WO2010137418A1 - 塗布装置、塗布具及び塗布方法 - Google Patents
塗布装置、塗布具及び塗布方法 Download PDFInfo
- Publication number
- WO2010137418A1 WO2010137418A1 PCT/JP2010/056698 JP2010056698W WO2010137418A1 WO 2010137418 A1 WO2010137418 A1 WO 2010137418A1 JP 2010056698 W JP2010056698 W JP 2010056698W WO 2010137418 A1 WO2010137418 A1 WO 2010137418A1
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- WO
- WIPO (PCT)
- Prior art keywords
- forming liquid
- printed circuit
- circuit board
- film forming
- coating
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0091—Apparatus for coating printed circuits using liquid non-metallic coating compositions
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
Definitions
- the present invention relates to an applicator and applicator for applying a liquid to an end face of a printed circuit board and an application method for applying a liquid.
- a glass epoxy member made by impregnating an epoxy resin into a plurality of superposed glass fiber cloths has excellent electrical and mechanical characteristics, so a circuit pattern is formed on the surface of the glass epoxy member cut to a predetermined size.
- a printed circuit board is often manufactured by forming a resist film.
- Patent Document 1 discloses a brush-type applicator provided with a nib made of a supple synthetic fiber, and the end face of a printed circuit board is formed by the brush-type applicator. It is conceivable to remove dust adhering to the surface.
- the present invention has been made in view of such circumstances, and it is an object of the present invention to provide a coating apparatus, a coating tool, and a coating method capable of preventing the end surface portion of the printed circuit board from collapsing and improving the quality of the printed circuit board.
- the coating apparatus is a coating apparatus that applies a liquid to a printed circuit board.
- the printed circuit board is supported by the support part so as to be in contact with or separated from the end face.
- a film forming liquid containing a resin component is applied to the end face of the printed circuit board supported by the support part by the application part to form a film.
- the coating part has a circular cross section, the axial direction of the coating part is a direction intersecting the printed circuit board supported by the support part, and the peripheral part of the coating part is a printed circuit board.
- the film forming liquid is supplied to the peripheral part of the application part from the supply part.
- the drive part rotates the axis of the application part around the axis.
- an appropriate amount of the film forming liquid is applied to the end face of the printed circuit board by rotating the circular application part around the axis so that the film forming liquid is evenly attached to the peripheral edge of the application part. Further, the peripheral part of the application part is brought close to the printed circuit board to reliably apply the film forming liquid.
- the supply unit contains a film forming liquid containing a resin component
- the coating unit includes a permeation unit through which the film forming liquid permeates from the supply unit.
- the film forming liquid that has permeated the permeation portion is applied to the end surface of the printed circuit board by bringing the permeation portion closer to the end surface of the printed circuit board.
- the applicator according to the present invention is provided with a holding bar that contains a film forming liquid containing a resin component therein, and a tip of the holding bar, and the film forming liquid penetrates from the holding chamber. And an infiltration portion.
- the user contacts the end surface of the printed circuit board with the permeation portion, and applies the film forming solution that has permeated the permeation portion to the end surface of the printed circuit board.
- the applicator according to the present invention is characterized in that the permeation part is formed by compressing a fibrous body.
- dust adhering to the end face of the printed circuit board is removed by bringing the high-rigidity infiltration portion into contact with the end face of the printed circuit board.
- the coating method of the film forming liquid according to the present invention includes a step of applying a film forming liquid containing a resin component to an end face of a printed board and a step of curing the applied film forming liquid.
- a film is formed by applying a film forming liquid to the end face of the printed circuit board.
- the film forming liquid according to the present invention is characterized by containing a resin component to be applied to the end face of the printed circuit board.
- a film is formed when applied to the end face of the printed circuit board to prevent the end face of the printed circuit board from collapsing.
- the film forming liquid according to the present invention has a viscosity of about 0.5 to 1 [Pa ⁇ s].
