WO2010139138A1 - 基片和掩膜的夹持装置及使用该夹持装置的夹持方法 - Google Patents

基片和掩膜的夹持装置及使用该夹持装置的夹持方法 Download PDF

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Publication number
WO2010139138A1
WO2010139138A1 PCT/CN2009/073426 CN2009073426W WO2010139138A1 WO 2010139138 A1 WO2010139138 A1 WO 2010139138A1 CN 2009073426 W CN2009073426 W CN 2009073426W WO 2010139138 A1 WO2010139138 A1 WO 2010139138A1
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WIPO (PCT)
Prior art keywords
clamping
plate
magnetic suction
mask
suction plate
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Application number
PCT/CN2009/073426
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English (en)
French (fr)
Inventor
杨明生
范继良
余超平
王曼媛
Original Assignee
东莞宏威数码机械有限公司
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Application filed by 东莞宏威数码机械有限公司 filed Critical 东莞宏威数码机械有限公司
Publication of WO2010139138A1 publication Critical patent/WO2010139138A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips

Definitions

  • the present invention relates to a holding device, and more particularly to a holding device for holding a substrate and a mask in the organic light-emitting display industry. Background technique
  • OLED display is a new product in digital products.
  • OLED is an organic light-emitting diode (Organic Light-Emitting Diode). Because of its light weight, power saving and other characteristics, it has been widely used in the display of digital products. And it has a large market potential.
  • OLED organic Light-Emitting Diode
  • the application of OLED in the world is focused on flat panel displays, because OLED is the only technology that can be compared with TFT-LCD in application, and it is the only one that can be made in all display technologies.
  • OLED display organic-emitting display
  • TFT-LCD display liquid crystal display
  • the typical structure is to deposit a layer of tens of nanometers thick organic light-emitting material on the IT0 glass as a light-emitting layer, and a metal electrode with a low work function is arranged above the light-emitting layer. When a voltage is applied to the electrodes, the luminescent layer produces optical radiation.
  • the luminescent layer should be patterned.
  • the luminescent layer patterning is applied to a conductive glass substrate using a fine metal mask (MASK) to deposit the organic material in the evaporation source on the substrate to a desired pattern.
  • a special clamping device is required to capture the entire evaporation process
  • the substrate and mask are taken and a positioning and pressing device is required to bond the substrate and the mask together.
  • the traditional approach is to use the robot to grab the mask and the substrate separately, and place them on the mask pallet above the evaporation source, and then use the robot to align.
  • the technology of the clamping device for the substrate and/or the mask is mainly embodied in the following two patents:
  • the Chinese invention patent number is CN1901155A
  • the name of the invention is the clamping for manufacturing the organic light-emitting display.
  • the patent discloses a holder having a plurality of step support plates for holding articles by the side walls of the support plate, the holders simultaneously supporting the substrate, the film tray and the mask, and at the transfer substrate, the film The tray and the mask simultaneously hold the substrate, the film tray, and the mask.
  • the clamping technology integrated by electrostatic technology and computer technology can only clamp the substrate or the mask at a time, and can not simultaneously clamp the substrate and the mask.
  • the technical form is equivalent to the parameterization of the conventional technology, and the cost is relatively high. Expensive, high working environment requirements, is not conducive to the application of mass production of automated equipment.
  • the object of the present invention is to provide a substrate and a mask which have high precision of bonding and positioning, good bonding effect, simple operation, low cost, and can simultaneously hold the substrate and the mask in position. Film holding device.
  • Another object of the present invention is to provide a clamping method for a clamping device using a substrate and a mask, which has high precision of bonding and positioning of the substrate and the mask, good bonding effect, and simple operation. Cost Low and simultaneous clamping of the substrate and mask.
  • the technical solution of the present invention is: providing a substrate and a mask clamping device, wherein the mask is a magnetic mask, the clamping device comprises: a clamping plate, a magnetic suction plate, a magnetic force a suction plate driving device, a clip group, and a clamping driving device; the surrounding sides of the clamping plate have alternating convex portions and concave portions, and the convex portions and the concave portions are alternately distributed in a regular continuous square wave shape, and the The convex portion of the same side of the clamping plate and the concave portion are at least two; the magnetic suction plate is located directly above the clamping plate, and the magnetic suction plate has a permanent magnet distributed uniformly;
  • the magnetic suction plate driving device is connected to the magnetic suction plate for controlling the engagement and disengagement of the magnetic suction plate and the clamping plate; the concave portion of the clamping plate protrudes from the clamping plate a lower surface, the inner clip is for clamping a substrate, the outer
  • the permanent magnet protrusions are uniformly distributed on the lower surface of the magnetic suction plate, and the clamping plate has a groove for receiving the protruding permanent magnet.
  • the magnetic suction plate driving device drives the magnetic suction plate to be engaged with the clamping plate
  • the permanent magnet is recessed in the groove of the clamping plate, so that the magnetic force is generated by the magnetic suction plate.
  • the attraction is greater, so that the mask and the substrate are more closely attached and the fit is better.
  • the upper surface of the clamping plate has a protruding profiled rib
  • the magnetic suction plate has a profiled groove for accommodating the profiled strip
  • the profiled groove is symmetrically distributed on the magnetic suction plate.
  • the shaped groove disposed on the magnetic suction plate can effectively reduce the weight of the magnetic suction plate, thereby facilitating the separation and fitting of the magnetic suction plate from the clamping plate; the symmetric distribution of the shaped groove can prevent magnetic attraction
  • the center of gravity of the plate is changed so that the magnetic suction plate can be accurately aligned with the clamping plate; in addition, the symmetric distribution of the irregular groove ensures that the permanent magnet is evenly distributed on the magnetic suction plate.
  • the upper surface of the clamping plate has an outwardly extending alignment pin
  • the magnetic suction plate has an alignment hole for receiving the alignment pin.
  • the alignment hole and the alignment pin can prevent misalignment when the magnetic chuck is attached to the clamping plate.
