WO2009125497A1 - 均熱装置および有機膜成膜装置 - Google Patents
均熱装置および有機膜成膜装置 Download PDFInfo
- Publication number
- WO2009125497A1 WO2009125497A1 PCT/JP2008/057205 JP2008057205W WO2009125497A1 WO 2009125497 A1 WO2009125497 A1 WO 2009125497A1 JP 2008057205 W JP2008057205 W JP 2008057205W WO 2009125497 A1 WO2009125497 A1 WO 2009125497A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heated
- flow path
- heating
- condensation
- hole
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/228—Gas flow assisted PVD deposition
Definitions
- the present invention relates to a heat equalizing apparatus used in an organic film forming apparatus, a heat equalizing apparatus for heating a raw material of a predetermined material accommodated in a container, and an organic film forming apparatus using the heat equalizing apparatus.
- a heat equalizing apparatus used in an organic film forming apparatus
- an organic film forming apparatus using the heat equalizing apparatus about.
- an evaporation device for the organic EL raw material is an evaporation pan by heating the outside of the evaporation pan with a heater.
- a heating method in which the internal organic EL material is sublimated or melted and evaporated is generally used.
- a conventional apparatus used for such heat treatment is disclosed, for example, in International Publication No. 2007/034790 (Patent Document 1).
- FIG. 19 is a side view of an evaporation container used for conventional heat treatment.
- FIG. 20 is a plan view of an evaporation container used in a conventional heat treatment.
- the evaporation container includes a bottom surface and a side surface standing from the bottom surface, and includes an evaporation dish 50 that defines a material storage space opened inside the side surface, and the material storage space.
- the partition plate 52 is divided into a plurality of partial spaces.
- the partition plate 52 is provided with a locking piece 54 having such a height that a plurality of partial spaces communicate with each other on the bottom surface side of the evaporating dish.
- FIG. 21 is a schematic diagram showing a modification of the conventional partition plate.
- FIG. 21 as a means for heating the bottom and side portions of the evaporating dish and the inside of the partition plate, one including heat pipes 741 and 761 is described.
- International Publication No. 2007/034790 Pamphlet is described.
- a raw material of a predetermined material is supplied to a communicating part on the bottom side of the evaporating dish, and is heated and evaporated on the bottom face, side face and partition plate part of the evaporating dish. Since the supplied raw material is stored and heated in the communication part on the bottom side of the evaporating dish, raw material stagnation occurs at a part of the bottom communication part, particularly at a corner part formed by the side surface and the partition plate. When stagnation occurs, it is not possible to sufficiently replace the raw material continuously with new raw material while heating and evaporating the raw material in each part of the evaporating dish. For this reason, it was difficult to heat and evaporate each part of the raw material in the evaporating dish under a uniform temperature history, and there was a problem that the amount of evaporation of the raw material varied.
- the bottom part and the side part of the evaporating dish have a double structure, and the heat pipe provided inside the partition plate and the double structure part are communicated with each other.
- the vapor pressure of the working fluid of the heat pipe corresponding to the operating temperature is generated as an internal pressure in this double structure portion.
- a steam pressure of about 1.6 MPa is generated when the operation is performed at 200 ° C. using water as a working fluid
- a steam pressure of about 1.9 MPa is generated when the operation is performed at 400 ° C. using naphthalene as a working fluid.
- this double structure portion does not have such a structure that maintains the internal pressure strength during high-temperature heating, there is a problem that the evaporating dish may be deformed or broken at high temperatures.
- the present invention has been made to solve the above-described problems, and continuously heats the material to be heated in each part inside the apparatus to make the temperature of the material to be heated uniform and perform stable vaporization. It is another object of the present invention to provide a soaking device that can sufficiently withstand the vapor pressure of a working fluid even at high temperatures.
- the heat equalizing apparatus includes a container structure, a heating means, and a material supply pipe.
- a sealed space filled with a working fluid is formed inside the container structure.
- the heating means is disposed at the bottom of the container structure.
- the material supply pipe communicates the outside and the inside of the container structure.
- the container structure includes a heating block that heats and vaporizes the material to be heated, and a housing portion that surrounds the heating block. In the heating block, a flow path through which the material to be heated flows is formed.
- the flow path includes a first flow path that is connected to the material supply pipe and extends in the horizontal direction, a second flow path that branches from the first flow path and extends in the up-down direction, and an opening in which the second flow path opens on the upper surface of the container structure Part.
- a condensation path is formed in the heating block. In the condensation path, the working fluid heated and evaporated by the heating means is cooled and condensed.
- the condensation path includes an upper condensation hole formed on both sides of the second flow path and extending in the horizontal direction, and a lower condensation hole formed on the lower side of the first flow path.
- a first flow path is disposed between the upper condensation hole and the lower condensation hole.
- the heating block is heated by the action of cooling and condensing the gaseous working fluid on the inner wall surface of the condensation path provided in the heating block, and the temperature of the heated heating block is made uniform. . Therefore, the temperature of the material to be heated that is heated while passing through the flow path in the heating block can be made uniform and heated.
- the flow path is configured so that the material to be heated flows continuously from the inlet to the outlet of the flow path, and a part of the material to be heated does not stay in a part of the flow path. The uniformity of the heating history can be improved.
- the convection of the melt of the to-be-heated material which passes the inside of a flow path can be suppressed by making the flow path of to-be-heated material a small diameter. Accordingly, since the temperature uniformity of the heated and vaporized material to be heated can be improved, a heat equalizing apparatus that can be applied to a vapor deposition apparatus that performs a highly accurate film forming process is obtained.
- FIG. 2 is a cross-sectional view of the heat equalizing device according to Embodiment 1.
- FIG. It is sectional drawing of a heat equalizing apparatus orthogonal to the cross section shown in FIG.
- FIG. 3 is a top plan view of the heat equalizer shown in FIGS. 1 and 2. It is sectional drawing of the heat equalization apparatus of Embodiment 2.
- FIG. FIG. 5 is a cross-sectional view of a heat equalizer that is orthogonal to the cross section shown in FIG. 4. It is sectional drawing of the heat equalization apparatus of Embodiment 3.
- FIG. 10 is a cross-sectional view of a modification of the heat equalizing device according to the third embodiment.
- FIG. 13 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 12. It is sectional drawing of the heat equalizing apparatus of Embodiment 6.
- FIG. 15 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 14. 6 is a graph showing the temperature measurement results of each part of the apparatus in the temperature raising process of the heat equalizing apparatus according to the first embodiment.
- Heating block 1 Heating block, 2 Housing part, 3 Flange, 4 Hollow part, 5 Working fluid, 6 Heating means, 7 Steam bubble, 8, 9, 17, 20 arrow, 10, 10a, 10b Condensation hole, 11 Material supply pipe, 12 Main header pipe, 13 branch header pipe, 14 riser pipe, 15 opening, 16 condensation hole, 18 column, 21 piping system, 22 condensation hole, 23 evaporator, 24 steam pipe, 25 liquid pipe, 26 second hydraulic fluid 27 Second heating means.
- each component is not necessarily essential for the present invention unless otherwise specified.
- the above number is an example, and the scope of the present invention is not necessarily limited to the number, amount, etc.
- FIG. 1 is a cross-sectional view of the heat equalizing device according to the first embodiment.
- FIG. 2 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 1.
- FIG. 3 is a top plan view of the heat equalizer shown in FIGS. 1 and 2.
- the horizontal direction refers to the left-right direction in the sectional views of the heat equalizer, and the up-down direction refers to the up-down direction in these drawings.
- the heat equalizing device includes a heating block 1 and a housing portion 2 arranged so as to surround the periphery of the heating block 1.
- the soaking device includes a flange 3.
- the heating block 1 and the housing part 2 are joined to the flange 3 at their respective upper ends, and their lower parts are joined to form a container structure in which a hollow part 4 that is a sealed space is formed inside. Yes.
- the container structure has a heating block 1 and a housing part 2.
- Condensation holes 10a and 10b extending in the horizontal direction through the heating block 1 are formed in the upper part of the heating block 1.
- the condensation holes 10a and 10b are circular holes whose cross-sectional shape along the radial direction of the hole is a circular shape, and straight holes whose depth direction is along a straight line.
- the depth direction of the condensation holes 10a and 10b is along the horizontal direction.
- a plurality of condensing holes 10a and 10b are formed. Both ends of the condensation holes 10 a and 10 b are open toward the hollow portion 4.
- the condensing holes 10a and 10b are formed so as to communicate the right and left hollow portions 4 and 4 inside the container structure shown in FIG.
- the inside of the hollow portion 4 is filled with a working fluid 5 that is a liquid working fluid.
- the working fluid is a heat medium used for transferring heat between the heating means 6 serving as a heat source and the heating block 1 and heating the heating block 1 to control the target temperature.
- the hydraulic fluid 5 is selected in consideration of the thermal characteristics at the operating temperature and the operating pressure (vapor pressure). Water is used in the region of about 200 ° C. or lower, and water is used in the region of higher than 200 ° C. and about 400 ° C. or lower.
- a high boiling point organic heat medium such as Dowsum (registered trademark) A or naphthalene is generally used.
- the working fluid 5 is filled in the hollow portion 4 after the inside of the hollow portion 4 is evacuated. Therefore, a gaseous working fluid in which the working fluid 5 is vaporized exists inside the hollow portion 4. Since the hollow portion 4 is formed so as to separate the heating block 1 and the housing portion 2, the structure is such that heat is not easily dissipated from the heating block 1 to the outside of the apparatus.
- a heating means 6 for heating the hydraulic fluid 5 is disposed at the bottom of the container structure.
- the heating means 6 is attached to the lower surface of the heating block 1 in thermal contact. That is, the heat generated in the heating means 6 can be transmitted to the hydraulic fluid 5 sufficiently efficiently through the bottom of the heating block 1.
- the soaking apparatus also includes a material supply pipe 11 that communicates the outside and inside of the container structure.
- the material supply pipe 11 is introduced from the outside of the container structure and is joined to one side surface of the heating block 1.
- a material to be heated which is a material heated and vaporized by the heat equalizing device, is supplied into the heat equalizing device via the material supply pipe 11.
- the material to be heated needs to be a fluid.
- the material to be vaporized is a solid material at room temperature
- the material is flowed by using a method such as heating and melting the material, or crushing and pulverizing the material into a liquid to form a slurry. By improving the property, the material supply pipe 11 can be passed.
- a main header pipe 12 that is connected to the material supply pipe 11 and extends in the horizontal direction, a plurality of branch header pipes 13 that branch from the main header pipe 12 and extend in the horizontal direction, and branch from the branch header pipe 13.
- a plurality of risers 14 extending in the vertical direction are formed.
- the main header pipe 12, the branch header pipe 13 and the riser pipe 14 are tubular members.
- the upper end of the riser 14 opens to the upper surface of the heating block 1 to form an opening 15.
- the main header pipe 12, the branch header pipe 13, the rising pipe 14 and the opening 15 are included in a flow path through which the material to be heated flows.
- a plurality of condensing holes 16 are formed inside the heating block 1 below the portion where the flow path of the material to be heated is formed.
- the plurality of condensation holes 16 extend in the vertical direction.
- the depth direction of the condensation hole 16 is along the vertical direction.
- the condensation hole 16 is formed below the main header pipe 12, the branch header pipe 13 and the riser pipe 14.
- the condensation hole 16 and the hollow portion 4 are formed so as to communicate with each other, and the hydraulic fluid 5 can freely flow inside the hollow portion 4 and inside the condensation hole 16.
- the planar shape of the condensation hole 16 may be any shape, for example, a rectangular shape or a circular shape.
- the condensation holes 16 may be arranged in any manner, have a function of storing the hydraulic fluid 5, and heat from the heating means 6 is transferred to the flow path of the material to be heated provided in the upper part of the heating block 1. Anything designed to minimize the influence is sufficient.
- a part of the gaseous working fluid heated and evaporated by the heating means 6 moves from the liquid level of the working fluid 5 to the inside of the condensation hole 16 as indicated by an arrow 8.
- the gaseous working fluid that has moved to the inside of the condensing hole 16 is cooled by transferring heat to the inner wall surface of the condensing hole 16 to be condensed and liquefied.
- the condensed liquid working fluid is returned to the working liquid retaining portion at the bottom of the container structure as indicated by an arrow 9.
- the condensing holes 10 a and 10 b are formed by sewing between the rising pipes 14 so as not to interfere with the rising pipes 14.
- the condensation holes 10a and 10b are formed between the riser pipes 14 and separated from the flow path of the material to be heated. As shown in FIG. 2, adjacent condensing holes 10 a are formed on both sides of the rising pipe 14 so as to sandwich the rising pipe 14, and adjacent condensing holes 10 b are formed on both sides of the rising pipe 14 so as to sandwich the rising pipe 14. ing.
- the main header pipe 12 and the branch header pipe 13 are arranged so as to be sandwiched between the condensation hole 10 b and the condensation hole 16 between the condensation hole 10 b and the condensation hole 16.
- the heating block 1 is heated by the heat generated by the heating means 6 installed at the lower part of the heating block 1.
- the heating block 1 is heated, it is formed at the bottom of the hollow portion 4 formed between the heating block 1 and the housing portion 2 and at the bottom of the heating block 1.
- the hydraulic fluid 5 staying in the lower part of the condensation hole 16 is heated.
- gaseous working fluid moves from the liquid level of the working fluid 5 to the inside of the condensation hole 16 as indicated by an arrow 8.
- the gaseous working fluid that has moved to the inside of the condensation hole 16 is cooled by heating the inner wall surface of the condensation hole 16, particularly the uppermost surface of the condensation hole 16, and is condensed and liquefied.
- the condensed liquid working fluid naturally recirculates to the working liquid retention part at the bottom of the container structure as indicated by an arrow 9.
- the inner surfaces of the condensation holes 10a and 10b and the condensation hole 16 provided in the heating block 1 are heated by the evaporation and condensation action of the working fluid.
- the material to be heated of the predetermined material reaches the heating block 1 from the outside of the container structure via the material supply pipe 11 as indicated by the white arrow 17, and the main header pipe 12 formed in the heating block 1.
- the material to be heated is heated from the wall surfaces of the condensation holes 10 a and 10 b and the condensation hole 16 provided inside the heating block 1 while passing through the inside of the heating block 1. That is, the material to be heated supplied to the inside of the heating block 1 via the material supply pipe 11 is heated by exchanging heat with the gaseous working fluid in which the working fluid 5 is heated and evaporated by the heating means 6.
- the main header pipe 12 and the branch header pipe 13 are disposed between the condensing hole 10 b and the condensing hole 16.
- the material to be heated flows through the main header pipe 12 and the branch header pipe 13
- heat is transferred from the condensation hole 10b formed on the upper side.
- the material to be heated is formed under the main header pipe 12 and the branch header pipe 13, and is transferred from the condensation holes 16 provided over the entire length of the main header pipe 12 and the branch header pipe 13.
- the riser 14 is formed between two adjacent condensation holes 10a and two adjacent condensation holes 10b. When the material to be heated flows through the riser 14, heat is transferred from the condensation holes 10a and 10b formed on the left and right sides.
- the material to be heated that flows through the flow path formed in the heating block 1 is transferred from two condensing paths that are formed so as to sandwich the flow path.
- the material to be heated flowing in the flow path is heated from two opposite directions. Since the material to be heated receives heat from a plurality of directions, the occurrence of a temperature difference in the material to be heated flowing inside the flow path is suppressed. That is, the temperature uniformity of the material to be heated can be improved.
- the flow rate of the heated material in the main header pipe 12 is sufficiently smaller than the flow rate of the heated material in the branch header pipe 13, and the flow rate of the heated material in the branch header pipe 13 is set in the riser pipe 14.
- the inner diameters of the main header pipe 12, the branch header pipe 13 and the riser pipe 14 are selected so as to be sufficiently small with respect to the flow rate of the material to be heated. Therefore, the material to be heated that branches off from the main header pipe 12 flows equally into the plurality of branch header pipes 13 and equally flows into the plurality of rising pipes 14.
- the material to be heated since the material to be heated moves in a predetermined flow path in a predetermined flow state, the material to be heated stays in a specific part in the flow path, and the phenomenon that the temperature history differs at each position in the flow path. Without occurrence, the temperature history of the heated material can be made uniform, and the uniformity of the temperature of the heated material after heating can be improved.
- the riser pipe 14 is formed of a pipe having a small diameter hole having an inner diameter of about 2 to 3 mm, convection does not occur in the melt of the material to be heated inside the riser pipe 14 and the material to be heated inside the riser pipe 14. Therefore, the temperature of the material to be heated can be made more uniform.
- the material to be heated In the inside of the heating block 1, when the material to be heated is heated to a temperature close to the boiling point, the material to be heated is evaporated and vaporized.
- the gaseous material to be heated flows out of the heating block 1 through the opening 15. In this way, it is possible to obtain a gaseous material to be heated in which the temperature distribution is suppressed and the temperature is equalized.
- a column 18 is formed in the lower part of the heating block 1 by a condensation hole 16 formed in the lower part of the heating block 1, and the structure is sufficiently resistant to generation of vapor pressure inside the container structure due to evaporation of the working fluid 5. It is possible to do.
- This column 18 causes heat conduction from the heating means 6 to the upper part of the heating block 1, but the heat applied to the heating means 6 is also caused by the condensation holes 16 around the column 18 formed in the lower part of the heating block 1.
- the hydraulic fluid 5 is transmitted to the upper part of the heating block 1 while evaporating.
- the condensing hole 16 and the column 18 are designed so that the upper temperature of the column 18, that is, the temperature of the flow path of the material to be heated is lowered to a temperature substantially equal to the temperature of the working fluid on the upper surface of the condensing hole 16. .
- the heat equalizing apparatus includes the container structure, the heating means 6, and the material supply pipe 11.
- a hollow portion 4 filled with a working fluid is formed inside the container structure.
