WO2010103699A1 - 薄膜超電導線材および超電導ケーブル導体 - Google Patents
薄膜超電導線材および超電導ケーブル導体 Download PDFInfo
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- WO2010103699A1 WO2010103699A1 PCT/JP2009/070302 JP2009070302W WO2010103699A1 WO 2010103699 A1 WO2010103699 A1 WO 2010103699A1 JP 2009070302 W JP2009070302 W JP 2009070302W WO 2010103699 A1 WO2010103699 A1 WO 2010103699A1
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
- C23C28/3455—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer with a refractory ceramic layer, e.g. refractory metal oxide, ZrO2, rare earth oxides or a thermal barrier system comprising at least one refractory oxide layer
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/04—Single wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B12/00—Superconductive or hyperconductive conductors, cables, or transmission lines
- H01B12/02—Superconductive or hyperconductive conductors, cables, or transmission lines characterised by their form
- H01B12/06—Films or wires on bases or cores
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- H—ELECTRICITY
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- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/20—Permanent superconducting devices
- H10N60/203—Permanent superconducting devices comprising high-Tc ceramic materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
- Y10T428/2913—Rod, strand, filament or fiber
- Y10T428/2933—Coated or with bond, impregnation or core
Definitions
- a plurality of cable cores constituting a superconducting cable disclosed in the following Japanese Patent Application Laid-Open No. 2006-331893 has the following configuration. That is, the cable core is a first composed of a former located at the center of the cable core and a superconducting wire wound around the former (a superconducting wire in which a superconducting filament is covered with a stabilizing metal such as silver). A superconducting layer, an insulating layer formed outside the first superconducting layer, and a second superconducting layer formed outside the insulating layer are provided.
- the diameter of the second superconducting layer disposed outside is larger than that of the first superconducting layer disposed inside.
- the value of the bending stress applied when, for example, the cable core is wound around the surface of the former or the insulating layer is larger in the second superconducting layer than in the first superconducting layer. Therefore, in Patent Document 1, the tensile strength of the material forming the second superconducting layer is made higher than the tensile strength of the material forming the first superconducting layer (specifically, the reinforcement covering the surface of the second superconducting layer).
- the tensile strength of the second superconducting layer subjected to a large bending stress is increased.
- a treatment is performed to make it higher than the tensile strength of one superconducting layer. In this way, the bending characteristics of the cable core and the superconducting cable are improved.
- the inventor performs a metal plating process (specifically, a copper plating process) on the thin film superconducting wire having a laminated structure including a superconducting layer so as to cover the surface of the laminated structure in order to protect the laminated structure. It was investigated.
- the copper plating thin film formed on the surface of the laminated structure by the copper plating process has a role of protecting the superconducting layer from erosion and the like.
- this copper plating thin film is considered to correspond to the coating layer of the second superconducting layer in Patent Document 1 described above, the thin film superconducting wire is formed on the thin film superconducting wire having the copper plating thin film formed on the surface.
- the bending characteristics were investigated on the assumption that the wire was wound around. As a result, the bending characteristics of the thin film superconducting wire formed with the copper plating thin film were deteriorated as compared with the thin film superconducting wire not formed with the copper plating thin film.
- the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a thin-film superconducting wire having a copper-plated thin film that can suppress deterioration of bending characteristics, and It is to provide a superconducting cable conductor having a thin film superconducting wire.
- the thin film superconducting wire when the thin film superconducting wire is wound around the outer periphery of the former, if the superconducting layer of the thin film superconducting wire is located on the outer side in the radial direction when viewed from the former, a tensile stress is applied to the superconducting layer. . And when the copper plating thin film to which the tensile stress is applied as the above residual stress exists outside the laminated structure including the superconducting layer as described above, the residual stress of the copper plating thin film is applied to the superconducting layer. The tensile stress resulting from is further loaded.
