WO2010121701A1 - Aufnahmeeinrichtung zur aufnahme von halbleitersubstraten - Google Patents
Aufnahmeeinrichtung zur aufnahme von halbleitersubstraten Download PDFInfo
- Publication number
- WO2010121701A1 WO2010121701A1 PCT/EP2010/002052 EP2010002052W WO2010121701A1 WO 2010121701 A1 WO2010121701 A1 WO 2010121701A1 EP 2010002052 W EP2010002052 W EP 2010002052W WO 2010121701 A1 WO2010121701 A1 WO 2010121701A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- receiving
- recording device
- suction structure
- semiconductor substrate
- carrier
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
- B25B11/005—Vacuum work holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- the invention relates to a receiving device according to claim 1.
- a precise and positional fixation of semiconductor substrates is inevitable for a variety of processes in the semiconductor industry.
- the usually very thin and susceptible semiconductor substrates are applied to a receiving device, a so-called chuck, and fixed there.
- the technologies known for fixing semiconductor substrates on the chucks are not applicable, in particular, to extremely thin semiconductor substrates having a thickness of less than 100 ⁇ m, in particular less than 50 ⁇ m, and substrates having a topography.
- a very frequently used type of fixation takes place with the aid of vacuum or negative pressure, wherein a planar semiconductor substrate is fixed on a flat, hardened surface into which vacuum paths are milled by means of vacuum or vacuum.
- the semiconductor substrates along the vacuum paths can break or at least be damaged.
- An even greater problem is the fixation of substrates with very high topography, the topography is generated for example by so-called bumps.
- Bumps are spherical, conical or prismatic (cuboid) applied, conductive materials, which later serve for electrical contacting of other components.
- the bumps may have a height of more than 500 microns, typically between 4-200 microns, usually between 10- 150 microns, and be distributed in a large variety over the entire substrate surface. It follows that a fixation of the semiconductor substrate with the known methods is not sufficiently possible.
- Electrostatic fixing devices have the disadvantage that the build-up of electric fields is likely to damage the complex circuits on the semiconductor substrates.
- the invention is based on the idea to improve a generic receiving device by providing a defined suction structure on a receiving side of the receiving device with simultaneous use of a soft surface material or material of the suction structure.
- a compliant material on the surface contacting the semiconductor substrate, a gentle uptake of the semiconductor substrate, even in the presence of a topography on the semiconductor substrate, can be ensured.
- the soft material at the same time has a suction structure sucking the semiconductor substrate, the disadvantages known from the prior art are avoided and a secure and gentle pick-up of thin and / or topographical semiconductor substrates is possible.
- the distance between adjacent elevations of the suction structure should be less than 1: 7, in particular less than 1: 5, preferably less than 1: 3, more preferably less than 1: 2, in relation to the thickness of the semiconductor substrate. Analogously, this applies to the diameter of any topographies on the semiconductor substrate.
- the distance between adjacent elevations of the suction structure is accordingly at most 7 times greater than the thickness of the semiconductor substrate and / or the diameter of individual topographies of the semiconductor substrate to be accommodated on the receiving device.
- the suction structure extends over the entire receiving side.
- the entire semiconductor substrate is accommodated in a gentle manner.
- the suction structure has a Shore hardness of less than 90 Shore A.
- a soft material with a Shore hardness of between 10 Shore A and 70 Shore A is optimal for the stable and, on the other hand, gentle retention of the semiconductor substrate, since in some cases high contact and / or transverse forces can act on the semiconductor substrate.
- the semiconductor substrate does not float on the receptacle.
- the combination of soft material and negative pressure also provides for a stable side guide or stable side fixation care.
- the receiving body By making the receiving body of the soft material, the receiving body may be formed with the suction structure as a part.
- the defined suction structure has one or more, in particular predominantly extending in the circumferential direction of the receiving body and / or the semiconductor substrate, web (s), a particularly defined negative pressure over the entire surface of the semiconductor substrate can be constructed.
- a negligible negative pressure is already sufficient by the paths, which are oriented predominantly in the circumferential direction of the receiving body, in order to securely fix the semiconductor substrate.
