WO2009104627A1 - 太陽電池モジュール - Google Patents
太陽電池モジュール Download PDFInfo
- Publication number
- WO2009104627A1 WO2009104627A1 PCT/JP2009/052739 JP2009052739W WO2009104627A1 WO 2009104627 A1 WO2009104627 A1 WO 2009104627A1 JP 2009052739 W JP2009052739 W JP 2009052739W WO 2009104627 A1 WO2009104627 A1 WO 2009104627A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solar cell
- cell module
- connection electrode
- wiring material
- wiring
- Prior art date
Links
- 239000000463 material Substances 0.000 claims abstract description 98
- 239000000853 adhesive Substances 0.000 claims abstract description 45
- 230000001070 adhesive effect Effects 0.000 claims abstract description 45
- 239000011347 resin Substances 0.000 claims abstract description 39
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 238000006243 chemical reaction Methods 0.000 claims description 30
- 239000002245 particle Substances 0.000 claims description 24
- 239000003566 sealing material Substances 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 9
- 239000000969 carrier Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 230000001681 protective effect Effects 0.000 description 10
- 229910021417 amorphous silicon Inorganic materials 0.000 description 9
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 210000003128 head Anatomy 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 6
- 238000007650 screen-printing Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000000839 emulsion Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- -1 Polyethylene Terephthalate Polymers 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0512—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module made of a particular material or composition of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022433—Particular geometry of the grid contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to a solar cell module including a plurality of solar cells connected to each other by a wiring material.
- Solar cells are expected as a new energy source because they can directly convert clean and infinitely supplied solar energy into electrical energy.
- the output per solar cell is about several watts. Therefore, when a solar cell is used as a power source for a house or a building, a solar cell module whose output is increased by connecting a plurality of solar cells is used.
- the plurality of solar cells are electrically connected to each other by the wiring material and sealed by the sealing material.
- the wiring material is connected on the connection electrode formed on the main surface of the solar cell.
- connection electrode a technique for adhering the wiring material to the connection electrode by interposing a resin adhesive that is thermally cured at a temperature lower than the melting temperature of the solder between the wiring material and the connection electrode has been proposed (for example, JP, 2007-214533, A). Electrical connection between the wiring material and the connection electrode is achieved by a plurality of conductive particles contained in the resin adhesive. According to such a method, the influence of the temperature change on the solar cell can be reduced as compared with the case where the wiring material is soldered to the connection electrode.
- connection electrode most of the conductive particles are dispersed from each other. Therefore, there has been a problem that it is difficult to maintain a good electrical connection between the connection electrode and the wiring material due to the displacement of the conductive particles interposed between the connection electrode and the wiring material. .
- the sealing material since the sealing material has a larger linear expansion coefficient than that of the wiring material, the wiring material receives stress from the sealing material according to the temperature change in the usage environment of the solar cell module. By transmitting such stress to the resin adhesive, the resin adhesive is deformed. As a result, there has been a problem that a location where electrical connection cannot be achieved due to a shift in the position of the conductive particles in the resin adhesive.
- This invention is made
- a solar cell module includes a plurality of solar cells, a wiring material that electrically connects the plurality of solar cells to each other, and a sealing material that seals the plurality of solar cells.
- One solar cell included in the battery includes a photoelectric conversion unit that generates a photogenerated carrier by receiving light, and a connection electrode that is formed on the photoelectric conversion unit and to which a wiring material is connected. It is connected to the connection electrode by an adhesive, and the connection electrode has a plurality of convex portions that directly contact the wiring material.
- connection electrode since the connection electrode has a plurality of convex portions that are in direct contact with the wiring material, the electrical connection between the connection electrode and the wiring material can be improved. Therefore, maintaining good electrical connection between the connection electrode and the wiring material even when the wiring material is subjected to stress from the sealing material in accordance with temperature changes in the usage environment of the solar cell module Can do.
- the plurality of convex portions directly contact each other so as to bite into the wiring material. Since the contact area between the connection electrode and the wiring material is increased by the plurality of protrusions biting into the wiring material in this manner, the electrical connection between the connection electrode and the wiring material becomes better, The mechanical connection strength can be increased.
- each of the plurality of convex portions may bite into the wiring material.
- the wiring member is composed of a low-resistance body and a conductor covering the outer periphery of the low-resistance body, and the plurality of protrusions may bite into the conductor. Good.
- the ratio of the sum of the biting widths of the plurality of convex portions to the wiring material with respect to the width of the wiring material is 0.05 or more.
- the plurality of protrusions includes a plurality of first protrusions and a plurality of second protrusions higher than the plurality of first protrusions, and the plurality of first protrusions.
- a part of each part may be in direct contact with the wiring material.
- the plurality of first protrusions may be arranged along a direction intersecting with an arrangement direction in which the plurality of solar cells are arranged.
- the resin adhesive may include a plurality of conductive particles.
- the plurality of conductive particles may be dispersed in the resin adhesive.
- FIG. 1 is a side view of a solar cell module 100 according to an embodiment of the present invention.
- FIG. 2 is an enlarged plan view of the solar cell string 1 according to the embodiment of the present invention.
- FIG. 3 is a plan view of the solar cell 10 according to the embodiment of the present invention.
- FIG. 4 is an enlarged plan view of the connection electrode 40 according to the embodiment of the present invention.
- FIG. 5 is a cross-sectional view taken along line AA in FIG. 6 is a cross-sectional view taken along line BB in FIG.
- FIG. 7 is a cross-sectional view taken along line XX of FIG.
