WO2010021306A1 - 微細流路チップの製造方法、微細流路チップ成形用金型、及び微細流路チップ - Google Patents
微細流路チップの製造方法、微細流路チップ成形用金型、及び微細流路チップ Download PDFInfo
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- WO2010021306A1 WO2010021306A1 PCT/JP2009/064388 JP2009064388W WO2010021306A1 WO 2010021306 A1 WO2010021306 A1 WO 2010021306A1 JP 2009064388 W JP2009064388 W JP 2009064388W WO 2010021306 A1 WO2010021306 A1 WO 2010021306A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/263—Moulds with mould wall parts provided with fine grooves or impressions, e.g. for record discs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/40—Removing or ejecting moulded articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00444—Surface micromachining, i.e. structuring layers on the substrate
- B81C1/0046—Surface micromachining, i.e. structuring layers on the substrate using stamping, e.g. imprinting
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/10—Integrating sample preparation and analysis in single entity, e.g. lab-on-a-chip concept
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/04—Closures and closing means
- B01L2300/041—Connecting closures to device or container
- B01L2300/044—Connecting closures to device or container pierceable, e.g. films, membranes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/12—Specific details about materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/051—Micromixers, microreactors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0323—Grooves
- B81B2203/0338—Channels
Definitions
- the present invention is manufactured by a method of manufacturing a micro-channel chip by bonding a resin substrate on which a micro-channel is formed, a micro-channel chip molding die used for the manufacturing, and a manufacturing method thereof
- the present invention relates to a fine channel chip.
- Microfabrication technology is used to form microchannels and circuits on silicon and glass substrates, and liquefied samples such as nucleic acids, proteins, blood, etc. are introduced into microchannels in microspaces, and their chemical reactions, separation,
- a device called a micro analysis chip for performing analysis or the like, ⁇ TAS (Micro Total Analysis System), or a microchannel chip has been put into practical use.
- ⁇ TAS Micro Total Analysis System
- the microchannel chip is manufactured by bonding two members that have been subjected to micromachining to at least one member.
- a glass substrate is used for the fine channel chip, and various fine processing methods have been proposed.
- glass substrates are not suitable for mass production and are very expensive, development of inexpensive and disposable resin-made micro-channel chips is desired.
- a method of manufacturing a resin-made fine channel chip there is a method of joining a resin substrate on which a channel groove is formed and a resin substrate that covers the channel groove.
- welding method to heat and bond resin substrates using hot plate, hot air, hot roll, ultrasonic wave, vibration, laser, etc. bonding to bond resin substrates using adhesive or solvent
- Examples thereof include a method, a method of bonding using the adhesiveness of the resin substrate itself, and a method of bonding the substrates to each other by subjecting the resin substrate to a surface treatment such as plasma treatment (see, for example, Patent Document 1).
- FIG. 10 is a schematic cross-sectional view of a state in which a resin substrate is formed by pouring resin into a conventional mold for forming a micro-channel chip.
- a resin having a channel groove is formed by pouring molten resin into a fine channel chip molding die 100 (part indicated by diagonal lines) and then cooling.
- a substrate 001 (a painted portion) is formed.
- the micro-channel chip molding die 100 has a microstructure 102 for transferring the channel groove to a surface 101 (hereinafter referred to as “molding transfer surface 101”) for transferring the channel groove to the resin substrate.
- FIG. 11 is a schematic cross-sectional view at the time of mold release (resin substrate is separated from the mold) after pouring resin into a conventional mold for forming a micro-channel chip.
- the present invention has been made in view of such circumstances, and provides a micro-channel chip manufacturing method for reducing deformation in a micro-channel due to molding shrinkage and a micro-channel chip molding die used therefor. It is aimed.
- the molten resin is injected into a mold having a fine structure provided as described above and a convex portion protruding higher than the fine structure from the surface toward the cavity, and the injected resin is solidified.
- the surface of the mold is relatively separated from the formed resin substrate in the order of the fine structure and the convex portion, and a fine flow path chip is manufactured using the resin substrate. It is.
- the invention according to claim 2 is the method for manufacturing a micro-channel chip according to claim 1, wherein the micro-channel chip manufacturing method according to claim 1 covers a portion where the fine structure is transferred on the resin substrate and is formed from the hole formed by the convex portion. Another resin substrate is bonded to the resin substrate so as to be located at a distant portion.
- the invention according to claim 3 is the method for manufacturing a micro-channel chip according to claim 1 or 2, wherein the convex portion injects molten resin into the cavity provided in the mold. It is arranged near the outer edge of the surface farthest from the injection port.
- a fine channel chip manufacturing method comprising: a cavity capable of accommodating a molten resin; and a fine structure provided on one surface forming the cavity so as to protrude from the surface toward the cavity.