- the container structure includes a heating block 1 that heats and vaporizes a material to be heated, and a housing portion 2 that surrounds the heating block 1.
- the heating means 6 is disposed at the bottom of the heating block 1.
- the material supply pipe 11 communicates the outside and the inside of the container structure.
- the flow path includes a main header pipe 12 as a first flow path connected to the material supply pipe 11 and extending in the horizontal direction, a rising pipe 14 as a second flow path branched from the first flow path and extending in the vertical direction, and a second flow
- the path includes an opening 15 opening in the upper surface of the heating block 1.
- a condensation path is formed.
- the condensing path includes condensing holes 10a and 10b as upper condensing holes formed on both sides of the rising pipe 14 and extending in the horizontal direction, and a condensing hole 16 as a lower condensing hole formed below the rising pipe 14.
- the main header pipe 12 is disposed between the condensation hole 10 b and the condensation hole 16.
- the heating block 1 is heated by the action of the working fluid condensing on the inner wall surfaces of the condensation holes 10a and 10b and the condensation hole 16 provided in the heating block 1, and the temperature of the heated heating block 1 is increased.
- the uniformity is improved. Therefore, the temperature after heating of the material to be heated that is heated while passing through the flow path in the heating block 1 can be made uniform.
- the flow path is configured so that the material to be heated flows continuously from the connection portion between the material supply pipe 11 and the main header pipe 12 to the opening 15, and a part of the material to be heated is part of the flow path. It is possible to improve the uniformity of the heating history of the material to be heated. Further, by making the riser 14 small in diameter, it is possible to suppress the convection of the melt of the material to be heated that passes through the riser 14 and to further improve the temperature uniformity of the heated and vaporized material to be heated. Can be made.
- the condensing hole 16 as the lower condensing hole is provided over the entire longitudinal direction of the main header pipe 12 and the branch header pipe 13. If it does in this way, in the whole longitudinal direction of the main header pipe
- tube 13 in addition to the heat transfer from the upper condensation holes 10a and 10b, heat is also supplied to the material to be heated from the lower condensation holes 16. Since it can be transmitted, the uniformity of the temperature of the material to be heated can be further improved.
- the temperature of the inner wall surface of the flow path for heating the material to be heated can be managed in a temperature distribution within ⁇ 1 ° C., and the amount of vaporization of the material to be heated can be highly accurate. Therefore, it is possible to obtain an evaporation source that can be applied to a vapor deposition apparatus that performs a highly accurate film forming process.
- the area of the heat transfer surface increases.
- the material to be heated can be heated with a large surface area.
- the heating efficiency is increased, the thermal response at the time of temperature rise is greatly improved, and the heat energy at the time of temperature rise can be minimized, so the heat equalizing device that improves heat transfer efficiency and is suitable for energy saving. Is obtained.
- FIG. 16 is a graph showing a temperature measurement result of each part of the apparatus in the temperature rising process of the heat equalizing apparatus according to the first embodiment.
- the horizontal axis represents the elapsed time (unit: minutes) from the start of temperature rise
- the vertical axis represents the temperature (unit: ° C.).
- FIG. 16 shows temperature rise curves in the vicinity of the heating means 6, the vicinity of the branch header pipe 13, and the opening 15 when water is used as the working fluid 5 in the first embodiment.
- the temperature in the vicinity of the heating means 6 (heater vicinity temperature) is higher than the others.
- the temperature of the opening 15 on the upper surface of the heating block 1 corresponding to the outlet of the material to be heated (heating hole surface temperature) and the temperature in the vicinity of the branch header pipe 13 that is the flow path of the material to be heated Is rising at about the same temperature. In other words, it can be seen that the temperature of the heated material rises while keeping the temperature extremely uniform.
- the temperature controllability until the temperature stabilizes is good, and the effectiveness of the configuration of the heat equalizing device in the first embodiment has been confirmed.
- the steady-state temperature distribution in the opening 15 was ⁇ 0.5 ° C. or less.
- the time required for the temperature rise from room temperature to about 200 ° C. is about 0.5 hours, and has a temperature rise characteristic in a short time.
- FIG. 4 is a cross-sectional view of the heat equalizer of the second embodiment.
- FIG. 5 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 4.
- the heat equalizing device of the second embodiment is different from the heat equalizing device of the first embodiment in that the upper condensing holes are configured as shown in FIGS. 4 and 5.
- the cross-sectional shape of the condensation hole 10 may be a vertically long rectangle (that is, a long side is formed in the vertical direction).
- the liquid working fluid cooled and condensed into the condensation hole 10 is collected by a capillary force at a corner portion near the apex of the rectangle of the cross section of the condensation hole 10. Therefore, the inside of the condensation hole 10 can be prevented from being blocked by the liquid working fluid, and the vapor space of the working fluid is reliably ensured.
- the film thickness of the liquid working fluid adhering to the flat part of the condensation hole 10 can be reduced, the surface temperature distribution of the condensation hole 10 is improved.
- the condensing hole 10 extends along the rising pipe 14.
- the condensation hole 10 extends along the extending direction of the riser 14. In this way, the heat transfer distance from the surface of the condensation hole 10 to the riser pipe 14 through which the material to be heated flows can be made uniform in the direction in which the riser pipe 14 extends. Therefore, the material to be heated flowing inside the riser 14 can be heated from the lower end of the riser 14 to the opening 15 so that the temperature becomes more uniform.
- interval of the riser pipe 14 can be shortened by making the condensing hole 10 into a vertically long rectangular shape. Therefore, as shown in FIG. 5, the number of risers 14 can be increased compared to the case where the condensing holes shown in FIG. 2 are round holes, and the opening area of the riser 14 can be increased. The efficiency of evaporation can be improved.
- the cross-sectional shape of the condensing hole 10 is changed from a round shape to a rectangular shape, so that the size of the heating block 1 in the width direction can be reduced and the apparatus can be downsized. Therefore, it is possible to obtain a heat equalizing device having an energy saving structure in which the thermal responsiveness can be improved and the heat radiation surface area is reduced.
- the diameter of the condensing hole 10 in the round hole needs to be about 7 to 8 mm.