- a film forming liquid containing a resin component is applied to the end face of the printed circuit board supported by the support section by the coating section to form a film. Therefore, it is possible to prevent the end surface portion of the printed circuit board from collapsing and generating further dust.
- a circular coating portion is rotated about its axis so that the film forming liquid is evenly attached to the peripheral portion of the coating portion, and an appropriate amount of film is formed on the end surface of the printed circuit board. Apply liquid. Therefore, it is possible to prevent the film forming liquid from dripping from the end face of the printed circuit board. Moreover, the film forming liquid can be reliably applied by bringing the peripheral edge of the application part close to the printed circuit board.
- a film is formed by applying the film forming liquid that has permeated the permeation portion to the end surface of the printed board by bringing the permeation portion closer to the end surface of the printed board. For this reason, it is possible to prevent the end surface portion of the printed circuit board from collapsing and generating further dust.
- the user grips the gripping rod, brings the permeation portion into contact with the end surface of the printed circuit board, and applies the film forming solution that has permeated the permeation section to the end surface of the printed circuit board. Therefore, the user can easily form a film on the end face of the printed circuit board.
- a film is formed by coating a film forming liquid on the end face of the printed board. Therefore, it is possible to prevent the end surface portion of the printed circuit board from collapsing and generating further dust.
- a film when applied to the end face of the printed board, a film can be formed to prevent the end face of the printed board from collapsing. Moreover, since it has a predetermined viscosity, it does not sag from the end face of the printed circuit board after application.
- FIG. 1 is a schematic side cross-sectional view of a coating apparatus according to Embodiment 1.
- FIG. 2 is a front view schematically showing an internal mechanism of the coating apparatus according to Embodiment 1.
- FIG. 6 is a schematic perspective view of a coating apparatus according to Embodiment 2.
- FIG. 6 is a longitudinal sectional view schematically showing a configuration in the vicinity of a support portion of a coating apparatus according to a second embodiment.
- 10 is a schematic cross-sectional view showing an applicator according to Embodiment 3.
- FIG. It is a perspective view which shows schematically the state which has apply
- FIG. 6 is a schematic cross-sectional view showing an applicator according to Embodiment 4.
- FIG. 1 is a schematic side sectional view of the coating apparatus
- FIG. 2 is a front view schematically illustrating an internal mechanism of the coating apparatus.
- reference numeral 1 denotes a housing, and a carry-in port 1a and a carry-out port 1b are provided on the front and rear surfaces of the housing 1, respectively.
- Conveyors 2 and 2 extending in the front-rear direction are arranged in parallel across the carry-in entrance 1a and the carry-out exit 1b.
- the conveyor 2 is supported on the housing 1 by a support member (not shown).
- the housing 1 is provided with an operation unit 3 having a plurality of operation switches 3a. The conveyor 2 is driven and stopped by operating the operation switch 3 a of the operation unit 3.
- Application mechanisms 10 and 10 are provided on the left and right sides of the conveyor 2, respectively.
- the application mechanism 10 is fixed to a fixed plate 4 that faces the rear surface of the housing 1.
- the fixing plate 4 is supported on the rear surface portion.
- the coating mechanism 10 includes a coating disk 11 that is substantially parallel to a plane perpendicular to the vertical direction, and the coating disk 11 has a shaft 11a that extends vertically.
- a motor 12 is connected to the shaft 11 a of the application disk 11. By driving the motor 12, the application disk 11 rotates about its axis. The motor 12 is driven and stopped by operating the operation switch 3a.
- a supply disk 13 substantially parallel to a plane orthogonal to the left-right direction is provided on the opposite side of the conveyor 2 across the application disk 11.
- the supply disk 13 has a shaft 13a extending left and right.
- the shaft 13 a of the supply disk 13 is located below the shaft 11 a of the application disk 11.
- the side surface on the application disk 11 side in the upper part of the supply disk 13 is close to the peripheral surface of the application disk 11.