- a resin substrate formed by injecting molten resin into a mold having a recess provided deeper than the fine structure in a direction opposite to the protruding direction of the fine structure, and solidifying the injected resin
- the surface of the mold is relatively separated in the order of the fine structure and the concave portion, and a fine flow path chip is manufactured using the resin substrate.
- the invention according to claim 5 is the method for manufacturing a micro-channel chip according to claim 4, wherein the micro-structure of the resin substrate is covered with a portion to which the fine structure is transferred and is formed from the protrusion formed by the recess. Another resin substrate is bonded to the resin substrate so as to be located at a distant portion.
- the invention according to claim 6 is the method of manufacturing the micro-channel chip according to claim 4 or claim 5, wherein the concave portion injects molten resin into the cavity provided in the mold. It is arranged near the outer edge of the surface farthest from the entrance.
- the fine flow path chip molding die wherein a fine flow path groove is formed on a surface of one of the at least two resin substrates, and the two resin substrates are formed on the fine resin substrate.
- a cavity capable of containing a molten resin for forming a resin substrate in which the groove for the fine flow path is formed, and one surface forming the cavity are provided so as to protrude from the surface to the cavity side. It has a fine structure and a convex portion protruding higher than the fine structure from the surface toward the cavity.
- the invention according to claim 8 is the fine channel chip molding die according to claim 7, wherein the convex portion is provided in a portion other than the surface to which the two resin substrates are joined. It is characterized by this.
- the fine flow path chip molding die according to claim 9 has a fine flow path groove formed on a surface of one of the at least two resin substrates, and the two resin substrates are formed on the fine resin substrate.
- a cavity capable of containing a molten resin for forming a resin substrate in which the groove for the fine flow path is formed, and one surface forming the cavity are provided so as to protrude from the surface to the cavity side. It is characterized by comprising a fine structure and a recess provided deeper than the height of the fine structure in a direction opposite to the protruding direction of the fine structure.
- a tenth aspect of the present invention is the fine channel chip molding die according to the ninth aspect, wherein the concave portion is provided in a portion other than a surface to which the two resin substrates are joined. It is characterized by.
- the fine channel chip according to claim 11 is formed on the surface of at least one resin substrate of two resin substrates by injection molding in which a fine channel into which a liquid is introduced is injected with molten resin.
- Two resin substrates are bonded together with the surface on which the microchannel is formed facing inside, and the microchannel forming surface of the resin substrate on which the microchannel is formed includes: A concave portion formed longer than the maximum length in the depth direction of the fine flow path is formed at a position other than the fine flow path.
- the invention according to a twelfth aspect is the fine channel chip according to the eleventh aspect, wherein the two resin substrates cover a portion where the fine structure is transferred and are joined at a portion away from the concave portion. It is characterized by being.
- the mold for forming a micro-channel chip according to the present invention has a configuration having a convex portion or a recess longer than the micro-channel configured in the cavity, and the micro-channel chip manufacturing method according to the present invention includes a micro-channel chip manufacturing method.
- the convex portion or the concave portion is detached after the road is separated from the mold.
- the fine channel does not leave at the end, and the application of force to the fine channel due to molding shrinkage is reduced. Therefore, the mold release deformation at the edge of the fine flow path is reduced, and a fine flow path with high accuracy can be formed, and the flatness can be improved.
- the microchannel chip according to the present invention is manufactured by high-precision bonding using a highly flat resin substrate and has a high-precision microchannel. Thereby, the fine flow path chip according to the present invention has improved quantitativeness and reproducibility.
- FIG. 2 is a cross-sectional view of a micro-channel chip molding die according to the present embodiment, and is a cross-sectional view taken along the line II-II in FIG. It is typical sectional drawing of the state which inject
- FIG. 10 is a schematic cross-sectional view of a state in which a resin is injected into a micro-channel chip molding die according to Modification 1.
- FIG. 10 is a schematic cross-sectional view when releasing a fine channel chip molding die according to Modification 1 from a molded resin substrate.
- 10 is a schematic cross-sectional view of a state in which a resin is injected into a micro-channel chip molding die according to Modification 2.
- FIG. FIG. 10 is a schematic cross-sectional view of a state in which a fine channel chip molding die according to Modification 2 is released from a molded resin substrate. It is typical sectional drawing of the state which poured resin into the conventional mold for fine channel chips, and formed the resin substrate. It is typical sectional drawing at the time of mold release molding after pouring resin into the conventional mold for fine channel chips.
- FIG. 1 is a schematic top view of a micro-channel chip molding die according to this embodiment.
- FIG. 2 is a cross-sectional view of the micro-channel chip molding die according to this embodiment, and is a cross-sectional view taken along the line II-II in FIG.
- FIG. 3 is a schematic cross-sectional view of a state in which a resin is injected into the micro-channel chip molding die according to the present embodiment.