- the suction structure in particular in the cross-section of adjacent webs, is tooth-shaped.
- at least one, in particular from elevations and depressions, existing web spirally, in particular from a center Z of the receiving body extends.
- a spiral path can easily be realized on the production side and, on the other hand, a maximum distance from the center of the receiving device to the circumference of the receiving device is realized so that an optimum course of the negative pressure applied to the web is ensured.
- any electrostatic charges can be avoided, for example by grounding the receiving device.
- the receiving side forms a receiving plane A and side walls of the recesses to the receiving plane A, in particular at an angle, are angled, in particular in between 30 ° and 85 °, preferably between 50 ° and 70 °, lying angles W1 / W2.
- the angle W l applies to a first side wall of the recess and the angle W2 for a second side wall of the recess.
- the suction structure is designed to receive topographies of the semiconductor substrate by the elasticity and geometry of the suction structure.
- Fig. 1 a micrograph of a on a
- Fig. 2 a schematic representation of the invention
- Fig. 3 a schematic section of the inventive
- Suction structure made of soft material.
- FIG. 1 shows a detail of a semiconductor substrate 4 with a topography 5, namely individual bumps 5b, which are arranged distributed on the surface of the semiconductor substrate 4.
- FIG. 2 shows a receiving device consisting of a carrier 1 and a receiving body 3 fixed on the carrier 1.
- the carrier 1 can serve, for example, for receiving by a robot arm or a process station and is therefore preferably made of rigid material, in particular metal.
- the carrier 1 advantageously has a greater base area than the receiving body 3.
- the receiving body 3 is formed with respect to the carrier 1 of a softer material.
- the soft material may be, for example, Viton, silicone, rubber, NBR (nitrile rubbers), neoprenes, etc.
- the semiconductor substrate 4 with its topography 5 can be accommodated.
- the semiconductor substrate 4 may also be connected to the topography 5 directed upward, so away from the receiving side 7, recorded.
- the receiving body 3 is penetrated by a vacuum channel 2, which extends further through the support 1 to a vacuum device, not shown, for applying a vacuum to a suction end 8 arranged on the receiving side 7.
- a plurality of vacuum channels 2 can be arranged distributed over the receiving body 3. It is advantageous if the distance B 1 from the center Z to the suction end 8 is greater than the distance B2 from the suction end 8 to a circumference 9 of the suction end 8 Receiving body 3. Particularly advantageous is a ratio B 1: B2 of 1, 5: 1 to 3: 1, preferably 2: 1.
- the suction end 8 is arranged in a recess 10 of the suction structure 6 and the depressions 10 are the suction structure 6 forming elevations
- the elevations 1 1 are tooth-like in the present case, wherein the recesses 10 and elevations 1 1 are formed by a spiral beginning in the center Z 12.
- the bumps 5b are receivable.
- FIG. 3 shows an enlarged detail of the receiving body 3.
- Side walls S 1, S 2 of the depressions 10 are opposite one through the Receiving side 7 of the receiving body 3 formed receiving plane A angled, namely equiangularly with the identical in the exemplary embodiment angles W l, W2 between the side walls S l, S2 and the receiving plane A.
- the angle Wl, W2 are between 30 ° and 85 °, preferably between 40 ° and 75 °.
- the elevations 1 1 pointed in FIG. 3 may be rounded off in an advantageous embodiment of the invention.
- a particular advantage of the invention is also that with one and the same recording device different semiconductor substrates, especially in diameter different semiconductor substrates 4 can be safely and gently recorded.
- Semiconductor substrates 4 which have substantially the same outer contour and / or the same outer circumference and / or the same diameter as the receiving body 3 are received in a particularly secure and gentle manner.
