WO2010058782A1 - Film de connexion, corps collé et procédé de fabrication du corps collé - Google Patents

Film de connexion, corps collé et procédé de fabrication du corps collé Download PDF

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Publication number
WO2010058782A1
WO2010058782A1 PCT/JP2009/069535 JP2009069535W WO2010058782A1 WO 2010058782 A1 WO2010058782 A1 WO 2010058782A1 JP 2009069535 W JP2009069535 W JP 2009069535W WO 2010058782 A1 WO2010058782 A1 WO 2010058782A1
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WIPO (PCT)
Prior art keywords
layer
circuit member
film
curing
organic resin
Prior art date
Application number
PCT/JP2009/069535
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English (en)
Japanese (ja)
Inventor
恭志 阿久津
朋之 石松
幸一 宮内
Original Assignee
ソニーケミカル＆インフォメーションデバイス株式会社
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Application filed by ソニーケミカル＆インフォメーションデバイス株式会社 filed Critical ソニーケミカル＆インフォメーションデバイス株式会社
Priority to KR1020107018228A priority Critical patent/KR101085722B1/ko
Priority to CN2009801051493A priority patent/CN101946371B/zh
Publication of WO2010058782A1 publication Critical patent/WO2010058782A1/fr
Priority to US12/838,625 priority patent/US9023464B2/en
Priority to HK11104262.0A priority patent/HK1150322A1/xx
Priority to US13/613,560 priority patent/US8524032B2/en

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/017—Antistatic agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
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    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K9/02—Ingredients treated with inorganic substances
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    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
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    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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    • C09J2433/00—Presence of (meth)acrylic polymer
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    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Definitions

  • the present invention relates to a connection film, a joined body, and a manufacturing method thereof, and more particularly, a connection film capable of electrically and mechanically connecting circuit members such as an IC chip and a liquid crystal panel (LCD panel) in a liquid crystal display (LCD).
  • a connection film capable of electrically and mechanically connecting circuit members such as an IC chip and a liquid crystal panel (LCD panel) in a liquid crystal display (LCD).
  • the present invention relates to a joined body including a connection film and a manufacturing method thereof.
  • connection film is used when, for example, a terminal of a flexible printed circuit board (FPC) or an IC chip is connected to an ITO (Indium Tin Oxide) electrode formed on the glass substrate of the LCD panel.
  • ITO Indium Tin Oxide
  • connection film a cationic curable connection film containing a cationic curing agent and an epoxy resin has been put into practical use, and low temperature curability and reduction of the warping of the adherend are realized.
  • cationic curing agents such as sulfonium salts have high curing activity, there is a problem that curing reaction is easily inhibited even by a very small amount of impurities, resulting in poor curing. In particular, poor curing due to a passivation film made of polyimide formed on the back surface of the IC chip occurs frequently.
  • connection film a radical curing connection film containing a radical curing agent (organic peroxide) and an acrylic resin has been put into practical use for connection on the printed circuit board (PWB) side, and has achieved low-temperature curability. ing.
  • a radical curing connection film does not generate a hydroxyl group during curing, there is a problem in that the interaction with the adherend having a polarity is weakened, the adhesive strength is weakened, and poor curing occurs.
  • the radical curable connection film has a problem in that the adhesion to the glass surface of the LCD panel is poor, and interface peeling tends to occur on the LCD panel side.
  • a radical curable connection film containing an epoxy resin is also known (for example, Patent Document 1), but in this case, the adhesion to glass was insufficient. Therefore, the radical curable connection film is not suitable for connection on the LCD panel side and has a poor track record.
  • connection film Rubber materials generally used as a material for the connection film have a problem that they are liable to inhibit curing.
  • connection film in which a radical curing agent (low temperature curing) and an imidazole curing agent (high temperature curing) are mixed has been proposed (for example, Patent Document 2).
  • a binary curing type connection film in which a radical curing agent (low temperature curing) and an imidazole curing agent (high temperature curing) are mixed has been proposed (for example, Patent Document 2).
  • the connection film produced by mixing components having different curing mechanisms causes layer separation during curing, internal cracks are liable to occur and the connection reliability is poor.
  • curing needs to be performed in two stages, and is not suitable for short-time connection.