- FIG. 4 is a schematic cross-sectional view when the fine channel chip molding die according to this embodiment is released from the molded resin substrate.
- FIG. 5 is a schematic top view of one resin substrate molded by the method of manufacturing a microchannel chip according to the present embodiment.
- the micro-channel chip molding die 100 has a cavity 104 for injecting molten resin in a direction perpendicular to the paper surface of FIG.
- a direction perpendicular to the paper surface of FIG. 1 is referred to as a “cavity direction”.
- the micro-channel chip molding die 100 has a molding transfer surface 101 for transferring the microstructure 102 and the like to a resin substrate 001 to be molded. .
- a microstructure 102 and a convex portion 103 for contraction are provided on the molding transfer surface 101.
- the fine structure 102 and the convex portion 103 for shrinkage protrude toward the cavity (project from the molding transfer surface 101 toward the cavity).
- the resin substrate 001 formed by the micro-channel chip molding die 100 and the other resin substrate 001 are joined with the surface on which the micro-channel 002 is formed inside, and an actual micro-channel chip is formed.
- a range A indicated by a dotted line in FIG. 1 is a region where another resin substrate 001 is bonded.
- a range A which is a portion bonded to another resin substrate 001 is a “bonding surface”.
- the portion of the range A is referred to as a joint surface.
- the fine structure 102 has a fine flow path 002 (on a resin substrate 001 on which resin injected into the cavity 104 (see FIG. 2) of the fine flow path chip molding die 100 is solidified and molded. (See FIG. 4).
- the microstructure 102 has a plurality of portions having different heights in the cavity direction. In the present embodiment, description will be made assuming that the highest portion in the cavity direction in the microstructure 102 is a portion of the II-II cross section shown in FIG.
- the anti-shrinkage convex portion 103 is provided on a portion other than the joint surface on the molding transfer surface 101.
- contraction is higher than the highest part in the cavity direction in the fine structure 102 (part corresponding to the II-II cross section in FIG. 2 in this embodiment). (That is, the anti-contraction convex part 103 protrudes higher than the fine structure 102).
- the size of the convex portion 103 for shrinkage in the molding transfer surface direction is a circle having a diameter of 20 ⁇ m or more (a circle having a diameter of 10% or more larger than the smallest width in the fine structure 102).
- the size is not particularly limited.
- the shape of the anti-shrinkage convex portion 103 may be a shape other than a circle.
- the fine channel chip molding die 100 has a tubular runner portion 105 for injecting a resin as a material of the resin substrate 001 as shown in FIG.
- the runner portion 105 is arranged so as to pour resin in the direction of the arrow P in FIG.
- the micro-channel chip molding die 100 is configured to open (separate) vertically at the portion of the line 106 in FIG. This is for taking out the resin substrate 001 which is hardened and molded in the cavity 104.
- the micro-channel chip molding die 100 opens substantially perpendicular to the molding transfer surface 101.
- Processing of the fine channel chip forming die 100 is performed using known etching processing, machining-cutting processing / end middle processing, or the like.
- Convex portions corresponding to the fine structure 102 are formed on the molding transfer surface 101 of the micro-channel chip molding die 100, and further, the anti-shrinking convex portions 103 are formed on portions other than the joint surface (range A).
- the fine channel chip forming mold 100 may be produced by electroforming. In this case, a convex portion corresponding to the fine structure 102 and the convex portion for shrinkage 103 is formed on the electroforming master by etching. Then, the mold 100 for forming a fine channel chip is formed by the electroforming master.
- a resin as a material for the resin substrate 001 is melted by heating at 250 ° C. to 300 ° C. Then, the resin that is the material of the molten resin substrate 001 is poured into the fine channel chip molding die 100 of about 100 degrees through the runner portion 105.
- the temperature of the micro-channel chip molding die 100 is determined to be about HDT based on the glass transition temperature Tg and the heat distortion temperature (deflection temperature under load) HDT.
- the resin is not solidified at the glass transition temperature Tg or higher.
- the thermal deformation temperature HDT is a temperature at which a certain amount of deformation occurs in the resin when a certain load is applied. Then, the cavity 104 of the micro-channel chip molding die 100 is filled with the poured resin.
- the resin poured into the cavity 104 is solidified by cooling the resin to the temperature of the micro-channel chip molding die 100 (around 100 degrees).
- the resin is solidified in accordance with the microstructure 102 provided on the molding transfer surface 101 of the micro-channel chip molding die 100. That is, a recess is formed on the resin substrate 001 in accordance with the microstructure 102 as shown in FIG.
- the anti-shrinkage convex portion 103 provided on the molding transfer surface 101 of the micro-channel chip molding die 100 is also filled with resin. That is, as shown in FIG. 3, a concave portion is formed on the resin substrate 001 in accordance with the convex portion 103 for shrinkage.
