WO2011040180A1 - Matrice de moulage - Google Patents

Matrice de moulage Download PDF

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Publication number
WO2011040180A1
WO2011040180A1 PCT/JP2010/065111 JP2010065111W WO2011040180A1 WO 2011040180 A1 WO2011040180 A1 WO 2011040180A1 JP 2010065111 W JP2010065111 W JP 2010065111W WO 2011040180 A1 WO2011040180 A1 WO 2011040180A1
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WO
WIPO (PCT)
Prior art keywords
mold
transfer surface
heating element
die
molding die
Prior art date
Application number
PCT/JP2010/065111
Other languages
English (en)
Japanese (ja)
Inventor
哲史 大石
Original Assignee
コニカミノルタオプト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタオプト株式会社 filed Critical コニカミノルタオプト株式会社
Priority to JP2011534157A priority Critical patent/JPWO2011040180A1/ja
Publication of WO2011040180A1 publication Critical patent/WO2011040180A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C45/7331—Heat transfer elements, e.g. heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/08—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means for dielectric heating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3828—Moulds made of at least two different materials having different thermal conductivities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms
    • B29L2011/0016—Lenses

Definitions

  • the present invention relates to a molding die used for molding an objective lens and other lenses for an optical pickup device.
  • a molding die there is one in which a pair of dies are clamped to form a mold space, and a resin is injected into the mold space.
  • a heating means composed of a coil and a magnetic body is provided inside one mold. Some are embedded (see Patent Document 1).
  • the temperature control of the molded body is performed by providing a temperature control channel together with the heat generating means inside each die.
  • an object of the present invention is to provide a molding die that can be easily maintained at a transfer surface portion and that can be precisely temperature-adjusted during resin injection.
  • a molding die includes a first die provided with a first transfer surface for forming a first optical surface, and a second transfer for forming a second optical surface. And a second mold having a surface, the first mold having a heating device including a heating element arranged so as to be exposed to the parting line surface around the first transfer surface.
  • the first mold to be provided with the heating device can be a fixed mold, but can also be a movable mold.
  • the heating element of the heating device provided in the first mold is arranged so as to be exposed to the parting line surface around the first transfer surface. Maintenance of the heating apparatus including this can be performed, and the temperature of the first transfer surface can be precisely adjusted when the molten resin is injected into the mold space.
  • the heating element is arranged so as to surround the first transfer surface in the molding die.
  • the first transfer surface can be efficiently heated from the surroundings and maintained at the target temperature.
  • the heating device is incorporated so that at least the heating element can be replaced.
  • the heating element can be replaced with an appropriate one in accordance with the usage status of the molding die or the replacement of the core die or the nested die on which the first transfer surface is formed.
  • the heating device includes a magnetic body as a heating element and a coil that applies a magnetic field to the magnetic body.
  • the heating element can be easily miniaturized, and the heating element can be easily disposed close to the first transfer surface.
  • the magnetic body forming the heating element is desirably a ferromagnetic body.
  • the first transfer surface and the heating element are arranged apart from each other via a metal portion. In this case, the possibility that excessive stress is applied to the first transfer surface during mold clamping can be reduced, and the transfer accuracy of the optical surface can be increased.
  • the metal portion has a higher thermal conductivity than the base material of the first mold.
  • the heat from the heating element can be efficiently transmitted to the first transfer surface side through the metal portion, and the temperature control near the first transfer surface can be made more precise.
  • the first transfer surface forms an optical surface having an uneven shape in the lens.
  • the concavo-convex shape of the optical surface does not mean that the optical surface is a concave surface or a convex surface as a whole, but means a state in which a fine diffraction structure, a step structure or the like is formed on the optical surface.
  • the temperature control in the vicinity of the first transfer surface is performed by the heating element, and a lens in which the uneven shape is accurately transferred can be obtained.
