WO2010102454A1 - 一种射频单元以及集成天线 - Google Patents

一种射频单元以及集成天线 Download PDF

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Publication number
WO2010102454A1
WO2010102454A1 PCT/CN2009/070783 CN2009070783W WO2010102454A1 WO 2010102454 A1 WO2010102454 A1 WO 2010102454A1 CN 2009070783 W CN2009070783 W CN 2009070783W WO 2010102454 A1 WO2010102454 A1 WO 2010102454A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
power amplifier
duplexer
amplifier circuit
radio frequency
Prior art date
Application number
PCT/CN2009/070783
Other languages
English (en)
French (fr)
Inventor
彭永辉
欧胜军
唐涛
杨刚华
李腾跃
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to PCT/CN2009/070783 priority Critical patent/WO2010102454A1/zh
Priority to JP2011553252A priority patent/JP5491535B2/ja
Priority to EP09841323.0A priority patent/EP2408121B1/en
Priority to CN2009801564352A priority patent/CN102282778B/zh
Priority to EP15179453.4A priority patent/EP2983302B1/en
Publication of WO2010102454A1 publication Critical patent/WO2010102454A1/zh
Priority to US13/231,680 priority patent/US8971824B2/en
Priority to US13/287,773 priority patent/US8781409B2/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00Antennas with active circuits or circuit elements integrated within them or attached to them
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/02Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/02Transmitters
    • H04B1/03Constructional details, e.g. casings, housings
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • H05K1/145Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules

Definitions

  • the present invention relates to the field of communications technologies, and in particular, to a radio frequency unit and an integrated antenna. Background technique
  • FIG. 1 is a schematic structural diagram of a radio frequency unit in the prior art.
  • the radio frequency unit 100 includes a duplexer 10, a power amplifier circuit board 30, and a transceiver circuit board 50.
  • the duplexer 10 is connected to the power amplifier circuit board 30 and the transceiver circuit board 50.
  • the power amplifier circuit board 30 is connected to the power amplifier circuit board 30. Connected to the transceiver circuit board 50, wherein the power amplifier circuit board 30 is opposite the transceiver circuit board 50.
  • the radio frequency unit 100 further includes a first box body 71 and a second box body 73.
  • the first box body 71 and the second box body 73 can form a closed cavity.
  • the power amplifier circuit board 30 and the transceiver circuit board 50 are located. The closed cavity.
  • the first case 71 and the second case 73 are provided with heat dissipating teeth, and the heat generated by the power amplifier circuit board 30 and the transceiver circuit board 50 can be dissipated through the heat dissipating teeth of the first case 71 and the second case 73. .
  • the radio frequency unit 100 is usually integrated with an antenna.
  • the transmission device transmits the digital signal to the baseband processing unit through an optical fiber or a cable, and the baseband processing unit converts the digital signal into an analog signal, and the analog signal passes through the transceiver circuit board.
  • 10 is processed into a radio frequency small signal, and the radio frequency small signal is amplified into a high-power radio frequency signal through the power amplifier circuit board 30, and then transmitted to the antenna through the duplexer 10 filter, so that the antenna can convert the radio frequency signal into electromagnetic wave radiation; when receiving the signal
  • the antenna receives the electromagnetic wave from the terminal, converts the electromagnetic wave into a radio frequency signal, and the RF signal is filtered by the duplexer 10 and transmitted to the transceiver circuit board 50.
  • the transceiver circuit board 50 processes the signal into an analog signal and transmits it to the baseband processing unit.
  • the baseband processing unit then processes the analog signal into a digital signal for transmission to the transmission device.
  • the power amplifier circuit board 30 and the transceiver circuit board 50 When the RF unit 100 is in operation, the power amplifier circuit board 30 and the transceiver circuit board 50 generate heat, and the power amplifier circuit board 30 is opposed to the transceiver circuit board 50. Thus, the heat generated by the power amplifier circuit board 30 may affect the Transceiver circuit board 50, which may affect the heat dissipation of the radio frequency unit 100 effectiveness.
  • the embodiment of the invention provides a radio frequency unit and an integrated antenna, which can improve the heat dissipation efficiency of the radio frequency unit.
  • An embodiment of the present invention provides a radio frequency unit, where the radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board, and the duplexer is connected to the power amplifier circuit board and the transceiver circuit board.
  • the power amplifier circuit board and the transceiver circuit board are connected, wherein the power amplifier circuit board and the transceiver circuit board are respectively located at two ends of the duplexer, and the power amplifier circuit board and the The transceiver circuit boards are projected to the same plane along the direction perpendicular to the power amplifier circuit board without overlapping.
  • An embodiment of the present invention further provides an integrated antenna, where the integrated antenna includes an antenna unit and a radio frequency unit, where the radio frequency unit includes a duplexer, a power amplifier circuit board, and a transceiver circuit board, where the duplexer and the duplexer
  • the power amplifier circuit board is connected to the transceiver circuit board, and the power amplifier circuit board is connected to the transceiver circuit board, wherein the power amplifier circuit board and the transceiver circuit board are respectively located in the pair
  • the power amplifier circuit board and the transceiver circuit board are projected to the same plane in a direction perpendicular to the power amplifier circuit board without overlapping, and the duplexer passes through the coaxial connector and the antenna unit Board connection.
  • the power amplifier circuit board and the transceiver circuit board are respectively located at both ends of the duplexer, and the power amplifier circuit board and the transceiver circuit board are projected to the same plane along the direction perpendicular to the power amplifier circuit board. Without overlap, the heat generated by the power amplifier circuit board is difficult to affect the transceiver circuit board, and the radio frequency unit adopting such a layout can improve the heat dissipation efficiency of the radio frequency unit.