- the micro-channel chip molding die 100 has a temperature of about HDT, and thus the solidified resin may be deformed when a load is applied.
- PMMA (Tg: 113 to 115 ° C., HDT: 91 to 95 ° C.) is used as the resin and the resin is melted to solidify.
- PMMA is a thermoplastic resin and melts by heating.
- the melting method uses an injection molding machine to drop resin pellets (resin-shaped resin having a diameter of about 1 to 2 mm and a length of about 2 to 5 mm) into a plasticizing cylinder, and heat by a cylinder heater and shear heat generated by rotation of a plasticizing screw Melt in combination with.
- the ratio between the heating by the cylinder heater and the shear heat generation (actually the number of rotations of the screw) varies depending on the resin.
- the temperature of the injection cylinder for injecting the resin is heated to 230 to 270 ° C.
- the temperature of the micro-channel chip molding die 100 is set to 80 to 120 ° C.
- the temperature of the resin at the time of mold release is cooled to 80 to 120 ° C., which is the temperature of the mold 100 for forming a fine channel chip.
- the fine flow path chip molding die 100 is separated in the vertical direction toward the plane of FIG. 2 along the line 106 in FIG. Release from the mold 100.
- the stress is released at the same time as the mold release in a state where the resin substrate 001 is contracted, so in the normal case, sudden shape shrinkage occurs. To do.
- the resin substrate 001 and the micro-channel chip molding die 100 at the time of release will be described in detail.
- the resin substrate 001 immediately before the mold release and the fine flow path chip molding die 100 are completely engaged with each other.
- the micro-channel chip molding die 100 is gradually separated, the convex portion of the microstructure 102 on the molding transfer surface 101 is completely detached from the resin substrate 001 as shown in FIG. .
- the portion of the fine structure 102 in FIG. 4 is the highest portion in the cavity direction in the fine structure 102, all the portions of the fine structure 102 are detached from the resin substrate 001. Thereby, the release of the portion of the fine channel 002 on the resin substrate 001 is completed.
- the convex portion 103 for contraction is higher than the highest portion in the cavity direction in the fine structure 102
- the highest portion in the cavity direction in the fine structure 102 is the resin substrate 001.
- the anti-shrinkage convex portion 103 has not yet separated from the resin substrate 001. That is, the molding transfer surface 101 is relatively separated from the resin substrate 001 in the order of the fine structure 002 and the convex portion 103 for shrinkage.
- the anti-shrinkage convex portion 103 is not detached from the resin substrate 001 until the end, so that the force due to the shrinkage of the resin substrate 001 at the time of mold release It is received only by the convex portion 103 for contraction. Therefore, a large mold release deformation occurs in the anti-shrinkage convex portion 103.
- the microstructure 102 receives a force due to the contraction together with at least the anti-contraction convex portion 103, and the force received by the contraction is dispersed. Therefore, the mold release deformation in the microstructure 102 can be suppressed to a small value. .
- the molded resin substrate 001 is represented in FIG.
- the micro flow path 002 is a recess of the resin substrate 001
- the anti-shrink hole 004 is also a recess of the resin substrate 001.
- the fine channel 002 shown in FIG. 5 of the molded resin substrate 001 has almost no mold release deformation, the transfer property of the fine channel 002 is good, and the planarity near the fine channel 002 is It is good.
- the anti-shrinkage hole 004 of the resin substrate 001 shown in FIG. 5 has a large mold release deformation, and the flatness accuracy is low in the vicinity thereof.
- the deformation in the fine flow path 002 is preferably suppressed to within 5% with respect to the depth of the fine flow path 002, and more preferably within 3%. In the manufacturing method of the microchannel chip according to the present embodiment, it can be suppressed to 5% or less.
- the molded resin substrate 001 is joined to the other resin substrate molded with another mold.
- the other resin substrate is bonded to the range B of the resin substrate 001 (see FIG. 5).
- This range B corresponds to the range A in the micro-channel chip molding die 100 shown in FIG.
- the anti-shrink hole 004 is provided in a portion other than the joint surface (range B is located in a portion away from the anti-shrink hole 004). Thereby, the flatness of the joint surface is kept good. Therefore, the molded resin substrate 001 and the other resin substrate are bonded satisfactorily.
- Examples of the resin used for the resin substrate 001 include good moldability (transferability and releasability), high transparency, and low autofluorescence with respect to ultraviolet rays and visible light. It is not limited.
- polymethyl methacrylate and cyclic polyolefin are preferable. Note that the same material may be used for the resin substrate 001 and the other resin substrate bonded thereto, or different materials may be used.
- the anti-shrinkage convex portion 103 is arranged in a portion other than the joint surface.
- the joint surface It can also be placed inside.
- the anti-shrinkage convex portion 103 is simply disposed on a portion other than the joint surface.
