DE60217587D1 - Substrathalter und ein Belichtungsapparat - Google Patents
Substrathalter und ein BelichtungsapparatInfo
- Publication number
- DE60217587D1 DE60217587D1 DE60217587T DE60217587T DE60217587D1 DE 60217587 D1 DE60217587 D1 DE 60217587D1 DE 60217587 T DE60217587 T DE 60217587T DE 60217587 T DE60217587 T DE 60217587T DE 60217587 D1 DE60217587 D1 DE 60217587D1
- Authority
- DE
- Germany
- Prior art keywords
- exposure apparatus
- substrate holder
- holder
- substrate
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
- G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/7026—Focusing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001225574A JP2003037157A (ja) | 2001-07-26 | 2001-07-26 | 基板保持装置、露光装置、デバイス製造方法、半導体製造工場および半導体製造装置の保守方法 |
JP2001229889A JP2003045945A (ja) | 2001-07-30 | 2001-07-30 | 基板チャック及び露光装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60217587D1 true DE60217587D1 (de) | 2007-03-08 |
Family
ID=26619296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60217587T Expired - Lifetime DE60217587D1 (de) | 2001-07-26 | 2002-07-25 | Substrathalter und ein Belichtungsapparat |
Country Status (3)
Country | Link |
---|---|
US (1) | US6836316B2 (de) |
EP (1) | EP1280188B1 (de) |
DE (1) | DE60217587D1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60139801D1 (de) * | 2000-02-17 | 2009-10-15 | Panasonic Corp | Vorrichtung und verfahren zur elektrischen bauteilbestückung |
JP2003007601A (ja) * | 2001-06-26 | 2003-01-10 | Canon Inc | 2つの物体の間隔測定方法とそれを用いた半導体露光方法、および間隔測定装置、半導体露光装置 |
JP2004022655A (ja) * | 2002-06-13 | 2004-01-22 | Canon Inc | 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法 |
US7212015B2 (en) * | 2003-03-13 | 2007-05-01 | Canon Kabushiki Kaisha | Capacitance sensor type measuring apparatus |
JP2005044893A (ja) * | 2003-07-24 | 2005-02-17 | Canon Inc | 基板保持装置 |
JP2006165371A (ja) * | 2004-12-09 | 2006-06-22 | Canon Inc | 転写装置およびデバイス製造方法 |
WO2007013619A1 (ja) * | 2005-07-28 | 2007-02-01 | Kyocera Corporation | 試料保持具とこれを用いた試料吸着装置およびこれを用いた試料処理方法 |
TWI541615B (zh) | 2007-07-13 | 2016-07-11 | 瑪波微影Ip公司 | 在微影裝置中交換晶圓的方法 |
US8705010B2 (en) | 2007-07-13 | 2014-04-22 | Mapper Lithography Ip B.V. | Lithography system, method of clamping and wafer table |
DE102009018434B4 (de) * | 2009-04-22 | 2023-11-30 | Ev Group Gmbh | Aufnahmeeinrichtung zur Aufnahme von Halbleitersubstraten |
JP2014513869A (ja) * | 2011-04-22 | 2014-06-05 | マッパー・リソグラフィー・アイピー・ビー.ブイ. | ウェーハのようなターゲットを処理するためのリソグラフィシステム、及びウェーハのようなターゲットを処理するためのリソグラフィシステムを動作させる方法 |
US11378531B1 (en) | 2021-02-01 | 2022-07-05 | Applied Materials Israel Ltd. | Method for focusing an electron beam on a wafer having a transparent substrate |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69133413D1 (de) * | 1990-05-07 | 2004-10-21 | Canon Kk | Substratträger des Vakuumtyps |
JPH0851143A (ja) * | 1992-07-20 | 1996-02-20 | Nikon Corp | 基板保持装置 |
US5738165A (en) * | 1993-05-07 | 1998-04-14 | Nikon Corporation | Substrate holding apparatus |
US5822171A (en) * | 1994-02-22 | 1998-10-13 | Applied Materials, Inc. | Electrostatic chuck with improved erosion resistance |
JP3487368B2 (ja) * | 1994-09-30 | 2004-01-19 | 株式会社ニコン | 走査型露光装置 |
US5563689A (en) * | 1995-05-26 | 1996-10-08 | T/R Systems | Developer module with electromagnetic shutter |
US5923408A (en) * | 1996-01-31 | 1999-07-13 | Canon Kabushiki Kaisha | Substrate holding system and exposure apparatus using the same |
JP3814359B2 (ja) * | 1996-03-12 | 2006-08-30 | キヤノン株式会社 | X線投影露光装置及びデバイス製造方法 |
JP3526162B2 (ja) | 1997-02-04 | 2004-05-10 | キヤノン株式会社 | 基板保持装置および露光装置 |
JP3377165B2 (ja) | 1997-05-19 | 2003-02-17 | キヤノン株式会社 | 半導体露光装置 |
TW594426B (en) * | 1999-06-11 | 2004-06-21 | Asml Netherlands Bv | Lithographic projection apparatus, integrated circuit manufacturing method and integrated circuit made thereby |
EP1059566B1 (de) * | 1999-06-11 | 2006-08-23 | ASML Netherlands B.V. | Lithographischer Projektionsapparat |
WO2001011431A2 (en) | 1999-08-06 | 2001-02-15 | Applied Materials, Inc. | Method and apparatus of holding semiconductor wafers for lithography and other wafer processes |
EP1291910B1 (de) * | 2000-01-28 | 2007-01-10 | Hitachi Tokyo Electronics Co., Ltd. | Wafer-spannfutter, belichtungssystem und verfahren zur herstellung eines halbleiterbauelements |
JP2001332609A (ja) * | 2000-03-13 | 2001-11-30 | Nikon Corp | 基板保持装置及び露光装置 |
-
2002
- 2002-07-25 DE DE60217587T patent/DE60217587D1/de not_active Expired - Lifetime
- 2002-07-25 EP EP02255196A patent/EP1280188B1/de not_active Expired - Lifetime
- 2002-07-25 US US10/201,989 patent/US6836316B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1280188B1 (de) | 2007-01-17 |
EP1280188A2 (de) | 2003-01-29 |
US6836316B2 (en) | 2004-12-28 |
EP1280188A3 (de) | 2004-02-18 |
US20030020891A1 (en) | 2003-01-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |