WO2010102454A1 - 一种射频单元以及集成天线 - Google Patents
一种射频单元以及集成天线 Download PDFInfo
- Publication number
- WO2010102454A1 WO2010102454A1 PCT/CN2009/070783 CN2009070783W WO2010102454A1 WO 2010102454 A1 WO2010102454 A1 WO 2010102454A1 CN 2009070783 W CN2009070783 W CN 2009070783W WO 2010102454 A1 WO2010102454 A1 WO 2010102454A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- power amplifier
- duplexer
- amplifier circuit
- radio frequency
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/02—Transmitters
- H04B1/03—Constructional details, e.g. casings, housings
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/40—Circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
Definitions
- the present invention relates to the field of communications technologies, and in particular, to a radio frequency unit and an integrated antenna. Background technique
- FIG. 1 is a schematic structural diagram of a radio frequency unit in the prior art.
- the radio frequency unit 100 includes a duplexer 10, a power amplifier circuit board 30, and a transceiver circuit board 50.
- the duplexer 10 is connected to the power amplifier circuit board 30 and the transceiver circuit board 50.
- the power amplifier circuit board 30 is connected to the power amplifier circuit board 30. Connected to the transceiver circuit board 50, wherein the power amplifier circuit board 30 is opposite the transceiver circuit board 50.
- the radio frequency unit 100 further includes a first box body 71 and a second box body 73.
- the first box body 71 and the second box body 73 can form a closed cavity.
- the power amplifier circuit board 30 and the transceiver circuit board 50 are located. The closed cavity.
- the first case 71 and the second case 73 are provided with heat dissipating teeth, and the heat generated by the power amplifier circuit board 30 and the transceiver circuit board 50 can be dissipated through the heat dissipating teeth of the first case 71 and the second case 73. .
- the radio frequency unit 100 is usually integrated with an antenna.
- the transmission device transmits the digital signal to the baseband processing unit through an optical fiber or a cable, and the baseband processing unit converts the digital signal into an analog signal, and the analog signal passes through the transceiver circuit board.
- 10 is processed into a radio frequency small signal, and the radio frequency small signal is amplified into a high-power radio frequency signal through the power amplifier circuit board 30, and then transmitted to the antenna through the duplexer 10 filter, so that the antenna can convert the radio frequency signal into electromagnetic wave radiation; when receiving the signal
- the antenna receives the electromagnetic wave from the terminal, converts the electromagnetic wave into a radio frequency signal, and the RF signal is filtered by the duplexer 10 and transmitted to the transceiver circuit board 50.
- the transceiver circuit board 50 processes the signal into an analog signal and transmits it to the baseband processing unit.
- the baseband processing unit then processes the analog signal into a digital signal for transmission to the transmission device.
- the power amplifier circuit board 30 and the transceiver circuit board 50 When the RF unit 100 is in operation, the power amplifier circuit board 30 and the transceiver circuit board 50 generate heat, and the power amplifier circuit board 30 is opposed to the transceiver circuit board 50. Thus, the heat generated by the power amplifier circuit board 30 may affect the Transceiver circuit board 50, which may affect the heat dissipation of the radio frequency unit 100 effectiveness.
- the embodiment of the invention provides a radio frequency unit and an integrated antenna, which can improve the heat dissipation efficiency of the radio frequency unit.
- An embodiment of the present invention provides a radio frequency unit, where the radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board, and the duplexer is connected to the power amplifier circuit board and the transceiver circuit board.
- the power amplifier circuit board and the transceiver circuit board are connected, wherein the power amplifier circuit board and the transceiver circuit board are respectively located at two ends of the duplexer, and the power amplifier circuit board and the The transceiver circuit boards are projected to the same plane along the direction perpendicular to the power amplifier circuit board without overlapping.