- the anti-shrinkage convex portion 103 is separated from the runner portion 105. More preferably, it is arranged in the vicinity of the outer edge of the farthest molding transfer surface 101.
- the projection that does not penetrate as the anti-shrinkable convex portion 103 is described as being formed on the molding transfer surface 101 of the micro-channel chip molding die 100, but this projection may be penetrated.
- the fine channel chip forming mold 100 a mold having a molding transfer surface 101 on which the fine structure 102 is formed and a hole through which a pin for forming a through hole is formed on the resin substrate 001; It may be a mold configured with pins that pass through the holes. In this case, the pin becomes the anti-shrinkage convex portion 103.
- FIG. 6 is a schematic cross-sectional view of a state in which a resin is injected into a micro-channel chip molding die according to Modification 1.
- FIG. 7 is a schematic cross-sectional view when the fine flow path chip molding die according to Modification 1 is released from the molded resin substrate.
- a micro-channel chip molding die provided with a recess for anti-shrinkage will be described as a structure for suppressing mold release deformation of the micro-channel 002.
- the micro-channel chip molding die 100 according to Modification 1 has a counter-shrinkage recess 200 that faces in the opposite direction of the cavity.
- the length (depth) of the concave portion 200 for shrinkage in the opposite direction of the cavity is larger than the height L of the highest portion in the cavity direction in the microstructure 102.
- the anti-shrinkage recess 200 is provided in a portion other than the joint surface.
- the molding transfer surface 101 is relatively separated from the resin substrate 001 in the order of the fine structure 002 and the shrinking recess 200.
- this anti-shrinkage recess 200 is provided in a portion other than the joint surface, even if it undergoes a large deformation, it does not affect the flatness of the joint surface and the molding of the fine flow path 002. Therefore, it is possible to mold the resin substrate 001 that has the fine flow path 002 with high accuracy, the bonding surface has good flatness, and can be bonded to the other resin substrate with high accuracy.
- the anti-shrinkage concave portion 200 is disposed in a portion other than the joint surface. Is possible. Further, in this modification, the anti-shrinkage recess 200 is simply disposed at a portion other than the joint surface. However, in order to further reduce the influence of the shrinkage of the resin substrate 001, the anti-shrinkage recess 200 is farthest from the runner portion 105. More preferably, it is disposed near the outer edge of the molded transfer surface 101.
- the mold release deformation in the fine channel 002 can be suppressed to 5% or less of the fine channel 002.
- a result almost the same as the configuration in which the convex part is provided on the mold 100 is obtained.
- the accuracy of the micro-channel 002 and the flatness of the joining surface can be improved.
- FIG. 8 is a schematic cross-sectional view of a state in which a resin is injected into a micro-channel chip molding die according to Modification 2.
- FIG. 9 is a schematic cross-sectional view after release from the resin substrate on which the micro-channel chip molding die according to Modification 2 is molded.
- a fine channel chip molding die having a structure for absorbing mold release deformation in the anti-shrinking recess will be described.
- the micro-channel chip molding die 100 includes a counter deformation convex portion 300 at the boundary between the anti-shrinkage convex portion 103 and the molding transfer surface 101. It is.
- the description will be made assuming that the anti-shrinkage convex portion 103 is a circle having a depth of 60 ⁇ m and a size of 60 ⁇ m in the direction of the molding transfer surface.
- the anti-deformation convex portion 300 has a depth of 10 ⁇ m and a width of 10 ⁇ m in the direction of the molding transfer surface.
- the amount of swell in the mold-releasing deformation at the anti-contraction convex portion 103 having a depth of 10 ⁇ m and a width in the direction of the molding transfer surface of 60 ⁇ m is empirically determined to be 5 ⁇ m or less.
- the size of the anti-deformation convex portion 300 is set to the above-described size as the size to be absorbed. What is necessary is just to have a capacity substantially the same as the size of the raised portion. Further, the value obtained by subtracting the height in the cavity direction of the anti-deformation convex portion 300 from the height in the cavity direction of the anti-shrinkage convex portion 103 is the value of the height of the highest portion in the cavity direction in the microstructure 102. It is getting bigger.
- a recess (micro-channel) is formed on the resin substrate 001 in accordance with each microstructure 102 as shown in FIG.
- the inside of the anti-shrinkage convex portion 103 is filled with resin, and a protrusion is formed on the resin substrate 001 in a state where the anti-deformation convex portion 300 is recessed.
- mold release molding is performed by opening and separating the micro-channel chip molding die 100. In this mold release molding, a counter deformation recess 006 corresponding to the counter deformation convex portion 300 is formed in the opening of the anti-shrink hole 004.
- the anti-shrink hole 004 formed on the resin substrate 001 is formed. Is not detached from the anti-contraction convex portion 103.