  • the inner clip includes a left base, a right base, two torsion springs, a clamping block, a clip top post and a rotating shaft, and the left base and the right base are located on both sides of the clamping block, Rotating shaft through
  • one end of the clip top column is connected to the inner clamping driving device, and the other end is suspended directly above the top of the clamping block, and the bottom of the clamping block is bent inwardly to form
  • the clamping portion, the left base and the right base are connected to the recess of the clamping plate.
  • the inner clamping driving device drives the clip top post to press down against the top of the inner clip, and under the action of pressure, the rotating shaft rotates and the clamping portion opens downward
  • the inner clamp is opened; when the inner clamp needs to be closed, the inner clamping driving device drives the inner clamp top column to be reset, and the rotating shaft is rotated and reset by the action of the two torsion springs, The clamping portion is closed upwards such that the inner clip is closed.
  • the four corners of the lower surface of the magnetic suction plate have an outwardly extending magnetic suction plate top column
  • the clamping plate has a positioning hole through which the magnetic suction plate top column passes, the magnetic suction plate The top post is connected to the magnetic chuck driving device through the positioning hole, and the magnetic suction plate driving device controls the bonding of the magnetic suction plate and the clamping plate by driving the magnetic suction plate top column Get rid of.
  • the clamping method of the clamping device using the substrate and the mask of the present invention comprises the following steps: (1) the magnetic suction plate is located directly above the clamping plate and is detached from the clamping plate, and the The inner clamping drive opens the inner clamp, the inner clamp forms an inner clamping zone; (2) raises the substrate to the inner clamping zone formed by the inner clamp opening, and controls the inner clamping a driving device closing the inner clip; (3) controlling the outer clamping driving device to open the outer clip, the outer clip forming an outer clamping region; (4) raising the mask to the outer clip Opening the formed outer holding zone, controlling the outer clamping driving device to close the outer clamp; and (5) controlling the magnetic suction plate driving device to drive the magnetic suction plate to align with the clamping plate The film is bonded and attracted to the substrate by the magnetic force of the magnetic suction plate.
  • the method further comprises the following steps: (6) placing the mask and the substrate adhered by the magnetic attraction in the step (5) at a designated position; (7) controlling the magnetic force a suction plate driving device drives the magnetic suction plate to be disengaged from the clamping plate; (8) controlling the inner clamping device to open the inner and outer clamps; (9) controlling the outer clamping device to open the outer clamp.
  • the bonded substrate and mask can be placed in a specified position by the above steps.
  • the clamping device of the substrate and the mask of the present invention comprises a clamping plate, a magnetic suction plate, an inner clamp and an outer clamp which are all distributed around the clamping plate, and the magnetic suction plate and the clamping are controlled.
  • the magnetic suction plate driving device for detaching the plate the clamping driving device for controlling the opening and closing of the inner clip and the outer clip, so that when the substrate and the mask are clamped by the clamping device of the substrate and the mask of the invention, the clip can be clamped
  • the inner clip and the outer clip on the holding plate simultaneously clamp the substrate and the mask, thereby effectively reducing the production cycle of the device, and simplifying the layout and control of the device; and, due to the substrate and the mask ⁇ Mechanically clamping the inner clip and the outer clip evenly distributed over the entire circumference, assisting the use of a symmetrical magnetic force to bond the substrate and the mask, so that the alignment of the substrate and the mask can achieve a higher positioning accuracy and
  • the substrate and the mask have a good bonding effect, so that the production yield is high, the performance is superior, and the substrate and the mask to be held are not displaced during the transfer and the flipping, and the substrate to be clamped is not prevented.
  • Figure 1 is a schematic view showing the structure of a holding device for a substrate and a mask of the present invention.
  • Figure 2 is a schematic view showing the structure of a magnetic suction plate in the holding device of the substrate and the mask of the present invention.
  • Figure 3 is a schematic view showing the structure of a holding plate and a clip set in the holding device of the substrate and the mask of the present invention.
  • Figure 4 is a schematic view showing the operation of the holding device of the substrate and the mask of the present invention.
  • Figure 5 is an enlarged schematic view of a portion A of Figure 4.
  • Figure 6 is a flow chart showing a method of holding the substrate and the mask by the holding device of the substrate and the mask of the present invention. detailed description
  • the clamping device of the substrate and the mask of the present invention comprises a clamping plate 200, a magnetic suction plate 100, a magnetic suction plate driving device (not shown), a clip group, and a clamping driving device;
  • the side surfaces of the clamping plate 200 have alternating convex portions 302a and concave portions 301a, and the convex portions 302a and the concave portions 301a are alternately distributed in a regular continuous square wave shape, and the said side portions of the holding plate 200 are located on the same side of the holding plate 200.
  • the convex portion 302a and the concave portion 301a are at least two; the magnetic suction plate 100 is located directly above the clamping plate 200, and the magnetic suction plate 100 has a uniformly distributed permanent magnet 103; the magnetic force
  • the suction plate driving device is connected to the magnetic suction plate 100, and the magnetic suction plate driving device is configured to control the bonding and disengagement of the magnetic suction plate 100 and the clamping plate 200; the clip group includes an inner clamp 301.
  • the outer clip 302 is mounted on the concave portion 301a of the clamping plate 200 and protrudes from the lower surface of the clamping plate 200, and the inner clip 301 is used for clamping the substrate 400,
  • the outer clip 302 is mounted on the convex portion 302a of the clamping plate 200 and protrudes from the lower surface of the clamping plate 200.
  • the outer clip 302 is used for clamping the magnetic mask 500.
  • the mask 500 is magnetic.
  • the clamping device 500 includes an inner clamping driving device (not shown) and an outer clamping driving device (not shown) identical to the inner clamping driving device, the inner clamping A drive device is coupled to the inner clip and controls opening and closing of the inner clip 301, the outer clamp drive being coupled to the outer clip and controlling opening and closing of the outer clip 302. More specifically, the following is shown in conjunction with FIG. 2, FIG. 3, FIG. 4 and FIG.
  • the permanent magnets 103 are uniformly distributed on the lower surface of the magnetic chucking plate 100, and the holding plate 200 has a recess 203 for receiving the protruding permanent magnets 103.
