WO2009116136A1 - Nanopâte à base d'argent composite, procédé de production de la nanopâte à base d'argent composite, et procédé de liaison de nanopâte - Google Patents

Nanopâte à base d'argent composite, procédé de production de la nanopâte à base d'argent composite, et procédé de liaison de nanopâte Download PDF

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Publication number
WO2009116136A1
WO2009116136A1 PCT/JP2008/054971 JP2008054971W WO2009116136A1 WO 2009116136 A1 WO2009116136 A1 WO 2009116136A1 JP 2008054971 W JP2008054971 W JP 2008054971W WO 2009116136 A1 WO2009116136 A1 WO 2009116136A1
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WIPO (PCT)
Prior art keywords
silver
composite
resin
temperature
paste
Prior art date
Application number
PCT/JP2008/054971
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English (en)
Japanese (ja)
Inventor
小松　晃雄
岩黒　弘明
良 松林
Original Assignee
株式会社応用ナノ粒子研究所
新電元工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority to PCT/JP2008/050558 priority Critical patent/WO2009090748A1/fr
Application filed by 株式会社応用ナノ粒子研究所, 新電元工業株式会社 filed Critical 株式会社応用ナノ粒子研究所
Priority to PCT/JP2008/054971 priority patent/WO2009116136A1/fr
Priority to JP2010503690A priority patent/JP5256281B2/ja
Priority to PCT/JP2008/061822 priority patent/WO2009090767A1/fr
Priority to PCT/JP2008/062238 priority patent/WO2009116185A1/fr
Priority to JP2010503736A priority patent/JP5306322B2/ja
Priority to US12/735,435 priority patent/US8348134B2/en
Priority to EP08870788.0A priority patent/EP2298471B1/fr
Priority to JP2009549977A priority patent/JP4680313B2/ja
Priority to PCT/JP2008/073660 priority patent/WO2009090846A1/fr
Priority to CN2008801281306A priority patent/CN101990474B/zh
Priority to KR1020107017975A priority patent/KR101222304B1/ko
Priority to PCT/JP2008/073751 priority patent/WO2009090849A1/fr
Publication of WO2009116136A1 publication Critical patent/WO2009116136A1/fr
Priority to US13/707,298 priority patent/US8459529B2/en
Priority to US13/707,384 priority patent/US8906317B2/en

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    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
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    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Abstract

La présente invention concerne une technique pour l'application à des nanoparticules à base d'argent composite de C10 ou C12 dans un état non agrégé, c'est-à-dire, d'une pâte état de non agrégation. La nanopâte composite à base d'argent est caractérisée en ce que les nanoparticules composites à base d'argent comportant une couche de revêtement organique, formée d'au moins d'un élément parmi des résidus de molécules d'alcool ayant 10 ou 12 atomes de carbone, des dérivés de molécules d'alcool et/ou des molécules d'alcool, disposés autour de noyaux d'argent formés d'agrégats d'atomes d'argent, de fines particules d'argent, et une résine sont mélangés de manière homogène pour constituer la nanopâte composite à base d'argent, et la résine peut retenir les nanoparticules composite à base d'argent et les fines particules d'argent dans un état de dispersion homogène dans à l'état solide ou non fluide hautement visqueux à une température égale ou inférieure à 30°C alors que, lorsqu'elle est réchauffée, la résine devient fluide et apte à être appliquée. De préférence, le diamètre moyen des particules des noyaux d'argent est compris entre 1 et 20 nm, le diamètre moyen des particules des fines particules d'argent est compris entre 0,1 et 3,0 μm, le poids des nanoparticules à base d'argent composite est compris entre 5 et 30%, le poids des fines particules d'argent est compris entre 60 et 90%, et le poids de la résine est inférieure ou égale à 15%.
PCT/JP2008/054971 2008-01-17 2008-03-18 Nanopâte à base d'argent composite, procédé de production de la nanopâte à base d'argent composite, et procédé de liaison de nanopâte WO2009116136A1 (fr)

Priority Applications (15)

