Classifications

• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V3/00—Globes; Bowls; Cover glasses
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
  • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
  • F21K9/20—Light sources comprising attachment means
  • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
  • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
  • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
  • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
  • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
  • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
  • F21V29/50—Cooling arrangements
  • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
  • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
  • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
  • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
  • F21Y2103/30—Elongate light sources, e.g. fluorescent tubes curved
  • F21Y2103/33—Elongate light sources, e.g. fluorescent tubes curved annular
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
  • F21Y2107/40—Light sources with three-dimensionally disposed light-generating elements on the sides of polyhedrons, e.g. cubes or pyramids
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F21—LIGHTING
  • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
  • F21Y2115/00—Light-generating elements of semiconductor light sources
  • F21Y2115/10—Light-emitting diodes [LED]

Definitions

• the present invention relates to the field of LHD lighting and, more particularly, to concentrated LHD lighting devices that transfer heat quickly to a separate heat sink with or without active cooling to dissipate the heat away from the concentrated LED light source.
• Light emitting diodes are considered an efficient light source to replace incandescent, compact fluorescent lights (CFLs) and other more conventional light sources to save electrical energy. LEDs use significantly less than the energy required by incandescent lights to produce comparable amounts of light. The energy savings ranges from 40 to 80% depending on the design of light bulbs. In addition, LEDs contain no environmental harming elements, such as mercury that is commonly used in (“FLs. Light bulbs using LEDs as the light source for replacing traditional incandescent bulbs, CFLs and other conventional sources are required to produce the same as or better quantities and qualities of light. The quantity of the light depends on light output, which can be increased with increasing LED efficiency, number or size, as well as electronic driver efficiency.
• the quality of the light is related to factors affecting the color rendering index and die light beam profile. Since most packaged LED devices do not emit light omni-dir ⁇ ctionally, a challenge exists when designing replacement bulbs using packaged LJP-Ds thai do emit light omnidirectionally. On the other hand, LHDs emitting in one direction can be easily adopted for down lighting as is done with MR16 lights with heat management systems and an electronic driver. However, in order to radiate light spatially using LEDs - i.e., in a non-unidirectional or omni-directional fashion similar to that provided using incandescent bulbs - a special three-dimensional positioning arrangement for multiple LEDs is generally required.
• the invention discloses a 3 dimensional LHD arrangement tin ⁇ heat management method using a heat transfer pipe to enable the heat transferred quickly from a 3 dimensional cluster of LEDs to a heatsink with/without active cooling, I he light emitted from the 3 dimensional clustei is not obstructed b> am' heat sink attangemem so that the light beam profile can be similar to traditional incandescent bulbs,
• FlG. 1 provides a perspective ⁇ iew of one embodiment of an LED lighting device according to the present [mention;
• FIG, 2 ides a cross sectional view of the LED lighting device illustrated m FIG L
• FIG. 3 provides a cross sectional ⁇ lev, of one embodiment of a heat pipe as used in the present invention
• FlG, 4 provides a cross season ⁇ iew of a second embodiment of an LHD lighting device according to the piesent iineniion,
• FKi 5 provides a perspective view of a yet further embodiment of an LF. D lighting device accoiding to the present invention
• FIG. (> pros ides a cross seasonal v iew of the FED lighting ice iilusuated ⁇ n FSG 5. and [001 ⁇ ) I- Ki " provides a cross sectional ⁇ jew of vet anothei embodiment of an LED lighting ⁇ e ⁇ ice aecouling to thetab ⁇ t invention
• FIG. 1 and 2 an tmbodimem of the pi esem im entson LS illustrated depicting an LED lighting mg a pita alrt) of panels 102 and LEDi 1 (B mounted t ⁇ the panels 102 and antageousiy ati ⁇ tigcd aboui a cential a ⁇ is fot space lighting / e , lighting in a non -unidirectional fashion similar to that ided using incandescent bulba Illumination from the lighting device 100 ib piovided by the pluiahtv of LCDs 103 A gla ⁇ s us plastic bulb (or transpaiem housing) 10t> encases the LbDs and the ⁇ auou?
