WO2010082715A1 - Connecteur électrique et prise de vérification comprenant ledit connecteur électrique - Google Patents

Connecteur électrique et prise de vérification comprenant ledit connecteur électrique Download PDF

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Publication number
WO2010082715A1
WO2010082715A1 PCT/KR2009/003413 KR2009003413W WO2010082715A1 WO 2010082715 A1 WO2010082715 A1 WO 2010082715A1 KR 2009003413 W KR2009003413 W KR 2009003413W WO 2010082715 A1 WO2010082715 A1 WO 2010082715A1
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WO
WIPO (PCT)
Prior art keywords
conductive
semiconductor device
elastic material
elastic
terminal
Prior art date
Application number
PCT/KR2009/003413
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English (en)
Korean (ko)
Inventor
이재학
Original Assignee
(주)아이에스시테크놀러지
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Filing date
Publication date
Application filed by (주)아이에스시테크놀러지 filed Critical (주)아이에스시테크놀러지
Publication of WO2010082715A1 publication Critical patent/WO2010082715A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs

Definitions

  • the present invention relates to an electrical connector, and more particularly, to a semiconductor device.
  • the present invention relates to an electrical connector, and more specifically, to a conductive part contacting a terminal of a semiconductor device, a plurality of conductive particles are formed in an elastic material of high hardness. It relates to the electrical connection included and a test socket including the electrical connection.
  • Semiconductor devices manufactured through a complex process are inspected for characteristics and defective states through various electrical tests. Specifically, in the electrical inspection of semiconductor devices such as semiconductor integrated circuit devices such as package ICs and MCMs, and wafers on which integrated circuits are formed, electrically connecting terminals formed on one side of the semiconductor device to be inspected and pads of the test apparatus to each other. For this purpose, a test socket is arranged between the semiconductor device and the test apparatus.
  • the test socket according to the related art is mounted on a test apparatus, and includes a sheet 110 to which a conductive pad 130 is attached, and an elastic sheet disposed below the sheet 110. 120).
  • the through hole 111 is formed at a position corresponding to the terminal 141 of the semiconductor device 140.
  • the conductive pad 130 is inserted into the through hole 111 of the sheet 110, the conductive pad 130 is supported by the sheet 110.
  • the conductive pads 130 are plated with nickel and gold on copper foil.
  • the elastic sheet 120 includes a plurality of conductive parts 121 disposed in a plane direction at positions corresponding to the terminals 141 of the semiconductor device 140, and an insulating support part for insulating and supporting each conductive part 121. Consisting of 122.
  • the conductive portion 121 has a form in which a plurality of conductive particles 121a are contained in an elastic material 121b such as silicone rubber.
  • the insulating support 122 is made of an elastic material such as silicone rubber.
  • the semiconductor device which is the inspection object
  • the test socket is mounted on the test apparatus so that the terminals of the semiconductor device contact the test socket.
  • each terminal is in contact with the conductive pad to push the conductive pad to the lower side, and thus the conductive pad presses the conductive portion of the elastic sheet to contact the conductive particles spaced apart from each other by the elastic material in the conductive portion. .
  • an electrically connectable state is formed.
  • test signal when the test signal is applied from the test apparatus, the test signal flows to the terminal of the semiconductor device through the conductive portion and the conductive pad of the elastic sheet, and the signal returned from the semiconductor device is returned to the test apparatus through the conductive pad and the conductive portion. Inflow is performed to perform a predetermined inspection.
  • test socket according to the prior art has the following problems.
  • the height of the conductive pads be increased as a whole to facilitate the electrical connection between the terminals of the semiconductor device and the test socket. If the terminal of the semiconductor device is formed in an intaglio form in addition to the embossed form, when the height of the conductive pad protrudes upward, the conductive pad can easily contact the terminal of the semiconductor device. .
  • the overall strength may be weakened. That is, silver or gold, which is used as a material for plating, has excellent electrical conductivity, but if its strength is low, plating too thick may not endure repeated tests and may cause the copper foil to fall off or break.
  • the conductive pad has a flat top surface, so that contact with the terminals of the semiconductor device is not ensured. That is, the conductive pad having a flat surface and the terminal of the semiconductor device may be contacted by a single contact where only one point of the surface is in contact when the terminal of the semiconductor device is not completely flat. In this case, there is a problem in that a reliable electrical connection is difficult when contacting with a single contact.
  • the terminals of the semiconductor device are generally composed of solder, there is a height deviation of each terminal. At this time, if the heights of all terminals are maintained within a certain range, there is no problem. However, when the thickness of each terminal is made different due to manufacturing tolerances, and the height deviation is severe, some terminals of the semiconductor device are in contact with the conductive pads. There is a fear that a problem may occur in the reliability of the inspection. In addition, it is not preferable to increase the precision of the terminal because it requires relatively expensive equipment and increases the cost in manufacturing. In particular, this problem can easily occur when the conductive pad is coupled to the seat as shown in FIG.
  • FIG. 2 is a view showing the operation of the test socket of FIG.
  • FIG. 3 is an enlarged view of the main part of FIG. 2;
