WO2009125510A1 - 加速度センサ - Google Patents
加速度センサ Download PDFInfo
- Publication number
- WO2009125510A1 WO2009125510A1 PCT/JP2008/069522 JP2008069522W WO2009125510A1 WO 2009125510 A1 WO2009125510 A1 WO 2009125510A1 JP 2008069522 W JP2008069522 W JP 2008069522W WO 2009125510 A1 WO2009125510 A1 WO 2009125510A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- axis
- torsion
- detection
- substrate
- acceleration sensor
- Prior art date
Links
- 230000001133 acceleration Effects 0.000 title claims abstract description 154
- 238000001514 detection method Methods 0.000 claims abstract description 303
- 239000000758 substrate Substances 0.000 claims abstract description 104
- 239000003990 capacitor Substances 0.000 description 44
- 238000006073 displacement reaction Methods 0.000 description 24
- 230000007423 decrease Effects 0.000 description 18
- 230000005484 gravity Effects 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229920005591 polysilicon Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 239000005360 phosphosilicate glass Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 3
- 238000004092 self-diagnosis Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0032—Packages or encapsulation
- B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
- B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0888—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values for indicating angular acceleration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/14—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of gyroscopes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
- G01P3/02—Devices characterised by the use of mechanical means
- G01P3/16—Devices characterised by the use of mechanical means by using centrifugal forces of solid masses
- G01P3/22—Devices characterised by the use of mechanical means by using centrifugal forces of solid masses transferred to the indicator by electric or magnetic means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0242—Gyroscopes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
- G01P2015/0825—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass
- G01P2015/0831—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass for one single degree of freedom of movement of the mass the mass being of the paddle type having the pivot axis between the longitudinal ends of the mass, e.g. see-saw configuration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
Definitions
- the present invention relates to an acceleration sensor, for example, a capacitance type acceleration sensor.
- an acceleration sensor As one of the principles of an acceleration sensor that detects acceleration in the thickness direction of a conventional substrate, there is a method of detecting a change in electrostatic capacity accompanying acceleration.
- an acceleration sensor according to this method for example, an acceleration provided with a torsion beam (flexible portion), an inertial mass body (weight), a detection frame (element), and a detection electrode (detection electrode) as main components.
- a sensor acceleration sensing motion converter
- Patent Document 1 Japanese Patent Laid-Open No. 5-133976
- the acceleration sensor of Patent Document 1 has one detection frame having a surface facing the substrate.
- An inertia mass body is provided on one end of the detection frame.
- the detection frame is supported on the substrate so that the detection frame can be rotated about the torsion beam.
- a detection electrode for detecting this rotational displacement is provided below the detection frame.
- Patent Document 2 there is known an acceleration sensor in which an inertial mass body is arranged not on a detection frame but on the same plane as the detection frame (see, for example, International Publication No. WO2003 / 044539 (Patent Document 2)).
- the acceleration sensor of Patent Document 2 includes a torsion beam, an inertial mass body (mass body), a detection frame (movable electrode), and a detection electrode (first and second fixed electrodes).
- the torsion beam is connected to an anchor portion supported by the substrate.
- One detection frame (movable electrode) is connected to the torsion beam, and is supported on the substrate so as to be rotatable about the torsion beam.
- Link beams are provided at one end and the other end of the detection frame at positions separated from the center line of the detection frame by a predetermined distance.
- An inertia mass body mass body
- the inertial mass body is configured to be movable in accordance with the acceleration in the thickness direction of the silicon substrate.
- an inertial force in the substrate thickness direction acts on the inertial mass body.
- the inertia mass body is provided on one end, that is, at a position having a deviation from the rotation axis in the in-plane direction of the substrate. For this reason, this inertial force acts on the detection frame as a torque around the torsion beam. As a result, the detection frame is rotationally displaced.
- the acceleration sensors of Patent Documents 1 and 2 are usually package-sealed by molding with a resin material.
- the thermal characteristics of the material constituting the acceleration sensor and the resin material are different, when molding is performed, the shape of the package is deformed due to thermal contraction of each material, and the package warps.
- the substrate that supports the acceleration sensor disposed inside may warp.
- the output of the acceleration sensor fluctuates before and after packaging. Furthermore, when the shape of the package changes over time, the output of the acceleration sensor also varies with time.
- an object of the present invention is to provide an acceleration sensor with improved accuracy by reducing the influence of substrate warpage.
- the acceleration sensor of the present invention includes a substrate, a first torsion beam, a first detection frame, a second torsion beam, a second detection frame, first and second detection electrodes, a first link beam, A two-link beam and an inertial mass body are provided.
- the first torsion beam can be twisted about the first torsion axis and is supported on the substrate.
- the first detection frame is supported on the substrate via the first torsion beam so as to be rotatable about the first torsion axis.
- the second torsion beam can be twisted about the second torsion axis and is supported by the substrate.
- the second detection frame is supported on the substrate via the second torsion beam so as to be rotatable about the second torsion axis.
- the first and second detection electrodes are formed on the substrate so as to face each of the first and second detection frames, and detect the angle of the first and second detection frames with respect to the substrate by capacitance.
- the first link beam is connected to the first detection frame on the first axis obtained by moving the first torsion axis to the one end side of the first detection frame along the direction intersecting the first torsion axis.
- the second link beam is connected to the second detection frame on the second axis that has moved the second torsion axis in the same direction as the movement direction of the first torsion axis.
- the inertial mass body is supported on the substrate so as to be displaceable in the thickness direction of the substrate by being connected to each of the first and second detection frames by the first and second link beams.
- the first link beam is located on the first axis obtained by moving the first torsion axis to the one end side of the first detection frame along the direction intersecting the first torsion axis.
- One detection frame is connected.
- the second link beam is connected to the second detection frame on the second axis obtained by moving the second torsion axis in the same direction as the movement direction.
- the first and second detection frames are rotationally displaced in directions opposite to each other.
- the increase / decrease in the capacitance of the capacitor constituted by the first detection frame and the first detection electrode and the increase / decrease in the capacitance of the capacitor constituted by the second detection frame and the second detection electrode are mutually. Displaces in the opposite direction. Therefore, when the substrate is warped, the capacitance of the capacitor constituted by the first detection frame and the first detection electrode and the capacitance of the capacitor constituted by the second detection frame and the second detection electrode Displacement can be offset each other.
- FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1. It is sectional drawing which shows roughly a mode when the acceleration is applied to the acceleration sensor in Embodiment 1 of this invention upward along the film thickness direction of a board
- FIG. 1 It is a top view which shows roughly the structure of the acceleration sensor in a comparative example. It is sectional drawing which shows roughly a mode that the board
- FIG. 1 is a top view schematically showing the configuration of the acceleration sensor according to Embodiment 1 of the present invention.
