WO2013094059A1 - Procédé de fracture d'un substrat en matériau fragile - Google Patents

Procédé de fracture d'un substrat en matériau fragile Download PDF

Info

Publication number
WO2013094059A1
WO2013094059A1 PCT/JP2011/079842 JP2011079842W WO2013094059A1 WO 2013094059 A1 WO2013094059 A1 WO 2013094059A1 JP 2011079842 W JP2011079842 W JP 2011079842W WO 2013094059 A1 WO2013094059 A1 WO 2013094059A1
Authority
WO
WIPO (PCT)
Prior art keywords
scribe line
laser beam
substrate
brittle material
cleaving
Prior art date
Application number
PCT/JP2011/079842
Other languages
English (en)
Japanese (ja)
Inventor
政二 清水
Original Assignee
三星ダイヤモンド工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三星ダイヤモンド工業株式会社 filed Critical 三星ダイヤモンド工業株式会社
Priority to KR1020127019017A priority Critical patent/KR101442067B1/ko
Priority to PCT/JP2011/079842 priority patent/WO2013094059A1/fr
Priority to CN201180005624.7A priority patent/CN103282317B/zh
Publication of WO2013094059A1 publication Critical patent/WO2013094059A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Definitions

  • intersection area for reducing the laser beam irradiation amount has a width of 5 mm or less from the intersection of the first scribe line and the second scribe line to the upstream side and the downstream side in the relative movement direction of the laser beam. preferable.
  • a laser output device 34 is provided on the mounting base 32.
  • the laser beam LB emitted from the laser output device 34 is reflected downward by the reflection mirror 44, and is formed on the rotary table 26 from the opening formed in the support base 31 through the optical system held in the holding member 33.
  • the fixed brittle material substrate 50 is irradiated.
  • the mounting base 32 is provided with a pair of CCD cameras 38 and 39 for recognizing alignment marks engraved in advance on the brittle material substrate 50. These CCD cameras 38 and 39 detect misalignment when the brittle material substrate 50 is set. For example, when the brittle material substrate 50 is deviated by an angle ⁇ , the rotary table 26 is rotated by ⁇ , and the brittle material substrate 50 is detected. When is shifted by Y, the slide table 12 is moved by -Y.
  • the brittle material substrate 50 is cleaved in the cleaving apparatus having such a configuration, first, the brittle material substrate 50 is placed on the rotary table 26 and fixed by suction means. Then, the CCD camera 38, 39 images the alignment mark provided on the brittle material substrate 50, and positions the brittle material substrate 50 at a predetermined position based on the imaging data as described above.
  • the brittle material substrate 50 By irradiating the brittle material substrate 50 with the laser beam LB, the brittle material substrate 50 is heated below the melting temperature in the thickness direction, and the brittle material substrate 50 tries to thermally expand, but cannot expand due to local heating, and the irradiation point Compressive stress is generated around the center. Immediately after the heating, the surface of the brittle material substrate 50 is cooled by water, so that the brittle material substrate 50 is contracted and tensile stress is generated. Due to the action of the tensile stress, the vertical crack 53 is formed in the brittle material substrate 50 along the planned cutting line 51 with the trigger crack as a starting point.
  • the laser beam LB is irradiated again along the first scribe line 52a.
  • the vertical crack 53a extends in the substrate thickness direction, and the substrate 50 is cleaved by the first scribe line 52a.
  • the depth of the vertical crack 53a after the extension may extend to a depth at which the substrate 50 is cleaved without applying an external force. It is not necessary to reach the opposite side of the.
  • the irradiation amount of the laser beam LB at this time is shown in FIG. As understood from FIG. 4B, the laser beam irradiation amount gradually decreases from the normal irradiation amount toward the intersection of the first scribe line 52a and the second scribe line 52b, and becomes zero at the intersection. After that, it gradually increases and returns to the normal dose. In this way, by reducing the irradiation amount of the laser beam LB to the intersection area between the first scribe line 52a and the second scribe line 52b, occurrence of chipping at the intersection portion is suppressed.
  • Laser type CO 2 laser Laser output: 100W Relative moving speed: 100mm / sec Laser spot: elliptical
  • Laser break laser beam irradiation conditions Laser type: CO 2 laser Laser output: 320W Relative moving speed: 1500mm / sec Laser spot: elliptical
  • Example 1 had good cleaving at all of the 40 intersections, whereas the cleaving method of Comparative Example 1 cleaved only 3 intersections. Good and chipped at the remaining 37 intersections.
  • Laser type CO 2 laser Laser output: 130W Relative movement speed: 180mm / sec Laser spot: elliptical

