WO2009101750A1 - Antenne cadre et procédé de test d'immunité - Google Patents

Antenne cadre et procédé de test d'immunité Download PDF

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Publication number
WO2009101750A1
WO2009101750A1 PCT/JP2008/072937 JP2008072937W WO2009101750A1 WO 2009101750 A1 WO2009101750 A1 WO 2009101750A1 JP 2008072937 W JP2008072937 W JP 2008072937W WO 2009101750 A1 WO2009101750 A1 WO 2009101750A1
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WIPO (PCT)
Prior art keywords
annular conductor
conductor
annular
loop antenna
magnetic field
Prior art date
Application number
PCT/JP2008/072937
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English (en)
Japanese (ja)
Inventor
Norio Masuda
Original Assignee
Nec Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corporation filed Critical Nec Corporation
Priority to JP2009553350A priority Critical patent/JP5504894B2/ja
Publication of WO2009101750A1 publication Critical patent/WO2009101750A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support

Definitions

  • the present invention relates to a loop antenna, and more particularly to an antenna that is irradiated with a magnetic field to test electromagnetic sensitivity and immunity performance, or a compact loop antenna that generates a magnetic field to communicate.
  • an electromagnetic field generated along with the operation of another electronic device or mechanical device arrives, and the electromagnetic field causes an electromagnetic interference to cause an electromagnetic interference (EMI: Electromagnetic Interference), and the performance of the electronic device May cause deterioration.
  • EMI Electromagnetic Interference
  • the performance of the electronic device May cause deterioration.
  • EMI Electromagnetic Interference
  • the design stage of the electronic device it is important to identify locations where electromagnetic sensitivity is high, to elucidate the mechanism of occurrence of electromagnetic interference, and to design with improved immunity.
  • An antenna is installed near a large scale integrated circuit (LSI) or a printed wiring board (PWB: Printed Wiring Board) in order to identify a portion where electromagnetic sensitivity is weak, and an electromagnetic field is irradiated to cause malfunction or performance degradation. Tests are underway to determine the condition. Such a test helps to identify circuits and mounting components that are weak in electromagnetic immunity.
  • LSI large scale integrated circuit
  • PWB printed wiring board
  • FIG. 11 shows a configuration example when evaluating an immunity performance by installing an antenna for irradiating a magnetic field right above the LSI.
  • FIG. 11A is a diagram of the LSI viewed from directly above, and the antenna 10 is installed directly above the QFP (Quad Flat Pack) 1 on which the LSI is mounted so as to be at a certain height from the QFP 1.
  • the antenna 10 is made of a multilayer substrate, and the loop wiring 11 for generating a magnetic field is formed of a printed wiring.
  • FIG. 11B is a side view of the same configuration as FIG. 11A.
  • Peripheral circuits necessary for operating the LSI are also mounted on the mounting board 5.
  • a circuit for monitoring the operation of the LSI is also mounted on the mounting board 5.
  • FIG. 1 2 is a chip portion of QFP 1
  • 3 is a lead frame of QFP 1.
  • the antenna 10 is composed of a loop wiring 11 formed by printed wiring on a printed wiring board 13, a lead 12 and a connector 14.
  • the high frequency signal sent from the signal generator 17 is transmitted by the coaxial cable 16, the connector 14 and the lead 12, and is finally supplied to the loop wiring 11.
  • a magnetic field is generated around the loop surface around the loop wiring 11 in accordance with the laws of electromagnetism.
  • the magnetic field in the direction perpendicular to the loop surface is dominant. Therefore, as shown in FIG. 11B, when the antenna 10 is disposed at an appropriate distance so as to be parallel to the QFP mounted on the mounting board 5, a magnetic field with little change in intensity is irradiated over the entire surface of the QFP. it can.
  • FIG. 11A While changing the setting of the signal generator 17 and controlling the intensity, modulation, waveform, etc. of the generated magnetic field, the cause of the malfunction of the LSI is identified.
