WO2010092964A1 - Procédé de découpage de substrat à matériau cassant - Google Patents

Procédé de découpage de substrat à matériau cassant Download PDF

Info

Publication number
WO2010092964A1
WO2010092964A1 PCT/JP2010/051918 JP2010051918W WO2010092964A1 WO 2010092964 A1 WO2010092964 A1 WO 2010092964A1 JP 2010051918 W JP2010051918 W JP 2010051918W WO 2010092964 A1 WO2010092964 A1 WO 2010092964A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
laser beam
scribe line
brittle material
cleaving
Prior art date
Application number
PCT/JP2010/051918
Other languages
English (en)
Japanese (ja)
Inventor
久美子 野橋
山本　幸司
則文 在間
透 熊谷
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Publication of WO2010092964A1 publication Critical patent/WO2010092964A1/fr

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • the present invention relates to a method of irradiating a brittle material substrate with a laser beam and cleaving the brittle material substrate along two directions intersecting each other.
  • a scribe line is formed by pressing and rolling a cutter wheel or the like, and then the substrate is cleaved by applying external force from the direction perpendicular to the substrate along the scribe line.
  • the method is widely practiced.
  • the substrate is likely to be defective due to mechanical stress imparted to the brittle material substrate by the cutter wheel, and is caused by the above-described defect when performing a break. Cracks occur.
  • Patent Document 1 a method of cleaving a brittle material substrate in two directions intersecting each other using a laser has been proposed (for example, Patent Document 1).
  • a brittle substrate is irradiated with a laser beam to form a first crack in a half cut state, and then a second crack in a full cut state that intersects the first crack is also formed by laser beam irradiation.
  • the half-cut portion of the first crack is again irradiated with a laser beam to perform a full cut.
  • the intersection of the first crack and the second crack may be chipped. is there. If a break occurs at the intersection of the brittle substrate that becomes the corner after the cleaving, the dimensional accuracy of the brittle substrate after the cleaving is lowered, and the generated cullet adheres to the surface of the substrate and causes a problem.
  • the present invention has been made in view of such a conventional problem, and an object of the present invention is to suppress the occurrence of chipping at an intersection when a brittle material substrate is cleaved in two directions intersecting each other using a laser. It is to provide a method.
  • the brittle material substrate is irradiated while moving the laser beam relative to the substrate, the substrate is heated to a temperature lower than the melting temperature, and then the substrate is cooled by spraying a cooling medium to the substrate.
  • a third step of irradiating again and extending the vertical crack to cleave the substrate with a first scribe line wherein the third step
  • the maximum width (hereinafter sometimes referred to as “irradiation width”) of the irradiation spot of the laser beam irradiated to the first scribe line in the direction perpendicular to the relative movement direction is 1.0 mm or less.
  • the laser beam is irradiated while moving relative to the substrate in a direction crossing the first scribe line, and then the substrate is cooled by spraying a cooling medium to cool the vertical crack. Then, it is preferable to irradiate the laser beam again to extend the vertical crack to cleave the substrate.
  • the depth of the vertical crack of the first scribe line should be 25% or more of the thickness of the brittle material substrate. preferable.
  • the input energy Q calculated from the following formula (1) is 0.085 J / mm or less.
  • Q P / S ⁇ L / V ⁇ W (1)
  • Q Input energy (J / mm)
  • P Laser output (J / s)
  • S Laser spot area (mm 2 )
  • L Irradiation length (mm)
  • V Relative moving speed (mm / s)
  • W Irradiation width (mm)
  • the method for cleaving a brittle material substrate according to the present invention when the brittle material substrate is cleaved in two directions intersecting each other, it is possible to suppress the occurrence of chipping at the intersection. Thereby, the dimensional accuracy of the brittle material substrate after cleaving is improved, and defects caused by cullet are significantly suppressed.
  • the tolerance of the laser beam irradiation conditions for breaking the brittle material substrate is widened.
  • FIG. 1 is a schematic diagram showing an example of a cleaving apparatus used for carrying out the cleaving method according to the present invention.
  • the cleaving apparatus in this figure includes a slide table 12 that is movable on the gantry 11 in a direction perpendicular to the paper surface (Y direction), a pedestal 19 that is movable on the slide table in the left and right direction (X direction), and The brittle material substrate 50 provided with a rotating mechanism 25 provided on the pedestal 19 and placed and fixed on the rotating table 26 provided on the rotating mechanism 25 is freely moved in the horizontal plane by these moving means.
  • the brittle material substrate 50 provided with a rotating mechanism 25 provided on the pedestal 19 and placed and fixed on the rotating table 26 provided on the rotating mechanism 25 is freely moved in the horizontal plane by these moving means.
  • the slide table 12 is movably mounted on a pair of guide rails 14 and 15 arranged in parallel with a predetermined distance on the upper surface of the gantry 11. Between the pair of guide rails 14 and 15, a ball screw 13 is provided in parallel with the guide rails 14 and 15 so as to be rotatable forward and backward by a motor (not shown). A ball nut 16 is provided on the bottom surface of the slide table 12. The ball nut 16 is screwed into the ball screw 13. When the ball screw 13 rotates forward or backward, the ball nut 16 moves in the Y direction, whereby the slide table 12 to which the ball nut 16 is attached moves on the guide rails 14 and 15 in the Y direction.
  • the pedestal 19 is movably supported by a pair of guide members 21 arranged in parallel at a predetermined distance on the slide table 12. Between the pair of guide members 21, a ball screw 22 is provided in parallel with the guide member 21 so as to be rotatable forward and backward by a motor 23. A ball nut 24 is provided on the bottom surface of the pedestal 19 and is screwed into the ball screw 22. When the ball screw 22 rotates forward or backward, the ball nut 24 moves in the X direction, whereby the pedestal 19 together with the ball nut 24 moves in the X direction along the pair of guide members 21.
  • a rotation mechanism 25 is provided on the pedestal 19.
  • a rotating table 26 is provided on the rotating mechanism 25.
  • the brittle material substrate 50 to be cleaved is fixed on the rotary table 26 by vacuum suction.
