WO2011030715A1 - 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 - Google Patents

絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 Download PDF

Info

Publication number
WO2011030715A1
WO2011030715A1 PCT/JP2010/065033 JP2010065033W WO2011030715A1 WO 2011030715 A1 WO2011030715 A1 WO 2011030715A1 JP 2010065033 W JP2010065033 W JP 2010065033W WO 2011030715 A1 WO2011030715 A1 WO 2011030715A1
Authority
WO
WIPO (PCT)
Prior art keywords
particles
conductive
insulating
conductive particles
insulating particles
Prior art date
Application number
PCT/JP2010/065033
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
伸也 上野山
正太郎 小原
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to CN2010800399539A priority Critical patent/CN102549676B/zh
Priority to JP2010535097A priority patent/JP4993230B2/ja
Priority to KR1020127006015A priority patent/KR101222375B1/ko
Publication of WO2011030715A1 publication Critical patent/WO2011030715A1/ja

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/002—Inhomogeneous material in general
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating

Definitions

  • the present invention relates to, for example, conductive particles with insulating particles that can be used for electrical connection between electrodes, a manufacturing method thereof, and an anisotropic conductive material and a connection structure using the conductive particles with insulating particles. .
  • Anisotropic conductive materials such as anisotropic conductive paste, anisotropic conductive ink, anisotropic conductive adhesive, anisotropic conductive film, and anisotropic conductive sheet are widely known.
  • anisotropic conductive materials conductive particles are dispersed in paste, ink, or resin.
  • the anisotropic conductive material is used, for example, to electrically connect electrodes of substrates such as a glass substrate and a printed substrate.
  • Coated conductive particles comprising: are disclosed.
  • an anisotropic conductive adhesive composition containing the coated conductive particles and an adhesive is also disclosed.
  • the insulating material includes a polar group on the surface of conductive particles, a polymer electrolyte that can be adsorbed, and inorganic particles that can be adsorbed to the polymer electrolyte. These inorganic particles are insulating particles.
  • the coated conductive particles can be obtained, for example, by electrostatically adsorbing the polymer electrolyte on at least a part of the surface of the conductive particles and then further electrostatically adsorbing the inorganic oxide particles. It is done.
  • polymer electrolyte examples include polyanions having a functional group capable of being negatively charged such as sulfonic acid, sulfuric acid and carboxylic acid, and functional groups capable of being positively charged such as a quaternary ammonium group and an amino group.
  • a functional group capable of being negatively charged such as sulfonic acid, sulfuric acid and carboxylic acid
  • functional groups capable of being positively charged such as a quaternary ammonium group and an amino group.
  • Patent Document 4 discloses coated conductive particles having conductive particles and a resin layer covering the surface of the conductive particles. This resin layer is bonded to the conductive particles through a structure derived from a triazine thiol compound. The resin layer is a film having a thickness of about 10 nm.
  • the insulating particles may be detached from the surface of the conductive particles.
  • the metal layer is a metal layer other than gold, for example, the metal layer is a Ni layer or the Ni layer is exposed on the outermost surface of the metal layer.
  • the insulating particles are easily detached from the surface of the conductive particles.
  • the coated conductive particles described in Patent Document 4 the conductive particles are coated with a resin layer instead of insulating particles.
  • Such a resin layer may not be sufficiently removed by pressure bonding at the time of connection between the electrodes as compared with the insulating particles, and may remain between the conductive particles and the electrodes. For this reason, the conduction
  • An object of the present invention is to provide conductive particles with insulating particles in which the insulating particles are not easily detached from the surface of the conductive particles, a method for producing the same, and an anisotropic conductive material and a connection structure using the conductive particles with insulating particles. Is to provide.
  • the limiting object of the present invention is to provide insulation particularly when the metal layer is a metal layer other than gold, for example, when the metal layer is a Ni layer or the Ni layer is exposed on the outermost surface of the metal layer. It is an object to provide conductive particles with insulating particles in which the particles are hardly detached from the surface of the conductive particles, a method for producing the same, and an anisotropic conductive material and a connection structure using the conductive particles with insulating particles.
  • a hydroxyl group comprising conductive particles having a conductive layer on the surface and insulating particles attached to the surface of the conductive particles, wherein the insulating particles are directly bonded to phosphorus atoms.
  • conductive particles with insulating particles having a hydroxyl group directly bonded to a silicon atom on the surface are provided.
  • the insulating particles have a group represented by the following formula (11) or a hydroxyl group directly bonded to a silicon atom on the surface.
  • X1 represents a hydroxyl group, an alkoxy group or an alkyl group having 1 to 12 carbon atoms.
  • the group represented by the above formula (11) is a group represented by the following formula (11A).
  • the insulating particles are composed of a compound having a hydroxyl group directly bonded to a phosphorus atom or a compound having a hydroxyl group directly bonded to a silicon atom. Insulating particles used.
  • the insulating particles use a compound represented by the following formula (1) or a compound having a hydroxyl group directly bonded to a silicon atom as a material. Insulating particles.
  • X1 represents a hydroxyl group, an alkoxy group or an alkyl group having 1 to 12 carbon atoms
  • X2 represents an organic group containing an unsaturated bond
  • the compound represented by the above formula (1) is a compound represented by the following formula (1A).
  • X2 represents an organic group containing an unsaturated bond.
  • the conductive particle includes a base particle and a conductive layer covering a surface of the base particle.
  • a dispersion obtained by dispersing 0.5 g of conductive particles with insulating particles in 50 g of ion-exchanged water at 23 ° C. is allowed to stand at 100 ° C. for 10 hours. Then, when the conductive particles with insulating particles are removed from the dispersion to obtain a liquid, the electric conductivity of the obtained liquid is 20 ⁇ S / cm or less.
  • the amount of heat generated in the dispersion becomes insulating particles. It is 10 mJ or more per 1 g of attached conductive particles.
  • the outermost surface of the conductive layer is a gold layer, a nickel layer, or a palladium layer.
  • a method for producing conductive particles with insulating particles comprising conductive particles having a conductive layer on the surface and insulating particles attached to the surface of the conductive particles, the method comprising: There is provided a method for producing conductive particles with insulating particles, in which insulating particles having a hydroxyl group directly bonded to the surface or a hydroxyl group directly bonded to a silicon atom are attached to the surface of the conductive particles.
  • the insulating particles having hydroxyl groups directly bonded to the phosphorus atoms or hydroxyl groups directly bonded to the silicon atoms on the surface, the hydroxyl groups directly bonded to the phosphorus atoms. Or a compound having a hydroxyl group directly bonded to a silicon atom.
  • the anisotropic conductive material according to the present invention includes conductive particles with insulating particles configured according to the present invention and a binder resin.
  • a connection structure includes a first connection target member, a second connection target member, and a connection portion connecting the first and second connection target members, and the connection portion is a main connection member.