  • thermosetting composition and the photocurable composition are contained in the binary curing type connection film (for example, patent document 3) which mixed the radical type hardening
  • a connection film (for example, Patent Document 4) and a connection film having a two-layer structure (for example, Patent Document 5) having a layer containing a photocationic curing agent and a layer containing a photoradical curing agent have been proposed.
  • none of these improve the curing failure due to the passivation film made of polyimide formed on the back surface of the IC chip. Therefore, it is desired to develop a connection film that does not cause poor curing due to a passivation film made of polyimide.
  • metal wiring such as Al, Mo, Cr, Ti, Cu, and Ni is often laminated on a base such as ITO from the viewpoint of electrical conductivity. . Since these metal wirings lack optical transparency, it is difficult to connect the circuit members by curing the connection film by photocuring.
  • connection film having a two-layer structure a method is known in which the first layer and the second layer are provided with a viscosity difference to improve the efficiency of capturing conductive particles (for example, Patent Document 6).
  • the coupling force near the boundary between the first layer and the second layer is weak, and the conduction reliability may decrease.
  • Patent Document 7 a method for improving the adhesion by mixing a hydroxyl group-containing resin such as a phenoxy resin is known (for example, Patent Document 7).
  • the adhesive described in Patent Document 7 does not employ a two-layer structure having different viscosities, and is completely different in configuration and effect from the present invention.
  • an object of this invention is to provide the connection film excellent in both the supplementary efficiency and conduction
  • the second layer contains a radical curing agent, an acrylic resin and an epoxy compound, and either one of the first and second layers contains conductive particles.
  • the other of the first and second layers is an insulating organic resin layer having no conductivity, and the minimum melt viscosity of the conductive particle-containing organic resin layer is the insulating organic layer.
  • connection film characterized by being at least 10 times the minimum melt viscosity of the resin layer .
  • a first layer containing a cationic curing agent and an epoxy resin is disposed on the first circuit member side, and a second layer containing a radical curing agent and an acrylic resin.
  • This layer is disposed on the second circuit member side in which a film containing nitrogen atoms is formed on the surface facing the first circuit member, so that the adhesion strength to the circuit member can be improved.
  • the minimum melt viscosity of the conductive resin-containing organic resin layer is set to 10 times or more the minimum melt viscosity of the insulating organic resin layer, the efficiency of capturing the conductive particles can be improved.
  • connection film having a two-layer structure with a difference in viscosity
  • the phase separation tends to weaken the bonding force between the layers.
  • the epoxy compound contained in the second layer reacts with the epoxy resin contained in the first layer, it is between the first layer and the second layer. Bonding power can be improved.
  • the second layer is the connection film according to any one of ⁇ 1> to ⁇ 2>, wherein the second layer contains a hydroxyl group-containing acrylate.
  • the first layer containing the cationic curing agent and the epoxy resin is disposed on the first circuit member side, and the second layer containing the radical curing agent and the acrylic resin.
  • This layer is disposed on the second circuit member side in which a film containing nitrogen atoms is formed on the surface facing the first circuit member, so that the adhesion strength to the circuit member can be improved. Moreover, since the epoxy compound contained in the second layer reacts with the epoxy resin contained in the first layer at the time of bonding, the bonding force between the first layer and the second layer is improved. can do. Furthermore, since the minimum melt viscosity of the conductive resin-containing organic resin layer is set to 10 times or more the minimum melt viscosity of the insulating organic resin layer, it is possible to improve the capture efficiency of the conductive particles.
  • ⁇ 5> Joining characterized by including the joining process which joins by crimping
  • the first circuit member is an LCD panel
  • the second circuit member is either IC or TAB
  • the first layer is the LCD ⁇ 5> described in ⁇ 5>, wherein the polyimide film is temporarily attached so as to be in contact with the panel, the polyimide film is temporarily disposed so as to be in contact with the second layer, and is bonded by pressure bonding from the second circuit member side using a hot press. This is a manufacturing method of the joined body.
  • FIG. 1 is a schematic explanatory view showing a joined body of the present invention.
  • FIG. 2 is a schematic explanatory view showing the connection film of the present invention.
  • FIG. 3 is a schematic explanatory view showing a method for evaluating the adhesive strength.