  • the magnetic suction plate driving device drives the magnetic suction plate 100 to be engaged with the clamping plate 200, the permanent magnet 103 is received in the recess 203 of the clamping plate 200, so that the magnetic suction plate
  • the magnetic force generated by 100 is more attractive and uniform to the mask 500, so that the mask 500 and the substrate 400 are more closely attached, and the bonding effect is better.
  • the upper surface of the clamping plate 200 has a protruding shaped rib 201, and the magnetic absorbing plate 100 has a shaped groove 101 for accommodating the shaped strip; wherein the shaped groove 101 surrounds the permanent magnet
  • the portion of 103 is symmetrically distributed on the magnetic chuck 100, and the weight of the magnetic chuck 100 is reduced while ensuring that the center of gravity of the magnetic chuck is constant and the magnetic force is uniform.
  • the upper surface of the clamping plate 200 has an outwardly extending alignment pin 102 having an alignment aperture 202 that receives the alignment pin 102. The cooperation between the alignment hole 202 and the alignment pin 102 makes the magnetic suction plate 100 and the clamping plate 200 more precise, and effectively prevents the magnetic suction plate 100 from being adhered to the clamping plate 200. It is misplaced.
  • the inner clip 301 includes a left base 311, a right base 312, two torsion springs 313, a clamping block 314, a clip top post 315 and a rotating shaft 316.
  • the left base 311 and the right base 312 are located at the The two sides of the clamping block 314 pass through the clamping block 314 and are respectively pivotally connected to the left base 311 and the right base 312 respectively.
  • the torsion spring 313 has a cylindrical shape.
  • the torsion springs 313 are respectively disposed on the rotating shaft 316 and are respectively in contact with the left base 311 and the clamping block 314 and the right base 312 and the clamping block 314, and the clip top post 315 is end-to-end.
  • the clamping portion 301b is formed by bending, and the left base 311 and the right base 312 are coupled to the concave portion 301a of the clamping plate 200.
  • the inner clamping driving device drives the clip top post 315 to press down and contact the top of the clamping block 314 of the inner clip 301, and the clamping block 314 acts under pressure. Rotating about the rotating shaft 316, the clamping block 314 is rotated about the rotating shaft 316 such that the inner clip 301 is opened and forms an inner clamping zone 301c for clamping the substrate 400.
  • the substrate 400 is carried on the clamping portion 301b forming the inner clamping region 301c; when the inner clamp 301 needs to be closed, the inner clamping driving device drives the clip top pillar 315 Resetting, under the action of the two torsion springs 313, the rotating shaft 316 is rotationally reset, and the clamping block 314 is rotated to close the inner clip 301.
  • the outer clip 302 has the same structure as the inner clip 301, and the outer clip 302 includes a left base 321, a right base 322, two torsion springs 323, a clamping block 324, a clip top post 325, and a rotating shaft 326.
  • the clip top post 325 is connected to the outer clamping driving device, and the other end is suspended directly above the top of the clamping block 324.
  • the left base 321 and the right base 322 are connected to the clamping.
  • the outer clamping drive device drives the clip top post 325 to press down and contact the top of the clamping block 324 of the outer clip 302.
  • the clamping block 324 acts under pressure.
  • the lower rotating shaft 326 rotates, the clamping block 324 rotates around the rotating shaft 326 such that the outer clip 302 opens and forms an outer clamping zone 302c, and the outer clamping zone 302c is used for clamping the mask 500.
  • the mask 500 is carried on the clamping portion 302b forming the outer clamping region 301c; when the outer clip 302 needs to be closed, the outer clamping driving device drives the clip top post 325 to be reset. Under the action of the two torsion springs 323, the rotating shaft 326 is rotationally reset, and the clamping block 324 is rotated to close the outer clip 302.
  • the four corners of the lower surface of the magnetic suction plate 100 have an outwardly extending magnetic suction plate top post 600
  • the clamping plate 200 has a positioning hole 200a through which the magnetic suction plate top post 600 passes.
  • the magnetic suction plate top post 600 is connected to the magnetic suction plate driving device through the positioning hole 200a, and the magnetic suction plate driving device controls the magnetic suction plate 100 by driving the magnetic suction plate top column 600
  • the clamping plate 200 is attached and detached.
  • (S1) the magnetic suction plate is located directly above the clamping plate and is detached from the clamping plate, and is controlled
  • the inner clamping drive opens an inner clamp, the inner clamp forming an inner clamping zone
  • (S5) controlling the magnetic chuck driving device to drive the magnetic chuck to align with the clamping plate, and attracting the mask and the substrate by magnetic force of the magnetic chuck.
  • the mask and the substrate are separated from the holding device of the substrate and the mask of the present invention.
  • step (S5) the following steps are further included:
  • the clamping device of the substrate and the mask of the present invention When the clamping device of the substrate and the mask of the present invention is in an initial state, that is, the magnetic chucking plate 100 is suspended directly above the clamping plate 200 through the magnetic suction plate top post 600, the inner clip 301 passes through the The clip top post 315 is coupled to the inner grip drive and the inner clip 301 is in a closed state, the outer clip 302 is coupled to the outer grip drive by the clip top post 325 and the outer clip The 301 is in a closed state, and when the substrate 400 and the mask 500 are clamped, the inner clamping driving device drives the clip top post 315 to press against the top of the clamping block 314 of the inner clip 301, so that the inner clip 301 The clamping block 314 is rotated about the rotating shaft 316, so that the inner clip 301 is in an open state, and the inner clip 301 is opened to form an inner clamping portion 301c for holding the substrate 400, and the substrate 400 is raised at this time.
  • the inner clamping driving device drives the clip top post 315 to be reset, and the inner clip 301 is closed by the inner clamping driving device, and the substrate 400 is carried at this time.
  • the outer clamping driving device driving the clip top post 325 of the outer clip 302 to be pressed
  • the top of the clamping block 324 of the outer clip 302 rotates the clamping block 32 of the inner and outer clips 302 about the rotating shaft 326, so that the outer clip 302 is in an open state, and the inner clip 302 is opened to form an outer surface of the mask 500.