  • the insulating particle has a hydroxyl group directly bonded to a phosphorus atom or a hydroxyl group directly bonded to a silicon atom, and the insulating particle adheres to the surface of the conductive particle. Therefore, it is difficult for the insulating particles to be detached from the surface of the conductive particles. For this reason, when conductive particles with insulating particles are used for connection between electrodes, even if a plurality of conductive particles with insulating particles are in contact, there are insulating particles between adjacent conductive particles. It is difficult to electrically connect adjacent electrodes that should not be made.
  • FIG. 1 is a cross-sectional view showing conductive particles with insulating particles according to an embodiment of the present invention.
  • FIG. 2 is a cross-sectional view showing conductive particles with insulating particles according to another embodiment of the present invention.
  • FIG. 3 is a partially cutaway cross-sectional view of a connection structure using conductive particles with insulating particles according to an embodiment of the present invention.
  • FIG. 4 is a partially cutaway sectional view showing a modification of the connection structure shown in FIG.
  • FIG. 1 is a sectional view showing conductive particles with insulating particles according to an embodiment of the present invention.
  • the conductive particles 1 with insulating particles include conductive particles 2 and a plurality of insulating particles 3 attached to the surface 2 a of the conductive particles 2.
  • the conductive particles 2 have base material particles 4 and a conductive layer 5 covering the surface 4 a of the base material particles 4.
  • the conductive particles 2 are coated particles in which the surface 4 a of the base particle 4 is coated with the conductive layer 5. Accordingly, the conductive particles 2 have the conductive layer 5 on the surface 2a.
  • the insulating particles 3 are made of an insulating material.
  • Examples of the base particles 4 include resin particles, inorganic particles, organic-inorganic hybrid particles, and metal particles.
  • the base material particles 4 are preferably resin particles formed of a resin.
  • the conductive particles 2 with the insulating particles are disposed between the electrodes, and then the conductive particles 2 are compressed by pressure bonding.
  • the substrate particles 4 are resin particles, the conductive particles 2 are easily deformed during the above-described pressure bonding, and the contact area between the conductive particles 2 and the electrodes can be increased. For this reason, the conduction
  • the resin for forming the resin particles examples include polyolefin resin, acrylic resin, phenol resin, melamine resin, benzoguanamine resin, urea resin, epoxy resin, unsaturated polyester resin, saturated polyester resin, polyethylene terephthalate, polysulfone, and polyphenylene.
  • examples thereof include oxides, polyacetals, polyimides, polyamideimides, polyetheretherketones, and polyethersulfones. Since the hardness of the base particle 4 can be easily controlled within a suitable range, the resin for forming the resin particles is obtained by polymerizing one or more polymerizable monomers having an ethylenically unsaturated group. A polymer is preferred.
  • Examples of the inorganic material for forming the inorganic particles include silica and carbon black.
  • Examples of the organic / inorganic hybrid particles include organic / inorganic hybrid particles formed of a crosslinked alkoxysilyl polymer and an acrylic resin.
  • the substrate particles 4 are metal particles
  • examples of the metal for forming the metal particles include silver, copper, nickel, silicon, gold, and titanium.
  • the metal for forming the conductive layer 5 is not particularly limited.
  • the metal include gold, silver, copper, platinum, palladium, zinc, iron, tin, lead, aluminum, cobalt, indium, nickel, chromium, titanium, antimony, bismuth, germanium, cadmium, silicon, and alloys thereof. Etc.
  • the metal include tin-doped indium oxide (ITO) and solder. Especially, since the connection resistance between electrodes can be made still lower, the alloy containing tin and tin, nickel, palladium, copper, or gold
  • the outermost surface of the conductive layer is preferably a nickel layer or a palladium layer, and particularly preferably a nickel layer.
  • the metal layer is a metal layer other than gold, for example, even if the metal layer is a Ni layer or the Ni layer is exposed on the outermost surface of the metal layer, the insulating particles are conductive. Hard to desorb from the surface of the particles.
  • the conductive layer 5 is formed by one layer.
  • the conductive layer may be formed of a plurality of layers. That is, the conductive layer may have a stacked structure of two or more layers.
  • the outermost layer is preferably a gold layer, a nickel layer, a palladium layer, a copper layer, or an alloy layer containing tin and silver, and is a gold layer. Is more preferable.
  • the connection resistance between the electrodes can be further reduced. Further, when the outermost layer is a gold layer, the corrosion resistance can be further enhanced.
  • the outermost surface of the conductive layer is preferably a gold layer, a nickel layer, or a palladium layer, and particularly preferably a palladium layer.
  • the method for forming the conductive layer 5 on the surface 4a of the substrate particle 4 is not particularly limited.
  • Examples of the method for forming the conductive layer 5 include a method by electroless plating, a method by electroplating, a method by physical vapor deposition, and a metal powder or a paste containing a metal powder and a binder on the surface 4 a of the base particle 4.
  • the method of coating etc. are mentioned.
  • the method by electroless plating is preferable.
  • the method by physical vapor deposition include methods such as vacuum vapor deposition, ion plating, and ion sputtering.
  • the average particle diameter of the conductive particles 2 is preferably in the range of 0.5 ⁇ m to 100 ⁇ m.
  • a more preferable lower limit of the average particle diameter of the conductive particles 2 is 1 ⁇ m, and a more preferable upper limit is 20 ⁇ m.
  • the contact area between the conductive particles 2 and the electrode can be sufficiently increased, and the conductive material aggregated when the conductive layer 5 is formed. It becomes difficult to form the conductive particles 2. Further, the distance between the electrodes connected via the conductive particles 2 does not become too large, and the conductive layer 5 is difficult to peel from the surface 4 a of the base particle 4.
  • the “average particle diameter” of the conductive particles 2 indicates the number average particle diameter.
  • the average particle diameter of the conductive particles 2 is obtained by observing 50 arbitrary conductive particles with an electron microscope or an optical microscope and calculating an average value.
  • the thickness of the conductive layer 5 is preferably in the range of 0.005 to 1 ⁇ m.
  • a more preferable lower limit of the thickness of the conductive layer 5 is 0.01 ⁇ m, and a more preferable upper limit is 0.3 ⁇ m.
  • the thickness of the conductive layer 5 is within the above preferable range, sufficient conductivity can be obtained, and the conductive particles 2 do not become too hard, and the conductive particles 2 are sufficiently bonded at the time of connection between the electrodes. Can be deformed.
  • the thickness of the outermost conductive layer is within the range of 0.001 to 0.5 ⁇ m, particularly when the outermost layer is a gold layer.
  • the thickness of the outermost conductive layer is within the above preferred range, the outermost conductive layer can be uniformly coated, the corrosion resistance can be sufficiently increased, and the connection resistance between the electrodes is sufficiently reduced. Can do. Further, the thinner the gold layer when the outermost layer is a gold layer, the lower the cost.
  • the thickness of the conductive layer 5 can be measured by observing the cross section of the conductive particles 2 using, for example, a transmission electron microscope (TEM).
  • TEM transmission electron microscope
  • the insulating particles 3 are particles having insulating properties.
  • the insulating particles 3 are smaller than the conductive particles 2.
  • Examples of the material constituting the insulating particles 3 include an insulating resin and an insulating inorganic substance.
  • an insulating resin the said resin quoted as resin for forming the resin particle as the base particle 4 is mentioned.
  • an insulating inorganic substance the said inorganic substance quoted as an inorganic substance for forming the inorganic particle as the base particle 4 is mentioned.