  • FIG. 4 is a view showing a test socket including an electrical connection according to an embodiment of the present invention.
  • FIG. 5 is an enlarged view of the main part of FIG. 4;
  • FIG. 6 is an illustration of the main portion of a test socket including an electrical contact in accordance with another embodiment of the present invention.
  • FIG. 7 is an operational view of FIG.
  • FIG. 8 is an illustration of the main portion of a test socket including electrical connections according to another embodiment of the present invention.
  • FIG. 9 is an illustration of the main portion of a test socket including electrical connections according to another embodiment of the present invention.
  • FIG. 10 is an illustration of an essential part of a test socket including electrical connections according to another embodiment of the present invention.
  • FIG. 11 is an illustration of an essential part of a test socket including electrical connections according to another embodiment of the present invention.
  • FIG. 12 is a view of a test socket according to another embodiment of the present invention.
  • the present invention has been made to solve the above problems, and it is easy to make an electrical connection with a semiconductor device, does not need to increase the contact pressure unnecessarily during a test, and even when the heights of terminals of the semiconductor device are different from each other. It is an object of the present invention to provide an electrical connection that enables stable electrical connection.
  • An electrical connector for achieving the above object, comprising: a plurality of conductive parts disposed at positions connectable with terminals of the semiconductor device, the electrical connectors being electrically connected to terminals of the semiconductor device; And a support member coupled to each of the plurality of conductive parts to support the conductive parts.
  • the conductive portion includes a conductive elastic region in which a plurality of conductive particles are contained in the high hardness elastic material, and the elastic material has a Shore A hardness of 60 or more or a Shore D hardness of 30 or more.
  • the conductive portion is formed of the conductive elastic region, the upper surface of which is in contact with the terminal of the semiconductor device, and the lower portion of the upper portion and electrically connected to the upper portion of the metal material It is preferable that the lower portion is formed of a conductive pad.
  • the support member is preferably made of a porous insulating mesh.
  • the conductive elastic region is preferably connected to the support member through the vertically penetrating support member.
  • the support member is preferably made of a sheet of synthetic resin material.
  • the support member is formed with a through hole penetrating in a vertical direction at a position corresponding to the terminal of the semiconductor device, wherein the conductive portion is inserted into the through hole and fixedly coupled to the support member. desirable.
  • the conductive elastic region is inserted into the through hole in the conductive portion.
  • the conductive pad is inserted into the through hole in the conductive portion.
  • the elastic material is preferably made of any one of a urethane resin, epoxy resin and acrylic resin.
  • At least some of the conductive particles may protrude from the elastic material, and may be in multi-contact contact with the terminals of the semiconductor device.
  • the conductive particles are preferably any one of spherical, plate, needle and irregular.
  • the conductive particles are plated with gold, silver, copper, etc. having excellent conductivity on the surfaces of the metal particles, the polymer particles, and the ceramic particles.
  • An electrical connector for achieving the above object, comprising: a plurality of conductive parts disposed at positions connectable with terminals of the semiconductor device, the electrical connectors being electrically connected to terminals of the semiconductor device; And a support member coupled to each of the plurality of conductive portions to support the conductive portion, wherein the conductive portion includes a conductive elastic region including a plurality of conductive particles in an elastic material having high hardness. In the conductive elastic region, the conductive particles preferably protrude from the elastic material and are connected to the terminals of the semiconductor device.
  • the conductive elastic region is preferably at its upper surface connectable with the terminals of the semiconductor device, and the elastic material has a Shore A hardness of 60 or a Shore D hardness of 30 or more.
  • the test socket of the present invention for achieving the above object is a test socket including the above-described electrical connection body, is disposed below the electrical connection body, in a position corresponding to the conductive portion, than the elastic material of the conductive portion It is preferable that an elastic sheet composed of a conductive part containing a plurality of conductive particles and an insulating support part for supporting and insulating the conductive part, respectively, is disposed in the elastic material having a low hardness.
  • the test socket of the present invention for achieving the above object is a test socket including the above-described electrical connector, which is disposed below the electrical connector and formed with a through hole in a vertical direction at a position corresponding to the terminal of the semiconductor device. It is preferable that a conductive elastic means is inserted into the housing and the through-hole and is compressed and extended in the vertical direction and has conductivity.
  • the elastic means is preferably a compression coil spring.
  • the semiconductor is contacted with the terminals of the semiconductor device by using a conductive part including a plurality of conductive particles in a high hardness elastic material so that the thickness is not restricted, so that the semiconductor layer is not thickened. There is an effect that can easily contact the terminal of the device.
  • the terminals of the semiconductor device come into contact with a plurality of conductive particles, the terminals have a plurality of contacts instead of a single point, thereby enabling more reliable electrical connection.
