WO2011013714A1 - 発光装置 - Google Patents
発光装置 Download PDFInfo
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- WO2011013714A1 WO2011013714A1 PCT/JP2010/062724 JP2010062724W WO2011013714A1 WO 2011013714 A1 WO2011013714 A1 WO 2011013714A1 JP 2010062724 W JP2010062724 W JP 2010062724W WO 2011013714 A1 WO2011013714 A1 WO 2011013714A1
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- layer
- light emitting
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- emitting device
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/22—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of auxiliary dielectric or reflective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/173—Passive-matrix OLED displays comprising banks or shadow masks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
Definitions
- the present invention relates to a light emitting device.
- An organic electroluminescence element (hereinafter sometimes referred to as an organic EL element) includes a pair of electrodes composed of an anode and a cathode, and a light emitting layer provided between the electrodes. When a voltage is applied to the organic EL element, holes are injected from the anode and electrons are injected from the cathode, and the injected holes and electrons are combined in the light emitting layer to emit light.
- An organic EL element has an advantage that a predetermined layer such as a light emitting layer provided between electrodes can be easily formed by a coating method.
- the light emitting layer can be formed by forming a film of ink containing a material for forming the light emitting layer by a predetermined coating method and further solidifying the ink.
- the nozzle printing method is a method in which ink is continuously applied by moving the nozzle while continuously discharging liquid columnar ink from the nozzle.
- FIG. 4 is a plan view of a pattern coating substrate 1 conventionally used for forming an organic EL element.
- FIG. 5 is a cross-sectional view of the substrate 1 for pattern application as seen from the cutting plane line VV in FIG.
- Organic EL elements are used as light sources for display devices, for example.
- a plurality of organic EL elements are provided on the support substrate 3.
- the support substrate 3 is provided with one electrode 4 of a pair of electrodes of the organic EL element, an insulating film 5 for electrically insulating each organic EL element, and the like.
- a partition wall 2 is provided on the support substrate 3 for storing a coating solution at a predetermined position when an organic EL element is formed by a coating method.
- the partition wall 2 is arranged in a stripe shape in an outer peripheral portion 2a surrounding a region where a plurality of organic EL elements are provided, and in a region surrounded by the outer peripheral portion 2a, and one end and the other end are respectively connected to the outer peripheral portion 2a.
- a plurality of partitions 2b is provided in a stripe shape in an outer peripheral portion 2a surrounding a region where a plurality of organic EL elements are provided, and in a region surrounded by the outer peripheral portion 2a, and one end and the other end are respectively connected to the outer peripheral portion 2a.
- Organic EL elements are arranged in a matrix in the display device. Specifically, it arrange
- a light emitting layer is formed on such a substrate 1 for coating a pattern
- the ink containing the material for forming the light emitting layer is ejected from the nozzle of the nozzle printing apparatus in a liquid column shape, and along the partition 2b.
- the nozzles are scanned to selectively supply ink between the partition portions 2b.
- a light emitting layer is formed by solidifying the supplied ink (see, for example, Patent Document 1).
- FIGS. 6 and 7 are plan views of a conventional pattern coating substrate 1 after ink is supplied by the nozzle printing method, and the ink (electroluminescence layer: EL layer 35) is hatched.
- the ink is supplied by so-called one-stroke writing without stopping the ink discharge, so that the ink is supplied in a region other than the region where the ink is to be supplied.
- the ink is also applied on the outer peripheral portion 2 a of the partition wall 2. Since the ink applied on the outer peripheral portion 2a of the partition wall 2 spreads on the outer peripheral portion 2a, the ink (EL layer 35) applied to adjacent rows may come into contact with each other (see FIG. 7).
- a backflow may occur between the partitions 2b. Then, for example, when the types of ink in adjacent rows are different, a problem of color mixing occurs. Moreover, the light-emitting layers at both ends in the longitudinal direction between the partition portions 2b may be thickened by the backflowed ink.
- an object of the present invention is to prevent ink applied to areas other than the area where the ink is to be supplied from flowing back to the area where the ink is to be supplied and to mix the ink when the ink is selectively supplied by the application method. It is an object of the present invention to provide a light emitting device having a structure that can prevent this.
- the light-emitting device includes a support substrate, a plurality of organic electroluminescence elements provided on the support substrate, and a partition that separates the plurality of organic electroluminescence elements, and the partition includes the plurality of partitions.
- the organic electroluminescence element is arranged in a stripe shape so as to surround a region where the organic electroluminescence element is provided, and one end and the other end in the longitudinal direction are connected to the outer periphery, respectively, in a region surrounded by the outer periphery.
- a plurality of partitions, and the organic electroluminescence element is disposed between the partitions adjacent to each other, and on the extension line in the longitudinal direction of the partition, A dent toward the support substrate is provided.
- the bottom surface of the recess is preferably made of a material having a contact angle with anisole of less than 30 °.
- the organic electroluminescence element has a pair of electrodes
- the light emitting device includes a dummy electrode composed of the same member as one electrode disposed near the support substrate of the pair of electrodes, It may further be provided on the bottom surface of the recess, and the recess may be provided so as to reach the surface of the dummy electrode.
- the one electrode and the dummy electrode can be formed by a coating method.
- the one electrode may be configured by arranging a wire-like conductor having conductivity on a film body exhibiting optical transparency.
- the light-emitting device further includes an insulating film that electrically insulates the plurality of organic electroluminescence elements, and a dummy insulating film formed of the same member as the insulating film.
- the dummy insulating film is provided between the partition wall and the support substrate, the dummy insulating film is provided on a bottom surface of the recess, and the recess can be provided to reach the surface of the dummy insulating film. .
- the ink applied to a region other than the region where the ink is to be supplied is prevented from flowing back to the region where the ink is to be supplied and the ink is mixed. It is possible to provide a light emitting device having a structure capable of preventing this.
- FIG. 1 is a plan view of a light emitting device 11 of the present invention.
- FIG. 2 is an end view of the light emitting device 11.
- FIG. 3 is a plan view of the support substrate 21 in a state where ink is applied.
- FIG. 4 is a plan view of a conventional pattern coating substrate 1 used for forming an organic EL element.
- FIG. 5 is a cross-sectional view of the substrate 1 for pattern application as seen from the cutting plane line VV in FIG.
- FIG. 6 is a plan view of a conventional pattern coating substrate 1 after ink is supplied by the nozzle printing method.
- FIG. 7 is a plan view of a conventional pattern coating substrate 1 after ink is supplied by the nozzle printing method.
- FIG. 8 is a perspective view of the light emitting device 11.
- FIG. 8 is a perspective view of the light emitting device 11.
- FIG. 9 is a perspective view of the light emitting device 11 before the light emitting layer is formed.
- FIG. 10 is a diagram for explaining a contact angle ⁇ of anisole applied on a substrate.
- FIG. 11 is a cross-sectional view of the organic EL element 31.
- FIG. 12 is a cross-sectional view of the organic EL element 31.
- FIG. 13 is a cross-sectional view of the organic EL element 31.
- FIG. 14 is a cross-sectional view of the organic EL element 31.
- FIG. 15 is a partial cross-sectional view of the organic EL element 31.
- FIG. 16 is a partial cross-sectional view of the organic EL element 31.
- FIG. 17 is a partial cross-sectional view of the organic EL element 31.
- FIG. 11 is a cross-sectional view of the organic EL element 31.
- FIG. 12 is a cross-sectional view of the organic EL element 31.
- FIG. 13 is a cross-sectional
- FIG. 18 is a partial cross-sectional view of the organic EL element 31.
- FIG. 19 is a perspective view of a conductive resin electrode.
- FIG. 20 is a perspective view of the light emitting device 11 before the light emitting layer is formed.
- FIG. 21 is a perspective view of the light emitting device 11 using a dummy insulating film.
- FIG. 22 is a perspective view of the light emitting device 11 before forming the light emitting layer using the dummy insulating film.
- FIG. 23 is a perspective view of the light-emitting device 11 using a recess having an opening.
- FIG. 24 is a perspective view of the light-emitting device 11 before forming a light-emitting layer using a recess having an opening.
- the light emitting device of the present invention includes a support substrate 21, a plurality of organic EL elements 31 provided on the support substrate 21, and a partition wall 41 that partitions the plurality of organic EL elements 31.
- the partition wall 41 is disposed in a stripe shape in an outer peripheral portion 42 that is disposed so as to surround the region where the plurality of organic EL elements are provided, and one end and the other end are respectively disposed on the outer peripheral portion 42. It has the several partition part 43 connected.
- the organic EL element is disposed between the partition portions 43 adjacent to each other. Then, on the extended line in the longitudinal direction Y of the partition part (stripe part) 43 of the outer peripheral part 42, that is, at one end and the other end of the partition part 43, recesses 44 directed toward the support substrate 21 are respectively provided.
- FIG. 1 is a plan view of a light emitting device 11 according to the present invention
- FIG. 2 is an end view of the light emitting device 11.
- 2A shows an end portion of the light-emitting device 11 when the light-emitting device 11 shown in FIG. 1 is cut along a plane perpendicular to the row direction X (cross section taken along line II (A) -II (A) in FIG. 1).
- 2B is an enlarged view of FIG. 2B, and FIG. 2B is an end surface obtained by cutting the light emitting device 11 shown in FIG.
- FIG. 8 is a perspective view of the light emitting device partially disassembled from the light emitting device shown in FIG. 1, and FIG. 9 shows a state before the electroluminescence layer (EL layer) 35 is formed in the light emitting device shown in FIG. It is a perspective view of the light-emitting device.
- EL layer electroluminescence layer
- an active matrix drive type display device will be described as an example of the light emitting device 11 on which a plurality of organic EL elements are mounted.