  • the insulating particle 3 has a hydroxyl group directly bonded to a phosphorus atom (hereinafter also referred to as a P—OH group) or a hydroxyl group directly bonded to a silicon atom (hereinafter also referred to as a Si—OH group) on the surface 3a. Especially, since the adhesiveness of the electroconductive particle 2 and the insulating particle 3 can be improved further, it is preferable that the insulating particle 3 has the said P-OH group in the surface 3a.
  • the conductive particles 1 with insulating particles can be obtained by attaching the insulating particles 3 having a hydroxyl group directly bonded to a phosphorus atom or a hydroxyl group directly bonded to a silicon atom to the surface 2 a of the conductive particle 2.
  • the insulating particles 3 are attached to the surface 2a of the conductive particles 2 by, for example, the P—OH group or the Si—OH group.
  • the P—OH group or the Si—OH group on the surface 3 a of the insulating particle 3 is strongly chemically bonded to the conductive layer 5 on the surface 2 a of the conductive particle 2.
  • Such a bond has a very high bond strength compared to a bond by van der Waals force or electrostatic force alone. Therefore, the conductive particles 2 and the insulating particles 3 can be firmly attached, and the insulating particles 3 can be prevented from being detached from the surface 2 a of the conductive particles 2.
  • the conductive particles 1 with insulating particles are added to a binder resin or the like and kneaded, the insulating particles 3 are not easily detached from the surface 2 a of the conductive particles 2.
  • the insulating particles 3 are unlikely to be detached from the surface 2 a of the conductive particles 2 due to an impact at the time of contact.
  • the plurality of insulating particles 3 having the P—OH group or the Si—OH group on the surface 3a are not chemically bonded to each other by the P—OH group or the Si—OH group. For this reason, the insulating particles 3 can be attached to the surface 2a of the conductive particles 2 so as to form a single layer rather than two or more layers. Accordingly, it is possible to obtain conductive particles 1 with insulating particles having a uniform particle size.
  • the conductive layer 5 or the electrode is hardly corroded by the P—OH group or the Si—OH group.
  • the conductive layer 5 or the electrode may be corroded by the group containing a sulfur atom. Since the insulating particle 3 has the P—OH group or the Si—OH group on the surface 3a, corrosion of the conductive layer 5 or the electrode can be suppressed.
  • the insulating particles 3 preferably have a group represented by the following formula (11) or a hydroxyl group directly bonded to a silicon atom on the surface 3a. That is, the insulating particles having the P—OH group on the surface preferably have a group represented by the following formula (11) on the surface. In this case, the insulating particles 3 are more difficult to be detached from the surface 2 a of the conductive particles 2.
  • X1 represents a hydroxyl group, an alkoxy group or an alkyl group having 1 to 12 carbon atoms.
  • the group represented by the above formula (11) is preferably a group represented by the following formula (11A).
  • the adhesion of the insulating particles 3 to the conductive particles 2 can be further enhanced.
  • the insulating particles having the Si—OH group on the surface preferably have a group represented by the following formula (12) on the surface.
  • the group represented by the following formula (12) can be relatively easily introduced into the surface 3 a of the insulating particle 3.
  • Z1 and Z2 each represent a hydroxyl group, an alkoxy group or an alkyl group having 1 to 12 carbon atoms. Z1 and Z2 may be the same or different. Since the insulating particles 3 can be firmly attached to the surface 2a of the conductive particles 2, each of Z1 and Z2 is preferably a hydroxyl group.
  • the insulating particle may be a compound having a hydroxyl group directly bonded to a phosphorus atom (hereinafter also referred to as a P—OH group-containing compound).
  • a P—OH group-containing compound a compound having a hydroxyl group directly bonded to a silicon atom
  • Si—OH group-containing compound a material constituting the insulating particle in the production of the insulating particle. Examples thereof include a method of containing the P—OH group-containing compound or the Si—OH group-containing compound.
  • the P—OH is used as a material constituting the insulating particle 3 when the insulating particle 3 is produced.
  • a method of containing the group-containing compound or the Si—OH group-containing compound is preferable. Since the adhesion between the insulating particles 3 and the conductive particles 2 can be further improved, the insulating particles 3 are preferably insulating particles using the P—OH group-containing compound as a material.
  • the insulating particle 3 having a hydroxyl group directly bonded to a phosphorus atom or a hydroxyl group directly bonded to a silicon atom on the surface thereof is bonded directly to a compound having a hydroxyl group directly bonded to a phosphorus atom or a silicon atom, for example. It can be obtained by using a compound having a hydroxyl group.
  • the P—OH group-containing compound or the Si—OH group-containing compound is chemically treated on the surface of the insulating particles. And the surface of the insulating particle is chemically treated, and the insulating particle has the P—OH group or the Si—OH group on the surface by the P—OH group-containing compound or the Si—OH group-containing compound. And the like.
  • Examples of the P—OH group-containing compound include compounds represented by the following formula (1).
  • X1 represents a hydroxyl group, an alkoxy group or an alkyl group having 1 to 12 carbon atoms
  • X2 represents an organic group containing an unsaturated bond
  • X1 is preferably a hydroxyl group. That is, the compound represented by the above formula (1) is preferably a compound represented by the following formula (1A). In this case, the adhesion between the conductive particles 2 and the insulating particles 3 can be further enhanced.
  • X2 represents an organic group containing an unsaturated bond.
  • X2 in the above formula (1) and formula (1A) preferably contains a (meth) acryloyl group because it can be easily copolymerized with the constituent raw material of the insulating particles 3.
  • P—OH group-containing compound examples include acid phosphooxyethyl methacrylate, acid phosphooxypropyl methacrylate, acid phosphooxypolyoxyethylene glycol monomethacrylate, and acid phosphooxypolyoxypropylene glycol monomethacrylate. Only one type of P—OH group-containing compound may be used, or two or more types may be used in combination.
  • Si—OH group-containing compound examples include compounds represented by the following formula (2).
  • Z1 and Z2 each represent a hydroxyl group, an alkoxy group or an alkyl group having 1 to 12 carbon atoms
  • Z3 represents an organic group containing an unsaturated bond.
  • Z1 to Z3 may be the same or different. Since the insulating particles 3 can be firmly attached to the surface 2a of the conductive particles 2, each of Z1 and Z2 is preferably a hydroxyl group. Further, Z3 preferably contains a (meth) acryloyl group because it can be easily copolymerized with the constituent material of the insulating particles.
  • Si—OH group-containing compound examples include vinyltrihydroxysilane and 3-methacryloxypropyltrihydroxysilane.
  • said Si-OH group containing compound only 1 type may be used and 2 or more types may be used together.
  • the particle diameter of the insulating particles 3 can be appropriately selected depending on the particle diameter of the conductive particles 2 and the use of the conductive particles 1 with insulating particles.
  • the average particle diameter of the insulating particles 3 is preferably in the range of 0.005 to 1 ⁇ m. A more preferable lower limit of the average particle diameter of the insulating particles 3 is 0.01 ⁇ m, and a more preferable upper limit is 0.5 ⁇ m. If the average particle diameter of the insulating particles 3 is too small, the conductive particles 2 of the plurality of conductive particles 1 with insulating particles are likely to come into contact with each other when the conductive particles 1 with insulating particles are dispersed in the binder resin. If the average particle diameter of the insulating particles 3 is too large, it is necessary to increase the pressure in order to eliminate the insulating particles 3 between the electrodes and the conductive particles 2 during connection between the electrodes, You have to heat it up.