- the cross section of the condensing hole is a vertically long rectangular shape, ) Can be reduced to about 3 to 4 mm, so that the arrangement pitch of the risers 14 can be reduced by about 30%.
- FIG. 6 is a cross-sectional view of the heat equalizer of the third embodiment.
- FIG. 7 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 6.
- the heat equalizing device according to the third embodiment is different from the heat equalizing device according to the first embodiment in that the upper condensing holes are configured as shown in FIGS. 6 and 7.
- the example in which the condensing holes 10a and 10b in the upper part of the heating block 1 extend in the horizontal direction has been described.
- One side in the depth direction of 10a and 10b may be relatively high and the other side may be relatively low to form an inclined hole inclined in the depth direction with respect to the horizontal direction.
- the liquid working fluid cooled and condensed by exchanging heat with the material to be heated flows along the inclined bottom surfaces of the condensation holes 10a and 10b. Therefore, the liquid working fluid can be naturally refluxed quickly from the condensation holes 10a and 10b to the working liquid retention portion at the bottom of the container structure. Therefore, the film thickness of the liquid working fluid staying on the inner surfaces of the condensation holes 10a and 10b can be further reduced, and the temperature equalization over the entire surfaces of the condensation holes 10a and 10b can be further improved.
- the temperature of the heating material can be made more uniform.
- FIG. 8 is a cross-sectional view of a modification of the heat equalizing apparatus according to the third embodiment.
- FIG. 9 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 8.
- the condensing hole 10 whose cross-sectional shape is a vertical rectangle is arranged such that one side in the depth direction is relatively high and the other side is relatively low, Even if the inclined hole is inclined in the depth direction, the same effect as described above can be obtained.
- FIG. 10 is a cross-sectional view of the heat equalizing device according to the fourth embodiment.
- 11 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG.
- the heat equalizing device according to the fourth embodiment is different from the heat equalizing device according to the third embodiment in that the upper condensing holes are configured as shown in FIGS. 10 and 11.
- the condensing hole in the upper part of the heating block 1 is shown with a constant and inclined cross-sectional shape.
- the upper surface of the condensing hole 10 is horizontal.
- the bottom surface may be inclined. That is, the upper edge of the condensation hole 10 extends in the horizontal direction, and the lower edge of the condensation hole 10 is inclined in the depth direction.
- the bottom surface of the condensing hole 10 is inclined, and the liquid working fluid condensed and liquefied inside the condensing hole 10 is returned to the working liquid retaining portion at the bottom of the container structure.
- the liquid working fluid that collects at the bottom of the condensing hole 10 can be efficiently removed to the outside of the condensing hole 10, and the liquid working fluid film can be thinned.
- the material to be heated can be heated up to the vicinity of the opening 15 in each of the plurality of risers 14. Therefore, the soaking effect of the material to be heated can be further improved.
- FIG. 12 is a cross-sectional view of the heat equalizer of the fifth embodiment.
- 13 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG.
- the soaking device of the fifth embodiment is different from the soaking device of the fourth embodiment in that the upper condensing holes are configured as shown in FIGS. 12 and 13.
- the inclination direction of the bottom surface of the condensing hole is shown for each hole in one direction.
- the inclination direction of the condensing holes 10a and 10b is changed. You may make it arrange
- the positions of the bottom surfaces of the condensing holes 10a and 10b can be averaged with respect to each riser 14, and the material to be heated flowing inside the riser 14 is opened from the lower end of the riser 14. Since it can heat uniformly in each riser pipe 14 until it reaches the section 15, the material to be heated can be heated more uniformly.
- FIG. 14 is a cross-sectional view of the heat equalizing apparatus according to the sixth embodiment.
- 15 is a cross-sectional view of the heat equalizer that is orthogonal to the cross section shown in FIG. 14 and 15 show a heat equalizing device in which a piping system 21 is provided for supplying a material to be heated vaporized by evaporation to a process vessel. A part of the lower part of the piping system 21 is opened so as to be connected to the opening 15 opened on the upper surface of the container structure. The carrier gas flows in the piping system 21 as indicated by the white arrow 20.
- the piping system 21 is also intended to be heated uniformly. That is, the heat equalizing apparatus according to the sixth embodiment further includes a piping system 21 connected to the opening 15 and a heating facility for heating the piping system 21.
- Condensation holes 22 are arranged on the wall surface of the piping system 21.
- An evaporator 23 is installed below the piping system 21 separately from the piping system 21.
- the piping system 21 and the evaporator 23 are communicated with each other by a steam pipe 24 and a liquid pipe 25 to form a hollow circuit.
- the hollow circuit is filled with a predetermined amount of the second hydraulic fluid 26 after evacuation.
- a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the evaporator 23, a second heating means 27 is provided below the e
- the second heating means 27 is provided separately from the heating means 6 described in the first embodiment, the temperature of the piping system 21 and the temperature of the container structure are individually controlled.
- the method of heating the inner surface of the condensation hole 22 by the second heating means 27 is such that the wall surface of the piping system 21 is uniformly heated by the evaporation and condensation action of the working fluid 26 as in the heating means 6. .
- the inner wall surface of the piping system 21 can be held by the second heating means 27 so as to be slightly higher than the temperature of the flow path through which the heated material inside the heating block 1 flows. If it does in this way, it can prevent that the to-be-heated material evaporated and vaporized is condensed and liquefied (or condensed and solidified) by the inner surface of the piping system 21.
- the condensing hole 22 provided in the wall surface of the piping system 21 is shown as a plurality of round holes processed.
- the condensing hole 22 includes the evaporator 23 and the working fluid.
- the cross-sectional shape of the condensation hole 22 may be round, square, or polygonal.
- the passive treatment film containing a metal oxide is formed on the inner surface of the path through which the working fluid flows. Therefore, decomposition and dissociation of the working fluid is prevented from occurring due to the catalytic effect of the metal material constituting the heat equalizing device, for example, stainless steel.
- An atmospheric pressure ionization mass spectrometer (APIMS, Atmospheric Pressure Ionization Mass Spectroscopy) was used as the analyzer.