  • the mask 500 is carried on the clamping portion 302b forming the outer clamping region 302c, thereby completing the grasping and clamping of the mask 500;
  • the plate driving device drives the magnetic suction plate top column 600 to move, so that the magnetic suction plate 100 is aligned
  • the magnetic sheet 50 is applied to the clamping plate 200 to generate a uniform magnetic force to attract the magnetic mask 500 to bond the mask 500 to the substrate 400 to complete the clamping and bonding process of the substrate 400 and the mask 500.
  • the magnetic suction plate driving device is controlled to drive the magnetic suction plate 100 to disengage from the clamping plate 200, and then the inner clamp 301 is opened first, and then The outer clip 302 is opened, so that the substrate 400 and the mask 500 are simultaneously lowered, and finally the inner clip 301 and the outer clip 302 are closed, thereby completing the placing of the bonded substrate 400 and the mask 500 in the designated working position, which is the next step.
  • the process of the substrate 400 and the mask 500 provides good bonding precision and performance.
  • the clamping device for the substrate and the mask of the present invention comprises a clamping plate 200, a magnetic suction plate 100, an inner clip 301 and an outer clip 302 evenly distributed around the clamping plate 200, and controls the magnetic suction plate 100 to be separated from the clamping plate 200.
  • the inner clip 301 and the outer clip 302 on the clamping plate 200 can simultaneously clamp the substrate 400 and the mask 500 respectively, thereby effectively reducing the production cycle of the device, and simplifying the layout of the device.
  • the substrate 400 and the mask 500 are mechanically clamped by the inner clip 301 and the outer clip 302 which are evenly distributed over the entire circumference, the substrate 400 and the mask 500 are assisted by using a uniform magnetic force.
  • the alignment of the substrate 400 and the mask 500 is achieved to achieve a higher positioning accuracy, and the substrate 400 and the mask 500 are attached to each other, thereby achieving high production yield and superior performance, and Ensure that the clamped substrate and mask are not misaligned during transfer and flipping, ensuring that the substrate being held is not scratched.

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Description

基片和掩膜的夹持装置及使用该夹持装置的夹持方法 技术领域
本发明涉及一种夹持装置， 尤其涉及一种用于夹持有机发光显示屏行业中 的基片和掩膜的夹持装置。 背景技术
随着经济的不断发展、 科技的不断进步和世界能源的日益减少， 人们在生 产中越来越重视能源的节约及利用效率， 使得人与自然和谐发展以满足中国新 型的工业化道路要求。