- the thin film superconducting wire according to the present invention includes a substrate, an intermediate layer formed on one main surface of the substrate, and an intermediate layer opposite to the main surface facing the substrate.
- the thin film superconducting wire further includes a copper plating thin film covering the outer periphery of the laminated structure, and the residual stress inside the copper plating thin film is a compressive stress.
- the compressive residual stress acting in the direction opposite to the tensile stress associated with the winding described above cancels the tensile stress caused by the winding, thereby reducing the tensile stress caused by the winding (or if the residual stress value is sufficiently large, the tensile stress caused by the winding is canceled and the inside of the copper plating thin film is reduced.
- the stress can be a compressive stress).
- the laminated structure further includes a sputtered silver layer disposed on the main surface of the substrate that does not face the intermediate layer and on the main surface of the superconducting layer that does not face the intermediate layer. Is preferred.
- the silver sputter layer acts as a conductive layer that conducts current to the surface of the laminated structure when performing a plating process for forming a copper plating thin film constituting the thin film superconducting wire.
- a plating process for forming a copper plating thin film constituting the thin film superconducting wire for example, of the main surface (the largest main surface among the surfaces) constituting the laminated structure, on the main surface opposite to the main surface facing the intermediate layer (the outermost surface) of the superconducting layer, and the substrate A silver sputter layer is formed on the main surface opposite to the main surface facing the intermediate layer (the outermost surface). If it does in this way, the plating process which forms a copper plating thin film can be smoothly performed by sending an electric current through the surface of a laminated structure using said 1 pair of sputtered silver layers.
- the silver sputter layer formed on the main surface (which is the outermost surface) of the superconducting layer acts as a protective layer for suppressing the superconducting layer from being eroded by, for example, a plating solution. Therefore, the possibility that the superconducting layer is damaged by the plating process can be reduced by forming the silver sputter layer.
- a silver coating layer covering the outer periphery of the laminated structure is further provided between the copper plating thin film and the laminated structure.
- the silver coating layer is a thin film layer formed after forming the laminated structure and before forming the copper plating thin film covering the outer periphery of the laminated structure, and protects the superconducting layer and the like from the copper plating solution for performing the copper plating treatment. It has a role. Therefore, if the said silver coating layer is formed, the freedom degree of selection of the copper plating solution used for a copper plating process can be improved.
- the superconducting cable formed by winding the above-described thin film superconducting wire on the surface of a former, for example, is a copper-plated thin film on the side where the superconducting layer is arranged when the superconducting layer is wound so that the side on which the superconducting layer is arranged faces outward
- the tensile stress applied to is reduced by the compressive stress as the residual stress inside the copper plating thin film. For this reason, possibility that a big tensile stress will be added to a superconducting layer can be reduced. Therefore, as described above, since the electrical characteristics and bending characteristics of the thin film superconducting wire can be improved, the electrical characteristics and bending characteristics of the superconducting cable can be improved.
- the residual stress inside the copper plating thin film covering the outer periphery of the laminated structure is a compressive stress.
- the tensile stress applied to the copper plating thin film facing outward is the same as that of the superconducting layer. It becomes smaller due to compressive stress, which is stress. For this reason, the electrical property and bending property of a thin film superconducting wire can be improved.
- FIGS. 1, 5 and 6 are schematic cross-sectional views of a cross section cut in a direction crossing the extending direction of the thin film superconducting wire according to the present embodiment.
- the direction intersecting the paper surface is the longitudinal direction of the thin film superconducting wire 10
- the superconducting current of the superconducting layer 5 flows in a direction along the direction intersecting the paper surface.
- 1, 5, and 6 in order to make the drawings easy to see, the difference in length between the vertical direction and the horizontal direction of the rectangular shape of the cross section is reduced, but in fact the thickness of the cross section in the vertical direction is Very small compared to the width in the horizontal direction.
- a thin film superconducting wire 10 has a long shape (tape shape) having a rectangular cross section, and here, a relative shape extending in the longitudinal direction of the long shape.