- the resin swells due to deformation of the anti-shrink hole 004, and deformation 003 occurs as shown in FIG.
- the deformation 003 is housed in a counter deformation recess 006 formed in the opening of the counter contraction hole 004.
- the rising of the deformation 003 due to the mold release deformation of the anti-shrink hole 004 is absorbed by the anti-deformation recess 006 and does not affect the molding transfer surface 101.
- the mold release deformation in the anti-shrinking convex portion 103 is absorbed, the influence on the flatness of the molding transfer surface 101 is reduced.
- Example 1 a microchannel chip was manufactured by the method according to the above-described embodiment.
- the micro-channel chip molding die 100 was created.
- Resin material: PMMA Melting temperature t1 250 ° C.
- Mold release temperature t2 93 ° C Height of the highest part in the cavity direction in the microstructure 102 (depth of the deepest part of the fine channel 002)
- d1 50 ⁇ m Height of convex portion 103 for shrinkage
- Position of convex portion 103 for contraction 103 in FIG. It is.
- a micro-channel is formed on the surface of the plate-like member having a 30 mm square and a thickness of 1.5 mm.
- a resin substrate 001 in which 002 and anti-shrink holes 004 were formed was produced. (Evaluation) The deformation in the fine channel 002 with respect to the depth of the fine channel 002 is 4.5%. This is a good value of less than 5%. Further, the deformation in the anti-shrink hole 004 is 8.3%. This is a bad value of 5% or more.
- Example 2 the microchannel chip was manufactured by the method according to Modification 1.
- the micro-channel chip molding die 100 was created.
- d1 50 ⁇ m
- Position of concave portion 200 for shrinkage 200 in FIG. It is.
- a micro-channel is formed on the surface of the plate-like member having a 30 mm square and a thickness of 1.5 mm.
- a resin substrate 001 in which 002 and anti-shrink holes 004 were formed was produced. (Evaluation) The deformation in the fine channel 002 with respect to the depth of the fine channel 002 is 4.7%. This is a good value of less than 5%. Further, the deformation in the anti-shrink hole 004 is 8.3%. This is a bad value of 5% or more.
- the microchannel chip was manufactured by a conventional method (that is, a mold release method that does not use the anti-shrinking convex portion 103).
- a mold release method that does not use the anti-shrinking convex portion 103.
- the micro-channel chip molding die 100 was created.
- the deformation in the fine channel 002 with respect to the depth of the fine channel 002 is 8.3%. This is a bad value of 5% or more.
Abstract
Description
まず樹脂基板001の材料となる樹脂を、250℃~300℃の加熱により溶融する。そして、溶融された状態の樹脂基板001の材料となる樹脂を、ランナー部105を介して100度前後の微細流路チップ成形用金型100に流し込む。実際には微細流路チップ成形用金型100の温度はガラス転移点温度Tgと熱変形温度(荷重たわみ温度)HDTに基づいて、おおよそHDT程度の温度に決定される。このガラス転移点温度Tg以上では樹脂は固化しない。また、熱変形温度HDTでは、ある荷重をかけた場合に樹脂に一定量の変形がある温度である。そして、微細流路チップ成形用金型100のキャビティ104が流し込まれた樹脂で充填される。