  • the terminals can contact all the terminals, thereby improving the reliability of the inspection.
  • FIG. 4 is a diagram of a test socket including an electrical connector according to an exemplary embodiment of the present invention
  • FIG. 5 is an enlarged view of a portion of FIG. 4.
  • the electrical connection body according to the present invention consists of a supporting member and a conductive portion.
  • the support member is coupled to the conductive portion to support the conductive portion.
  • the sheet 20 made of synthetic resin is preferably used.
  • the sheet 20 is good to use the excellent elasticity.
  • the sheet 20 is provided with a through hole 21 having a predetermined size at a position corresponding to the terminal 141 of the semiconductor device 140.
  • the through hole 21 preferably has a smaller diameter than the size of the terminal 141.
  • the conductive portion is disposed at a position connectable with a terminal of the semiconductor device, and includes a lower portion and an upper portion.
  • the lower portion forms a lower side of the conductive portion, and is electrically connected to the upper portion thereof, and includes a conductive pad 30 made of a metal material.
  • the conductive pad 30 forming the lower portion is inserted into the through hole 21 formed at a position corresponding to the terminal 141 of the semiconductor device 140 and supported by the through hole 21.
  • the conductive pad 30 may include a connection part 31 inserted into the through hole 21 and a contact part having a diameter larger than that of the through hole 21 and integrally formed at upper and lower ends of the connection part 31. 32).
  • the conductive pad 30 preferably has a structure in which a nickel and gold plated layer is formed on the copper foil.
  • the conductive pad 30 may be made of various metal materials in addition to the copper foil, and various metal materials having excellent conductivity may be plated in addition to the nickel and gold plated layers. Do.
  • the contact portion 32 disposed above the sheet 20 of the contact portion 32 of the conductive pad 30 has a conductive elastic region 40 to be described later disposed on the upper surface thereof.
  • the upper portion includes a conductive elastic region 40 in which a plurality of conductive particles are included in the high hardness elastic material.
  • the conductive pad 30 is formed on the upper surface of the contact portion 32 disposed above the sheet 20.
  • the conductive elastic region 40 preferably has a diameter substantially the same as the contact portion 32 of the conductive pad 30, but the size of the conductive elastic region 40 may be changed.
  • the height of the conductive elastic region 40 may be variously formed as necessary.
  • the conductive elastic region 40 is composed of an elastic material 41 and the conductive particles 42.
  • the elastic material 41 has a form in which a plurality of conductive particles 42 are contained. As the conductive particles 42 are contained in the elastic material 41 as described above, when the terminals 141 of the semiconductor device 140 press the conductive elastic regions 40, the conductive particles 42 are in contact with each other and electrically connected. When the terminal 141 is removed, the conductive particles 42 are returned to their original positions by the elastic restoring force of the elastic material 41.
  • the elastic material 41 is preferably one of a high hardness urethane resin, an epoxy resin, and an acrylic resin, but is not limited thereto, and a silicone adhesive and a ceramic adhesive having a high adhesive strength may also be used.
  • the hardness of the elastic material 41 is preferably used Shore A hardness (shore A hardness) of 60 or more or Shore D hardness of 30 or more.
  • Shore A hardness is 60 or more or the Shore D hardness is 30 or more is to prevent the conductive elastic region 40 exposed to the outside from being easily damaged during the repeated test process.
  • the conductive elastic region 40 may be adhered to the conductive pad 30 by a polymer or a ceramic adhesive having a high adhesive strength, and then mixed with the conductive particles 42 by using a solder cream in addition to the polymer and ceramics. It is also possible to use a method of heat curing.
  • the conductive particles 42 preferably have a form in which at least one of gold, silver, and copper having excellent conductivity is plated on any one surface of the metal particles, the polymer particles, and the ceramic particles.
  • various materials can be used in addition to the conductive particles 42 and the plating material thereof.
  • the above-described electrical connector may further comprise an elastic sheet to form a test socket.
  • the elastic sheet 50 is disposed on the lower side of the support member.
  • the elastic sheet 50 includes a conductive connection part 51 and an insulating support part 52.
  • the conductive connecting portion 51 is formed of a plurality of conductive particles 51a contained in the elastic material 51b and forms a shape extending in the vertical thickness direction.
  • the conductive connectors 51 are formed in the number corresponding to the terminals 141 of the semiconductor device 140, and the upper surfaces of the conductive connectors 51 contact the lower surfaces of the conductive pads 30.
  • the average particle diameter of the said conductive particle 51a is 10-150 micrometers.
  • the average particle diameter is 150 ⁇ m
  • the particles of the conductive particles 51a are too large, which is not preferable because the elastic force may be reduced. It is preferable to use the elastic material 51b having a lower hardness than the elastic material of the conductive elastic region 40 described above.
  • the insulating support portion 52 supports and insulates each of the conductive connecting portions 51, and is preferably made of silicone rubber and other synthetic resin materials having excellent elasticity and formability.
  • test socket including the electrical connection according to the preferred embodiment of the present invention has the following effects.
  • Test socket according to an embodiment of the present invention having such a configuration has the following effects.
  • the semiconductor device is lowered so that the terminals of the semiconductor device are in contact with the conductive elastic region.