  • the second mold has a recess provided adjacent to the second transfer surface and forming a resin introduction path extending along the parting line surface.
  • so-called side-gate type injection molding is performed, but it is possible to prevent a significant temperature drop at the portion of the first transfer surface opposite to the gate during filling of the molten resin.
  • An optical surface obtained by relatively uniformly transferring the surface can be obtained.
  • the second mold has a heating device including a heating element disposed so as to be exposed to the parting line surface around the second transfer surface.
  • a heating device including a heating element disposed so as to be exposed to the parting line surface around the second transfer surface.
  • the temperature of the vicinity of the second transfer surface can be directly controlled, and a lens having a precise optical surface can be obtained.
  • FIG. 1 It is a partial side sectional view explaining the molding die of a 1st embodiment.
  • A is a figure explaining the flow-path space for supplying resin to mold space
  • B is a figure explaining the mold space for shape
  • A is a perspective view explaining the external appearance of the molded product formed with the shaping die of FIG. 1
  • B is a side view of the lens as a product.
  • A) is an end view for explaining the main part of the molding die
  • (B) is a side sectional view for explaining the main part of the molding die.
  • A) is a side sectional view explaining the principal part of the shaping die of a modification
  • B) is an end elevation explaining the principal part of a modification.
  • FIG. 1 It is a figure explaining the shaping
  • the molding die 40 of this embodiment includes a movable die 41 and a fixed die 42.
  • the movable mold 41 is reciprocally movable in the AB direction, as will be described in detail later.
  • the movable mold 41 is moved toward the fixed mold 42, the molds 41 and 42 are matched with the parting line surfaces PS1 and PS2, and the mold is clamped.
  • a mold space CV for molding a lens and a flow path space FC for supplying resin to the mold space CV are formed.
  • the flow path space FC is a space that forms the sprue portion SP and the runner portion RP of the molded product MP shown in FIG. 3 (A).
  • the flow path space FC is branched into four corresponding to the four runner portions RP.
  • the flow path space FC communicates with each of the four mold spaces CV via the gate portion GS that forms the gate portion GP of the molded product MP at the four branched ends.
  • the mold space CV is surrounded by the main body space CV1 sandwiched between the first and second transfer surfaces S1 and S2, and the third and fourth transfer surfaces S3 and S4. Flange space CV2.
  • the first and second transfer surfaces S1 and S2 are for forming the optical surfaces OS1 and OS2 of the central optical function part OP in the lens LP shown in an enlarged manner in FIG. Correspond to the end faces of the core molds 74a and 64a.
  • the first transfer surface S1 is deeper than the second transfer surface S2 and has a larger curvature.
  • the first transfer surface S1 is provided with an uneven shape that is a diffractive structure, and the optical surface OS1 of the lens LP has a diffractive structure.
  • the third and fourth transfer surfaces S3 and S4 are portions for forming the flange portion FL of the lens LP, and correspond to end surfaces of outer peripheral dies 74b and 64b described later.
  • the lens LP shown in FIG. 3B is an objective lens for an optical pickup, and in the case of this embodiment, for example, it is assumed to be, for example, a three-standard compatible single objective lens.
  • the lens LP has a BD (Blu-ray Disc) with a wavelength of 405 nm and a DVD (with a wavelength of 655 nm and NA 0.65) depending on optical characteristics such as a diffractive structure formed on the optical surface OS1.
  • Digital Versatile Disc and optical information corresponding to three standards of a wavelength of 780 nm and a CD of NA 0.53 can be read or written.
  • the movable mold 41 as the second mold includes a mold plate 61 that forms the parting line surface PS ⁇ b> 1, a receiving plate 62 that supports the mold plate 61 from the back, and the receiving plate 62 from the back.
  • Projecting pins 65 and 66 for projecting the runner portion RP of the molded product MP and releasing the mold, a movable rod 67a for pushing the core mold 64a from the back, a movable rod 67b for pushing the ejecting pins 65 and 66 from the back, and a movable rod And an advancing / retreating mechanism 69 for advancing and retracting 67a and 67b.