- FIG. 8 is a cross-sectional view taken along line YY in FIG.
- FIG. 9 is an enlarged view of FIG.
- FIG. 1 is a side view of a solar cell module 100 according to the present embodiment.
- FIG. 2 is an enlarged plan view of the solar cell string 1.
- the solar cell module 100 includes a solar cell string 1, a light receiving surface side protective material 2, a back surface side protective material 3, and a sealing material 4.
- the solar cell module 100 is configured by sealing the solar cell string 1 with a sealing material 4 between the light receiving surface side protective material 2 and the back surface side protective material 3.
- the solar cell string 1 includes a plurality of solar cells 10, a wiring material 11, and a resin adhesive 12.
- the solar cell string 1 is configured by connecting a plurality of solar cells 10 to each other by a wiring material 11.
- the plurality of solar cells 10 are arranged along the arrangement direction H.
- the solar cell 10 includes a photoelectric conversion unit 20, a thin wire electrode 30, and a connection electrode 40. The detailed configuration of the solar cell 10 will be described later.
- Wiring member 11 electrically connects a plurality of solar cells 10 to each other. Specifically, the wiring member 11 is connected to the connection electrode 40 of one solar cell 10 and the connection electrode 40 of another solar cell 10 adjacent to the one solar cell 10. The wiring member 11 is connected to the connection electrode 40 by the resin adhesive 12.
- the wiring member 11 is composed of a low resistance body and a conductor covering the outer periphery of the low resistance body.
- a low resistance body a thin plate or twisted copper, silver, gold, tin, nickel, aluminum, or an alloy thereof can be used.
- the conductor a material having a hardness smaller than that of the low resistance body can be used.
- the protrusions of the connection electrode 40 described later have a hardness that can be bitten.
- lead-free solder plating, tin plating, or the like can be used.
- the resin adhesive 12 is inserted between the wiring member 11 and the connection electrode 40.
- the resin adhesive 12 is preferably cured at a temperature below the melting point of the eutectic solder, that is, at a temperature of about 200 ° C. or less.
- the resin adhesive 12 include a two-component reaction type adhesive in which a curing agent is mixed with an epoxy resin, an acrylic resin, or a urethane resin, in addition to a thermosetting resin adhesive such as an acrylic resin or a highly flexible polyurethane system. A material etc. can be used.
- the width of the resin adhesive 12 may be substantially the same as the width of the wiring material 11 or may be narrower than the width of the wiring material 11.
- the resin adhesive 12 may be conductive or insulative.
- the resin adhesive 12 may contain a plurality of conductive particles.
- the conductive particles nickel, nickel with gold coating, or the like can be used.
- Such conductive particles are preferably added to the resin adhesive 12 in an amount of 2 to 20 (vol.%) In order to ensure the function of the resin adhesive 12 as an adhesive.
- the resin adhesive 12 when the resin adhesive 12 is insulative, the resin adhesive 12 may contain a plurality of insulating particles. Conventionally known particles such as Al 2 O 3 particles can be used as the insulating particles.
- the light receiving surface side protective material 2 is disposed on the light receiving surface side of the sealing material 4 and protects the surface of the solar cell module 100.
- As the light-receiving surface side protective material 2 glass having translucency and water shielding properties, translucent plastic, or the like can be used.
- the back surface side protective material 3 is arrange
- a resin film such as PET (Polyethylene Terephthalate), a laminated film having a structure in which an Al foil is sandwiched between resin films, and the like can be used.
- the sealing material 4 seals the solar cell string 1 between the light-receiving surface side protective material 2 and the back surface side protective material 3.
- a translucent resin such as EVA, EEA, PVB, silicon, urethane, acrylic, or epoxy can be used.
- an Al frame (not shown) can be attached to the outer periphery of the solar cell module 100 having the above-described configuration.
- FIG. 3 is a plan view of the solar cell 10.
- the solar cell 10 includes a photoelectric conversion unit 20, a thin wire electrode 30, and a connection electrode 40.
- the photoelectric conversion unit 20 has a light receiving surface and a back surface formed on the opposite side of the light receiving surface.
- the photoelectric conversion unit 20 generates photogenerated carriers by receiving light on the light receiving surface.
- the photogenerated carrier refers to holes and electrons generated by absorption of sunlight into the photoelectric conversion unit 20.
- the photoelectric conversion unit 20 includes a semiconductor junction such as a pn-type junction or a pin junction.
- the photoelectric conversion unit 20 can be formed using a general semiconductor material such as a crystalline semiconductor material such as single crystal Si or polycrystalline Si, or a compound semiconductor material such as GaAs or InP.
- the photoelectric conversion unit 20 may have a so-called HIT structure in which a substantially intrinsic amorphous silicon layer is sandwiched between a single crystal silicon substrate and an amorphous silicon layer.
- the fine wire electrode 30 is a collecting electrode that collects carriers from the photoelectric conversion unit 20.
- a plurality of fine wire electrodes 30 are formed on the photoelectric conversion unit 20 along an orthogonal direction T substantially orthogonal to the arrangement direction H.
- the fine wire electrode 30 can be formed, for example, by applying a resin-type conductive paste, a sintered-type conductive paste (ceramic paste), or the like using a coating method or a printing method.
- the thin wire electrode 30 is similarly formed on the light receiving surface and the back surface of the photoelectric conversion unit 20.