- the present invention is not limited to the active matrix driving method, and can be applied to, for example, a passive matrix driving method display device, and can also be applied to a predetermined light emitting device other than these display devices.
- a plurality of organic EL elements 31 are provided in a matrix on the support substrate 21. Specifically, the plurality of organic EL elements 31 are arranged at regular intervals in the row direction X on the support substrate 21 and discretely arranged at regular intervals in the column direction Y. The row direction X and the column direction Y are directions perpendicular to each other and perpendicular to the thickness direction Z of the support substrate 21.
- innumerable organic EL elements are provided in a normal display device, but FIG. 1 shows a light emitting device in which 20 organic EL elements are arranged in a matrix of 4 rows and 4 columns for easy understanding. Yes.
- FIG. 2 shows only one of the pair of electrodes with respect to the organic EL element, and the other configuration is not shown.
- the organic EL element 31 is not shown except for one electrode 32.
- the other electrode 33 is provided on the light emitting layer of the organic EL element 31 so as to cover almost the entire surface of the substrate.
- a partition wall 41 is further provided on the support substrate 21 to separate the organic EL element 31.
- the partition wall 41 includes an outer peripheral portion 42 disposed so as to surround a region where the plurality of organic EL elements 31 are provided, and a plurality of partition portions 43 disposed in a stripe shape in the region surrounded by the outer peripheral portion 42. is doing.
- the partition portion 43 is connected to the outer peripheral portion 42 at one end and the other end in the longitudinal direction.
- the outer peripheral part 42 and the partition part 43 are integrally formed.
- the outer peripheral portion 42 of the partition wall 41 constitutes a substantially rectangular frame.
- the outer peripheral portion 42 only needs to have a shape surrounding a region where the plurality of organic EL elements 31 are provided, and may not be a substantially rectangular frame.
- the plurality of partition portions 43 are arranged with their longitudinal directions aligned with the column direction Y, and are arranged with equal intervals in the row direction X, respectively.
- the longitudinal direction of the partition part 43 and the row direction Y coincide, the longitudinal direction of the partition part 43 may be referred to as the row direction Y below.
- This partition part 43 is provided in order to partition each organic EL element 31.
- Each organic EL element 31 is provided between the partition parts 43 adjacent to each other.
- the recess comprised by the partition part 43 provided in the end of the row direction X and the outer peripheral part 42, and the recess comprised by the partition part 43 provided in the other end of the row direction X, and the outer peripheral part 42 In this specification, it is included between the partition parts 43.
- the organic EL elements 31 are arranged at equal intervals along the column direction Y between the partition portions 43.
- a dent 44 toward the support substrate is provided.
- the organic EL element 31 has a pair of electrodes, and the light emitting device 11 is configured by the same member as the one electrode 32 disposed near the support substrate 21 of the pair of electrodes 32. It is preferable that the dummy electrode 45 is further provided on the bottom surface of the recess 44, and the recess 44 is provided so as to reach the surface of the dummy electrode 45. It should be noted that a step toward the support substrate 21 may be formed at one end and the other end of the outer peripheral portion 42 in the column direction Y (partition portion longitudinal direction), and the recess 44 is not formed until the dummy electrode 45 is reached. Also good.
- the recess 44 may be formed until reaching the support substrate 21.
- the dummy electrodes 45 are provided so as to continue in the row direction X in FIG. 1, the dummy electrodes 45 may be provided discretely in the row direction X in the same manner as the one electrode 32.
- the dummy electrode 45 is not limited to the same member as the one electrode 32, and may be formed of a member having lyophilicity.
- the dummy electrode 45 may be formed of the same member as an insulating film described later.
- FIG. 10 is a diagram showing a state of contact between the anisole AN contained in the ink and the bottom when the dummy electrode 45 is used as the bottom of the recess 44.
- the bottom of the recess 44 preferably has a contact angle ⁇ with respect to anisole of less than 30 °.
- the bottom of the recess 44 corresponds to the surface of the dummy electrode 45.
- the main component of the solvent that dissolves the ink material forming the EL layer (organic layer) 35 is anisole, and the wettability of the contact surface of the anisole can be quantified using the contact angle ⁇ .
- the contact angle ⁇ is an angle formed by a tangent along the outer surface of the anisole at the contact position between the electrode surface and the outermost portion of the anisole.
- one electrode 32 of the pair of electrodes exhibiting conductivity is usually more lyophilic than the partition wall, when the dummy electrode 45 is formed of the same member as such a member, the lyophilic property is exhibited.
- the dummy electrode 45 can be manufactured in the same process as the one electrode 32. Therefore, the dummy electrode 45 exhibiting lyophilicity can be manufactured without increasing the number of steps compared to the number of steps for forming a light emitting device without a dummy electrode.
- the organic EL element includes a pair of electrodes and a light emitting layer provided between the electrodes.
- One electrode 32 disposed on the support substrate 21 side of the pair of electrodes is provided for each organic EL element, and is equally spaced in the row direction X and equally spaced in the column direction Y on the support substrate 21. Each is arranged discretely.
- one electrode 32 has a plate shape and is substantially rectangular in plan view.
- an insulating film 24 having electrical insulation is provided as necessary.
- the insulating film 24 has openings 28 through which the surface of one electrode 32 is exposed.
- the insulating film 24 covers the peripheral edge of one electrode 32 and is continuously formed between the one electrode 32, and is provided in a lattice shape.
- Organic EL elements that emit light independently of each other as so-called pixels are formed in regions where the openings 28 are formed.
- the organic EL elements 31 are electrically insulated from each other by the insulating film 24.
- the partition portion 43 constituting the above-described partition wall 41 is provided on the insulating film 24 in contact with the insulating film 24 formed in a lattice shape.
- the organic EL element 31 is provided with a predetermined organic layer or inorganic layer as necessary in addition to the light emitting layer between the pair of electrodes.
- the organic layer and the inorganic layer including these light emitting layers are provided between the respective partition portions 43 and are arranged as a continuous layer across a plurality of organic EL elements arranged at equal intervals along the column direction Y.
- At least one of the organic layer and the inorganic layer provided between the pair of electrodes is formed by a nozzle printing method described later.
- the other electrode of the pair of electrodes is formed so as to continue from one side in the thickness direction Z of the support substrate to the entire organic EL element. That is, the other electrode is provided as a common electrode.
- the support substrate 21 is prepared. Next, one electrode 32 disposed on the support substrate 21 side of the pair of electrodes constituting the organic EL element 31 is patterned.
- One electrode 32 is preferably formed by a coating method because of the simplicity of the process. For example, it is preferable to form a conductive resin electrode, which will be described later, in which a conductive wire-like conductor is arranged on a film body exhibiting light transmittance. Details of the electrodes formed by the coating method will be described later.
- a dummy electrode 45 made of the same member as the one electrode 32. Since the dummy electrode 45 is formed of the same member as the one electrode 32 in this way, the dummy electrode 45 can be formed in the same process as the one electrode 32, so that the dummy electrode can be formed without increasing the number of processes. 45 can be formed.
- a conductive film made of an electrode material described later is formed on the entire surface of the support substrate 21 by, for example, a sputtering method or a vapor deposition method instead of the coating method, and the conductive film is patterned by photolithography to form the matrix electrode 32.
- one electrode may be patterned on a predetermined base and transferred onto the support substrate.
- the insulating film 24 is made of an inorganic material or an organic material. Examples of the inorganic material constituting the insulating film 24 include SiO 2 and SiN.
- the insulating film 24 is formed by depositing an inorganic insulator on the entire surface of the substrate by a known method such as plasma CVD or sputtering, and patterning a thin film made of the deposited inorganic substance into a predetermined shape by photolithography. .
- the opening 28 described above is drilled when patterning.
- the width in the row direction X and the width in the column direction Y of the openings 28 are appropriately set according to the design such as resolution.
- the width in the row direction X is usually 30 ⁇ m to 200 ⁇ m
- the width in the column direction Y is usually 100 ⁇ m to 500 ⁇ m. It is.
- the insulating film 24 made of an organic material may be formed using an acrylic resin-based, novolak resin-based, and / or polyimide resin-based positive or negative photosensitive material (photoresist).
- photoresist a photoresist on the substrate, irradiating a predetermined region with light through a predetermined mask, and developing. The opening 28 described above is drilled when patterning.
- a spin coater, a bar coater, a roll coater, a die coater, a gravure coater, a slit coater The method using such as can be mentioned.
- a lattice-like insulating film 24 is formed when viewed from one side in the thickness direction of the support substrate 21.
- the insulating film 24 is provided for insulation between the organic EL elements 31.
- the film thickness of the insulating film 24 is set to a thickness that can ensure insulation between the organic EL elements 31, and is usually 0.1 ⁇ m to 1 ⁇ m, preferably 0.2 ⁇ m to 0.4 ⁇ m. Further, the insulating film 24 may not be provided depending on the electric resistance of the organic material described later.
- the partition wall 41 is formed.
- the partition wall 41 having the outer peripheral portion 42 and the partition portion 43 is formed by applying the above-described photoresist on the entire surface, irradiating a predetermined region with light through a predetermined mask, and further developing.
- a plurality of openings extending in the column direction Y are formed in the photoresist layer, and one end of the column direction Y is left from both ends of the plurality of openings while leaving a predetermined width.
- the outer peripheral part 42 and the partition part 43 are formed by removing the other. In this development, the surface of the dummy electrode 45 is exposed.
- the photoresist can be applied by a method using a spin coater, bar coater, roll coater, die coater, gravure coater, slit coater or the like.