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP10712715.1A EP2421677B1 (de) | 2009-04-22 | 2010-03-31 | Aufnahmeeinrichtung zur aufnahme von halbleitersubstraten |
KR1020177014327A KR101875351B1 (ko) | 2009-04-22 | 2010-03-31 | 반도체 기판을 수용하기 위한 수용 장치 |
CN201080017785.3A CN102427916B (zh) | 2009-04-22 | 2010-03-31 | 用于保持半导体衬底的保持设备 |
US13/138,902 US9278433B2 (en) | 2009-04-22 | 2010-03-31 | Receiving device for receiving semiconductor substrates |
JP2012506359A JP2012524984A (ja) | 2009-04-22 | 2010-03-31 | 半導体基板を保持するための工作物保持固定具 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009018434.1 | 2009-04-22 | ||
DE102009018434.1A DE102009018434B4 (de) | 2009-04-22 | 2009-04-22 | Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010121701A1 true WO2010121701A1 (de) | 2010-10-28 |
Family
ID=42154433
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2010/002052 WO2010121701A1 (de) | 2009-04-22 | 2010-03-31 | Aufnahmeeinrichtung zur aufnahme von halbleitersubstraten |
Country Status (8)
Country | Link |
---|---|
US (1) | US9278433B2 (de) |
EP (1) | EP2421677B1 (de) |
JP (2) | JP2012524984A (de) |
KR (2) | KR20120007017A (de) |
CN (1) | CN102427916B (de) |
DE (1) | DE102009018434B4 (de) |
TW (1) | TWI511228B (de) |
WO (1) | WO2010121701A1 (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012121108A (ja) * | 2010-12-09 | 2012-06-28 | Ud Trucks Corp | エアブラスト装置の搬送テーブル |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4761334B2 (ja) * | 2009-02-23 | 2011-08-31 | 株式会社ソディック | 着色セラミック真空チャックおよびその製造方法 |
JP5361634B2 (ja) * | 2009-09-25 | 2013-12-04 | 信越ポリマー株式会社 | 半導体ウェーハ用チャックテーブル及び半導体ウェーハの加工方法 |
DE102013100563A1 (de) * | 2013-01-21 | 2014-07-24 | Ev Group E. Thallner Gmbh | Aufnahmeeinrichtung zur Handhabung strukturierter Substrate |
US11613869B2 (en) | 2015-10-05 | 2023-03-28 | Terminator Ip Limited | Reciprocating impact hammer |
WO2017203067A1 (es) * | 2016-05-25 | 2017-11-30 | Zayer, S.A. | Utillaje para el mecanizado de piezas con curvatura |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5671910A (en) * | 1992-05-06 | 1997-09-30 | James C. Carne | Vacuum plates |
JPH10321708A (ja) * | 1997-05-15 | 1998-12-04 | Sony Corp | 露光装置のウエハステージ |
US5923408A (en) * | 1996-01-31 | 1999-07-13 | Canon Kabushiki Kaisha | Substrate holding system and exposure apparatus using the same |
US6032715A (en) * | 1996-06-28 | 2000-03-07 | Sony Corporation | Wafer bonding device |
WO2001090820A1 (en) * | 2000-05-23 | 2001-11-29 | Silicon Valley Group, Inc. | Flexible piezoelectric chuck |
WO2004011953A1 (en) * | 2000-03-15 | 2004-02-05 | Tsk America, Inc. | Spiral chuck |
JP2004259792A (ja) * | 2003-02-25 | 2004-09-16 | Nikon Corp | 吸着装置、吸着装置用シート、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
WO2008130173A1 (en) * | 2007-04-23 | 2008-10-30 | Hanmisemiconductor Co., Ltd | Suction pad for semiconductor package |
Family Cites Families (46)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3307819A (en) * | 1965-04-12 | 1967-03-07 | Cocito Joe Michael | Disc valve for vacuum board |
US4448404A (en) * | 1980-11-18 | 1984-05-15 | Nippon Kogaku K. K. | Device for holding a sheet-like sample |