- the dimensions and number of the thin wire electrodes 30 can be set to an appropriate number in consideration of the size and physical properties of the photoelectric conversion unit 20. For example, when the size of the photoelectric conversion unit 20 is about 100 mm square, about 50 fine wire electrodes 30 can be formed.
- connection electrode 40 is an electrode for connecting the wiring material 11.
- the connection electrode 40 is formed along the arrangement direction H on the photoelectric conversion unit 20. Therefore, the connection electrode 40 intersects with the plurality of fine wire electrodes 30.
- the connection electrode 40 can be formed by applying a resin-type conductive paste, a sintered-type conductive paste (ceramic paste) or the like using a coating method or a printing method in the same manner as the thin wire electrode 30.
- connection electrode 40 is similarly formed on the light receiving surface and the back surface of the photoelectric conversion unit 20.
- the dimensions and number of the connection electrodes 40 can be set to an appropriate number in consideration of the size and physical properties of the photoelectric conversion unit 20. For example, when the dimension of the photoelectric conversion unit 20 is about 100 mm square, two connection electrodes 40 having a width of about 1.5 mm can be formed.
- FIG. 4 is an enlarged view of the surface of the connection electrode 40 shown in FIG.
- FIG. 5 is a cross-sectional view taken along line AA in FIG. 6 is a cross-sectional view taken along line BB in FIG.
- a plurality of convex portions 40 a are formed on the surface of the connection electrode 40 facing the wiring material 11.
- the plurality of convex portions 40a can be formed by a printing method such as screen printing, for example.
- a plate used for screen printing has a portion in which the mesh eyes in which wires are stretched in a lattice shape are filled with the emulsion, and a portion in which the emulsion is lost in the shape of the connection electrode 40.
- the resin-type conductive paste is extruded onto the photoelectric conversion unit 20 from the mesh eyes where the emulsion is missing. Therefore, a plurality of convex portions 40 a corresponding to mesh eyes are formed on the surface of the connection electrode 40.
- the plurality of convex portions 40 a are continuous along the intersecting direction K intersecting the arrangement direction H. This is because when the fine line electrode 30 and the connection electrode 40 are simultaneously screen-printed, the wire portion of the mesh is not overlapped with the position of the fine line electrode 30.
- a bias angle of about 30 degrees is provided between the arrangement direction H and the crossing direction K.
- the height ⁇ of the plurality of convex portions 40a is about 5 to 20 ⁇ m, and the pitch ⁇ indicating the vertex interval of the convex portions 40a is about 30 ⁇ m.
- a plurality of convex portions 40 a having different heights are arranged along an orthogonal direction T substantially orthogonal to the arrangement direction H.
- the pitch ⁇ indicating the vertex interval of the convex portion 40a in the orthogonal direction T is about 100 ⁇ m.
- FIG. 7 is a cross-sectional view taken along line XX (crossing direction K) in FIG. 8 is a cross-sectional view taken along line YY (orthogonal direction T) in FIG.
- the plurality of convex portions 40 a are in direct contact with the wiring material 11. Specifically, the plurality of convex portions 40 a bite into the above-described conductor in the wiring member 11. Thereby, the electrical and mechanical connection between the connection electrode 40 and the wiring member 11 is directly achieved.
- the resin adhesive 12 is sandwiched between the connection electrode 40 and the wiring material 11.
- the plurality of convex portions 40a penetrate the resin adhesive material 12, and the resin adhesive material 12 is disposed between the plurality of convex portions 40a.
- the wiring member 11 is bonded to the connection electrode 40 by the resin adhesive 12. Further, when the resin adhesive 12 includes a plurality of conductive particles, the connection electrode 40 and the wiring member 11 can be electrically connected through the plurality of conductive particles.
- FIG. 9 is an enlarged view of FIG. As shown in FIG. 9, the width of the wiring member 11 in the orthogonal direction T is ⁇ .
- the n convex portions 40a bite into the wiring member 11, and the biting width ⁇ in the orthogonal direction T of each of the n convex portions 40a is ⁇ 1, ⁇ 2, ..., ⁇ n-1, ⁇ n.
- the ratio ⁇ of the total sum of the biting widths ⁇ of the n convex portions 40a to the width ⁇ of the wiring member 11 is ( ⁇ 1 + ⁇ 2 +... ⁇ n-1 + ⁇ n) / ⁇ .
- the ratio ⁇ can be appropriately set in consideration of the amount of power generation in the photoelectric conversion unit 20 and the presence / absence of conductive particles. However, sufficient electrical and mechanical connection between the connection electrode 40 and the wiring member 11 is ensured. In order to achieve this, the ratio ⁇ is preferably 0.05 or more.
- an i-type amorphous silicon layer and a p-type amorphous silicon layer are sequentially laminated on the light-receiving surface side of an n-type single crystal silicon substrate by using a CVD (chemical vapor deposition) method.
- an i-type amorphous silicon layer and an n-type amorphous silicon layer are sequentially stacked on the back side of the n-type single crystal silicon substrate.
- the i-type amorphous silicon layers formed on the light-receiving surface side and the back surface side of the n-type single crystal silicon substrate are formed to a thickness that does not substantially contribute to power generation, for example, a thickness of several to 250 mm. .
- an ITO film is formed on the light receiving surface side of the p-type amorphous silicon layer using PVD (physical vapor deposition). Similarly, an ITO film is formed on the back side of the n-type amorphous silicon layer. Thus, the photoelectric conversion unit 20 is manufactured.
- an epoxy thermosetting silver paste is arranged in a pattern shown in FIG. 3 on the light receiving surface and the back surface of the photoelectric conversion unit 20 by using a printing method such as a screen printing method.