- the partition portion 43 of the partition wall 41 is provided to insulate the organic EL elements 31 adjacent in the row direction X through the partition portion 43 and prevent color mixture between pixels adjacent in the row direction X. That is, when ink is supplied to the recess defined by the space between the partition portions 43, the partition portion 43 is provided to prevent the ink from overflowing into the recesses adjacent to each other in the row direction X beyond the partition portion 43. ing.
- the height of the partition wall 41 is set from such a viewpoint, and is usually 0.5 ⁇ m to 1.5 ⁇ m, preferably 0.5 ⁇ m to 1.0 ⁇ m.
- the width of the partition portion 43 in the row direction X is appropriately set depending on the design such as resolution, and is 2 ⁇ m to 50 ⁇ m, preferably 5 ⁇ m to 20 ⁇ m.
- the interval between the adjacent partition portions 43 is appropriately set depending on the design such as resolution, and is usually 40 ⁇ m to 220 ⁇ m.
- the partition walls 41 exhibit liquid repellency. Since the surface of the organic substance is fluorinated and lyophobic by performing plasma treatment in an atmosphere containing fluorine, the partition wall 41 can be lyophobic by plasma treatment in an atmosphere containing fluorine after the partition wall 41 is formed. For example, the surface of the partition wall 41 can be made liquid repellent by performing CF 4 plasma treatment. Note that the partition wall 41 may be provided with liquid repellency by a method different from the above-described method. For example, the partition wall 41 may be formed using a material in which a material exhibiting liquid repellency is mixed.
- the insulating film 24 is formed of an organic material, the insulating film 24 is also lyophobic simultaneously by performing plasma treatment in a fluorine-containing atmosphere.
- the organic EL element has various layer configurations.
- an organic EL element having a configuration in which only a light emitting layer is provided between a pair of electrodes will be described.
- a method for forming a light emitting layer by a coating method using a nozzle printing apparatus will be described.
- a commercially available nozzle printing apparatus can be used, for example, NP-300G manufactured by Dainippon Screen Mfg. Co., Ltd. can be used.
- ink containing a material for forming a light emitting layer is supplied between the partition portions 43.
- the ink includes a light emitting material and a solvent described later.
- Ink is supplied between the partition portions 43 by moving the nozzle arranged above the partition portions 43 to one side in the longitudinal direction in a state where the liquid columnar ink is ejected from the nozzles of the nozzle printing apparatus.
- ink is applied by so-called one-stroke writing. That is, while discharging the liquid column-like ink from the nozzles, the following steps (1) to (4) are repeated in this order as scanning of the nozzles, whereby the inks can be sequentially supplied between the partition portions 43.
- the nozzle disposed above the partition 43 is moved from one side in the column direction Y to the other side (down in FIG. 1), and (2) next to one side in the row direction X (right side in FIG. 1).
- the nozzle is moved upward between the adjacent partition portions 43, and (3) the nozzle disposed further upward between the partition portions 43 is moved from the other in the column direction Y to one side (up in FIG. 1), (4 )
- the nozzle is moved upward between the partition portions 43 adjacent to each other in the row direction X (right in FIG. 1).
- FIG. 3 is a plan view of the support substrate 21 in a state where ink (EL layer 35) is applied, and the ink is hatched.
- the ink is continuously applied without stopping the ink discharge, so that the ink is applied beyond the outer peripheral portion 42 of the partition wall 41. That is, the ink is applied to the region other than between the partition portions 43.
- the ink (EL layer 35) is supplied to a region between a pair of coating lines TL parallel to the Y direction, and the width w of the coating line TL is equal to the width in the X direction of the slit, which is a partition opening region between the partition portions 43. equal.
- the ink applied beyond the outer peripheral portion 42 of the partition wall 41 is the recess 44.
- this outer peripheral part 42 functions as a partition which isolates between the partition parts 43 and the dent 44. Accordingly, it is possible to prevent the ink applied beyond the outer peripheral portion 42 of the partition wall 41 from flowing back between the partition portions 43.
- the dummy electrode 45 is formed of the same member as the one electrode 32.
- the material constituting one electrode 32 is usually lyophilic and has a contact angle with anisole of less than 30 °.
- the dummy electrode 45 exhibiting such lyophilicity is exposed and provided. Accordingly, the ink applied beyond the outer peripheral portion 42 of the partition wall 41 spreads on the dummy electrode 45, and the ink once applied on the dummy electrode 45 is secured on the dummy electrode 45. It is possible to efficiently prevent the ink applied beyond the outer peripheral portion 42 from flowing back between the partition portions 43.
- the thickness of the coating film formed by being supplied between the partition portions 43 and formed by coating. can be made uniform over the column direction Y.
- the width L in the column direction Y of the outer peripheral portion where the one end and the other end of the partition portion 43 are connected to each other is wide, the ink spreads on the outer peripheral portion, and as a result, the ink applied on the outer peripheral portion It will flow backward between the partition parts 43. Therefore, in order to prevent wetting and spreading of the ink on the outer peripheral portion, the width L in the column direction Y of the outer peripheral portion to which one end and the other end of the partition portion 43 are respectively connected is preferably 200 ⁇ m or less, more preferably 100 ⁇ m or less.
- a display panel for a monochrome display device In the case of a display panel for a monochrome display device, the problem of color mixing does not occur. However, for example, in the case of a display panel for a color display device, color mixing becomes a serious problem.
- three types of ink each including an R light emitting material emitting red light, a G light emitting material emitting green light, and a B light emitting material emitting blue light are applied to each column. It is necessary to divide.
- the ink containing the R light-emitting material, the ink containing the G light-emitting material, and the ink containing the B light-emitting material are applied between the partition portions 43 with an interval of two rows, respectively, so that the three types of ink are applied separately. ing.
- each type of ink is applied between the partition portions 43 with a two-stroke interval, as described above.
- the three types of ink applied on the outer peripheral portion 42 mix on the outer peripheral portion 42, and the mixed ink flows back between the partition portions 43, thereby mixing colors.
- the outer peripheral portion 42 functions as a partition by providing the dent 44 in this embodiment. Therefore, the mixed ink can be prevented from flowing back between the partition portions 43, so that the problem of color mixing can be prevented.
- the dummy electrodes 45 are provided so as to be continuous in the row direction X in FIG. 1, as shown in FIG. 20, the plurality of dummy electrodes 45 are discretely arranged along the row direction X as in the case of one electrode 32. When provided, ink is held on the dummy electrode 45 exhibiting lyophilicity. Note that FIG. 20 shows a state before the light emitting layer is formed so that the internal structure of the light emitting device 11 can be easily understood.
- the dummy electrode 45 is provided on the surface of the support substrate 21. In this example, the dummy electrode 45 is provided for each opening region of the partition wall 41.
- the light emitting device of FIG. 20 is the same as the above light emitting device except that the plurality of dummy electrodes 45 are separated.
- the light emitting layer can be formed by heating at a predetermined temperature for a predetermined time in an atmosphere such as an air atmosphere, an inert gas atmosphere, and a vacuum atmosphere.
- the other electrode is formed.
- the other electrode is formed so as to continue from one side in the thickness direction Z of the support substrate to all organic EL elements, for example, by an evaporation method and / or a sputtering method using an electrode material described later.
- FIG. 11 is a longitudinal sectional view of a single organic EL element 31.
- the organic EL element 31 includes a lower electrode 32 formed on the support substrate 21, a light emitting layer 34 (EL layer 35) formed on the lower electrode 32, and an upper electrode 32 formed on the EL layer 35. I have.
- a bias voltage is applied between the lower electrode 32 and the upper electrode 33, electrons and holes are injected from the respective electrodes into the EL layer 35, and the injected electrons and holes are combined in the light emitting layer 34.
- the light emitting layer 34 emits light, and light is emitted in the thickness direction of the substrate 21. If at least one of the electrodes 32 and 33 is made of a transparent electrode, the emitted light is transmitted through the transparent electrode and output to the outside. When the lower electrode 32 and the support substrate 21 are transparent, the light from the light emitting layer 34 passes through these and is output to the outside.
- a predetermined layer different from the light emitting layer 34 can be provided between the pair of electrodes. If these predetermined layers can be formed using a coating method, they may be formed by the above-described nozzle printing method using an ink containing a material for forming the predetermined layer, similarly to the light-emitting layer 34. Is preferred. Since the predetermined layer and the light emitting layer 34 contribute to light emission as a whole, the EL layer 35 is formed.
- the lower electrode 32 is an anode
- the upper electrode 33 is a cathode.
- FIG. 12 is a longitudinal sectional view of the organic EL element 31, in which a layer X is interposed between the upper electrode 33 and the light emitting layer 34, and a layer Y is interposed between the lower electrode 32 and the light emitting layer 34. Is intervening.
- Each of the layer X and the layer Y includes one type or a plurality of types of layers.
- examples of the layer X provided between the cathode (electrode 33) and the light emitting layer 34 include an electron injection layer, an electron transport layer, and a hole blocking layer.
- the layer X consists of a single layer, this is an electron transport layer.
- FIG. 13 is a longitudinal sectional view of the organic EL element 31, in which the upper electrode 33 and the light emitting layer 34 are in direct contact, and the layer Y is interposed between the lower electrode 32 and the light emitting layer 34. Yes.
- the layer Y is composed of one or more types of layers and is in contact with both the lower electrode 32 and the light emitting layer 34.
- FIG. 14 is a longitudinal sectional view of the organic EL element 31, in which the lower electrode 32 and the light emitting layer 34 are in direct contact, and the layer X is interposed between the upper electrode 33 and the light emitting layer 34. Yes.
- the layer X includes one or more types of layers and is in contact with both the upper electrode 33 and the light emitting layer 34.