  • an antenna of approximately the same size as the QFP is used, but some test methods use a smaller antenna than the QFP to provide limited coverage.
  • a magnetic field is irradiated while scanning a small antenna at a predetermined height on the QFP, and a circuit with weak immunity is identified.
  • FIG. 13 is an explanatory view of a method of measuring the magnetic field of the surface of the antenna 10 of FIG.
  • FIG. 14A is a view obtained by measuring and visualizing the magnetic field while installing the small-sized magnetic field probe 15 in the vicinity of the loop wiring 11 and scanning in the XY axis direction at a constant height.
  • the measurement was performed by connecting the small magnetic field probe 15 to a measuring instrument such as a spectrum analyzer, oscillating the antenna 10 at 10 MHz, and measuring the output of the small magnetic field probe 15.
  • a measuring instrument such as a spectrum analyzer
  • FIG. 14A and (b) the result of scanning and measuring the small magnetic field probe 15 over the whole loop surface is displayed.
  • the external shape of the loop wiring 11 of FIG. 13B is 24 mm square, and the width of the loop wiring 11 is 1 mm, and the small magnetic field probes 15 were measured 6 mm apart.
  • FIG. 14A it can be seen that a strong magnetic field is generated over the entire surface in the range surrounded by the loop wiring 11.
  • FIG. 14A it can be seen that a strong magnetic field is generated over the entire surface in the range surrounded by the loop wiring 11.
  • FIG. 14B shows the result of measurement of the magnetic field while making the Y and Z coordinates constant and one-dimensionally scanning on the line AA ′ passing the center of the loop wiring 11 of FIG. 13B.
  • Hz is dominant in the area surrounded by the loop wiring 11. There is also a region where Hx becomes strong near the loop wiring 11, but the intensity is lower than Hz. If the measurement distance of the small magnetic field probe 15 is further reduced, and becomes smaller than 1 mm, Hx may become dominant compared to Hz, but the distance between the loop and the object under normal use conditions is taken into consideration Then, the distribution in FIG. 14A is a typical distribution. Since Hy is in principle the direction in which the magnetic field is not observed, it has a very low value.
  • Hxyz (x 2 + y 2 + z 2 ) (1/2) in the x, y, and z directions is roughly similar to the distribution in Hz, but in the region where Hx is strong Hxyz Will be greater than Hz. Therefore, in the case of FIG. 14B, Hxyz is approximately a combination of Hz and Hx. In the area surrounded by the loop wiring 11, the change in the intensity of the synthetic magnetic field Hxyz is small, and remains at about 8%. Both FIGS. 14A and 14B are normalized and displayed at the maximum value. If the loop wiring 11 is manufactured to the same size as that of the QFP and placed on the QFP as shown in FIG. 11A, it is possible to irradiate a magnetic field of almost constant strength over the entire surface of the QFP.
  • FIG. 15A schematically shows the test method of irradiating the magnetic field described above.
  • the hatched portion is a region that generates a strong magnetic field, and the inside of the loop wire 11 substantially belongs to this region.
  • the loop wiring 11 can not but be installed away from the chip 1 and the lead frame 3.
  • the magnetic field in the vicinity of the center of the loop wiring 11 becomes strong, and as a result, a strong magnetic field is generated in the loop plane illustrated in FIG. 14A. Therefore, changing the installation distance of the antenna 10 to generate an annular magnetic field is very limited.
  • FIG. 15A since the magnetic field is irradiated over the entire surface of the QFP 1, the immunity of the entire QFP 1 can be evaluated, but the evaluation of each part can not be performed.
  • FIG. 15B it is possible to irradiate the magnetic field only to the chip 2 on which the LSI is formed by creating the loop wiring 11 having a small external dimension, but connecting the lead frame 3 and QFP 1 to the pads on the chip Only the bonding wire 4 can not be irradiated with the magnetic field.
