WO2011009917A2 - Verfahren und vorrichtung zur reinigung von substraten an einem träger - Google Patents
Verfahren und vorrichtung zur reinigung von substraten an einem träger Download PDFInfo
- Publication number
- WO2011009917A2 WO2011009917A2 PCT/EP2010/060644 EP2010060644W WO2011009917A2 WO 2011009917 A2 WO2011009917 A2 WO 2011009917A2 EP 2010060644 W EP2010060644 W EP 2010060644W WO 2011009917 A2 WO2011009917 A2 WO 2011009917A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- tubes
- carrier
- longitudinal channels
- substrates
- tube
- Prior art date
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 50
- 239000000758 substrate Substances 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000012530 fluid Substances 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 37
- 238000004026 adhesive bonding Methods 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 239000000969 carrier Substances 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a process for the purification of substrates on a support, in particular on a support according to the German patent application DE 102009023121 filed on May 22, 2009 by the same Applicant, as well as a corresponding device for carrying out this process.
- a plurality of flat substrates such as, for example, silicon wafers for solar cell production, are arranged on a flat elongate carrier and are adhesively bonded thereto.
- the carrier has in its interior a plurality of longitudinal channels which run parallel to one another and which pass over openings in the intermediate spaces between the substrates at the underside of the carrier or are connected in a fluid-conducting manner thereto.
- liquid connections can be made directly to the openings of the longitudinal channels for introducing cleaning fluids.
- this does not give a good cleaning effect.
- the invention has for its object to provide an aforementioned method and a corresponding device with which problems of the prior art can be avoided and in particular the cleaning effect is as large as possible.
- This object is achieved by a method having the features of claim 1 and a device having the features of claim 8.
- Advantageous and preferred embodiments of the subject invention also emerge from the other claims and are explained in more detail below. Some of the features are described only for the method or only for the device. However, they should be able to apply to both the process and the device independently. The wording of the claims is incorporated herein by express reference.
- an elongate tube is introduced into at least one of the longitudinal channels, advantageously a tube in each of the longitudinal channels of the carrier.
- the relative movement takes place between the carrier and the tube, so it can be a part moved and the other remain unmoved.
- Cleaning liquid or other fluid is then discharged from the tube, in particular from its end region, which extends into the longitudinal channel, into the longitudinal channel.
- the relative movement is achieved substantially or at least also by moving the carrier. This means that in the end the tube moves in the longitudinal channel of the carrier and thus also the place where the cleaning liquid exits the tube and thus virtually the exit point of cleaning liquid moves within the longitudinal channel.
- the advantage of moving at least the carrier during the relative movement is that it is moved in any case in a continuous process by a corresponding system, in particular from processing station to processing station.
- the movement means used for this purpose conveyor belts or roller conveyors or the like. also be used for the relative movement. It can be provided that at the beginning of the cleaning process after the introduction of the front pipes in the longitudinal channels cleaning liquid is introduced through the tubes in the longitudinal channels, and that when the tubes protrude only a small piece in the longitudinal channels. This is done advantageously for a period of a few seconds. Subsequently, cleaning liquid is further introduced through the tubes in the longitudinal channels, while the tubes with a relative movement in the longitudinal channels to drive to the other end opening.
- a tube extends to at least a central region of the longitudinal channel of the carrier.
- a pipe passes through the entire length of the longitudinal channel during the course of the relative movement and thus a pipe is sufficient for its cleaning.
- two groups of tubes are provided, namely a front tube and a rear tube, which reach into the two opposite ends of the longitudinal channel in this and then each extend only slightly during the relative movement beyond the central region.
- the introduction of the tubes in the longitudinal channels can follow such that in each case a group of adjacent tubes, in particular as many tubes as longitudinal channels, or the like on a tube holder. are fixed and moved into the path of movement of the wearer or can be swiveled in, so that this under certain circumstances Removing the pipes can be moved continuously.
- the pivoting of the tubes in the path of movement of the carrier is advantageously carried out such that the longitudinal center axes of the tubes are aligned with the longitudinal center axes of the longitudinal channels and can thus enter the carrier. If the above-described division into front tubes and rear tubes is provided, then the carrier is first driven to maximum extent on the front tubes.