- FIG. 2 is a schematic cross-sectional view taken along the line II-II in FIG.
- coordinate axes X-axis, Y-axis, and Z-axis are introduced.
- the X axis is a positive axis in the right direction along the horizontal direction
- the Y axis is a positive axis in the upward direction along the vertical direction
- the Z axis is perpendicular to the paper surface and above the paper surface. Is the positive axis.
- the direction of the Z axis coincides with the acceleration direction to be measured by the acceleration sensor of the present embodiment.
- the acceleration sensor of the present embodiment mainly includes a substrate 1, first and second torsion beams 11 and 12, first and second detection frames 21 and 22, A plurality of detection electrodes, first and second link beams 31, 32, an inertial mass body 2, and an actuation electrode 5 are provided.
- a silicon substrate can be used.
- materials of the first and second torsion beams 11 and 12, the first and second detection frames 21 and 22, the first and second link beams 31 and 32, the inertia mass body 2, the detection electrode, and the actuation electrode 5 A polysilicon film can be used. This polysilicon film desirably has low stress and no stress distribution in the thickness direction.
- the first torsion beam 11 is supported by an anchor 91 provided on the substrate 1 so that it can be twisted around the first torsion axis T1 along the X axis.
- the first detection frame 21 is supported by the substrate 1 via the first torsion beam 11 so as to be rotatable about the first torsion axis T1. Further, at least a part of the first detection frame 21 has conductivity.
- the second torsion beam 12 is supported by an anchor 92 provided on the substrate 1 so that it can be twisted around the second torsion axis T2 along the X axis.
- the second detection frame 22 is supported by the substrate 1 via the second torsion beam 12 so as to be rotatable about the second torsion axis T2. Further, at least a part of the second detection frame 22 has conductivity.
- the plurality of detection electrodes include a first detection electrode 41 and a second detection electrode 42.
- the first and second detection frames 41 and 42 are arranged so that the angles of the first and second detection frames 21 and 22 with respect to the substrate 1 can be detected by capacitance.
- An insulating film 3 is formed on the substrate 1 so as to face each of 22.
- the insulating film 3 is preferably a low stress silicon nitride film or silicon oxide film.
- the actuation electrode 5 is formed on the substrate 1 via the insulating film 3 so as to face the inertial mass 2 so that the inertial mass 2 can be displaced by electrostatic force.
- the first link beam 31 has a first axis on a first axis L1 that is moved by an offset e1 toward one end of the first detection frame 21 along a direction in which the first torsion axis T1 intersects the first torsion axis T1.
- a detection frame 21 is connected.
- the “offset” means a value representing the position by a difference (distance) from the reference point. That is, the absolute value of the offset e1 is the dimension between the first torsion axis T1 and the first link beam 31, and the direction of the offset e1 intersects the first torsion axis T1 and is the first to the first torsion axis T1. The direction is toward the axis L1.
- the second link beam 32 moves to the second detection frame 22 on the second axis L2 in which the second torsion axis T2 is shifted in the same direction as the movement direction, that is, the offset e2 in the same direction as the offset e1. It is connected. That is, the absolute value of the offset e2 is a dimension between the second torsion axis T2 and the second link beam 32, and the direction of the offset e2 is the same direction as the offset e1.
- the first and second torsion beams 11 and 12 and the first and second link beams 31 and 32 are arranged so that the offsets e1 and e2 are equal.
- first and second torsion axes T1, T2 are parallel to each other. That is, the first and second torsion beams 11 and 12 are arranged in parallel to each other, and the first and second link beams 31 and 32 are arranged in parallel to each other.
- the inertial mass body 2 is supported on the substrate 1 so as to be displaceable in the thickness direction of the substrate 1 by being connected to the first and second detection frames 21 and 22 by the first and second link beams 31 and 32, respectively. Has been.
- the plurality of detection electrodes have a first detection electrode 41 facing the first detection frame 21.
- the first detection electrode 41 includes first detection electrodes 41a and 41b so as to sandwich the first twist axis T1.
- the first detection electrode 41a is located on the outer circumference side (upper side in FIG. 1) of the acceleration sensor, and the first detection electrode 41b is located on the inner circumference side (center side in FIG. 1) of the acceleration sensor.
- the first detection electrodes 41a and 41b are provided so as to sandwich the first torsion axis T1.
- the back surface (the surface facing the detection electrode 41) of the first detection frame 21 approaches one of the detection electrodes 41a and 41b and from the other Move away. For this reason, the difference between the capacitance generated when the first detection frame 21 faces the detection electrode 41a and the capacitance formed when the first detection frame 21 faces the detection electrode 41b is calculated. By detecting, the angle of the first detection frame 21 with respect to the substrate 1 can be detected.
- the plurality of detection electrodes have a second detection electrode 42 facing the second detection frame 22.
- the second detection electrode 42 includes second detection electrodes 42a and 42b so as to sandwich the second torsion axis T2.
- the second detection electrode 42a is located on the inner circumference side (center side in FIG. 1) of the acceleration sensor, and the second detection electrode 42b is located on the outer circumference side (lower side in FIG. 1).
- the second detection electrodes 42a and 42b are provided so as to sandwich the second torsion axis T2.
- the back surface of the second detection frame 22 (the surface facing the detection electrode 42) approaches one of the second detection electrodes 42a and 42b, Move away from the other. For this reason, the electrostatic capacitance generated when the second detection frame 22 faces the second detection electrode 42a and the electrostatic capacitance formed when the second detection frame 22 faces the second detection electrode 42b. Is detected, the angle of the second detection frame 22 with respect to the substrate 1 can be detected.
- the planar layout of the acceleration sensor has a line-symmetric structure with respect to an axis B extending in a direction parallel to the first and second torsion axes T1 and T2, except for the first and second link beams 31 and 32.
- the center of gravity G of the inertial mass body 2 is located on the axis B.
- the plane layout of the acceleration sensor has a line-symmetric structure with respect to the axis A extending in the direction intersecting the first and second torsion axes T1, T2, and the center of gravity G of the inertial mass body 2 is the axis A. Located on the top.
- FIG. 3 is a cross-sectional view schematically showing a state in which acceleration is applied upward along the film thickness direction of the substrate with respect to the acceleration sensor according to the first embodiment of the present invention. 3 is the same as that in FIG. Further, in FIG. 3, the anchors 91 and 92 are not shown for easy understanding of the drawing.