- An embodiment of the present invention further provides an integrated antenna, where the integrated antenna includes an antenna unit and a radio frequency unit, where the radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board, where the duplexer and the duplexer
- the power amplifier circuit board is connected to the transceiver circuit board, and the power amplifier circuit board is connected to the transceiver circuit board, wherein the power amplifier circuit board and the transceiver circuit board are respectively located in the pair
- the power amplifier circuit board and the transceiver circuit board are projected to the same plane in a direction perpendicular to the power amplifier circuit board without overlapping, and the duplexer passes through the coaxial connector and the antenna unit Board connection.
- the power amplifier circuit board and the transceiver circuit board are respectively located at both ends of the duplexer, and the power amplifier circuit board and the transceiver circuit board are projected to the same plane along the direction perpendicular to the power amplifier circuit board. Without overlap, the heat generated by the power amplifier circuit board is difficult to affect the transceiver circuit board, and the radio frequency unit adopting such a layout can improve the heat dissipation efficiency of the radio frequency unit.
- FIG. 1 is a schematic structural view of a radio frequency unit in the prior art
- FIG. 2 is a schematic structural diagram of a radio frequency unit according to an embodiment of the present invention.
- FIG. 3 is another schematic structural diagram of a radio frequency unit according to an embodiment of the present invention.
- FIG. 4 is another schematic structural diagram of a radio frequency unit according to an embodiment of the present invention.
- 5 is a schematic structural view of a power amplifier circuit board and a radio frequency unit in a common board according to an embodiment of the present invention;
- FIG. 6 is a schematic structural diagram of an integrated antenna according to an embodiment of the present invention.
- FIG. 7 is still another schematic structural diagram of an integrated antenna according to an embodiment of the present invention.
- FIG. 8 is a schematic diagram showing a connection between a coaxial connector of a duplexer and a feeder network circuit board in an integrated antenna according to an embodiment of the present invention
- FIG. 9 is a schematic diagram showing a connection between a coaxial connector of a duplexer and a feeder network circuit board in an integrated antenna according to an embodiment of the present invention.
- FIG. 10 is a schematic diagram of a coaxial connector of a duplexer in an integrated antenna connected to a feeder network circuit board according to an embodiment of the present invention
- FIG. 11 is a schematic structural diagram of an integrated antenna including a sun shield according to an embodiment of the present invention.
- a radio frequency unit 200 includes a duplexer 20, a power amplifier circuit board 40, and a transceiver circuit board 60.
- the duplexer 20 is connected to the power amplifier circuit board 40 and the transceiver circuit board 60.
- the circuit board 40 is connected to the transceiver circuit board 60.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, the power amplifier circuit board 40 and the transceiver circuit board. 60 is projected in the direction perpendicular to the power amplifier circuit board 40 to the same plane without overlapping.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, and the power amplifier circuit board 40 and the The transceiver circuit board 60 is projected to the same plane in the direction perpendicular to the power amplifier circuit board 40 without overlap.
- the heat generated by the power amplifier circuit board 40 hardly affects the transceiver circuit board 60.
- the radio frequency unit 200 adopting such a layout can be improved.
- the direction of the power amplifier circuit board 40 is perpendicular as shown by an arrow 46 in FIG. 2, and the plane perpendicular to the direction of the arrow is a plane 48.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively A projection is formed on the plane 48, and the power amplifier circuit board 40 and the transceiver circuit board The projections formed on the plane 48, respectively, 60 have no overlap.
- the side of the power amplifier circuit board 40 is provided with heat dissipating teeth
- the side of the transceiver circuit board 60 is provided with heat dissipating teeth.
- the power amplifier circuit board 40 and the transceiver circuit board are located on the same plane. It should be noted that the power amplifier circuit board 40 and the transceiver circuit board are located on the same plane, and are not necessarily in the same geometric plane. There may be a certain error, and the error may be about 10%, or 15%. As long as it can improve the heat dissipation efficiency of the RF unit. Of course, it can also be understood as the same plane in a strictly geometric sense.
- the radio frequency unit 200 further includes a baseband processing unit and a hybrid connector 66.
- the transceiver circuit board 60 is coupled to the baseband processing unit, and the baseband processing unit is coupled to the transmission device and the power supply device via the hybrid connector 66.
- the power supply unit supplies power to the power amplifier circuit board 40, the transceiver circuit board 60, and the baseband processing unit.