  • the joined body of the present invention includes a first circuit member, a second circuit member, and a connection film, and further includes other members that are appropriately selected as necessary.
  • the joined body 100 includes an LCD panel 10 as a first circuit member, an IC chip 11 as a second circuit member, and a connection film 12.
  • the terminal 11a in the IC chip 11, the conductive particles 12a in the connection film 12, and the terminal (not shown) in the LCD panel 10 are electrically connected, whereby the LCD panel 10 and the IC chip 11 are electrically connected. .
  • First circuit member> There is no restriction
  • the first circuit member has a metal wiring made of, for example, aluminum. Thus, if the first circuit member has a wiring made of a material that does not transmit light, such as aluminum, it is difficult to photocur the resin contained in the connection film. Is more preferably a thermosetting resin.
  • the second circuit member is not particularly limited as long as a film containing nitrogen atoms is formed on the surface facing the first circuit member, and can be appropriately selected according to the purpose.
  • a film containing nitrogen atoms is formed on the surface facing the first circuit member, and can be appropriately selected according to the purpose.
  • an IC chip on which a passivation film containing polyimide is formed an IC chip on which a passivation film containing Si 3 N 4 is formed, a TAB tape on which the IC chip is mounted, and the like.
  • the second circuit member may be made of a material that does not transmit light. As described above, when the second circuit member is made of a material that does not transmit light, it is difficult to photocur the resin contained in the connection film. Therefore, the resin contained in the connection film is a thermosetting resin. Is more preferable.
  • connection film includes a first layer and a second layer, and further includes other layers appropriately selected as necessary.
  • One of the first and second layers is a conductive particle-containing organic resin layer containing conductive particles, and the other of the first and second layers is not conductive. It is an insulating organic resin layer.
  • the connection film 12 includes a release layer (separator) 20, an insulating organic resin layer 22 as a second layer formed on the release layer (separator) 20, and an insulating organic material.
  • a conductive particle-containing organic resin layer 21 as a first layer formed on the resin layer 22 is included.
  • the adhesive film 12 is attached so that the conductive particle-containing organic resin layer 21 is on the LCD panel 10 (FIG. 1) side. Thereafter, the release layer (separator) 20 is peeled off, and the IC chip 11 (FIG. 1) is pressure-bonded from the insulating organic resin layer 22 side to form the joined body 100 (FIG. 1).
  • the first layer is not particularly limited as long as it is disposed on the first circuit member side and contains a cationic curing agent and an epoxy resin, and can be appropriately selected according to the purpose.
  • the first layer is preferably a conductive particle-containing organic resin layer further containing conductive particles. In this case, it is necessary to make the 2nd layer mentioned later into the insulating organic resin layer which does not have electroconductivity.
  • ⁇ cationic curing agent >>>
  • a sulfonium salt, onium salt, etc. can be mentioned, Among these, an aromatic sulfonium salt is preferable.
  • Epoxy resin >>>
  • fever such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, and those modified epoxy resins
  • fever such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, and those modified epoxy resins
  • a curable epoxy resin is mentioned. These may be used individually by 1 type and may use 2 or more types together.
  • the conductive particles are not particularly limited, and those used in conventional anisotropic conductive adhesives (connection films) can be used.
  • metal particles or metal-coated resins having a particle diameter of 1 to 50 ⁇ m. Particles can be used.
  • the metal particles include nickel, cobalt, copper and the like. In order to prevent such surface oxidation, particles whose surfaces are coated with gold or palladium may be used. Furthermore, you may use the surface which gave the metal film or the insulating film with organic substance.
  • the metal-coated resin particles include true spherical particles plated with one or more of nickel, cobalt, copper and the like. Similarly, particles whose outermost surface is coated with gold or palladium may be used. Furthermore, you may use the surface which gave the metal film or the insulating film with organic substance.
  • the second layer is not particularly limited as long as it is disposed on the second circuit member side and contains a radical curing agent, an acrylic resin, and an epoxy compound, and is appropriately selected depending on the purpose. Can do.
  • the second layer preferably contains a hydroxyl group-containing acrylate from the viewpoint of adhesion to a polar circuit member.