• the heat conduction pipe iefers to any devisctuie or r ⁇ ate ⁇ al capable of conducting heat ft om high to Jo ⁇ tempej atiire
• I he fiamc 124 is seemed to the proximal end 120 of the boat conduction pipe S G ⁇
• the fiame 124 has an uppei 12b and Sower 128 smface ⁇ ith holes 132 extending thiough the sui faces for mounting the irai ⁇ c 124 to a rod-like !
• the frame 124 can be seemed to the heat conduction pipe 105 using a tight fiictum-ilt OJ a heat conducts e paste between the outei suiface of the pipe 105 and the tnnei suiface of the holes 132 oi using suitable ⁇ i fasteneis
• the frame 124 can be solid oi hollow , depending on the heat load or weight req ⁇ tionss
• the frame 124 is constructed fiora metal sheet stock e g aluminum oi anv oth ⁇ i heat conducting matetial - and constructed using fold lines positioned on the sheet stock to yield the desired thiee-dimensional mtiltifaceted shape or design
• the frame can be constructed using a slug of metal or any other heat conducting maienal the slug being cast oi machined or otherwise molded into the desired multifaceted shape oi design
• Embodiments employing the hollow deMgn raav include heat conducting means - e g .
• the facets of the frame 124 can be vertical or angel posithei) or negatnely, depending upon the desiied iighi beam profile of the lighting device 100 and the emitting patterns of the component Lf Ds
• the plurality of panels 102 and LEDs 103 are secured to one or more of the faces of the mul ⁇ - faceted frame 124.
• pairs of screws 134 secure corresponding panels 102 to each face of the frame 124
• the light emitting ponion of each ⁇ .F.D 103 extends through a hole in the panel 102 while the backside of the LIiD is attached to either the panel 102 or the face of the frame or both using a heat conductive paste 144
• the I EDs 103 are wired in series by connecting corresponding positive and negathe leads from each LED 103 using wires 104.
• the LEDs can also be connected using combinations of serial and parallel ciieurtry depending on die components u&ed and the requirements of the electronic driser. ⁇ paii of power conducting wires 140, 142 supply powei to the LEDs 103 from an electronic driver 145.
• the electronic driver 145 is used to cov ert AC input tu DC output that is generally required to drive LED circuiU ⁇ , electticaii ⁇ isolate various components of the dc ⁇ iee from one another and to control operation of the LEDs - e.g., control dimming
• the electronic drh ei 145 is positioned tmide ⁇ standaid Edison base 1 1 1 of the lighting device 100 and connected to the Edison base which generally receives AC pow er thiough conducting leads 246. 247. er. if the I EDs on the frame 124 can be driven directly ⁇ C power, then the electronic dr ⁇ er 145 ss not requited in the embodiment.
• the threaded base portion generally comprises the components and sizes associated with n standaid Edison screw base - e.g., size E27, ⁇ m ⁇ ranging fto ⁇ i E5 io E40, while threaded base pott ions ate generally preferred for connection with an external supply of power, other means of connection - e si ⁇ pins or prongs ai ⁇ considered within the scope of the m ⁇ etit ⁇ on Surface mounted I FDs are generally preferred for the foregoing embodiment, and those skilled in the art will appreciate that while the e description refers to wiring the LFDs in series, the LKDs are also readily wired in parallel or using combinations of series and parallel circuitry.
• the distal end 122 of the heat conduction pipe 105 extends into a iieat sink 108.
• the heat sink 108 is illustrated hav ing fins 110 for dissipation of heat although rods or other configurations of heat dissipations means may be used
• the fins 1 10 extend from a heat conducting slug ! 12 that conducts heat from the distal end of the heat conduction tube 105 and to the tins 1 SO.
• a fan assembly 3 14 is positioned below the heat sink 108 and directs a flow of cooling air past the fins 1 10 of die heat sink SOS.
• the bulb lOo maj be completely sealed, as illustrated in FIG, 2.
• the flow of cooiins; aii is directed thiouuh the fms 1 H) and about the outer surface of the bulb 106
• the bulb ! 06 may include an opening adjacent the fins 1 ! O, in which case the flow of cooling air is directed past the fms 1 10 and into the interior of the bulb 106
• a storage space 1 16 is incorporated into the lighting device 100, typically abov e the threaded base portion 1 1 ! and the below the heat smk 108,
• a heat conduction pipe S 50 for use w ith the present invention includes a sealed cylindrical tube 152, a wiekiru ⁇ structure 154, a working fluid within the wicking structuie 152 and a hoi Sow space 156 interior to the wicking structure 154
• Application of heat at a ptoximal end PO of the heat conduction pipe 150 causes the working fluid at that point to evaporate to the gaseous state, picking up the latent heat of vaporization.
• the ga ⁇ t which then has a higher pressure, travels along the hollow space 156 toward the cooler distal end 172 where it condenses back to the liquid state, releasing the latent heat of vaporization to the distal end 172 of the heat conduction pipe 150, The condensed working fluid then trav els back along the kicking structure 152 toward the ptoximal end 170 and repeats the process.