- the radio frequency unit 200 further includes a hybrid connector 66 through which the transceiver circuit board 60 is coupled to the baseband processing unit and the power supply device.
- the power supply unit supplies power to the power amplifier circuit board 40, the transceiver circuit board 60, and the baseband processing unit.
- the transmission device may be an optical network transmission device or a microwave transmission device.
- the duplexer 20 includes two ends, a first end 22 and a second end 24, which may be opposite the second end 24.
- the power amplifier circuit board 40 is located at a first end 22 of the duplexer 20, and the transceiver circuit board 60 is located at a second end 24 of the duplexer 20. It can be understood that the power amplifier circuit board 40 can also be located at the second end portion 24 of the duplexer 20, and the transceiver circuit board 60 can also be located at the first end of the duplexer 20.
- the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20 and the transceiver circuit board 60 is located at the second end 24 of the duplexer 20:
- the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20. Specifically, the power amplifier circuit board 40 is located at one end of the duplexer 20, and the power amplifier circuit board 40 is located at the one end.
- the side of the duplexer 20 is located at the other end of the duplexer 20, and the transceiver circuit board 60 is located at the other end of the duplexer 20, and The transceiver circuit board 60 is located on one side 224 of the other end.
- the side 222 of the duplexer 20-end is One side 224 of the other end of the duplexer 20 is the same side of the duplexer 20.
- the power amplifier circuit board 40 is in the same plane as the transceiver circuit board 60.
- the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20 , and specifically: the power amplifier circuit board 40 is located at one end of the duplexer 20 , and the power amplifier circuit board 40 is located at the one end
- the transceiver circuit board 60 is located at the second end 24 of the duplexer 20, and specifically: the transceiver circuit board 60 is located at the other end of the duplexer 20, and the transceiver The circuit board 60 is located on the other side 226 of the other end.
- one side 222 of the duplexer 20-end and the other side 226 of the other end of the duplexer 20 are different sides of the duplexer 20.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are located on both sides of the duplexer 20.
- the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20. Specifically, the power amplifier circuit board 40 is located at one end of the duplexer 20, and the power amplifier circuit board 40 is located at the double The transceiver circuit board 60 is located at the second end 24 of the duplexer 20, and the transceiver circuit board 60 is located at the other end of the transceiver 20, and the transceiver The letter board 60 is located below the other end of the duplexer 20.
- the power amplifier circuit board 40 may also be located under the other end of the duplexer 20, and the transceiver circuit board 60 may also be located above one end of the duplexer 20.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at two ends of the duplexer 20, and the power amplifier circuit board 40 is located at one end of the duplexer 20,
- the transceiver circuit board 60 is located on one side of the other end of the duplexer 20; or: the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at the two ends of the duplexer 20, and the power amplifier circuit board 40 is located at one end of the duplexer 20, and the transceiver
- the signal circuit board 60 is located below or above the other end of the duplexer.
- the power amplifier circuit board 40 is located at one side of one end of the duplexer 20.
- the transceiver circuit board 60 is located below or above the other end of the duplexer 20, and is:
- the power amplifier circuit board 40 is located at one side of one end of the duplexer 20, and the transceiver circuit board 60 is located below the other end of the duplexer 20; or: the power amplifier circuit board 40 is located at one end of the duplexer 20.
- the transceiver circuit board 60 is located above the other end of the duplexer 20.
- the duplexer 20 is connected to the power amplifier circuit board 40, and may be: the duplexer 20 and the power amplifier circuit board 40, which are hard-wired, hard-wired, RF-connected, coaxial, or blind. Plug connector connection.
- the duplexer 20 is connected to the transceiver circuit board 60, and may be: the duplexer 20 and the transceiver circuit board 60 are hard-wired, hard-wired, and RF-connected. Shaft cable connection or blind plug connector connection.
- the power amplifier circuit board 40 is connected to the transceiver circuit board 60, and the power amplifier circuit board 40 and the transceiver circuit board 60 are connected by a hybrid connector, a radio frequency connector or a coaxial cable.