- the rear tubes are pivoted on their tube holder in the movement path, so that they are also aligned with the longitudinal channels. Then the carrier can be moved back and thereby drive the rear tubes also in the longitudinal channels.
- the distance between the front pipes and the rear pipes should not be too great, for example a few centimeters or about 10% to 30% of the length of the pipes.
- the carrier is slowly reciprocated while cleaning liquid exits the tubes to clean the gaps.
- the tubes are advantageously fixed or are stationary, so that only the carrier moves during the main cleaning.
- the openings of the tubes are advantageously located in their end regions and go down or are oriented downwards.
- recesses are introduced into the tubes, which advantageously have a round cross section.
- These recesses may be either elongate slots or elongated openings, for example, with a length of 1 cm to 7 cm.
- a plurality of openings may be provided, advantageously in turn as simple holes.
- Each of these openings may have a size of a few millimeters.
- Elaborate nozzle shapes or the like. are not necessarily needed for the tubes, although they are conceivable, since the cleaning fluid essentially only needs to emerge, then to flush or clean the interstices between the substrates on the carriers.
- 1 is a side sectional view of a carrier with substrates on its underside and longitudinal channels, in which pipes are inserted from both sides,
- Fig. 2 is a plan view of the illustration of FIG. 1 with tubes on a holder on the right side of the carrier and
- Fig. 3 is an enlargement through an elongated tube on a carrier with a plurality of outlets at its end.
- Fig. 1 is shown in a lateral section, as hanging on a basically known carrier 1 1 at the bottom 12 a plurality of substrates 14. These were created by sawing silicon blocks. This is well known to the skilled person and therefore need not be explained in detail.
- the carrier 11 together with substrates 14 is in a manner not shown along the through Double arrow illustrated movement direction B transported, for example, from left to right. For this purpose, it can be clamped, for example, in a carrier device, as is known from DE 102008053596 A1. This carrier in turn is on a roller conveyor or the like. transported horizontally.
- longitudinal channels 16 are present in the carrier 1 1, which are sawed when sawing the silicon blocks in the substrates 14 from the bottom 12 ago and so through the openings a connection between longitudinal channels 16 and spaces between the Substrates 14 is formed.
- liquid in particular water or cleaning liquid, can now be introduced into the longitudinal channels 16, advantageously from the ends. This liquid then flows out of the longitudinal channels 16 through the sawn openings between the substrates 14 for said desired cleaning action.
- the elongate tubes 18a and 18b are provided according to the invention. These are slightly smaller than the cross section of the longitudinal channels 16 and have openings 19a and 19b directed down near an end region. These openings 19 are formed in Fig. 1 as elongated slots, and thus as relatively large openings. They have the effect that liquid exits downwards from the tubes 18 over the length of the openings 19 and thus considerably more liquid can be used to clean the substrates 14 in this area than over the entire length of the longitudinal channels. Thus, a concentrated or targeted application of cleaning liquid can take place and thus a more targeted and concentrated cleaning of the intermediate spaces or of the substrates 14.
- the right tubes 18 b are attached to a pipe holder 21 b.
- the pipe holder 21 b is formed in the manner of an arm, namely pivotable about a rotation axis 22b.
- a drive is not shown here, but is easy to implement.
- the rotation axis 22b is parallel to the direction of movement B of the carrier 11.
- the left-hand tubes 18a according to FIG. 1 are advantageously provided on a similar or mirror-image-shaped tube holder 21a. From the plan view of Fig. 2 it can also be seen that the carrier 11 has five longitudinal channels 16 and left and right each equal to and thus five tubes 18a and 18b are provided. Then, liquid can be introduced for cleaning at the same time through each of the longitudinal channels 16.
- the left tube holder 21a is pivoted upwards with the tubes 18a or pivoted out of the direction of movement B of the carrier 11 together with substrates 14 and the possible carrier device so as not to hinder its movement.