  • the “average particle diameter” of the insulating particles 3 indicates the number average particle diameter.
  • the average particle diameter of the insulating particles 3 is obtained in the same manner as the average particle diameter of the conductive particles 2.
  • the average particle diameter of the insulating particles 3 is preferably 1/5 or less of the average particle diameter of the conductive particles 2.
  • the average particle diameter of the insulating particles 3 is preferably 1/1000 or more of the average particle diameter of the conductive particles 2.
  • the average particle diameter of the insulating particles 3 is 1/5 or less of the average particle diameter of the conductive particles 2, for example, when the conductive particles 1 with insulating particles are manufactured, the insulating particles 3 are formed on the surface of the conductive particles 2. It can be made to adhere more efficiently by 2a.
  • Two or more kinds of insulating particles having different particle diameters may be used.
  • the exposed area of the conductive particles 2 can be reduced. Therefore, even if a plurality of conductive particles with insulating particles are in contact with each other, the adjacent conductive particles 2 are difficult to contact with each other, so that a short circuit between adjacent electrodes can be suppressed.
  • the average particle diameter of the small insulating particles is preferably 1 ⁇ 2 or less of the average particle diameter of the large insulating particles.
  • the number of small insulating particles is preferably 1 ⁇ 4 or less of the number of large insulating particles.
  • the coverage of the insulating particles 3 (the coverage of the conductive particles 2 with the insulating particles 3) is preferably in the range of 5 to 70%.
  • the said coverage shows the area of the part coat
  • FIG. When the coverage is within the preferred range, the adjacent conductive particles 2 are more difficult to contact, and the insulating particles 3 can be formed without applying heat and pressure more than necessary when connecting the electrodes. Can be eliminated sufficiently.
  • the contact area of the insulating particles 2 attached to the surface 2 a of the conductive particles 2 is preferably 20% or less of the surface area of the insulating particles 3.
  • the deformation of the insulating particles 2 is relatively small, and the thickness of the coating layer of the insulating particles 3 attached to the surface of the conductive particles 2 can be made uniform.
  • the insulating particle 3 between the electroconductive particle 2 and an electrode can be efficiently excluded in the case of contact between electrodes.
  • the lower limit of the contact area of the insulating particle 2 is not particularly limited, and may be substantially 0% as long as the insulating particle 3 adheres to the surface 2a of the conductive particle 2.
  • FIG. 2 is a sectional view showing conductive particles with insulating particles according to another embodiment of the present invention.
  • the conductive particles 12 are metal particles and a plurality of insulating particles 3 that are attached to the surface 12a of the conductive particles 12. Since the conductive particles 12 are metal particles, they have a conductive layer on the surface 12a. Thus, the conductive particles only have to have a conductive layer on the surface, and may be metal-coated particles or metal particles.
  • the metal for forming the conductive particles 12 is not particularly limited. As said metal, the said metal quoted as the metal for forming the conductive layer 5 of the electroconductive particle 2 is mentioned. A preferable range of the average particle diameter of the conductive particles 12 is the same as the average particle diameter of the conductive particles 2.
  • a dispersion obtained by dispersing 0.5 g of conductive particles with insulating particles in 50 g of ion-exchanged water at 23 ° C. is allowed to stand at 100 ° C. for 10 hours, and then the conductive particles with insulating particles are removed from the dispersion to remove the liquid.
  • the electric conductivity of the obtained liquid is preferably 20 ⁇ S / cm or less.
  • the electric conductivity of the liquid is more preferably 15 ⁇ S / cm or less. The insulation reliability can be further improved as the electrical conductivity is lower.
  • Examples of the electrical conductivity measuring device include “COND METER ES-51” manufactured by HORIBA, Ltd.
  • the method of controlling the electrical conductivity a method in which an ionic compound is not used in the step of coating the conductive particles with the insulating particles, and a strong bond with the conductive particles in the step of coating the conductive particles with the insulating particles. And a method of using an ionic compound.
  • the method of controlling the said electric conductivity is a method which does not use an ionic compound in the process of coat
  • the amount of heat generated in the dispersion is preferably 10 mJ or more per 1 g of conductive particles with insulating particles.
  • the calorific value is more preferably 80 mJ or more. The higher the calorific value, the higher the dispersibility of the conductive particles with insulating particles in the binder resin or the like. For this reason, it becomes difficult to produce the aggregated conductive particles with insulating particles, and the conductive particles can be arranged with high accuracy between the electrodes. Therefore, since the conductive particles can be accurately arranged between the electrodes, the upper and lower electrodes to be connected can be easily connected by the conductive particles.
  • the adjacent electrodes which should not be connected are connected via several electroconductive particle by presence of the aggregated electroconductive particle with an insulating particle. For this reason, the conduction
  • the calorific value is equal to or more than the lower limit
  • the binder resin is an epoxy resin
  • the dispersibility of the conductive particles with insulating particles in the epoxy resin is increased.
  • calorific value measuring device examples include “TAMIII” manufactured by TA Instruments Inc.
  • the average particle diameter of the conductive particles in the conductive particles with insulating particles is 1 to 20 ⁇ m and the calorific value is not less than the lower limit. Furthermore, the average particle diameter of the conductive particles in the conductive particles with insulating particles is 1 to 20 ⁇ m, the coverage in the conductive particles with insulating particles is 5 to 70%, and the heat generation amount is not less than the lower limit. Preferably there is. In these cases, the amount of heat generated in the dispersion can be further increased, and the dispersibility of the conductive particles with insulating particles in the binder resin or the like can be further increased.
  • the outermost surface of the conductive layer is a gold layer, a nickel layer, or a palladium layer, and the calorific value is 10 mJ or more.
  • the calorific value in the dispersion can be further increased, and the dispersibility of the conductive particles with insulating particles in the binder resin or the like can be further increased.
  • Examples of the method for controlling the heat generation amount include a method for surface-treating conductive particles, a method for optimizing the composition of insulating particles, and a method for surface-treating insulating particles. Especially, since control of the emitted-heat amount is easy, it is preferable that the method of controlling the said emitted-heat amount is a method of optimizing the composition of an insulating particle.
  • the anisotropic conductive material according to the present invention contains the conductive particles with insulating particles of the present invention and a binder resin.
  • the conductive particles 1 with insulating particles according to the present embodiment are used, since the insulating particles 3 and the conductive particles 2 are firmly attached, the conductive particles 1 with insulating particles are dispersed in the binder resin. For example, the insulating particles 3 are unlikely to be detached from the surface 2 a of the conductive particles 2 during the process.
  • the binder resin is not particularly limited. In general, an insulating resin is used as the binder resin.
  • the binder resin include vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers. As for the said binder resin, only 1 type may be used and 2 or more types may be used together.
  • Examples of the vinyl resin include vinyl acetate resin, acrylic resin, and styrene resin.