- the surface with a large area is the main surface.
- the thin film superconducting wire 10 includes a laminated structure 20, a silver coating layer 7 disposed so as to cover the outer periphery of the laminated structure 20, and a copper plating thin film 9 disposed so as to cover the outer periphery of the silver coating layer 7.
- the stacked structure 20 includes a substrate 1, an intermediate layer 3 formed on one main surface of the substrate 1, and a main surface of the intermediate layer 3 opposite to the main surface facing the substrate 1 (the upper surface in FIG. 1).
- Superconducting layer 5 formed on the main surface) and silver sputtered layer 6 are included.
- the sputtered silver layer 6 is formed on the main surface of the substrate 1 that does not face the intermediate layer 3 (lower main surface in FIG. 1) and the main surface of the superconducting layer 5 that does not face the intermediate layer 3 (upper side in FIG. 1).
- the silver sputter layer 6 is disposed so as to sandwich the substrate 1, the intermediate layer 3, and the superconducting layer 5 from the upper and lower main surface sides. That is, the laminated structure 20 is formed by the substrate 1, the intermediate layer 3, the superconducting layer 5, and the silver sputtered layer 6 described above.
- the substrate 1 is preferably made of, for example, Hastelloy (registered trademark) or a nickel base alloy and has a long shape (tape shape) with a rectangular cross section.
- the length that the thin film superconducting wire 10 extends in the extending direction is, for example, 100 m or more, and the length (width) that intersects the extending direction is, for example, about 10 mm.
- the cross-sectional area of the substrate 1 is small.
- the thickness of the substrate 1 is preferably about 0.1 mm, for example.
- the intermediate layer 3 is disposed between the substrate 1 and the superconducting layer 5.
- a material such as Gd 2 Zr 2 O 7 (an oxide of Gd (gadolinium) and Zr (zirconium)), CeO 2 (cerium oxide), or YSZ (yttria stabilized zirconia) is preferably used. . If these materials are used as the intermediate layer 3, it becomes easy to align the crystal axis of the superconducting layer 5 formed on the main surface of the intermediate layer 3.
- the superconducting layer 5 is a thin film layer through which a superconducting current flows in the thin film superconducting wire 10, and is preferably composed of, for example, a yttrium-based (YBa 2 Cu 3 O x ) thin film that is a superconducting material. Further, in order to improve the value of the critical current Ic of the superconducting current flowing in the superconducting layer 5, the thickness of the superconducting layer 5 is preferably 0.1 ⁇ m or more and 10 ⁇ m or less.
- the plating process for forming the copper plating thin film 9 can be easily performed on the multilayer structure 20 including the silver coating layer 7. . That is, the copper plating thin film 9 is formed on the outer surface of the silver coating layer 7.
- the said silver coating layer 7 has the thickness mentioned above, there exist the following effects. Specifically, when the plating process is performed, the laminated structure 20 is immersed in a copper plating solution. Since the surface of the superconducting layer 5 is covered with the silver coating layer 7, the surface of the superconducting layer 5 is directly coated with the copper plating solution. Do not touch.
- the silver coating layer 7 is disposed on the thin film superconducting wire 10, for example, when a malfunction such as quenching occurs in the superconducting layer 5, a part of the excessive current flowing in the superconducting layer 5 is shunted to form silver.
- the coating layer 7 can be made to flow. Therefore, damage to the superconducting layer 5 due to excessive current flowing through the superconducting layer 5 can be suppressed.
- the copper plating thin film 9 is arranged so as to cover the outer periphery of the silver coating layer 7 described above, that is, to cover almost the entire outermost surface of the silver coating layer 7.
- the copper plating thin film 9 is a copper thin film formed by plating, and the thickness is preferably 0.1 ⁇ m or more and 50 ⁇ m or less.