- a printing method such as a screen printing method.
- a plurality of convex portions 40 a corresponding to mesh eyes used for screen printing are formed on the surface of the connection electrode 40.
- the silver paste is heated and cured under predetermined conditions.
- the solar cell 10 is produced.
- the wiring member 11 is thermocompression-bonded on the connection electrode 40 via the resin adhesive 12 containing a plurality of conductive particles. Specifically, first, the resin adhesive 12 and the wiring material 11 are sequentially arranged on the connection electrodes 40 formed on the light receiving surface and the back surface of the photoelectric conversion unit 20. Next, the wiring member 11 is pressed toward the solar cell 10 using a heater block. As a result, all or some of the plurality of convex portions 40 a formed on the surface of the connection electrode 40 facing the wiring member 11 are in direct contact with the wiring member 11. At this time, by adjusting the pressure and temperature, all or a part of the plurality of convex portions 40 a can be made to bite into the conductor in the wiring member 11. Thus, the solar cell string 1 is created.
- an EVA (sealing material 4) sheet, a solar cell string 1, an EVA (sealing material 4) sheet, and a PET sheet (back surface side protection material 3) are sequentially placed on the glass substrate (light-receiving surface side protection material 2). Laminate to make a laminate.
- the EVA is cured by thermocompression bonding of the laminate.
- the solar cell module 100 is manufactured.
- a terminal box, an Al frame, or the like can be attached to the solar cell module 100.
- the wiring member 11 is connected to the connection electrode 40 by the resin adhesive 12, and the connection electrode 40 includes a plurality of convex portions 40 a that are in direct contact with the wiring member 11. Have.
- connection electrode 40 since the connection electrode 40 includes the plurality of convex portions 40a that are in direct contact with the wiring material 11, the electrical connection between the connection electrode 40 and the wiring material 11 can be improved. Therefore, even if the wiring material 11 is subjected to stress from the sealing material 4 according to the temperature change in the usage environment of the solar cell module 100, good electrical connection between the connection electrode 40 and the wiring material 11 is achieved. Connection can be maintained.
- the plurality of convex portions 40 a according to the present embodiment are in direct contact with each other so as to bite into the wiring material 11. Since the contact area between the connection electrode 40 and the wiring material 11 is increased by the plurality of protrusions 40a biting into the wiring material 11 in this manner, the electrical connection between the connection electrode 40 and the wiring material 11 is better. And mechanical connection strength can be increased.
- the position of the wiring material 11 may be microscopically displaced from the connection electrode 40 due to the stress received from the sealing material 4. Also in this case, since the plurality of convex portions 40a are in direct contact with the wiring member 11, electrical connection can be maintained well. Moreover, when the some convex part 40a has bite into the wiring material 11, since the several convex part 40a is caught in the wiring material 11, the wiring material 11 can return to the original position. Therefore, the electrical connection between the wiring member 11 and the connection electrode 40 can be maintained satisfactorily.
- the resin adhesive 12 includes a plurality of conductive particles.
- a better electrical connection between the connection electrode 40 and the wiring member 11 can be achieved.
- the connection electrodes 40 and the wiring material 11 are mechanically and firmly connected by the plurality of convex portions 40 a biting into the wiring material 11. Therefore, it is possible to suppress the displacement of the conductive particles due to the deformation of the resin adhesive 12.
- the plurality of convex portions 40a are formed by the screen printing method.
- the conductive electrode 40 is mechanically processed, or the conductive paste is overcoated on the surface of the connecting electrode 40. By doing so, a plurality of convex portions 40a may be formed.
- the plurality of convex portions 40 a bite into the wiring material 11, but the plurality of convex portions 40 a may be in direct contact with the surface of the wiring material 11.
- connection electrode 40 may have a convex portion 40 a that is in direct contact with the wiring member 11 and a convex portion that is not in direct contact with the wiring member 11.
- the plurality of convex portions 40a may include a plurality of first convex portions having a large height and a plurality of second convex portions having a small height.
- the some 1st convex part may contact the wiring material directly among the some convex parts 40a.
- the plurality of second convex portions may be separated from the wiring material.
- a bias angle of about 30 ° is provided between the arrangement direction H and the crossing direction K, but there is no limit to the magnitude of such a bias angle. Further, the plurality of convex portions 40 a may be continued along the arrangement direction H.
- the plurality of regularly arranged convex portions 40a are formed on the surface of the connection electrode 40.
- the height of the plurality of convex portions 40a and the pitch between the vertices are irregular. Also good.
- connection electrodes 40 are continuously formed along the arrangement direction H.
- connection electrodes 40 may be divided into a plurality along the arrangement direction H.
- the present invention does not limit the shape of the connection electrode 40.
- the thin wire electrode 30 and the connection electrode 40 are formed on the back surface of the photoelectric conversion unit 20, but the electrode may be formed so as to cover the entire back surface.
- the present invention does not limit the shape of the electrode formed on the back surface of the photoelectric conversion unit 20.
- the thin wire electrode 30 is formed in a line shape along the orthogonal direction, but the shape of the thin wire electrode 30 is not limited to this.
- a plurality of fine wire electrodes 30 formed in a wavy shape may intersect in a lattice shape.
- Example 1 First, a photoelectric conversion part was manufactured using an n-type single crystal silicon substrate having a size of 100 mm square.