  • FIG. 1 is a schematic structural view of a radio frequency unit in the prior art
  • FIG. 2 is a schematic structural diagram of a radio frequency unit according to an embodiment of the present invention.
  • FIG. 3 is another schematic structural diagram of a radio frequency unit according to an embodiment of the present invention.
  • FIG. 4 is another schematic structural diagram of a radio frequency unit according to an embodiment of the present invention.
  • 5 is a schematic structural view of a power amplifier circuit board and a radio frequency unit in a common board according to an embodiment of the present invention;
  • FIG. 6 is a schematic structural diagram of an integrated antenna according to an embodiment of the present invention.
  • FIG. 7 is still another schematic structural diagram of an integrated antenna according to an embodiment of the present invention.
  • FIG. 8 is a schematic diagram showing a connection between a coaxial connector of a duplexer and a feeder network circuit board in an integrated antenna according to an embodiment of the present invention
  • FIG. 9 is a schematic diagram showing a connection between a coaxial connector of a duplexer and a feeder network circuit board in an integrated antenna according to an embodiment of the present invention.
  • FIG. 10 is a schematic diagram of a coaxial connector of a duplexer in an integrated antenna connected to a feeder network circuit board according to an embodiment of the present invention
  • FIG. 11 is a schematic structural diagram of an integrated antenna including a sun shield according to an embodiment of the present invention.
  • a radio frequency unit 200 includes a duplexer 20, a power amplifier circuit board 40, and a transceiver circuit board 60.
  • the duplexer 20 is connected to the power amplifier circuit board 40 and the transceiver circuit board 60.
  • the circuit board 40 is connected to the transceiver circuit board 60.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, the power amplifier circuit board 40 and the transceiver circuit board. 60 is projected in the direction perpendicular to the power amplifier circuit board 40 to the same plane without overlapping.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, and the power amplifier circuit board 40 and the The transceiver circuit board 60 is projected to the same plane in the direction perpendicular to the power amplifier circuit board 40 without overlap.
  • the heat generated by the power amplifier circuit board 40 hardly affects the transceiver circuit board 60.
  • the radio frequency unit 200 adopting such a layout can be improved.
  • the direction of the power amplifier circuit board 40 is perpendicular as shown by an arrow 46 in FIG. 2, and the plane perpendicular to the direction of the arrow is a plane 48.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively A projection is formed on the plane 48, and the power amplifier circuit board 40 and the transceiver circuit board The projections formed on the plane 48, respectively, 60 have no overlap.
  • the side of the power amplifier circuit board 40 is provided with heat dissipating teeth
  • the side of the transceiver circuit board 60 is provided with heat dissipating teeth.
  • the power amplifier circuit board 40 and the transceiver circuit board are located on the same plane. It should be noted that the power amplifier circuit board 40 and the transceiver circuit board are located on the same plane, and are not necessarily in the same geometric plane. There may be a certain error, and the error may be about 10%, or 15%. As long as it can improve the heat dissipation efficiency of the RF unit. Of course, it can also be understood as the same plane in a strictly geometric sense.
  • the radio frequency unit 200 further includes a baseband processing unit and a hybrid connector 66.
  • the transceiver circuit board 60 is coupled to the baseband processing unit, and the baseband processing unit is coupled to the transmission device and the power supply device via the hybrid connector 66.
  • the power supply unit supplies power to the power amplifier circuit board 40, the transceiver circuit board 60, and the baseband processing unit.
  • the radio frequency unit 200 further includes a hybrid connector 66 through which the transceiver circuit board 60 is coupled to the baseband processing unit and the power supply device.
  • the power supply unit supplies power to the power amplifier circuit board 40, the transceiver circuit board 60, and the baseband processing unit.
  • the transmission device may be an optical network transmission device or a microwave transmission device.
  • the duplexer 20 includes two ends, a first end 22 and a second end 24, which may be opposite the second end 24.
  • the power amplifier circuit board 40 is located at a first end 22 of the duplexer 20, and the transceiver circuit board 60 is located at a second end 24 of the duplexer 20. It can be understood that the power amplifier circuit board 40 can also be located at the second end portion 24 of the duplexer 20, and the transceiver circuit board 60 can also be located at the first end of the duplexer 20.
  • the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20 and the transceiver circuit board 60 is located at the second end 24 of the duplexer 20:
  • the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20. Specifically, the power amplifier circuit board 40 is located at one end of the duplexer 20, and the power amplifier circuit board 40 is located at the one end.
  • the side of the duplexer 20 is located at the other end of the duplexer 20, and the transceiver circuit board 60 is located at the other end of the duplexer 20, and The transceiver circuit board 60 is located on one side 224 of the other end.
  • the side 222 of the duplexer 20-end is One side 224 of the other end of the duplexer 20 is the same side of the duplexer 20.
  • the power amplifier circuit board 40 is in the same plane as the transceiver circuit board 60.
  • the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20 , and specifically: the power amplifier circuit board 40 is located at one end of the duplexer 20 , and the power amplifier circuit board 40 is located at the one end
  • the transceiver circuit board 60 is located at the second end 24 of the duplexer 20, and specifically: the transceiver circuit board 60 is located at the other end of the duplexer 20, and the transceiver The circuit board 60 is located on the other side 226 of the other end.
  • one side 222 of the duplexer 20-end and the other side 226 of the other end of the duplexer 20 are different sides of the duplexer 20.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are located on both sides of the duplexer 20.
