WO2011009917A2 - Verfahren und vorrichtung zur reinigung von substraten an einem träger - Google Patents
Verfahren und vorrichtung zur reinigung von substraten an einem träger Download PDFInfo
- Publication number
- WO2011009917A2 WO2011009917A2 PCT/EP2010/060644 EP2010060644W WO2011009917A2 WO 2011009917 A2 WO2011009917 A2 WO 2011009917A2 EP 2010060644 W EP2010060644 W EP 2010060644W WO 2011009917 A2 WO2011009917 A2 WO 2011009917A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tubes
- carrier
- longitudinal channels
- substrates
- tube
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000012530 fluid Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 37
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080034667.3A CN102612759B (zh) | 2009-07-23 | 2010-07-22 | 用于清洁载体处的基质的方法和装置 |
EP10739325A EP2457263A2 (de) | 2009-07-23 | 2010-07-22 | Verfahren und vorrichtung zur reinigung von substraten an einem träger |
JP2012521040A JP2012533898A (ja) | 2009-07-23 | 2010-07-22 | キャリア上で基板をクリーニングする方法及び装置 |
US13/355,223 US8524008B2 (en) | 2009-07-20 | 2012-01-20 | Method and device for cleaning substrates on a carrier |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009035343.7 | 2009-07-23 | ||
DE102009035343A DE102009035343A1 (de) | 2009-07-23 | 2009-07-23 | Verfahren und Vorrichtung zur Reinigung von Substraten an einem Träger |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/355,223 Continuation US8524008B2 (en) | 2009-07-20 | 2012-01-20 | Method and device for cleaning substrates on a carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011009917A2 true WO2011009917A2 (de) | 2011-01-27 |
WO2011009917A3 WO2011009917A3 (de) | 2011-05-19 |
Family
ID=43384040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/060644 WO2011009917A2 (de) | 2009-07-20 | 2010-07-22 | Verfahren und vorrichtung zur reinigung von substraten an einem träger |
Country Status (9)
Country | Link |
---|---|
US (1) | US8524008B2 (de) |
EP (1) | EP2457263A2 (de) |
JP (1) | JP2012533898A (de) |
KR (1) | KR20120036348A (de) |
CN (1) | CN102612759B (de) |
DE (1) | DE102009035343A1 (de) |
MY (1) | MY154124A (de) |
TW (1) | TWI493607B (de) |
WO (1) | WO2011009917A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8387636B2 (en) | 2009-07-23 | 2013-03-05 | Gebr. Schmid Gmbh | Device for cleaning substrates on a carrier |
EP2711151A1 (de) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Verfahren zur Herstellung von Wafern |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010052635B4 (de) * | 2010-11-29 | 2014-01-02 | Rena Gmbh | Halte-Reinigungsvorrichtung und Verfahren zum abschnittsweisen Reinigen gesägter Wafer |
US9349392B1 (en) | 2012-05-24 | 2016-05-24 | Western Digital (Fremont), Llc | Methods for improving adhesion on dielectric substrates |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008053596A1 (de) | 2008-10-15 | 2010-04-22 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock |
DE102009023121A1 (de) | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
JP2965876B2 (ja) * | 1994-11-22 | 1999-10-18 | 大日本スクリーン製造株式会社 | 基板処理装置およびそれに用いられる処理槽 |
JPH0919921A (ja) * | 1995-07-07 | 1997-01-21 | Tokyo Seimitsu Co Ltd | ワイヤソー |
JPH0936080A (ja) | 1995-07-13 | 1997-02-07 | Toray Eng Co Ltd | 加工済シリコンインゴットの洗浄方法 |
JPH09207126A (ja) * | 1996-01-31 | 1997-08-12 | Nippei Toyama Corp | ワイヤソーのためのワーク支持装置、清浄方法及びワイヤソー |
JPH1142636A (ja) * | 1997-07-29 | 1999-02-16 | Olympus Optical Co Ltd | ウエハー解除方法 |
DE19900671C2 (de) * | 1999-01-11 | 2002-04-25 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung |
JP2002110591A (ja) * | 2000-09-27 | 2002-04-12 | Takata Corp | ワイヤーソー後ウエハ洗浄装置及び洗浄方法 |
JP2004106360A (ja) * | 2002-09-19 | 2004-04-08 | Komatsu Electronic Metals Co Ltd | スリット入りウェーハ支持部材およびウェーハ洗浄装置 |
JP2007118354A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | インゴット支持用治具 |
DE102006059810A1 (de) * | 2006-12-15 | 2008-06-19 | Rena Sondermaschinen Gmbh | Vorrichtung und Verfahren zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben |
KR100901493B1 (ko) * | 2007-10-11 | 2009-06-08 | 세메스 주식회사 | 매엽식 기판 세정 설비 및 기판의 이면 세정 방법 |
US8083865B2 (en) * | 2008-11-21 | 2011-12-27 | Aquajet Ltd. | Tube lancing machine |
DE102009035341A1 (de) * | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Vorrichtung zur Reinigung von Substraten an einem Träger |
-
2009
- 2009-07-23 DE DE102009035343A patent/DE102009035343A1/de not_active Withdrawn
-
2010
- 2010-07-22 KR KR1020127001541A patent/KR20120036348A/ko not_active Application Discontinuation
- 2010-07-22 EP EP10739325A patent/EP2457263A2/de not_active Withdrawn
- 2010-07-22 JP JP2012521040A patent/JP2012533898A/ja active Pending
- 2010-07-22 MY MYPI2012000240A patent/MY154124A/en unknown
- 2010-07-22 TW TW099124188A patent/TWI493607B/zh not_active IP Right Cessation
- 2010-07-22 CN CN201080034667.3A patent/CN102612759B/zh not_active Expired - Fee Related
- 2010-07-22 WO PCT/EP2010/060644 patent/WO2011009917A2/de active Application Filing
-
2012
- 2012-01-20 US US13/355,223 patent/US8524008B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008053596A1 (de) | 2008-10-15 | 2010-04-22 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock |
DE102009023121A1 (de) | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8387636B2 (en) | 2009-07-23 | 2013-03-05 | Gebr. Schmid Gmbh | Device for cleaning substrates on a carrier |
EP2711151A1 (de) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Verfahren zur Herstellung von Wafern |
WO2014045108A1 (en) | 2012-09-24 | 2014-03-27 | Meyer Burger Ag | Method of making wafers |
Also Published As
Publication number | Publication date |
---|---|
KR20120036348A (ko) | 2012-04-17 |
WO2011009917A3 (de) | 2011-05-19 |
CN102612759B (zh) | 2015-03-11 |
US20120118329A1 (en) | 2012-05-17 |
DE102009035343A1 (de) | 2011-01-27 |
US8524008B2 (en) | 2013-09-03 |
TWI493607B (zh) | 2015-07-21 |
MY154124A (en) | 2015-05-15 |
TW201117274A (en) | 2011-05-16 |
CN102612759A (zh) | 2012-07-25 |
EP2457263A2 (de) | 2012-05-30 |
JP2012533898A (ja) | 2012-12-27 |
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