- connection electrodes On the light receiving surface and the back surface of the photoelectric conversion portion, fine wire electrodes and connection electrodes were formed in a lattice shape (see FIG. 3) using an epoxy thermosetting silver paste by screen printing.
- the connection electrode had a height of 50 ⁇ m and a width of 1.5 mm.
- an epoxy resin adhesive was applied to the connection electrode formed on the light receiving surface of one solar cell and the connection electrode formed on the back surface of another adjacent solar cell.
- the epoxy resin-based adhesive one in which about 10,000 nickel particles were kneaded in 1 mm 3 of epoxy resin was used.
- an epoxy resin adhesive formed in a film shape may be disposed on the connection electrode.
- a wiring material was prepared by plating SnAgCu solder on the surface of a flat copper foil having a width of 1.5 mm. Subsequently, a wiring material was placed on the epoxy resin adhesive, and pressure was applied from above and below the wiring material at 0.25 MPa for 60 seconds with a metal head heated to 200 ° C.
- a solar cell module according to Example 1 was manufactured by sealing such a solar cell string with EVA between glass and a PET film.
- Example 2 A solar cell module according to Example 2 was manufactured at a pressure applied to the wiring member by the metal head of 0.5 MPa. Other steps were the same as those in the first example.
- Example 3 A solar cell module according to Example 3 was manufactured at a pressure applied to the wiring member by the metal head of 0.75 MPa. Other steps were the same as those in the first example.
- Example 4 A solar cell module according to Example 4 was manufactured at a pressure applied to the wiring member by the metal head of 1.0 MPa. Other steps were the same as those in the first example.
- Example 5 A solar cell module according to Example 5 was manufactured at a pressure applied to the wiring member by the metal head of 2.0 MPa. Other steps were the same as those in the first example.
- a solar cell module according to a comparative example was manufactured by setting the pressure applied to the wiring member by the metal head to 0.02 MPa. Other steps were the same as those in the first example.
- the temperature cycle test was conducted in accordance with the provisions of JIS C 8917. Specifically, each sample is held in a thermostatic bath, raised from 25 ° C. to 90 ° C. over 45 minutes, held at this temperature for 90 minutes, and then lowered to ⁇ 40 ° C. over 90 minutes. Hold for 90 minutes and then increase to 25 ° C. over 45 minutes. This was defined as 1 cycle (6 hours), and 550 cycles were performed.
- Table 2 shows the results of measuring the output of the solar cell module before and after the test. Table 2 shows values normalized by setting the output value before the test of Example 5 to 100. In addition, the output of the solar cell module was measured under light irradiation of AM 1.5 and 100 mW / cm 2 .
- the output could be maintained even after the temperature cycle test.
- Table 1 the electrical connection between the connection electrode and the wiring material was maintained satisfactorily when the convex portion of the connection electrode was in direct contact with the wiring material. That is, it was confirmed that a good electrical connection between the connection electrode and the wiring material can be maintained by the convex portion being in direct contact with the wiring material.
- Table 1 since the ratio ⁇ in Example 1 with the smallest applied pressure was 0.05, it was found that the ratio ⁇ is preferably 0.05 or more.
- connection electrode since the convex portion of the connection electrode was not in direct contact with the wiring material, the electrical connection between the connection electrode and the wiring material could not be maintained.