- the aspect of the thin film superconducting wire 30 is different from the aspect of the thin film superconducting wire 10. That is, in other components, the thin film superconducting wire 30 is in the same mode as the thin film superconducting wire 10. More specifically, as for the copper plating thin film 9 in the thin film superconducting wire 30, the internal residual stress is a compressive stress as in the copper plating thin film 9 in the thin film superconducting wire 10. Thus, even if a tensile stress is applied to the copper plating thin film 9 on the side where the superconducting layer 5 is disposed, the tensile stress is reduced by the action of the compressive stress, and the effect of suppressing the deterioration of the superconducting layer 5 is exhibited. Therefore, the thin film superconducting wire according to the present embodiment may be an aspect of the thin film superconducting wire 30.
- the aspect of the thin film superconducting wire 50 is different from the aspect of the thin film superconducting wire 30. That is, in other components, the thin film superconducting wire 50 is in the same mode as the thin film superconducting wire 30. More specifically, as for the copper plating thin film 9 in the thin film superconducting wire 50, the internal residual stress is a compressive stress as in the copper plating thin film 9 in the thin film superconducting wire 10.
- the thin film superconducting wire according to the present embodiment may be an aspect of the thin film superconducting wire 50.
- the silver sputtered layer 6 By disposing the silver sputtered layer 6 not only in the direction of the main surface of the laminated structure 20 but also in the direction intersecting the main surface of the laminated structure 20 (vertical direction in FIG. 6), the silver sputtered layer 6 is coated with silver. Similar to the layer 7, the entire structure of the outer periphery of the multilayer structure 20 is covered. For this reason, the effect as a protective layer which reduces possibility that malfunctions, such as superconducting layer 5 being eroded with a copper plating solution, will occur like the silver coating layer 7 at the time of performing plating processing which forms copper plating thin film 9. Play.
- the silver sputtered layer 6 of the thin film superconducting wire 50 is a part of the excessive current flowing in the superconducting layer 5 when, for example, the superconducting layer 5 has a problem such as quenching, similar to the silver coating layer 7 described above. Can be provided (role as a stabilizing layer). Therefore, damage to the superconducting layer 5 due to excessive current flowing through the superconducting layer 5 can be suppressed.
- the silver sputtered layer 6 is formed on the entire periphery of the laminated structure 20 like the silver coating layer 7 (see FIG. 1) like the thin film superconducting wire 50, for example, compared with the silver sputtered layer 6 in the thin film superconducting wire 10 It is preferable to increase the thickness of the silver sputter layer 6. Specifically, the thickness is preferably 0.5 ⁇ m or more and 50 ⁇ m or less.
- the thin film superconducting wire 10 when used, the thin film superconducting wire 10 is spirally wound around the outer peripheral surface of the cylindrical former 60 as shown in FIG. In this way, a plurality of thin film superconducting wires 10 are spirally laminated on the former 60 in a spiral manner to form a superconducting cable conductor 70 shown in FIG.
- the outer side of the winding of each thin film superconducting wire 10 is the side on which the superconducting layer 5 is disposed (upper side in FIG. 1), and the inner side of the winding of the thin film superconducting wire 10 is It winds so that it may become the side (lower side in FIG.
- the side on which the substrate 1 is disposed is the side facing the outer peripheral surface of the former 60, and the side on which the superconducting layer 5 is disposed does not face the former 60. It is the side facing the outside of the winding.
- the tensile stress 11 (see FIG. 4) applied to the main surface of the copper plating thin film 9 on the side where the superconducting layer 5 of the thin film superconducting wire 10 is disposed is the inside of the copper plating thin film 9.
- the compressive stress 12 becomes smaller (see FIG. 4).
- the stress applied to the superconducting layer 5 of the thin film superconducting wire 10 is reduced, and the occurrence of problems such as a decrease in the critical current Ic due to deterioration and breakage of the thin film superconducting wire 10 is suppressed, and the electrical characteristics and bending characteristics are improved. be able to.