例如， 在数码产品的显示产业中， 企业为了节约能源、 降低生产成本， 都 加大投资研发力度， 不断地追求节能的新产品。 其中， OLED显示屏就是数码产 品中的一种新产品， OLED即有机发光二极管（ Organic Light-Emitting Diode ), 因为具备轻薄、 省电等特性， 因此在数码产品的显示屏上得到了广泛应用， 并且具有较大的市场潜力， 目前世界上对 OLED 的应用都聚焦在平板显示 器上， 因为 OLED是唯一在应用上能和 TFT-LCD相提并论的技术， 且是目 前所有显示技术中，唯一可制作大尺寸、高亮度、高分辨率软屏的显示技术， 可以做成和紙张一样的厚度； 但 OLED显示屏（有机发光显示屏）与传统的 TFT-LCD 显示屏 （液晶显示屏） 并不同， 其无需背光灯， 釆用非常薄的有 机材料涂层和玻璃基片， 当有电流通过时， 这些有机材料就会发光， 而且 OLED显示屏可以做得更轻更薄， 可视角度更大， 并且能够显著节省电能； 相应地， 制造 OLED显示屏的所有设备必须要保证 OLED显示屏的精度要 求。 OLED显示屏是基于有机材料的一种电流型半导体发光器件。 其典型结构 是在 IT0玻璃上蒸镀一层几十纳米厚的有机发光材料作发光层， 发光层上方有 一层低功函数的金属电极。 当电极上加有电压时， 发光层就产生光辐射。
为了使其能够全彩色显示装置， 发光层应被图案化。 通常发光层图案化是 利用精细金属掩膜（MASK )贴合在导电玻璃基片上， 使蒸发源中的有机材料在 基板上沉积为所要求的图案。 在整个蒸镀过程中需要一种特殊的夹持装置来抓 取基片和掩膜， 并需要一个定位压合装置将基片和掩膜贴合在一起。 传统的做 法是是利用机械手分别抓取掩膜和基片， 并将其放置在蒸发源上方的掩膜托板 上， 再利用机械手进行对位。
目前国内外关于对基片和 /掩膜的夹持装置的技术主要体现在以下两个专 利中： 如， 中国发明专利公开号为 CN1901155A, 发明创造的名称为用于制造有 机发光显示器的夹持器， 该专利公开了一种具有多个台阶支撑板的夹持器， 利 用支撑板的侧壁夹持物件， 该夹持器可同时支撑基底、 膜托盘和掩膜， 并且在 传送基底、 膜托盘和掩膜的同时夹持基底、 膜托盘和掩膜。 利用上述台阶支撑 板式的夹持器来夹持基片和 /或掩膜时， 因其对基片或 /和掩膜的约束只有在周 边上且基片或 /和掩膜与约束侧壁具有间隙， 所以其传输方式只能在平面内传 输， 不能实现翻转或倾斜传输， 同时台阶的设计使基片和掩膜间存在距离差， 使基片和掩膜在贴合时位置精确度难以保证， 同时在传输时有相互磨损的可能 性， 影响生产的成品率； 中国发明专利公开号为 CN141 1026A, 发明名称为夹持 基片的方法和装置， 该申请公开了一种以静电方法夹紧和夹持基片的静电卡盘， 并能够计算夹紧力和基片每时刻经受的加速度， 从而改变夹紧电源的夹紧电压 输出， 使静电卡盘产生合适的夹紧力。 用静电技术和计算机技术集成的夹持技 术每次只能夹持基片或掩膜， 不能对基片和掩膜进行同时夹持， 其技术形式相 当于将传统技术的参数化， 且成本较为昂贵， 工作环境要求较高， 不利于自动 化设备量产的应用。
因此， 急需一种基片和掩膜的贴合定位精确度高、 贴合效果好、 操作简单、 成本低且可同时对基片和掩膜进行对位夹持的夹持装置。 发明内容
本发明的目的在于提供一种基片和掩膜的贴合定位精确度高、 贴合效果好、 操作简单、 成本低且可同时对基片和掩膜进行对位夹持的基片和掩膜的夹持装 置。
本发明的另一目的在于提供一种使用基片和掩膜的夹持装置的夹持方法， 该夹持方法使基片和掩膜的贴合定位精确度高、 贴合效果好、 操作简单、 成本 低且可同时对基片和掩膜进行对位夹持。
为了实现上述目的， 本发明的技术方案为： 提供一种基片和掩膜的夹持装 置， 所述掩膜为磁性掩膜， 所述夹持装置包括： 夹持板、 磁力吸板、 磁力吸板 驱动装置、 夹子组、 夹持驱动装置； 所述夹持板四周侧面均具有交替分布的凸 部及凹部， 所述凸部与所述凹部交替分布呈规则的连续方波状， 位于所述夹持 板的同一侧面的所述凸部与所述凹部至少为两个； 所述磁力吸板位于所述夹持 板的正上方， 且所述磁力吸板上具有均勾分布的永磁体； 所述磁力吸板驱动装 置与所述磁力吸板连接， 用于控制所述磁力吸板与所述夹持板的贴合和脱离； 夹持板的凹部处且突出于所述夹持板的下表面， 所述内夹子用于夹持基片， 所 述外夹子安装于所述夹持板的凸部处且突出于所述夹持板的下表面， 所述外夹 子用于夹持掩膜； 所述夹持驱动装置包括内夹持驱动装置和与所述内夹持驱动 装置相同的外夹持驱动装置， 所述内夹持驱动装置控制内夹子的打开和关闭， 所述外夹持驱动装置控制外夹子的打开和关闭。
较佳地， 所述永磁体突出均勾分布于所述磁力吸板的下表面， 所述夹持板 上具有容置突出的永磁体的凹槽。 当所述磁力吸板驱动装置驱动所述磁力吸板 与所述夹持板贴合时， 永磁体凹于所述夹持板的凹槽内， 使得所述磁力吸板产 生的磁力对掩膜的吸引力更大， 从而使掩膜和基片贴合的更加紧密， 贴合效果 更好。
较佳地， 所述夹持板的上表面具有突出的异形凸条， 所述磁力吸板具有容 置异形条的异形槽， 且所述异形槽对称的分布在所述磁力吸板上。 设置于所述 磁力吸板上的异形槽可以有效地减轻磁力吸板的重量， 从而方便所述磁力吸板 与所述夹持板脱离和贴合； 所述异形槽的对称分布可以防止磁力吸板的重心改 变， 使得磁力吸板可以准确地与所述夹持板对位贴合； 另， 所述异形槽的对称 分布还保证了所述永磁体在所述磁力吸板上分布均匀。
较佳地， 所述夹持板的上表面具有向外延伸的对位销， 所述磁力吸板具有 容置所述对位销的对位孔。 所述对位孔和对位销可以防止磁力吸板与所述夹持 板贴合时产生错位。 较佳地， 所述内夹子包括左底座、 右底座、 两扭转弹簧、 夹持块、 夹子顶 柱及转动轴， 所述左底座与所述右底座位于所述夹持块两侧， 所述转动轴穿过