- FIG. 15 is a longitudinal sectional view of the organic EL element 31 and shows an example in which two layers X1 and X2 are interposed between the upper electrode 33 and the light emitting layer. That is, when both the electron injection layer X1 and the electron transport layer X2 are provided between the cathode (electrode 33) and the light emitting layer 34, the layer in contact with the cathode (electrode 33) is referred to as the electron injection layer X1, The layer excluding the electron injection layer X1 is referred to as an electron transport layer X2.
- the electron injection layer X1 is a layer having a function of improving the efficiency of electron injection from the cathode.
- the electron transport layer X2 is a layer having a function of improving electron injection from the cathode, the electron injection layer, or the electron transport layer closer to the cathode.
- the hole blocking layer is a layer having a function of blocking hole transport. In the case where the electron injection layer and / or the electron transport layer have a function of blocking hole transport, these layers may also serve as the hole blocking layer.
- the hole blocking layer has a function of blocking hole transport makes it possible, for example, to produce an element that allows only hole current to flow, and confirm the blocking effect by reducing the current value.
- FIG. 16 is a longitudinal sectional view of the organic EL element 31 and shows an example in which two layers Y1 and Y2 are interposed between the lower electrode 32 and the light emitting layer. That is, examples of the layer Y provided between the anode (electrode 32) and the light emitting layer 34 include a hole injection layer, a hole transport layer, and an electron block layer. When only one layer is provided between the anode (electrode 32) and the light emitting layer 34, the layer is referred to as a hole injection layer.
- the layer in contact with the anode (electrode 32) is the hole injection layer Y1.
- the layer excluding this hole injection layer Y1 is called a hole transport layer Y2.
- the hole injection layer Y1 is a layer having a function of improving the hole injection efficiency from the anode (electrode 32).
- the hole transport layer Y2 is a layer having a function of improving hole injection from the anode (electrode 32), the hole injection layer Y1, or the hole transport layer closer to the anode.
- the electron blocking layer is a layer having a function of blocking electron transport. In the case where the hole injection layer and / or the hole transport layer has a function of blocking electron transport, these layers may also serve as an electron blocking layer.
- the electron blocking layer has a function of blocking electron transport makes it possible, for example, to produce an element that allows only electron current to flow, and confirm the blocking effect by reducing the current value.
- the electron injection layer and the hole injection layer may be collectively referred to as a charge injection layer, and the electron transport layer and the hole transport layer may be collectively referred to as a charge transport layer.
- An example of the layer structure that the organic EL element can take is shown below.
- Anode / hole injection layer / light emitting layer / electron transport layer / cathode (configuration in which layer Y is a hole injection layer and layer X is an electron transport layer in FIG. 12) f) Anode / hole injection layer / light-emitting layer / electron transport layer / electron injection layer / cathode: (In FIG. 12, the structure of FIG. 16 is adopted as the layer Y with the layer X as the hole injection layer) d) Anode / hole transport layer / light-emitting layer / cathode: (configuration in which layer Y is a hole transport layer in FIG.
- Anode / hole transport layer / light emitting layer / electron injection layer / cathode (configuration in which layer Y is a hole transport layer and layer Y is an electron injection layer in FIG. 12)
- Anode / hole transport layer / light emitting layer / electron transport layer / cathode (configuration in which layer Y is a hole transport layer and layer X is an electron transport layer in FIG. 12)
- Anode / hole injection layer / hole transport layer / light emitting layer / cathode (configuration in which layer Y in FIG. 13 has the structure of hole injection layer Y1 / hole transport layer Y2 shown in FIG. 16) i) Anode / hole injection layer / hole transport layer / light emitting layer / electron injection layer / cathode: (in FIG. 12, layer Y has the structure of hole injection layer Y1 / hole transport layer Y2 shown in FIG. 16, layer X is an electron injection layer) j) Anode / hole injection layer / hole transport layer / light emitting layer / electron transport layer / cathode: (in FIG.
- layer Y has the structure of hole injection layer Y1 / hole transport layer Y2 shown in FIG. 16, layer X is an electron transport layer)
- Anode / light-emitting layer / electron injection layer / cathode: (configuration in which layer X is an electron injection layer in FIG.
- Anode / light-emitting layer / electron transport layer / cathode (configuration in which layer X is an electron transport layer in FIG. 14) n) Anode / light-emitting layer / electron transport layer / electron injection layer / cathode: (in FIG. 14, layer X has the structure of electron transport layer X2 / electron injection layer X1 shown in FIG. 15)
- the symbol “/” indicates that the layers sandwiching the symbol “/” are stacked adjacent to each other. same as below.
- the organic EL device of the present embodiment may have two or more light emitting layers, and the organic EL device having two light emitting layers is any one of the layer configurations of a) to n) above.
- the organic EL device having two light emitting layers is any one of the layer configurations of a) to n) above.
- the layer configuration shown in the following o) can be obtained.
- a plurality of stacked bodies A are interposed between the electrodes 32 and 32, and a charge injection layer Z is interposed between the stacked bodies A.
- (repeating unit B) x represents a laminate in which the repeating unit B is laminated in x stages.
- the stacked body B (repeating unit B) is interposed between the electrodes 32 and 32 by a number x, and adjacent to the outermost one of the stacked bodies B, the stacked body A is positioned, and the electrode 32 is adjacent to the laminate A.
- the charge injection layer (Z) is a layer that generates holes and electrons by applying an electric field.
- the charge injection layer include a thin film made of vanadium oxide, indium tin oxide (IndiumInTin Oxide: abbreviation ITO), molybdenum oxide, or the like.
- an anode is usually arranged on the substrate side, but a cathode may be arranged on the substrate side.
- the order of the layers to be laminated, the number of layers, and the thickness of each layer can be appropriately set in consideration of the light emission efficiency and the element lifetime.
- ⁇ Support substrate> As the support substrate, one that does not change in the process of manufacturing the organic EL element is preferably used. For example, glass, plastic, a polymer film, a silicon substrate, and a laminate of these are used. A drive substrate on which a circuit for driving the organic EL element is formed may be used as the support substrate. For example, a TFT (Thin Film Transistor) substrate may be provided as the support substrate.
- TFT Thin Film Transistor
- Electrode 32 In the case of an organic EL element having a configuration in which light emitted from the light emitting layer (34) is emitted outside the element through the anode (electrode 32), an electrode having optical transparency is used for the anode, thereby exhibiting optical transparency.
- a thin film hereinafter sometimes referred to as a “conductive resin electrode” configured by arranging a conductive wire-like conductor on the film body can be used as an electrode.
- FIG. 19 is a perspective view of the lower electrode 32 (or the upper electrode 33) made of a conductive resin electrode.
- a conductive resin electrode can be formed by, for example, a coating method.
- the film body M one having a high light transmittance in the visible light region is preferably used, and is configured to include a resin, an inorganic polymer, an inorganic-organic hybrid compound, or the like.
- a resin having conductivity is preferably used.
- the electrical resistance can be lowered by using the conductive film body M.
- the film thickness of the electrode is appropriately set depending on the electrical resistance and the visible light transmittance, and is, for example, 0.02 to 2 ⁇ m, preferably 0.02 to 1 ⁇ m.
- the diameter of the wire-like conductor W is preferably smaller, for example, 400 nm or less, preferably 200 nm or less, and more preferably 100 nm or less.
- the wire-like conductor arranged in the film body diffracts or scatters the light passing through the electrode, so that the haze value (HazeHFactor) is increased and the light transmittance is decreased, but the wavelength of visible light or
- the wire-like conductor W having a diameter smaller than the wavelength of visible light the haze value with respect to visible light can be suppressed to a low level and the decrease in light transmittance can be suppressed.
- the diameter is preferably 10 nm or more.
- One or a plurality of wire-like conductors W arranged in the film main body M may be used, and a network structure is preferably formed in the film main body.
- a network structure is preferably formed in the film main body.
- the volume resistivity of the conductive resin electrode (electrode 32) can be lowered by the wire-like conductor W forming the network structure.
- the wire-like conductor W may be, for example, a curved shape or a needle shape.
- An electrode having a low volume resistivity can be realized by forming a network structure by contacting curved and / or needle-shaped conductors with each other.
- wire conductor W As the material of the wire-like conductor W, a metal having low resistance is preferably used, and examples thereof include Ag, Au, Cu, Al, and alloys thereof.
- the wire-like conductor W can be obtained by, for example, a method by NRJana, L. Gearheart and CJMurphy (Chm. Commun., 2001, p617-p618), C. Ducamp-Sanguesa, R. Herrera-Urbina, and M. Figlarz, etc. It can be produced by the method (J. Solid State Chem., Vol. 100, 1992, p272-p280).
- wire-like conductor W for example, a silver nanoparticle whose surface is protected with an amino group-containing polymer dispersant (manufactured by IC Japan, trade name “Solsperse 24000SC”).
- a wire (major axis average length 1 ⁇ m, minor axis average length 10 nm) can be used.
- the type of resin is appropriately selected according to the characteristics required for the electrode, such as refractive index, light transmittance, and electrical resistance.
- the amount of the wire-like conductor W dispersed is affected by the electrical resistance, haze value, translucency, etc. of the electrode, and therefore is appropriately set according to the characteristics required for the conductive resin electrode.
- the conductive resin electrode is obtained by coating a film of a dispersion in which a conductive wire-like conductor W is dispersed in a dispersion medium by a predetermined coating method, and further curing the film.
- the dispersion is prepared by dispersing wire-like conductor W and resin in a dispersion medium.
- the dispersion medium may be any material that can dissolve or disperse the resin, for example, a chlorine solvent such as chloroform, methylene chloride, dichloroethane, an ether solvent such as tetrahydrofuran, an aromatic hydrocarbon solvent such as toluene and xylene, Examples include ketone solvents such as acetone and methyl ethyl ketone, and ester solvents such as ethyl acetate, butyl acetate, and ethyl cellosolve acetate.