- a motor 14 is connected to the shaft 13 a of the supply disk 13. By supplying the motor 14, the supply disk 13 rotates about its axis. The motor 14 is driven and stopped by operating the operation switch 3a.
- the motor 14 is connected to the fixed plate 4 via a pivot 15 extending in the front-rear direction.
- the position of the supply disk 13 and the application disk 11 is adjusted by rotating the motor 14 around the axis about the pivot 15.
- the motor 14 is fixed to the fixed plate 4 by a fixing means (not shown).
- a liquid supply container 17 for storing a film forming liquid 16 containing a resin component is provided below the supply disk 13.
- the liquid supply container 17 has a box shape with an open top.
- the lower part of the supply disk 13 is inserted into the liquid supply container 17 from above and immersed in the film forming liquid 16. With the rotation of the supply disk 13, the film forming liquid 16 moves from the lower part of the supply disk 13 to the upper part of the supply disk 13 and is supplied to the peripheral surface of the coating disk 11.
- a ball screw mechanism 20 is provided below the fixed plate 4.
- the ball screw mechanism 20 includes a motor 21 disposed below the conveyor 2.
- the motor 21 includes a rotating shaft extending in a direction away from the conveyor 2, and a male screw 22 extending in the left-right direction is connected to the rotating shaft.
- a cylindrical female screw 23 is fitted to the male screw 22, and the lower part of the fixing plate 4 is connected to the female screw 23.
- a rolling element (not shown) is fitted between the male screw 22 and the female screw 23 along the screw groove.
- a rectangular printed board 30 will be described as an example. It is assumed that the vertical dimension (thickness dimension) of the printed circuit board 30 is smaller than the vertical dimension (thickness dimension) of the coating disk 11.
- the user operates the operation switch 3a of the operation unit 3 to rotate the motor 21 forward and backward, and adjust the left and right positions of the coating mechanism 10 so as to match the left and right width of the printed circuit board 30. Then, the user places the printed circuit board 30 on the conveyor 2 from the carry-in entrance 1a side, operates the operation switch 3a, and drives the conveyor 2, the motor 12, and the motor 14.
- the printed circuit board 30 is carried out to the coating mechanism 10 by the conveyor 2, and the left and right end surfaces come into contact with the peripheral surface of the coating disk 11. At this time, the film forming liquid 16 attached to the peripheral surface of the application disk 11 is applied to the left and right end surfaces of the printed circuit board 30. Then, as the printed circuit board 30 advances, the film forming liquid 16 is applied to the entire left and right end surfaces of the printed circuit board 30 and is carried out from the carry-out port 1b. After applying the film forming liquid 16, the user cures the resin component contained in the film forming liquid 16 to form a coating film. For example, after the film forming liquid 16 is applied, the printed circuit board 30 is left in the air to be naturally cured, or the resin component contained in the film forming liquid 16 is cured by heating or irradiation with ultraviolet rays.
- the user adjusts the left-right position of the coating mechanism 10 so as to align with the front-rear width of the carried-out printed board 30, and the printed board 30 rotated 90 ° with the up-down direction as the rotation axis direction is loaded into the carry-in entrance 1 a.
- the film forming liquid 16 can be applied to the front and rear end faces of the printed circuit board 30.
- the film forming liquid 16 containing the resin component is applied to the end surface of the printed circuit board 30 supported by the conveyor 2 by the application disk 11 to form a film. Therefore, it is possible to prevent the end surface portion of the printed circuit board 30 from collapsing and generating further dust.
- the film forming liquid 16 is uniformly attached to the peripheral surface of the coating disk 11, and an appropriate amount of the film forming liquid 16 can be applied to the end surface of the printed board 30. . Therefore, it is possible to prevent the film forming liquid 16 from dripping from the end surface of the printed circuit board 30, and the operation of the ball screw mechanism 20 brings the peripheral surface of the application disk 11 close to the end surface of the printed circuit board 30, The forming liquid 16 can be reliably applied.