JPS5785235A (en) * | 1980-11-18 | 1982-05-27 | Nippon Kogaku Kk <Nikon> | Sampling stand |
DE8703223U1 (de) * | 1987-03-03 | 1987-04-16 | Modellbau Paul Apitz, 7913 Senden, De | |
JPH01258243A (ja) * | 1988-04-08 | 1989-10-16 | Fujitsu Ltd | 互換型書き換え可能光ディスク |
FR2631165B1 (fr) * | 1988-05-05 | 1992-02-21 | Moulene Daniel | Support conditionneur de temperature pour petits objets tels que des composants semi-conducteurs et procede de regulation thermique utilisant ce support |
JPH04152512A (ja) | 1990-10-16 | 1992-05-26 | Fujitsu Ltd | ウエハチャック |
US5293370A (en) * | 1991-01-16 | 1994-03-08 | Del Mar Avionics | Method and apparatus for creating optical disc masters |
JPH06120319A (ja) | 1992-10-08 | 1994-04-28 | Hitachi Ltd | 半導体製造装置 |
US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
JP3312163B2 (ja) * | 1994-11-18 | 2002-08-05 | 日本電信電話株式会社 | 真空吸着装置 |
JPH08288190A (ja) * | 1995-04-19 | 1996-11-01 | Hitachi Ltd | 物品取扱部材およびその製造方法および収納容器ならびに物品取扱装置 |
JP2904086B2 (ja) * | 1995-12-27 | 1999-06-14 | 日本電気株式会社 | 半導体装置およびその製造方法 |
DE19722679A1 (de) | 1997-05-30 | 1998-12-03 | Wacker Siltronic Halbleitermat | Scheibenhalter und Verfahren zur Herstellung einer Halbleiterscheibe |
JPH1140646A (ja) * | 1997-07-18 | 1999-02-12 | Fujitsu Ltd | ピックアップツール |
US6173648B1 (en) * | 1997-10-24 | 2001-01-16 | Sharp Kabushiki Kaisha | Manufacturing method of liquid crystal display element and manufacturing apparatus of the same |
SG71182A1 (en) * | 1997-12-26 | 2000-03-21 | Canon Kk | Substrate processing apparatus substrate support apparatus substrate processing method and substrate manufacturing method |
US6073681A (en) * | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
US6328096B1 (en) * | 1997-12-31 | 2001-12-11 | Temptronic Corporation | Workpiece chuck |
US6583638B2 (en) * | 1999-01-26 | 2003-06-24 | Trio-Tech International | Temperature-controlled semiconductor wafer chuck system |
US6271676B1 (en) | 1999-03-02 | 2001-08-07 | Tsk America, Inc. | Spiral chuck |
US6182957B1 (en) * | 1999-08-12 | 2001-02-06 | International Business Machines Corporation | Apparatus and method for holding a flexible product in a flat and secure position |
US6809802B1 (en) * | 1999-08-19 | 2004-10-26 | Canon Kabushiki Kaisha | Substrate attracting and holding system for use in exposure apparatus |
US6922387B1 (en) * | 2000-03-24 | 2005-07-26 | Matsushita Electric Industrial Co., Ltd. | Optical information recording medium, and method and apparatus for recording/reproducing information thereon |
US6754143B2 (en) * | 2000-03-24 | 2004-06-22 | Matsushita Electric Industrial Co., Ltd. | Optical information recording medium, and method and apparatus for recording/reproducing information thereon |
EP1356499A2 (de) * | 2000-07-10 | 2003-10-29 | Temptronic Corporation | Scheibenhalter mit verschachtelten wärme- und kühlelementen |
JP4546626B2 (ja) | 2000-08-29 | 2010-09-15 | 株式会社ディスコ | 半導体素子のピックアップ方法 |
JP2002298343A (ja) * | 2001-03-28 | 2002-10-11 | Nec Corp | 光ディスクの記録再生方法および記録再生装置 |
JP2002351082A (ja) * | 2001-05-24 | 2002-12-04 | Adtec Engineeng Co Ltd | 露光装置用基板ステージ |
DE60217587D1 (de) * | 2001-07-26 | 2007-03-08 | Canon Kk | Substrathalter und ein Belichtungsapparat |