• the heat conducting pipe include an i ⁇ tetiot section housing au interior solid mate ⁇ ai ha ⁇ ing a melting point below that of the materia ⁇ used to construct the heat pipe
• the latent heat of melting of the interim material may be used t ⁇ store a portion of the heat generated by the LFJDs m the interior material changes phase from a solid to a liquid
• the heat conduction pipe is constructed of aluminum or copper and houses an interior mate ⁇ ai comprising tin or lead, both of which exhibit melting points substantially below that of both copper and aluminum.
• Gallium mas also be used, as a suitable metal for the interior material.
• a still further alteraat ⁇ e is to substitute a solid rod, constructed using materials having good heat conduction properties, e.g. aluminum or copper, for the more com cntional heat conduction pipes described above
• the heat conduction pipe is a cylindrical rod between about two ⁇ 2s and about three (3) inches in length and between about one-quarter ⁇ ! 4) and about three- quarteis (3/4) inch in diameter and constructed of copper;
• the heat sink 1OS including the heat slug 1 12, is between about one-half (J /2 ⁇ and about one U) inch in diametei and between about one-q ⁇ aiter ( 1 4 ⁇ and about one (1 ⁇ inch in thickness and constructed of aluminum;
• the frame is a six-sided hexagon-shaped hollow frame constructed of aluminum sheet, ing an average diameter between about one-half 0/2) and about one ( 1) inch, a length between about one-quaiter (1/4) and about one ( 1) inch and a sheet thickness, of between about one thirty- second ( I 32 s and about one q ⁇ artei (1 4) inch I he shape of the bulb 1 Ob approximates the shape of a standard 10OW incandescent bulb hax ing a sta ⁇ daid Jb27
• An LED lighting de ⁇ ice 200 includes a plurahts of LED chips 203 that are mounted to a multi-faceted frame 224 and advantageous! ⁇ arranged about a central axis tor space fighting. Illumination from the lighting device 200 is provided by the plurality of Li: D chips 203.
• This lighting configuration is similai to that discussed aboxe regarding FIGS. 1 and 2, with the exception that the lighting m the current embodiment JS ided by LHO chips mounted on the multi-faceted lead frame 224, rather than surface mounted LEDs
• Various exemplar chips suitable for use with the present inv ention are disclosed in US Pat. Ko 6,719,446 (Cao).
• the LLD chips 203 are mounted directly to the multi-faceted frame 224 Suitable such as epoxy. may be used to mount each chip to the frame 224.
• ⁇ glass or plastic bulb 206 encases the t ED chips and frame 224 and. as detailed below, the various cor ⁇ ponentb that incorporate the assembled lighting de ⁇ ice 200.
• an optional layer of phosphor 250 encases one oi more of the I FD chips 203.
• the lave* of phosphor is advantageous in that it, fo ⁇ example, in one embodiment, produces a white light or the appearance of a white light - e g., by using an ultraviolet LED chip to stimulate a white-emitting phosphor or by usmg a blue I.
• white light or the appearance thereof is produced through use of a plurality of 450- 47OtUIi blue gallium nitride LED chips cov ered by a layer of yellowish phosphor of cerium doped yttrium aluminum garnet crystals
• [0022] 1 he LHD chips are electrical Iy connected within the lighting device 200, m one embodiment, bv. connecting a negativ e .e ⁇ ninal of each chip to the frame 224 using a first wire 230 and by connecting a positive terminal of each chip to an electrically conducting cap 212 using a second wire 214.
• the electrical] ⁇ conducting cap 212 is positioned atop the frame 224 and electrically insulated therefrom by an insuiaiion layer 216, vhich can be constructed using epoxy, ⁇ IO or am other material ing electrically insulating properties.
• ⁇ pair of electrical conducting wires 240, 242 supply power to the LED chips 203 from a standard threaded base portion 21 1 of the bulb device 200
• Hie pair of power supply wires 240 « 242 extend, respectively, from corresponding contacts at the base portion 21 1 to the electronic dm er 245 inside.
• the electronic dm ei 245 is used to coven AC input to DC output that is geoeially required to drive LED circuitry electrically isolate various components of Ae device from one another and control operation of the LEDs - e.g , control dimming.
• the electronic driver 245 is positioned inside a standard bdison base 21 1 of the lighting device 200 and connected to She Cdiso ⁇ base which general! ⁇ receiver AC power tJiro ⁇ gh conducting leads 246 247.
• the electronic driver 245 is not ret ⁇ iired in the embodiment., Ln this sense, the LED chips 203 a.e wired in parallel.
• sencs-vnred counterparts to that disclosed in this embodiment are readily apparent to those skilled in the art and are considered within the scope of the p ⁇ et>em invention.
• an epoxy cap 208 is used to cover the frame 224, first and second w ires 210. 214, 1 ED chips 2 ( H and phosphor Ia) er 250. among other components of the lighting device