- the coating mechanism 10 is provided with an ejection nozzle that faces the end face of the printed circuit board 30 placed on the conveyor 2, and the film forming liquid 16 is ejected from the ejection nozzle, and the film forming liquid 16 is applied to the end face of the printed circuit board 30. It may be applied. Further, the film forming liquid 16 is applied to the entire end face of the rectangular printed board 30 by arranging two coating apparatuses as described above and providing a mechanism for rotating the rectangular printed board 30 by 90 ° with the vertical direction as the rotation axis direction therebetween. can do. Further, the ball screw mechanism 20 is used as a mechanism for moving the fixing plate 4, but other mechanisms such as a linear mechanism may be applied instead of the ball screw mechanism 20.
- FIG. 3 is a schematic perspective view of the coating apparatus
- FIG. 4 is a vertical cross-sectional view schematically showing the configuration in the vicinity of the support portion.
- the coating apparatus includes a box-shaped base 40. On the upper surface of the base 40, two through-grooves 40a and 40a extending in the front-rear direction are provided side by side.
- a ball screw mechanism 41 is provided inside the base 40, and the ball screw mechanism 41 includes a motor 42 disposed on the front side.
- the motor 42 includes a rotating shaft extending rearward, and a male screw 43 extending rearward is connected to the rotating shaft.
- a female screw 44 is fitted to the male screw 43, and a connecting rod 45 extending from side to side is connected.
- the left and right end portions of the connecting rod 45 are bent upward, and support bases 46 and 46 that are substantially parallel to a plane perpendicular to the vertical direction are fixed to each upper end portion.
- a rolling element (not shown) is fitted along the thread groove between the male screw 43 and the female screw 44.
- the support legs stand upright on the left and right.
- the support legs support a storage box 50 that stores the ball screw mechanism 51.
- a front groove of the storage box 50 is provided with a through groove 50a extending left and right.
- the ball screw mechanism 51 includes a motor 52 arranged on the left side.
- the motor 52 includes a rotation shaft extending rightward, and a male screw 53 extending rightward is connected to the rotation shaft.
- a female screw 54 is fitted to the male screw 53.
- the female screw 54 includes an extended portion 54a extending forward, and the extended portion 54a extends from the groove 50a.
- a rolling element (not shown) is fitted along the screw groove.
- a support box 60 having a rectangular parallelepiped shape is provided on the front side of the storage box 50.
- the extending part 54 a is connected to the support box 60.
- a groove 60 a extending in the vertical direction is provided on the front surface of the support box 60.
- a ball screw mechanism 61 is provided in the support box 60, and the ball screw mechanism 61 includes a motor 62 disposed on the lower side.
- the motor 62 includes a rotating shaft extending upward, and a male screw 63 extending upward is connected to the rotating shaft.
- a female screw 64 is fitted to the male screw 63.
- the female screw 64 protrudes forward from the groove 60a.
- a rolling element (not shown) is fitted along the screw groove.
- a gripping rod 70 with the vertical direction as the axial direction is provided on the front side of the support box 60.
- the gripping rod 70 is connected to the female screw 64.
- a storage chamber 70a for storing a film forming liquid 71 containing a resin component is formed inside the gripping rod 70.
- a penetrating portion 72 through which the film forming liquid 71 penetrates is provided at the lower end portion of the gripping rod 70.
- the infiltrating portion 72 is formed by compressing a fibrous body, and is made of, for example, felt or nonwoven fabric.
- a passage is formed between the storage chamber 70a and the permeation portion 72, and the film forming liquid 71 reaches the permeation portion 72 through the passage.
- the base 40 is provided with an operation unit 80 having a plurality of operation switches 80a.
- the motors 42 to 62 are rotated by the operation of the operation switch 80a, the support base 46 is moved in the front-rear direction, and the gripping rod 70 is moved left-right or up-down.
- the application of the film forming liquid 71 to the end face of the printed circuit board 30 supported by the support base 46 will be described.
- the user places the printed circuit board 30 flat on the support base 46.