  • the core mold 64a is driven by the moving movable rod 67a to move forward to the fixed mold 42 side, and automatically retracts along with the moving movable rod 67a to return to the original position.
  • the projecting pins 65 and 66 are also driven by the movable rod 67b to advance toward the fixed mold 42, and automatically retract and return to their original positions along with the retracting movable rod 67b.
  • a mold plate 61 which is a mold part on the mold surface side corresponds to a cold slug recess 61a corresponding to the cold slug portion OO of the molded product MP shown in FIG. 3A and a runner portion RP.
  • a runner recess 61b, a gate recess 61c for forming the gate portion GP, and through holes 61e, 61f, 61g provided for inserting the outer peripheral mold 64b and the projecting pins 65, 66 are provided.
  • a jacket 51 which is a flow path for circulating a heat medium, is formed in order to keep the temperature of the mold at an appropriate temperature during molding.
  • a temperature sensor 52 for measuring the temperature of the movable mold 41, that is, the surface temperature of the mold space CV formed by the mold plate 61 is embedded in the mold plate 61.
  • the fixed mold 42 as the first mold includes a mold plate 71 that forms the parting line surface PS2, a mounting plate 72 that supports the mold plate 71 from behind, and a mold space CV shown in FIG.
  • a core die 74a as a central portion formed from the fixed side, an outer peripheral die 74b as a peripheral portion forming the mold space CV from the fixed side, and a sprue bush 77 are provided.
  • a mold plate 71 which is a mold part on the mold surface side includes a sprue bush hole 71a provided for inserting the sprue bush 77, and a runner portion RP of the molded product MP shown in FIG.
  • the sprue bush 77 is inserted and fixed in the sprue bush hole 71 a of the template 71 and the sprue bush hole 72 a of the mounting plate 72.
  • the flow path 77a formed in the sprue bush 77 forms a sprue portion SP of the molded product MP shown in FIG.
  • a jacket 53 which is a flow path for circulating a heat medium, is formed in order to keep the mold temperature at an appropriate temperature during molding. Further, a temperature sensor 54 for measuring the temperature of the fixed mold 42, that is, the surface temperature of the mold space CV and the like is embedded in the mold plate 71.
  • the core mold 74a has a cylindrical outer shape and is housed and fixed in the outer peripheral mold 74b.
  • the outer peripheral die 74b has a cylindrical outer shape and is fixed in a state of being embedded in the through hole 71e of the template 71.
  • the core mold 74a has a first transfer surface S1 as an end surface, and has a thin ring-shaped outer edge surface S11 on the outer edge thereof.
  • the outer peripheral die 74b has a third transfer surface S3 as an end surface, and an annular groove 78 is provided on the outer edge thereof.
  • mold 74b is comprised with the metal.
  • An annular heating element 81 is embedded in the groove 78 and fixed.
  • the heating element 81 has substantially the same shape as the space of the groove 78, but is completely contained in the groove 78. That is, the surface 81a of the heating element 81 is disposed at a position on the same plane as the parting line surface PS2 or at a position retracted to the mounting plate 72 side behind the parting line surface PS2. This prevents the heating element 81 from protruding from the parting line surface PS2 to cause a clamping failure or stress on the first transfer surface S1 of the core die 74a and the molding accuracy deteriorates. To prevent that.
  • the heating element 81 is formed of, for example, a ferromagnetic material and does not generate heat by itself.
  • the heat generation efficiency can be increased by using the heat generating body 81 as a ferromagnetic material.
  • the heating element 81 described above is embedded in the outer peripheral die 74b core die 74a, but the metal portion of the outer peripheral die 74b has a higher thermal conductivity than the base material of the template 71 of the fixed mold 42. Thereby, the heat from the heating element 81 can be efficiently transmitted to the first transfer surface S1 side through the tip portion of the outer peripheral die 74b, and the temperature near the first transfer surface S1 can be accurately managed. it can.