- the present invention it is possible to provide a solar cell module capable of maintaining a good electrical connection between the wiring material and the connection electrode, which is useful in the photovoltaic power generation field.
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
本発明の特徴に係る太陽電池モジュールにおいて、樹脂接着材は、複数の導電性粒子を含んでいてもよい。
本発明の実施形態に係る太陽電池モジュール100の概略構成について、図1及び図2を参照しながら説明する。図1は、本実施形態に係る太陽電池モジュール100の側面図である。図2は、太陽電池ストリング1の拡大平面図である。
次に、太陽電池10の構成について、図3を参照しながら説明する。図3は、太陽電池10の平面図である。
次に、接続用電極40が有する凸部40aについて、図4乃至図6を参照しながら説明する。図4は、図3に示す接続用電極40の表面の拡大図である。図5は、図4のA-A線における断面図である。図6は、図4のB-B線における断面図である。
次に、接続用電極40と配線材11との接続について、図7及び図8を参照しながら説明する。図7は、図2のX-X線(交差方向K)における断面図である。図8は、図2のY-Y線(直交方向T)における断面図である。
次に、本実施形態に係る太陽電池モジュール100の製造方法の一例について説明する。
本実施形態に係る太陽電池モジュール100において、配線材11は、樹脂接着材12によって接続用電極40上に接続されており、接続用電極40は、配線材11に直接接する複数の凸部40aを有する。
本発明は上記の実施形態によって記載したが、この開示の一部をなす論述及び図面はこの発明を限定するものであると理解すべきではない。この開示から当業者には様々な代替実施形態、実施例及び運用技術が明らかとなろう。
まず、寸法100mm角のn型単結晶シリコン基板を用いて光電変換部を作製した。
金属ヘッドによって配線材に加える圧力を0.5MPaとして、実施例2に係る太陽電池モジュールを作製した。その他の工程は、上記第1実施例と同様とした。
金属ヘッドによって配線材に加える圧力を0.75MPaとして、実施例3に係る太陽電池モジュールを作製した。その他の工程は、上記第1実施例と同様とした。
金属ヘッドによって配線材に加える圧力を1.0MPaとして、実施例4に係る太陽電池モジュールを作製した。その他の工程は、上記第1実施例と同様とした。
金属ヘッドによって配線材に加える圧力を2.0MPaとして、実施例5に係る太陽電池モジュールを作製した。その他の工程は、上記第1実施例と同様とした。
金属ヘッドによって配線材に加える圧力を0.02MPaとして、比較例に係る太陽電池モジュールを作製した。その他の工程は、上記第1実施例と同様とした。
上述した実施例1~5及び比較例に係る太陽電池モジュールについて、接続用電極の凸部が配線材に食込んでいる様子を観測した。
次に、実施例1~5及び比較例に係る太陽電池モジュールについて、恒温槽を用いて温度サイクル試験を行った。
Claims (8)
- 複数の太陽電池と、
前記複数の太陽電池を互いに電気的に接続する配線材と、
前記複数の太陽電池を封止する封止材と
を備え、
前記複数の太陽電池に含まれる一の太陽電池は、
受光により光生成キャリアを生成する光電変換部と、
前記光電変換部上に形成され、前記配線材が接続される接続用電極と
を有し、
前記配線材は、樹脂接着材によって前記接続用電極上に接続されており、
前記接続用電極は、前記配線材に直接接触する複数の凸部を有する
ことを特徴とする太陽電池モジュール。 - 前記複数の凸部それぞれは、前記配線材に食い込んでいる
ことを特徴とする請求項1に記載の太陽電池モジュール。 - 前記配線材は、低抵抗体と、前記低抵抗体の外周を覆う導電体とによって構成されており、
前記複数の凸部は、前記導電体に食込む
ことを特徴とする請求項2に記載の太陽電池モジュール。 - 前記複数の太陽電池が配列される配列方向と略直交する方向において、前記配線材の幅に対する前記複数の凸部それぞれの前記配線材への食い込み幅の総和の比率は、0.05以上である
ことを特徴とする請求項2又は3に記載の太陽電池モジュール。 - 前記複数の凸部は、複数の第1凸部と、前記複数の第1凸部より高い複数の第2凸部とを含んでおり、
前記複数の第1凸部それぞれの一部は、前記配線材に直接接触する
ことを特徴とする請求項1乃至4のいずれかに記載の太陽電池モジュール。 - 前記複数の第1凸部は、前記複数の太陽電池が配列される配列方向と交差する方向に沿って配列されている
ことを特徴とする請求項5に記載の太陽電池モジュール。 - 前記樹脂接着材は、複数の導電性粒子を含む
ことを特徴とする請求項1乃至6のいずれかに記載の太陽電池モジュール。 - 前記複数の導電性粒子は、前記樹脂接着材中に分散されている
ことを特徴とする請求項7に記載の太陽電池モジュール。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/867,784 US9082917B2 (en) | 2008-02-21 | 2009-02-18 | Solar cell module |
CN200980105997.4A CN101952976B (zh) | 2008-02-21 | 2009-02-18 | 太阳能电池模块 |
JP2009554337A JP5367588B2 (ja) | 2008-02-21 | 2009-02-18 | 太陽電池モジュール |
KR1020107018587A KR101509844B1 (ko) | 2008-02-21 | 2009-02-18 | 태양 전지 모듈 |
EP09711661.0A EP2249397B1 (en) | 2008-02-21 | 2009-02-18 | Solar cell module |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008040589 | 2008-02-21 | ||
JP2008-040589 | 2008-02-21 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009104627A1 true WO2009104627A1 (ja) | 2009-08-27 |
Family
ID=40985505
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2009/052739 WO2009104627A1 (ja) | 2008-02-21 | 2009-02-18 | 太陽電池モジュール |
Country Status (7)
Country | Link |
---|---|
US (1) | US9082917B2 (ja) |
EP (1) | EP2249397B1 (ja) |
JP (1) | JP5367588B2 (ja) |
KR (1) | KR101509844B1 (ja) |
CN (1) | CN101952976B (ja) |
TW (1) | TWI438915B (ja) |
WO (1) | WO2009104627A1 (ja) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2009107804A1 (ja) * | 2008-02-28 | 2011-07-07 | 三洋電機株式会社 | 太陽電池モジュール |
WO2011148840A1 (ja) * | 2010-05-28 | 2011-12-01 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
WO2011152319A1 (ja) * | 2010-05-31 | 2011-12-08 | 三洋電機株式会社 | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
WO2012073926A1 (ja) * | 2010-11-30 | 2012-06-07 | 京セラ株式会社 | 光電変換モジュール |
JP2012134393A (ja) * | 2010-12-22 | 2012-07-12 | Sony Chemical & Information Device Corp | 太陽電池モジュールの製造方法及び太陽電池モジュール |
KR101197780B1 (ko) * | 2010-10-07 | 2012-11-06 | 엘지이노텍 주식회사 | 태양전지 모듈용 접속부재 및 이를 포함하는 태양전지 모듈 |
US20130237000A1 (en) * | 2010-10-26 | 2013-09-12 | Sanyo Electric Co., Ltd. | Method of manufacturing solar cell module |