  • noise may be generated in the lead frame 3 or the bonding wire 4 by the electromagnetic field coming from the outside, and may be larger than the noise generated inside the chip 2 by the same external electromagnetic field.
  • noise generated in the lead frame 3 or the bonding wire 4 becomes conductive noise, and is mixed into the inside of the chip 2 from the terminal portion to cause a malfunction. Therefore, even if an electromagnetic field does not enter the chip 2 from the outside I can not expect an effect. Therefore, it is important to select and test the lead frame 3 and the bonding wires 4 in order to select the correct noise countermeasure.
  • FIG. 15C shows the case where the magnetic field irradiation test is performed by selecting the portion where bonding wire 4 and bonding wire 4 are connected to lead frame 3 (that is, the portion where lead frame 3 is tapered), and FIG. This is the case where the test is performed to irradiate the magnetic field including the wiring 6 on the board 5.
  • a magnetic field generation method that generates a strong magnetic field in an annular shape, it becomes possible to test by combining the chip 2, the bonding wire 4, the lead frame 3, and the wiring 6 on the mounting board. It becomes possible to identify the mounted component that causes the decrease in immunity.
  • FIG. 16 shows an example in which a magnetic field is selected for each circuit.
  • the test is performed including all the parts connected to the circuit to be tested, rather than selecting at the mounting part level.
  • Examples of circuits include power supply circuits, data ports, I / O ports for signal transmission, etc.
  • pins connected to similar circuits are often adjacent on the QFP. In that case, as shown in FIG. 16B, for example, it may not be desirable to irradiate a specific lead frame 3.
  • Patent document 1 connects a first half loop 3c, a circular loop 3e, and a second half loop 3g in series, and forms a first annular shape including a first half loop 3c and a second half loop 3g.
  • a loop antenna is disclosed in which the antenna portion and the second annular antenna portion consisting of the circular loop 3e are formed in the same shape and the same size, and the first and second annular antenna portions are adhered.
  • FIG. 2C of Patent Document 2 discloses a coil antenna for a noncontact communication device in which the magnetic field strength is increased by winding a loop portion of a loop antenna a plurality of times.
  • the present invention has been made in view of the above-described point, and its object is to control the magnetic field distribution in the vicinity of the loop antenna to enable generation of an annular magnetic field distribution adapted to the measurement object,
  • the present invention provides a novel loop antenna that can accurately identify circuits and components with low immunity performance.
  • Another object of the present invention is to provide an electronic device having an extremely short distance communication function, capable of preventing a malfunction by selectively attenuating a magnetic field around components which are not desired to be irradiated with a magnetic field. It is.
  • the first aspect of the loop antenna according to the present invention is A first annular conductor, One or more second annular conductors smaller than the first annular conductor and located inside the ring of the first annular conductor, Said second annular conductor is connected in series with said first annular conductor;
  • the first annular conductor and the second annular conductor are disposed on the same plane, and
  • One or more second annular conductors smaller than the first annular conductor and located inside the ring of the first annular conductor, Said second annular conductor is connected in series with said first annular conductor;
  • the first annular conductor and the second annular conductor are disposed on different sides of the substrate,
  • An annular conductor, And a metal plate disposed inside the ring of the annular conductor, The annular conductor and the metal plate are disposed on the same plane,
  • the aspect of the magnetic field generation method according to the present invention is A first annular conductor and one or more second annular conductors smaller than the first annular conductor and located inside the annulus of the first annular conductor, the second annular conductor comprising A loop antenna connected in series to the first annular conductor is driven at a frequency having a wavelength sufficiently longer than the total length of the first annular conductor and the second annular conductor, and an annular magnetic field distribution It is characterized in that
  • the loop antenna of the present invention is configured as described above, the magnetic field can be selectively irradiated, and it becomes easy to identify parts having low immunity performance.
  • the mounting method of the loop antenna of the present invention in the electronic device having the extremely short distance communication function, since the magnetic field around the parts which are not desired to be irradiated with the magnetic field can be selectively attenuated, malfunction can be prevented.
