284 Country of ref document: EP Kind code of ref document: A1 |