  • tip part can also be formed with a material (metal) with high thermal conductivity.
  • the core die 74a can have the same thermal conductivity as that of the base material of the template 71, but only the first transfer surface S1 side has a lower thermal conductivity than the base material of the template 71. Only the one transfer surface S1 side can have a higher thermal conductivity than the base material of the template 71.
  • the thermal conductivity of the core mold 74a By reducing the thermal conductivity of the core mold 74a, heat conduction (loss) from the first transfer surface S1 on the tip side of the core mold 74a to the inside of the core mold 74a is reduced when the resin is filled. Can do. Thereby, the first transfer surface S1 of the core mold 74a can be heated more efficiently. Therefore, for example, even when the first transfer surface S1 has a complicated fine structure such as a diffractive structure, transferability can be improved. Moreover, when the core mold 74a has a low thermal conductivity, a decrease in the resin temperature can be reduced when the resin is filled. As described above, since the decrease in the resin temperature can be reduced, for example, even when the second transfer surface S2 has a complicated fine structure such as a diffractive structure, the transferability can be improved.
  • the core mold have high thermal conductivity, heat is efficiently transferred from the first transfer surface S1 on the tip side of the heated core mold 74a to the inside of the core mold 74a after resin filling (after surface transfer). Can conduct. Thereby, the first transfer surface S1 of the core die 74a can be cooled more quickly. Therefore, the molding cycle time can be shortened, and productivity can be improved.
  • the optical surface shape of the molded product has a complicated fine structure such as a diffractive structure, and the optical surface shape is relatively difficult to mold
  • a material with low thermal conductivity can be used for the core die 74a.
  • Transferability of the optical surface can be improved, and if the optical surface shape of the molded product is an optical surface shape that is relatively easy to mold, such as a refractive surface shape that does not have a diffractive structure, high heat conduction is provided to the core mold 74a.
  • Productivity can be improved by using the rate material.
  • the transferability and productivity of the optical surface of the molded product can be improved by appropriately selecting the material of the core mold 74a.
  • An annular groove 79 is provided around the outer peripheral die 74b in the template 71.
  • An annular coil 82 is embedded and fixed in the groove 79.
  • the coil 82 has substantially the same shape as the space of the groove 78, but is completely contained in the groove 79. That is, the surface 82a of the coil 82 is disposed at a position on the same plane as the parting line surface PS2 or at a position retracted to the mounting plate 72 side behind the parting line surface PS2.
  • the coil 82 constitutes a heating device 80 in cooperation with the heating element 81 and drives the heating element 81 to perform high-frequency induction heating.
  • the coil 82 forms a magnetic field extending along the axis AX on the inner side by passing a current through the coil 82, and by making this current a high frequency current, the magnetic field passing through the heating element 81 fluctuates at a high frequency.
  • the heating element 81 can be heated remotely without contact. That is, the temperature of the first transfer surface S1 provided on the outer peripheral die 74b can be precisely adjusted.
  • the coil 82 is connected to a power supply line 82 c, and the power supply line 82 c is drawn out of the template 71 through a guide hole 71 k formed in the template 71.
  • the heating device 80 is detachable from the fixed mold 42. That is, the heating element 81 can be attached to and detached from the groove portion 78 using a screw or the like, and can be replaced with one made of a different kind of magnetic material when the molding conditions are changed. Thereby, the emitted-heat amount and heat capacity can be adjusted to a desired value.
  • the coil 82 is also detachable from the groove 79, and can be exchanged for a different specification.
  • the movable mold 41 is not necessarily provided with the heating device 80 as provided in the fixed mold 42, but the movable mold 41 is also provided with a heating device in the core mold 64a or in the vicinity thereof.