  • the conductive elastic regions are pressed and the conductive particles are in contact with each other to form an electrical connection state.
  • the conductive pad and the terminals of the semiconductor device are electrically connected to each other.
  • the conductive pad is also pushed down by the terminal to press the elastic sheet, so that the conductive portion in contact with each other in the conductive portion to form an electrical connection state.
  • the terminals of the semiconductor device and the pad of the test apparatus are electrically connected as a whole.
  • the test signal may be performed by applying the test signal from the test apparatus.
  • the test apparatus including the electrical connector according to the present embodiment, since the conductive elastic region is formed on the upper side of the conductive pad, the test apparatus may protrude upward beyond the protruding height of gold plating or nickel plating. This enables stable electrical connection in any case regardless of the shape or structure of the terminal.
  • the electrically connected portions are increased as compared with the prior art. That is, in the prior art, the contact point required for electrical connection has been excessively required because of a single contact point, but in the present embodiment, since the contact point has a large number of contact points, even when a slight contact pressure is applied, the electrical contact point is satisfactory. There is an effect that can achieve a connection state.
  • the conductive elastic regions can sufficiently absorb different heights, so that all terminals can be easily electrically connected. That is, even when one terminal protrudes from the other terminal in the plurality of semiconductor devices, the conductive elastic region in contact with the protruding terminal is compressed more deeply than the other conductive elastic region, thereby enabling electrical connection in consideration of the height difference. do.
  • the conductive elastic region in contact with the protruding terminal is compressed more deeply than the other conductive elastic region, thereby enabling electrical connection in consideration of the height difference. do.
  • the conductive elastic region in contact with the protruding terminal is compressed more deeply than the other conductive elastic region, thereby enabling electrical connection in consideration of the height difference. do.
  • the conductive elastic region in contact with the protruding terminal is compressed more deeply than the other conductive elastic region, thereby enabling electrical connection in consideration of the height difference. do.
  • the conductive elastic region in contact with the protruding terminal is compressed more deeply than the other conductive elastic region, thereby enabling electrical connection in consideration of the
  • the electrical connector according to the preferred embodiment of the present invention and the test socket including the electrical connector may be modified as follows.
  • some of the conductive particles 42 may protrude from the elastic material to contact the terminals of the semiconductor device in a multi-contact manner. As such, when the conductive particles 42 protrude, the conductive particles 42 may easily contact the terminals 141 of the semiconductor device 140, thereby providing a reliable electrical connection.
  • the conductive particles 42 may have a plate shape.
  • the conductive particles 42 made of a plate shape further facilitates electrical connection in the vertical direction.
  • the plate-shaped conductive particles 42 increase the number of conductive particles 42 that can be included in the same volume, thereby enabling more reliable electrical connection.
  • the conductive particles 42 may directly contact the terminals of the semiconductor device, thereby making electrical connection easier.
  • a conductive part consists only of the conductive elastic region 50.
  • the conductive elastic region 50 is inserted into the through hole 21 to be coupled to the sheet 20 serving as the support member.
  • the elastic sheet 50 is provided below the conductive elastic region 40.
  • the conductive particles 42 may protrude from the elastic material 41.
  • the conductive particles 42 protrude in this manner, the conductive particles 42 come into direct contact with the terminals of the semiconductor device, thereby enabling reliable electrical connection.
  • porous mesh 20a instead of a sheet as a supporting member.
  • a porous mesh 20a a nonwoven fabric made of fibers of various materials may be used. For example, polyethylene fibers, polyester fibers and the like can be used. Further, the lattice-shaped hole may be formed in the thin sheet by laser drilling or etching.
  • high hardness silicon and conductive powder are filled in the upper and lower molds, and an insulating mesh is inserted therebetween to harden them.
  • the denser holes are formed as compared to the sheet 20 in which the through holes 21 described above with reference to FIGS. 4 and 5 are used, they can be used more effectively when the pitch between the conductive parts is small. Will be.
  • the embodiment shown in FIG. 4 discloses a configuration in which the elastic sheet 50 is disposed below the sheet 20, but is not limited thereto. That is, it may be considered that the form consisting of the housing 60 and the spring 62 is arranged.
  • the housing 60 is disposed below the sheet 20, and the insertion hole 61 is formed in the vertical direction at a position corresponding to the terminal of the semiconductor device 140.
  • the housing 60 is preferably made of a synthetic resin material such as engineering plastics.
  • the spring 62 is inserted into the through hole to be compressed and extended in the vertical direction.
  • the upper end of the spring 62 is in contact with the conductive pad 30 and the lower end of the spring 62 is tested. In contact with the pad 151 of the device 150.
  • the spring 62 is a compression coil spring is used, and any spring can be used as long as the elastic force is good.
  • the conductive particles may be needle-like or indefinite.
  • the contact surface of the terminal penetrates into the surface of the terminal so that a reliable contact is made.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Connecting Device With Holders (AREA)