- a sample gas naphthalene vapor diluted and adjusted to a concentration of 300 ppb with Ar gas was supplied at a flow rate of 10 sccm to a stainless steel pipe subjected to various passive treatments.
- the shape of the stainless steel pipe was 6.35 mm in outer diameter, 4.35 mm in inner diameter, and 1 m in length.
- stainless steel piping (SUS316L-EP) obtained by electropolishing JIS (Japanese Industrial Standards) SUS316L piping, and stainless steel piping (Cr 2 O 3 -SUS) obtained by subjecting SUS316L piping to Cr 2 O 3 passivation treatment.
- stainless steel pipe subjected to the Y 2 O 3 coating passivation process piping SUS316L (Y 2 O 3 -SUS ) was prepared as a sample. Samples of these various stainless steel pipes were respectively installed immediately before the APIMS analyzer, and the temperature was raised to 750 ° C. at a rate of 4 ° C./min while supplying naphthalene gas.
- FIG. 17 is a graph showing the thermal decomposition characteristics of naphthalene due to the catalytic effect of stainless steel.
- the horizontal axis of FIG. 17 indicates the temperature of the sample surface (unit: ° C.), and the vertical axis indicates the concentration of naphthalene (unit: ppb).
- FIG. 17 shows the relationship between temperature and naphthalene concentration on the surface of the passivation film of each sample.
- the decomposition of naphthalene started at 588 ° C. on the Cr 2 O 3 passivated surface and 608 ° C. on the Al 2 O 3 passivated surface. However, in the high temperature region, the decomposition inhibitory effect was observed on the Cr 2 O 3 passivated surface.
- an example of investigating the decomposition behavior of the material to be heated will be shown.
- an atmospheric pressure ionization mass spectrometer (APIMS) was used as the analyzer.
- a sample gas decahydronaphthalene (C 10 H 18 ) vapor diluted with Ar gas to a concentration of 5 ppm was supplied at a flow rate of 5 sccm to a stainless steel pipe subjected to various passive treatments.
- the shape of the stainless steel pipe was 6.35 mm in outer diameter, 4.35 mm in inner diameter, and 1 m in length.
- stainless steel piping (SUS316L-EP) obtained by electropolishing JIS (Japanese Industrial Standards) SUS316L piping, and stainless steel piping (Al 2 O 3 -SUS) obtained by subjecting SUS316L piping to Al 2 O 3 passivation treatment.
- Ni piping were prepared as samples.
- These various stainless steel pipe samples were installed immediately before the FTIR (Fourier Transform Infrared) analyzer, and while supplying decahydronaphthalene gas, the various metal pipes were raised to 800 ° C at a rate of 2 ° C / min. Warm up.
- FTIR Fastier Transform Infrared
- FIG. 18 is a graph showing thermal decomposition characteristics of decahydronaphthalene due to the catalytic effect of stainless steel.
- the horizontal axis in FIG. 18 indicates the temperature of the sample surface (unit: ° C.), and the vertical axis indicates the concentration of decahydronaphthalene (unit: ppm).
- FIG. 18 shows the thermal decomposition characteristics of each sample of decahydronaphthalene on the surface of the passive treatment film, measured for the purpose of confirming general thermal decomposition behavior on the metal surface of the organic material. As a result, on the Ni surface, it was confirmed that a concentration decrease accompanying decomposition and dissociation of decahydronaphthalene gas occurred from 150 ° C.
- decomposition of decahydronaphthalene also started at 200 ° C. on the SUS316L-EP surface.
- decahydronaphthalene can be supplied stably without being decomposed and dissociated to 550 ° C. on the Al 2 O 3 passive surface.
- the Al 2 O 3 passive state is taken as an example, but other metal oxides such as Cr 2 O 3 and Y 2 O 3 may be used.
- the substantially square shape in which the housing portion 2 surrounds the periphery of the heating block 1 has been described.
- the shapes of the heating block 1 and the housing portion 2 are not limited to a square shape. It may be square or round.
- the housing part 2 may be separated for each side surface of the heating block 1, and the respective upper ends and lower parts may be joined to the respective side walls of the heating block 1 to form a container structure.
- heating means 6 and the heating means 27 an electric heater type, an induction heating type, a hot water heating type or a steam heating type may be used, and the heating method is not limited.
- tube 11 penetrated the side part of the housing part 2 and was joined to the side part of the heating block 1, the material supply pipe
- FIG. Even if it is a thing, it may reach to the main header pipe 12 via the inside of the flange 3. As long as the material to be heated is supplied to the main header pipe 12 formed inside the heating block 1, any route may be taken.
- the horizontal direction or the vertical direction Although defined and described, the direction in which the flow path and the condensation path extend may not be strictly parallel to the horizontal direction or the vertical direction but may be inclined. Further, the flow path and the condensing path are not limited to a straight pipe or a straight hole, and may include a pipe or a hole having a bent shape or a curved shape.
- the present invention can be applied particularly advantageously to a heating apparatus for heating a raw material of a predetermined material accommodated in a container to melt and evaporate the film to form a film of the predetermined material on the substrate surface.