- the inertial mass body 2 when an acceleration az in the upward direction along the film thickness direction of the substrate, that is, in the positive direction of the Z axis (upward in the figure) is applied to the acceleration sensor, the inertial mass body 2 is moved to the initial position by the inertial force. It is displaced so as to sink in the negative direction of the Z-axis (downward in the figure) from the position indicated by the broken line in the figure.
- the first and second link beams 31 and 32 connected to the inertial mass body 2 are also displaced integrally with the inertial mass body in the negative direction of the Z-axis (downward in the figure).
- the first detection frame 21 Due to the displacement of the first link beam 31, the first detection frame 21 receives a force in the negative direction (downward in the figure) of the Z axis at the portion of the first axis L1. Since the first axis L1 is in a position translated from the first torsion axis T1 by an offset e1, torque about the first axis L1 acts on the first detection frame 21. As a result, the first detection frame 21 is rotationally displaced.
- the second detection frame 22 receives a force in the negative direction of the Z axis (downward in the figure) at the portion of the second axis L2. Since the second axis L2 is in a position translated from the second torsion axis T2 by the offset e2, a torque about the second axis L2 acts on the second detection frame 22. As a result, the second detection frame 22 is rotationally displaced.
- the first detection frame 21 and the second detection frame 22 rotate in the same direction. That is, the upper surface of the first detection frame 21 faces one end side (right side in FIG. 3) of the acceleration sensor, and the upper surface of the second detection frame 22 also faces one end side (right side in FIG. 3) of the acceleration sensor. Further, the first and second detection frames 21 and 22 are rotationally displaced.
- the capacitance C 1a of the capacitor C1a constituted by the first detection frame 21 and the detection electrode 41a increases, and the static of the capacitor C1b constituted by the first detection frame 21 and the detection electrode 41b is increased.
- the capacitance C 1b decreases.
- the capacitance C 2a of the capacitor C2a formed by the second detection frame 22 and the detection electrode 42a increases, and the capacitance C 2b of the capacitor C2b formed by the second detection frame 22 and the detection electrode 42b increases. Decrease.
- FIG. 4 is a circuit diagram illustrating electrical connection of capacitors formed by the first and second detection frames and the detection electrodes of the acceleration sensor according to Embodiment 1 of the present invention.
- capacitors C1a and C2a are connected in parallel, and capacitors C1b and C2b are connected in parallel. These two parts connected in parallel are further connected in series.
- the thus formed circuit of a capacitor C1a, the end portion of C2a side constant potential V d is applied, the capacitor C1b, an end portion of C2b side is grounded.
- the series connection portion is provided with a terminal, and the output potential Vout of this terminal can be measured.
- This output potential V out has the following value.
- the acceleration sensor can be provided with a function of self-diagnosis whether the sensor has failed without actually applying acceleration az to the acceleration sensor.
- FIG. 5 is a cross-sectional view schematically showing a state in which the substrate 1 warps convexly with respect to the acceleration sensor according to Embodiment 1 of the present invention. 5 is the same as that in FIG. Further, in FIG. 5, the anchors 91 and 92 are omitted for easy understanding of the drawing.
- the first and second detection frames 21 and 22 are positioned perpendicular to the anchors 91 and 92 (positions indicated by dotted lines in FIG. 5).
- the inertial mass body 2 and the first and second detection frames 21 and 22 are connected.
- the first and second detection frames are arranged in a direction (in the direction of the arrow in FIG.
- the capacitance C 1a of the capacitor C1a formed by the first detection frame 21 and the first detection electrode 41a decreases.
- the capacitance C 1b of the capacitor C 1b formed by the first detection frame 21 and the first detection electrode 41b increases.
- the capacitance C 2a of the capacitor C2a constituted by the second detection frame 22 and the first detection electrode 42a increases, and the capacitance of the capacitor C2b constituted by the second detection frame 22 and the first detection electrode 42b increases.
- the capacity C 2b decreases.
- FIG. 6 is a top view schematically showing the configuration of the acceleration sensor in the comparative example.
- FIG. 7 is a cross-sectional view schematically showing a state in which the substrate 1 warps convexly with respect to the acceleration sensor in the comparative example. 7 is the same as that in FIG. Further, in FIG. 7, the anchors 91 and 92 are omitted for easy understanding of the drawing.
- the first and second detection frames 21 and 22 of the acceleration sensor of the comparative example perform substantially the same operation.
- the first and second axes L1 and L2 are located in different directions from the first and second torsion axes T1 and T2, respectively, as shown in FIG. 7, the second detection electrodes 42a and 42b are arranged. Is reversed.
- the capacitance C 1a of the capacitor C1a formed by the first detection frame 21 and the detection electrode 41a decreases, and the first The capacitance C 1b of the capacitor C 1b constituted by the detection frame 21 and the detection electrode 41b increases.
- the capacitance C 2a of the capacitor C2a formed by the second detection frame 22 and the detection electrode 42a decreases, and the capacitance C 2b of the capacitor C2b formed by the second detection frame 22 and the detection electrode 42b. Will increase.
- 8 to 12 are schematic cross-sectional views sequentially showing first to fifth steps of the method of manufacturing the acceleration sensor according to the first embodiment of the present invention, and the cross-sectional positions thereof correspond to the cross-sectional positions of FIG. .
- insulating film 3 is deposited on substrate 1 made of silicon by LPCVD (Low Pressure Chemical Vapor Deposition) method.
- LPCVD Low Pressure Chemical Vapor Deposition
- a low-stress silicon nitride film or silicon film is suitable.
- a conductive film made of, for example, polysilicon is deposited on the insulating film 3 by LPCVD.
- the conductive film is patterned to form a plurality of detection electrodes and actuation electrodes 5.
- a PSG (Phosphosilicate Glass) film 101 is deposited on the entire substrate 1.
- the PSG film 101 in the portion where the anchors 91 and 92 (see FIG. 2) are formed is selectively removed.
- a polysilicon film 102 is deposited on the entire substrate 1. Subsequently, a CMP (Chemical Mechanical Polishing) process is performed on the surface.
- CMP Chemical Mechanical Polishing
- the surface of polysilicon film 102 is planarized by the CMP process.
- the acceleration sensor has a planar layout in which the offsets e1 and e2 are in the same direction. Therefore, when the substrate 1 is warped as shown in FIG. 5, in the electric circuit shown in FIG. 4, the capacitance changes of the capacitors C1a and C2b and the capacitors C1b and C2a are substantially the same. Therefore, the fluctuation of the value shown in Expression (1) is suppressed. In other words, the influence of the warp of the substrate 1 on the output potential Vout can be suppressed. Therefore, when detecting the acceleration az from the output potential Vout, it is possible to suppress the occurrence of a detection error due to the warping of the substrate.