  • the second layer is preferably an insulating organic resin layer that does not have electrical conductivity.
  • the conductive layer can be used as an organic resin layer containing conductive particles. In this case, the first layer needs to be an insulating organic resin layer.
  • Radical curing agent >>>
  • curing agent According to the objective, it can select suitably, For example, an organic peroxide can be mentioned.
  • Acrylic resin is not particularly limited and may be appropriately selected depending on the intended purpose.
  • acrylic resins such as cartons and urethane acrylates. These may be used individually by 1 type and may use 2 or more types together. Moreover, what made the said
  • Epoxy compound >>>
  • the epoxy compound contained in the second layer reacts with the epoxy resin contained in the first layer at the time of pressure bonding.
  • a mixed layer that generates both radical curing by the acrylic resin and cation curing by the epoxy compound is formed in the portion on the first layer side of the second layer, and the first layer is formed by this mixed layer.
  • the coupling force between the second layer and the second layer can be dramatically improved.
  • the epoxy compound preferably has a molecular weight of 900 or more and 50,000 or less, more preferably 5,000 or more and 40,000 or less, and particularly preferably 10,000 or more and 30,000 or less.
  • the epoxy compound preferably has an epoxy equivalent of 450 or more and 5,000 or less, more preferably 1,000 or more and 4,500 or less, and particularly preferably 2,000 or more and 4,000 or less.
  • the epoxy equivalent of the epoxy compound is less than 450, it is a compound having a low molecular weight, so it is not included in the network of the second layer, and unreacted epoxy groups remain, which may cause a decrease in film life. Yes, if it exceeds 5000, the number of epoxies is too small and the reaction with the epoxy resin of the first layer is also reduced, and the bonding strength between the layers may not be sufficiently increased.
  • the hydroxyl group-containing acrylate is not particularly limited as long as it is an acrylate having one or more hydroxyl groups in the molecule, and can be appropriately selected according to the purpose.
  • the acid value of the hydroxyl group-containing acrylate is preferably 1 mgKOH / g or more and 360 mgKOH / g or less, more preferably 10 mgKOH / g or more and 300 mgKOH / g or less, and 50 mgKOH / g or more and 250 mgKOH / g or less. Particularly preferred. If the acid value of the hydroxyl group-containing acrylate is less than 1 mgKOH / g, the adhesive strength may be lowered. If it exceeds 360 mgKOH / g, the electrode may be corroded, which is not preferable.
  • the minimum melt viscosity of the conductive particle-containing organic resin layer is preferably 10 times or more, more preferably 13 times or more the minimum melt viscosity of the insulating organic resin layer. If the minimum melt viscosity of the conductive particle-containing organic resin layer is less than 10 times the minimum melt viscosity of the insulating organic resin layer, the capture efficiency of the conductive particles cannot be sufficiently improved. From the viewpoint of conductivity, the minimum melt viscosity of the conductive particle-containing organic resin layer is preferably 1,000 times or less the minimum melt viscosity of the insulating organic resin layer.
  • a peeling layer can be mentioned.
  • the shape, structure, size, thickness, material (material), etc. of the release layer are not particularly limited and can be appropriately selected according to the purpose.
  • a transparent release PET (polyethylene terephthalate) sheet coated with a release agent such as silicone is preferable.
  • a PTFE (polytetrafluoroethylene) sheet may be used.
  • the manufacturing method of the joined body of the present invention includes at least a joining step and further includes other steps appropriately selected as necessary.
  • the bonding step is a step of bonding the first and second circuit members while heating them through the connection film of the present invention.
  • the heating is determined by the total amount of heat.
  • the heating is performed at a heating temperature of 120 ° C. to 220 ° C.
  • the pressure bonding differs depending on the type of the second circuit member, and is performed at a pressure of 2 to 6 MPa in the case of a TAB tape and at a pressure of 20 to 120 MPa in the case of an IC chip for 3 to 10 seconds, respectively. Bonding may be performed by ultrasonic waves and heat.
  • the first circuit member is an LCD panel and the second circuit member is either IC or TAB and has a polyimide film
  • the first layer is brought into contact with the LCD panel in the bonding step.
  • the polyimide film is temporarily attached to the second layer and temporarily disposed so as to be in contact with the second layer, and then bonded by being pressure-bonded from the second circuit member side using a hot press.