与夹持块之间， 所述夹子顶柱一端与所述内夹持驱动装置连接， 另一端悬置于 所述夹持块的顶部正上方， 所述夹持块的底部向内弯折形成夹持部， 所述左底 座与所述右底座连接于所述夹持板的凹部。 当需要打开所述内夹子时， 所述内 夹持驱动装置驱动所述夹子顶柱下压接触所述内夹子顶部， 在压力作用下， 所 述转动轴旋转且所述夹持部向下开合使得所述内夹子打开； 当需要关闭所述内 夹子时， 所述内夹持驱动装置驱动所述内夹子顶柱复位， 在两扭转弹簧的作用 下， 所述转动轴旋转复位， 所述夹持部向上闭合使得所述内夹子关闭。
较佳地， 所述磁力吸板的下表面的四角具有向外延伸的磁力吸板顶柱， 所 述夹持板具有供所述磁力吸板顶柱穿过的定位孔， 所述磁力吸板顶柱穿过所述 定位孔与所述磁力吸板驱动装置连接， 所述磁力吸板驱动装置通过驱动所述磁 力吸板顶柱控制所述磁力吸板与所述夹持板的贴合和脱离。
本发明使用基片和掩膜的夹持装置的夹持方法， 包括以下步骤： （1 ) 所述 磁力吸板位于所述夹持板的正上方且与所述夹持板脱离， 控制所述内夹持驱动 装置打开内夹子， 所述内夹子形成一个内夹持区； （2 )将所述基片升至所述内 夹子打开所形成的内夹持区内， 控制所述内夹持驱动装置闭合所述内夹子； （ 3 ) 控制所述外夹持驱动装置打开所述外夹子， 所述外夹子形成一个外夹持区； （4 ) 将所述掩膜升至所述外夹子打开所形成的外加持区内， 控制所述外夹持驱动装 置将所述外夹子闭合； 及（5 )控制所述磁力吸板驱动装置驱动所述磁力吸板与 所述夹持板对位贴合， 并通过磁力吸板的磁力吸引所述掩膜和所述基片贴合。
较佳地， 所述步骤（5 )之后还包括以下步骤： （6 )将所述步骤（5 ) 中通 过磁力吸引贴合的掩膜和基片放置在指定位置； （7 )控制所述磁力吸板驱动装 置驱动所述磁力吸板与所述夹持板脱离； ( 8 )控制所述内夹持装置打开所述内 外夹子； （9 )控制所述外夹持装置打开所述外夹子。 通过上述步骤可以将已贴 合的基片和掩膜放置在指定的位置上。 与现有技术相比， 由于本发明基片和掩膜的夹持装置包括夹持板、 磁力吸 板、 均勾分布在夹持板四周的内夹子和外夹子、 控制磁力吸板与夹持板脱离的 磁力吸板驱动装置、 控制内夹子和外夹子打开和关闭的夹持驱动装置， 使得釆 用本发明基板和掩膜的夹持装置对基板和掩膜进行夹持时， 可使夹持板上的内 夹子和外夹子同时分别对基板和掩膜进行夹持， 从而有效地降低设备的生产周 期， 同时还简化了设备的布局与控制； 另， 又由于基片与掩膜四边都釆用整周 均匀分布的内夹子与外夹子进行机械夹持， 辅助使用匀称的磁力进行基片与掩 膜的贴合， 使基片和掩膜的对位贴合达到较高的定位精度且基片与掩膜贴合效 果好， 从而使得生产成品率高， 性能优越， 并且保证夹持的基片和掩膜在传送、 翻转时不会产生错位， 确保被夹持的基片不会被划损。 附图说明
图 1是本发明基片和掩膜的夹持装置的结构示意图。
图 2是本发明基片和掩膜的夹持装置中的磁力吸板的结构示意图。
图 3是本发明基片和掩膜的夹持装置中的夹持板和夹子组的结构示意图。 图 4是本发明基片和掩膜的夹持装置的工作示意图。
图 5是图 4中 A部分的放大示意图。
图 6是本发明基片和掩膜的夹持装置夹持基片和掩膜的夹持方法的流程图。 具体实施方式
如图 1所示，本发明基片和掩膜的夹持装置包括夹持板 200、磁力吸板 100、 磁力吸板驱动装置（图中未示）、 夹子组、 夹持驱动装置； 所述夹持板 200四周 侧面均具有交替分布的凸部 302a及凹部 301a , 所述凸部 302a与所述凹部 301a 交替分布呈规则的连续方波状，位于所述夹持板 200的同一侧面的所述凸部 302a 与所述凹部 301 a至少为两个；所述磁力吸板 100位于所述夹持板 200的正上方， 且所述磁力吸板 100上具有均匀分布的永磁体 103;所述磁力吸板驱动装置与所 述磁力吸板 100连接， 所述磁力吸板驱动装置用于控制所述磁力吸板 100与所 述夹持板 200的贴合和脱离； 所述夹子组包括内夹子 301及与所述内夹子相同 的外夹子 302 , 所述内夹子 301安装于所述夹持板 200的凹部 301a处且突出于 所述夹持板 200的下表面， 所述内夹子 301用于夹持基片 400, 所述外夹子 302 安装于所述夹持板 200的凸部 302a处且突出于所述夹持板 200的下表面， 所述 外夹子 302用于夹持磁性掩膜 500 , 所述掩膜 500为磁性掩膜 500; 所述夹持驱 动装置包括内夹持驱动装置 （图中未示）和与所述内夹持驱动装置相同的外夹 持驱动装置（图中未示）， 所述内夹持驱动装置与所述内夹子相连并控制内夹子 301的打开和关闭，所述外夹持驱动装置与所述外夹子相连并控制外夹子 302的 打开和关闭。 更具体地， 结合图 2、 图 3、 图 4及图 5所示如下：
较佳者， 所述永磁体 103突出均匀分布于所述磁力吸板 100的下表面， 所 述夹持板 200上具有容置突出的永磁体 103的凹槽 203。当所述磁力吸板驱动装 置驱动所述磁力吸板 100与所述夹持板 200贴合时， 永磁体 103容置于所述夹 持板 200的凹槽 203内， 使得所述磁力吸板 100产生的磁力对掩膜 500的吸引 力更大、 更均匀， 从而使掩膜 500和基片 400贴合的更加紧密， 贴合效果更好。
较佳者， 所述夹持板 200的上表面具有突出的异形凸条 201 , 所述磁力吸板 100具有容置异形条的异形槽 101 ; 其中， 所述异形槽 101绕开所述永磁体 103 的部位且对称地分布在所述磁力吸板 100上， 在减轻所述磁力吸板 100重量的 同时保证了所述磁力吸板的重心不变且磁力均匀。 更具体地， 所述夹持板 200 的上表面具有向外延伸的对位销 102 , 所述磁力吸板 100 具有容置所述对位销 102的对位孔 202。 通过所述对位孔 202与所述对位销 102的配合使得磁力吸板 100与所述夹持板 200贴合更精准， 有效的防止了磁力吸板 100与所述夹持板 200贴合时产生错位。