- the operation switch 80 a is operated to bring the permeation portion 72 into contact with the end surface of the printed board 30.
- the user operates the operation switch 80 a to move the permeation portion 72 along the end surface of the printed circuit board 30 to apply the film forming liquid 71 to the entire end surface of the printed circuit board 30.
- the user cures the resin component contained in the film forming liquid 71 to form a coating film.
- the printed circuit board 30 is left in the air to be naturally cured, or the resin component contained in the film forming liquid 71 is cured by heating or irradiation with ultraviolet rays.
- the ball screw mechanism 41 can move the support bases 46 and 46 in the front-rear direction with a stroke larger than the front-rear dimension of the printed circuit board 30.
- the ball screw mechanism 51 can move the female screw 54 in the left-right direction with a stroke larger than the left-right dimension of the printed circuit board 30.
- the ball screw mechanism 61 can move the female screw 64 downward until the penetration portion 72 is positioned below the printed circuit board 30 supported by the support base 46. Further, the vertical dimension of the permeation part 72 is larger than the vertical dimension (thickness dimension) of the printed circuit board 30.
- the film forming liquid 71 that has permeated the permeation unit 72 is applied to the end surface of the printed circuit board 30 by bringing the permeation unit 72 close to the end surface of the printed circuit board 30. Form. Therefore, it is possible to prevent the end surface portion of the printed circuit board 30 from collapsing and generating further dust.
- the coating apparatus applies the film forming liquid 71 to the end surface of the printed circuit board 30 by the user's operation, but a control unit having an MPU (Micro Processing Unit) is provided and stored in the MPU.
- the film forming liquid 71 may be automatically applied to the end face of the printed circuit board 30 based on a program.
- a ball screw mechanism is used as a mechanism for moving the support base 46 and the permeating portion 72, but other moving mechanisms such as a linear mechanism may be applied instead of the ball screw mechanism.
- FIG. 5 is a schematic cross-sectional view showing the applicator.
- reference numeral 90 denotes a cylindrical gripping rod for the user to grip
- an accommodation chamber 90a is formed inside the gripping rod.
- a taper is formed in the middle of the storage chamber 90a so that the inner diameter of the gripping rod 90 gradually decreases.
- the accommodating chamber 90a accommodates a batting 92 that occludes the film forming liquid 95, and is pressed against the taper.
- a tail plug 91 is inserted into one end of the gripping rod 90, and the tail plug 91 is in close contact with the storage chamber 90a.
- the other end of the gripping rod 90 has an inner diameter that decreases outward in the axial direction, and a columnar penetrating portion 93 is fitted into the other end of the gripping rod 90, and one end of the penetrating portion 93 is Embedded in the batting 92.
- the other end portion of the permeation portion 93 is exposed from the other end portion of the grip portion.
- the infiltrating portion 93 is formed by compressing a fibrous body, and is made of, for example, felt or nonwoven fabric.
- the film forming liquid 95 occluded in the filling 92 is impregnated in the permeation portion 93. Further, the permeation portion 93 has sufficient rigidity due to compression, and is not greatly deformed even if the user presses the permeation portion 93 to remove dust.
- the applicator according to Embodiment 3 is configured so that a bottomed cylindrical cap 94 can be placed on the permeation portion 93, and the cap 94 is fitted to the other end portion of the gripping rod 90.
- FIG. 6 is a perspective view schematically showing a state in which the film forming liquid 95 is applied to the end face of the printed board using an applicator, and FIG. FIG.
- the user holds the applicator along the end surface as shown by the white arrow in FIG. 6 while holding the applicator gripping rod 90 and bringing the penetrating portion 93 into contact with the end surface of the printed circuit board 30. Move. At this time, as shown in FIG. 7, the film forming liquid 95 that has oozed out of the permeation portion 93 is applied to the end face of the printed circuit board 30. After applying the film forming liquid 95, the user cures the resin component contained in the film forming liquid 95 to form a coating film. For example, after the film forming solution 95 is applied, the printed circuit board 30 is left in the air to be naturally cured, or the resin component contained in the film forming solution 95 is cured by heating or irradiation with ultraviolet rays.