Abstract

La présente invention concerne un connecteur électrique et une prise de vérification comprenant ledit connecteur électrique. Plus particulièrement, la présente invention concerne un connecteur électrique, qui est connecté électriquement à la borne d'un dispositif à semi-conducteurs, et qui comprend : une pluralité d'unités conductrices qui sont situées à une emplacement pouvant être connecté à la borne du dispositif à semi-conducteurs, et des éléments de support qui sont respectivement couplés aux unités conductrices et qui portent celles-ci. Les unités conductrices comprennent une région élastique conductrice qui comporte une pluralité de particules conductrices composées d'un matériau élastique à dureté élevée. La dureté Shore A du matériau élastique est de 60 ou plus ou la dureté Shore D du matériau élastique est de 30 ou plus.
PCT/KR2009/003413 2009-01-16 2009-06-24 Connecteur électrique et prise de vérification comprenant ledit connecteur électrique WO2010082715A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0003738 2009-01-16
KR1020090003738A KR101145886B1 (ko) 2009-01-16 2009-01-16 전기적 접속체 및 그 전기적 접속체를 포함한 테스트 소켓

Publications (1)

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WO2010082715A1 true WO2010082715A1 (fr) 2010-07-22

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KR (1) KR101145886B1 (fr)
WO (1) WO2010082715A1 (fr)

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KR101204940B1 (ko) * 2011-12-26 2012-11-27 주식회사 아이에스시 전기적 콘택터 및 전기적 콘택터의 제조방법
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KR101367936B1 (ko) * 2012-09-28 2014-02-28 리노공업주식회사 테스트 소켓 및 피검사체 인서트의 제조방법
KR20150079255A (ko) * 2013-12-31 2015-07-08 주식회사 아이에스시 시트형 커넥터 및 전기적 커넥터 장치
KR101532392B1 (ko) * 2014-06-18 2015-06-30 주식회사 아이에스시 검사용 소켓
KR101706331B1 (ko) * 2014-10-17 2017-02-15 주식회사 아이에스시 검사용 소켓
KR101672935B1 (ko) * 2015-07-13 2016-11-04 주식회사 아이에스시 테스트 소켓
CN107076781A (zh) * 2015-10-01 2017-08-18 株式会社Isc 测试连接器
KR102004501B1 (ko) * 2017-12-28 2019-07-26 (주)새한마이크로텍 이방 전도성 시트
KR102032652B1 (ko) * 2018-06-07 2019-10-15 주식회사 새한마이크로텍 스프링을 구비한 이방 전도성 시트
KR102046283B1 (ko) * 2019-07-29 2019-11-18 주식회사 새한마이크로텍 이방 전도성 시트
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