- the duplexer 20 is connected to the power amplifier circuit board 40 and the transceiver circuit board 60 through a blind plug connector 82.
- the power amplifier circuit board 40 passes through the coaxial cable 84 and the transceiver circuit board. 60 connections.
- the power amplifier circuit board 40 is coupled to the transceiver circuit board 60 via a coaxial cable 84.
- the power amplifier circuit board 40 and the transceiver circuit board 60 may be a circuit board, that is, the power amplifier circuit board 40 and the transceiver circuit board 60 have a common board structure, and the power amplifier circuit board 40 passes through the circuit board.
- the upper line is connected to the transceiver circuit board 60.
- the duplexer 20 can be coupled to the power amplifier circuit board 40 and the transceiver circuit board 60 via a blind plug connector 82.
- the radio frequency unit includes a duplexer 20, a power amplifier circuit 40, and a transceiver circuit 60.
- the duplexer 20 is connected to the power amplifier circuit 40 and the transceiver circuit 60, respectively.
- the power amplifier circuit 40 and the transceiver circuit 60 are connected to the transceiver circuit 60. Connected, the power amplifier circuit 40 and the transceiver circuit 60 are located on the same circuit board.
- the duplexer 20 is located at an intermediate position of the circuit board.
- the duplexer 20 is located in the middle of the circuit board, and is not necessarily an intermediate position in the geometric sense. There may be a certain error, and the error may be about 10%, or 15%. Of course, it can also be an intermediate position in the geometric sense.
- the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, and the power amplifier circuit board 40
- the radio frequency unit 200 of the layout can improve the heat dissipation efficiency of the radio frequency unit 200, and the transceiver circuit board 60 is projected to the same plane without being overlapped in the direction perpendicular to the power amplifier circuit board 40.
- FIG. 6 is a schematic structural diagram of an integrated antenna according to an embodiment of the present invention.
- the integrated antenna includes an antenna unit 300 and a radio frequency unit 200, wherein the radio frequency unit 200 includes a duplexer 20, a power amplifier circuit board 40, and a transceiver circuit board 60, the duplexer 20 and the power amplifier circuit board 40 and the transceiver
- the power circuit board 40 is connected to the transceiver circuit board 60, wherein the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, the power amplifier The circuit board 40 and the transceiver circuit board 60 are projected to the same plane without being overlapped in the direction perpendicular to the power amplifier circuit board 40.
- the duplexer 20 is connected to the circuit board of the antenna unit 300 via the coaxial connector 26.
- the power amplifier circuit board 40 of the radio frequency unit 200 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, and the power amplifier circuit board 40 and the transceiver circuit board 60 are perpendicular thereto.
- the power amplifier circuit board 40 is projected onto the same plane without overlapping.
- the RF unit 200 of this layout can improve the heat dissipation efficiency of the RF unit 200.
- the duplexer 20 is connected to the circuit board of the antenna unit 300 through the coaxial connector 26.
- the loss of the radio frequency signal between the duplexer 20 and the antenna unit 300 is reduced.
- the antenna unit 300 may be a directional antenna or an omnidirectional antenna.
- the antenna radiating unit 80 may be an array type antenna or a patch type antenna. Embodiments of the invention are not limited thereto.
- radio frequency unit 200 mentioned in an integrated antenna of this embodiment may be consistent with the structure described in an RF unit of the embodiment, and will not be repeated here.
- the antenna unit 300 includes an antenna reflector 70 , and the antenna reflector 70 is provided with an antenna radiating unit feeder circuit board 71 .
- the antenna radiating unit feeder circuit board 71 is provided with an antenna radiating unit 80 .
- the antenna radiating unit 80 is connected to the antenna radiating unit feeder circuit board 71.
- the circuit board is an antenna radiating unit feeder circuit board 71.
- the duplexer 20 is connected to the antenna radiating unit feeder circuit board 71 of the antenna unit 300 through the coaxial connector 26.
- the antenna unit 300 includes an antenna reflector 70, and the antenna reflector 70 is provided with an antenna radiating unit feeder circuit board 71.