  • FIG. 1A It is a figure which shows magnetic field distribution of the vicinity of the loop antenna of this invention. It is a figure which shows magnetic field distribution of the vicinity of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the structure of the loop antenna which has a conductor board of this invention. It is a figure which shows the example which has arrange
  • FIG. 4A It is a figure which shows the conductor board provided in the other side of the printed wiring board of FIG. 4B. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure which shows that a lead frame does not exist in 45 degree direction of QFP. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure explaining the other structural example of the loop antenna of this invention. It is a figure which applied the loop antenna of the present invention to SiP. It is a side view of FIG. 9A.
  • FIG. 11B is a side view of FIG. 11A. It is a figure explaining the conventional loop antenna. It is a figure explaining the measuring method of the magnetic field distribution of the conventional loop antenna vicinity. It is a top view of FIG. 13A. It is a figure which shows an example of the magnetic field distribution of the conventional loop antenna vicinity. It is a figure which shows an example of the magnetic field distribution of the conventional loop antenna vicinity.
  • the loop antenna of the present invention comprises a first annular conductor and one or more second annular conductors smaller than the first annular conductor and located inside the ring of the first annular conductor, Configured to generate an annular magnetic field in a region between the annular conductor and the second annular conductor, thereby selectively irradiating the magnetic field and identifying a component having low immunity performance. It is.
  • the first annular conductor and the second annular conductor may be connected in series and driven by one signal source, or the first annular conductor Each of the second annular conductors may be driven by another signal source.
  • yen is included.
  • FIG. 1 is a view for explaining an embodiment of a loop antenna 20 of the present invention.
  • the loop antenna 20 of the present invention comprises a printed wiring board 21 and a conductor pattern 28 formed thereon.
  • the conductor pattern 28 includes an annular conductor 22 formed so as to go around the outside, an annular conductor 23 connected in series to a part of the conductor pattern 28, and a connection wire 24 connecting the respective annular conductors.
  • the annular conductor 23 has a smaller outside dimension than the annular conductor 22 and is disposed inside the annular conductor 22.
  • the annular conductor 22 is connected to the connection wiring 25, and the other end of the connection wiring 25 is connected to the pads 30a and 30b.
  • FIG. 1B shows a state in which the coaxial cable 26 is vertically connected to the printed wiring board 21, but the center conductor of the coaxial cable is electrically connected to the pad 30a using a method such as soldering. It is fixed.
  • the outer conductor of the coaxial cable is connected to the pad 30 b via the sleeve 27. By performing such connection, it is possible to vertically connect with the conductor pattern 28 while suppressing the collapse of the coaxial structure.
  • the other end of the coaxial cable 26 is connected to the signal generator 17, and the signal transmitted from the signal generator 17 is transmitted to the annular conductors 22 and 23 to generate a magnetic field around the annular conductors 22 and 23 according to the laws of electromagnetism. .
  • the antenna 20 can be brought close to the QFP 1 at a fixed height as shown in FIG. 11B.
  • FIGS. 2A and 2B show the results of measuring the magnetic field on the loop antenna 20 in the same measurement system as in FIGS. 13A and 13B. Each figure is shown normalized with the maximum value.
  • the outer dimensions of the annular conductor 24 are 24 mm, the outer dimensions of the annular conductor 23 are 15 mm, and the wiring width is 1 mm.
  • FIG. 2A it can be seen that the magnetic field strength at the central portion is reduced, and a strong magnetic field is generated in the ring.
  • FIG. 2B shows the result of measuring the distribution on the AA ′ line of FIG. 13B, but two peaks are observed.
  • This peak is approximately located in the region sandwiched by the annular conductor 22 and the annular conductor 23.
  • the annular conductor 22 generates a magnetic field at its center in a direction from the front to the back of the paper.
  • the current 31b flowing through the annular conductor 23 is in the opposite direction to the current 31a, a magnetic field is generated at the central portion in the direction of penetrating from the back side to the front side of the drawing.