  • the temperature of the second transfer surface S2 provided on the core mold 64a can be precisely adjusted, and the temperature drop of the molten resin injected into the mold space CV can be suppressed.
  • FIG. 5 (A) and 5 (B) show a modified example in which the movable mold 41 is modified and a heating device 180 is provided.
  • the heating element 181 is embedded in the groove 178 formed avoiding the gate recess 61c
  • the coil 182 is embedded in the groove 179 formed avoiding the runner recess 61b.
  • the heating element 181 and the coil 182 are in a partially missing annular shape.
  • the coil 182 if a conducting wire (not shown) connecting both ends 182a and 182b of the coil 182 is embedded in the template 61 while avoiding interference with the runner recess 61b, the coil 182 is substantially annular. It is easy to form a strong magnetic field at the position of the heating element 181.
  • the surface 181a of the heating element 181 is disposed at a position on the same plane as the parting line surface PS1 or at a position retracted to the mounting plate 63 side behind the parting line surface PS1.
  • the surface 182a of the coil 182 is also disposed at a position on the same plane as the parting line surface PS1 or a position retracted to the mounting plate 63 side behind the parting line surface PS1.
  • FIG. 6 is a front view for explaining a molding apparatus incorporating the molding die 40 shown in FIG.
  • the illustrated molding apparatus 100 includes an injection molding machine 10 that is a main body part that performs injection molding to produce a molded product MP, a take-out device 20 that is an accessory part that takes out the molded product MP from the injection molding machine 10, and a molding device 100. And a control device 30 for comprehensively controlling the operation of each unit constituting the.
  • the injection molding machine 10 is a horizontal molding machine, and includes a molding die 40, a movable platen 11, a fixed platen 12, a mold clamping plate 13, an opening / closing drive device 15, and an injection device 16.
  • the injection molding machine 10 clamps both molds 41 and 42 by sandwiching a movable mold 41 and a fixed mold 42 constituting the molding mold 40 between the movable platen 11 and the fixed platen 12. Allows molding.
  • the movable platen 11 is supported by a slide guide 15a so as to be movable back and forth with respect to the fixed platen 12.
  • the movable platen 11 detachably supports the movable mold 41.
  • an ejector 45 is incorporated in the movable platen 11.
  • the ejector 45 is a part that operates the advance / retreat mechanism 69 shown in FIG. 1, and by moving the movable rods 67 a, 67 b forward and backward, the molded product MP in the movable mold 41 is released to fix the fixed mold 42. It extrudes to the side and enables transfer by the take-out device 20.
  • the fixed platen 12 is fixed to the center of the support frame 14 so as to face the movable platen 11, and supports the take-out device 20 on the top thereof.
  • the stationary platen 12 detachably supports the stationary mold 42.
  • the fixed platen 12 is fixed to the mold clamping machine 13 via a tie bar so that it can withstand the pressure of mold clamping at the time of molding.
  • the mold clamping machine 13 is fixed to the end of the support frame 14.
  • the mold clamping machine 13 supports the movable board 11 from the back via the power transmission part 15d of the opening / closing drive device 15 at the time of mold clamping.
  • the opening / closing drive device 15 includes a slide guide 15a, a power transmission unit 15d, and an actuator 15e.
  • the slide guide 15a supports the movable platen 11 and enables a smooth reciprocating movement in the advancing and retreating direction with respect to the fixed platen 12.
  • the power transmission unit 15 d expands and contracts by receiving a driving force from an actuator 15 e that operates under the control of the control device 30.
  • the movable platen 11 moves forward and backward freely with respect to the mold clamping plate 13, and as a result, the movable platen 11 and the fixed platen 12 are moved closer to and away from each other.
  • the mold clamping and mold opening with the fixed mold 42 are performed.
  • the injection device 16 includes a cylinder 16a, a raw material storage unit 16b, a screw drive unit 16c, and the like.
  • the injection device 16 operates at an appropriate timing under the control of the control device 30, and can inject molten resin from the resin injection nozzle 16d in a temperature-controlled state.