WO2014002249A1 (ja) * | 2012-06-29 | 2014-01-03 | 三洋電機株式会社 | 太陽電池、太陽電池モジュール、及び太陽電池の製造方法 |
WO2015092900A1 (ja) * | 2013-12-19 | 2015-06-25 | 日立化成株式会社 | 太陽電池及び太陽電池モジュール |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2450239B1 (en) * | 2010-11-04 | 2014-03-19 | Inalfa Roof Systems Group B.V. | Method for connecting two objects and panel using said method |
TWI634668B (zh) * | 2013-12-19 | 2018-09-01 | 日商日立化成股份有限公司 | 太陽電池以及太陽電池模組 |
KR102271055B1 (ko) * | 2014-06-26 | 2021-07-01 | 엘지전자 주식회사 | 태양 전지 모듈 |
EP3333863A4 (en) * | 2015-08-06 | 2019-03-20 | Fujikura Ltd. | PHOTOELECTRIC CONVERSION ELEMENT |
WO2018207859A1 (ja) * | 2017-05-10 | 2018-11-15 | シャープ株式会社 | 光電変換装置およびそれを備える太陽電池モジュール |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156693A (ja) * | 2004-11-29 | 2006-06-15 | Kyocera Corp | 太陽電池素子及び、これを用いた太陽電池モジュール |
JP2007214533A (ja) | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
WO2007122897A1 (ja) * | 2006-03-28 | 2007-11-01 | Sharp Kabushiki Kaisha | インターコネクタ付き太陽電池、太陽電池モジュールおよび太陽電池モジュールの製造方法 |
WO2008023795A1 (en) * | 2006-08-25 | 2008-02-28 | Sanyo Electric Co., Ltd. | Solar battery module and solar battery module manufacturing method |
WO2008041487A1 (en) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co., Ltd. | Solar battery module |
JP2008135652A (ja) * | 2006-11-29 | 2008-06-12 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2008147567A (ja) * | 2006-12-13 | 2008-06-26 | Sanyo Electric Co Ltd | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
IL77364A (en) * | 1984-12-28 | 1991-01-31 | Monsanto Co | Thermal dealkylation of n-alkyl n-phosphono-methylglycine |
JP3448924B2 (ja) * | 1993-11-25 | 2003-09-22 | 富士電機株式会社 | 薄膜太陽電池モジュールの製造方法 |
JPH09153634A (ja) * | 1995-11-29 | 1997-06-10 | Sony Corp | 太陽電池用電極内蔵透明基板およびその製造方法ならびに太陽電池装置 |
JP3591223B2 (ja) * | 1997-06-05 | 2004-11-17 | 富士電機ホールディングス株式会社 | 太陽電池モジュール |
JP2001044459A (ja) * | 1999-07-29 | 2001-02-16 | Kyocera Corp | 太陽電池 |
JP4746732B2 (ja) * | 2000-05-31 | 2011-08-10 | キヤノン株式会社 | 画像表示装置の製造方法 |
KR101087202B1 (ko) * | 2003-11-27 | 2011-11-29 | 쿄세라 코포레이션 | 태양 전지 모듈 |
JP2005244171A (ja) * | 2003-11-28 | 2005-09-08 | Kyocera Corp | 光電変換装置および光電変換アレイならびに光発電装置 |
US20050115602A1 (en) * | 2003-11-28 | 2005-06-02 | Kyocera Corporation | Photo-electric conversion cell and array, and photo-electric generation system |
JP2005252210A (ja) * | 2004-02-03 | 2005-09-15 | Sharp Corp | 太陽電池 |
JP5323310B2 (ja) * | 2005-11-10 | 2013-10-23 | 日立化成株式会社 | 接続構造及びその製造方法 |
US20070235077A1 (en) * | 2006-03-27 | 2007-10-11 | Kyocera Corporation | Solar Cell Module and Manufacturing Process Thereof |
KR101171646B1 (ko) * | 2006-04-26 | 2012-08-07 | 히다치 가세고교 가부시끼가이샤 | 접착 테이프 및 그것을 이용한 태양 전지 모듈 |
JP3123842U (ja) * | 2006-05-18 | 2006-07-27 | 京セラケミカル株式会社 | 太陽電池モジュール |
CN101669258B (zh) * | 2007-05-09 | 2016-04-13 | 日立化成株式会社 | 导电体的连接方法、导电体连接用部件、连接结构及太阳能电池模块 |
JP2009158858A (ja) * | 2007-12-27 | 2009-07-16 | Sanyo Electric Co Ltd | 太陽電池モジュール及びその製造方法 |
WO2011108467A1 (ja) * | 2010-03-01 | 2011-09-09 | 古河電気工業株式会社 | 銅箔の表面処理方法、表面処理銅箔およびリチウムイオン二次電池の負極集電体用銅箔 |
-
2009
- 2009-02-11 TW TW98104279A patent/TWI438915B/zh active
- 2009-02-18 JP JP2009554337A patent/JP5367588B2/ja active Active
- 2009-02-18 KR KR1020107018587A patent/KR101509844B1/ko active IP Right Grant
- 2009-02-18 WO PCT/JP2009/052739 patent/WO2009104627A1/ja active Application Filing
- 2009-02-18 US US12/867,784 patent/US9082917B2/en active Active
- 2009-02-18 CN CN200980105997.4A patent/CN101952976B/zh active Active
- 2009-02-18 EP EP09711661.0A patent/EP2249397B1/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156693A (ja) * | 2004-11-29 | 2006-06-15 | Kyocera Corp | 太陽電池素子及び、これを用いた太陽電池モジュール |
JP2007214533A (ja) | 2006-01-16 | 2007-08-23 | Hitachi Chem Co Ltd | 導電性接着フィルム及び太陽電池モジュール |
WO2007122897A1 (ja) * | 2006-03-28 | 2007-11-01 | Sharp Kabushiki Kaisha | インターコネクタ付き太陽電池、太陽電池モジュールおよび太陽電池モジュールの製造方法 |