  • the conductor pattern 28 includes two loop antennas having different directions of oscillation with the same phase.
  • FIG. 1A The above results are shown in FIG. 1A in which two loop antennas are driven by a signal having a wavelength sufficiently longer than the total length of the annular conductors 22 and 23. Such a frequency is selected.
  • a signal having a wavelength sufficiently longer than the total length of the annular conductors 22 and 23 Such a frequency is selected.
  • the annular conductors 22 and 23 are driven in phase to generate a magnetic field, an annular magnetic field distribution shown in FIG. 2A can be obtained.
  • the wavelength is shorter than the total length of the annular conductor, the influence of voltage and current distribution on the annular conductor becomes large, and it becomes impossible to generate an annular magnetic field distribution having uniform magnetic field strength.
  • the annular conductors 22, 23 have a near rectangular shape. Assuming that the measurement object is a QFP, it is possible to conduct the test over the entire surface of the object by making it square. Usually, the QFP 1 and the chip 2 are substantially square, and the sides are parallel to each other. Therefore, as shown in FIG. 1A, by arranging the annular conductor 23 at the center of the annular conductor 22 so that the sides are parallel to each other, the irradiation range shown in FIG. 15 can be selected and irradiated.
  • the conductor pattern 28 may be designed according to the shape. Therefore, the conductor pattern 28 is manufactured in a rectangle, a trapezoid, a circle, an ellipse, or a polygon according to the purpose.
  • the annular conductor 22 and the annular conductor 23 do not have to have the same shape, and a combination of different shapes is also acceptable as shown in FIG. 3A.
  • FIG. 3C is an example in which a plurality of annular conductors 23 are arranged.
  • the center of the annular conductor 22 and the center of the annular conductor 23 do not have to be aligned, and the annular conductor 23 can be disposed at an asymmetric position with respect to the annular conductor 22.
  • packages such as SiP (System in Package)
  • the chip is often mounted at an asymmetric position, and such a mounting method is also possible.
  • the factor A is always included in the conventional test method using the antenna 10. That is, if the test is performed while changing the outer dimensions of the loop wiring 11, it is necessary to measure the electromagnetic immunity in the combination such as factor A, factor (A + B), factor (A + B + C), factor (A + B + C), factor (A + B + C + D) become.
  • the method of selecting the irradiation area in such an addition formula for example, if contribution to the immunity of factor A is large, the contribution of other factors can not be separated, and if the interaction between each factor is large There is a disadvantage that the effect of is difficult to separate.
  • the inner annular conductor 23 is replaced with a conductor plate 32 made of a metal plate having a predetermined area.
  • the conductor plate 32 is disposed at the center of the annular conductor 22.
  • the annular conductor 22 is driven at a predetermined frequency, a strong magnetic field is generated inside the ring, but if the conductor plate 32 is thick enough to prevent the magnetic field from penetrating, the magnetic field at the central portion of the conductor plate 32 is attenuated.
  • the loop antenna 20 does not operate to cancel the magnetic field positively, an annular distribution similar to that of the loop antenna 20 can be obtained.
  • each side of the conductor plate 32 is formed so as to be parallel to each side of the annular conductor 22, the magnetic field distribution shown in FIGS. 15B and 15C can be generated.
  • the shape of the conductor plate 32 may be any shape such as a trapezoid in accordance with the measurement condition. Further, the shape of the annular conductor may be different from the shape of the metal plate.
  • the pads 30a and 30b for connecting the coaxial cable 26 are disposed outside the annular conductor 22 provided on one surface of the printed wiring board 21.
  • the connection pads 31 a and 31 b are disposed inside the annular conductor 22.
  • FIG. 4C shows a conductor plate 32 provided on the other surface of the printed wiring board 21 of FIG. 4B.
  • the conductor plate 32 is connected to the pad 31 b by the via 33, and the ground conductor of the coaxial cable 26 together with the pad 31 b.