Application Number Priority Date Filing Date Title
PCT/JP2008/050558 WO2009090748A1 (fr) 2008-01-17 2008-01-17 Nanoparticule composite d'argent et ses processus et appareil de production
PCT/JP2008/054971 WO2009116136A1 (fr) 2008-03-18 2008-03-18 Nanopâte à base d'argent composite, procédé de production de la nanopâte à base d'argent composite, et procédé de liaison de nanopâte
JP2010503690A JP5256281B2 (ja) 2008-03-18 2008-03-18 複合銀ナノペースト、その製法及びナノペースト接合方法
PCT/JP2008/061822 WO2009090767A1 (fr) 2008-01-17 2008-06-30 Nanoparticules d'argent composites, nanopâte d'argent composite, processus et appareil de production de la nanopâte d'argent composite, procédé de liaison, et procédé de formation de motif
PCT/JP2008/062238 WO2009116185A1 (fr) 2008-03-18 2008-07-04 Pâte de nanoparticules d'argent composites, son procédé de production, procédé de connexion et procédé de formation de motifs
JP2010503736A JP5306322B2 (ja) 2008-03-18 2008-07-04 複合銀ナノペースト、その製法、接合方法及びパターン形成方法
EP08870788.0A EP2298471B1 (fr) 2008-01-17 2008-12-25 Nanoparticules d'argent composites, nanopâte d'argent composite, et leurs procédé de production
US12/735,435 US8348134B2 (en) 2008-01-17 2008-12-25 Composite silver nanoparticle, composite silver nanopaste, bonding method and patterning method
JP2009549977A JP4680313B2 (ja) 2008-01-17 2008-12-25 複合銀ナノ粒子、複合銀ナノペースト、その製法、製造装置、接合方法及びパターン形成方法
PCT/JP2008/073660 WO2009090846A1 (fr) 2008-01-17 2008-12-25 Nanoparticules d'argent composites, nanopâte d'argent composite, et leurs procédé de production, appareil de production, procédé de conjugaison et procédé de modelage
CN2008801281306A CN101990474B (zh) 2008-01-17 2008-12-25 复合银纳米粒子、复合银纳米糊膏、其制法、制造装置、接合方法及图案形成方法
KR1020107017975A KR101222304B1 (ko) 2008-01-17 2008-12-25 복합 은나노입자, 복합 은나노 페이스트, 그 제법, 제조장치, 접합방법 및 패턴 형성방법
PCT/JP2008/073751 WO2009090849A1 (fr) 2008-01-17 2008-12-26 Procédé de microcâblage et structure comprenant une partie électronique montée
US13/707,298 US8459529B2 (en) 2008-01-17 2012-12-06 Production method of composite silver nanoparticle
US13/707,384 US8906317B2 (en) 2008-01-17 2012-12-06 Production apparatus of composite silver nanoparticle

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2008/054971 WO2009116136A1 (fr) 2008-03-18 2008-03-18 Nanopâte à base d'argent composite, procédé de production de la nanopâte à base d'argent composite, et procédé de liaison de nanopâte

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PCT/JP2008/062238 WO2009116185A1 (fr) 2008-01-17 2008-07-04 Pâte de nanoparticules d'argent composites, son procédé de production, procédé de connexion et procédé de formation de motifs

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JP2011175871A (ja) * 2010-02-24 2011-09-08 Osaka Municipal Technical Research Institute 接合用材料及び接合方法
JP2013079430A (ja) * 2011-10-05 2013-05-02 Nippon Synthetic Chem Ind Co Ltd:The 金属複合超微粒子の製造方法
JP2013079431A (ja) * 2011-10-05 2013-05-02 Nippon Synthetic Chem Ind Co Ltd:The 金属複合超微粒子の製造方法
JP5306322B2 (ja) * 2008-03-18 2013-10-02 株式会社応用ナノ粒子研究所 複合銀ナノペースト、その製法、接合方法及びパターン形成方法
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WO2011155055A1 (fr) * 2010-06-11 2011-12-15 Ｄｏｗａエレクトロニクス株式会社 Liant permettant le frittage à basse température et procédé de liaison au moyen du liant
JP5487301B2 (ja) * 2010-06-11 2014-05-07 Ｄｏｗａエレクトロニクス株式会社 低温焼結性接合材および該接合材を用いた接合方法
KR102158290B1 (ko) * 2010-11-22 2020-09-21 도와 일렉트로닉스 가부시키가이샤 접합재료, 접합체, 및 접합방법
JP6662619B2 (ja) * 2015-11-30 2020-03-11 Ｄｏｗａエレクトロニクス株式会社 接合材およびそれを用いた接合方法
JP6927490B2 (ja) * 2017-05-31 2021-09-01 株式会社応用ナノ粒子研究所 放熱構造体
CN111095441B (zh) 2017-09-20 2021-11-23 积水化学工业株式会社 含金属粒子、连接材料、连接结构体及连接结构体的制造方法、导通检查用部件以及导通检查装置

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WO2015182489A1 (fr) * 2014-05-30 2015-12-03 Ｄｏｗａエレクトロニクス株式会社 Matériau de liaison, et procédé de liaison l'utilisant
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