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
図1は、実施の形態1の均熱装置の断面図である。図2は、図1に示す断面と直交する、均熱装置の断面図である。図3は、図1および図2に示す均熱装置の上部平面図である。以下の実施の形態において、水平方向とは、均熱装置の断面図における左右方向をいい、上下方向とはこれらの図における上下方向をいうものとする。
図4は、実施の形態2の均熱装置の断面図である。図5は、図4に示す断面と直交する、均熱装置の断面図である。実施の形態2の均熱装置は、実施の形態1の均熱装置と比較して、上側凝縮孔が図4および図5に示すような構成となっている点で異なっている。
図6は、実施の形態3の均熱装置の断面図である。図7は、図6に示す断面と直交する、均熱装置の断面図である。実施の形態3の均熱装置は、実施の形態1の均熱装置と比較して、上側凝縮孔が図6および図7に示すような構成となっている点で異なっている。
図10は、実施の形態4の均熱装置の断面図である。図11は、図10に示す断面と直交する、均熱装置の断面図である。実施の形態4の均熱装置は、実施の形態3の均熱装置と比較して、上側凝縮孔が図10および図11に示すような構成となっている点で異なっている。
図12は、実施の形態5の均熱装置の断面図である。図13は、図12に示す断面と直交する、均熱装置の断面図である。実施の形態5の均熱装置は、実施の形態4の均熱装置と比較して、上側凝縮孔が図12および図13に示すような構成となっている点で異なっている。
図14は、実施の形態6の均熱装置の断面図である。図15は、図14に示す断面と直交する、均熱装置の断面図である。図14および図15では、蒸発により気化した被加熱材料をプロセス容器に供給するための、配管系21が配置された均熱装置を示す。配管系21の下部の一部は、容器構造体の上部表面に開口した開口部15に連結されるように、開口している。キャリアガスは、白抜き矢印20に示すように、配管系21の内部を流れる。
上記の一連の実施例においては、容器構造体内部での作動流体の蒸発および凝縮により、加熱手段6から加熱ブロック1への熱輸送が行なわれて、被加熱材料が加熱される。たとえばナフタレン(C10H8)を作動流体として使用することができる。この場合、ナフタレンが接触している面のステンレスの触媒効果により、ナフタレンが分解解離すると、水素が発生する。この水素ガスが、気体状の作動流体が凝縮する面に不凝縮ガスとなって存在すると、ナフタレンの蒸気が凝縮する際の熱伝達を阻害して均熱性の維持が困難となる。
上記の一連の実施例において、所定の被加熱材料が、加熱ブロック1の内部に形成された流路を流通するときに、流路の内壁面から伝熱されて加熱される。加熱された被加熱材料が分解解離してしまうと、目的の有機原料を所定の濃度で供給することが困難となり、要求している性能を持たせることができなくなる。実施の形態8では、これらの流路を構成する金属材料の触媒効果により被加熱材料が分解されないように、被加熱材料の流れる経路の表面に金属酸化物を含む不働態処理皮膜を形成していることを特徴としている。
Claims (9)
- 作動流体が充填される密閉空間が内部に形成されている容器構造体と、
前記容器構造体の底部に配置された加熱手段(6)と、
前記容器構造体の外側と内側とを連通する材料供給管(11)とを備え、
前記容器構造体は、被加熱材料を加熱して気化させる加熱ブロック(1)と、前記加熱ブロック(1)を取り囲むハウジング部(2)とを有し、
前記加熱ブロック(1)には、被加熱材料が流動する流路と、前記加熱手段(6)により加熱され蒸発した作動流体が冷却されて凝縮する凝縮路とが形成されており、
前記流路は、前記材料供給管(11)に接続され水平方向に延びる第一流路(12,13)と、前記第一流路(12,13)から分岐し上下方向へ延びる第二流路(14)と、前記第二流路(14)が前記容器構造体の上部表面に開口した開口部(15)とを含み、
前記凝縮路は、前記第二流路(14)の両側に形成され水平方向に延びる上側凝縮孔(10)と、前記第一流路(12,13)の下側に形成された下側凝縮穴(16)とを含み、
前記上側凝縮孔(10)と前記下側凝縮穴(16)との間に前記第一流路(12,13)を配置した、均熱装置。 - 前記下側凝縮穴(16)を、前記第一流路(12,13)の全体に渡って設ける、請求の範囲第1項に記載の均熱装置。
- 前記上側凝縮孔(10)を前記第二流路(14)に沿って延在させた、請求の範囲第1項または第2項に記載の均熱装置。
- 前記上側凝縮孔(10)の底面を傾斜させ、前記作動流体を前記容器構造体の底部に戻すようにした、請求の範囲第1項に記載の均熱装置。
- 前記上側凝縮孔(10)の天井面を水平にした、請求の範囲第4項に記載の均熱装置。
- 前記第二流路(14)の両側に位置する隣り合う前記上側凝縮孔(10)の底面を、互いに異なる傾斜方向に傾斜させた、請求の範囲第4項または第5項に記載の均熱装置。
- 前記開口部(15)に連結された配管系(21)と、
前記配管系(21)を加熱する加熱設備とをさらに備え、
前記配管系(21)の温度と前記容器構造体の温度とは、個別に制御される、請求の範囲第1項または第2項に記載の均熱装置。 - 前記作動流体の流れる経路、および、前記被加熱材料の流れる経路の、少なくともいずれか一方に、金属酸化物を含む不働態処理皮膜が形成されている、請求の範囲第1項または第2項に記載の均熱装置。
- 請求の範囲第1項または第2項に記載の均熱装置を用いた有機膜成膜装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/934,190 US8691017B2 (en) | 2008-04-11 | 2008-04-11 | Heat equalizer and organic film forming apparatus |
CN2008801286691A CN102016107B (zh) | 2008-04-11 | 2008-04-11 | 均热装置和有机膜成膜装置 |
PCT/JP2008/057205 WO2009125497A1 (ja) | 2008-04-11 | 2008-04-11 | 均熱装置および有機膜成膜装置 |
JP2010507104A JP5143892B2 (ja) | 2008-04-11 | 2008-04-11 | 均熱装置および有機膜成膜装置 |
KR1020107022287A KR101197340B1 (ko) | 2008-04-11 | 2008-04-11 | 균열 장치 및 유기막 성막 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/057205 WO2009125497A1 (ja) | 2008-04-11 | 2008-04-11 | 均熱装置および有機膜成膜装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009125497A1 true WO2009125497A1 (ja) | 2009-10-15 |
Family
ID=41161640
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/057205 WO2009125497A1 (ja) | 2008-04-11 | 2008-04-11 | 均熱装置および有機膜成膜装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8691017B2 (ja) |
JP (1) | JP5143892B2 (ja) |
KR (1) | KR101197340B1 (ja) |
CN (1) | CN102016107B (ja) |
WO (1) | WO2009125497A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101196564B1 (ko) * | 2008-04-11 | 2012-11-01 | 도시바 미쓰비시덴키 산교시스템 가부시키가이샤 | 균열 장치 |
GB2504731B (en) * | 2012-08-08 | 2015-03-25 | Reckitt & Colman Overseas | Device for evaporating a volatile fluid |
GB2504733B (en) * | 2012-08-08 | 2015-05-20 | Reckitt & Colman Overseas | Device for evaporating a volatile material |
KR102077803B1 (ko) * | 2013-05-21 | 2020-02-17 | 삼성디스플레이 주식회사 | 증착원 및 유기층 증착 장치 |
US9857027B2 (en) * | 2014-07-03 | 2018-01-02 | Applied Materials, Inc. | Apparatus and method for self-regulating fluid chemical delivery |