  • the magnetic field attenuates around the conductor plate 32 as in FIG. 4A. Since the coaxial cable 26 can be installed inside the annular conductor 22, the size can be reduced.
  • the conductor plate 32 is disposed on the inner side of the annular conductor 22, and the conductor plate 32 is formed on the same surface as the annular conductor 22, and the pads 31a and 31b are opposed to the conductor plate 32 to be a conductor. It may be configured to be provided on a surface different from the surface on which the plate 32 is provided.
  • the shape of the annular conductor 22 is polygonal, and a magnetic field is applied only to the hatched area in FIG. 16A.
  • the loop antenna is rectangular or annular, but as shown in FIG. 5A, the magnetic field can be irradiated only to the lead frame to be tested if the shape of the lead frame of the QFP is matched.
  • FIG. 5B if an annular conductor is formed inside, it is possible to attenuate the magnetic field strength around the lead frame that you do not want to test, as shown in FIG. 16B.
  • FIG. 6A shows an embodiment of the present invention in which the connection wirings 24 and 25 are disposed in parallel with the side of the QFP.
  • the connection wiring 25 is formed in this manner, a distribution which does not originally require a magnetic field is formed around the connection wiring 25, the magnetic field strength is lowered, and a part of the lead frames may not be irradiated with the magnetic field of sufficient strength.
  • the connection wiring 25 is connected to the corner of the annular conductor 22 formed in a rectangular shape, and drawn out so as to form an angle of 45 degrees with each side of the annular wiring.
  • the connection wiring 24 is disposed adjacent to the connection wiring 25 and the angle between the connection wirings 24 and 25 is 0 degree.
  • connection wiring 25 does not have to be arranged linearly with the connection wiring 24 and may form an angle of 45 degrees. In FIG. 6B, the connection wiring 24 and the connection wiring 25 are partially shared.
  • connection wiring 25 is a polygon, it is preferable to provide the connection wiring 25 at the corner where the two sides of the polygon intersect.
  • annular conductor 22 and an annular conductor 23 are formed in different layers.
  • the annular conductor 23 is disposed inside the annular conductor 22, and the annular conductor 22 and the annular conductor 23 are connected in series at the vias 34. It is possible to change the distance in the direction perpendicular to the loop surface of the annular conductor 22 and the annular conductor 23 by controlling the thickness of the printed board 21 and to control the intensity distribution on the QFP 1.
  • a characteristic magnetic field distribution can be generated by using the antenna of the present invention in a frequency band of a wavelength sufficiently longer than the total length of the annular conductor.
  • the strength of the magnetic field can be locally adjusted, and the same effect as the loop antenna 20 can be obtained.
  • the annular conductors 61 and 62 can be controlled independently, the phase of the supplied signal can be reversed or the amplitude can be changed, and the generated magnetic field distribution can be efficiently controlled. Therefore, precise control is possible as compared with the integrated type of FIG. 1A.
  • the loop antenna of the present invention described above can also be applied to a transmitting / receiving antenna incorporated on a printed wiring board or in an LSI package.
  • FIGS. 9A and 9B show a device in which a printed wiring board 21 in which a loop antenna is formed is mounted on a system in package (SiP) via a spacer 60.
  • SiP system in package
  • the reason for mounting a planar antenna on a printed circuit board is to realize thinning and downsizing. For this reason, the distance between the SiP and the antenna conductor is very close, for example, 1 mm or less.
  • Two chips 51 and 52 are mounted on the interposer 50 by BGA.
  • the chips 51, 52 are connected to each other by wires 58, 59 on the interposer, as shown in FIG. 9C. This is to recombine the wiring on the interposer 50.
  • the wiring 58 becomes a first layer
  • the wiring 59 becomes a second layer, and so on.
  • Such an SiP is used in a wireless medium for reading and writing information without contact, such as an IC card or a wireless tag. Moreover, it may be mounted in the inside of information terminal devices, such as a mobile telephone.