- the resin examples include low density or high density polyethylene, ethylene-propylene copolymer, ethylene-butene copolymer, ethylene-hexene copolymer, ethylene-octene copolymer, ethylene-norbornene copolymer, Polyolefin resins such as ethylene-dimethano-octahydronaphthalene copolymer, polypropylene, ethylene-vinyl acetate copolymer, ethylene-methyl methacrylate copolymer, ionomer resin; polyesters such as polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate Nylon-6, nylon-6,6, metaxylenediamine-adipic acid condensation polymer; amide resin such as polymethylmethacrylamide; acrylic resin such as polymethylmethacrylate; Styrene-acrylonitrile resins such as Tylene, styrene-acrylonitrile copolymer, sty
- a resin having conductivity is preferably used, and examples of the resin having conductivity include polyaniline and polythiophene derivatives.
- a poly (ethylenedioxythiophene) / polystyrene sulfonic acid solution having a refractive index of 1.7 (trade name “BaytronP” manufactured by Starck Co., Ltd.) can be used.
- the refractive index of the conductive resin electrode is mainly determined by the refractive index of the film body made of resin or the like.
- the refractive index of the film body is mainly determined by the type of resin to be used. Therefore, a conductive resin electrode having an intended refractive index can be easily formed by selecting the resin to be used.
- the difference in refractive index between the one electrode and the support substrate is preferably smaller.
- the absolute value of the difference is preferably less than 0.4. 1.8 or less is preferable. Since the refractive index of the conductive resin electrode can be set to a desired value by appropriately selecting the type of resin used for the film body, the relationship of the refractive index with the support substrate is set within the above range. be able to.
- a dispersion liquid in which a wire-like conductor is dispersed in a photosensitive material and a photocurable monomer used for a photosensitive photoresist an electrode having a predetermined pattern shape can be easily formed by a coating method and photolithography.
- a dispersion liquid in which a wire-like conductor is dispersed in a photosensitive material and a photocurable monomer used for a photosensitive photoresist an electrode having a predetermined pattern shape can be easily formed by a coating method and photolithography. can do.
- trimethylolpropane triacrylate manufactured by Shin-Nakamura Chemical Co., Ltd., trade name “NK Ester-TMPT”
- polymerization initiator trade name “IRGACURE 907” produced by Nippon Ciba-Geigy Inc.
- a dipping method As a method for applying a dispersion in which a wire-like conductor is dispersed, a dipping method, a coating method using a bar coater, a coating method using a spin coater, a doctor blade method, a spray coating method, a screen mesh printing method, Examples include brushing, spraying, roll coating, and the like.
- a coating film when using a thermosetting resin or a photocurable resin, after apply
- ITO is used for the electrode showing light transmittance.
- the refractive index of ITO is about 2, the refractive index of the glass substrate is about 1.5, and the refractive index of the portion in contact with ITO (for example, the light emitting layer) is about 1.7.
- an ITO having a high refractive index is sandwiched between a glass substrate having a low refractive index and the light emitting layer. Therefore, a part of the light emitted from the light emitting layer is reflected by the ITO by total reflection or the like, and the light may not be efficiently emitted to the outside.
- a conductive resin electrode having a low refractive index as described above, reflection at the electrode can be suppressed, and light can be efficiently emitted to the outside.
- a thin film of metal oxide, metal sulfide, metal or the like having high electrical conductivity can be used as the anode.
- a thin film made of indium oxide, zinc oxide, tin oxide, ITO, indium zinc oxide (Indium Zinc Oxide: abbreviation IZO), gold, platinum, silver, copper, or the like is used.
- ITO Indium Zinc Oxide
- a thin film made of IZO or tin oxide is preferably used.
- Examples of a method for producing the anode include a vacuum deposition method, a sputtering method, an ion plating method, and a plating method.
- an organic transparent conductive film such as polyaniline or a derivative thereof, polythiophene or a derivative thereof may be used as the anode.
- a material that reflects light may be used for the anode, and the material is preferably a metal, metal oxide, or metal sulfide having a work function of 3.0 eV or more.
- the film thickness of the anode can be appropriately selected in consideration of light transmittance and electric conductivity, and is, for example, 10 nm to 10 ⁇ m, preferably 20 nm to 1 ⁇ m, and more preferably 50 nm to 500 nm. .
- ⁇ Hole injection layer As the hole injection material constituting the hole injection layer, oxides such as vanadium oxide, molybdenum oxide, ruthenium oxide, and aluminum oxide, phenylamine type, starburst type amine type, phthalocyanine type, amorphous carbon, polyaniline, And polythiophene derivatives.
- oxides such as vanadium oxide, molybdenum oxide, ruthenium oxide, and aluminum oxide, phenylamine type, starburst type amine type, phthalocyanine type, amorphous carbon, polyaniline, And polythiophene derivatives.
- Examples of the method for forming the hole injection layer include film formation from a solution containing a hole injection material.
- the solvent used for film formation from a solution is not particularly limited as long as it dissolves the hole injection material.
- Chlorine solvents such as chloroform, methylene chloride, dichloroethane, ether solvents such as tetrahydrofuran, toluene, xylene And aromatic hydrocarbon solvents such as acetone, ketone solvents such as acetone and methyl ethyl ketone, ester solvents such as ethyl acetate, butyl acetate and ethyl cellosolve acetate, and water.
- a film forming method from a solution As a film forming method from a solution, a nozzle printing method, a spin coating method, a casting method, a micro gravure coating method, a gravure coating method, a bar coating method, a roll coating method, a wire bar coating method, a dip coating method, a spray coating method, Application methods such as a screen printing method, a flexographic printing method, an offset printing method, and an ink jet printing method can be given, and the nozzle printing method described above is preferably used in this embodiment.
- the film thickness of the hole injection layer is appropriately set based on the element design, and is, for example, 1 nm to 1 ⁇ m, preferably 2 nm to 500 nm, and more preferably 5 nm to 200 nm.
- ⁇ Hole transport layer> As the hole transport material constituting the hole transport layer, polyvinylcarbazole or a derivative thereof, polysilane or a derivative thereof, a polysiloxane derivative having an aromatic amine in a side chain or a main chain, a pyrazoline derivative, an arylamine derivative, a stilbene derivative, Triphenyldiamine derivative, polyaniline or derivative thereof, polythiophene or derivative thereof, polyarylamine or derivative thereof, polypyrrole or derivative thereof, poly (p-phenylene vinylene) or derivative thereof, or poly (2,5-thienylene vinylene) or Examples thereof include derivatives thereof.
- hole transport materials include polyvinyl carbazole or derivatives thereof, polysilane or derivatives thereof, polysiloxane derivatives having aromatic amine compound groups in the side chain or main chain, polyaniline or derivatives thereof, polythiophene or derivatives thereof, poly Preferred is a polymeric hole transport material such as arylamine or a derivative thereof, poly (p-phenylene vinylene) or a derivative thereof, or poly (2,5-thienylene vinylene) or a derivative thereof, more preferably polyvinyl carbazole or a derivative thereof. , Polysilane or a derivative thereof, and a polysiloxane derivative having an aromatic amine in the side chain or main chain. In the case of a low-molecular hole transport material, it is preferably used by being dispersed in a polymer binder.
- the method for forming the hole transport layer is not particularly limited, but in the case of a low molecular hole transport material, film formation from a mixed solution containing a polymer binder and a hole transport material can be exemplified.
- molecular hole transport materials include film formation from a solution containing a hole transport material.
- the solvent used for film formation from a solution is not particularly limited as long as it can dissolve a hole transport material.
- Chlorine solvents such as chloroform, methylene chloride, dichloroethane, ether solvents such as tetrahydrofuran, toluene, xylene And aromatic hydrocarbon solvents such as acetone, ketone solvents such as acetone and methyl ethyl ketone, and ester solvents such as ethyl acetate, butyl acetate, and ethyl cellosolve acetate.
- the same coating method as the above-described film forming method of the hole injection layer can be exemplified, and the nozzle printing method described above is preferably used in the present embodiment.
- polystyrene examples include vinyl chloride and polysiloxane.
- the film thickness of the hole transport layer is appropriately set based on the element design, and is, for example, 1 nm to 1 ⁇ m, preferably 2 nm to 500 nm, and more preferably 5 nm to 200 nm.
- the light emitting layer is usually formed of an organic substance that mainly emits fluorescence and / or phosphorescence, or an organic substance and a dopant that assists the organic substance.
- the dopant is added, for example, in order to improve the luminous efficiency and change the emission wavelength.
- the organic substance may be a low molecular compound or a high molecular compound, and the light emitting layer preferably contains a high molecular compound having a polystyrene-equivalent number average molecular weight of 10 3 to 10 8 .
- Examples of the light emitting material constituting the light emitting layer include the following dye materials, metal complex materials, polymer materials, and dopant materials.
- dye-based materials include cyclopentamine derivatives, tetraphenylbutadiene derivative compounds, triphenylamine derivatives, oxadiazole derivatives, pyrazoloquinoline derivatives, distyrylbenzene derivatives, distyrylarylene derivatives, pyrrole derivatives, thiophene ring compounds. Pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophene derivatives, oxadiazole dimers, pyrazoline dimers, quinacridone derivatives, coumarin derivatives, and the like.