- the inertial mass body 2 serving as a movable part, the first and second link beams 31, 32, the first and second detection frames 21, 22, and the first and first Two torsion beams 11 and 12 are collectively formed from films made of the same material. Therefore, since there is no joint part of different materials in the movable part, there is no occurrence of distortion caused by the difference in thermal expansion coefficient of different materials. For this reason, the acceleration sensor which can suppress temperature dependence is realizable.
- the offsets e1 and e2 shown in FIG. 1 have the same absolute value.
- the first and second torsion axes T1 and T2 shown in FIG. 1 are parallel to each other. For this reason, the rotational displacement amounts of the first and second detection frames 21 and 22 are equal. Therefore, the capacitance changes of the capacitors C1a, C1b, C2a and C2b shown in FIG. 4 are performed with higher accuracy. For this reason, the error of the acceleration sensor can be further suppressed.
- FIG. 13 is a top view schematically showing a configuration of the acceleration sensor according to the second embodiment of the present invention.
- the acceleration sensor in the present embodiment basically has the same configuration as the acceleration sensor in the first embodiment shown in FIG. 1, but the configuration of the acceleration sensor in the first embodiment with reference to FIG.
- third and fourth torsion beams 13 and 14, third and fourth detection frames 23 and 24, and third and fourth link beams 33 and 34 are provided. That is, the acceleration sensor according to the present embodiment includes the first unit 10, the second unit 20, the third unit 30, and the fourth unit 40.
- Each of the first to fourth units 10, 20, 30, 40 includes first to fourth torsion beams 11 to 14, first to fourth detection frames 21 to 24, and first to fourth link beams 31.
- first to fourth detection electrodes 41 to 44, and anchors 91 to 94 To 34, first to fourth detection electrodes 41 to 44, and anchors 91 to 94.
- the third torsion beam 13 is supported by an anchor 93 provided on the substrate 1 so that it can be twisted around the first torsion axis T1. That is, the third torsion axis that becomes the center at which the third torsion beam 13 is twisted is the first torsion axis T1.
- the third detection frame 23 is supported on the substrate 1 via the third torsion beam 13 so as to be rotatable about the first torsion axis T1. Further, at least a part of the third detection frame 23 has conductivity.
- the fourth torsion beam 14 is supported by an anchor 94 provided on the substrate 1 so that it can be twisted around the second torsion axis T2. That is, the fourth torsion axis serving as the center at which the fourth torsion beam 13 is twisted is the second torsion axis T2.
- the fourth detection frame 24 is supported by the substrate 1 via the fourth torsion beam 14 so as to be rotatable about the second torsion axis T2. Further, at least a part of the fourth detection frame 24 has conductivity.
- the plurality of detection electrodes further include a third detection electrode 43 and a fourth detection electrode 44.
- the third detection electrode 43 includes third detection electrodes 43a and 43b facing the third detection frame 23 so that the angle of the third detection frame 23 with respect to the substrate 1 can be detected by capacitance.
- the third detection electrodes 43 a and 43 b are formed on the substrate 1 via the insulating film 3 so as to face each of the third detection frames 23.
- the plurality of fourth detection electrodes 44 include fourth detection electrodes 44a and 44b facing the fourth detection frame 24 so that the angle of the fourth detection frame 24 with respect to the substrate 1 can be detected.
- the fourth detection electrodes 44 a and 44 b are formed on the substrate 1 via the insulating film 3 so as to face each of the fourth detection frames 24.
- the third link beam 33 is connected to the third detection frame 23 on the third axis L3.
- the third axis L3 is a position shifted in parallel to the first torsion axis T1 by an offset e3 in the negative direction of the Y axis. That is, the direction of the offset e3 is opposite to the direction from the first torsion axis T1 toward the first axis L1 (the direction of the offset e1).
- the absolute value of the offset e3 is equal to the offset e1.
- the fourth link beam 34 is connected to the fourth detection frame 23 on the fourth axis L4.
- the fourth axis L4 is a position shifted in parallel to the second torsion axis T2 by an offset e4 in the negative direction of the Y axis. That is, the direction of the offset e4 is opposite to the direction from the second torsion axis T2 toward the second axis L2 (the direction of the offset e2).
- the absolute value of the offset e4 is equal to the offset e2.
- the inertial mass body 2 is connected to each of the first to fourth detection frames 21 to 24 via the first to fourth link beams 31 to 34, so that the thickness of the substrate 1 is increased on the substrate 1. It is supported so that it can be displaced.
- the third detection frame 23 is connected to the anchor 93 by the third torsion beam 13, and the third link beam 33 is connected to the inertia mass body 2 by the third axis L3.
- the fourth detection frame 24 is connected to the anchor 94 by the fourth torsion beam 14, and the fourth link beam 34 is connected to the inertia mass body 2 by the fourth axis L4.
- FIG. 14 is a cross-sectional view schematically showing a state in which acceleration is applied upward along the film thickness direction of the substrate with respect to the acceleration sensor according to the second embodiment of the present invention.
- 14 is a schematic sectional view taken along line XIV-XIV in FIG. Further, in FIG. 14, the anchors 91 and 92 are not shown for easy understanding of the drawing.
- inertial mass body 2 when acceleration az in the upward direction along the film thickness direction of substrate 1, that is, in the positive direction of the Z-axis (upward in the drawing) is applied to the acceleration sensor, inertial mass body 2 is initialized by inertial force. It is displaced from the position (the position indicated by the broken line in the figure) so as to sink in the negative direction of the Z axis (downward in the figure).
- the first and second link beams 31 and 32 connected to the inertial mass body 2 are also displaced integrally with the inertial mass body in the negative direction of the Z-axis (downward in the figure).
- the first detection frame 21 Due to the displacement of the first link beam 31, the first detection frame 21 receives a force in the negative direction (downward in the figure) of the Z axis at the portion of the first axis L1. Since the first axis L1 is in a position translated from the first torsion axis T1 by an offset e1, torque acts on the first detection frame 21. As a result, the first detection frame 21 is rotationally displaced.
- the fourth detection frame 24 receives a force in the negative direction of the Z axis (downward in the figure) at the portion of the fourth axis L4. Since the fourth axis L4 is in a position translated from the second torsion axis T2 by the offset e4, torque acts on the second detection frame 22. As a result, the second detection frame 22 is rotationally displaced.
- the first detection frame 21 and the fourth detection frame 24 rotate in opposite directions. That is, the upper surface of the first detection frame 21 faces one end side (the right side in FIG. 14) of the acceleration sensor, and the upper surface of the fourth detection frame 24 is the other end (center) side of the acceleration sensor (the left side in FIG. 14).