  • the rotation mechanism 25 rotates the rotary table 26 around the central axis in the vertical direction.
  • a support base 31 is supported above the rotary table 26 by a holding member 33 depending from the mounting base 32 so as to face the rotary table 26 at a distance.
  • the support base 31 includes a cutter wheel 35 for forming a trigger crack on the surface of the brittle material substrate 50, an opening (not shown) for irradiating the brittle material substrate 50 with a laser beam, and the surface of the brittle material substrate 50. And a cooling nozzle 37 for cooling.
  • the cutter wheel 35 is held by the chip holder 36 so as to be movable up and down between a position in pressure contact with the brittle material substrate 50 and a non-contact position, and the brittle material is formed only when forming a trigger crack as a starting point of the scribe line. It descends to a position where it presses against the substrate 50.
  • the trigger crack is preferably formed on the inner side of the front edge of the brittle material substrate 50 in order to suppress a preceding phenomenon in which the crack is generated in an unpredictable direction from the trigger crack.
  • a laser output device 34 is provided on the mounting base 32.
  • the laser beam LB emitted from the laser output device 34 is reflected downward by the reflection mirror 44, and is formed on the rotary table 26 from the opening formed in the support base 31 through the optical system held in the holding member 33.
  • the fixed brittle material substrate 50 is irradiated.
  • water as a cooling medium is jetted together with air from the cooling nozzle 37 provided in the vicinity of the opening of the support base 31 from which the laser beam LB is emitted toward the brittle material substrate 50.
  • the position on the brittle material substrate 50 from which the cooling medium is ejected is on the planned cutting line 51 and behind the irradiation region of the laser beam LB (see FIG. 2).
  • the mounting base 32 is provided with a pair of CCD cameras 38 and 39 for recognizing alignment marks engraved in advance on the brittle material substrate 50. These CCD cameras 38 and 39 detect misalignment when the brittle material substrate 50 is set. For example, if the brittle material substrate 50 is deviated by an angle ⁇ , the rotary table 26 is rotated by ⁇ . When is shifted by Y, the slide table 12 is moved by -Y.
  • the brittle material substrate 50 is cleaved in the cleaving apparatus having such a configuration, first, the brittle material substrate 50 is placed on the rotary table 26 and fixed by suction means. Then, the CCD cameras 38 and 39 capture an image of the alignment mark provided on the brittle material substrate 50, and position the brittle material substrate 50 at a predetermined position based on the imaging data as described above.
  • a trigger crack is formed in the brittle material substrate 50 by the cutter wheel 35.
  • a laser beam LB is emitted from the laser output device 34.
  • the laser beam LB is irradiated by the reflecting mirror 44 substantially perpendicularly to the surface of the brittle material substrate 50 as shown in FIG.
  • water as a cooling medium is ejected from the cooling nozzle 37 in the vicinity of the rear end of the laser beam irradiation region.
  • the brittle material substrate 50 By irradiating the brittle material substrate 50 with the laser beam LB, the brittle material substrate 50 is heated below the melting temperature in the thickness direction, and the brittle material substrate 50 tries to thermally expand, but cannot expand due to local heating, and the irradiation point Compressive stress is generated around the center. Immediately after the heating, the surface of the brittle material substrate 50 is cooled by water, so that the brittle material substrate 50 is contracted and tensile stress is generated. Due to the action of the tensile stress, the vertical crack 53 is formed in the brittle material substrate 50 along the planned cutting line 51 with the trigger crack as a starting point.
  • the brittle material substrate 50 is moved by the slide table 12, the pedestal 19, and the rotating mechanism 25 of the rotating table 26 while the laser beam LB and the cooling nozzle 37 are fixed at predetermined positions.
  • the laser beam LB and the cooling nozzle 37 may be moved while the brittle material substrate 50 is fixed.
  • both the brittle material substrate 50 and the laser beam LB / cooling nozzle 37 may be moved.
  • FIG. 3 is a process diagram showing an example of the cleaving method of the present invention.
  • the laser beam LB and the cooling nozzle 37 are relatively moved according to the planned cutting line 51a, so that a trigger crack (not shown) is started.
  • the first scribe line 52a is formed on the brittle material substrate 50 by extending the vertical crack 53a in the relative movement direction.
  • the laser beam LB used here is not particularly limited, and may be determined appropriately from the material and thickness of the substrate, the depth of the vertical crack to be formed, and the like.
  • a laser beam having a wavelength of 9 to 11 ⁇ m having a large absorption on the glass substrate surface is preferably used.
  • An example of such a laser beam is a CO 2 laser.
  • the irradiation shape of the laser beam on the substrate is preferably an elliptical shape that is elongated in the relative movement direction of the laser beam, the irradiation length L in the relative movement direction is preferably in the range of 10 to 60 mm, and the irradiation width W is preferably in the range of 1 to 5 mm. It is.
  • the cooling medium ejected from the cooling nozzle 37 includes water and alcohol. Further, an additive such as a surfactant may be added within a range that does not adversely affect the use of the brittle material substrate after cleaving.
  • the amount of cooling medium sprayed is usually in the range of 1 to 2 ml / min.
  • the cooling of the substrate by the cooling medium is preferably a so-called water jet method in which water is injected together with gas (usually air) from the viewpoint of rapidly cooling the substrate heated by the laser beam.
  • the cooling region with the cooling medium is preferably circular or elliptical with a major axis of about 1 to 5 mm.
  • the cooling region is preferably formed so that the distance between the center points of the cooling region and the heating region is about 5 to 20 mm behind the heating region by the laser beam in the relative movement direction.
  • the relative moving speeds of the laser beam LB and the cooling nozzle 37 are not particularly limited, and may be appropriately determined from the depth of the vertical crack to be obtained. In general, the slower the relative movement speed, the deeper the vertical cracks that are formed. Usually, the relative movement speed is about several hundred mm / sec.