  • examples of the thermoplastic resin include polyolefin resin, ethylene-vinyl acetate copolymer, and polyamide resin.
  • examples of the curable resin include an epoxy resin, a urethane resin, a polyimide resin, and an unsaturated polyester resin.
  • the curable resin may be a room temperature curable resin, a thermosetting resin, a photocurable resin, or a moisture curable resin.
  • the curable resin may be used in combination with a curing agent.
  • thermoplastic block copolymer examples include a styrene-butadiene-styrene block copolymer, a styrene-isoprene-styrene block copolymer, a hydrogenated product of a styrene-butadiene-styrene block copolymer, and a styrene-isoprene. -Hydrogenated products of styrene block copolymers.
  • the elastomer examples include styrene-butadiene copolymer rubber and acrylonitrile-styrene block copolymer rubber.
  • anisotropic conductive materials include, for example, fillers, extenders, softeners, plasticizers, polymerization catalysts, curing catalysts, colorants, antioxidants, thermal stabilizers. Further, various additives such as a light stabilizer, an ultraviolet absorber, a lubricant, an antistatic agent or a flame retardant may be contained.
  • the method for dispersing the conductive particles with insulating particles in the binder resin is not particularly limited, and a conventionally known dispersion method can be used.
  • a method for dispersing conductive particles with insulating particles in the binder resin include, for example, a method in which conductive particles with insulating particles are added to a binder resin and then kneaded and dispersed with a planetary mixer or the like.
  • a method in which conductive particles are uniformly dispersed in water or an organic solvent using a homogenizer or the like, then added to a binder resin, kneaded and dispersed with a planetary mixer, etc., and the binder resin is water or an organic solvent, etc.
  • a method in which conductive particles with insulating particles are added, and the mixture is kneaded and dispersed with a planetary mixer or the like after dilution.
  • the anisotropic conductive material of the present invention can be used as an anisotropic conductive paste, anisotropic conductive ink, anisotropic conductive adhesive, anisotropic conductive film, anisotropic conductive sheet or the like.
  • anisotropic conductive material containing the conductive particles with insulating particles of the present invention is used as a film-like adhesive such as an anisotropic conductive film or anisotropic conductive sheet
  • the conductive material with insulating particles A film adhesive that does not include conductive particles with insulating particles may be laminated on the film adhesive that includes the particles.
  • the content of the conductive particles with insulating particles is not particularly limited. From the viewpoint of improving the conduction reliability, the content of the conductive particles with insulating particles is preferably in the range of 0.01 to 20% by volume in 100% by volume of the anisotropic conductive material.
  • FIG. 3 is a cross-sectional view schematically showing a connection structure using conductive particles according to an embodiment of the present invention.
  • connection structure 21 shown in FIG. 3 is a connection that electrically connects the first connection target member 22, the second connection target member 23, and the first and second connection target members 22 and 23. Part 24.
  • the connecting portion 24 is formed of an anisotropic conductive material including the conductive particles 1 with insulating particles and the binder resin 25.
  • a plurality of electrodes 22 b are provided on the upper surface 22 a of the first connection target member 22.
  • a plurality of electrodes 23 b are provided on the lower surface 23 a of the second connection target member 23.
  • the electrode 22b and the electrode 23b are laminated via the conductive particles 1 with insulating particles.
  • the electrode 22 b and the electrode 23 b are electrically connected by the conductive particles 2.
  • first and second connection target members 22 and 23 include electronic components such as semiconductor chips, capacitors, and diodes, and circuit boards such as printed boards, flexible printed boards, and glass boards.
  • the manufacturing method of the connection structure 21 is not particularly limited.
  • the anisotropic conductive material is disposed between the first connection target member 22 and the second connection target member 23 to obtain a laminate, The method of heating and pressurizing this laminated body is mentioned.
  • the temperature at which the laminate is heated is about 120 to 220 ° C.
  • the pressure applied to the laminate is about 9.8 to 10 4 to 4.9 ⁇ 10 6 Pa.
  • the insulating particles 3 existing between the conductive particles 2 and the electrodes 22b and 23b can be eliminated.
  • the insulating particles 3 existing between the conductive particles 2 and the electrodes 22b and 23b are melted or deformed, so that the surface 2a of the conductive particles 2 is obtained. Is partially exposed.
  • some of the insulating particles 3 are peeled off from the surface 2a of the conductive particles 2, and the surface 2a of the conductive particles 2 is partially May be exposed. The portions where the surface 2a of the conductive particle 2 is exposed come into contact with the electrodes 22b and 23b, whereby the electrodes 22b and 23b can be electrically connected via the conductive particle 2.
  • the layer 26 derived from the insulating particles 3 is formed around the contact portion between the conductive particles 2 and the electrodes 22b and 23b. It is formed.
  • the insulating particle 3 has the P—OH group or the Si—OH group on the surface 3a.
  • the P—OH group or the Si—OH group is strongly chemically bonded not only to the conductive layer on the surface 2 a of the conductive particle 2 but also to the electrodes 22 b and 23 b formed of metal. For this reason, the layer 26 derived from the insulating particles 3 is strongly chemically bonded to the electrodes 22b and 23b.
  • the layer 26 derived from the insulating particles 3 is firmly chemically bonded to the electrodes 22b and 23b, and therefore the adhesive strength between the conductive particles 2 and the electrodes 22b and 23b. Can be increased. For this reason, the connection reliability between electrodes can be improved.
  • a modified example of the connection structure 21 includes conductive particles 1 ⁇ / b> A and 1 ⁇ / b> B with insulating particles disposed between the plurality of electrodes 22 b and 23 b, respectively.
  • the conductive particles with insulating particles 1A to 1D are in contact with 1D.
  • the interval between a plurality of adjacent electrodes 22b and the interval between a plurality of adjacent electrodes 23b have become narrower. When the distance between the lateral electrodes 22b and 23b is narrow, the laterally adjacent electrodes 22b and 23b may come into contact with each other through the continuous conductive particles with insulating particles 1A to 1D.
  • the insulating particles 3 are unlikely to be detached from the surface 2a of the conductive particles 2 unless a large force is applied. However, the insulating particles 3 exist between the conductive particles 2. For this reason, the short circuit of a plurality of adjacent electrodes 22b and 23b can be suppressed. That is, even if the plurality of conductive particles 1 with insulating particles come into contact with each other, the plurality of electrodes 22 b and 23 b adjacent in the lateral direction that should not be connected are hardly connected by the plurality of conductive particles 2.
  • the monomer composition was weighed in distilled water so that the solid content was 10% by weight, stirred at 200 rpm, and polymerized at 60 ° C. for 24 hours in a nitrogen atmosphere. After completion of the reaction, the mixture was freeze-dried to obtain insulating particles A having P—OH groups derived from acid phosphooxypolyoxyethylene glycol methacrylate on the surface.
  • Acid phosphooxypolyoxypropylene glycol mono-acid is similar to insulating particle A except that the acid phosphooxypolyoxyethylene glycol methacrylate is changed to acid phosphooxypolyoxypropylene glycol monomethacrylate.
  • Insulating particles C having the above-described P—OH groups derived from methacrylate on the surface were obtained.
  • the monomer composition was weighed in distilled water so that the solid content was 10% by weight, stirred at 200 rpm, and polymerized at 60 ° C. for 24 hours in a nitrogen atmosphere. After completion of the reaction, the particles were freeze-dried to obtain insulating particles D having the Si—OH groups derived from vinyltrihydroxysilane on the surface.