  • the power amplifier circuit board 40 is located at the first end 22 of the duplexer 20. Specifically, the power amplifier circuit board 40 is located at one end of the duplexer 20, and the power amplifier circuit board 40 is located at the double The transceiver circuit board 60 is located at the second end 24 of the duplexer 20, and the transceiver circuit board 60 is located at the other end of the transceiver 20, and the transceiver The letter board 60 is located below the other end of the duplexer 20.
  • the power amplifier circuit board 40 may also be located under the other end of the duplexer 20, and the transceiver circuit board 60 may also be located above one end of the duplexer 20.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at two ends of the duplexer 20, and the power amplifier circuit board 40 is located at one end of the duplexer 20,
  • the transceiver circuit board 60 is located on one side of the other end of the duplexer 20; or: the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at the two ends of the duplexer 20, and the power amplifier circuit board 40 is located at one end of the duplexer 20, and the transceiver
  • the signal circuit board 60 is located below or above the other end of the duplexer.
  • the power amplifier circuit board 40 is located at one side of one end of the duplexer 20.
  • the transceiver circuit board 60 is located below or above the other end of the duplexer 20, and is:
  • the power amplifier circuit board 40 is located at one side of one end of the duplexer 20, and the transceiver circuit board 60 is located below the other end of the duplexer 20; or: the power amplifier circuit board 40 is located at one end of the duplexer 20.
  • the transceiver circuit board 60 is located above the other end of the duplexer 20.
  • the duplexer 20 is connected to the power amplifier circuit board 40, and may be: the duplexer 20 and the power amplifier circuit board 40, which are hard-wired, hard-wired, RF-connected, coaxial, or blind. Plug connector connection.
  • the duplexer 20 is connected to the transceiver circuit board 60, and may be: the duplexer 20 and the transceiver circuit board 60 are hard-wired, hard-wired, and RF-connected. Shaft cable connection or blind plug connector connection.
  • the power amplifier circuit board 40 is connected to the transceiver circuit board 60, and the power amplifier circuit board 40 and the transceiver circuit board 60 are connected by a hybrid connector, a radio frequency connector or a coaxial cable.
  • the duplexer 20 is connected to the power amplifier circuit board 40 and the transceiver circuit board 60 through a blind plug connector 82.
  • the power amplifier circuit board 40 passes through the coaxial cable 84 and the transceiver circuit board. 60 connections.
  • the power amplifier circuit board 40 is coupled to the transceiver circuit board 60 via a coaxial cable 84.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 may be a circuit board, that is, the power amplifier circuit board 40 and the transceiver circuit board 60 have a common board structure, and the power amplifier circuit board 40 passes through the circuit board.
  • the upper line is connected to the transceiver circuit board 60.
  • the duplexer 20 can be coupled to the power amplifier circuit board 40 and the transceiver circuit board 60 via a blind plug connector 82.
  • the radio frequency unit includes a duplexer 20, a power amplifier circuit 40, and a transceiver circuit 60.
  • the duplexer 20 is connected to the power amplifier circuit 40 and the transceiver circuit 60, respectively.
  • the power amplifier circuit 40 and the transceiver circuit 60 are connected to the transceiver circuit 60. Connected, the power amplifier circuit 40 and the transceiver circuit 60 are located on the same circuit board.
  • the duplexer 20 is located at an intermediate position of the circuit board.
  • the duplexer 20 is located in the middle of the circuit board, and is not necessarily an intermediate position in the geometric sense. There may be a certain error, and the error may be about 10%, or 15%. Of course, it can also be an intermediate position in the geometric sense.
  • the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, and the power amplifier circuit board 40
  • the radio frequency unit 200 of the layout can improve the heat dissipation efficiency of the radio frequency unit 200, and the transceiver circuit board 60 is projected to the same plane without being overlapped in the direction perpendicular to the power amplifier circuit board 40.
  • FIG. 6 is a schematic structural diagram of an integrated antenna according to an embodiment of the present invention.
  • the integrated antenna includes an antenna unit 300 and a radio frequency unit 200, wherein the radio frequency unit 200 includes a duplexer 20, a power amplifier circuit board 40, and a transceiver circuit board 60, the duplexer 20 and the power amplifier circuit board 40 and the transceiver
  • the power circuit board 40 is connected to the transceiver circuit board 60, wherein the power amplifier circuit board 40 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, the power amplifier The circuit board 40 and the transceiver circuit board 60 are projected to the same plane without being overlapped in the direction perpendicular to the power amplifier circuit board 40.
  • the duplexer 20 is connected to the circuit board of the antenna unit 300 via the coaxial connector 26.
  • the power amplifier circuit board 40 of the radio frequency unit 200 and the transceiver circuit board 60 are respectively located at both ends of the duplexer 20, and the power amplifier circuit board 40 and the transceiver circuit board 60 are perpendicular thereto.
  • the power amplifier circuit board 40 is projected onto the same plane without overlapping.
  • the RF unit 200 of this layout can improve the heat dissipation efficiency of the RF unit 200.
  • the duplexer 20 is connected to the circuit board of the antenna unit 300 through the coaxial connector 26.
  • the loss of the radio frequency signal between the duplexer 20 and the antenna unit 300 is reduced.
  • the antenna unit 300 may be a directional antenna or an omnidirectional antenna.
  • the antenna radiating unit 80 may be an array type antenna or a patch type antenna. Embodiments of the invention are not limited thereto.
  • radio frequency unit 200 mentioned in an integrated antenna of this embodiment may be consistent with the structure described in an RF unit of the embodiment, and will not be repeated here.