樹脂基板001に用いられる樹脂としては、成形性(転写性、離型性)が良いこと、透明性が高いこと、紫外線や可視光に対する自己蛍光性が低いことなどが条件としてあげられるが、特に限定されるものではない。例えば、ポリカーボネート、ポリメタクリル酸メチル、ポリスチレン、ポリアクリロニトリル、ポリ塩化ビニル、ポリエチレンテレフタレート、ナイロン6、ナイロン66、ポリ酢酸ビニル、ポリ塩化ビニリデン、ポリプロピレン、ポリイソプレン、ポリエチレン、ポリジメチルシロキサン、環状ポリオレフィンなどが好ましい。特に、ポリメタクリル酸メチル、環状ポリオレフィンなどが好ましい。なお、樹脂基板001と、それに接合されるもう一方の樹脂基板とで、同じ材料を用いてもよいし、異なる材料を用いてもよい。
次に、上述した微細流路チップ製造方法及びそれに用いられる微細流路チップ成形用金型の変形例1について図6及び図7を参照して説明する。図6は変形例1に係る微細流路チップ成形用金型に樹脂を注入した状態の模式的な断面図である。また、図7は変形例1に係る微細流路チップ成形用金型を成形した樹脂基板から離型する時の模式的な断面図である。この変形例では微細流路002の離型変形を抑える構造として対収縮用凹部を備えた微細流路チップ成形用金型について説明する。
また、上述した微細流路チップ製造方法及びそれに用いられる微細流路チップ成形用金型の変形例2について図8及び図9を参照して説明する。図8は変形例2に係る微細流路チップ成形用金型に樹脂を注入した状態の模式的な断面図である。また、図9は変形例2に係る微細流路チップ成形用金型を成形した樹脂基板から離型した後の模式的な断面図である。この変形例では対収縮用凹部における離型変形を吸収する構造を備えた微細流路チップ成形用金型について説明する。
次に、具体的な実施例1について説明する。
樹脂素材:PMMA
溶融温度t1=250℃
離型温度t2=93℃
微細構造102の中でキャビティ方向における最も高い部分の高さ(微細流路002の最も深い部分の深さ)d1=50μm
対収縮用凸部103の高さd2=60μm
対収縮用凸部の大きさ=0.003mm2
対収縮用凸部103の位置=図3における103
である。
そして、その微細流路チップ成形用金型100を用いた射出成形機で透明樹脂材料のPMMAを成形することで、30mm角で厚さが1.5mmの板状部材の表面に、微細流路002と対収縮用孔004とが形成された樹脂基板001を作成した。
(評価)
微細流路002の深さに対する微細流路002における変形は4.5%となっている。これは5%未満であり良好な値である。また、対収縮用孔004における変形は8.3%となっている。これは、5%以上となり不良な値である。
次に、具体的な実施例2について説明する。
樹脂素材:PMMA
溶融温度:250℃
離型温度t=93℃
微細構造102の中でキャビティ方向における最も高い部分の高さ(微細流路002の最も深い部分の深さ)d1=50μm
対収縮用凹部200の長さd3=60μm
対収縮用凹部200の大きさ=0.003mm2
対収縮用凹部200の位置=図6における200
である。
そして、その微細流路チップ成形用金型100を用いた射出成形機で透明樹脂材料のPMMAを成形することで、30mm角で厚さが1.5mmの板状部材の表面に、微細流路002と対収縮用孔004とが形成された樹脂基板001を作成した。
(評価)
微細流路002の深さに対する微細流路002における変形は4.7%となっている。これは5%未満であり良好な値である。また、対収縮用孔004における変形は8.3%となっている。これは、5%以上となり不良な値である。
次に、具体的な比較例について説明する。
樹脂素材:PMMA
溶融温度:250℃
離型温度t=93℃
微細構造102の中でキャビティ方向における最も高い部分の高さ(微細流路002の最も深い部分の深さ)d1=50μm
である。
(評価)
微細流路002の深さに対する微細流路002における変形は8.3%となっている。これは5%以上となり不良な値である。
(比較結果)
上述のように、比較例では必要精度を満足しておらず、接合面の平面性が悪化している。これに対し、実施例1と実施例2では、必要精度を満足しており、接合面の平面性が良好に保たれている。したがって、実施例の方法で微細流路チップを製造した方が、より、精度の高い微細流を有し、接合性のよい微細流路チップを製造することが可能である。
002 微細流路
003 変形
004 対収縮用孔
005 対収縮用突起
006 対変形用凹部
100 微細流路チップ成形用金型
101 成形転写面
102 微細構造
103 対収縮用凸部
104 キャビティ
105 ランナー部
200 対収縮用凹部
300 対変形用凸部
Claims (12)
- 溶融した樹脂を収容可能なキャビティと、該キャビティを形成する一つの面に該面から前記キャビティ側に突出するように設けられた微細構造と、前記面から前記キャビティ側に向けて前記微細構造よりも高く突出した凸部と、を備えた金型に溶融した樹脂を注入し、
注入した樹脂が固化して形成された樹脂基板から前記金型の前記面を、前記微細構造、前記凸部の順に、相対的に離脱させ、前記樹脂基板を利用して微細流路チップを製造することを特徴とする微細流路チップ製造方法。 - 前記樹脂基板における前記微細構造が転写された部分を覆い、かつ前記凸部により形成される孔から離れた部分に位置するように、前記樹脂基板に他の樹脂基板を接合させることを特徴とする請求項1に記載の微細流路チップ製造方法。
- 前記凸部は、前記金型に設けられた前記キャビティへ溶融した樹脂を注入する注入口から最も離れた前記面の外縁付近に配置されることを特徴とする請求項1又は請求項2に記載の微細流路チップ製造方法。
- 溶融した樹脂を収容可能なキャビティと、該キャビティを形成する一つの面に該面から前記キャビティ側に突出するように設けられた微細構造と、該微細構造の突出方向と反対方向に前記微細構造の高さよりも深く設けられた凹部と、を備えた金型に溶融した樹脂を注入し、
注入した樹脂が固化して形成された樹脂基板から前記金型の前記面を、前記微細構造、前記凹部の順に、相対的に離脱させ、前記樹脂基板を利用して微細流路チップを製造することを特徴とする微細流路チップ製造方法。 - 前記樹脂基板における前記微細構造が転写された部分を覆い、かつ前記凹部により形成される突出部から離れた部分に位置するように、前記樹脂基板に他の樹脂基板を接合させることを特徴とする請求項4に記載の微細流路チップ製造方法。