JP4333065B2 (ja) | 2001-11-14 | 2009-09-16 | レーザーテック株式会社 | 基板保持装置 |
US7221553B2 (en) * | 2003-04-22 | 2007-05-22 | Applied Materials, Inc. | Substrate support having heat transfer system |
JP3894562B2 (ja) * | 2003-10-01 | 2007-03-22 | キヤノン株式会社 | 基板吸着装置、露光装置およびデバイス製造方法 |
US20050229854A1 (en) * | 2004-04-15 | 2005-10-20 | Tokyo Electron Limited | Method and apparatus for temperature change and control |
JP4541824B2 (ja) * | 2004-10-14 | 2010-09-08 | リンテック株式会社 | 非接触型吸着保持装置 |
JP2006305713A (ja) * | 2005-03-28 | 2006-11-09 | Nikon Corp | 吸着装置、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
US7136565B1 (en) * | 2005-05-23 | 2006-11-14 | Imation Corp. | Optical waveguide disk |
JP4580327B2 (ja) * | 2005-11-21 | 2010-11-10 | 東京エレクトロン株式会社 | 被処理体の取り出し方法及びプログラム記憶媒体並びに載置機構 |
JP2008085285A (ja) * | 2006-08-31 | 2008-04-10 | Fluoro Mechanic Kk | 真空ピンセット |
JP2008066607A (ja) * | 2006-09-11 | 2008-03-21 | Tokyo Ohka Kogyo Co Ltd | 真空吸着装置 |
JP5059450B2 (ja) | 2007-03-06 | 2012-10-24 | 東京エレクトロン株式会社 | 基板載置台及び基板処理装置 |
JP4746579B2 (ja) * | 2007-03-29 | 2011-08-10 | シャープ株式会社 | 低負荷搬送装置 |
JP5268345B2 (ja) * | 2007-12-20 | 2013-08-21 | パナソニック株式会社 | インダクタ |
EP2321846A4 (de) * | 2008-08-12 | 2012-03-14 | Applied Materials Inc | Elektrostatische futteranordnung |
WO2011008918A2 (en) * | 2009-07-16 | 2011-01-20 | Cabot Microelectronics Corporation | Grooved cmp polishing pad |
KR101059490B1 (ko) * | 2010-11-15 | 2011-08-25 | 테세라 리써치 엘엘씨 | 임베드된 트레이스에 의해 구성된 전도성 패드 |
-
2009
- 2009-04-22 DE DE102009018434.1A patent/DE102009018434B4/de active Active
-
2010
- 2010-03-31 WO PCT/EP2010/002052 patent/WO2010121701A1/de active Application Filing
- 2010-03-31 JP JP2012506359A patent/JP2012524984A/ja active Pending
- 2010-03-31 EP EP10712715.1A patent/EP2421677B1/de active Active
- 2010-03-31 CN CN201080017785.3A patent/CN102427916B/zh active Active
- 2010-03-31 KR KR1020117025691A patent/KR20120007017A/ko active Search and Examination
- 2010-03-31 US US13/138,902 patent/US9278433B2/en active Active
- 2010-03-31 KR KR1020177014327A patent/KR101875351B1/ko active IP Right Grant
- 2010-04-22 TW TW099112707A patent/TWI511228B/zh active
-
2014
- 2014-09-19 JP JP2014190883A patent/JP2015005778A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5671910A (en) * | 1992-05-06 | 1997-09-30 | James C. Carne | Vacuum plates |
US5923408A (en) * | 1996-01-31 | 1999-07-13 | Canon Kabushiki Kaisha | Substrate holding system and exposure apparatus using the same |
US6032715A (en) * | 1996-06-28 | 2000-03-07 | Sony Corporation | Wafer bonding device |
JPH10321708A (ja) * | 1997-05-15 | 1998-12-04 | Sony Corp | 露光装置のウエハステージ |
WO2004011953A1 (en) * | 2000-03-15 | 2004-02-05 | Tsk America, Inc. | Spiral chuck |
WO2001090820A1 (en) * | 2000-05-23 | 2001-11-29 | Silicon Valley Group, Inc. | Flexible piezoelectric chuck |
JP2004259792A (ja) * | 2003-02-25 | 2004-09-16 | Nikon Corp | 吸着装置、吸着装置用シート、研磨装置、半導体デバイス及び半導体デバイス製造方法 |
WO2008130173A1 (en) * | 2007-04-23 | 2008-10-30 | Hanmisemiconductor Co., Ltd | Suction pad for semiconductor package |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012121108A (ja) * | 2010-12-09 | 2012-06-28 | Ud Trucks Corp | エアブラスト装置の搬送テーブル |
