CN102184934B - 掩膜板真空对位装置 - Google Patents
掩膜板真空对位装置 Download PDFInfo
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- CN102184934B CN102184934B CN2011100842580A CN201110084258A CN102184934B CN 102184934 B CN102184934 B CN 102184934B CN 2011100842580 A CN2011100842580 A CN 2011100842580A CN 201110084258 A CN201110084258 A CN 201110084258A CN 102184934 B CN102184934 B CN 102184934B
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN2011100842580A CN102184934B (zh) | 2011-04-02 | 2011-04-02 | 掩膜板真空对位装置 |
Applications Claiming Priority (1)
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CN2011100842580A CN102184934B (zh) | 2011-04-02 | 2011-04-02 | 掩膜板真空对位装置 |
Publications (2)
Publication Number | Publication Date |
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CN102184934A CN102184934A (zh) | 2011-09-14 |
CN102184934B true CN102184934B (zh) | 2012-07-04 |
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Application Number | Title | Priority Date | Filing Date |
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CN2011100842580A Expired - Fee Related CN102184934B (zh) | 2011-04-02 | 2011-04-02 | 掩膜板真空对位装置 |
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CN (1) | CN102184934B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103730321B (zh) * | 2013-12-24 | 2016-08-24 | 苏州市奥普斯等离子体科技有限公司 | 一种芯片等离子体表面处理装置 |
CN108064316B (zh) * | 2016-12-28 | 2020-10-27 | 深圳市柔宇科技有限公司 | 蒸镀机对位系统及蒸镀机对位系统选取方法 |
CN108091603B (zh) * | 2017-12-13 | 2020-07-21 | 京东方科技集团股份有限公司 | 对位方法和装置 |
CN111336338B (zh) * | 2018-12-18 | 2022-03-29 | 沈阳新松机器人自动化股份有限公司 | 真空腔室用旋转伸缩密封结构 |
CN111623753A (zh) * | 2020-06-15 | 2020-09-04 | 大连理工大学 | 一种智能调节水平装置及其检测调节方法 |
CN111710639A (zh) * | 2020-07-20 | 2020-09-25 | 北京航空航天大学杭州创新研究院 | 高密度阵列结构的非硅基薄膜器件制备用对准装置 |
CN117983565A (zh) * | 2024-03-29 | 2024-05-07 | 德沪涂膜设备(苏州)有限公司 | 一种掩膜板清洗装置以及掩膜板的清洗方法 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4368633B2 (ja) * | 2002-08-01 | 2009-11-18 | 株式会社半導体エネルギー研究所 | 製造装置 |
JP2004146369A (ja) * | 2002-09-20 | 2004-05-20 | Semiconductor Energy Lab Co Ltd | 製造装置および発光装置の作製方法 |
US20060086321A1 (en) * | 2004-10-22 | 2006-04-27 | Advantech Global, Ltd | Substrate-to-mask alignment and securing system with temperature control for use in an automated shadow mask vacuum deposition process |
CN1687729A (zh) * | 2005-06-09 | 2005-10-26 | 上海交通大学 | 基于微机电系统的力敏器件的制作方法 |
WO2007023552A1 (ja) * | 2005-08-25 | 2007-03-01 | Hitachi Zosen Corporation | 真空蒸着用アライメント装置 |
JP5167103B2 (ja) * | 2008-12-15 | 2013-03-21 | 株式会社日立ハイテクノロジーズ | 成膜装置 |
CN101493657B (zh) * | 2009-02-27 | 2011-03-30 | 上海微电子装备有限公司 | 掩模版定位机构 |
CN202049932U (zh) * | 2011-04-02 | 2011-11-23 | 东莞宏威数码机械有限公司 | 真空对位系统 |
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2011
- 2011-04-02 CN CN2011100842580A patent/CN102184934B/zh not_active Expired - Fee Related
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Publication number | Publication date |
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CN102184934A (zh) | 2011-09-14 |
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