  • the loop antenna 20 of this embodiment is used when transmitting and receiving information with an external device wirelessly.
  • the loop antenna 10 illustrated in FIG. 12 is given. As described above, such a loop antenna 10 produces a substantially uniform magnetic field distribution as shown in FIG. 14A.
  • the loop antenna 20 of the present invention is driven by the chip 51 to generate a magnetic field, and performs communication with an external LSI over an extremely short distance.
  • the wires formed on the interposer such as the wires 58 and 59 are longer than the on-chip wires, and thus are susceptible to the influence of the external electromagnetic field in a frequency band lower than the chips 51 and 52. Therefore, when the conventional antenna 10 is used in place of the loop antenna 20, a large noise voltage is generated in the wires 58 and 59, which becomes conductive noise and intrudes into the circuits in the chips 51 and 52, causing the circuit to malfunction. That is, the wires 58 and 59 which are more sensitive to the electromagnetic field coming from the outside than the chips 51 and 52 alone will eventually allow the entry of noise.
  • the loop antenna 20 of the present invention generates an annular magnetic field distribution near the loop antenna 20, and the magnetic field strength at the central portion is weak. That is, since the magnetic field strength is weak in the region where the wiring with high electromagnetic sensitivity in the central portion of FIG. 9A is present, it is possible to reduce the risk of occurrence of a malfunction.
  • a receiving antenna is installed to face the antenna 20, and communication is performed at an extremely short distance.
  • the loop antenna 10 having substantially the same outer dimensions is used as the receiving antenna, when the antenna 10 and the loop antenna 20 are excited with the same power, the output of the receiving antenna of the loop antenna 20 is lowered. This is because the magnetic field strength at the central portion of the loop antenna 20 is attenuated. If the total amount of magnetic field in the loop of the receiving antenna is equal, the gain in transmission and reception does not decrease. Comparing the integrated value of the magnetic field in the loop with the external dimensions of the receiving antenna being the same as on the transmitting side, if the transmission power of the loop antenna 20 is multiplied by 1.8, a magnetic field equivalent to the antenna 10 is generated Are equal.
  • FIG. 10 is a result of measuring the magnetic field distribution generated by the antenna 10 and the loop antenna 20, and is normalized by the maximum value of the loop antenna 20.
  • the present invention is applicable to a loop antenna, an electronic device having an extremely short distance communication function, and various other related devices.

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Abstract

L'invention porte sur une antenne cadre apte à identifier précisément des circuits et des composants munis de faibles performances d'immunité. L'antenne cadre comprend un premier conducteur annulaire ainsi qu'un ou plusieurs seconds conducteurs annulaires plus petits que le premier conducteur annulaire et agencés dans l'anneau du premier conducteur annulaire. Le premier conducteur annulaire et le second conducteur annulaire sont connectés en série et agencés dans le même plan. Dans ce cas, le sens d'un champ magnétique créé par le premier conducteur annulaire est opposé à celui du champ créé par les seconds conducteurs annulaires dans la zone entourée par le premier et par les seconds conducteurs annulaires.