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)

Abstract

Dans la présente invention, une première ligne de découpe (52a) comprenant une fissure perpendiculaire (53a) et une seconde ligne de découpe (52b) comprenant une fissure perpendiculaire (53b) sont formées par irradiation d'un faisceau laser (LB) et pulvérisation d'un milieu de refroidissement à partir d'une buse de refroidissement (37). La seconde ligne de découpe (52b) est de nouveau irradiée avec le faisceau laser (LB) pour étendre la fissure perpendiculaire (53b), et un substrat (50) est fracturé sur la seconde ligne de découpe (52b). Ensuite, la région du point d'intersection entre une ligne de fracture (54) et la première ligne de découpe (52a) est recouverte d'une plaque en verre (61) et de gouttelettes d'eau (62). Puis la première ligne de découpe (52a), exception faite de la région d'intersection, est de nouveau irradiée avec le faisceau laser (LB) pour étendre la fissure perpendiculaire (53a), et le substrat (50) est fracturé sur la première ligne de découpe (52a). L'occurrence de brisure en éclats au point d'intersection dans le cas où un substrat en un matériau fragile est fracturé à l'aide d'un laser dans deux directions qui se coupent est ainsi supprimée.
PCT/JP2011/079842 2011-12-22 2011-12-22 Procédé de fracture d'un substrat en matériau fragile WO2013094059A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020127019017A KR101442067B1 (ko) 2011-12-22 2011-12-22 취성 재료 기판의 할단 방법
PCT/JP2011/079842 WO2013094059A1 (fr) 2011-12-22 2011-12-22 Procédé de fracture d'un substrat en matériau fragile
CN201180005624.7A CN103282317B (zh) 2011-12-22 2011-12-22 脆性材料基板的割断方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/079842 WO2013094059A1 (fr) 2011-12-22 2011-12-22 Procédé de fracture d'un substrat en matériau fragile

Publications (1)

Publication Number Publication Date
WO2013094059A1 true WO2013094059A1 (fr) 2013-06-27

Family

ID=48667984

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/079842 WO2013094059A1 (fr) 2011-12-22 2011-12-22 Procédé de fracture d'un substrat en matériau fragile

Country Status (3)

Country Link
KR (1) KR101442067B1 (fr)
CN (1) CN103282317B (fr)
WO (1) WO2013094059A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6387695B2 (ja) * 2014-06-13 2018-09-12 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク装置
CN105436712B (zh) * 2015-12-07 2017-12-12 武汉铱科赛科技有限公司 一种脆性半导体材料的脆性裂片方法及系统
CN109080005B (zh) * 2018-08-20 2020-10-02 衡阳恒裕轻质保温材料有限责任公司 一种加气混凝土砌块的高精度切割装置
CN109873050B (zh) * 2019-02-22 2024-08-02 上海祖强能源有限公司 太阳能电池制备方法及系统
JP7028820B6 (ja) * 2019-03-18 2023-12-19 ファナック株式会社 ワークを切断するレーザ加工方法
CN110465755A (zh) * 2019-07-10 2019-11-19 阜宁苏民绿色能源科技有限公司 一种改善mark点隐裂的方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058281A (ja) * 1999-06-18 2001-03-06 Mitsuboshi Diamond Industrial Co Ltd レーザーを用いたスクライブ法
JP2009090598A (ja) * 2007-10-11 2009-04-30 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の曲線状クラック形成方法および脆性材料基板