  • the depth of the vertical crack 53a that constitutes the scribe line 52a is not particularly limited, but the laser beam irradiation condition for cleaving the brittle material substrate in the subsequent process, for example, tolerance of relative movement speed, laser output, etc. In order to increase the thickness, it is desirable that the depth is 25% or more with respect to the substrate thickness. This will be described in detail in a later embodiment.
  • the second scribe line 52b is formed by relatively moving the laser beam LB and the cooling nozzle 37 along the planned cutting line 51b orthogonal to the first scribe line 52a.
  • the conditions for forming the second scribe line 52b are the same as the conditions for forming the first scribe line 52a.
  • the laser beam LB is irradiated again along the second scribe line 52b.
  • the vertical crack 53b extends in the substrate thickness direction, and the substrate 50 is cleaved by the second scribe line 52b.
  • the figure (b) and the figure (c) correspond to the 2nd process in this invention.
  • the vertical crack 53b only needs to extend to a depth at which the substrate 50 is cleaved without applying external force, and does not necessarily have to reach the opposite surface side of the substrate 50.
  • Irradiation conditions of the laser beam LB for extending the vertical crack 53b in the substrate thickness direction may be determined as appropriate from the thickness of the substrate 50, the depth of the vertical crack 53b, and the like. Usually, the second scribe line 52b described above is used. The irradiation conditions when forming are also exemplified here.
  • the laser beam LB is irradiated again along the first scribe line 52a as shown in FIG.
  • the vertical crack 53a extends in the substrate thickness direction, and the substrate 50 is cleaved by the first scribe line 52a.
  • the depth of the vertical crack 53a after the extension may extend to a depth at which the substrate 50 is cleaved without applying an external force. It is not necessary to reach the opposite side of the.
  • the irradiation width W of the irradiation spot of the laser beam LB irradiated to the first scribe line 52a is set to 1.0 mm or less, as shown in FIG.
  • a more preferable irradiation width W is 0.9 mm or less.
  • FIG. 5 shows another embodiment of the cleaving method according to the present invention.
  • the laser beam LB and the cooling nozzle 37 are moved relatively according to the cleaving line 51a, as shown in FIG.
  • the first scribe line 52a is formed on the substrate 50.
  • the laser beam LB and the cooling nozzle 37 are relatively moved along the planned cutting line 51b orthogonal to the first scribe line 52a.
  • the laser beam LB and the cooling nozzle 37 are relatively moved along the planned cutting line 51b to form the first scribe line 52a composed of the vertical cracks 53a, and then the second scribe line.
  • the substrate 50 is cleaved by irradiating the laser beam LB again to the laser beam LB, in the cleaving method of this embodiment, the laser beam LB and the cooling nozzle 37 are moved relative to each other once according to the cleaved scheduled line 51b. Cracks 53b are formed deeply to cleave the substrate 50.
  • the relative movement speed of the laser beam LB and the cooling nozzle 37 is decreased, or the laser beam LB to be used has a short wavelength. What is necessary is just to increase the energy provision amount per unit time to a board
  • the laser beam LB is irradiated again along the first scribe line 52a as shown in FIG.
  • the vertical crack 53a extends in the substrate thickness direction, and the substrate 50 is cleaved by the first scribe line 52a.
  • the irradiation width W of the irradiation spot of the laser beam LB irradiated to the first scribe line 52a for the second time is 1.0 mm or less.
  • the depth in the substrate thickness direction of the vertical crack 53a after extension may be extended to a depth at which the substrate 50 is cleaved without applying an external force, as described above. It is not necessary to reach the surface side.
  • each of the first scribe line 52a and the second scribe line 52b is formed to cleave the substrate.
  • the first scribe line 52a and the second scribe line 52a are formed on the substrate 50 having a large area.
  • the cleaving method of the present invention can also be applied to a case where a plurality of lines 52b are formed and cleaved into a large number of small area substrates.
  • the cleaving method of the present invention can be applied to a case where the two scribe lines are crossed at a desired angle in addition to the case where the two scribe lines are orthogonal.
  • Example 1 Using the cleaving apparatus shown in FIG. 1, a plurality of scribe lines perpendicular to each other were formed on a soda glass substrate having a thickness of 0.55 mm subjected to chemical strengthening so that the number of intersections was 40. The laser beam was irradiated again along the scribe line to cleave the substrate into a plurality. The cleaving of the glass substrate was performed using the method shown in FIG. Specific conditions for laser irradiation are as follows.
  • the glass substrate was cleaved by changing the laser output and the relative movement speed, the range of conditions under which cleaving was possible was specified, and the intersection missing rate (%) was calculated under the conditions where the laser input energy was minimized.
  • the results are shown in Table 1.
  • the “input energy” corresponds to the laser energy value per 1 mm of the first scribe line when the laser beam LB is irradiated again along the first scribe line, and was calculated from the above equation (1).
  • Laser beam CO 2 laser
  • Laser output 180 W
  • Relative moving speed 1000mm / sec
  • Laser spot elliptical (irradiation length L: 38 mm, irradiation width W: 1.3 mm)
  • Laser beam CO 2 laser Laser output: 50 to 250 W Relative moving speed: 200-1500mm / sec Laser spot: elliptical (irradiation length L: 38 mm, irradiation width W: 0.9 mm)
  • Comparative Example 1 and Comparative Example 7 As laser irradiation conditions in the second scribe line, the laser spot irradiation width W is 1.1 mm and 1.3 mm, the laser output and relative movement speed are changed to cleave the glass substrate, and the range of conditions that can be cleaved is specified. The intersection missing rate (%) was calculated under the condition that the input energy was the smallest. The results are shown in Table 1. For reference, FIG. 6 shows an optical micrograph in the case where the intersection is missing.
  • the cleaving method of the present invention when a brittle material substrate is cleaved in two directions intersecting each other using a laser, the occurrence of chipping at the intersection is useful.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