- the first layer 10a is clockwise in the figure
- the second layer 10b is counterclockwise in the figure
- the third layer 10c is clockwise
- the fourth layer 10d is counterclockwise in the figure.
- the thin film superconducting wire 10 is wound with the directions alternately changed.
- the winding direction of the first layer 10a to the fourth layer 10d is not limited to this, and may be wound in any direction.
- the first layer 10a and the second layer 10b may be right-handed in the drawing
- the third layer 10c and the fourth layer 10d may be left-handed in the drawing
- all of the first layer 10a to the fourth layer 10d have the same direction. It may be wound around.
- a step (S10) of forming a laminated structure is first performed. Specifically, this is a step of forming a laminated structure 20 of each thin film superconducting wire shown in FIGS. As shown in the flowchart of FIG. 10, the step of forming the laminated structure (S10) further includes a step of preparing a superconducting layer (S11) and a step of forming a silver sputter layer (S12). .
- the step of preparing the superconducting layer (S11) will be specifically described.
- a structure in which the substrate 1 and the intermediate layer 3 are laminated is prepared.
- an IBAD method ion beam assisted vapor deposition method
- a PLD method pulse laser vapor deposition method
- a sputtering method can be used. If these methods are used, the crystal orientation of the superconducting layer 5 formed on the main surface of the intermediate layer 3 can be improved.
- the intermediate layer 3 may be a single layer, or may be configured by laminating a plurality of layers.
- superconducting layer 5 is formed on the main surface of intermediate layer 3.
- the superconducting layer 5 is preferably formed of a thin film made of, for example, an yttrium (YBa 2 Cu 3 O x ) superconductor by using a PLD method, a high frequency sputtering method, or a MOD method (organic metal deposition method).
- the main surface of the laminated structure 20 is the surface of the target material so that the end face of the laminated structure 20 faces the sputtering target material.
- positioning with respect to, can be used.
- the main structure of the multilayer structure 20 with respect to the surface of the target material is formed so that the silver sputter layer 6 is simultaneously formed on one of the main surfaces of the multilayer structure 20 (for example, the outermost surface of the superconducting layer 5) and one of the side end faces.
- the inclination accuracy of the surface may be adjusted as appropriate.
- the copper plating thin film 9 is formed by the process (S30) of forming a copper plating thin film.
- the step of forming the copper plating thin film (S30) is a step of preparing a copper plating solution (S31), a step of adding an additive (S32), and a step of performing a plating process. (S33).
- a copper plating solution used for immersing the laminated structure 20 to form the copper plating thin film 9 for example, a solution obtained by dissolving copper sulfate in a sulfuric acid solution or a solution obtained by dissolving copper pyrophosphate in ammonia water is used. Is preferred.
- a liquid phase in which copper pyrophosphate is dissolved in ammonia water In order to prevent the surface of the superconducting layer 5 constituting the laminated structure 20 from being eroded when the laminated structure 20 is immersed, it is more preferable to use a plating solution in which copper sulfate is dissolved in sulfuric acid.
- a step (S32) of adding an additive is performed as shown in FIG. Specifically, this is a step of adding an additive to the copper plating solution in order to improve the smoothness and gloss of the surface of the formed copper plating thin film 9.
- thiourea 8 ppm or more of thiourea with respect to a solution in which copper sulfate is dissolved in sulfuric acid (for example, a solution having a copper sulfate concentration of 60 g / l (liter) to 150 g / l and a sulfuric acid concentration of 100 g / l to 220 g / l). It is preferable to add so that it may become a density
- the temperature of the liquid phase is preferably 20 ° C. or higher and 30 ° C. or lower.
- the temperature of the solution is preferably 50 ° C. or more and 60 ° C. or less.
- a thin film superconducting wire 90 shown in FIG. 12 in which a copper plating thin film 9 is formed using a plating solution obtained by dissolving copper sulfate in a sulfuric acid solvent as a copper plating solution is prepared, and inside the copper plating thin film 9 of the thin film superconducting wire 90.