  • the antenna unit 300 includes an antenna reflector 70 , and the antenna reflector 70 is provided with an antenna radiating unit feeder circuit board 71 .
  • the antenna radiating unit feeder circuit board 71 is provided with an antenna radiating unit 80 .
  • the antenna radiating unit 80 is connected to the antenna radiating unit feeder circuit board 71.
  • the circuit board is an antenna radiating unit feeder circuit board 71.
  • the duplexer 20 is connected to the antenna radiating unit feeder circuit board 71 of the antenna unit 300 through the coaxial connector 26.
  • the antenna unit 300 includes an antenna reflector 70, and the antenna reflector 70 is provided with an antenna radiating unit feeder circuit board 71.
  • the antenna radiating unit feeder circuit board 71 is provided with an antenna radiating unit 80.
  • the antenna radiates
  • the unit 80 is connected to the antenna radiating unit feeder circuit board 71.
  • the antenna unit 300 further includes a feeder network circuit board 73, the feeder network circuit board 73 and the antenna radiating single The meta-feed circuit board 71 is connected.
  • the circuit board includes: a feeder network circuit board 73 and an antenna radiating unit feeder circuit board 71.
  • the antenna radiating unit feeder circuit board 71 is connected to the feeder network circuit board 73, and the duplexer 20 passes
  • the coaxial connector 26 is connected to the feeder network circuit board 73 of the antenna unit 300.
  • FIG. 8 and 9 a schematic diagram of the duplexer 20 of Figure 7 being coupled to the feeder network circuit board 73 via a coaxial connector 26 is shown.
  • the inner conductor 261 of the coaxial connector 26 can be coupled to the feeder network circuit board 73 by screws, and the outer conductor 262 of the coaxial connector can be coupled to the feeder network circuit board 73 by screws.
  • the coaxial connector 26 can also be connected to the feeder network circuit board 73 by soldering, and the embodiment of the present invention is not limited thereto.
  • the coaxial connector 26 can also be coupled to the antenna radiating element feeder circuit board 71.
  • the reflector 73 is provided with a hole 731.
  • the coaxial connector 26 is sleeved on the hole 731.
  • the outer conductor 262 of the coaxial connector 26 and the peripheral side of the hole 731 of the reflector 73 are shown. There is an insulation between them.
  • electromagnetic induction between the coaxial connector outer conductor 262 and the reflection plate 73 can be prevented, which affects the electromagnetic radiation performance of the antenna radiating unit 80.
  • the coaxial connector 26 is provided with a boss 77.
  • the outer conductor 262 of the coaxial connector 26 is separated from the reflector 70 by the boss 77.
  • the insulating portion is a boss 77.