  • the hot press and the second circuit member come into contact with each other, and the resin of the second layer is heated, so that the melt viscosity is lowered and the fluid tends to flow.
  • the conductive particles of the first layer can be captured efficiently.
  • an ethyl acetate / toluene mixed solution containing the above raw materials so as to have a solid content of 50% is prepared.
  • this mixed solution was applied onto a PET film having a thickness of 50 ⁇ m, and then dried in an oven at 80 ° C. for 5 minutes to obtain a cation-curable electrode bonding sheet C1.
  • the minimum melt viscosity was measured using a rheometer (product name: RS150, manufactured by HAAKE). The measurement was performed under the condition of a temperature rising rate of 10 ° C./min.
  • Production Example 2 Cationic Curing Electrode Adhesive Sheet C2
  • phenoxy resin product name: YP-50, manufactured by Toto Kasei Co., Ltd.
  • silica fine particles product name: Aerosil RY200, manufactured by Nippon Aerosil Co., Ltd.
  • a cation curable electrode bonding sheet C2 was prepared and the minimum melt viscosity was measured.
  • Production Example 3 Cationic Curing Electrode Adhesive Sheet C3
  • epoxy resin product name: jER828, manufactured by Japan Epoxy Resin Co., Ltd.
  • acrylic resin product name: EB600, manufactured by Daicel Cytec Co., Ltd.
  • Production Example 4 Cationic Curing Electrode Adhesive Sheet C4
  • silica fine particles product name: Aerosil RY200, manufactured by Nippon Aerosil Co., Ltd.
  • Table 1 shows the formulation and minimum melt viscosity of the cationically curable electrode bonding sheets C1 to C4.
  • an ethyl acetate / toluene mixed solution containing the above raw materials so as to have a solid content of 50% is prepared.
  • this mixed solution was applied onto a PET film having a thickness of 50 ⁇ m, and then dried in an oven at 80 ° C. for 5 minutes to obtain a radical-curing electrode bonding sheet R1.
  • the minimum melt viscosity was measured using a rheometer (product name: RS150, manufactured by HAAKE). The measurement was performed under the condition of a temperature rising rate of 10 ° C./min.
  • Production Example 6 Radical-curing electrode bonding sheet R2
  • Production Example 5 except that 10 parts of an epoxy compound (Product name: jER1010, manufactured by Japan Epoxy Resin) was added instead of 10 parts of the epoxy compound (Product name: jER1001, manufactured by Japan Epoxy Resin).
  • a radical curable electrode bonding sheet R2 was prepared, and the minimum melt viscosity was measured.
  • Production Example 7 Radical-curing electrode bonding sheet R3
  • 10 parts of the epoxy compound product name: jER4110, manufactured by Japan Epoxy Resin Co., Ltd.
  • a radical curable electrode bonding sheet R3 was prepared, and the minimum melt viscosity was measured.
  • Production Example 8 Radical curing electrode bonding sheet R4
  • the amount of acrylic resin product name: EB-600, manufactured by Daicel Cytec
  • hydroxyl group-containing acrylate product name: Nk ester CB-1, manufactured by Shin-Nakamura Chemical Co., Ltd.
  • a radical curable electrode bonding sheet R4 was prepared in the same manner as in Production Example 7, and the minimum melt viscosity was measured.
  • Production Example 11 Radical-curing electrode bonding sheet R7
  • the addition amount of phenoxy resin product name: YP-50, manufactured by Toto Kasei Co., Ltd.
  • 10 parts of epoxy compound product name: jER1001, manufactured by Japan Epoxy Resin Co., Ltd.
  • a sheet R7 for radical curing electrode adhesion was prepared, and the minimum melt viscosity was measured.
  • Production Example 13 Radical-curing electrode bonding sheet R9
  • 10 parts of a hydroxyl group-containing acrylate (Product name: ⁇ -CEA, manufactured by Daicel Cytec Co., Ltd.) was added instead of 10 parts of the hydroxyl group-containing acrylate (Product name: Nk ester CB-1, manufactured by Shin-Nakamura Chemical Co., Ltd.). Except for this, a radical curable electrode bonding sheet R9 was prepared in the same manner as in Production Example 12, and the minimum melt viscosity was measured.