较佳者， 所述内夹子 301包括左底座 311、 右底座 312、 两扭转弹簧 313、 夹持块 314、 夹子顶柱 315及转动轴 316 , 所述左底座 311与所述右底座 312位 于所述夹持块 314两侧， 所述转动轴 316穿过所述夹持块 314且两端分别与所 述左底座 311及右底座 312枢接， 所述扭转弹簧 313呈圓柱形， 所述两扭转弹 簧 313均穿于所述转动轴 316之上且分别抵触于左底座 311与夹持块 314和右 底座 312与夹持块 314之间， 所述夹子顶柱 315 —端与所述内夹持驱动装置连 接， 另一端悬置于所述夹持块 314的顶部正上方， 所述夹持块 314的底部向内 弯折形成夹持部 301b,所述左底座 311与所述右底座 312连接于所述夹持板 200 的凹部 301a。 当需要打开所述内夹子 301时， 所述内夹持驱动装置驱动所述夹 子顶柱 315下压并接触所述内夹子 301 的夹持块 314的顶部， 所述夹持块 314 在压力作用下绕转动轴 316转动， 所述夹持块 314绕所述转动轴 316旋转使得 所述内夹子 301打开并形成内夹持区 301 c , 所述内夹持区 301c用于夹持基片 400, 具体地， 所述基片 400承载于形成所述内夹持区 301c的夹持部 301b上； 当需要关闭所述内夹子 301时， 所述内夹持驱动装置驱动所述夹子顶柱 315复 位， 在两扭转弹簧 313的作用下， 所述转动轴 316旋转复位， 所述夹持块 314 旋转使得所述内夹子 301 关闭。 更具体地， 所述外夹子 302与所述内夹子 301 结构相同， 所述外夹子 302包括左底座 321、 右底座 322、 两扭转弹簧 323、 夹 持块 324、 夹子顶柱 325及转动轴 326，所述夹子顶柱 325—端与所述外夹持驱 动装置连接， 另一端悬置于夹持块 324的顶部正上方， 所述左底座 321与所述 右底座 322连接于所述夹持板 200的凸部 302a。当需要打开所述外夹子 302时， 所述外夹持驱动装置驱动所述夹子顶柱 325下压并接触所述外夹子 302的夹持 块 324的顶部， 所述夹持块 324在压力作用下绕转动轴 326转动， 所述夹持块 324绕所述转动轴 326旋转使得所述外夹子 302打开并形成外夹持区 302c , 所 述外夹持区 302c用于夹持掩膜 500 , 具体地， 所述掩膜 500承载于形成所述外 夹持区 301c的夹持部 302b上； 当需要关闭所述外夹子 302时， 所述外夹持驱 动装置驱动所述夹子顶柱 325复位， 在两扭转弹簧 323的作用下， 所述转动轴 326旋转复位， 所述夹持块 324旋转使得所述外夹子 302关闭。
较佳者， 所述磁力吸板 100 的下表面的四角具有向外延伸的磁力吸板顶柱 600, 所述夹持板 200具有供所述磁力吸板顶柱 600穿过的定位孔 200a , 所述磁 力吸板顶柱 600穿过所述定位孔 200a与所述磁力吸板驱动装置连接， 所述磁力 吸板驱动装置通过驱动所述磁力吸板顶柱 600控制所述磁力吸板 100与所述夹 持板 200的贴合和脱离。
结合图 6所示， 对使用本发明基片和掩膜的夹持装置夹持对基片 400和掩 膜 500进行夹持的夹持方法做详细的说明， 具体步骤如下：
( S1 ) 所述磁力吸板位于所述夹持板的正上方且与所述夹持板脱离， 控制 所述内夹持驱动装置打开内夹子， 所述内夹子形成一个内夹持区；
( 52 )将所述基片升至所述内夹子打开所形成的内夹持区内， 控制所述内 夹持驱动装置闭合所述内夹子；
( 53 )控制所述外夹持驱动装置打开所述外夹子， 所述外夹子形成一个外 夹持区；
( 54 )将所述掩膜升至所述外夹子打开所形成的外加持区内， 控制所述外 夹持驱动装置将所述外夹子闭合； 及
( S5 )控制所述磁力吸板驱动装置驱动所述磁力吸板与所述夹持板对位贴 合， 并通过磁力吸板的磁力吸引所述掩膜和所述基片贴合。
较佳者， 当需要对贴合好的掩膜和基片进行下一步工序时， 还需将贴 合好的掩膜和基片从本发明基片和掩膜的夹持装置中脱离，因此，上述步骤（ S5 ) 之后还包括如下步骤：
( S6 )将所述步骤（S5 ) 中通过磁力吸引贴合的掩膜和基片放置在指定位 置；
( S7 )控制所述磁力吸板驱动装置驱动所述磁力吸板与所述夹持板脱离； ( S8 )控制所述内夹持装置打开所述内外夹子；
( S9 )控制所述外夹持装置打开所述外夹子，将所述基片和所述掩膜同时放 下。
结合图 1至图 6对本发明基片和掩膜的夹持装置的工作原理和过程作一下 详细的说明：
本发明基片和掩膜的夹持装置处于初始状态时， 即所述磁力吸板 100通过 所述磁力吸板顶柱 600悬于所述夹持板 200正上方， 所述内夹子 301通过所述 夹子顶柱 315与所述内夹持驱动装置相连且所述内夹子 301处于关闭状态， 所 述外夹子 302通过所述夹子顶柱 325与所述外夹持驱动装置相连且所述外夹子 301处于关闭状态， 当对基片 400和掩膜 500进行夹持时， 所述内夹持驱动装置 驱动所述夹子顶柱 315压触内夹子 301的夹持块 314的顶部， 使内夹子 301的 夹持块 314绕转轴 316转动， 从而使得内夹子 301处于打开状态， 所述内夹子 301打开形成夹持所述基片 400的内夹持区 301 c , 此时升高基片 400至所述内 夹持区 301c处， 再使所述内夹持驱动装置驱动所述夹子顶柱 315复位， 所述内 夹子 301在所述内夹持驱动装置的作用下关闭， 此时所述基片 400承载于所述 形成所述内夹持区 301c的夹持部 301b上， 从而完成对基片 400的抓取夹持； 所述外夹持驱动装置驱动所述外夹子 302的夹子顶柱 325压触外夹子 302的夹 持块 324的顶部， 使内外夹子 302的夹持块 32绕转轴 326转动， 从而使得外夹 子 302处于打开状态， 所述内夹子 302打开形成夹持所述掩膜 500的外夹持区 302c , 此时升高掩膜 500至所述外夹持区 302c处， 再使所述外夹持驱动装置驱 动所述夹子顶柱 325复位， 所述外夹子 302在所述外夹持驱动装置的作用下关 闭， 此时所述掩膜 500承载于所述形成所述外夹持区 302c的夹持部 302b上， 从而完成对掩膜 500 的抓取夹持； 所述磁力吸板驱动装置驱动所述磁力吸板顶 柱 600动作， 使磁力吸板 100对位贴合在夹持板 200上， 磁力吸板 100上产生 均匀的磁力吸引磁性掩膜 500使掩膜 500与基片 400贴合， 完成基片 400和掩 膜 500的夹持贴合过程。