WO2008023795A1 (en) * | 2006-08-25 | 2008-02-28 | Sanyo Electric Co., Ltd. | Solar battery module and solar battery module manufacturing method |
WO2008041487A1 (en) * | 2006-09-28 | 2008-04-10 | Sanyo Electric Co., Ltd. | Solar battery module |
JP2008135652A (ja) * | 2006-11-29 | 2008-06-12 | Sanyo Electric Co Ltd | 太陽電池モジュール |
JP2008147567A (ja) * | 2006-12-13 | 2008-06-26 | Sanyo Electric Co Ltd | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2009107804A1 (ja) * | 2008-02-28 | 2011-07-07 | 三洋電機株式会社 | 太陽電池モジュール |
WO2011148840A1 (ja) * | 2010-05-28 | 2011-12-01 | 三洋電機株式会社 | 太陽電池モジュール及びその製造方法 |
JP2011249663A (ja) * | 2010-05-28 | 2011-12-08 | Sanyo Electric Co Ltd | 太陽電池モジュール及びその製造方法 |
US8927851B2 (en) | 2010-05-31 | 2015-01-06 | Sanyo Electric Co., Ltd. | Solar cell module and method of manufacturing solar cell module |
WO2011152319A1 (ja) * | 2010-05-31 | 2011-12-08 | 三洋電機株式会社 | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
JP5991534B2 (ja) * | 2010-05-31 | 2016-09-14 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
JP2016006913A (ja) * | 2010-05-31 | 2016-01-14 | パナソニックIpマネジメント株式会社 | 太陽電池モジュール及び太陽電池モジュールの製造方法 |
KR101197780B1 (ko) * | 2010-10-07 | 2012-11-06 | 엘지이노텍 주식회사 | 태양전지 모듈용 접속부재 및 이를 포함하는 태양전지 모듈 |
US9530924B2 (en) * | 2010-10-26 | 2016-12-27 | Panasonic Intellectual Property Management Co., Ltd. | Method of manufacturing solar cell module |
US20130237000A1 (en) * | 2010-10-26 | 2013-09-12 | Sanyo Electric Co., Ltd. | Method of manufacturing solar cell module |
WO2012073926A1 (ja) * | 2010-11-30 | 2012-06-07 | 京セラ株式会社 | 光電変換モジュール |
JP5460882B2 (ja) * | 2010-11-30 | 2014-04-02 | 京セラ株式会社 | 光電変換モジュール |
CN103262256A (zh) * | 2010-12-22 | 2013-08-21 | 迪睿合电子材料有限公司 | 太阳能电池模块的制造方法及太阳能电池模块 |
JP2012134393A (ja) * | 2010-12-22 | 2012-07-12 | Sony Chemical & Information Device Corp | 太陽電池モジュールの製造方法及び太陽電池モジュール |
WO2014002249A1 (ja) * | 2012-06-29 | 2014-01-03 | 三洋電機株式会社 | 太陽電池、太陽電池モジュール、及び太陽電池の製造方法 |
JPWO2014002249A1 (ja) * | 2012-06-29 | 2016-05-30 | パナソニックIpマネジメント株式会社 | 太陽電池、太陽電池モジュール、及び太陽電池の製造方法 |
WO2015092900A1 (ja) * | 2013-12-19 | 2015-06-25 | 日立化成株式会社 | 太陽電池及び太陽電池モジュール |
Also Published As
Publication number | Publication date |
---|---|
CN101952976A (zh) | 2011-01-19 |
EP2249397A4 (en) | 2015-09-23 |
JPWO2009104627A1 (ja) | 2011-06-23 |
TWI438915B (zh) | 2014-05-21 |
JP5367588B2 (ja) | 2013-12-11 |
US9082917B2 (en) | 2015-07-14 |
KR101509844B1 (ko) | 2015-04-06 |
EP2249397A1 (en) | 2010-11-10 |
TW200945606A (en) | 2009-11-01 |
CN101952976B (zh) | 2012-11-21 |
KR20100118582A (ko) | 2010-11-05 |
EP2249397B1 (en) | 2019-02-06 |
US20110017261A1 (en) | 2011-01-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5367588B2 (ja) | 太陽電池モジュール | |
US9825188B2 (en) | Solar cell module | |
US8298363B2 (en) | Method of manufacturing solar cell module | |
JP5159725B2 (ja) | 太陽電池ストリング及びそれを用いた太陽電池モジュール | |
EP2575183B1 (en) | Solar cell module | |
US20120305047A1 (en) | Solar cell, solar cell module and solar cell system | |
US20100031999A1 (en) | Solar cell module | |
US8497419B2 (en) | Solar cell module | |
JP5046743B2 (ja) | 太陽電池モジュール及びその製造方法 | |
KR20090013721A (ko) | 태양 전지 모듈 및 그 제조 방법 | |
EP2075852A2 (en) | Solar cell module and method of manufacturing the same | |
WO2009107804A1 (ja) | 太陽電池モジュール | |
JP5178489B2 (ja) | 太陽電池モジュール及びその製造方法 | |
JP5100206B2 (ja) | 太陽電池モジュール | |
KR20120138021A (ko) | 태양전지 모듈 | |
JP5183257B2 (ja) | 太陽電池モジュール | |
US8975507B2 (en) | Solar cell module | |
JP5516566B2 (ja) | 太陽電池モジュール及びその製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 200980105997.4 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 09711661 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009554337 Country of ref document: JP |
|
ENP | Entry into the national phase |
Ref document number: 20107018587 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2009711661 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 12867784 Country of ref document: US |