  • the insulating portion may also be an insulating spacer, and the outer conductor 262 of the coaxial connector 26 is separated from the reflecting plate 70 by an insulating spacer.
  • the power amplifier circuit board 40 is provided with heat dissipating teeth 42 on one side, and the heat dissipation teeth 62 are disposed on one side of the transceiver circuit board 60.
  • the heat dissipating teeth 42 and the heat dissipating teeth 62 can be used for the power amplifier.
  • the heat generated by the circuit board 40 and the transceiver circuit board 60 goes out.
  • an integrated antenna is provided in the embodiment of the present invention.
  • the radio frequency unit 200 is further provided with a sun shield 65.
  • the sun shield 65 can not only block the illumination of sunlight, but also form a chimney effect through the sun shield 65. , dissipating heat for the radio frequency unit 200, as shown in FIG. This is more advantageous for heat dissipation of the RF unit 200.
  • the sun shield 65 can be fixed to the radio frequency unit 200 by screws.

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)

Description

一种射频单元以及集成天线
技术领域
本发明涉及通信技术领域, 特别地, 涉及一种射频单元以及集成天线。 背景技术
随着无线通信技术的发展,越来越多的基站朝小型化、集成化发展, 同时, 人们希望基站在性能不断提升的同时其整体架构越来越小、 越来越轻。 这样, 随着基站小型化的发展,如何使集成于天线的射频单元满足散热需求成为业界 急需解决的问题。
如图 1所示, 为现有技术中一种射频单元的结构示意图。 该射频单元 100 包括双工器 10、 功放电路板 30以及收发信机电路板 50, 其中, 该双工器 10 与该功放电路板 30和该收发信机电路板 50连接, 该功放电路板 30与该收发 信机电路板 50连接, 其中, 该功放电路板 30与该收发信机电路板 50相对。 该射频单元 100还包括第一箱体 71和第二箱体 73 , 第一箱体 71和第二箱体 73可以形成一个密闭腔体, 该功放电路板 30和该收发信机电路板 50位于该 密闭腔体内。 第一箱体 71和第二箱体 73设有散热齿, 该功放电路板 30和该 收发信机电路板 50产生的热量, 可以通过第一箱体 71和第二箱体 73的散热 齿散热。
该射频单元 100通常与天线集成在一起,发射信号时,传输设备通过光纤 或者电缆把数字信号传输给基带处理单元,该基带处理单元把数字信号转换为 模拟信号, 模拟信号通过收发信机电路板 10处理成射频小信号, 射频小信号 通过功放电路板 30放大为大功率射频信号,然后通过双工器 10滤波传输给天 线, 这样, 天线就可以把射频信号转换成电磁波辐射出去; 接收信号时, 天线 接收来自终端的电磁波, 把电磁波转换成射频信号, 射频信号通过双工器 10 滤波, 传输给收发信机电路板 50, 收发信机电路板 50把信号处理成模拟信号 传送给基带处理单元,基带处理单元再把模拟信号处理成数字信号传输给传输 设备。
在射频单元 100工作时,功放电路板 30和收发信机电路板 50会产生热量, 功放电路板 30与该收发信机电路板 50相对 , 这样 , 功放电路板 30产生的热 量可能会影响到该收发信机电路板 50, 从而可能会影响射频单元 100的散热 效率。
发明内容
本发明实施例提供了一种射频单元和集成天线,可以提高射频单元的散热 效率。
本发明实施例提供了一种射频单元,所述射频单元包括双工器、功放电路 板以及收发信机电路板,所述双工器与所述功放电路板和所述收发信机电路板 连接, 所述功放电路板和所述收发信机电路板连接, 其中, 所述功放电路板和 所述收发信机电路板分别位于所述双工器的两端部,所述功放电路板和所述收 发信机电路板沿垂直所述功放电路板方向投影到同一平面无重叠。
本发明实施例还提供了一种集成天线,所述集成天线包括天线单元和射频 单元, 其中, 所述射频单元包括双工器、 功放电路板以及收发信机电路板, 所 述双工器与所述功放电路板和所述收发信机电路板连接,所述功放电路板和所 述收发信机电路板连接,其中, 所述功放电路板和所述收发信机电路板分别位 于所述双工器的两端部,所述功放电路板和所述收发信机电路板沿垂直所述功 放电路板方向投影到同一平面无重叠,所述双工器通过同轴连接器与所述天线 单元的电路板连接。
由上可以看出,该功放电路板和该收发信机电路板分别位于该双工器的两 端部,该功放电路板和该收发信机电路板沿垂直该功放电路板方向投影到同一 平面无重叠,该功放电路板产生的热量难以影响到该收发信机电路板, 采用这 种布局的射频单元可以提高该射频单元的散热效率。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施 例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地, 下面描述 中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付 出创造性劳动性的前提下, 还可以根据这些附图获得其他的附图。
图 1为现有技术中一种射频单元的结构示意图;
图 2为本发明实施例射频单元的结构示意图;
图 3为本发明实施例射频单元的又一结构示意图;
