WO2011000629A3 - Verfahren zur herstellung eines folienartigen elektrischen verbinders für solarzellen, derartig hergestelltes verbindungselement sowie verfahren zum elektrischen verbinden von mindestens zwei solarzellen zu einem solarmodul - Google Patents

Verfahren zur herstellung eines folienartigen elektrischen verbinders für solarzellen, derartig hergestelltes verbindungselement sowie verfahren zum elektrischen verbinden von mindestens zwei solarzellen zu einem solarmodul Download PDF

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Publication number
WO2011000629A3
WO2011000629A3 PCT/EP2010/056899 EP2010056899W WO2011000629A3 WO 2011000629 A3 WO2011000629 A3 WO 2011000629A3 EP 2010056899 W EP2010056899 W EP 2010056899W WO 2011000629 A3 WO2011000629 A3 WO 2011000629A3
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WO
WIPO (PCT)
Prior art keywords
foil
solar cells
transport
lateral edge
adjusting
Prior art date
Application number
PCT/EP2010/056899
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English (en)
French (fr)
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WO2011000629A2 (de
Inventor
Hans-Joachim Krokoszinski
Martin Zippel
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Priority to KR1020127002397A priority Critical patent/KR20120124052A/ko
Priority to US13/381,263 priority patent/US9307650B2/en
Priority to JP2012518056A priority patent/JP5409908B2/ja
Priority to CN201080038226.0A priority patent/CN102473794B/zh
Priority to EP10721480A priority patent/EP2449601A2/de
Publication of WO2011000629A2 publication Critical patent/WO2011000629A2/de
Publication of WO2011000629A3 publication Critical patent/WO2011000629A3/de

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/04—Punching, slitting or perforating
    • B32B2038/047—Perforating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B32B38/1841—Positioning, e.g. registration or centering during laying up
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y10T29/4921—Contact or terminal manufacturing by assembling plural parts with bonding

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Manufacturing & Machinery (AREA)
  • Photovoltaic Devices (AREA)

Abstract

Die Erfindung betrifft ein Verfahren zur Herstellung eines folienartigen elektrischen Verbinders für Solarzellen, um diese zu Modulen zu verschalten, wobei der Verbinder eine leitfähige und mindestens eine isolierende Flächenschicht aufweist. Erfindungsgemäß wird zunächst eine isolierene Trägerfolienbahn in einer Breite bereitgestellt, welche im Wesentlichen der Breite der zu verschaltenden Solarzellen entspricht. Weiterhin werden in die Trägerfolie Ausnehmungen im Bereich späterer Lötstellen und in den Seitenstreifenrandbereichen Justage- und Transportperforationen eingebracht. Weiterhin wird eine leitfähige Folienbahn mit einer auf die Trägerfolie abgestimmten Breite bereitgestellt, wobei in diese Folienbahn ebenfalls randseitig eine Justage- und Transportperforation eingebracht sowie zusätzliche Kammstrukturen als spätere elektrische Verbindungsfinger ausgebildet werden. Hierbei verbleiben Haltestege in Richtung der Justage- und Transportperforation, um eine Lagesicherung der Kammstrukturen zu gewährleisten. Mit Hilfe von stiftförmigen Fortsätzen eines Transportbands oder einer Transportrolle wird die leitfähige Folienbahn auf der Trägerfolie positioniert, wobei die Fortsätze in die jeweiligen Justage- und Transportperforationen eingreifen. Es erfolgt danach ein Verbinden der Trägerfolie mit der leitfähigen Folienbahn, bevorzugt durch Stoffschluss. Im Anschluss wird ein Abtrennen der Seitenrandstreifen und Durchtrennen der Haltestege vorgenommen. Im nächsten Schritt erfolgt ein Aufbringen, insbesondere Auflaminieren einer isolierenden Deckfolie oder jeweils eines randseitigen Deckfolienstreifens mit jeweils einem breiten Überstand bezogen auf den Verbund Trägerfolie / leitfähige Folienbahn. Hiernach schließt sich ein Falzen und Fixieren der seitlich überstehenden Deckfolienränder bzw. des Überstands der Deckfolienstreifen bis hin zur Verbundunterseite zum Zweck der Kantenisolierung an. Das so erhaltene Gebilde wird dann auf einer Vorratsrolle zur späteren Verarbeitung gelagert.
PCT/EP2010/056899 2009-06-29 2010-05-19 Verfahren zur herstellung eines folienartigen elektrischen verbinders für solarzellen, derartig hergestelltes verbindungselement sowie verfahren zum elektrischen verbinden von mindestens zwei solarzellen zu einem solarmodul WO2011000629A2 (de)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020127002397A KR20120124052A (ko) 2009-06-29 2010-05-19 태양 전지용 포일형 전기 커넥터의 제조 방법, 이 제조 방법에 따라 제조된 연결 부재, 및 태양광 모듈을 형성하기 위해 2개 이상의 태양 전지를 전기적으로 연결하기 위한 방법
US13/381,263 US9307650B2 (en) 2009-06-29 2010-05-19 Method for manufacturing a foil-like electrical connector for connecting solar cells
JP2012518056A JP5409908B2 (ja) 2009-06-29 2010-05-19 太陽電池用のフィルム状電気コネクタを製造する方法、このようにして製造された接続エレメント、及び少なくとも２つの太陽電池を１つのソーラーモジュールへと電気的に接続する方法
CN201080038226.0A CN102473794B (zh) 2009-06-29 2010-05-19 用于为太阳能电池制造薄膜状电连接器的方法、这样制造的连接元件以及用于把至少两个太阳能电池电连接为太阳能模块的方法
EP10721480A EP2449601A2 (de) 2009-06-29 2010-05-19 Verfahren zur herstellung eines folienartigen elektrischen verbinders für solarzellen, derartig hergestelltes verbindungselement sowie verfahren zum elektrischen verbinden von mindestens zwei solarzellen zu einem solarmodul

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE102009030997 2009-06-29
DE102009030997.7 2009-06-29
DE102010004112A DE102010004112A1 (de) 2009-06-29 2010-01-07 Verfahren zur Herstellung eines folienartigen elektrischen Verbinders für Solarzellen, derartig hergestelltes Verbindungselement sowie Verfahren zum elektrischen Verbinden von mindestens zwei Solarzellen zu einem Solarmodul
DE102010004112.2 2010-01-07

Publications (2)

Publication Number Publication Date
WO2011000629A2 WO2011000629A2 (de) 2011-01-06
WO2011000629A3 true WO2011000629A3 (de) 2011-02-24

Family

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Application Number Title Priority Date Filing Date
PCT/EP2010/056899 WO2011000629A2 (de) 2009-06-29 2010-05-19 Verfahren zur herstellung eines folienartigen elektrischen verbinders für solarzellen, derartig hergestelltes verbindungselement sowie verfahren zum elektrischen verbinden von mindestens zwei solarzellen zu einem solarmodul

Country Status (7)

Country Link
US (1) US9307650B2 (de)
EP (1) EP2449601A2 (de)
JP (1) JP5409908B2 (de)
KR (1) KR20120124052A (de)
CN (1) CN102473794B (de)
DE (1) DE102010004112A1 (de)
WO (1) WO2011000629A2 (de)

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CN112599641B (zh) * 2020-12-18 2022-12-20 无锡奥特维科技股份有限公司 电池串生产方法
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US20120208411A1 (en) 2012-08-16
CN102473794B (zh) 2014-12-10
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