- Metal complex materials examples include Al, Zn, Be, etc. as a central metal, or rare earth metals such as Tb, Eu, Dy, etc., and oxadiazole, thiadiazole, phenylpyridine, phenylbenzimidazole, as a ligand, Examples include metal complexes having a quinoline structure, such as metal complexes having light emission from triplet excited states such as iridium complexes and platinum complexes, aluminum quinolinol complexes, benzoquinolinol beryllium complexes, benzoxazolyl zinc complexes, benzoates. Examples include a thiazole zinc complex, an azomethyl zinc complex, a porphyrin zinc complex, and a europium complex.
- Polymer material As polymer materials, polyparaphenylene vinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyfluorene derivatives, polyvinylcarbazole derivatives, the above dye materials and metal complex light emitting materials are polymerized. The thing etc. can be mentioned.
- materials that emit blue light include distyrylarylene derivatives, oxadiazole derivatives, and polymers thereof, polyvinylcarbazole derivatives, polyparaphenylene derivatives, polyfluorene derivatives, and the like.
- polymer materials such as polyvinyl carbazole derivatives, polyparaphenylene derivatives, and polyfluorene derivatives are preferred.
- examples of materials that emit green light include quinacridone derivatives, coumarin derivatives, and polymers thereof, polyparaphenylene vinylene derivatives, polyfluorene derivatives, and the like. Of these, polymer materials such as polyparaphenylene vinylene derivatives and polyfluorene derivatives are preferred.
- examples of materials that emit red light include coumarin derivatives, thiophene ring compounds, and polymers thereof, polyparaphenylene vinylene derivatives, polythiophene derivatives, and polyfluorene derivatives.
- polymer materials such as polyparaphenylene vinylene derivatives, polythiophene derivatives, and polyfluorene derivatives are preferable.
- Dopant material examples include perylene derivatives, coumarin derivatives, rubrene derivatives, quinacridone derivatives, squalium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazolone derivatives, decacyclene, phenoxazone, and the like. Note that the thickness of such a light emitting layer is usually about 2 nm to 200 nm.
- a method for forming the light emitting layer a method of applying a solution containing a light emitting material, a vacuum deposition method, a transfer method, or the like can be used.
- the solvent used for film formation from a solution include the same solvents as those used for forming a hole transport layer from the above solution.
- a spin coating method, a casting method, a micro gravure coating method, a gravure coating method, a bar coating method, a roll coating method, a wire bar coating method, a dip coating method, a slit coating method, a capillary Coating methods such as coating methods, spray coating methods and nozzle printing methods, as well as gravure printing methods, screen printing methods, flexographic printing methods, offset printing methods, reverse printing methods, ink jet printing methods, etc.
- the nozzle printing method described above is preferably used.
- Electrode transport material constituting the electron transport layer
- known materials can be used, such as oxadiazole derivatives, anthraquinodimethane or derivatives thereof, benzoquinone or derivatives thereof, naphthoquinone or derivatives thereof, anthraquinones or derivatives thereof, tetracyanoanthra Quinodimethane or derivatives thereof, fluorenone derivatives, diphenyldicyanoethylene or derivatives thereof, diphenoquinone derivatives, or metal complexes of 8-hydroxyquinoline or derivatives thereof, polyquinoline or derivatives thereof, polyquinoxaline or derivatives thereof, polyfluorene or derivatives thereof, etc. Can be mentioned.
- oxadiazole derivatives as an electron transport material, oxadiazole derivatives, benzoquinone or derivatives thereof, anthraquinones or derivatives thereof, or metal complexes of 8-hydroxyquinoline or derivatives thereof, polyquinoline or derivatives thereof, polyquinoxaline or derivatives thereof, polyfluorene or Derivatives thereof are preferred, and 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, benzoquinone, anthraquinone, tris (8-quinolinol) aluminum, and polyquinoline are more preferred. .
- the method for forming the electron transport layer there are no particular restrictions on the method for forming the electron transport layer, but for low molecular weight electron transport materials, vacuum deposition from powder or film formation from a solution or a molten state can be exemplified.
- the material include film formation from a solution or a molten state.
- a polymer binder may be used in combination.
- the method for forming the electron transport layer from the solution include the same film formation method as the method for forming the hole transport layer from the above-described solution. In this embodiment, the above-described nozzle printing method is preferably used. Used.
- the film thickness of the electron transport layer varies depending on the material used, and is set appropriately so that the drive voltage and the light emission efficiency become appropriate values. At least a thickness that does not cause pinholes is required, and it is too thick. In such a case, the driving voltage of the element increases, which is not preferable. Accordingly, the thickness of the electron transport layer is, for example, 1 nm to 1 ⁇ m, preferably 2 nm to 500 nm, and more preferably 5 nm to 200 nm.
- an optimal material is appropriately selected according to the type of the light emitting layer, and an alloy containing at least one of alkali metal, alkaline earth metal, alkali metal and alkaline earth metal, alkali A metal or alkaline earth metal oxide, halide, carbonate, or a mixture of these substances can be given.
- alkali metals, alkali metal oxides, halides, and carbonates include lithium, sodium, potassium, rubidium, cesium, lithium oxide, lithium fluoride, sodium oxide, sodium fluoride, potassium oxide, potassium fluoride , Rubidium oxide, rubidium fluoride, cesium oxide, cesium fluoride, lithium carbonate, and the like.
- alkaline earth metals, alkaline earth metal oxides, halides and carbonates include magnesium, calcium, barium, strontium, magnesium oxide, magnesium fluoride, calcium oxide, calcium fluoride, barium oxide, Examples thereof include barium fluoride, strontium oxide, strontium fluoride, and magnesium carbonate.
- the electron injection layer may be composed of a laminate in which two or more layers are laminated, and examples thereof include LiF / Ca.
- the electron injection layer is formed by vapor deposition, sputtering, printing, or the like.
- the thickness of the electron injection layer is preferably about 1 nm to 1 ⁇ m.
- a material for the cathode As a material for the cathode, a material having a small work function, easy electron injection into the light emitting layer, and high electrical conductivity is preferable. Moreover, in the organic EL element which takes out light from the anode side, since the light from the light emitting layer is reflected to the anode side by the cathode, a material having a high visible light reflectance is preferable as the cathode material.
- an alkali metal, an alkaline earth metal, a transition metal, a group 13 metal of the periodic table, or the like can be used.
- cathode material examples include lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium, aluminum, scandium, vanadium, zinc, yttrium, indium, cerium, samarium, europium, terbium, ytterbium, and the like.
- An alloy, graphite, or a graphite intercalation compound is used.
- alloys include magnesium-silver alloys, magnesium-indium alloys, magnesium-aluminum alloys, indium-silver alloys, lithium-aluminum alloys, lithium-magnesium alloys, lithium-indium alloys, calcium-aluminum alloys, and the like. it can.
- a conductive resin electrode that can be formed by the coating method described in the section of the anode, or a transparent conductive electrode made of a conductive metal oxide, a conductive organic substance, or the like can be used.
- the conductive metal oxide include indium oxide, zinc oxide, tin oxide, ITO, and IZO
- examples of the conductive organic substance include polyaniline or a derivative thereof, polythiophene or a derivative thereof, and the like.
- the cathode may be composed of a laminate in which two or more layers are laminated. In some cases, the electron injection layer is used as a cathode.
- the electrode 33 constituting the cathode may include a film body M and a conductor W that is a plurality of nanowires dispersed in the film body M, as shown in FIG.
- the internal electrode structure of the cathode in this case is the same as that of the anode.
- the film thickness of the cathode is appropriately set in consideration of electric conductivity and durability, and is, for example, 10 nm to 10 ⁇ m, preferably 20 nm to 1 ⁇ m, and more preferably 50 nm to 500 nm.
- the dummy insulating film 24 ⁇ / b> D configured by the same member as the insulating film 24 is used instead of the dummy electrode 45. May be provided.
- FIG. 21 is a perspective view of the light emitting device 11 using a dummy insulating film
- FIG. 22 is a perspective view of the light emitting device 11 before forming a light emitting layer using a dummy insulating film. That is, the dummy insulating film 24D is provided on the bottom surface (the surface of the support substrate 21) of the recess 44, and the recess 44 is provided so as to reach the surface of the dummy insulating film 24D. In this embodiment, the bottom of the recess 44 corresponds to the surface of the dummy insulating film 24D.
- a dummy insulating film 24D is used in place of the dummy electrode 45, and other configurations are the light emitting devices shown in FIGS. Identical to the device.
- a dummy insulating film 24D having the same shape (rectangular shape) is provided instead of the dummy electrode 45 at the position of the dummy electrode 45.
- the dummy insulating film 24D is manufactured in the same process as the insulating film 24.
- the insulating films 24D and 24 may be continuous.
- the dummy insulating film may be provided in a portion where the dummy electrode of the above-described embodiment is provided.
- the dummy insulating film may be formed integrally with the insulating film.
- the insulating film may be extended to the portion where the dummy electrode is formed in the above-described embodiment, and the insulating film extended to the portion where the dummy electrode is provided may be used as the dummy insulating film.
- the dummy insulating film is preferably formed in the same process as the insulating film forming process. Since the dummy insulating film is formed of the same member as the insulating film in this way, the dummy insulating film can be formed in the same process as the insulating film, so the dummy insulating film is formed without increasing the number of processes. be able to.
- the insulating film and the dummy insulating film are preferably more lyophilic than the partition.
- the bottom of the recess is preferably made of a material having a contact angle with respect to anisole of less than 30 °
- the dummy insulating film serving as the bottom of the recess is made of a material with a contact angle with respect to anisole of less than 30 °. Is preferred. Therefore, among the materials exemplified as the insulating film, it is necessary to form the insulating film using a material that exhibits lyophilicity.
- the material of the insulating film and the dummy insulating film an oxide such as SiO 2, oxynitride and SiN and the like, preferably oxides and nitric oxide, such as SiO 2, a high SiO 2 lyophilic property is more preferable.