  • the oxidation of the hydroxyl group-containing acrylate (product name: ⁇ -CEA, manufactured by Daicel-Cytec) is 365 mgKOH / g.
  • Production Example 14 Radical-curing electrode bonding sheet R10
  • the amount of phenoxy resin product name: YP-50, manufactured by Tohto Kasei Co., Ltd.
  • a hydroxyl group-containing acrylate product name: Nk ester CB-1, manufactured by Shin-Nakamura Chemical Co., Ltd.
  • a radical curable electrode bonding sheet R10 was prepared in the same manner as in Production Example 12 except that 5 parts of phosphoric acid acrylate (product name: Light Ester P-1M, manufactured by Kyoeisha Chemical Co., Ltd.) was added instead of the parts. The minimum melt viscosity was measured.
  • Example 1 An IC chip (through an electrode bonding sheet having a two-layer structure in which the cationic curing electrode bonding sheet C1 produced in Production Example 1 and the radical curing electrode bonding sheet R1 produced in Production Example 5 are laminated.
  • the radical curing electrode bonding sheet R1 is bonded to the IC chip side, and the cationic curing electrode bonding sheet C1 is bonded to the aluminum pattern glass substrate side.
  • polyimide is used as a passivation film for the IC chip. The connection between the IC chip and the aluminum pattern glass substrate was performed by pressing the IC chip at 180 ° C., 80 MPa for 5 seconds.
  • Example 2 A joined body was produced in the same manner as in Example 1, except that the radical curable electrode bonding sheet R1 in Example 1 was replaced with the radical curable electrode bonding sheet R2 prepared in Production Example 6.
  • Example 3 A joined body was produced in the same manner as in Example 1 except that the radical curing electrode adhesion sheet R1 in Example 1 was replaced with the radical curing electrode adhesion sheet R3 produced in Production Example 7.
  • Example 4 A joined body was produced in the same manner as in Example 1 except that the radical curing electrode adhesion sheet R1 in Example 1 was replaced with the radical curing electrode adhesion sheet R4 produced in Production Example 8.
  • Example 5 A joined body was produced in the same manner as in Example 1 except that the radical curable electrode bonding sheet R1 in Example 1 was replaced with the radical curable electrode bonding sheet R5 prepared in Production Example 9.
  • Example 6 A joined body was produced in the same manner as in Example 1 except that the radical curable electrode bonding sheet R1 in Example 1 was replaced with the radical curable electrode bonding sheet R6 prepared in Production Example 10.
  • Example 1 (Comparative Example 1) In Example 1, the cation-curing electrode adhesion sheet C1 was replaced with the cation-curing electrode adhesion sheet C2 produced in Production Example 2, and the radical-curing electrode adhesion sheet R1 was produced in Production Example 11. A joined body was produced in the same manner as in Example 1 except that the sheet electrode R7 was replaced with the system electrode bonding sheet R7.
  • Comparative Example 2 A joined body was produced in the same manner as in Comparative Example 1, except that the cationic curing electrode bonding sheet C2 in Comparative Example 1 was replaced with the cationic curing electrode bonding sheet C3 prepared in Production Example 3.
  • the cationic curing electrode bonding sheet is a conductive particle-containing organic resin layer
  • the radical curing electrode bonding sheet is an insulating organic resin layer.
  • ⁇ Thermal cycle test> Each joined body was subjected to a thermal cycle under the condition of ⁇ 40 ° C. for 30 minutes and 100 ° C. for 30 minutes, taken out at 100 cycle intervals, and the connection resistance was measured. The number of cycles in which the connection resistance exceeded 50 ⁇ was defined as a failure occurrence cycle.
  • the joined bodies of Examples 1 to 6 having the configuration of the present invention have high supplemental efficiency of conductive particles, high joint strength, and excellent conduction reliability.