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100626983B1 (ko) * 1999-06-18 2006-09-22 미쓰보시 다이야몬도 고교 가부시키가이샤 레이저를 이용한 스크라이브 방법
JP4256724B2 (ja) * 2003-06-05 2009-04-22 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法及びその装置
US7723212B2 (en) * 2004-07-30 2010-05-25 Mitsuboshi Diamond Industrial Co., Ltd Method for forming median crack in substrate and apparatus for forming median crack in substrate
US20100247836A1 (en) * 2007-11-07 2010-09-30 Claus Peter Kluge Method for the laser ablation of brittle components
KR101139306B1 (ko) * 2007-12-27 2012-04-26 미쓰보시 다이야몬도 고교 가부시키가이샤 취성 재료 기판의 크랙 형성 방법
JP2010184457A (ja) * 2009-02-13 2010-08-26 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法
JP2011230940A (ja) * 2010-04-26 2011-11-17 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の割断方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001058281A (ja) * 1999-06-18 2001-03-06 Mitsuboshi Diamond Industrial Co Ltd レーザーを用いたスクライブ法
JP2009090598A (ja) * 2007-10-11 2009-04-30 Mitsuboshi Diamond Industrial Co Ltd 脆性材料基板の曲線状クラック形成方法および脆性材料基板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI681241B (zh) * 2018-12-04 2020-01-01 友達光電股份有限公司 顯示裝置製作方法及使用該方法製作的顯示裝置

Also Published As

Publication number Publication date
KR101442067B1 (ko) 2014-09-19
CN103282317B (zh) 2015-12-16
CN103282317A (zh) 2013-09-04
KR20130094173A (ko) 2013-08-23

Similar Documents

Publication Publication Date Title
WO2013094059A1 (fr) Procédé de fracture d'un substrat en matériau fragile
JP4156513B2 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
TWI406828B (zh) Method for processing brittle material substrates
KR101094284B1 (ko) 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP2011230940A (ja) 脆性材料基板の割断方法
TWI394628B (zh) The splitting device and segmentation method of brittle material substrate
JP2010150068A (ja) 脆性材料基板の割断方法
JP2010090010A (ja) 脆性材料基板の割断方法及び割断装置
JP4080484B2 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
JP4133812B2 (ja) 脆性材料基板のスクライブ装置およびスクライブ方法
JP5202595B2 (ja) レーザ割断装置
JP2005212364A (ja) 脆性材料の割断加工システム及びその方法
JP2010089143A (ja) 脆性材料基板の割断方法及び割断装置
WO2010092964A1 (fr) Procédé de découpage de substrat à matériau cassant
KR20100107253A (ko) 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP2010138046A (ja) 被割断材の加工方法および加工装置
KR20050005525A (ko) 취성재료 기판의 스크라이브 장치 및 스크라이브 방법
JP5590642B2 (ja) スクライブ加工装置及びスクライブ加工方法
JP5554158B2 (ja) 脆性材料基板の割断方法
JPWO2003013816A1 (ja) 脆性材料基板のスクライブ方法およびスクライブ装置
JP5444158B2 (ja) 脆性材料基板の割断方法
KR20130126287A (ko) 기판 절단 장치 및 방법
TWI461251B (zh) Method for cutting brittle material substrates
TW201321322A (zh) 刻劃裝置
JP2010253752A (ja) 脆性材料の割断装置および脆性材料の割断方法

Legal Events

Date Code Title Description
ENP Entry into the national phase

Ref document number: 20127019017

Country of ref document: KR

Kind code of ref document: A

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11877808

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS (EPO FORM 1205A DATED 29-09-2014)

NENP Non-entry into the national phase

Ref country code: JP

122 Ep: pct application non-entry in european phase

Ref document number: 11877808

Country of ref document: EP

Kind code of ref document: A1