- the first and fourth detection frames 21 and 24 are rotationally displaced so as to face.
- the capacitance C 1a of the capacitor C1a constituted by the first detection frame 21 and the detection electrode 41a increases, and the capacitor C4b constituted by the fourth detection frame 24 and the fourth detection electrode 44b.
- the electrostatic capacitance C 4b is reduced.
- the capacitance C 4a of the capacitor C4a constituted by the fourth detection frame 24 and the fourth detection electrode 44a increases, and the capacitance of the capacitor C2b constituted by the fourth detection frame 24 and the fourth detection electrode 44b increases.
- the capacity C 2b decreases.
- the first detection frame 21 and the second detection frame 22 can also detect the acceleration az. Further, the acceleration az can be detected by the third detection frame and the fourth detection frame.
- FIG. 15 is a cross-sectional view schematically showing a state when angular acceleration is applied around the X axis to the acceleration sensor according to the second embodiment of the present invention.
- the cross-sectional position in FIG. 15 is the same as that in FIG. Further, in FIG. 15, the anchors 91 and 92 and the center inertia mass body 2 are not shown in order to make the drawing easy to see.
- inertial mass body 2 when inertial mass body 2 receives negative angular acceleration a ⁇ in the X-axis direction, rotational displacement is caused in the direction opposite to angular acceleration a ⁇ from the initial position (the position indicated by the broken line in the figure) due to the moment of inertia. Then tilt.
- the first detection frame 21 is lifted by the portion of the axis L1 of the first link beam 31, and is rotated about the first torsion axis T1.
- the fourth detection frame 24 is pushed down by the portion of the fourth axis L4 of the fourth link beam 34 and rotated about the second torsion axis T2.
- the capacitance C 1a of the capacitor C1a formed by the first detection frame 21 and the detection electrode 41a decreases, and the first detection frame 21 and the detection electrode
- the capacitance C 1b of the capacitor C1b constituted by 41b increases.
- the capacitance C 4a of the capacitor C4a configured by the fourth detection frame 24 and the detection electrode 44a increases, and the capacitance C 4b of the capacitor C4b configured by the fourth detection frame 24 and the detection electrode 44b increases. Decrease.
- FIG. 16 shows a capacitor formed by the first, second, third and fourth detection frames of the acceleration sensor according to the second embodiment of the present invention and the first, second, third and fourth detection electrodes. It is a circuit diagram explaining electrical connection.
- capacitors C1a, C2a, C3a, and C4a are connected in parallel, and capacitors C1b, C2b, C3b, and C4b are connected in parallel. These two parts connected in parallel are further connected in series.
- the thus formed circuit capacitors C1a, C2a, C3a, constant potential V d is applied to an end portion of C4a side capacitor C1b, C2b, C3b, the end of the C4b side is grounded.
- the series connection portion is provided with a terminal, and the output potential Vout of this terminal can be measured.
- This output potential V out has the following value.
- the acceleration az in the Z-axis direction can be detected by measuring the output potential Vout .
- FIG. 17 is a cross-sectional view schematically showing a state in which an angular velocity is applied to an axis slightly inclined from the Y axis with respect to the acceleration sensor according to the second embodiment of the present invention. 17 is the same as that in FIG. In FIG. 17, the anchors 91 and 92 and the center inertia mass body 2 are not shown for easy understanding of the drawing.
- the centrifugal force accompanying the rotation of the angular velocity ⁇ acts on the inertial mass body 2. For this reason, the inertial mass body 2 is tilted from the initial position (the position indicated by the broken line in the drawing) in a direction in which the end of the inertial mass body 2 moves away from the rotation axis of the angular velocity ⁇ .
- the inclination of the inertial mass body 2 is the same as that when the angular acceleration a ⁇ described above is applied. For this reason, the influence which angular velocity (omega) has on output potential Vout is also suppressed by the same principle.
- FIG. 18 is a cross-sectional view schematically showing a state when acceleration is applied in the Y-axis direction to the acceleration sensor according to the second embodiment of the present invention. 18 is the same as that in FIG. Further, in FIG. 18, the anchors 91 and 92 and the central inertia mass body 2 are not shown for easy understanding of the drawing.
- a negative force in the Z-axis direction acts on the inertial mass body 2 as gravity, and the inertial mass body 2 moves downward (in the direction of the Z-axis in the drawing) from the initial position (the position of the broken line in the drawing). It is in a state of sinking in the negative direction.
- the height of the first axis L1 from the substrate 1 is lower than the first torsion axis T1 due to the influence of gravity. For this reason, the force (arrow in FIG. 17) transmitted to the portion of the first axis L1 acts on the first detection frame 21 as a torque around the first torsion axis T1.
- the height of the axis L4 from the substrate 1 is lower than the second torsion axis T2 due to the influence of gravity. For this reason, the force transmitted to the portion of the axis L4 acts on the fourth detection frame 24 as a torque around the second torsion axis T2.
- the torques around the first and second torsion axes T1 and T2 both have an action point below the first and second torsion axes T1 and T2. Further, both forces acting on the action point are positive in the Y-axis direction. As a result, the rotational displacement of the first detection frame 21 and the rotational displacement of the fourth detection frame 24 are in the same direction.
- the capacitance C 1a of the capacitor C1a formed by the first detection frame 21 and the detection electrode 41a decreases, and the static of the capacitor C1b formed by the first detection frame 21 and the detection electrode 41b decreases.
- the capacitance C 1b increases.
- the capacitance C 4a of the capacitor C4a constituted by the fourth detection frame 24 and the detection electrode 44a increases, and the capacitance C 4b of the capacitor C4b constituted by the fourth detection frame 24 and the detection electrode 44b. Decrease.
- the direction of movement from the first and second torsion axes T1, T2 to the first and second axes L1, L2, and the first and second torsion axes T1, T2 The direction of movement to the third and fourth axes L3 and L4 is the opposite direction.
- detection errors due to angular acceleration, angular velocity, and other-axis acceleration can be suppressed. Therefore, even when the substrate 1 is warped, the output accuracy can be improved by the first detection frame 21 and the second detection frame 22, or the third detection frame 23 and the fourth detection frame 24.
- FIG. 19 is a top view schematically showing a configuration of the acceleration sensor according to the third embodiment of the present invention.
- the acceleration sensor in the present embodiment basically has the same configuration as that of the second embodiment shown in FIG. 13, but the second detection frame 22, the second link beam 32, The arrangement of the second torsion beam 12 and the anchor 92 (second unit 20) and the fourth detection frame 24, the fourth link beam 34, the fourth torsion beam 14 and the anchor 94 (fourth unit 40) are switched. It is a configuration.