- 前記凹部は、前記金型に設けられた前記キャビティへ溶融した樹脂を注入する注入口から最も離れた前記面の外縁付近に配置されることを特徴とする請求項4又は請求項5に記載の微細流路チップ製造方法。
- 少なくとも2つの樹脂基板のうち、一方の樹脂基板の表面には微細流路用溝が形成され、前記2つの樹脂基板を、前記微細流路用溝が形成された面を内側にして接合される微細流路チップの前記微細流路用溝が形成された樹脂基板を成形するための微細流路チップ成形用金型であって、
前記微細流路用溝が形成された樹脂基板を形成するための溶融した樹脂を収容可能なキャビティと、
該キャビティを形成する一つの面に該面から前記キャビティ側に突出するように設けられた微細構造と、
前記面から前記キャビティ側に向けて前記微細構造よりも高く突出する凸部と、
を備えたことを特徴とする微細流路チップ成形用金型。 - 前記凸部は、前記2つの樹脂基板が接合される面以外の部分に設けられていることを特徴とする請求項7に記載の微細流路チップ成形用金型。
- 少なくとも2つの樹脂基板のうち、一方の樹脂基板の表面には微細流路用溝が形成され、前記2つの樹脂基板を、前記微細流路用溝が形成された面を内側にして接合される微細流路チップの前記微細流路用溝が形成された樹脂基板を成形するための微細流路チップ成形用金型であって、
前記微細流路用溝が形成された樹脂基板を形成するための溶融した樹脂を収容可能なキャビティと、
該キャビティを形成する一つの面に該面から前記キャビティ側に突出するように設けられた微細構造と、
該微細構造の突出方向と反対方向に前記微細構造の高さよりも深く設けられた凹部と、
を備えたことを特徴とする微細流路チップ成形用金型。 - 前記凹部は、前記2つの樹脂基板が接合される面以外の部分に設けられていることを特徴とする請求項9に記載の微細流路チップ成形用金型。
- 2つの樹脂基板のうち少なくとも1つの樹脂基板の表面には液体が導入される微細流路が溶融した樹脂を射出する射出成形によって形成され、前記2つの樹脂基板を、前記微細流路が形成されている面を内側にして接合された微細流路チップであって、
前記微細流路が形成された前記樹脂基板の微細流路形成面には、前記微細流路以外の位置に、前記微細流路の深さ方向の最大長さよりも長く形成された凹部が形成されている、
ことを特徴とする微細流路チップ。 - 前記2つの樹脂基板は、前記微細構造が転写された部分を覆い、かつ前記凹部から離れた部分で接合されていることを特徴とする請求項11に記載の微細流路チップ。
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US13/059,494 US8377362B2 (en) | 2008-08-20 | 2009-08-17 | Method for manufacturing micro-channel, die for molding micro-channel chip, and micro-channel chip |
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KR100719238B1 (ko) * | 2006-04-10 | 2007-05-18 | 에스케이씨 주식회사 | 마이크로 입자 계수용 플라스틱 마이크로 칩과 그 제조방법 |
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2009
- 2009-08-17 US US13/059,494 patent/US8377362B2/en not_active Expired - Fee Related
- 2009-08-17 EP EP09808242.3A patent/EP2314436B1/en not_active Not-in-force
- 2009-08-17 CN CN200980131567.XA patent/CN102123838B/zh not_active Expired - Fee Related
- 2009-08-17 WO PCT/JP2009/064388 patent/WO2010021306A1/ja active Application Filing
- 2009-08-17 KR KR1020117003564A patent/KR20110046475A/ko not_active Application Discontinuation
- 2009-08-17 JP JP2010525685A patent/JPWO2010021306A1/ja not_active Withdrawn
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010247535A (ja) * | 2009-03-25 | 2010-11-04 | Kagawa Univ | マイクロニードルおよびその製造方法と金型 |
JP2018537978A (ja) * | 2015-12-11 | 2018-12-27 | エムビーディー カンパニー リミテッド | バイオチップ用ピラー構造体 |
US11266983B2 (en) | 2015-12-11 | 2022-03-08 | MBD Co., Ltd. | Pillar structure for biochip |
Also Published As
Publication number | Publication date |
---|---|
EP2314436A4 (en) | 2013-05-22 |
KR20110046475A (ko) | 2011-05-04 |
US20110133364A1 (en) | 2011-06-09 |
US8377362B2 (en) | 2013-02-19 |
EP2314436B1 (en) | 2015-04-01 |
JPWO2010021306A1 (ja) | 2012-01-26 |
EP2314436A1 (en) | 2011-04-27 |
CN102123838A (zh) | 2011-07-13 |
CN102123838B (zh) | 2014-05-07 |
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