- the antenna radiating unit feeder circuit board 71 is provided with an antenna radiating unit 80.
- the antenna radiates
- the unit 80 is connected to the antenna radiating unit feeder circuit board 71.
- the antenna unit 300 further includes a feeder network circuit board 73, the feeder network circuit board 73 and the antenna radiating single The meta-feed circuit board 71 is connected.
- the circuit board includes: a feeder network circuit board 73 and an antenna radiating unit feeder circuit board 71.
- the antenna radiating unit feeder circuit board 71 is connected to the feeder network circuit board 73, and the duplexer 20 passes
- the coaxial connector 26 is connected to the feeder network circuit board 73 of the antenna unit 300.
- FIG. 8 and 9 a schematic diagram of the duplexer 20 of Figure 7 being coupled to the feeder network circuit board 73 via a coaxial connector 26 is shown.
- the inner conductor 261 of the coaxial connector 26 can be coupled to the feeder network circuit board 73 by screws, and the outer conductor 262 of the coaxial connector can be coupled to the feeder network circuit board 73 by screws.
- the coaxial connector 26 can also be connected to the feeder network circuit board 73 by soldering, and the embodiment of the present invention is not limited thereto.
- the coaxial connector 26 can also be coupled to the antenna radiating element feeder circuit board 71.
- the reflector 73 is provided with a hole 731.
- the coaxial connector 26 is sleeved on the hole 731.
- the outer conductor 262 of the coaxial connector 26 and the peripheral side of the hole 731 of the reflector 73 are shown. There is an insulation between them.
- electromagnetic induction between the coaxial connector outer conductor 262 and the reflection plate 73 can be prevented, which affects the electromagnetic radiation performance of the antenna radiating unit 80.
- the coaxial connector 26 is provided with a boss 77.
- the outer conductor 262 of the coaxial connector 26 is separated from the reflector 70 by the boss 77.
- the insulating portion is a boss 77.
- the insulating portion may also be an insulating spacer, and the outer conductor 262 of the coaxial connector 26 is separated from the reflecting plate 70 by an insulating spacer.
- the power amplifier circuit board 40 is provided with heat dissipating teeth 42 on one side, and the heat dissipation teeth 62 are disposed on one side of the transceiver circuit board 60.
- the heat dissipating teeth 42 and the heat dissipating teeth 62 can be used for the power amplifier.
- the heat generated by the circuit board 40 and the transceiver circuit board 60 goes out.
- an integrated antenna is provided in the embodiment of the present invention.
- the radio frequency unit 200 is further provided with a sun shield 65.
- the sun shield 65 can not only block the illumination of sunlight, but also form a chimney effect through the sun shield 65. , dissipating heat for the radio frequency unit 200, as shown in FIG. This is more advantageous for heat dissipation of the RF unit 200.
- the sun shield 65 can be fixed to the radio frequency unit 200 by screws.