图 4为本发明实施例射频单元的又一结构示意图; 图 5为本发明实施例中功放电路板和射频单元为共板结构示意图; 图 6为本发明实施例一种集成天线的结构示意图;
图 7为本发明实施例一种集成天线的又一结构示意图;
图 8 为本发明实施例一种集成天线中双工器的同轴连接器与馈线网络电 路板连接的示意图;
图 9 为本发明实施例一种集成天线中双工器的同轴连接器与馈线网络电 路板连接的示意图;
图 10为本发明实施例一种集成天线中双工器的同轴连接器与馈线网络电 路板连接的示意图;
图 11为本发明实施例一种集成天线包括遮阳罩的结构示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清 楚、 完整地描述, 显然, 所描述的实施例仅仅是本发明一部分实施例, 而不是 全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造 性劳动前提下所获得的所有其他实施例, 都属于本发明保护的范围。
请参阅图 2, 为本发明实施例射频单元的结构示意图。 本发明实施例一种 射频单元 200, 包括双工器 20、 功放电路板 40和收发信机电路板 60, 该双工 器 20与该功放电路板 40和收发信机电路板 60连接,该功放电路板 40与该收 发信机电路板 60连接, 该功放电路板 40和该收发信机电路板 60分别位于该 双工器 20的两端部 , 该功放电路板 40和该收发信机电路板 60沿垂直该功放 电路板 40方向投影到同一平面无重叠。
由上可以看出, 本发明实施例一种射频单元 200 工作时, 该功放电路板 40和该收发信机电路板 60分别位于该双工器 20的两端部 , 该功放电路板 40 和该收发信机电路板 60沿垂直该功放电路板 40方向投影到同一平面无重叠, 该功放电路板 40产生的热量难以影响到该收发信机电路板 60, 采用这种布局 的射频单元 200能够提高该射频单元 200的散热效率。
续请参阅图 2, 垂直该功放电路板 40的方向如图 2中箭头 46所示, 与该 箭头方向垂直的平面为平面 48,所述功放电路板 40和所述收发信机电路板 60 分别在所述平面 48上形成投影, 并且所述功放电路板 40和收发信机电路板 60分别在所述平面 48上形成的投影无重叠。
其中 ,该功放电路板 40侧设有散热齿,该收发信机电路板 60侧设有散热 齿。 射频单元 200工作时, 可以通过散热齿将该功放电路板 40和该收发信机 电路板 60产生的热量散发出去。
其中 , 请参阅图 2, 该功放电路板 40和该收发信机电路板位于同一平面。 需要说明的是, 该功放电路板 40和该收发信机电路板位于同一平面, 并不一 定是严格几何意义上的同一平面,可以存在一定误差,此误差可以为 10%左右, 或 15%。 只要能提高射频单元的散热效率即可。 当然, 也可以理解为严格几何 意义上的同一平面。
其中, 该射频单元 200还包括基带处理单元和混合连接器 66, 该收发信 机电路板 60与该基带处理单元连接,该基带处理单元通过混合连接器 66与传 输设备和电源设备连接。 该电源设备为该功放电路板 40、 收发信机电路板 60 和基带处理单元供电。
其中, 该射频单元 200还包括混合连接器 66, 该收发信机电路板 60通过 该混合连接器 66与基带处理单元和电源设备连接。 该电源设备为该功放电路 板 40、 收发信机电路板 60和基带处理单元供电。
更进一步, 该传输设备可以为光网络传输设备, 或微波传输设备。
其中, 续请参阅图 2, 该双工器 20包括两个端部, 即第一端部 22和第二 端部 24, 第一端部 22可以与第二端部 24相对。 该功放电路板 40位于该双工 器 20的第一端部 22, 该收发信机电路板 60位于该双工器 20的第二端部 24。 可以理解的是, 该功放电路板 40也可以位于该双工器 20的第二端部 24, 该 收发信机电路板 60也可以位于该双工器 20的第一端部。
下面以功放电路板 40位于双工器 20的第一端部 22, 收发信机电路板 60 位于双工器 20的第二端部 24为例进行阐述:
请参阅图 2,该功放电路板 40位于该双工器 20的第一端部 22,具体可以 为: 该功放电路板 40位于该双工器 20的一端 , 并且该功放电路板 40位于该 一端的一侧 222;同理,该收发信机电路板 60位于该双工器 20的第二端部 24, 具体可以为: 该收发信机电路板 60位于该双工器 20的另一端, 并且该收发信 机电路板 60位于该另一端的一侧 224。 其中, 该双工器 20—端的一侧 222与 该双工器 20另一端的一侧 224为该双工器 20同一侧。 由图 2可以看出,该功 放电路板 40与该收发信机电路板 60位于同一平面。
请参阅图 3 ,该功放电路板 40位于该双工器 20的第一端部 22,具体可以 为: 该功放电路板 40位于该双工器 20的一端 , 并且该功放电路板 40位于该 一端的一侧 222; 该收发信机电路板 60位于该双工器 20的第二端部 24,具体 可以为: 该收发信机电路板 60位于该双工器 20的另一端, 并且该收发信机电 路板 60位于该另一端的另一侧 226。 由图 3可以看出, 该双工器 20—端的一 侧 222与该双工器 20另一端的另一侧 226为该双工器 20不同的两侧。该功放 电路板 40和该收发信机电路板 60位于该双工器 20的两侧。
请参阅图 4,该功放电路板 40位于该双工器 20的第一端部 22,具体可以 为: 该功放电路板 40位于该双工器 20的一端 , 并且该功放电路板 40位于该 双工器 20的一端上方;该收发信机电路板 60位于该双工器 20的第二端部 24, 具体可以为: 该收发信机电路板 60位于该收工器 20的另一端, 并且该收发信 机电路板 60位于该双工器 20的另一端的下方。 当然, 本发明实施例中, 该功 放电路板 40也可以位于该双工器 20另一端的下方, 该收发信机电路板 60也 可以位于该双工器 20的一端的上方。
需要说明的是, 在上述实施例描述中, 所使用的某些术语仅用于参照, 因 此并不意味着进行限制。 例如, 诸如"一端"、 "另一端"等术语是指所参照的附 图中的方向。 除非文中明确指出, 涉及的术语"第一"、 "第二 "及其它此类数词 不暗示顺序或次序。
可以理解的是,该功放电路板 40和该收发信机电路板 60分别位于该双工 器 20的两端部, 可以为: 该功放电路板 40位于该双工器 20—端的一侧, 该 收发信机电路板 60位于该双工器 20另一端的一侧; 或: 该功放电路板 40和 该收发信机电路板 60分别位于该双工器 20的两端。 当然, 该功放电路板 40 和该收发信机电路板 60分别位于该双工器 20的两端部 ,还可以为: 该功放电 路板 40位于该双工器 20的一端的一侧 , 该收发信机电路板 60位于靠近该双 工器的另一端的下方或上方。