  • the injection device 16 brings the resin injection nozzle 16d into contact with the sprue bush 77 shown in FIG. 1 in a state where the movable die 41 and the fixed die 42 are clamped, and the flow path space FC (see FIG. 2A).
  • the molten resin in the cylinder 16a can be supplied at a desired timing.
  • a mold temperature controller 46 attached to the injection molding machine 10 circulates a temperature-controlled heat medium in jackets 51 and 53 (see FIG. 1) formed in both molds 41 and 42. .
  • the mold temperature controller 46 raises the temperature of the heating element 81 and the like at a desired timing and the amount of heat generated by supplying a controlled high-frequency current to a heating device 80 embedded in the fixed mold 42 and the like. Thereby, the temperature of both metal mold
  • the mold temperature controller 46 operates in synchronism with mold closing, mold clamping, and molten resin injection, which will be described later, and precisely controls the temperatures of the transfer surfaces S1 and S2 provided on the core molds 74a and 64a. can do.
  • the take-out device 20 includes a hand 21 that can hold the molded product MP and a three-dimensional drive device 22 that moves the hand 21 three-dimensionally.
  • the take-out device 20 operates at an appropriate timing under the control of the control device 30, and after the mold is opened with the movable mold 41 and the fixed mold 42 separated from each other, the molded product MP remaining in the movable mold 41 is obtained. It has a role of gripping and carrying it out.
  • the control device 30 includes an opening / closing control unit 31, an injection device control unit 32, an ejector control unit 33, and a take-out device control unit 34.
  • the opening / closing control unit 31 enables the molds 41 and 42 to be clamped and opened by operating the actuator 15e.
  • the injection device control unit 32 causes the resin to be injected at a desired pressure into the mold space formed between the molds 41 and 42 by operating the screw driving unit 16c and the like.
  • the ejector control unit 33 operates the ejector 45 to push out the molded product MP remaining in the movable mold 41 from the inside of the movable mold 41 when the mold is opened, thereby releasing the mold.
  • the take-out device control unit 34 operates the take-out device 20 to grip the molded product MP remaining in the movable mold 41 after mold opening and mold release and carry it out of the injection molding machine 10.
  • FIG. 7 is a flowchart conceptually illustrating the operation of the molding apparatus 100 shown in FIG.
  • the mold temperature controller 46 heats the surfaces of both molds 41 and 42 to a temperature suitable for molding (step S10).
  • the opening / closing drive device 15 is operated to advance the movable platen 11 to start mold closing (step S11).
  • the movable platen 11 moves to the fixed platen 12 side to the die contact position where the movable die 41 and the fixed die 42 come into contact with each other, and the die closing is completed.
  • mold clamping is performed to clamp the movable mold 41 and the fixed mold 42 with necessary pressure (step S12).
  • the injection device 16 is operated to inject the molten resin into the mold space CV between the clamped movable mold 41 and the fixed mold 42 at a necessary pressure.
  • the injection molding machine 10 maintains the resin pressure in the mold space CV.
  • the mold space CV and the flow path space FC are appropriately heated by the heating device 80, and the molten resin is put into the mold space CV. It can be introduced quickly, and moderate decooling of the resin in the mold space CV can be achieved.
  • step S14 After the molten resin is introduced into the mold space CV, the molten resin in the mold space CV is gradually cooled, so that the molten resin is solidified with the cooling and waits for completion of molding (step S14). .
  • the opening / closing drive device 15 is operated to perform mold opening for retracting the movable platen 11 (step S15).
  • the movable mold 41 moves backward, and the movable mold 41 and the fixed mold 42 are separated from each other.
  • the molded product MP that is, the lens LP is released from the fixed mold 42 while being held by the movable mold 41.