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- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Transceivers (AREA)
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2009/070783 WO2010102454A1 (zh) | 2009-03-13 | 2009-03-13 | 一种射频单元以及集成天线 |
JP2011553252A JP5491535B2 (ja) | 2009-03-13 | 2009-03-13 | 無線周波数ユニット及び統合アンテナ |
EP09841323.0A EP2408121B1 (en) | 2009-03-13 | 2009-03-13 | Radio frequency unit and integrated antenna |
CN2009801564352A CN102282778B (zh) | 2009-03-13 | 2009-03-13 | 一种集成天线 |
EP15179453.4A EP2983302B1 (en) | 2009-03-13 | 2009-03-13 | Radio frequency unit and integrated antenna with improved heat dissipation |
US13/231,680 US8971824B2 (en) | 2009-03-13 | 2011-09-13 | Radio frequency unit and integrated antenna |
US13/287,773 US8781409B2 (en) | 2009-03-13 | 2011-11-02 | Radio frequency unit and integrated antenna |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2009/070783 WO2010102454A1 (zh) | 2009-03-13 | 2009-03-13 | 一种射频单元以及集成天线 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/231,680 Continuation US8971824B2 (en) | 2009-03-13 | 2011-09-13 | Radio frequency unit and integrated antenna |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2010102454A1 true WO2010102454A1 (zh) | 2010-09-16 |
Family
ID=42727787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2009/070783 WO2010102454A1 (zh) | 2009-03-13 | 2009-03-13 | 一种射频单元以及集成天线 |
Country Status (5)
Country | Link |
---|---|
US (2) | US8971824B2 (zh) |
EP (2) | EP2408121B1 (zh) |
JP (1) | JP5491535B2 (zh) |
CN (1) | CN102282778B (zh) |
WO (1) | WO2010102454A1 (zh) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010102454A1 (zh) * | 2009-03-13 | 2010-09-16 | 华为技术有限公司 | 一种射频单元以及集成天线 |
CN102595838B (zh) * | 2012-02-21 | 2014-07-16 | 武汉正维电子技术有限公司 | 一种功率放大器的装配结构 |
CN102820893B (zh) * | 2012-07-24 | 2015-05-20 | 大唐移动通信设备有限公司 | 一种rru和天线的集成模块化系统及移动通信基站 |
KR101868869B1 (ko) * | 2012-08-07 | 2018-06-19 | 주식회사 케이엠더블유 | 이동통신 시스템의 소형 기지국 |
EP3254334B1 (en) * | 2015-02-26 | 2023-11-22 | Huawei Technologies Co., Ltd. | A radio unit housing and a base station antenna module |
CN105048053B (zh) * | 2015-07-03 | 2018-11-27 | 普联技术有限公司 | 集成散热功能的天线装置 |
WO2017033564A1 (ja) * | 2015-08-27 | 2017-03-02 | 株式会社村田製作所 | 高周波モジュール |
US10084231B2 (en) * | 2015-12-29 | 2018-09-25 | Blue Danube Systems, Inc. | Low thermal impedance structure in a phased array |
US10355362B2 (en) | 2016-09-01 | 2019-07-16 | Nxp Usa, Inc. | Power amplifier system with integrated antenna |
KR101854309B1 (ko) * | 2016-11-16 | 2018-05-03 | 주식회사 케이엠더블유 | Mimo 안테나 어셈블리 |
WO2018093176A2 (ko) * | 2016-11-16 | 2018-05-24 | 주식회사 케이엠더블유 | 적층구조의 mimo 안테나 어셈블리 |
US10123248B1 (en) | 2017-05-24 | 2018-11-06 | Sprint Communications Company L.P. | Wireless access point control of power amplifiers based on an enclosure temperature |
US10320051B2 (en) * | 2017-06-30 | 2019-06-11 | Intel Corporation | Heat sink for 5G massive antenna array and methods of assembling same |
KR102290036B1 (ko) * | 2019-05-15 | 2021-08-18 | 주식회사 케이엠더블유 | 안테나 장치 |
EP4270661A1 (en) * | 2020-12-28 | 2023-11-01 | Kyocera Corporation | Antenna device |
WO2022147916A1 (en) * | 2021-01-08 | 2022-07-14 | Telefonaktiebolaget Lm Ericsson (Publ) | Radio heatsink, radio unit, and base station |