  • the bonded body of Comparative Examples 1 and 2 in which the radical curable electrode bonding sheet (second layer) does not contain an epoxy compound has a low die shear strength and a small defect generation cycle, so that a sufficient bonding strength is obtained. It is not done. For this reason, there exists a possibility that conduction
  • Comparative Example 1 is between the minimum melt viscosity (500 Pa ⁇ s) of the cation-curing-type electrode bonding sheet C2 (ACF) and the minimum melt viscosity (500 Pa ⁇ s) of the radical-curing-type electrode bonding sheet R7 (NCF). Furthermore, since there is no difference in viscosity, the particle capture rate is low and it is not possible to handle fine pitch connection.
  • the viscosity is between the minimum melt viscosity (500 Pa ⁇ s) of the cationic curing electrode bonding sheet C2 (ACF) and the minimum melt viscosity (500 Pa ⁇ s) of the radical curing electrode bonding sheet R7 (NCF). Since there is no difference, a mixed layer is easily formed and the adhesive strength is improved.
  • an acrylic resin is blended in the cation curable electrode bonding sheet (first layer), but the joining strength is low, and in order to solve the problems of the present invention, radicals are used. It can be seen that it is essential to contain an epoxy compound in the curable electrode bonding sheet (second layer).
  • Example 4 Comparing Example 1 and Example 4, it can be seen that in Example 4 in which the hydroxyl group-containing acrylate was blended, the adhesive strength was further improved. Further, in Example 5 in which the molecular weight of the epoxy compound is small and Example 6 in which the epoxy equivalent is large, although improvement can be seen from the prior art, the die shear strength is lower than in Examples 1 to 4, and the cycle of occurrence of defects is also reduced. I understand that it is small.
  • a 40 V DC voltage was applied between the wirings of this corrosive evaluation sample under an environment of 40 ° C. and 90% RH, and the following three stages were evaluated according to the time until corrosion occurred.
  • ⁇ Corrosion does not occur even after 48 hours.
  • ⁇ Corrosion occurs in 24 to 48 hours.
  • X Corrosion occurs before 24 hours.
  • Reference Example 2 In Reference Example 1, the cation-curing electrode bonding sheet C2 was prepared as the cation-curing electrode bonding sheet C4 produced in Production Example 4, and the radical-curing electrode bonding sheet R8 was produced in Production Example 13. A conductive resistance, adhesive strength, and corrosive evaluation were performed in the same manner as in Reference Example 1, except that the electrode bonding sheet R9 was used.
  • Reference Example 3 In Reference Example 1, except that the radical curable electrode bonding sheet R8 was replaced with the radical curable electrode bonding sheet R7 produced in Production Example 11, the conduction resistance, adhesive strength, and corrosion were the same as in Reference Example 1. A sex assessment was performed.
  • Reference Example 4 In Reference Example 3, the conductive resistance, adhesive strength, and corrosion were the same as in Reference Example 3 except that the radical curing electrode bonding sheet R7 was replaced with the radical curing electrode bonding sheet R10 prepared in Production Example 14. A sex assessment was performed.
  • Reference Example 5 In Reference Example 2, except that the radical curable electrode bonding sheet R9 was replaced with the radical curable electrode bonding sheet R11 prepared in Production Example 15, the same as in Reference Example 2, conduction resistance, adhesive strength, corrosion A sex assessment was performed. The evaluation results of Reference Examples 1 to 5 are shown in Table 5 below.
  • connection film of the present invention, the joined body, and the manufacturing method thereof can be suitably used as a connecting film excellent in both the supplementary efficiency and conductive reliability of the conductive particles, and the joined body and the manufacturing method thereof. .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

L'invention porte sur un film de connexion possédant à la fois une excellente efficacité de retenue de particules conductrices et une excellente fiabilité de conduction, sur un corps collé et sur un procédé de fabrication du corps collé. Le film de connexion connecte électriquement un premier élément de circuit à un second élément de circuit dans lequel un film contenant des atomes d'azote est formé sur la surface faisant face au premier élément de circuit. Le film de connexion comprend une première couche agencée du côté du premier élément de circuit, et une seconde couche agencée du côté du second élément de circuit. La première couche contient un agent de durcissement cationique et une résine époxy, et la seconde couche contient un agent de durcissement radicalaire, une résine acrylique et un composé époxy. L'une des première et seconde couches est une couche de résine organique contenant des particules conductrices, qui contient des particules conductrices, et l'autre des première et seconde couches est une couche de résine organique isolante n'ayant pas de conductivité. La viscosité à l'état fondu la plus faible de la couche de résine organique contenant des particules conductrices vaut 10 fois ou plus la viscosité à l'état fondu la plus faible de la couche de résine organique isolante.