- the film forming liquid 95 is colorless and transparent, and the coating film 96 is also colorless and transparent. Further, the permeation part 93 removes the dust 31 adhering to the end face of the printed circuit board 30. Also, the dust 31 adhered to the end face is scraped off from the end face by the rigidity of the permeation portion 93.
- a colored component for example, a colored component having the same color as the resist film of the printed circuit board 30 may be mixed into the film forming liquid 95 to make the film forming liquid 95 colored and transparent, and the coating film 96 may be colored and transparent.
- the film forming liquid 95 is applied to the portion where the dust 31 has been removed, and the applied film forming liquid 95 is cured to form the coating film 96. Therefore, it is possible to improve the quality of the printed circuit board 30 by cleaning, and it is possible to prevent the cleaned portion from collapsing and generating further dust 31.
- the permeation portion 93 for removing the dust 31 is formed by compressing the fibrous body, and the dust 31 adhered to the end surface of the printed circuit board 30 is scraped off by the high-rigidity permeation portion 93, so that the dust 31 can be reliably removed. Further, the user can easily clean the printed circuit board 30 by holding the holding bar 90.
- the film forming liquid 95 colorless, it is possible to avoid unnecessary coloring on the printed circuit board 30 and to maintain the quality of the printed circuit board 30.
- the film forming liquid 95 is colored, for example, the same color as the resist film applied to the printed circuit board 30, so that the appearance of the end surface of the printed circuit board 30 and the resist film is harmonized and the design of the printed circuit board 30 is achieved. Can be improved.
- the permeation portion 93 is formed of felt or non-woven fabric, and the rigidity of the permeation portion 93 is improved, so that the dust 31 adhered to the end face of the printed circuit board 30 can be surely scraped off.
- the film forming liquid 95 used in the applicator according to Embodiment 3 may have a different color from the resist film of the printed circuit board 30.
- the film forming liquid 95 may be opaque, and the coating film 96 may be opaque. Further, the resin component contained in the film forming liquid 95 may be anything that forms the coating film 96.
- FIG. 8 is a schematic cross-sectional view showing the applicator.
- reference numeral 100 denotes a bottomed cylindrical gripping rod for the user to grip, and the inner peripheral surface of the gripping rod 100 has a tapered shape whose diameter increases toward the opening.
- the gripping rod 100 is fitted with an elongated cylindrical tank portion 101 (accommodating chamber) for storing a colorless and transparent aqueous film-forming solution 95 containing a resin component.
- the portion fitted into 100 has a taper shape with a diameter decreasing toward the bottom of the gripping rod 100 so as to correspond to the inner peripheral surface of the gripping rod 100. Therefore, the outer peripheral surface of the tank part 101 and the inner peripheral surface of the gripping rod 100 are in close contact with each other by the frictional force between them.
- the tank part 101 extends in the axial direction from the gripping rod 100, and a cylindrical bush part 110 and a film forming liquid 95 pushed out from the tank part 101 are temporarily placed inside the extended part of the tank part 101.
- a cylindrical reservoir 111 and a cylindrical support member 112 are coaxially fitted in order from the gripping rod 100 side.
- the inside of the bush part 110 is a passage through which the film forming liquid 95 stored in the tank part 101 flows.
- a large number of circumferential grooves 111a along the circumferential direction are formed on the outer peripheral surface of the retaining portion 111, and the circumferential grooves 111a communicate with each other by longitudinal grooves (not shown) extending in the axial direction.
- the support member 112 is formed with a penetrating air hole 112a for keeping the pressure in the tank portion 101 within a predetermined range.
- a columnar penetrating portion 114 into which the film forming liquid 95 penetrates is fitted into the support member 112.