WO2023049082A1 (en) * | 2021-09-24 | 2023-03-30 | Meta Platforms, Inc. | Remote radio unit with reduced volume and increased thermal efficiency |
CN116259967A (zh) * | 2021-12-01 | 2023-06-13 | 中兴通讯股份有限公司 | 有源天线单元及基站 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030091157A (ko) * | 2002-05-24 | 2003-12-03 | 엘지전자 주식회사 | 아이솔레이터 내장형 듀플렉서 |
CN1825687A (zh) * | 2006-02-27 | 2006-08-30 | 东南大学 | X波段基片集成波导单板射频系统 |
CN101106235A (zh) * | 2007-06-06 | 2008-01-16 | 华为技术有限公司 | 一种单板硬件设备及射频盲插连接设备 |
Family Cites Families (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4792939A (en) * | 1986-01-24 | 1988-12-20 | Hitachi Denshi Kabushiki Kaisha | Duplex radio communication transceiver |
JP2840493B2 (ja) * | 1991-12-27 | 1998-12-24 | 株式会社日立製作所 | 一体型マイクロ波回路 |
GB2289827B (en) * | 1994-05-17 | 1998-05-20 | Motorola Ltd | Integrated mast base station |
JPH0837414A (ja) * | 1994-07-21 | 1996-02-06 | Matsushita Electric Works Ltd | 平面アンテナ |
US5740522A (en) * | 1995-07-17 | 1998-04-14 | Ericsson Inc. | Method and apparatus for reducing receive band transmitter-chain noise for a portable duplex transceiver |
US6091715A (en) * | 1997-01-02 | 2000-07-18 | Dynamic Telecommunications, Inc. | Hybrid radio transceiver for wireless networks |
KR19980065967A (ko) * | 1997-01-17 | 1998-10-15 | 김광호 | 시스템 성능 개선을 위한 다중채널 시분할교신방식의 신호 송수신 장치 |
US5986618A (en) * | 1998-08-21 | 1999-11-16 | Lucent Technologies Inc. | Combined solar shield and antenna ground plane structure for an electrical assembly |
US6084772A (en) * | 1998-09-03 | 2000-07-04 | Nortel Networks Corporation | Electronics enclosure for power electronics with passive thermal management |
CN1326645A (zh) * | 1998-10-15 | 2001-12-12 | 艾尔耐特通信公司 | 用于动态分配无线宽带基站dsp资源的方法 |
US6462620B1 (en) * | 2000-09-12 | 2002-10-08 | Silicon Laboratories, Inc. | RF power amplifier circuitry and method for amplifying signals |
US7120427B1 (en) * | 2001-03-19 | 2006-10-10 | Cisco Systems Wireless Networking (Australia) Pty Limited | CMOS wireless transceiver with programmable characteristics |
KR100382765B1 (ko) * | 2001-06-15 | 2003-05-09 | 삼성전자주식회사 | 송수신용 수동소자와 그 집적모듈 및 그 제조방법 |
JP2004048109A (ja) * | 2002-07-08 | 2004-02-12 | Sansei Denki Kk | 無給電素子付きスロットボータイアンテナ、および無給電素子付きスロットボータイアレーアンテナ |
US7043280B1 (en) | 2001-10-11 | 2006-05-09 | Adaptix, Inc. | Mechanically rotatable wireless RF data transmission subscriber station with multi-beam antenna |
US6982879B1 (en) * | 2003-07-19 | 2006-01-03 | Intel Corporation | Apparatus to provide connection between a microelectronic device and an antenna |
JP4112484B2 (ja) * | 2003-12-17 | 2008-07-02 | 株式会社東芝 | 無線機器及び半導体装置 |
JP4465715B2 (ja) * | 2004-04-16 | 2010-05-19 | セイコーエプソン株式会社 | 薄膜デバイス、集積回路、電気光学装置、電子機器 |
US7983624B2 (en) * | 2005-06-17 | 2011-07-19 | Cts Corporation | RF front-end module for picocell and microcell base station transceivers |
KR20080006414A (ko) * | 2006-07-12 | 2008-01-16 | 엘지이노텍 주식회사 | 프론트 엔드 모듈 및 통신 시스템 |
KR20080018758A (ko) * | 2006-08-25 | 2008-02-28 | 엘지이노텍 주식회사 | 윈칩형 rf집적모듈 |
US7702295B1 (en) * | 2006-12-22 | 2010-04-20 | Nortel Networks Limited | Frequency agile duplex filter |