PCT/JP2009/069535 2008-11-20 2009-11-18 Film de connexion, corps collé et procédé de fabrication du corps collé WO2010058782A1 (fr)

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KR1020107018228A KR101085722B1 (ko) 2008-11-20 2009-11-18 접속 필름, 및 접합체 및 그 제조 방법
CN2009801051493A CN101946371B (zh) 2008-11-20 2009-11-18 连接膜、以及接合体及其制造方法
US12/838,625 US9023464B2 (en) 2008-11-20 2010-07-19 Connecting film, and joined structure and method for producing the same
HK11104262.0A HK1150322A1 (en) 2008-11-20 2011-04-28 Connecting film, and joined structure and method for producing the same
US13/613,560 US8524032B2 (en) 2008-11-20 2012-09-13 Connecting film, and joined structure and method for producing the same

Applications Claiming Priority (2)

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JP2008296494A JP4897778B2 (ja) 2008-11-20 2008-11-20 接続フィルム、並びに、接合体及びその製造方法
JP2008-296494 2008-11-20

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WO2010058782A1 true WO2010058782A1 (fr) 2010-05-27

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JP (1) JP4897778B2 (fr)
KR (1) KR101085722B1 (fr)
CN (1) CN101946371B (fr)
HK (1) HK1150322A1 (fr)
WO (1) WO2010058782A1 (fr)

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US20130213691A1 (en) * 2010-10-08 2013-08-22 Kyoung Soo Park Electronic device
WO2014046053A1 (fr) * 2012-09-21 2014-03-27 デクセリアルズ株式会社 Film conducteur anisotrope, procédé de connexion, et corps connecté
JP2015067627A (ja) * 2013-09-26 2015-04-13 デクセリアルズ株式会社 接続フィルム、接続構造体、接続構造体の製造方法、接続方法

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KR101381118B1 (ko) 2011-11-04 2014-04-04 제일모직주식회사 이방 전도성 접착 필름용 조성물 및 이를 이용한 이방 전도성 접착 필름
KR101403865B1 (ko) * 2011-12-16 2014-06-10 제일모직주식회사 이방성 도전 필름용 조성물, 이방성 도전 필름 및 반도체 장치
JP2015135878A (ja) * 2014-01-16 2015-07-27 デクセリアルズ株式会社 接続体、接続体の製造方法、接続方法、異方性導電接着剤
JP6260313B2 (ja) * 2014-02-04 2018-01-17 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
JP6431723B2 (ja) * 2014-08-18 2018-11-28 デクセリアルズ株式会社 接続構造体の製造方法、及び異方性導電接着フィルム
JP6510846B2 (ja) * 2015-03-24 2019-05-08 デクセリアルズ株式会社 異方性導電フィルム、接続方法、及び接合体
WO2017191772A1 (fr) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 Film d'alignement de charge
EP3569329B1 (fr) * 2017-01-11 2023-11-01 Resonac Corporation Pâte de cuivre pour liaison sans pression, corps lié et dispositif semi-conducteur
WO2019050012A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Film adhésif pour connexion de circuits et procédé de fabrication associé, procédé de fabrication d'une structure de connexion de circuits et ensemble contenant pour film adhésif
WO2019050011A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Film adhésif pour connexion de circuits et procédé de fabrication associé, procédé de fabrication d'une structure de connexion de circuits et ensemble contenant pour film adhésif
WO2019050005A1 (fr) * 2017-09-11 2019-03-14 日立化成株式会社 Ensemble contenant pour film adhésif et procédé de fabrication associé
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US8524032B2 (en) 2013-09-03
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HK1150322A1 (en) 2011-11-25
US20100285305A1 (en) 2010-11-11
US9023464B2 (en) 2015-05-05
CN101946371B (zh) 2012-10-24
JP2010123418A (ja) 2010-06-03
KR101085722B1 (ko) 2011-11-21
US20130000113A1 (en) 2013-01-03
KR20100121490A (ko) 2010-11-17

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