- the acceleration sensor in the present embodiment has an axially symmetric structure with respect to the X axis.
- the acceleration sensor includes the first and second detection frames 21 and 22, the first and second torsion beams 11 and 12, and the first and second link beams 31 and 32 having the first and second torsion shafts. It arrange
- the positions of the first and second link beams 31 and 32 are arranged axisymmetrically. For this reason, even when the 1st and 2nd detection frames 21 and 22 incline by curvature etc., the inclination of the inertial mass body 2 can be suppressed. That is, since the inertial mass body 2 can easily move only in the out-of-plane direction parallel displacement, the output can be detected with high accuracy and the accuracy of the self-diagnosis function by the actuation electrode 5 can be improved.
- FIG. 20 is a top view schematically showing a configuration of the acceleration sensor according to the fourth embodiment of the present invention.
- the acceleration sensor in the present embodiment basically has the same configuration as that of the third embodiment shown in FIG. 19, but has an axially symmetric structure with respect to the Y axis. Is arranged.
- the acceleration sensor includes one first unit 10, two second units, two third units 30, and one fourth unit 40.
- the fourth unit 40 is disposed so as to face the first unit 10 with respect to an axis B passing through the center of gravity G and parallel to the X axis.
- the two second units 20 are arranged so as to face the third unit 30 with respect to an axis B passing through the center of gravity G and parallel to the X axis with the fourth unit 40 interposed therebetween.
- the two third units 30 are arranged so as to face the second unit 20 with respect to an axis B passing through the center of gravity G and parallel to the X axis, with the first unit 10 interposed therebetween.
- first to fourth units 10, 20, 30, and 40 are arranged symmetrically with respect to an axis A that passes through the center of gravity G and is parallel to the Y axis.
- the first and second detection frames 21 and 22, the first and second torsion beams 11 and 12, and the first and second link beams 31 and 32 have the first and second torsion axes. It arrange
- FIG. 21 is a top view schematically showing a configuration of the acceleration sensor according to the fifth embodiment of the present invention.
- the acceleration sensor in the present embodiment basically has the same configuration as that of the fourth embodiment shown in FIG. 20, but includes first unit 10 and second unit 20. Further, fifth to eighth units 50, 60, 70, 80 rotated by 90 degrees with respect to the center of gravity G are further provided. That is, the acceleration sensor of the present embodiment is arranged so that the structure rotated 90 degrees with respect to the center of gravity G becomes a completely axisymmetric structure.
- Each of the fifth to eighth units 50, 60, 70, 80 includes fifth to eighth torsion beams 15 to 18, fifth to eighth detection frames 25 to 28, and fifth to eighth link beams 35.
- the fifth and seventh detection frames 25 and 27 are rotatable about the third torsion axis T3.
- the sixth and eighth detection frames 26, 28 are rotatable about the fourth torsion axis T4.
- the third and fourth torsion axes T3 and T4 are positions rotated by 90 degrees with respect to the first and second torsion axes T1 and T2.
- the fifth and sixth axes L5 and L6, in which the fifth and sixth link beams 35 and 36 are connected to the fifth and sixth detection frames 25 and 26, are in the same direction as the third and fourth torsion axes T3 and T4. It is the position moved to. That is, the offsets e5 and e6 are equal.
- the seventh and eighth axes L7, L8 where the seventh and eighth link beams 37, 38 are connected to the seventh and eighth detection frames 27, 28 are in the same direction as the third and fourth torsion axes T3, T4 And a position moved in the direction opposite to the fifth and sixth axes L5 and L6. That is, offsets e7 and e8 are equal, and offsets e7 and e8 are opposite in direction to offsets e5 and e6, and have the same absolute value.
- the first and second detection frames 21 and 22, the first and second torsion beams 11 and 21, and the first and second link beams 31 and 32 are rotated by 90 degrees.
- Fifth to eighth detection frames 25 to 28, fifth to eighth torsion beams 15 to 18, and fifth to eighth link beams 35 to 38 are further provided.
- the present invention can be applied particularly advantageously to a capacitance type acceleration sensor.
Abstract
Description
する場合には、加速度センサの出力も時間とともに変動することとなる。
第5のユニット、60 第6のユニット、70 第7のユニット、80 第8のユニット、91~98 アンカー、101 PSG膜、102 ポリシリコン膜。
(実施の形態1)
最初に、本実施の形態の加速度センサの主要な構成について説明する。
図3は、本発明の実施の形態1における加速度センサに対して基板の膜厚方向に沿って上方向に加速度が加えられた際の様子を概略的に示す断面図である。なお、図3の断面位置は図2と同一である。また図3においては図を見易くするためにアンカー91、92は図示されていない。
図13は、本発明の実施の形態2における加速度センサの構成を概略的に示す上面図である。
うに基板1上に絶縁膜3を介して形成されている。また、複数の第4検出電極44は、第4検出フレーム24の基板1に対する角度を検出できるように、第4検出フレーム24と対向する第4検出電極44aおよび44bを有している。この第4検出電極44a、44bは、第4検出フレーム24のそれぞれと対向するように基板1上に絶縁膜3を介して形成されている。
図14は、本発明の実施の形態2における加速度センサに対して基板の膜厚方向に沿って上方向に加速度が加えられた際の様子を概略的に示す断面図である。なお、図14の断面位置は図13のXIV-XIV線に沿う概略的な断面図である。また図14においては図を見易くするためにアンカー91、92は図示されていない。
図19は、本発明の実施の形態3における加速度センサの構成を概略的に示す上面図である。
図20は、本発明の実施の形態4における加速度センサの構成を概略的に示す上面図である。
図21は、本発明の実施の形態5における加速度センサの構成を概略的に示す上面図である。
Claims (7)
- 基板(1)と、
前記基板(1)に支持された第1ねじれ軸(T1)の周りにねじれる第1ねじれ梁(11)と、
前記第1ねじれ軸(T1)を中心に回転可能なように、前記第1ねじれ梁(11)を介して前記基板(1)に支持された第1検出フレーム(21)と、
前記基板(1)に支持された第2ねじれ軸(T2)の周りにねじれる第2ねじれ梁(12)と、
前記第2ねじれ軸(T2)を中心に回転可能なように、前記第2ねじれ梁(12)を介して前記基板(1)に支持された第2検出フレーム(22)と、
前記第1および第2検出フレーム(21、22)のそれぞれと対向するように前記基板(1)上に形成され、かつ前記基板(1)に対する前記第1および第2検出フレーム(21、22)の角度を静電容量により検出するための第1および第2検出電極(41、41a、41b、42、42a、42b)と、
前記第1ねじれ軸(T1)と交差する方向に沿って前記第1検出フレーム(21)の一方端部側に前記第1ねじれ軸(T1)を移動した第1の軸(L1)上において前記第1検出フレーム(21)と接続された第1リンク梁(31)と、
前記第1ねじれ軸(T1)の移動の方向と同じ方向に前記第2ねじれ軸(T2)を移動した第2の軸(L2)上において前記第2検出フレーム(22)と接続された第2リンク梁(32)と、
前記第1および第2リンク梁(31、32)のそれぞれにより前記第1および第2検出フレーム(21、22)の各々に連結されることで、前記基板(1)上で前記基板(1)の厚み方向に変位可能に支持された慣性質量体(2)とを備えた、加速度センサ。 - 前記第1ねじれ軸(T1)と前記第1リンク梁(31)との間のオフセット(e1)と、前記第2ねじれ軸(T2)と前記第2リンク梁(32)との間のオフセット(e2)とが等しい、請求の範囲第1項に記載の加速度センサ。
- 前記第1ねじれ軸(T1)と前記第2ねじれ軸(T2)とが互いに平行である、請求の範囲第1項に記載の加速度センサ。
- 前記第1および第2検出フレーム(21、22)と、前記第1および第2ねじれ梁(11、12)と、前記第1および第2リンク梁(31、32)とは、前記第1および第2ねじれ軸(T1、T2)に平行な軸に対して対称になるように配置された、請求の範囲第1項に記載の加速度センサ。
- 前記第1および第2検出フレーム(21、22)と、前記第1および第2ねじれ梁(11、12)と、前記第1および第2リンク梁(31、32)とは、前記第1および第2ねじれ軸(T1、T2)と交差する軸に対して対称になるように配置された、請求の範囲第4項に記載の加速度センサ。
- 前記第1および第2検出フレーム(21、22)と、前記第1および第2ねじれ梁(11、12)と、前記第1および第2リンク梁(31、32)を90度回転させた検出フレーム(25~28)と、ねじれ梁(15~18)と、リンク梁(35~38)とをさらに備えた、請求の範囲第5項に記載の加速度センサ。
- 前記基板(1)に支持された第3ねじれ軸(T3)の周りにねじれる第3ねじれ梁(13)と、
前記第3ねじれ軸(T3)を中心に回転可能なように、前記第3ねじれ梁(13)を介して前記基板(1)に支持された第3検出フレーム(23)と、
前記基板(1)に支持された第4ねじれ軸(T4)の周りにねじれる第4ねじれ梁(14)と、
前記第4ねじれ軸(T4)を中心に回転可能なように、前記第4ねじれ梁(14)を介して前記基板(1)に支持された第4検出フレーム(24)と、
前記第3および第4検出フレーム(23、24)のそれぞれと対向するように前記基板(1)上に形成され、かつ前記基板(1)に対する前記第3および第4検出フレーム(23、24)の角度を静電容量により検出するための第3および第4検出電極(43、43a、43b、44、44a、44b)と、
前記第3ねじれ軸(T3)と交差する方向に沿って前記第3検出フレーム(23)の一方端部側に前記第3ねじれ軸(T3)を移動した第3の軸(L3)上において前記第3検出フレーム(23)と接続された第3リンク梁(33)と、
前記第4ねじれ軸(T4)の移動の方向と同じ方向に前記第4ねじれ軸(T4)を移動した第4の軸(L4)上において前記第4検出フレーム(24)と接続された第4リンク梁(34)とをさらに備え、
前記第3および第4ねじれ軸(T3、T4)から前記第3および第4の軸(L3、L4)への移動方向は、前記第1および第2ねじれ軸(T1、T2)から前記第1および第2の軸(L1、L2)への移動の方向と反対方向である、請求の範囲第1項に記載の加速度センサ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010507115A JP5148688B2 (ja) | 2008-04-11 | 2008-10-28 | 加速度センサ |
DE112008003808T DE112008003808B4 (de) | 2008-04-11 | 2008-10-28 | Beschleunigungssensor |
US12/920,682 US8368387B2 (en) | 2008-04-11 | 2008-10-28 | Acceleration sensor |
CN2008801285966A CN101999081B (zh) | 2008-04-11 | 2008-10-28 | 加速度传感器 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008103406 | 2008-04-11 | ||
JP2008-103406 | 2008-04-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2009125510A1 true WO2009125510A1 (ja) | 2009-10-15 |
WO2009125510A9 WO2009125510A9 (ja) | 2010-09-02 |
Family
ID=41161650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/069522 WO2009125510A1 (ja) | 2008-04-11 | 2008-10-28 | 加速度センサ |
Country Status (5)
Country | Link |
---|---|
US (1) | US8368387B2 (ja) |
JP (1) | JP5148688B2 (ja) |
CN (1) | CN101999081B (ja) |
DE (1) | DE112008003808B4 (ja) |
WO (1) | WO2009125510A1 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012086103A1 (ja) * | 2010-12-20 | 2012-06-28 | 三菱電機株式会社 | 加速度センサ |
WO2013105591A1 (ja) * | 2012-01-11 | 2013-07-18 | アルプス電気株式会社 | 物理量センサ |
JP2014016175A (ja) * | 2012-07-06 | 2014-01-30 | Hitachi Automotive Systems Ltd | 慣性センサ |
WO2016039034A1 (ja) * | 2014-09-09 | 2016-03-17 | 株式会社村田製作所 | Mems構造体、加速度センサ |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8026714B2 (en) * | 2008-03-06 | 2011-09-27 | Symphony Acoustics, Inc. | Accelerometer with enhanced DC stability |
DE112009003522T5 (de) * | 2008-11-13 | 2012-08-23 | Mitsubishi Electric Corp. | Beschleunigungssensor |
JP5527015B2 (ja) * | 2010-05-26 | 2014-06-18 | セイコーエプソン株式会社 | 素子構造体、慣性センサー、電子機器 |
JP5747836B2 (ja) * | 2012-02-15 | 2015-07-15 | 三菱電機株式会社 | 加速度センサと加速度センサの自己診断方法 |
US9840409B2 (en) * | 2015-01-28 | 2017-12-12 | Invensense, Inc. | Translating Z axis accelerometer |
JP2020030067A (ja) * | 2018-08-21 | 2020-02-27 | セイコーエプソン株式会社 | 物理量センサー、センサーデバイス、電子機器、および移動体 |
JP2020085744A (ja) * | 2018-11-28 | 2020-06-04 | セイコーエプソン株式会社 | 加速度センサー、電子機器および移動体 |
JP2020118609A (ja) * | 2019-01-25 | 2020-08-06 | セイコーエプソン株式会社 | 慣性センサー、電子機器および移動体 |
JP2022006389A (ja) * | 2020-06-24 | 2022-01-13 | セイコーエプソン株式会社 | 慣性センサー、電子機器、及び移動体 |
JP2022014567A (ja) * | 2020-07-07 | 2022-01-20 | セイコーエプソン株式会社 | 慣性センサー及び慣性計測装置 |