Dans le cas du découpage d'un substrat à matériau cassant dans deux directions se croisant à l'aide d'un faisceau laser, une première ligne de traçage (52a) composée d'une fissure perpendiculaire (53a) et une seconde ligne de traçage (52b) composée d'une fissure perpendiculaire (53b) sont formées par le rayonnement d'un faisceau laser (LB) et le soufflage d'un agent de refroidissement depuis une buse de refroidissement (37) de manière à supprimer la génération d'ébrèchement dans la zone d'intersection. La fissure perpendiculaire (53b) est étendue par le rayonnement du faisceau laser (LB) à nouveau sur la seconde ligne de traçage (52b), et un substrat (50) est découpé au niveau de la seconde ligne de traçage (52b). Ensuite, la fissure perpendiculaire (53a) est étendue par le rayonnement du faisceau laser (LB) à nouveau sur la première ligne de traçage (52a), et le substrat (50) est découpé au niveau de la première ligne de traçage (52a). A ce moment, la largeur maximale de la largeur de rayonnement du point de rayonnement du faisceau laser (LB) rayonnant à nouveau sur la première ligne de traçage (52a) est de 1,0 mm ou moins.
PCT/JP2010/051918 2009-02-13 2010-02-10 Procédé de découpage de substrat à matériau cassant WO2010092964A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-030894 2009-02-13
JP2009030894A JP2010184457A (ja) 2009-02-13 2009-02-13 脆性材料基板の割断方法