EP3441757A1 (en) * | 2017-08-10 | 2019-02-13 | Mettler-Toledo GmbH | Oven insulation arrangement |
CN111170388A (zh) * | 2018-11-13 | 2020-05-19 | 上海景峰制药有限公司 | 一种水中有机溶剂蒸发装置 |
KR20210134226A (ko) * | 2020-04-29 | 2021-11-09 | 에이에스엠 아이피 홀딩 비.브이. | 고체 소스 전구체 용기 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02164401A (ja) * | 1988-12-16 | 1990-06-25 | Ulvac Corp | 有機化合物用蒸発源 |
JPH0949072A (ja) * | 1995-08-10 | 1997-02-18 | Ulvac Japan Ltd | 有機化合物用蒸発源 |
JPH10168560A (ja) * | 1996-12-06 | 1998-06-23 | Ulvac Japan Ltd | 有機材料用蒸発源 |
JP2001234335A (ja) * | 2000-02-17 | 2001-08-31 | Matsushita Electric Works Ltd | 蒸着装置 |
JP2002184571A (ja) * | 2000-12-15 | 2002-06-28 | Denso Corp | 有機el素子の製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4090039B2 (ja) | 2003-04-16 | 2008-05-28 | トッキ株式会社 | 蒸着装置における蒸発源 |
JP4321213B2 (ja) * | 2003-10-24 | 2009-08-26 | ウシオ電機株式会社 | 加熱ユニット |
JP5358778B2 (ja) | 2005-09-20 | 2013-12-04 | 国立大学法人東北大学 | 成膜装置、蒸発治具、及び、測定方法 |
-
2008
- 2008-04-11 CN CN2008801286691A patent/CN102016107B/zh active Active
- 2008-04-11 JP JP2010507104A patent/JP5143892B2/ja active Active
- 2008-04-11 KR KR1020107022287A patent/KR101197340B1/ko active IP Right Grant
- 2008-04-11 WO PCT/JP2008/057205 patent/WO2009125497A1/ja active Application Filing
- 2008-04-11 US US12/934,190 patent/US8691017B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02164401A (ja) * | 1988-12-16 | 1990-06-25 | Ulvac Corp | 有機化合物用蒸発源 |
JPH0949072A (ja) * | 1995-08-10 | 1997-02-18 | Ulvac Japan Ltd | 有機化合物用蒸発源 |
JPH10168560A (ja) * | 1996-12-06 | 1998-06-23 | Ulvac Japan Ltd | 有機材料用蒸発源 |
JP2001234335A (ja) * | 2000-02-17 | 2001-08-31 | Matsushita Electric Works Ltd | 蒸着装置 |
JP2002184571A (ja) * | 2000-12-15 | 2002-06-28 | Denso Corp | 有機el素子の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8691017B2 (en) | 2014-04-08 |
CN102016107B (zh) | 2012-11-07 |
US20110041768A1 (en) | 2011-02-24 |
KR101197340B1 (ko) | 2012-11-05 |
CN102016107A (zh) | 2011-04-13 |
JPWO2009125497A1 (ja) | 2011-07-28 |
JP5143892B2 (ja) | 2013-02-13 |
KR20100116230A (ko) | 2010-10-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5143892B2 (ja) | 均熱装置および有機膜成膜装置 | |
US20210040613A1 (en) | Heater assembly including cooling apparatus and method of using same | |
KR102190775B1 (ko) | 진공 증착 장치 및 증발원의 냉각 방법 | |
JP2011256427A (ja) | 真空蒸着装置における蒸着材料の蒸発、昇華方法および真空蒸着用るつぼ装置 | |
JP5226773B2 (ja) | 均熱装置 | |
JP2014114463A (ja) | 原料気化供給装置 | |
US20140050850A1 (en) | Vacuum apparatus, method for cooling heat source in vacuum, and thin film manufacturing method | |
JP2016014187A (ja) | Cvd装置またはpvd装置用固体または液体出発物質からの蒸気発生装置 | |
US10502466B2 (en) | Heat exchanger for cooling a heating tube and method thereof | |
US9109795B2 (en) | U-tube vaporizer | |
KR102503599B1 (ko) | 진공 디포지션 설비 및 기재를 코팅하기 위한 방법 | |
US11885017B2 (en) | Vaporizer and method for manufacture thereof | |
KR20130065930A (ko) | 스폰지 티타늄 제조설비의 반응로 | |
KR200448282Y1 (ko) | 콤팩트 증발기 및 이를 이용한 증발시스템 | |
TWI837977B (zh) | 蒸鍍源和蒸鍍裝置 | |
US20150329962A1 (en) | Evaporation source for transporting chemical precursors and method of evaporation for transporting the same which uses said source | |
AU2018385555B2 (en) | Vacuum deposition facility and method for coating a substrate | |
JP2018103363A (ja) | 木材処理装置及び木材処理方法 | |
US20110120682A1 (en) | Method and device for the absorption of heat in a vacuum coating apparatus | |
BR112020010757B1 (pt) | Instalação de deposição a vácuo, processo para depositar continuamente e kit para montagem de uma instalação de deposição a vácuo | |
KR20150048447A (ko) | 기화기 및 원료 공급 장치 | |
KR20130065933A (ko) | 스폰지 티타늄 제조설비의 응축장치 | |
KR20130053570A (ko) | 균일한 온도를 유지하도록 한 엠오씨브이디 반응챔버 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200880128669.1 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 08740302 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12934190 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010507104 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20107022287 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 08740302 Country of ref document: EP Kind code of ref document: A1 |