  • insulating particles E The Si derived from 3-methacryloxypropyltrihydroxysilane was the same as the insulating particles D except that the vinyltrihydroxysilane was changed to 3-methacryloxypropyltrihydroxysilane. Insulating particles E having —OH groups on the surface were obtained.
  • Preparation of conductive particles A to B (1) Preparation of conductive particles A (the outermost layer is a nickel layer) Alkaline degreasing with an aqueous sodium hydroxide solution on 10 g of resin particles formed of a copolymer resin of tetramethylolmethanetetraacrylate and divinylbenzene having an average particle diameter of 3 ⁇ m , Acid neutralization and sensitizing in a tin dichloride solution. Thereafter, pretreatment of electroless plating by activation in a palladium dichloride solution was performed, followed by filtration and washing to obtain resin particles in which palladium was adhered to the particle surfaces.
  • the following electroless nickel plating process was performed using the resin particles.
  • Electroless nickel plating process The resin particles were treated with a 10 wt% solution of an ion adsorbent for 5 minutes and then added to a 0.01 wt% palladium sulfate aqueous solution. Thereafter, dimethylamine borane was added for reduction treatment, filtration, and washing to obtain resin particles to which palladium was attached.
  • a 1% by weight sodium succinate solution in which sodium succinate was dissolved in 500 mL of ion-exchanged water was prepared.
  • 10 g of resin particles with palladium attached were added and mixed to prepare a slurry.
  • Sulfuric acid was added to the slurry, and the pH of the slurry was adjusted to 5.
  • a nickel plating solution containing 10% by weight of nickel sulfate, 10% by weight of sodium hypophosphite, 4% by weight of sodium hydroxide and 20% by weight of sodium succinate was prepared.
  • the slurry adjusted to pH 5 was heated to 80 ° C., and then the nickel plating solution was continuously added dropwise to the slurry and stirred for 20 minutes to advance the plating reaction. After confirming that hydrogen was no longer generated, the plating reaction was completed.
  • a late nickel plating solution containing 20% by weight of nickel sulfate, 5% by weight of dimethylamine borane and 5% by weight of sodium hydroxide was prepared.
  • the late nickel plating solution was continuously added dropwise to the solution that had undergone the plating reaction with the previous nickel plating solution, and the plating reaction was allowed to proceed by stirring for 1 hour. In this way, a nickel layer was formed on the surface of the resin particles, and conductive particles A were obtained.
  • the nickel layer had a thickness of 0.1 ⁇ m.
  • Electroless palladium plating process 10 g of the obtained conductive particles A were added to 500 mL of ion-exchanged water and sufficiently dispersed with an ultrasonic processor to obtain a particle suspension. While stirring the suspension at 50 ° C., 0.02 mol / L of palladium sulfate, 0.04 mol / L of ethylenediamine as a complexing agent, 0.06 mol / L of sodium formate as a reducing agent, and pH 10.0 containing a crystal modifier. The electroless plating solution was gradually added to perform electroless palladium plating. When the thickness of the palladium layer reached 0.03 ⁇ m, the electroless palladium plating was finished. Next, by washing and vacuum drying, conductive particles B having a palladium layer laminated on the surface of the nickel layer were obtained.
  • Example 1 The obtained insulating particles A were dispersed in distilled water under ultrasonic irradiation to obtain a 10 wt% aqueous dispersion of insulating particles A. 10 g of the obtained conductive particles A were dispersed in 500 mL of distilled water, 4 g of an aqueous dispersion of insulating particles A was added, and the mixture was stirred at room temperature for 6 hours. After filtration through a 3 ⁇ m mesh filter, the product was further washed with methanol and dried to obtain conductive particles with insulating particles.
  • Example 2 Conductive particles with insulating particles were obtained in the same manner as in Example 1 except that the types of insulating particles and conductive particles used were changed as shown in Table 1 below.
  • the coverage of the conductive particles with insulating particles was measured by SEM image analysis.
  • a circle with a diameter half the diameter of the conductive particles with insulating particles is drawn on the SEM image, and the coverage of the conductive particles with insulating particles in the circle (per one conductive particle with insulating particles in the circle) Projected area ⁇ number of conductive particles with insulating particles / projected area of conductive particles with insulating particles in a circle).
  • Conductive particles with insulating particles were added to the resin composition so that the content was 3% by volume to obtain an anisotropic conductive material.
  • a part of the obtained anisotropic conductive material was washed with toluene, and conductive particles with insulating particles were taken out.
  • the extracted conductive particles with insulating particles were observed by SEM to determine whether the insulating particles were detached from the surface of the conductive particles, and the adhesion of the insulating particles was evaluated according to the following evaluation criteria.
  • the anisotropic conductive material obtained by the above (2) evaluation of the adhesion of insulating particles is coated on a release film so that the thickness after drying becomes 7 ⁇ m, and toluene is evaporated to obtain insulating particles.
  • a second adhesive film containing the attached conductive particles was obtained.
  • the two-layer structure has a thickness of 17 ⁇ m.
  • An anisotropic conductive film was obtained.
  • the obtained anisotropic conductive film was cut into a size of 4 mm ⁇ 18 mm.
  • a silicon wafer (vertical 3 mm ⁇ width 15 mm ⁇ width) having electrodes formed of gold with a comb pattern (number of lines 400, overlap length 2 mm, line width 20 ⁇ m, line interval 20 ⁇ m, line height 18 ⁇ m) A thickness of 1 mm) was prepared.
  • a glass substrate (vertical 2 mm ⁇ horizontal 12.5 mm ⁇ thickness 1 mm) having electrodes formed of ITO on the upper surface was prepared.
  • the obtained anisotropic conductive film was attached to the lower surface of the silicon wafer from the second adhesive film side.
  • the silicon wafer was laminated on the glass substrate from the anisotropic conductive film side.
  • thermocompression bonding was performed under the following conditions 1 and 2 to obtain a measurement sample.
  • the resistance value between the electrodes of the obtained 20 measurement samples was measured, and the number of measurement samples having a resistance value of 10 8 ⁇ or more was counted and evaluated according to the following evaluation criteria.
  • Condition 1 Heating at 150 ° C. for 30 minutes under 20N pressure
  • Condition 2 Heating at 200 ° C. for 30 seconds under 200N pressure
  • thermocompression bonding was performed under the following conditions 1 and 2 to obtain a measurement sample.
  • the resistance values of the 20 measurement samples obtained were measured by the four-terminal method, the number of measurement samples having a resistance value of 5 ⁇ or less was counted, and the evaluation was performed according to the following evaluation criteria.
  • Condition 1 Heating at 150 ° C. for 30 minutes under 20N pressure
  • Condition 2 Heating at 200 ° C. for 30 seconds under 200N pressure
  • Adhesion test A measurement sample was prepared which was obtained under the above condition 1 in the continuity test (5) between the opposing electrodes. This measurement sample was left for 300 hours under a cycle of 55 ° C. for 6 hours and 120 ° C. for 6 hours. Thereafter, the cross section of the measurement sample was observed with an SEM, and the presence or absence of interface peeling between the conductive particles and the insulating particles and between the insulating particles and the binder resin was observed, and evaluated according to the following evaluation criteria.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
PCT/JP2010/065033 2009-09-08 2010-09-02 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体 WO2011030715A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2010800399539A CN102549676B (zh) 2009-09-08 2010-09-02 附着绝缘粒子的导电性粒子、附着绝缘粒子的导电性粒子的制造方法、各向异性导电材料及连接结构体
JP2010535097A JP4993230B2 (ja) 2009-09-08 2010-09-02 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
KR1020127006015A KR101222375B1 (ko) 2009-09-08 2010-09-02 절연 입자 부착 도전성 입자, 절연 입자 부착 도전성 입자의 제조 방법, 이방성 도전 재료 및 접속 구조체