- a test was conducted to investigate the residual stress.
- three types of copper plating solutions A, B, and C were prepared according to the concentration of copper sulfate pentahydrate (CuSO 4 .5H 2 O) dissolved in a sulfuric acid solvent. Then, the silver coating layer 7 covering almost the entire outer periphery of the laminated structure 20 of the thin film superconducting wire 10 shown in FIG. 1 is arranged so as to be connected to the cathode of the equipment for performing the plating process, and the electroplating process is performed. . In addition to the thiourea added as an additive, a small amount of chlorine ions was added to the copper plating solutions A, B, and C in order to suppress the action of the copper plating solution eroding the laminated structure 20.
- CuSO 4 .5H 2 O copper sulfate pentahydrate
- a first intermediate layer 3a, a second intermediate layer 3b, and a third intermediate layer are formed on one main surface of a tape-shaped substrate made of a nickel-tungsten alloy as a substrate 1 and having a width of 10 mm and a thickness of 80 ⁇ m.
- each CeO thickness 0.1 [mu] m 2 as 3c, thickness 0.3 [mu] m YSZ, the CeO 2 having a thickness of 0.1 [mu] m were formed in this order by an RF sputtering method.
- first intermediate layer 3a, second intermediate layer 3b, and third intermediate layer 3c are combined to form an intermediate layer 3. Further, the surface of the structure in which the superconducting layer 5 made of RE123 (REBa 2 Cu 3 O 7- ⁇ ) having a thickness of 2 ⁇ m is formed on the third intermediate layer 3c by using the PLD method is coated with silver by using the DC sputtering method. Layer 7 was formed. The thickness of the silver coating layer 7 is 8 ⁇ m for the silver coating layer 7 formed on the main surface of the superconducting layer 5, 2 ⁇ m for the silver coating layer 7 on the main surface of the substrate 1, and silver formed on both sides along the stacking direction. The coating layer 7 was 3 ⁇ m.
- the copper plating thin film 9 was formed under the conditions shown in Table 1 below by changing the concentration of these copper sulfates, the current density flowing through the cathode during the plating process, and the time for performing the plating process. As a result, a copper plating thin film 9 having a thickness of 20 ⁇ m was formed. The results of measuring the direction and magnitude of the residual stress inside the copper-plated thin film 9 of the thin film superconducting wire 10 thus formed are also shown in Table 1 below. The residual stress was evaluated using an X-ray stress measuring device.
- a thin film superconducting wire 90 in which a copper plating thin film 9 is formed is formed using a liquid phase obtained by dissolving copper pyrophosphate in ammonia water as a copper plating solution, and the residual stress inside the copper plating thin film 9 of the thin film superconducting wire 90 is investigated. A test was conducted.
- a copper plating solution D in which copper pyrophosphate was dissolved in ammonia water was prepared. Moreover, the material of the same structure as the material used in Example 1 mentioned above was used as an object material of a plating process. Then, the thin film superconducting wire 90 shown in FIG. 12 was disposed so that the silver coating layer 7 covering almost the entire outer periphery of the laminated structure 20 was connected to the cathode of the equipment for performing the plating process, and the electroplating process was performed. . Further, not only copper pyrophosphate but also potassium pyrophosphate which is a highly soluble potassium salt having phosphate ions was dissolved in the copper plating solution D. This is for securing the amount of phosphate ions dissolved in the liquid phase of the copper plating solution D.