Publications (1)

Publication Number Publication Date
WO2010092964A1 true WO2010092964A1 (fr) 2010-08-19

Family

ID=42561806

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2010/051918 WO2010092964A1 (fr) 2009-02-13 2010-02-10 Procédé de découpage de substrat à matériau cassant

Country Status (3)

Country Link
JP (1) JP2010184457A (fr)
TW (1) TW201031510A (fr)
WO (1) WO2010092964A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110121484A (zh) * 2017-03-13 2019-08-13 日本电气硝子株式会社 玻璃板的制造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5202595B2 (ja) * 2010-09-10 2013-06-05 三星ダイヤモンド工業株式会社 レーザ割断装置
JP5292420B2 (ja) * 2011-02-17 2013-09-18 三星ダイヤモンド工業株式会社 ガラス基板のスクライブ方法
KR101442067B1 (ko) * 2011-12-22 2014-09-19 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 할단 방법
DE102013016693A1 (de) * 2013-10-08 2015-04-09 Siltectra Gmbh Herstellungsverfahren für Festkörperelemente mittels Laserbehandlung und temperaturinduzierten Spannungen

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301806A (ja) * 2006-05-10 2007-11-22 Toyota Industries Corp 脆性基板の分断方法及び素子の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007301806A (ja) * 2006-05-10 2007-11-22 Toyota Industries Corp 脆性基板の分断方法及び素子の製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110121484A (zh) * 2017-03-13 2019-08-13 日本电气硝子株式会社 玻璃板的制造方法
CN110121484B (zh) * 2017-03-13 2022-04-26 日本电气硝子株式会社 玻璃板的制造方法

Also Published As

Publication number Publication date
JP2010184457A (ja) 2010-08-26
TW201031510A (en) 2010-09-01

Similar Documents

Publication Publication Date Title
JP2010150068A (ja) 脆性材料基板の割断方法
JP2011230940A (ja) 脆性材料基板の割断方法
JP5011048B2 (ja) 脆性材料基板の加工方法
JP5325209B2 (ja) 脆性材料基板の加工方法
JP5539625B2 (ja) レーザ加工方法
JP5194076B2 (ja) レーザ割断装置
JP4080484B2 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
WO2007119740A1 (fr) procédé de traçage, appareil de traçage, et substrat trusquiné selon le procédé ou appareil
CN102229466B (zh) 一种纳秒激光切割玻璃的方法及装置
WO2009128314A1 (fr) Procédé pour le traitement d'un substrat de matière fragile
JP2010090010A (ja) 脆性材料基板の割断方法及び割断装置
JP2012061681A (ja) レーザ割断装置
WO2010092964A1 (fr) Procédé de découpage de substrat à matériau cassant
JP5202595B2 (ja) レーザ割断装置
JP2010089143A (ja) 脆性材料基板の割断方法及び割断装置
JP2016128365A (ja) ガラス板の切断方法
JPWO2003008352A1 (ja) 脆性材料基板のスクライブ装置およびスクライブ方法
WO2013094059A1 (fr) Procédé de fracture d'un substrat en matériau fragile
JP5590642B2 (ja) スクライブ加工装置及びスクライブ加工方法
JP5444158B2 (ja) 脆性材料基板の割断方法
JP5554158B2 (ja) 脆性材料基板の割断方法
KR20130126287A (ko) 기판 절단 장치 및 방법
TWI461251B (zh) Method for cutting brittle material substrates
JP5678816B2 (ja) ガラス基板の割断方法および割断装置
JP2011201200A (ja) 脆性材料基板のレーザ加工方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10741241

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 10741241

Country of ref document: EP

Kind code of ref document: A1