- the right-hand tube holder 21b with the tubes 18b can already be pivoted into the position shown in FIG. 1, so that, as it were, the carrier 11 with its longitudinal channels 16 can drive onto the tubes 18b.
- the left pipe holder 21a can be moved up to the carrier 11 so that its pipes 18a engage from the left into the longitudinal channels 16, as shown. This is, for example, according to FIG. 1, no pure pivoting movement about a pivot axis parallel to the direction of movement B, but a pivoting and sliding movement.
- the left tubes 18a be able to be guided by a pure pivoting movement as well as the right tubes 18b, to the carrier 1 1, the tubes would be considerably longer, so that a tube 18 is almost as long as a longitudinal channel, so that when fully raised support 11 or brought up to the tube holder carrier 11, the other tubes can be pivoted and not too far away from the already introduced tubes.
- tubes 18a and 18b engage in the longitudinal channels 16 from both sides of the carrier 11.
- the cleaning effect is doubled, so to speak.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
- Photovoltaic Devices (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080034667.3A CN102612759B (zh) | 2009-07-23 | 2010-07-22 | 用于清洁载体处的基质的方法和装置 |
JP2012521040A JP2012533898A (ja) | 2009-07-23 | 2010-07-22 | キャリア上で基板をクリーニングする方法及び装置 |
EP10739325A EP2457263A2 (de) | 2009-07-23 | 2010-07-22 | Verfahren und vorrichtung zur reinigung von substraten an einem träger |
US13/355,223 US8524008B2 (en) | 2009-07-20 | 2012-01-20 | Method and device for cleaning substrates on a carrier |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009035343A DE102009035343A1 (de) | 2009-07-23 | 2009-07-23 | Verfahren und Vorrichtung zur Reinigung von Substraten an einem Träger |
DE102009035343.7 | 2009-07-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/355,223 Continuation US8524008B2 (en) | 2009-07-20 | 2012-01-20 | Method and device for cleaning substrates on a carrier |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011009917A2 true WO2011009917A2 (de) | 2011-01-27 |
WO2011009917A3 WO2011009917A3 (de) | 2011-05-19 |
Family
ID=43384040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/060644 WO2011009917A2 (de) | 2009-07-20 | 2010-07-22 | Verfahren und vorrichtung zur reinigung von substraten an einem träger |
Country Status (9)
Country | Link |
---|---|
US (1) | US8524008B2 (de) |
EP (1) | EP2457263A2 (de) |
JP (1) | JP2012533898A (de) |
KR (1) | KR20120036348A (de) |
CN (1) | CN102612759B (de) |
DE (1) | DE102009035343A1 (de) |
MY (1) | MY154124A (de) |
TW (1) | TWI493607B (de) |
WO (1) | WO2011009917A2 (de) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8387636B2 (en) | 2009-07-23 | 2013-03-05 | Gebr. Schmid Gmbh | Device for cleaning substrates on a carrier |
EP2711151A1 (de) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Verfahren zur Herstellung von Wafern |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010052635B4 (de) * | 2010-11-29 | 2014-01-02 | Rena Gmbh | Halte-Reinigungsvorrichtung und Verfahren zum abschnittsweisen Reinigen gesägter Wafer |
US9349392B1 (en) | 2012-05-24 | 2016-05-24 | Western Digital (Fremont), Llc | Methods for improving adhesion on dielectric substrates |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008053596A1 (de) | 2008-10-15 | 2010-04-22 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock |
DE102009023121A1 (de) | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5000795A (en) * | 1989-06-16 | 1991-03-19 | At&T Bell Laboratories | Semiconductor wafer cleaning method and apparatus |
JP2965876B2 (ja) * | 1994-11-22 | 1999-10-18 | 大日本スクリーン製造株式会社 | 基板処理装置およびそれに用いられる処理槽 |
JPH0919921A (ja) * | 1995-07-07 | 1997-01-21 | Tokyo Seimitsu Co Ltd | ワイヤソー |
JPH0936080A (ja) | 1995-07-13 | 1997-02-07 | Toray Eng Co Ltd | 加工済シリコンインゴットの洗浄方法 |
JPH09207126A (ja) * | 1996-01-31 | 1997-08-12 | Nippei Toyama Corp | ワイヤソーのためのワーク支持装置、清浄方法及びワイヤソー |
JPH1142636A (ja) * | 1997-07-29 | 1999-02-16 | Olympus Optical Co Ltd | ウエハー解除方法 |
DE19900671C2 (de) * | 1999-01-11 | 2002-04-25 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zum Vereinzeln von scheibenförmigen Substraten, insbesondere zur Waferherstellung |
JP2002110591A (ja) * | 2000-09-27 | 2002-04-12 | Takata Corp | ワイヤーソー後ウエハ洗浄装置及び洗浄方法 |
JP2004106360A (ja) * | 2002-09-19 | 2004-04-08 | Komatsu Electronic Metals Co Ltd | スリット入りウェーハ支持部材およびウェーハ洗浄装置 |
JP2007118354A (ja) * | 2005-10-27 | 2007-05-17 | Kyocera Corp | インゴット支持用治具 |
DE202006020339U1 (de) * | 2006-12-15 | 2008-04-10 | Rena Sondermaschinen Gmbh | Vorrichtung zum Reinigen von Gegenständen, insbesondere von dünnen Scheiben |
KR100901493B1 (ko) * | 2007-10-11 | 2009-06-08 | 세메스 주식회사 | 매엽식 기판 세정 설비 및 기판의 이면 세정 방법 |
US8083865B2 (en) * | 2008-11-21 | 2011-12-27 | Aquajet Ltd. | Tube lancing machine |
DE102009035341A1 (de) * | 2009-07-23 | 2011-01-27 | Gebr. Schmid Gmbh & Co. | Vorrichtung zur Reinigung von Substraten an einem Träger |
-
2009
- 2009-07-23 DE DE102009035343A patent/DE102009035343A1/de not_active Withdrawn
-
2010
- 2010-07-22 KR KR1020127001541A patent/KR20120036348A/ko not_active Application Discontinuation
- 2010-07-22 JP JP2012521040A patent/JP2012533898A/ja active Pending
- 2010-07-22 CN CN201080034667.3A patent/CN102612759B/zh not_active Expired - Fee Related
- 2010-07-22 TW TW099124188A patent/TWI493607B/zh not_active IP Right Cessation
- 2010-07-22 MY MYPI2012000240A patent/MY154124A/en unknown
- 2010-07-22 EP EP10739325A patent/EP2457263A2/de not_active Withdrawn
- 2010-07-22 WO PCT/EP2010/060644 patent/WO2011009917A2/de active Application Filing
-
2012
- 2012-01-20 US US13/355,223 patent/US8524008B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008053596A1 (de) | 2008-10-15 | 2010-04-22 | Gebr. Schmid Gmbh & Co. | Verfahren und Vorrichtung zur Reinigung eines Waferblocks sowie Trägereinrichtung für einen Waferblock |
DE102009023121A1 (de) | 2009-05-22 | 2010-11-25 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8387636B2 (en) | 2009-07-23 | 2013-03-05 | Gebr. Schmid Gmbh | Device for cleaning substrates on a carrier |
EP2711151A1 (de) | 2012-09-24 | 2014-03-26 | Meyer Burger AG | Verfahren zur Herstellung von Wafern |
WO2014045108A1 (en) | 2012-09-24 | 2014-03-27 | Meyer Burger Ag | Method of making wafers |
Also Published As
Publication number | Publication date |
---|---|
US8524008B2 (en) | 2013-09-03 |
EP2457263A2 (de) | 2012-05-30 |
MY154124A (en) | 2015-05-15 |
TWI493607B (zh) | 2015-07-21 |
DE102009035343A1 (de) | 2011-01-27 |
CN102612759A (zh) | 2012-07-25 |
US20120118329A1 (en) | 2012-05-17 |
JP2012533898A (ja) | 2012-12-27 |
WO2011009917A3 (de) | 2011-05-19 |
CN102612759B (zh) | 2015-03-11 |
TW201117274A (en) | 2011-05-16 |
KR20120036348A (ko) | 2012-04-17 |
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