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Abstract
Description
Claims (4)
- 基板(1)と、
前記基板(1)の一方の主表面上に形成された中間層(3)と、
前記中間層(3)の、前記基板(1)と対向する主表面と反対側の主表面上に形成された超電導層(5)とを含む積層構造(20)を備える薄膜超電導線材(10,30,50,90)であり、
前記積層構造(20)の外周を覆う銅めっき薄膜(9)をさらに備えており、
前記銅めっき薄膜(9)の内部の残留応力が圧縮応力になっている、薄膜超電導線材。 - 前記積層構造(20)には、基板(1)の、前記中間層(3)と対向しない主表面上と、前記超電導層(5)の、前記中間層(3)と対向しない主表面上とに配置された銀スパッタ層(6)をさらに含む、請求の範囲第1項に記載の薄膜超電導線材。
- 前記銅めっき薄膜(9)と前記積層構造(20)との間に、前記積層構造(20)の外周を覆う銀被覆層(7)をさらに備える、請求の範囲第1項に記載の薄膜超電導線材。
- 請求の範囲第1項に記載の薄膜超電導線材(10,30,50,90)を有する超電導ケーブル導体。
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DE112009003488T DE112009003488T5 (de) | 2009-03-11 | 2009-12-03 | Supraleitender Dünnfilmdraht und supraleitender Kabelleiter |
US13/133,274 US9255320B2 (en) | 2009-03-11 | 2009-12-03 | Thin film superconducting wire and superconducting cable conductor |
CN2009801498295A CN102165536A (zh) | 2009-03-11 | 2009-12-03 | 薄膜超导导线和超导电缆导体 |
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JP2009057870A JP5084766B2 (ja) | 2009-03-11 | 2009-03-11 | 薄膜超電導線材および超電導ケーブル導体 |
JP2009-057870 | 2009-03-11 |
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JP (1) | JP5084766B2 (ja) |
KR (1) | KR20110127634A (ja) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013045229A1 (de) * | 2011-09-27 | 2013-04-04 | Siemens Aktiengesellschaft | Bandförmiger hochtemperatur-supraleiter und verfahren zur herstellung eines bandförmigen hochtemperatur-supraleiters |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5634166B2 (ja) * | 2010-08-23 | 2014-12-03 | 株式会社フジクラ | 酸化物超電導線材およびその製造方法 |
JP5727278B2 (ja) * | 2011-04-15 | 2015-06-03 | 住友電気工業株式会社 | 酸化物超電導薄膜線材の製造方法 |
EP2806430B1 (en) * | 2012-02-23 | 2020-02-26 | Fujikura Ltd. | Superconducting current lead, superconducting current lead device, and superconducting magnet device |
KR101458513B1 (ko) * | 2012-08-29 | 2014-11-07 | 주식회사 서남 | 초전도 선재 제조방법 및 그에 의해 제조된 초전도 선재 |
WO2014203494A1 (en) * | 2013-06-19 | 2014-12-24 | Sumitomo Electric Industries, Ltd. | Reinforced superconducting wire and method for manufacturing the same |
JP2015028912A (ja) * | 2013-07-05 | 2015-02-12 | 中部電力株式会社 | 超電導線材及びそれを用いた超電導コイル |
JP6012658B2 (ja) * | 2014-04-01 | 2016-10-25 | 株式会社フジクラ | 酸化物超電導線材とその製造方法 |
WO2016185751A1 (ja) * | 2015-05-15 | 2016-11-24 | 住友電気工業株式会社 | 超電導線材 |
CN104953022A (zh) * | 2015-05-15 | 2015-09-30 | 富通集团(天津)超导技术应用有限公司 | 超导线材的制备方法 |
WO2018109205A1 (en) * | 2016-12-16 | 2018-06-21 | Cern - European Organization For Nuclear Research | Method of manufacturing a tape for a continuously transposed conducting cable and cable produced by that method |
US11705253B2 (en) | 2017-02-14 | 2023-07-18 | Sumitomo Electric Industries, Ltd. | Superconducting wire and superconducting coil |
DE112017007057T5 (de) * | 2017-02-14 | 2019-10-24 | Sumitomo Electric Industries, Ltd. | Supraleitender draht und supraleitende spule |