  • the ejector 45 is operated, and the molded product MP is ejected by the movable rods 67a and 67b (step S16). Thereby, the whole mold release is performed about the molded product MP. At this time, an appropriate position of the molded product MP is taken out and supported by the hand 21 of the apparatus 20 to prevent the molded product MP from dropping. Finally, the take-out device 20 is operated to hold the molded product MP completely released from the movable mold 41 with the hand 21 and carry it out (step S17).
  • the heating device 80 provided in the fixed die 42 as the first die includes the heating element 81, and the heating element 81 is the first transfer. Since it is arranged so as to be exposed to the parting line surface PS2 around the surface S1, the heating device 80 can be maintained from the parting line surface PS2 side, and when the molten resin is injected into the mold space CV In addition, the temperature of the first transfer surface S1 can be precisely adjusted. As a result, it is possible to provide a lens LP having a well-transferred shape.
  • the molding die according to the second embodiment is a modification of the first embodiment, and parts not specifically described are the same as those of the first embodiment.
  • the heating device 280 embedded in the fixed mold 42 will be described with reference to FIGS. 8 (A) and 8 (B).
  • the heating device 280 includes a fitting member 281 that is fitted to the end surface and the side surface of the outer peripheral die 74b.
  • the fitting member 281 has a heating element 85a on a part of the circumference, and the remaining part is a non-heating element 85b.
  • the non-heating element 85b is formed of a non-magnetic material or other material having low heat generation.
  • the heating element 85a heated by the coil 82 is disposed on the opposite side of the gate surface 71c, that is, on the opposite gate side. That is, in this embodiment, the non-gate side is relatively heated.
  • the reason for this will be explained.
  • the distal end portions of the outer peripheral die 74b and the core die 74a are heated by the molten resin injected and filled into the die space CV from the gate portion GS.
  • the heating element 85a that is biased on the side opposite to the gate, the temperature distribution at the tip of the outer peripheral die 74b and the core die 74a is made uniform, and the melt that is injected and filled into the die space CV.
  • the resin can be cooled relatively uniformly.
  • the transfer accuracy of the lens LP can be increased, and the shape accuracy of the curved surface or diffraction structure transferred to the optical surface OS2 can be uniformly increased in each part of the optical surface OS2.
  • the molding die according to the third embodiment is a modification of the first and second embodiments, and the parts that are not particularly described are the same as those of the first and second embodiments.
  • the heating device 380 embedded in the fixed mold 42 will be described with reference to FIG.
  • the heating device 380 includes a fitting member 381 that is fitted to the end surface and the side surface of the outer peripheral die 74b.
  • the fitting member 381 has a plurality of heating elements 85a along the circumference, and a non-heating element 85b is formed between the heating elements 85a.
  • the number of heating elements 85a is not limited to the four shown in the figure, and can be changed as appropriate according to manufacturing conditions, and the size of the heating elements 85a can also be changed as appropriate according to manufacturing conditions.
  • the molding die according to the fourth embodiment is a modification of the first and second embodiments, and the parts that are not particularly described are the same as those of the first and second embodiments.
  • the heating device 480 embedded in the fixed mold 42 will be described.
  • the heating device 480 includes a fitting member 481 that fits to the end face and the side face of the outer peripheral die 74b.
  • This fitting member 481 has a heating element 85a having a pentagonal outer side and a circular outline on the inner side, and five places around the heating element 85a are non-heating elements 85b.
  • the outer contour of the heating element 85a is not limited to the illustrated pentagon, and can be changed as appropriate according to the manufacturing conditions.
  • the single coil 82 which comprises the heating apparatus 80 is arrange
  • the coil which comprises the heating apparatus 80 is divided
  • the location of the heating elements 81, 181, and 85a embedded in the fixed mold 42 is not limited to the outer peripheral molds 74b and 64b, but may be appropriate places such as the template plates 71 and 61.
  • the heating devices 80, 280, 380, and 480 are basically embedded in the fixed mold 42.