Also Published As
Publication number | Publication date |
---|---|
KR101875351B1 (ko) | 2018-07-05 |
KR20120007017A (ko) | 2012-01-19 |
DE102009018434A1 (de) | 2010-10-28 |
EP2421677B1 (de) | 2020-05-27 |
EP2421677A1 (de) | 2012-02-29 |
KR20170063973A (ko) | 2017-06-08 |
TW201103100A (en) | 2011-01-16 |
TWI511228B (zh) | 2015-12-01 |
US20120146273A1 (en) | 2012-06-14 |
CN102427916B (zh) | 2016-08-03 |
US9278433B2 (en) | 2016-03-08 |
DE102009018434B4 (de) | 2023-11-30 |
JP2015005778A (ja) | 2015-01-08 |
JP2012524984A (ja) | 2012-10-18 |
CN102427916A (zh) | 2012-04-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2421677A1 (de) | Aufnahmeeinrichtung zur aufnahme von halbleitersubstraten | |
DE69837690T2 (de) | Gerät zur Entfernung von an einer Prüfspitzenendfläche haftenden Fremdstoffen | |
DE102007058555B4 (de) | Mehrschichtiges Substrat und Verfahren zur Herstellung desselben | |
WO2013023708A1 (de) | Vorrichtung und verfahren zum bonden von substraten | |
DE10297653T5 (de) | Verfahren zum Herstellen eines elektrischen Kontaktbauteils zur Prüfung einer elektrischen Vorrichtung und ein elektrisches Kontaktbauteil | |
EP1145292A1 (de) | Substrathalter | |
WO2010121703A1 (de) | Vorrichtung und verfahren zum trennen eines substrats von einem trägersubstrat | |
DE102014103446A1 (de) | Hubstift zur Substratverarbeitung | |
DE3942931C2 (de) | ||
DE112019006643T5 (de) | Kontaktanschluss, prüfmittel und prüfvorrichtung | |
DE19962702B4 (de) | Prüfsockel einer BGA-Vorrichtung | |
EP2652780A1 (de) | Aufnahmeeinrichtung zur aufnahme und halterung eines wafers | |
DE102011005797A1 (de) | System zur Herstellung zahntechnischer Formteile | |
WO2009062539A1 (de) | Platine sowie herstellung derselben | |
DE102010026610A1 (de) | Unterdruck-Saugeinheit und Greifer | |
EP1435106A2 (de) | Hebe- und stützvorrichtung | |
DE10007434B4 (de) | Trägermodul für eine Mikro-BGA-Vorrichtung | |
EP2765617A2 (de) | Verfahren zum Herstellen von Wafern, insbesondere von Wafern für Solarzellen, und Vorrichtung zum Herstellen von Wafern | |
DE102018208881B4 (de) | Verfahren und Vorrichtung zur Bestückung eines Trägers mit einem Bauteil | |
EP3185075B1 (de) | Vorrichtung für belichtungssystem | |
EP2793314A1 (de) | Kontaktfeder und dessen Verwendung | |
DE102019218444B4 (de) | Verfahren zur Herstellung einer Halbleitervorrichtung und Halbleitervorrichtung | |
DE102020116083B3 (de) | Vorrichtung mit einem Werkstückträger zur Drucksinterverbindung eines ersten und zweiten Verbindungspartners und Verfahren zur Drucksinterverbindung dafür | |
WO2001097281A2 (de) | Verfahren zur bearbeitung eines wafers | |
DE102019117602B3 (de) | Siliziumwaferverbund, Geometrie-Normal und Verfahren zur Herstellung eines Mikrobauteils |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080017785.3 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10712715 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010712715 Country of ref document: EP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2012506359 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20117025691 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 13138902 Country of ref document: US |