- the front end portion of the permeation portion 114 extends in the axial direction from the support member 112, and the front end portion of the permeation portion 114 is tapered so as to gradually become narrower toward the front end.
- the relay core 113 is inserted inside the storage part 111.
- the relay core 113 is disposed along the axial direction from the bush portion 110 to the support member 112, one end portion of the relay core 113 is connected to the permeation portion 114, and the other end portion of the relay core 113 is the bush portion 110.
- the film forming liquid 95 that has flowed through the inside of the bush part 110 passes through the relay core 113 and is supplied to the permeation part 114.
- the infiltrating portion 114 is formed by compressing a fibrous body, and is made of, for example, felt or nonwoven fabric. The supplied film forming liquid 95 penetrates into the permeation section 114.
- the permeation portion 114 has sufficient rigidity by compression, and is not greatly deformed even if the user presses the permeation portion 114 to remove dust.
- the film forming liquid 95 may be led out by directly disposing the penetrating portion 114 on the opposite side of the penetrating portion 114 in the bush portion 110 without interposing the relay core 113.
- the applicator according to Embodiment 4 is configured so that a bottomed cylindrical cap 120 can be placed on the permeation portion 114, and the cap 120 extends from the gripping rod 100 of the tank portion 101. It is formed so as to fit in.
- the applicator according to the fourth embodiment can apply the film forming liquid 95 to the end face of the printed circuit board 40 and harden it by the same method as the application method described in the third embodiment.
- the film forming liquid may be applied to the end surface of the printed circuit board by attaching the film forming liquid to the brush or the finger and bringing the brush or finger into contact with the end surface of the printed circuit board.
- the resin component contained in the film-forming liquid in Embodiments 1 to 4 include at least one kind of styrene butadiene resin emulsion, acrylonitrile butadiene resin emulsion, carboxy-modified styrene butadiene copolymer resin emulsion, acrylic resin emulsion, etc. Alone or a mixture of two or more thereof.
- the viscosity of the film-forming liquid in Embodiments 1 to 4 is preferably a viscosity that does not sag after coating. For example, a viscosity of about 0.5 to 1 [Pa ⁇ s] can be mentioned.
- the rotation speed of the supply disk 13 is set in advance in consideration of the viscosity of the film forming liquid, and the film forming liquid does not scatter from the supply disk 13.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coating Apparatus (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
