WO2010023976A1 - Guide d’ondes optique, module à guide d’ondes optique et substrat de montage d’un élément optique - Google Patents

Guide d’ondes optique, module à guide d’ondes optique et substrat de montage d’un élément optique Download PDF

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Publication number
WO2010023976A1
WO2010023976A1 PCT/JP2009/054347 JP2009054347W WO2010023976A1 WO 2010023976 A1 WO2010023976 A1 WO 2010023976A1 JP 2009054347 W JP2009054347 W JP 2009054347W WO 2010023976 A1 WO2010023976 A1 WO 2010023976A1
Authority
WO
WIPO (PCT)
Prior art keywords
waveguide
core
mirror
optical waveguide
light
Prior art date
Application number
PCT/JP2009/054347
Other languages
English (en)
Japanese (ja)
Inventor
長木浩司
宮尾憲治
白土洋次
渡辺啓
寺田信介
Original Assignee
住友ベークライト株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008217074A external-priority patent/JP2009145867A/ja
Application filed by 住友ベークライト株式会社 filed Critical 住友ベークライト株式会社
Publication of WO2010023976A1 publication Critical patent/WO2010023976A1/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Definitions

  • An electronic device with is equipped with multiple items.
  • the output signal of an electronic product is converted into a signal by photons, and the signal is transmitted to the optical waveguide.
  • the returned optical signal is returned to an electrical signal by another photon, and the signal is connected to another electrical product.
  • an optical waveguide is formed in the rigid, and the optical waveguide is integrated with the rigid.
  • a child and an electronic product are transmitted on a rigid through electricity and electrical wiring formed on the opposite surface through these wires, and an optical signal is transmitted from an optical waveguide formed on Then, if the insulation penetrates from the waveguide and is transmitted to the child, 2 0 0 2 8 2 0 4 9).
  • a mirror surface for bending the light propagating through the optical waveguide in a direction perpendicular to the base is provided in the optical waveguide (for example, 200 2 8 2 0 4 9, Special 0 3 0 0 9 6 and 2 0 0 6 9 8 7 9 8.
  • 0 is multi-layered intersection with Mira by Ming This is a part schematically showing the waveguide.
  • the hollow mirror 34 spans three layers of the upper cladding 3, the core 3 2 and the cladding 33, as shown in Fig. 4).
  • the hollow mirror 44 spans two layers of the upper cod 4 and the core 42, and as shown in 4C), the hollow mirror 54 spans the two layers of the core 52 and the clad 53.
  • Embodiments are mentioned and are included in any light as shown in 3 and 4, hollow mirrors according to light.
  • crossed waveguide 90 shown in Fig. 2 is a direct core 9
  • Such a rubornene-based poly is suitably synthesized by using, for example, a rubornene-based mono described later or a crosslinked norbornene-based mono).
  • the sensory functions include, for example, C) CC 2) S (Me) 3C) CC 3 CCC) CC) 2C) CC) 3 CCC 3 2C) C) C) C) C) C)))) R) 5 C) R 5 C) C) R 5 (C) C) R 5 C) C
  • R represents an alkyl group having from 0 to 0 carbon atoms
  • R represents a hydrogen atom or a methyl group
  • a represents a number of from 0 to 3, and is 2 0 or less.
  • a compound in which R is an alkyl group having a prime number of 4 to 0 and a is, such as, ) Methyl poly, Lnorbornene thalyl 25 rubolene) Methyl poly, etc. are preferred.
  • the fine movement stage was moved to 0 in 6 seconds, and a laser with a frequency of 0 z was irradiated in the meantime.
  • the waveguide was cut along the core and the surface was observed, it was found to be inclined at 45 degrees with respect to the plane defined by the 3 waveguide from the lower cladding layer to the core layer. .
  • the slope was observed with a scanning microscope S E, it became wider than the implementation of the laser deposited on the mirror surface, but the mirror surface was smooth.
  • the crossed waveguide 3 waveguide with the clad structure of 2 showed the same performance as the waveguide of either type.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Integrated Circuits (AREA)

Abstract

L’invention concerne un guide d’ondes optique comprenant une structure en miroir innovante en ce qu’elle ne présente aucune impureté sur une face de miroir mais possède une faible perte par réflexion et en ce qu’elle devient difficilement une base de cassure au moment d’une déformation. Le guide d’ondes optique comprend une couche de noyau ayant une portion de noyau pour définir une direction de trajet optique et une portion de gaine qui possède un indice de réfraction plus faible que celui de la portion de noyau ainsi que des couches de gaine appliquées par laminage sur les deux faces de la couche de noyau. Le guide d’ondes optique est caractérisé en ce qu’une structure en miroir creux destinée à définir une face de miroir pour convertir le trajet optique d’un rayon lumineux soit pour qu’il devienne incident au guide d’ondes optique, soit pour qu’il émane du guide d’ondes optique est disposée à une position prédéterminée de la portion de noyau le long de la direction du trajet optique.
PCT/JP2009/054347 2008-08-26 2009-03-02 Guide d’ondes optique, module à guide d’ondes optique et substrat de montage d’un élément optique WO2010023976A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-217074 2008-08-26
JP2008217074A JP2009145867A (ja) 2007-11-22 2008-08-26 光導波路、光導波路モジュールおよび光素子実装基板