- Examples of the method for producing the cathode include a vacuum deposition method, a sputtering method, and a laminating method in which a metal thin film is thermocompression bonded.
- FIG. 23 is a perspective view of the light emitting device 11 using a recess having an opening
- FIG. 24 is a perspective view of the light emitting device 11 before forming a light emitting layer using a recess having an opening. 23 and 24 differs from the above-described embodiment only in that the shape of the recess 44 is a recess having a rectangular opening, and other configurations are the light emission shown in FIGS. Identical to the device.
- the light-emitting device described above can be suitably used for a display device, and can also be applied to, for example, a backlight of a liquid crystal display device, a lighting device, a light source of a scanner, and the like.
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Abstract
Description
まず発光装置の構成について図1,図2を参照して説明する。図1は本発明の発光装置11の平面図であり、図2は発光装置11の端面図である。図2(A)は図1に示す発光装置11を行方向Xに垂直な平面で切断(図1のII(A)-II(A)矢印線断面)したときの、発光装置11の端部の端面を拡大して示しており、図2(B)は図1に示す発光装置11を列方向Yに垂直な平面で切断した端面(図1のII(B)-II(B)矢印線断面)を示している。但し、図2においては下側の電極32を除いて、有機EL素子の記載は省略してある。また、図8は、図1に示した発光装置を一部分解して示す発光装置の斜視図であり、図9は、図8に示す発光装置において、エレクトロルミネッセンス層(EL層)35の形成前の発光装置の斜視図である。
次に発光装置11の製造方法について説明する。
a)陽極/発光層/陰極:(図11に示す構成)
b)陽極/正孔注入層/発光層/陰極:(図13において、層Yを正孔注入層とした構成)
c)陽極/正孔注入層/発光層/電子注入層/陰極:(図12において層Yを正孔注入層とし、層Xを電子注入層とした構成)
e)陽極/正孔注入層/発光層/電子輸送層/陰極:(図12において層Yを正孔注入層とし、層Xを電子輸送層とした構成)
f)陽極/正孔注入層/発光層/電子輸送層/電子注入層/陰極:(図12において、層Xを正孔注入層とし、層Yとして図16の構造を採用した構成)
d)陽極/正孔輸送層/発光層/陰極:(図13において層Yを正孔輸送層とした構成)
e)陽極/正孔輸送層/発光層/電子注入層/陰極:(図12において層Yを正孔輸送層とし、層Yを電子注入層とした構成)
f)陽極/正孔輸送層/発光層/電子輸送層/陰極:(図12において層Yを正孔輸送層とし、層Xを電子輸送層とした構成)
g)陽極/正孔輸送層/発光層/電子輸送層/電子注入層/陰極:(図12において層Yを正孔輸送層とし、層Xを図15に示す電子輸送層X2/電子注入層X1構造とした構成)
h)陽極/正孔注入層/正孔輸送層/発光層/陰極:(図13において層Yを、図16に示す正孔注入層Y1/正孔輸送層Y2構造とした構成)
i)陽極/正孔注入層/正孔輸送層/発光層/電子注入層/陰極:(図12において、層Yを図16に示す正孔注入層Y1/正孔輸送層Y2構造とし、層Xを電子注入層とした構成)
j)陽極/正孔注入層/正孔輸送層/発光層/電子輸送層/陰極:(図12において、層Yを図16に示す正孔注入層Y1/正孔輸送層Y2構造とし、層Xを電子輸送層とした構成)
k)陽極/正孔注入層/正孔輸送層/発光層/電子輸送層/電子注入層/陰極:(図12において、層Yを図16に示す正孔注入層Y1/正孔輸送層Y2構造とし、層Xを図15に示す電子輸送層X2/電子注入層X1構造とした構成)
l)陽極/発光層/電子注入層/陰極:(図14において、層Xを電子注入層とした構成)
m)陽極/発光層/電子輸送層/陰極:(図14において、層Xを電子輸送層とした構成)
n)陽極/発光層/電子輸送層/電子注入層/陰極:(図14において、層Xを図15に示す電子輸送層X2/電子注入層X1構造とした構成)
p)陽極/(繰り返し単位B)x/(繰り返し単位A)/陰極
支持基板は、有機EL素子を製造する工程において変化しないものが好適に用いられ、例えばガラス、プラスチック、高分子フィルム、およびシリコン基板、並びにこれらを積層したものなどが用いられる。なお有機EL素子を駆動する回路が形成された駆動基板を支持基板として用いてもよく、例えばTFT(Thin Film Transistor)基板を支持基板として設けてもよい。
発光層(34)から放射される光が陽極(電極32)を通って素子外に出射する構成の有機EL素子の場合、陽極には光透過性を示す電極が用いられ、光透過性を示す膜本体に、導電性を有するワイヤ状の導電体が配置されて構成される薄膜(以下、「導電性樹脂電極」ということがある)を電極として用いることができる。
ワイヤ状の導電体Wの材料としては、抵抗の低い金属が好適に用いられ、例えば、Ag、Au、Cu、Alおよびこれらの合金などを挙げることができる。ワイヤ状の導電体Wは、例えばN.R.Jana, L.Gearheart and C.J.Murphyによる方法(Chm.Commun.,2001, p617-p618)や、C.Ducamp-Sanguesa, R.Herrera-Urbina, and M.Figlarz等による方法(J. Solid State Chem.,Vol.100, 1992, p272~p280)によって製造することができる。ワイヤ状の導電体Wとして、例えばアミノ基含有高分子系分散剤(アイ・シー・アイ・ジャパン(I.I.C JAPAN)社製、商品名「ソルスパース24000SC」)で表面を保護した銀ナノワイヤー(長軸平均長さ1μm、短軸平均長さ10nm)を用いることができる。
正孔注入層を構成する正孔注入材料としては、酸化バナジウム、酸化モリブデン、酸化ルテニウム、および酸化アルミニウムなどの酸化物や、フェニルアミン系、スターバースト型アミン系、フタロシアニン系、アモルファスカーボン、ポリアニリン、およびポリチオフェン誘導体などを挙げることができる。
正孔輸送層を構成する正孔輸送材料としては、ポリビニルカルバゾール若しくはその誘導体、ポリシラン若しくはその誘導体、側鎖若しくは主鎖に芳香族アミンを有するポリシロキサン誘導体、ピラゾリン誘導体、アリールアミン誘導体、スチルベン誘導体、トリフェニルジアミン誘導体、ポリアニリン若しくはその誘導体、ポリチオフェン若しくはその誘導体、ポリアリールアミン若しくはその誘導体、ポリピロール若しくはその誘導体、ポリ(p-フェニレンビニレン)若しくはその誘導体、又はポリ(2,5-チエニレンビニレン)若しくはその誘導体などを挙げることができる。
発光層は、通常、主として蛍光及び/又はりん光を発光する有機物、または該有機物とこれを補助するドーパントとから形成される。ドーパントは、例えば発光効率の向上や、発光波長を変化させるために加えられる。なお有機物は、低分子化合物でも高分子化合物でもよく、発光層は、ポリスチレン換算の数平均分子量が103~108である高分子化合物を含むことが好ましい。発光層を構成する発光材料としては、例えば以下の色素系材料、金属錯体系材料、高分子系材料、ドーパント材料を挙げることができる。
色素系材料としては、例えば、シクロペンダミン誘導体、テトラフェニルブタジエン誘導体化合物、トリフェニルアミン誘導体、オキサジアゾール誘導体、ピラゾロキノリン誘導体、ジスチリルベンゼン誘導体、ジスチリルアリーレン誘導体、ピロール誘導体、チオフェン環化合物、ピリジン環化合物、ペリノン誘導体、ペリレン誘導体、オリゴチオフェン誘導体、オキサジアゾールダイマー、ピラゾリンダイマー、キナクリドン誘導体、クマリン誘導体などを挙げることができる。
金属錯体系材料としては、例えば中心金属に、Al、Zn、Beなど、またはTb、Eu、Dyなどの希土類金属を有し、配位子にオキサジアゾール、チアジアゾール、フェニルピリジン、フェニルベンゾイミダゾール、キノリン構造などを有する金属錯体を挙げることができ、例えばイリジウム錯体、白金錯体などの三重項励起状態からの発光を有する金属錯体、アルミキノリノール錯体、ベンゾキノリノールベリリウム錯体、ベンゾオキサゾリル亜鉛錯体、ベンゾチアゾール亜鉛錯体、アゾメチル亜鉛錯体、ポルフィリン亜鉛錯体、ユーロピウム錯体などを挙げることができる。
高分子系材料としては、ポリパラフェニレンビニレン誘導体、ポリチオフェン誘導体、ポリパラフェニレン誘導体、ポリシラン誘導体、ポリアセチレン誘導体、ポリフルオレン誘導体、ポリビニルカルバゾール誘導体、上記色素系材料や金属錯体系発光材料を高分子化したものなどを挙げることができる。
ドーパント材料としては、例えばペリレン誘導体、クマリン誘導体、ルブレン誘導体、キナクリドン誘導体、スクアリウム誘導体、ポルフィリン誘導体、スチリル系色素、テトラセン誘導体、ピラゾロン誘導体、デカシクレン、フェノキサゾンなどを挙げることができる。なお、このような発光層の厚さは、通常約2nm~200nmである。
発光層の成膜方法としては、発光材料を含む溶液を塗布する方法、真空蒸着法、転写法などを用いることができる。溶液からの成膜に用いる溶媒としては、前述の溶液から正孔輸送層を成膜する際に用いられる溶媒と同様の溶媒を挙げることができる。
電子輸送層を構成する電子輸送材料としては、公知のものを使用でき、オキサジアゾール誘導体、アントラキノジメタン若しくはその誘導体、ベンゾキノン若しくはその誘導体、ナフトキノン若しくはその誘導体、アントラキノン若しくはその誘導体、テトラシアノアンスラキノジメタン若しくはその誘導体、フルオレノン誘導体、ジフェニルジシアノエチレン若しくはその誘導体、ジフェノキノン誘導体、又は8-ヒドロキシキノリン若しくはその誘導体の金属錯体、ポリキノリン若しくはその誘導体、ポリキノキサリン若しくはその誘導体、ポリフルオレン若しくはその誘導体などを挙げることができる。