CN114487480A (zh) * | 2022-01-14 | 2022-05-13 | 瑞声开泰科技(武汉)有限公司 | 微机电系统加速度计 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003044539A1 (fr) * | 2001-11-19 | 2003-05-30 | Mitsubishi Denki Kabushiki Kaisha | Accelerometre |
JP2008139282A (ja) * | 2006-11-09 | 2008-06-19 | Mitsubishi Electric Corp | 加速度センサ |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4699006A (en) * | 1984-03-19 | 1987-10-13 | The Charles Stark Draper Laboratory, Inc. | Vibratory digital integrating accelerometer |
US4736629A (en) * | 1985-12-20 | 1988-04-12 | Silicon Designs, Inc. | Micro-miniature accelerometer |
US5195371A (en) * | 1988-01-13 | 1993-03-23 | The Charles Stark Draper Laboratory, Inc. | Semiconductor chip transducer |
US5488864A (en) * | 1994-12-19 | 1996-02-06 | Ford Motor Company | Torsion beam accelerometer with slotted tilt plate |
DE19547642A1 (de) * | 1994-12-20 | 1996-06-27 | Zexel Corp | Beschleunigungssensor und Verfahren zu dessen Herstellung |
SE519954C2 (sv) * | 2000-08-09 | 2003-04-29 | Elster Messtechnik Gmbh | Anordning och förfarande för beröringsfri avkänning av en rotors rotationstillstånd |
US6955086B2 (en) * | 2001-11-19 | 2005-10-18 | Mitsubishi Denki Kabushiki Kaisha | Acceleration sensor |
FI116543B (fi) * | 2004-12-31 | 2005-12-15 | Vti Technologies Oy | Värähtelevä mikromekaaninen kulmanopeusanturi |
GB2437311A (en) | 2006-04-07 | 2007-10-24 | Mologic Ltd | A protease detection product |
US7624638B2 (en) * | 2006-11-09 | 2009-12-01 | Mitsubishi Electric Corporation | Electrostatic capacitance type acceleration sensor |
-
2008
- 2008-10-28 CN CN2008801285966A patent/CN101999081B/zh not_active Expired - Fee Related
- 2008-10-28 DE DE112008003808T patent/DE112008003808B4/de not_active Expired - Fee Related
- 2008-10-28 WO PCT/JP2008/069522 patent/WO2009125510A1/ja active Application Filing
- 2008-10-28 JP JP2010507115A patent/JP5148688B2/ja not_active Expired - Fee Related
- 2008-10-28 US US12/920,682 patent/US8368387B2/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2003044539A1 (fr) * | 2001-11-19 | 2003-05-30 | Mitsubishi Denki Kabushiki Kaisha | Accelerometre |
JP2008139282A (ja) * | 2006-11-09 | 2008-06-19 | Mitsubishi Electric Corp | 加速度センサ |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2012086103A1 (ja) * | 2010-12-20 | 2012-06-28 | 三菱電機株式会社 | 加速度センサ |
WO2013105591A1 (ja) * | 2012-01-11 | 2013-07-18 | アルプス電気株式会社 | 物理量センサ |
JP2014016175A (ja) * | 2012-07-06 | 2014-01-30 | Hitachi Automotive Systems Ltd | 慣性センサ |
WO2016039034A1 (ja) * | 2014-09-09 | 2016-03-17 | 株式会社村田製作所 | Mems構造体、加速度センサ |
Also Published As
Publication number | Publication date |
---|---|
US20110031959A1 (en) | 2011-02-10 |
WO2009125510A9 (ja) | 2010-09-02 |
JP5148688B2 (ja) | 2013-02-20 |
CN101999081B (zh) | 2013-01-02 |
US8368387B2 (en) | 2013-02-05 |
CN101999081A (zh) | 2011-03-30 |
DE112008003808T5 (de) | 2011-03-03 |
DE112008003808B4 (de) | 2012-12-13 |
JPWO2009125510A1 (ja) | 2011-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5148688B2 (ja) | 加速度センサ | |
JP5125327B2 (ja) | 加速度センサ | |
WO2010055716A1 (ja) | 加速度センサ | |
EP3225953B1 (en) | Micromechanical detection structure of a mems multi-axis gyroscope, with reduced drifts of corresponding electrical parameters | |
US9062972B2 (en) | MEMS multi-axis accelerometer electrode structure | |
EP2246706B1 (en) | Physical quantity sensor | |
US6955086B2 (en) | Acceleration sensor | |
TWI494263B (zh) | 具有互相正交方向中解偶感測之傳感器 | |
US8978475B2 (en) | MEMS proof mass with split z-axis portions | |
JP5852437B2 (ja) | デュアルプルーフマスを有するmemsセンサ | |
JP6002481B2 (ja) | 慣性センサ | |
US20090064780A1 (en) | Microelectromechanical sensor with improved mechanical decoupling of sensing and driving modes | |
WO2003044539A1 (fr) | Accelerometre | |
US11015933B2 (en) | Micromechanical detection structure for a MEMS sensor device, in particular a MEMS gyroscope, with improved driving features | |
EP3717400B1 (en) | Asymmetric out-of-plane accelerometer | |
WO2013187018A1 (ja) | 静電容量式物理量センサ | |
EP3640591B1 (en) | Microelectromechanical device for detection of rotational motion | |
TWI616656B (zh) | 微機電系統感測器和半導體封裝 | |
JP2015125124A (ja) | 多軸センサ | |
JP5816320B2 (ja) | Mems素子 | |
JP2008256578A (ja) | 角速度センサ | |
JP4983107B2 (ja) | 慣性センサおよび慣性センサの製造方法 | |
JP2012073049A (ja) | 加速度センサ及び加速度センサシステム | |
SG194332A1 (en) | Accelerometers and methods of fabricating thereof | |
JP2024015689A (ja) | 物理量センサー及び慣性計測装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880128596.6 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08873816 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010507115 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12920682 Country of ref document: US |
|
RET | De translation (de og part 6b) |
Ref document number: 112008003808 Country of ref document: DE Date of ref document: 20110303 Kind code of ref document: P |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08873816 Country of ref document: EP Kind code of ref document: A1 |