US8023999B2 (en) * | 2006-12-28 | 2011-09-20 | Alcatel Lucent | Base station architecture using decentralized duplexers |
US8155663B2 (en) * | 2007-04-13 | 2012-04-10 | Tessera, Inc. | Wearable ultra-thin miniaturized mobile communications |
CN201038329Y (zh) * | 2007-04-25 | 2008-03-19 | 广东通宇通讯设备有限公司 | 一种双极化板状定向基站天线辐射器 |
US8142702B2 (en) | 2007-06-18 | 2012-03-27 | Molecular Imprints, Inc. | Solvent-assisted layer formation for imprint lithography |
WO2008156760A1 (en) * | 2007-06-19 | 2008-12-24 | Cts Corporation | Time division duplex front end module |
CN100562095C (zh) | 2007-10-10 | 2009-11-18 | 中国联合网络通信集团有限公司 | 一种用即时消息系统实现视频会议的方法及系统 |
CN101460018B (zh) * | 2007-12-14 | 2011-02-16 | 华为技术有限公司 | 一种印制电路板及其制造方法、射频装置 |
CN101466197B (zh) * | 2007-12-21 | 2012-11-14 | 艾利森电话股份有限公司 | 电路板及设置于其上的功放、双通道收发单元、无线基站 |
US20130109333A1 (en) * | 2011-07-25 | 2013-05-02 | Sebastian Rowson | Method and system for switched combined diversity with a modal antenna |
US8606193B2 (en) * | 2008-11-13 | 2013-12-10 | Qualcomm Incorporated | RF transceiver IC having internal loopback conductor for IP2 self test |
WO2010102454A1 (zh) * | 2009-03-13 | 2010-09-16 | 华为技术有限公司 | 一种射频单元以及集成天线 |
US8279018B1 (en) * | 2009-03-16 | 2012-10-02 | Marvell International Ltd. | Trifila balun for wireless transceiver |
US8301077B2 (en) * | 2009-09-24 | 2012-10-30 | ConvenientPower, Ltd | Antenna network for passive and active signal enhancement |
KR101769568B1 (ko) * | 2011-05-16 | 2017-08-21 | 마벨 월드 트레이드 리미티드 | 시분할 신호 및 주파수분할 신호를 프로세싱하기 위한 시스템 및 방법 |
GB2498212B (en) * | 2012-01-09 | 2013-12-04 | Renesas Mobile Corp | Method and apparatus for time division duplex communication |
US8830881B2 (en) * | 2012-12-14 | 2014-09-09 | Broadcom Corporation | Wide band electrical balance duplexer with balanced bridge circuit |
-
2009
- 2009-03-13 WO PCT/CN2009/070783 patent/WO2010102454A1/zh active Application Filing
- 2009-03-13 EP EP09841323.0A patent/EP2408121B1/en active Active
- 2009-03-13 EP EP15179453.4A patent/EP2983302B1/en active Active
- 2009-03-13 CN CN2009801564352A patent/CN102282778B/zh active Active
- 2009-03-13 JP JP2011553252A patent/JP5491535B2/ja active Active
-
2011
- 2011-09-13 US US13/231,680 patent/US8971824B2/en active Active
- 2011-11-02 US US13/287,773 patent/US8781409B2/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030091157A (ko) * | 2002-05-24 | 2003-12-03 | 엘지전자 주식회사 | 아이솔레이터 내장형 듀플렉서 |
CN1825687A (zh) * | 2006-02-27 | 2006-08-30 | 东南大学 | X波段基片集成波导单板射频系统 |
CN101106235A (zh) * | 2007-06-06 | 2008-01-16 | 华为技术有限公司 | 一种单板硬件设备及射频盲插连接设备 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2408121A4 * |
Also Published As
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US8781409B2 (en) | 2014-07-15 |
EP2408121A4 (en) | 2012-03-14 |
US20120001809A1 (en) | 2012-01-05 |
US20120044840A1 (en) | 2012-02-23 |
CN102282778A (zh) | 2011-12-14 |
JP5491535B2 (ja) | 2014-05-14 |
JP2012520584A (ja) | 2012-09-06 |
US8971824B2 (en) | 2015-03-03 |
EP2983302A1 (en) | 2016-02-10 |
EP2408121A1 (en) | 2012-01-18 |
EP2408121B1 (en) | 2015-10-28 |
EP2983302B1 (en) | 2019-11-13 |
CN102282778B (zh) | 2013-11-06 |
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