電子注入層を構成する材料としては、発光層の種類に応じて最適な材料が適宜選択され、アルカリ金属、アルカリ土類金属、アルカリ金属およびアルカリ土類金属のうちの1種類以上含む合金、アルカリ金属若しくはアルカリ土類金属の酸化物、ハロゲン化物、炭酸塩、またはこれらの物質の混合物などを挙げることができる。アルカリ金属、アルカリ金属の酸化物、ハロゲン化物、および炭酸塩の例としては、リチウム、ナトリウム、カリウム、ルビジウム、セシウム、酸化リチウム、フッ化リチウム、酸化ナトリウム、フッ化ナトリウム、酸化カリウム、フッ化カリウム、酸化ルビジウム、フッ化ルビジウム、酸化セシウム、フッ化セシウム、炭酸リチウムなどを挙げることができる。また、アルカリ土類金属、アルカリ土類金属の酸化物、ハロゲン化物、炭酸塩の例としては、マグネシウム、カルシウム、バリウム、ストロンチウム、酸化マグネシウム、フッ化マグネシウム、酸化カルシウム、フッ化カルシウム、酸化バリウム、フッ化バリウム、酸化ストロンチウム、フッ化ストロンチウム、炭酸マグネシウムなどを挙げることができる。電子注入層は、2層以上を積層した積層体で構成されてもよく、例えばLiF/Caなどを挙げることができる。電子注入層は、蒸着法、スパッタリング法、印刷法などにより形成される。電子注入層の膜厚としては、1nm~1μm程度が好ましい。
陰極の材料としては、仕事関数の小さく、発光層への電子注入が容易で、電気伝導度の高い材料が好ましい。また陽極側から光を取出す有機EL素子では、発光層からの光を陰極で陽極側に反射するために、陰極の材料としては可視光反射率の高い材料が好ましい。陰極には、例えばアルカリ金属、アルカリ土類金属、遷移金属および周期表13族金属などを用いることができる。陰極の材料としては、例えばリチウム、ナトリウム、カリウム、ルビジウム、セシウム、ベリリウム、マグネシウム、カルシウム、ストロンチウム、バリウム、アルミニウム、スカンジウム、バナジウム、亜鉛、イットリウム、インジウム、セリウム、サマリウム、ユーロピウム、テルビウム、イッテルビウムなどの金属、前記金属のうちの2種以上の合金、前記金属のうちの1種以上と、金、銀、白金、銅、マンガン、チタン、コバルト、ニッケル、タングステン、錫のうちの1種以上との合金、またはグラファイト若しくはグラファイト層間化合物などが用いられる。合金の例としては、マグネシウム-銀合金、マグネシウム-インジウム合金、マグネシウム-アルミニウム合金、インジウム-銀合金、リチウム-アルミニウム合金、リチウム-マグネシウム合金、リチウム-インジウム合金、カルシウム-アルミニウム合金などを挙げることができる。
2 隔壁
2a 外周部
2b 仕切り部
3 支持基板
4 一方の電極
5 絶縁膜
11 発光装置
21 支持基板
24 絶縁膜
28 開口
31 有機EL素子
32 一方の電極
41 隔壁
42 外周部
43 仕切り部
44 凹み
45 ダミー電極
Claims (6)
- 支持基板と、
前記支持基板上に設けられる複数の有機エレクトロルミネッセンス素子と、
前記複数の有機エレクトロルミネッセンス素子を区分けする隔壁とを備える発光装置であって、
前記隔壁は、前記複数の有機エレクトロルミネッセンス素子が設けられる領域を囲むように配置される外周部と、前記外周部に囲まれる領域においてストライプ状に配置され、長手方向の一端および他端がそれぞれ前記外周部に連結されている複数本の仕切り部とを有しており、
前記有機エレクトロルミネッセンス素子は、互いに隣り合う仕切り部間に配置されており、
前記外周部の、前記仕切り部の長手方向の延長線上には、前記支持基板に向かう凹みが設けられている発光装置。 - 前記凹みの底面は、アニソールに対する接触角が30°未満である材料からなる請求項1記載の発光装置。
- 前記有機エレクトロルミネッセンス素子は一対の電極を有し、
該発光装置は、前記一対の電極のうちの前記支持基板寄りに配置される一方の電極と同じ部材によって構成されるダミー電極を、前記凹みの底面上にさらに有し、
前記凹みが前記ダミー電極表面まで達するように設けられている請求項1記載の発光装置。 - 前記一方の電極および前記ダミー電極は塗布法によって形成されてなる、請求項3記載の発光装置。
- 前記一方の電極が、光透過性を示す膜本体に、導電性を有するワイヤ状の導電体が配置されて構成されている請求項3に記載の発光装置。
- 前記複数の有機エレクトロルミネッセンス素子をそれぞれ電気的に絶縁する絶縁膜と、該絶縁膜と同じ部材によって構成されるダミー絶縁膜とをさらに有し、
前記絶縁膜は、前記隔壁と前記支持基板との間に設けられており、
前記ダミー絶縁膜は、前記凹みの底面上に設けられており、
前記凹みが前記ダミー絶縁膜表面まで達するように設けられている請求項1記載の発光装置。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013093974A1 (ja) * | 2011-12-22 | 2013-06-27 | パナソニック株式会社 | 有機el表示パネル |
JP2016115472A (ja) * | 2014-12-12 | 2016-06-23 | 株式会社Joled | 有機発光デバイス |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8957442B2 (en) * | 2011-02-11 | 2015-02-17 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and display device |
KR102095382B1 (ko) * | 2011-02-11 | 2020-03-31 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 발광 장치 및 표시 장치 |
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CN112103308A (zh) * | 2019-06-17 | 2020-12-18 | 松下知识产权经营株式会社 | 颜色变换设备及制造方法、微型led显示器面板及制造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007172896A (ja) * | 2005-12-20 | 2007-07-05 | Casio Comput Co Ltd | 表示装置及びその製造方法 |
JP2007299741A (ja) * | 2006-04-28 | 2007-11-15 | Samsung Sdi Co Ltd | 有機電界発光素子及びその製造方法 |
JP2008091071A (ja) * | 2006-09-29 | 2008-04-17 | Seiko Epson Corp | 電気光学装置、およびその製造方法 |
WO2008149499A1 (ja) * | 2007-05-30 | 2008-12-11 | Panasonic Corporation | 有機elディスプレイパネルおよびその製造方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009181856A (ja) * | 2008-01-31 | 2009-08-13 | Sumitomo Chemical Co Ltd | 透明導電膜付き透明板および有機エレクトロルミネッセンス素子 |
JP2010080086A (ja) * | 2008-09-24 | 2010-04-08 | Sumitomo Chemical Co Ltd | パターン塗布用基板および有機el素子 |
-
2009
- 2009-07-29 JP JP2009176324A patent/JP5458728B2/ja not_active Expired - Fee Related
-
2010
- 2010-07-28 EP EP10804460A patent/EP2461648A1/en not_active Withdrawn
- 2010-07-28 CN CN201080033529.3A patent/CN102474935B/zh not_active Expired - Fee Related
- 2010-07-28 US US13/387,245 patent/US20120181553A1/en not_active Abandoned
- 2010-07-28 KR KR1020127004596A patent/KR20120052342A/ko not_active Application Discontinuation
- 2010-07-28 WO PCT/JP2010/062724 patent/WO2011013714A1/ja active Application Filing
- 2010-07-29 TW TW099125035A patent/TW201116149A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007172896A (ja) * | 2005-12-20 | 2007-07-05 | Casio Comput Co Ltd | 表示装置及びその製造方法 |
JP2007299741A (ja) * | 2006-04-28 | 2007-11-15 | Samsung Sdi Co Ltd | 有機電界発光素子及びその製造方法 |
JP2008091071A (ja) * | 2006-09-29 | 2008-04-17 | Seiko Epson Corp | 電気光学装置、およびその製造方法 |
WO2008149499A1 (ja) * | 2007-05-30 | 2008-12-11 | Panasonic Corporation | 有機elディスプレイパネルおよびその製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013093974A1 (ja) * | 2011-12-22 | 2013-06-27 | パナソニック株式会社 | 有機el表示パネル |
JPWO2013093974A1 (ja) * | 2011-12-22 | 2015-04-27 | パナソニック株式会社 | 有機el表示パネル |
US9153791B2 (en) | 2011-12-22 | 2015-10-06 | Joled Inc | Organic EL display panel |
JP2016115472A (ja) * | 2014-12-12 | 2016-06-23 | 株式会社Joled | 有機発光デバイス |
Also Published As
Publication number | Publication date |
---|---|
US20120181553A1 (en) | 2012-07-19 |
KR20120052342A (ko) | 2012-05-23 |
EP2461648A1 (en) | 2012-06-06 |
JP5458728B2 (ja) | 2014-04-02 |
CN102474935B (zh) | 2014-11-05 |
TW201116149A (en) | 2011-05-01 |
JP2011029119A (ja) | 2011-02-10 |
CN102474935A (zh) | 2012-05-23 |
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