具体的,该功放电路板 40位于该双工器 20的一端的一侧,该收发信机电 路板 60位于靠近该双工器 20的另一端的下方或上方, 为: 该功放电路板 40位于该双工器 20的一端的一侧, 该收发信机电路板 60 位于该双工器 20另一端的下方; 或: 该功放电路板 40位于该双工器 20的一 端的一侧, 该收发信机电路板 60位于该双工器 20另一端的上方。
其中, 该双工器 20与该功放电路板 40连接, 可以为: 该双工器 20与该 功放电路板 40, 通过螺钉硬连接、 帽子硬连接、 射频连接器连接、 同轴电缆 连接或盲插连接器连接。 同理, 该双工器 20与该收发信机电路板 60连接, 可 以为: 该双工器 20与该收发信机电路板 60, 通过螺钉硬连接、 帽子硬连接、 射频连接器连接、 同轴电缆连接或盲插连接器连接。
其中, 功放电路板 40与该收发信机电路板 60连接, 可以为: 该功放电路 板 40与该收发信机电路板 60通过混合连接器、 射频连接器或同轴电缆连接。
续请参阅图 2, 该双工器 20通过盲插连接器 82与该功放电路板 40和该 收发信机电路板 60连接; 该功放电路板 40通过同轴电缆 84与该收发信机电 路板 60连接。
可以理解的是, 图 2中一种射频单元实施例中, 功放电路板 40是通过同 轴电缆 84与收发信机电路板 60连接。 请参阅图 5 , 该功放电路板 40与该收 发信机电路板 60可以为一个电路板, 即功放电路板 40与该收发信机电路板 60为共板结构,该功放电路板 40通过电路板上的线路与该收发信机电路板 60 连接。 该双工器 20可以通过盲插连接器 82与该功放电路板 40和该收发信机 电路板 60连接。
续请参阅图 5 , 为本发明实施例一种射频单元的结构示意图。 该射频单元 包括双工器 20、 功放电路 40以及收发信机电路 60, 该双工器 20分别与该功 放电路 40和该收发信机电路 60连接, 该功放电路 40与该收发信机电路 60 连接, 该功放电路 40和该收发信机电路 60位于同一电路板。
其中 , 该双工器 20位于该电路板中间位置。
需要说明的是, 该双工器 20位于该电路板的中间位置, 并不一定是几何 意义上的中间位置,可以存在一定的误差,此误差可以为 10%左右,或者 15%。 当然, 也可以是几何意义上的中间位置。
由上可以看出, 本发明实施例一种射频单元 200 工作时, 该功放电路板 40和该收发信机电路板 60分别位于该双工器 20的两端部, 该功放电路板 40 和该收发信机电路板 60沿垂直该功放电路板 40方向投影到同一平面无重叠, 这种布局的射频单元 200能够提高该射频单元 200的散热效率。
请参阅图 6, 为本发明实施例一种集成天线的结构示意图。 该集成天线包 括天线单元 300和射频单元 200, 其中, 该射频单元 200包括双工器 20、 功放 电路板 40和收发信机电路板 60, 该双工器 20与该功放电路板 40和收发信机 电路板 60连接, 该功放电路板 40与该收发信机电路板 60连接, 其中, 该功 放电路板 40和该收发信机电路板 60分别位于该双工器 20的两端部 , 该功放 电路板 40和该收发信机电路板 60沿垂直该功放电路板 40方向投影到同一平 面无重叠, 该双工器 20通过同轴连接器 26与该天线单元 300的电路板连接。
由上可以看出, 射频单元 200的功放电路板 40与该收发信机电路板 60 分别位于该双工器 20的两端部 , 该功放电路板 40和该收发信机电路板 60沿 垂直该功放电路板 40方向投影到同一平面无重叠。 这种布局的射频单元 200 能够提高该射频单元 200的散热效率。
更进一步,该双工器 20通过同轴连接器 26与该天线单元 300的电路板连 接。 这样, 降低了射频信号在双工器 20与天线单元 300之间的损耗。
其中,该天线单元 300可以为定向天线也可以为全向天线。该天线辐射单 元 80可以为阵子型天线,也可以为贴片型天线。本发明实施例并不局限于此。
需要说明的是,该实施例一种集成天线中提到的射频单元 200可以与实施 例一种射频单元阐述的结构一致, 在此, 不再重述。
其中, 续请参阅图 6, 该天线单元 300包括天线反射板 70, 并于该天线反 射板 70设有天线辐射单元馈线电路板 71 , 该天线辐射单元馈线电路板 71设 有天线辐射单元 80, 该天线辐射单元 80与该天线辐射单元馈线电路板 71连 接。
其中, 续请参阅图 6, 该电路板为天线辐射单元馈线电路板 71 , 该双工器 20通过同轴连接器 26与天线单元 300的天线辐射单元馈线电路板 71连接。
请参阅图 7, 该天线单元 300包括天线反射板 70, 并于该天线反射板 70 设有天线辐射单元馈线电路板 71 , 该天线辐射单元馈线电路板 71设有天线辐 射单元 80, 该天线辐射单元 80与该天线辐射单元馈线电路板 71连接, 该天 线单元 300还包括馈线网络电路板 73 , 该馈线网络电路板 73与该天线辐射单 元馈线电路板 71连接。
其中, 续请参阅图 7, 该电路板包括: 馈线网络电路板 73和天线辐射单 元馈线电路板 71 , 该天线辐射单元馈线电路板 71与该馈线网络电路板 73连 接, 该双工器 20通过同轴连接器 26与天线单元 300的馈线网络电路板 73连 接。
请参阅图 8和图 9, 为图 7中双工器 20通过同轴连接器 26与该馈线网络 电路板 73连接的示意图。该同轴连接器 26的内导体 261可以通过螺钉与该馈 线网络电路板 73连接, 该同轴连接器的外导体 262可以通过螺钉与该馈线网 络电路板 73连接。可以理解的是,该同轴连接器 26也可以通过焊接的方式与 该馈线网络电路板 73连接, 本发明实施例并不局限于此。 当然, 该同轴连接 器 26也可以与天线辐射单元馈线电路板 71连接。
请参阅图 10, 该反射板 73开设有孔 731 , 该同轴连接器 26套设于该孔 731 , 所述同轴连接器 26的外导体 262与所述反射板 73的孔 731的周侧间设 有绝缘部。这样,可以防止同轴连接器外导体 262与反射板 73之间电磁感应, 影响天线辐射单元 80的电磁波辐射性能。
其中, 该同轴连接器 26设有凸台 77, 通过该凸台 77使该同轴连接器 26 的外导体 262与该反射板 70隔开, 该绝缘部为凸台 77。 该绝缘部也可以为绝 缘垫片 , 通过绝缘垫片使该同轴连接器 26的外导体 262与该反射板 70隔开。