US20200211741A1 (en) * | 2017-05-12 | 2020-07-02 | Fujikura Ltd. | Superconducting wire and superconducting coil |
JP6349439B1 (ja) * | 2017-05-12 | 2018-06-27 | 株式会社フジクラ | 超電導コイル |
JP6318284B1 (ja) * | 2017-05-12 | 2018-04-25 | 株式会社フジクラ | 超電導線材 |
JPWO2018216064A1 (ja) * | 2017-05-22 | 2020-03-26 | 住友電気工業株式会社 | 超電導線材および超電導コイル |
CN108342757B (zh) * | 2018-02-05 | 2020-04-10 | 苏州新材料研究所有限公司 | 一种电镀铜制备高温超导带材保护层的方法 |
WO2021205495A1 (ja) * | 2020-04-06 | 2021-10-14 | 株式会社フジクラ | 酸化物超電導線材及び超電導コイル |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342396A (ja) * | 1986-08-04 | 1988-02-23 | ユナイテッド・テクノロジ−ズ・コ−ポレイション | ガスタービンエンジンの複合材料製ファン出口ガイドベーン |
JPH07335051A (ja) * | 1994-06-02 | 1995-12-22 | Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai | 安定化層を備えた酸化物超電導テープ及びその製造方法 |
JP2003008307A (ja) * | 2001-06-25 | 2003-01-10 | Tdk Corp | 電子部品及びその製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6391166B1 (en) * | 1998-02-12 | 2002-05-21 | Acm Research, Inc. | Plating apparatus and method |
US20040266628A1 (en) * | 2003-06-27 | 2004-12-30 | Superpower, Inc. | Novel superconducting articles, and methods for forming and using same |
DE602005022650D1 (de) * | 2004-04-26 | 2010-09-16 | Rohm & Haas Elect Mat | Verbessertes Plattierungsverfahren |
DE102004048648B4 (de) | 2004-10-04 | 2006-08-10 | Siemens Ag | Vorrichtung zur Strombegrenzung vom resistiven Typ mit bandfömigem Hoch-Tc-Supraleiter |
JP4662203B2 (ja) | 2005-05-26 | 2011-03-30 | 住友電気工業株式会社 | 超電導ケーブル |
JP5119582B2 (ja) | 2005-09-16 | 2013-01-16 | 住友電気工業株式会社 | 超電導線材の製造方法および超電導機器 |
-
2009
- 2009-03-11 JP JP2009057870A patent/JP5084766B2/ja active Active
- 2009-12-03 KR KR1020117010938A patent/KR20110127634A/ko not_active Application Discontinuation
- 2009-12-03 CN CN2009801498295A patent/CN102165536A/zh active Pending
- 2009-12-03 DE DE112009003488T patent/DE112009003488T5/de not_active Withdrawn
- 2009-12-03 WO PCT/JP2009/070302 patent/WO2010103699A1/ja active Application Filing
- 2009-12-03 US US13/133,274 patent/US9255320B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6342396A (ja) * | 1986-08-04 | 1988-02-23 | ユナイテッド・テクノロジ−ズ・コ−ポレイション | ガスタービンエンジンの複合材料製ファン出口ガイドベーン |
JPH07335051A (ja) * | 1994-06-02 | 1995-12-22 | Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai | 安定化層を備えた酸化物超電導テープ及びその製造方法 |
JP2003008307A (ja) * | 2001-06-25 | 2003-01-10 | Tdk Corp | 電子部品及びその製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013045229A1 (de) * | 2011-09-27 | 2013-04-04 | Siemens Aktiengesellschaft | Bandförmiger hochtemperatur-supraleiter und verfahren zur herstellung eines bandförmigen hochtemperatur-supraleiters |
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US20110244234A1 (en) | 2011-10-06 |
CN102165536A (zh) | 2011-08-24 |
US9255320B2 (en) | 2016-02-09 |
DE112009003488T5 (de) | 2012-06-14 |
JP2010212134A (ja) | 2010-09-24 |
KR20110127634A (ko) | 2011-11-25 |
JP5084766B2 (ja) | 2012-11-28 |
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