以下本発明を実施の形態1に係る塗布装置を示す図面に基づいて詳述する。図1は塗布装置の略示側面断面図、図2は塗布装置の内部機構を略示する正面図である。
以下本発明を実施の形態2に係る塗布装置を示す図面に基づいて詳述する。図3は塗布装置の略示斜視図、図4は支持部付近の構成を略示する縦断面図である。
以下本発明を実施の形態3に係る塗布具を示す図面に基づいて詳述する。図5は塗布具を示す略示断面図である。図において90は、ユーザが把持するための円筒形の把持棒であり、該把持棒の内側に収容室90aが形成されている。収容室90aの中途部に、把持棒90の内径が徐々に小さくなるように、テーパが形成してある。収容室90aには膜形成液95を吸蔵する中綿92が収容してあり、前記テーパにおいて圧接されている。
以下本発明を実施の形態4に係る塗布具を示す図面に基づいて詳述する。図8は塗布具を示す略示断面図である。
図において100は、ユーザが把持するための有底円筒形の把持棒であり、該把持棒100の内周面は、開口に向かうに従って拡径するテーパ状をなす。把持棒100には、樹脂成分を含む無色透明で水性の膜形成液95を貯留する細長い円筒形のタンク部101(収容室)が嵌入しており、タンク部101の外周面の内、把持棒100に嵌入している部分は把持棒100の内周面に対応するように、把持棒100の底部に向かうに従って縮径するテーパ状をなす。そのためタンク部101の外周面と把持棒100の内周面とは両者間の摩擦力によって密着している。
12、14、21、42、52、62 モータ
16、71、95 膜形成液
20、41、51、61 ボールねじ機構
46 支持台
70、90、100 把持棒
72、93、114 浸透部
90a 収容室
96 被覆膜
101 タンク部
Claims (8)
- プリント基板に液体を塗布する塗布装置において、
プリント基板を支持する支持部と、
該支持部に支持されたプリント基板の端面に対向する位置に配される塗布部と、
該塗布部に樹脂成分を含む膜形成液を供給する供給部と、
前記塗布部を移動させる手段と、
該手段を駆動する駆動手段とを備え、
前記駆動手段の駆動によって、前記塗布部は、前記支持部に支持されたプリント基板の端面に接離するようにしてあること
を特徴とする塗布装置。 - 前記塗布部は断面円形状をなし、
前記塗布部の軸方向は前記支持部に支持されたプリント基板に交差する方向であり、
前記塗布部の周縁部はプリント基板の端面に対向し、
前記塗布部を軸回りに回転させる駆動部を備え、
前記塗布部の周縁部に、前記供給部から膜形成液が供給されるようにしてあること
を特徴とする請求項1に記載の塗布装置。 - 前記供給部は樹脂成分を含む膜形成液を収容しており、
前記塗布部は前記供給部から前記膜形成液が浸透する浸透部を備えること
を特徴とする請求項1に記載の塗布装置。 - 樹脂成分を含む膜形成液を収容する収容室を内部に備える把持棒と、該把持棒の先端部に設けてあり、前記収容室から前記膜形成液が浸透する浸透部とを備えることを特徴とする塗布具。
- 前記浸透部は、繊維体を圧縮してなることを特徴とする請求項4に記載の塗布具。
- プリント基板の端面に樹脂成分を含む膜形成液を塗布する工程と、塗布された膜形成液を硬化させる工程とを含む膜形成液の塗布方法。
- プリント基板の端面に塗布するための樹脂成分を含むことを特徴とする膜形成液。
- 粘度が略0.5~1[Pa・s]であることを特徴とする請求項7に記載の膜形成液。
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JP2011515951A JPWO2010137418A1 (ja) | 2009-05-26 | 2010-04-14 | 塗布装置、塗布具、塗布方法及び膜形成液 |
CN2010800226652A CN102450111A (zh) | 2009-05-26 | 2010-04-14 | 涂敷装置、涂敷工具及涂敷方法 |
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KR (1) | KR20120024782A (ja) |
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WO (1) | WO2010137418A1 (ja) |
Cited By (6)
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JP2015003303A (ja) * | 2013-06-21 | 2015-01-08 | 株式会社エナテック | 塗布装置及び塗布方法 |
KR20170001958A (ko) | 2014-11-06 | 2017-01-05 | 가부시키가이샤 에나테크 | 도포장치, 도포헤드 및 도포방법 |
CN112566384A (zh) * | 2020-12-03 | 2021-03-26 | 江西威尔高电子科技有限公司 | 一种pcb防止表面氧化设备 |
WO2021095575A1 (ja) * | 2019-11-14 | 2021-05-20 | 株式会社エナテック | 塗布装置、及び塗布・乾燥硬化方法 |
CN114653520A (zh) * | 2020-12-22 | 2022-06-24 | 株式会社埃纳科技 | 涂敷装置及涂敷方法 |
KR20240048501A (ko) | 2022-10-06 | 2024-04-15 | 가부시키가이샤 에나테크 | 도포 장치, 건조 장치, 광 조사 장치, 및 도포 시스템 |
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DE102013101693B9 (de) * | 2013-02-20 | 2015-11-12 | Notion Systems GmbH | Oberflächenbearbeitungsvorrichtung |
CN103383883B (zh) * | 2013-07-30 | 2016-03-09 | 无锡统力电工有限公司 | 热粘合漆包扁线用宽面涂漆装置 |
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KR20120024782A (ko) | 2012-03-14 |
JPWO2010137418A1 (ja) | 2012-11-12 |
CN102450111A (zh) | 2012-05-09 |
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