根据实际需要， 将已贴合的基片 400和掩膜 500放置在确定位置后， 控制 磁力吸板驱动装置驱动所述磁力吸板 100与夹持板 200脱离， 然后先打开内夹 子 301 , 再打开外夹子 302 , 使得基片 400和掩膜 500同时放下， 最后使内夹子 301和外夹子 302闭合，从而完成将贴合的基片 400和掩膜 500放置在指定的工 作位置， 为下一步对基片 400和掩膜 500的工序提供良好的贴合精度和性能。
本发明基片和掩膜的夹持装置包括夹持板 200、 磁力吸板 100、 均匀分布在 夹持板 200四周的内夹子 301和外夹子 302、控制磁力吸板 100与夹持板 200脱 离与贴合的磁力吸板驱动装置、 控制内夹子 301和外夹子 302打开和关闭的夹 持驱动装置， 使得釆用本发明基板和掩膜的夹持装置对基板 400和具有磁性的 掩膜 500进行夹持时， 可使夹持板 200上的内夹子 301和外夹子 302同时分别 对基板 400和掩膜 500进行夹持， 从而有效地降低设备的生产周期， 同时还简 化了设备的布局与控制； 另， 又由于基片 400与掩膜 500四边都釆用整周均匀 分布的内夹子 301与外夹子 302进行机械夹持， 辅助使用匀称的磁力进行基片 400与掩膜 500的贴合，使基片 400和掩膜 500的对位贴合达到较高的定位精度 且基片 400与掩膜 500贴合效果好， 从而使得生产成品率高， 性能优越， 并且 保证夹持的基片和掩膜在传送、 翻转时不会产生错位， 确保被夹持的基片不会 被划损。
本发明基片和掩膜的夹持装置所涉及的夹持驱动装置及磁力吸板驱动装置 的工作原理和过程， 均为本领域普通技术人员所熟知， 在此不再做详细的说明。
以上所揭露的仅为本发明的优选实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明申请专利范围所作的等同变化， 仍属本发明所涵盖 的范围。

Claims

权 利 要 求
1、 一种基片和掩膜的夹持装置， 其特征在于： 所述掩膜为磁性掩膜， 所述夹持 装置包括：
夹持板， 所述夹持板四周侧面均具有交替分布的凸部及凹部， 所述凸部与 所述凹部交替分布呈规则的连续方波状， 位于所述夹持板的同一侧面的所述凸 部与所述 部至少为两个；
磁力吸板， 所述磁力吸板位于所述夹持板的正上方， 所述磁力吸板上具有均 匀分布的永磁体；
与所述磁力吸板连接的磁力吸板驱动装置，所述磁力吸板驱动装置用于控制 所述磁力吸板与所述夹持板的贴合和脱离； 安装于所述夹持板的凹部处且突出于所述夹持板的下表面， 所述内夹子用于夹 持基片， 所述外夹子安装于所述夹持板的凸部处且突出于所述夹持板的下表面， 所述外夹子用于夹持掩膜； 及
夹持驱动装置，所述夹持驱动装置包括内夹持驱动装置和与所述内夹持驱动 装置相同的外夹持驱动装置， 所述内夹持驱动装置控制内夹子的打开和关闭， 所述外夹持驱动装置控制外夹子的打开和关闭。
2、 如权利要求 1所述的基片和掩膜的夹持装置， 其特征在于： 所述永磁体突出 均匀分布于所述磁力吸板的下表面， 所述夹持板上具有容置突出的永磁体的凹 槽。
3、 如权利要求 1所述的基片和掩膜的夹持装置， 其特征在于： 所述夹持板的上 表面具有突出的异形凸条， 所述磁力吸板具有容置异形条的异形槽， 且所述异 形槽对称的分布在所述磁力吸板上。
4、 如权利要求 1所述的基片和掩膜的夹持装置， 其特征在于： 所述夹持板的上 表面具有向外延伸的对位销， 所述磁力吸板具有容置所述对位销的对位孔。
5、 如权利要求 1所述的基片和掩膜的夹持装置， 其特征在于： 所述内夹子包括 左底座、 右底座、 两扭转弹簧、 夹持块、 夹子顶柱及转动轴， 所述左底座与所 述右底座位于所述夹持块两侧， 所述转动轴穿过所述夹持块且两端分别与所述 左底座及右底座枢接， 所述扭转弹簧呈圓柱形， 所述两扭转弹簧均穿于所述转 动轴之上且分别抵触于左底座与夹持块和右底座与夹持块之间， 所述夹子顶柱 一端与所述内夹持驱动装置连接， 另一端悬置于所述夹持块的顶部正上方， 所 述夹持块的底部向内弯折形成夹持部， 所述左底座与所述右底座连接于所述夹 持板的凹部。
6、 如权利要求 1所述的基片和掩膜的夹持装置， 其特征在于： 所述磁力吸板的 下表面的四角具有向外延伸的磁力吸板顶柱， 所述夹持板具有供所述磁力吸板 顶柱穿过的定位孔， 所述磁力吸板顶柱穿过所述定位孔与所述磁力吸板驱动装 置连接， 所述磁力吸板驱动装置通过驱动所述磁力吸板顶柱控制所述磁力吸板 与所述夹持板的贴合和脱离。
7、 一种使用如权利要求 1所述的基片和掩膜的夹持装置的夹持方法， 其特征在 于， 包括以下步骤：
( 1 ) 所述磁力吸板位于所述夹持板的正上方且与所述夹持板脱离， 控制所 述内夹持驱动装置打开内夹子， 所述内夹子形成一个内夹持区；
( 2 )将所述基片升至所述内夹子打开所形成的内夹持区内， 控制所述内夹 持驱动装置闭合所述内夹子；
( 3 )控制所述外夹持驱动装置打开所述外夹子， 所述外夹子形成一个外夹 持区；
( 4 )将所述掩膜升至所述外夹子打开所形成的外加持区内， 控制所述外夹 持驱动装置将所述外夹子闭合； 及 ( 5 )控制所述磁力吸板驱动装置驱动所述磁力吸板与所述夹持板对位贴合, 并通过磁力吸板的磁力吸引所述掩膜和所述基片贴合。
8、 如权利要求 7所述的夹持方法， 其特征在于： 所述步骤（5)之后还包括以 下步骤：
(6)将所述步骤（5) 中通过磁力吸引贴合的掩膜和基片放置在指定位置; ( 7 )控制所述磁力吸板驱动装置驱动所述磁力吸板与所述夹持板脱离；
(8)控制所述内夹持装置打开所述内外夹子；
(9)控制所述外夹持装置打开所述外夹子。
PCT/CN2009/073426 2009-06-04 2009-08-21 基片和掩膜的夹持装置及使用该夹持装置的夹持方法 WO2010139138A1 (zh)

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