Publications (1)

Publication Number Publication Date
WO2010023976A1 true WO2010023976A1 (fr) 2010-03-04

Family

ID=41722761

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/054347 WO2010023976A1 (fr) 2008-08-26 2009-03-02 Guide d’ondes optique, module à guide d’ondes optique et substrat de montage d’un élément optique

Country Status (2)

Country Link
TW (1) TW201009408A (fr)
WO (1) WO2010023976A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011125799A1 (fr) * 2010-04-08 2011-10-13 住友ベークライト株式会社 Structure de guide d'ondes optique et appareil électronique
CN112485929A (zh) * 2019-09-12 2021-03-12 源杰科技股份有限公司 光信号产生装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2821826A4 (fr) * 2012-02-27 2015-09-30 Sumitomo Bakelite Co Guide d'onde optique, composant de câblage optique, module de guide d'onde optique et dispositif électronique
TWI636617B (zh) 2016-12-23 2018-09-21 財團法人工業技術研究院 電磁波傳輸板及差動電磁波傳輸板

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53164161U (fr) * 1977-05-31 1978-12-22
US4747653A (en) * 1986-03-14 1988-05-31 Northern Telecom Limited Crossover arrangement for optical conductors
JPH0387704A (ja) * 1989-08-30 1991-04-12 Nec Corp 光回路
JPH04230708A (ja) * 1990-04-03 1992-08-19 Commiss Energ Atom 外界から保護された集積光学素子及びその製造方法
JPH0688915A (ja) * 1992-02-24 1994-03-29 Corning Inc プレ−ナ光導波路およびその製造方法
JPH07168039A (ja) * 1993-12-15 1995-07-04 Ricoh Co Ltd 光導波路デバイス
JPH11248951A (ja) * 1998-02-27 1999-09-17 Hitachi Cable Ltd 光導波路及びその製造方法
JP2003075670A (ja) * 2001-08-31 2003-03-12 Kddi Submarine Cable Systems Inc 反射器の製造方法
JP2005037531A (ja) * 2003-07-17 2005-02-10 Ricoh Co Ltd 光電気複合配線基板
JP2005070141A (ja) * 2003-08-28 2005-03-17 Ngk Spark Plug Co Ltd 光路変換部品付きの光導波路構造体及びその製造方法、光路変換部品
JP2008046638A (ja) * 2006-08-14 2008-02-28 Samsung Electro Mech Co Ltd 光印刷回路基板及びその製造方法
JP2008112030A (ja) * 2006-10-31 2008-05-15 Sumitomo Bakelite Co Ltd 接着剤付き光回路基板、光素子実装用部品及び光素子実装部品

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53164161U (fr) * 1977-05-31 1978-12-22
US4747653A (en) * 1986-03-14 1988-05-31 Northern Telecom Limited Crossover arrangement for optical conductors
JPH0387704A (ja) * 1989-08-30 1991-04-12 Nec Corp 光回路
JPH04230708A (ja) * 1990-04-03 1992-08-19 Commiss Energ Atom 外界から保護された集積光学素子及びその製造方法
JPH0688915A (ja) * 1992-02-24 1994-03-29 Corning Inc プレ−ナ光導波路およびその製造方法
JPH07168039A (ja) * 1993-12-15 1995-07-04 Ricoh Co Ltd 光導波路デバイス
JPH11248951A (ja) * 1998-02-27 1999-09-17 Hitachi Cable Ltd 光導波路及びその製造方法
JP2003075670A (ja) * 2001-08-31 2003-03-12 Kddi Submarine Cable Systems Inc 反射器の製造方法
JP2005037531A (ja) * 2003-07-17 2005-02-10 Ricoh Co Ltd 光電気複合配線基板
JP2005070141A (ja) * 2003-08-28 2005-03-17 Ngk Spark Plug Co Ltd 光路変換部品付きの光導波路構造体及びその製造方法、光路変換部品
JP2008046638A (ja) * 2006-08-14 2008-02-28 Samsung Electro Mech Co Ltd 光印刷回路基板及びその製造方法
JP2008112030A (ja) * 2006-10-31 2008-05-15 Sumitomo Bakelite Co Ltd 接着剤付き光回路基板、光素子実装用部品及び光素子実装部品

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011125799A1 (fr) * 2010-04-08 2011-10-13 住友ベークライト株式会社 Structure de guide d'ondes optique et appareil électronique
CN112485929A (zh) * 2019-09-12 2021-03-12 源杰科技股份有限公司 光信号产生装置
CN112485929B (zh) * 2019-09-12 2022-12-20 源杰科技股份有限公司 光信号产生装置

Also Published As

Publication number Publication date
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