• the cap 208 sets as an optical lens and also as a protection layei fot the v arious identified components
• a heal conduct ton pipe 205 extends substantially along a central axis of the lighting device 200 and includes a proximal end 220 and a distal end 222.
• the frame 224 is secured to the proximal end 220 of the heal conduction pipe 205 m a mannei similar to that described ⁇ ith the previous embodiments.
• the dista! end 222 of the heat conduction pipe 205 extends into a heat sink 208 that is constructed and positioned similai to that described above with the sous embodiments.
• An ⁇ HD lighting ice 300 has a pluiality of panels 302 and I. FDs 303 mounted to the panels 302 and advantageously arranged about a central axis tor space lighting. illumination from the lighting device 300 is pi ⁇ uded b ⁇ the of LLDs 303 ⁇ glass oi plastic bulb 306 encases die 1 FDs and.
• th components tlui mc ⁇ iporate the assembled lighting M)O 1 lie panels *02, m one embodiment aie mounted to a multi-faceted frame 324 which can be constructed as described with respect to the embodiments iefetied to e More particularly the shape of the frame 324 m tins embodiment appioxnnates a spheie such that ⁇ earns pointing outwaidh noimal fiom each face sweep ju b ⁇ tb longitudinal aud latitudinal duections with iespeci to the sphere appto ⁇ imated bv the hame, thetebv pioduci ⁇ g a highei degree of om ⁇ i-di ⁇ ⁇ ctional special lighting i e .
• a heat conduction pipe 30*5 extends suhstantialh along a eential article of the hahling and includes a pioximai end 320 and a distal end 322 1 he fiame 324 is secured to the pioximal end 320 of the heat conduction pipe WS in a manner similar to that desenbed isc the distal end 322 of the heat conduction pipe 3OS extends into a heat sink ⁇ 08 that is constructed and positioned similar to that described he ⁇ ai ious embodiments of the heal conducting pipe and heat sink discussed alxne including the means of cooling the same applv equally to the embodiments described abo ⁇ c
• Furthet ⁇ is noted thai the ui ⁇ us embod ⁇ nents concerning the use of sutface mourned LhDs aid I ED chips including the mannei of wmng in series os patallel the optional use of phosphors, ot co ⁇ crm ⁇ and She optional use of a coohng fan
• An Li U lighting ice 400 includes a iirst heat ssnk m the him of a disk-shaped frame 424 aad a plurality of LEDs 403 mounted to the frame 424 and adxaritageously arranged about the tiame tbi directional space lighting Illumination from the lighting jded by the phualitv of LbDs 403
• the LED.s 403 tire vuied m se ⁇ cs* using connecting wires 404 4 pan of electrical conducting wxics 440, 442 suppH powei to the seues-wired LIxDs 403 from a stamlaid threaded base poition 41 1 of the lighting electioaic the base 411 provides pow ej to the LfcDs 1 he frame 424 can be constructed as described with iespect to the
• a heat conduction pipe 405 extends substantially along a centra! axis of the lighting device 400 and includes a proximal end 420 and a distal end 422.
• the frame 424 is secured to the proximal end 420 of the heat conduction pipe 405 in a manner similar to that described above with the pre ⁇ ious embodiments
• the distal end 422 of the heat conduction pipe 405 extends into a heat sink 408 that is constmcted and positioned similai to ihat described above w ith the previous embodiments
• the embodiments of the heat conducting pipe and heat sink discussed above, including the means of cooling the same, apply equally to the embodiments described above.
• the LED ices or !.,ED chips used t ⁇ constiuct the lighting devices described above may emit single or multiple colors or ⁇ Kite color
• the bulbs or encapsulating cos cr can also be frosted o ⁇ clear oi coated with phosphor to com erf the light ftorn LLD to different colon as required. While certain embodiments and details base been included herein and m the attached im cntion disclosure for purposes of illustrating the invention, it will be appaiem to those skilled in the art that various changes in the methods and appatatuses disclosed herein may be made without departing ftorn the scope of the i ⁇ xention. which is defined in the appended claims

Priority Applications (3)

Applications Claiming Priority (2)

Publications (1)

Family

ID=42559270

Family Applications (1)

Country Status (6)

Cited By (8)

Families Citing this family (193)

Citations (16)

Family Cites Families (92)

• 2010
  • 2010-02-17 EP EP10744264.2A patent/EP2399070B1/de active Active
  • 2010-02-17 JP JP2011550324A patent/JP2012518254A/ja active Pending
  • 2010-02-17 WO PCT/US2010/024489 patent/WO2010096498A1/en active Application Filing
  • 2010-02-17 EP EP17186663.5A patent/EP3273161A1/de active Pending
  • 2010-02-17 CN CN2010800061679A patent/CN102301181A/zh active Pending
  • 2010-02-17 US US12/706,869 patent/US8653723B2/en active Active
  • 2010-02-17 KR KR1020117016828A patent/KR20110117090A/ko active Search and Examination

Patent Citations (16)

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events