更进一步, 请参阅图 6和图 7, 该功放电路板 40—侧设有散热齿 42, 该 收发信机电路板 60一侧设有散热齿 62 , 该散热齿 42和散热齿 62可以将功放 电路板 40和收发信机电路板 60产生的热量 出去。
请参阅图 11, 本发明实施例一种集成天线, 于该射频单元 200还设有遮 阳罩 65 , 这样, 该遮阳罩 65不仅可以遮挡太阳光的照射, 还可以通过该遮阳 罩 65形成烟囱效应, 为该射频单元 200散热, 如图 10中的气流方向。 这样更 有利于该射频单元 200 的散热。 该遮阳罩 65 可以通过螺钉固定在射频单元 200。
以上所述仅为本发明的几个实施例,本领域的技术人员依据申请文件公开 的可以对本发明进行各种改动或变型而不脱离本发明的精神和范围。

Claims

权 利 要 求
1、 一种射频单元, 包括双工器、 功放电路板以及收发信机电路板, 所述 双工器分别与所述功放电路板和所述收发信机电路板连接,所述功放电路板和 所述收发信机电路板连接,其特征在于, 所述功放电路板和所述收发信机电路 板分别位于所述双工器的两端部,所述功放电路板和所述收发信机电路板沿垂 直所述功放电路板方向投影到同一平面无重叠。
2、 根据权利要求 1所述的射频单元, 其特征在于, 所述功放电路板和所 述收发信机电路板分别位于所述双工器的两端部, 为:
所述功放电路板位于所述双工器的一端的一侧,所述收发信机电路板位于 所述双工器的另一端的一侧。
3、 根据权利要求 1所述的射频单元, 其特征在于, 所述功放电路板和所 述收发信机电路板分别位于所述双工器的两端部, 为:
所述功放电路板和所述收发信机电路板分别位于所述双工器的两端。
4、 根据权利要求 1所述的射频单元, 其特征在于, 所述功放电路板和所 述收发信机电路板分别位于所述双工器的两端部, 为:
所述功放电路板位于所述双工器的一端的一侧,所述收发信机电路板位于 靠近所述双工器的另一端的下方或上方。
5、 根据权利要求 1或 2或 3所述的射频单元, 其特征在于, 所述功放电 路板和所述收发信机电路板基本位于同一平面。
6、 根据权利要求 5所述的射频单元, 其特征在于, 所述功放电路板和所 述收发信机电路板共板。
7、 根据权利要求 1所述的射频单元, 其特征在于, 所述射频单元还包括 混合连接器 ,所述收发信机电路板通过所述混合连接器与基带处理单元和电源 设备连接。
8、 根据权利要求 1所述的射频单元, 其特征在于, 所述射频单元还包括 基带处理单元和混合连接器 , 所述收发信机电路板与所述基带处理单元连接 , 所述基带处理单元通过所述混合连接器与传输设备和电源设备连接。
9、 根据权利要求 1所述的射频单元, 其特征在于, 所述功放电路板侧设 有散热齿, 所述收发信机电路板侧设有散热齿。
10、 一种射频单元, 其特征在于, 所述射频单元包括双工器、 功放电路以 及收发信机电路, 所述双工器分别与所述功放电路和所述收发信机电路连接, 所述功放电路与所述收发信机电路连接,所述功放电路和所述收发信机电路位 于同一电路板。
11、 根据权利要求 10所述的射频单元, 其特征在于, 所述双工器基本位 于所述电路板中间位置。
12、一种集成天线,其特征在于,所述集成天线包括天线单元和射频单元, 其中, 所述射频单元包括双工器、 功放电路板以及收发信机电路板, 所述双工 器与所述功放电路板和所述收发信机电路板连接,所述功放电路板和所述收发 信机电路板连接,所述功放电路板和所述收发信机电路板分别位于所述双工器 的两端部,所述功放电路板和所述收发信机电路板沿垂直所述功放电路板方向 投影到同一平面无重叠,所述双工器通过同轴连接器与所述天线单元的电路板 连接。
13、 根据权利要求 12所述的集成天线, 其特征在于, 所述天线单元包括 反射板, 所述反射板开设有孔, 所述同轴连接器套设于所述孔, 所述同轴连接 器的外导体与所述反射板的孔的周侧之间设有绝缘部。
14、根据权利要求 12或 13所述的集成天线, 其特征在于, 所述电路板为 天线辐射单元馈线电路板。
15、根据权利要求 12或 13所述的集成天线, 其特征在于, 所述电路板包 括馈线网络电路板和天线辐射单元馈线电路板,所述馈线网络电路板和所述天 线辐射单元馈线电路板连接,所述双工器通过同轴连接器与所述天线单元的馈 线网络电路板连接。
16、 根据权利要求 12所述的集成天线, 其特征在于, 所述功放电路板侧 设有散热齿, 所述收发信机电路板侧设有散热齿。
17、 根据权利要求 12所述的集成天线, 其特征在于, 所述集成天线还包 括遮阳罩, 所述遮阳罩设于所述射频单元。
18、 根据权利要求 12所述的集成天线, 其特征在于, 所述天线单元为定 向天线, 或全向天线。
19、 根据权利要求 13所述的集成天线, 其特征在于, 所述绝缘部为同轴 连接器设有的凸台 ,通过所述凸台使所述同轴连接器的外导体与所述反射板孔 周侧之间隔开; 或所述绝缘部为绝缘垫片,通过所述绝缘垫片使所述同轴连接 器的外导体与所述反射板孔周侧之间隔开。
PCT/CN2009/070783 2009-03-13 2009-03-13 一种射频单元以及集成天线 WO2010102454A1 (zh)

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JP2011553252A JP5491535B2 (ja) 2009-03-13 2009-03-13 無線周波数ユニット及び統合アンテナ
EP09841323.0A EP2408121B1 (en) 2009-03-13 2009-03-13 Radio frequency unit and integrated antenna
CN2009801564352A CN102282778B (zh) 2009-03-13 2009-03-13 一种集成天线
EP15179453.4A EP2983302B1 (en) 2009-03-13 2009-03-13 Radio frequency unit and integrated antenna with improved heat dissipation
US13/231,680 US8971824B2 (en) 2009-03-13 2011-09-13 Radio frequency unit and integrated antenna
US13/287,773 US8781409B2 (en) 2009-03-13 2011-11-02 Radio frequency unit and integrated antenna

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