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-207175 2009-09-08
JP2009207175 2009-09-08

Publications (1)

Publication Number Publication Date
WO2011030715A1 true WO2011030715A1 (ja) 2011-03-17

Family

ID=43732388

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/065033 WO2011030715A1 (ja) 2009-09-08 2010-09-02 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体

Country Status (5)

Country Link
JP (2) JP4993230B2 (zh)
KR (1) KR101222375B1 (zh)
CN (1) CN102549676B (zh)
TW (1) TW201122077A (zh)
WO (1) WO2011030715A1 (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004348A (ja) * 2011-06-17 2013-01-07 Sekisui Chem Co Ltd 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2014132567A (ja) * 2012-12-05 2014-07-17 Sekisui Chem Co Ltd 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
JP2014241281A (ja) * 2013-05-14 2014-12-25 積水化学工業株式会社 導電フィルム及び接続構造体
CN111954909A (zh) * 2018-04-04 2020-11-17 积水化学工业株式会社 带有绝缘性粒子的导电性粒子、导电材料以及连接结构体
KR20210029143A (ko) 2018-07-06 2021-03-15 세키스이가가쿠 고교가부시키가이샤 절연성 입자 구비 도전성 입자, 도전 재료 및 접속 구조체

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5982217B2 (ja) * 2011-08-08 2016-08-31 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP6119130B2 (ja) * 2012-07-11 2017-04-26 日立化成株式会社 複合粒子及び異方導電性接着剤
CN104471650A (zh) * 2012-10-02 2015-03-25 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP5530571B1 (ja) * 2012-11-28 2014-06-25 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
CN105917420B (zh) * 2014-01-14 2019-09-03 东洋铝株式会社 复合导电性粒子、包含其的导电性树脂组合物及导电性涂布物
KR102150607B1 (ko) * 2014-09-12 2020-09-01 엘지이노텍 주식회사 무기충전재, 이를 포함하는 에폭시 수지 조성물, 그리고 이를 이용한 절연층을 포함하는 발광소자
JP7132112B2 (ja) * 2018-12-11 2022-09-06 積水化学工業株式会社 導電フィルム及び接続構造体