  • the heating device 180 can be embedded only in the movable mold 41.
  • heating device 80 embedded in the fixed mold 42 in the first embodiment can be replaced with a partially missing annular heating device 180 for the movable mold 41.
  • the first transfer surface S1 on the fixed mold 42 side has a relatively large curvature and a diffractive structure, but the second transfer surface S2 on the movable mold 41 side is compared. It is also possible to have a diffractive structure with a large curvature.
  • the shape of the mold space CV provided in the injection mold composed of the fixed mold 42 and the movable mold 41 is not limited to the illustrated one, and various shapes can be used. That is, the shape of the mold space CV formed by the core molds 64a and 74a is merely an example, and can be appropriately changed according to the use of the lens LP. Note that the use of the lens LP is not limited to compatibility, and may be, for example, a BD alone.
  • Molding mold 41 Movable mold 42
  • Fixed mold 46 Mold temperature controller 52, 54 Temperature sensor 64a, 74a Core mold 64b, 74b Peripheral mold 78, 79, 178, 179 Groove 80, 180, 280, 380, 480 Heating device 81, 181 Heating element 82 Coil 85a Heating element 281, 381 Fitting member OS1, OS2 Optical surface PS1, PS2 Parting line surface S1, S2 Transfer surface

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

La présente invention concerne une matrice de moulage, la maintenance d'une surface de transfert étant aisée et le réglage précis de la température étant possible au moment de l'injection de résine. Une première matrice qui est une matrice fixe (42) est pourvue d'un dispositif chauffant (80), le dispositif chauffant (80) comprend un élément chauffant (81), et l'élément chauffant (81) est conçu de sorte que l'élément chauffant (81) est exposé à une surface de joint (PS2) autour d'une première surface de transfert (S1), la maintenance, etc. du dispositif chauffant (80) devient ainsi possible depuis le côté de la surface de joint (PS2), et la température d'une première surface de transfert (S1) peut être réglée avec précision lors de l'injection de résine fondue dans une empreinte (CV). Une lentille (LP) présentant une forme transférée de manière favorable peut ainsi être fournie.
PCT/JP2010/065111 2009-09-29 2010-09-03 Matrice de moulage WO2011040180A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011534157A JPWO2011040180A1 (ja) 2009-09-29 2010-09-03 成形金型

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Application Number Priority Date Filing Date Title
JP2009-224428 2009-09-29
JP2009224428 2009-09-29

Publications (1)

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WO2011040180A1 true WO2011040180A1 (fr) 2011-04-07

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3118897A1 (fr) * 2021-01-20 2022-07-22 Roctool Dispositif de chauffage par induction adapté au moulage d’une pièce de petite dimension

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05294643A (ja) * 1992-04-15 1993-11-09 Kyocera Corp ガラス光学素子成形装置
JPH06206732A (ja) * 1993-01-11 1994-07-26 Konica Corp ガラス製レンズの成形装置
JP2000246769A (ja) * 1999-03-01 2000-09-12 Canon Inc 成形用金型及び成形方法
JP2005179084A (ja) * 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd 誘導加熱成形装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05294643A (ja) * 1992-04-15 1993-11-09 Kyocera Corp ガラス光学素子成形装置
JPH06206732A (ja) * 1993-01-11 1994-07-26 Konica Corp ガラス製レンズの成形装置
JP2000246769A (ja) * 1999-03-01 2000-09-12 Canon Inc 成形用金型及び成形方法
JP2005179084A (ja) * 2003-12-16 2005-07-07 Matsushita Electric Ind Co Ltd 誘導加熱成形装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3118897A1 (fr) * 2021-01-20 2022-07-22 Roctool Dispositif de chauffage par induction adapté au moulage d’une pièce de petite dimension
WO2022157275A1 (fr) * 2021-01-20 2022-07-28 Roctool Dispositif de chauffage par induction adapté au moulage d'une pièce de petite dimension

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