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241489A (ja) * 2003-02-04 2004-08-26 Sekisui Chem Co Ltd 異方導電性光後硬化型ペースト、それを用いた電気部品の接合方法及び電気部品
JP2005187637A (ja) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子
JP2006059721A (ja) * 2004-08-20 2006-03-02 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006269296A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料
JP2007537572A (ja) * 2004-05-12 2007-12-20 マイクログローブ コープ カンパニー リミテッド 異方性導電接続用の絶縁導電性粒子及びその製造方法並びにこれを用いた異方性導電接続材料
WO2008047600A1 (fr) * 2006-10-17 2008-04-24 Hitachi Chemical Company, Ltd. particule revêtue et son procédé de fabrication, composition adhésive conductrice anisotrope utilisant la particule revêtue et film adhésif conducteur anisotrope
JP2009102731A (ja) * 2007-10-02 2009-05-14 Hitachi Chem Co Ltd 導電粒子、その製造方法及び絶縁被覆導電粒子の製造方法、並びに異方導電性接着剤フィルム
JP2009135086A (ja) * 2007-11-01 2009-06-18 Hitachi Chem Co Ltd 導電粒子、絶縁被覆導電粒子及びその製造方法、異方導電性接着剤

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100662176B1 (ko) * 2004-12-30 2006-12-27 제일모직주식회사 이방성 도전 필름용 조성물
JP4936775B2 (ja) * 2005-04-26 2012-05-23 旭化成イーマテリアルズ株式会社 導電粒子の連結構造体
JP2008120990A (ja) 2006-10-17 2008-05-29 Hitachi Chem Co Ltd 異方導電性接着剤組成物、異方導電性フィルム、回路部材の接続構造、及び、被覆粒子の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241489A (ja) * 2003-02-04 2004-08-26 Sekisui Chem Co Ltd 異方導電性光後硬化型ペースト、それを用いた電気部品の接合方法及び電気部品
JP2005187637A (ja) * 2003-12-25 2005-07-14 Sekisui Chem Co Ltd 異方導電性接着剤、液晶表示素子用上下導通材料及び液晶表示素子
JP2007537572A (ja) * 2004-05-12 2007-12-20 マイクログローブ コープ カンパニー リミテッド 異方性導電接続用の絶縁導電性粒子及びその製造方法並びにこれを用いた異方性導電接続材料
JP2006059721A (ja) * 2004-08-20 2006-03-02 Sekisui Chem Co Ltd 導電性微粒子及び異方性導電材料
JP2006269296A (ja) * 2005-03-24 2006-10-05 Sekisui Chem Co Ltd 突起粒子の製造方法、突起粒子、導電性突起粒子及び異方性導電材料
WO2008047600A1 (fr) * 2006-10-17 2008-04-24 Hitachi Chemical Company, Ltd. particule revêtue et son procédé de fabrication, composition adhésive conductrice anisotrope utilisant la particule revêtue et film adhésif conducteur anisotrope
JP2009102731A (ja) * 2007-10-02 2009-05-14 Hitachi Chem Co Ltd 導電粒子、その製造方法及び絶縁被覆導電粒子の製造方法、並びに異方導電性接着剤フィルム
JP2009135086A (ja) * 2007-11-01 2009-06-18 Hitachi Chem Co Ltd 導電粒子、絶縁被覆導電粒子及びその製造方法、異方導電性接着剤

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013004348A (ja) * 2011-06-17 2013-01-07 Sekisui Chem Co Ltd 絶縁性粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2014132567A (ja) * 2012-12-05 2014-07-17 Sekisui Chem Co Ltd 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、導電材料及び接続構造体
JP2014241281A (ja) * 2013-05-14 2014-12-25 積水化学工業株式会社 導電フィルム及び接続構造体
CN111954909A (zh) * 2018-04-04 2020-11-17 积水化学工业株式会社 带有绝缘性粒子的导电性粒子、导电材料以及连接结构体
KR20200140809A (ko) 2018-04-04 2020-12-16 세키스이가가쿠 고교가부시키가이샤 절연성 입자를 갖는 도전성 입자, 도전 재료 및 접속 구조체
JPWO2019194135A1 (ja) * 2018-04-04 2021-02-25 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP7284703B2 (ja) 2018-04-04 2023-05-31 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
KR20210029143A (ko) 2018-07-06 2021-03-15 세키스이가가쿠 고교가부시키가이샤 절연성 입자 구비 도전성 입자, 도전 재료 및 접속 구조체

Also Published As

Publication number Publication date
TWI372779B (zh) 2012-09-21
JP4993230B2 (ja) 2012-08-08
KR101222375B1 (ko) 2013-01-15
CN102549676A (zh) 2012-07-04
CN102549676B (zh) 2013-06-12
TW201122077A (en) 2011-07-01
JP2012094529A (ja) 2012-05-17
KR20120049904A (ko) 2012-05-17
JPWO2011030715A1 (ja) 2013-02-07

Similar Documents

Publication Publication Date Title
JP4993230B2 (ja) 絶縁粒子付き導電性粒子、絶縁粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP6475805B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
TWI394174B (zh) Conductive particles, method for producing conductive particles, anisotropic conductive material, and connecting structure
JP4804596B1 (ja) 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体
JP6165626B2 (ja) 導電性粒子、導電材料及び接続構造体
KR20130122730A (ko) 도전성 입자, 이방성 도전 재료 및 접속 구조체
JP2011060502A (ja) 絶縁粒子付き導電性粒子、異方性導電材料及び接続構造体
JP2012015019A (ja) 絶縁性粒子付き導電性粒子、絶縁性粒子付き導電性粒子の製造方法、異方性導電材料及び接続構造体
JP6165625B2 (ja) 導電性粒子、導電材料及び接続構造体
WO2007099965A1 (ja) 回路接続材料、これを用いた回路部材の接続構造及びその製造方法
JP6431411B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP5484265B2 (ja) 導電性粒子、絶縁粒子付き導電性粒子、異方性導電材料及び接続構造体
JP6151990B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP2014026971A (ja) 導電性粒子、導電材料及び接続構造体
JP6577723B2 (ja) 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
JP2014130809A (ja) 導電性粒子、導電材料及び接続構造体
JP5796232B2 (ja) 導電性粒子、異方性導電材料及び接続構造体
JP7077963B2 (ja) 絶縁被覆導電粒子、異方導電フィルム、異方導電フィルムの製造方法、接続構造体及び接続構造体の製造方法
JP2014026970A (ja) 導電性粒子、導電材料及び接続構造体

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 2010535097

Country of ref document: JP

Ref document number: 201080039953.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10815312

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20127006015

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10815312

Country of ref document: EP

Kind code of ref document: A1