PCT/JP2008/072937 2008-02-12 2008-12-17 Antenne cadre et procédé de test d'immunité WO2009101750A1 (fr)

Priority Applications (1)

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JP2009553350A JP5504894B2 (ja) 2008-02-12 2008-12-17 ループアンテナ及びイミュニティ試験法

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JP2008-030739 2008-02-12
JP2008030739 2008-02-12

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Cited By (6)

* Cited by examiner, † Cited by third party
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JP2011182583A (ja) * 2010-03-02 2011-09-15 Denso Corp 電圧制御回路及び電圧制御システム
JP2013511925A (ja) * 2009-11-23 2013-04-04 ハリス コーポレイション 周転円構造及び等方性放射を有する平面通信アンテナ及び関連する方法
JP6006831B1 (ja) * 2015-05-18 2016-10-12 日本電信電話株式会社 均一電界範囲決定法
JP2017041665A (ja) * 2015-08-17 2017-02-23 日本電信電話株式会社 ループアンテナアレイ群
WO2017158869A1 (fr) * 2016-03-15 2017-09-21 日本電信電話株式会社 Réseau d'antennes-cadres
WO2017163453A1 (fr) * 2016-03-22 2017-09-28 日本電信電話株式会社 Appareil de commande d'antenne, programme de commande d'antenne et système de commande d'antenne

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11313017A (ja) * 1998-04-24 1999-11-09 Nippon Steel Corp リーダライタ用アンテナ装置
JP2003085519A (ja) * 2001-09-11 2003-03-20 Toshiba Corp 無線カード
JP2003098211A (ja) * 2001-09-27 2003-04-03 Denki Tsushin Univ イミュニティ試験方法、イミュニティ試験装置及び回転磁界発生装置
JP2003532318A (ja) * 2000-04-21 2003-10-28 アエスカ エス．ア． 無接触式送信／受信読取りシステムに関するアンテナ
JP2004215061A (ja) * 2003-01-07 2004-07-29 Ngk Spark Plug Co Ltd 折り返しループアンテナ
JP2004336198A (ja) * 2003-05-01 2004-11-25 Toshiba Corp アンテナ装置
JP2005027296A (ja) * 2003-07-02 2005-01-27 Sensormatic Electronics Corp 位相補償電磁界除去入れ子ループアンテナ
JP2007523563A (ja) * 2004-02-20 2007-08-16 スリーエム イノベイティブ プロパティズ カンパニー 無線識別（ｒｆｉｄ）システム用磁界整形シールディング

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11313017A (ja) * 1998-04-24 1999-11-09 Nippon Steel Corp リーダライタ用アンテナ装置
JP2003532318A (ja) * 2000-04-21 2003-10-28 アエスカ エス．ア． 無接触式送信／受信読取りシステムに関するアンテナ
JP2003085519A (ja) * 2001-09-11 2003-03-20 Toshiba Corp 無線カード
JP2003098211A (ja) * 2001-09-27 2003-04-03 Denki Tsushin Univ イミュニティ試験方法、イミュニティ試験装置及び回転磁界発生装置
JP2004215061A (ja) * 2003-01-07 2004-07-29 Ngk Spark Plug Co Ltd 折り返しループアンテナ
JP2004336198A (ja) * 2003-05-01 2004-11-25 Toshiba Corp アンテナ装置
JP2005027296A (ja) * 2003-07-02 2005-01-27 Sensormatic Electronics Corp 位相補償電磁界除去入れ子ループアンテナ
JP2007523563A (ja) * 2004-02-20 2007-08-16 スリーエム イノベイティブ プロパティズ カンパニー 無線識別（ｒｆｉｄ）システム用磁界整形シールディング

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013511925A (ja) * 2009-11-23 2013-04-04 ハリス コーポレイション 周転円構造及び等方性放射を有する平面通信アンテナ及び関連する方法
JP2011182583A (ja) * 2010-03-02 2011-09-15 Denso Corp 電圧制御回路及び電圧制御システム
JP6006831B1 (ja) * 2015-05-18 2016-10-12 日本電信電話株式会社 均一電界範囲決定法
JP2017041665A (ja) * 2015-08-17 2017-02-23 日本電信電話株式会社 ループアンテナアレイ群
WO2017030001A1 (fr) * 2015-08-17 2017-02-23 日本電信電話株式会社 Réseau d'antennes à cadre et groupe de réseaux d'antennes à cadre
CN107925164A (zh) * 2015-08-17 2018-04-17 日本电信电话株式会社 环形天线阵列以及环形天线阵列群
US10777909B2 (en) 2015-08-17 2020-09-15 Nippon Telegrah And Telephone Corporation Loop antenna array and loop antenna array group
WO2017158869A1 (fr) * 2016-03-15 2017-09-21 日本電信電話株式会社 Réseau d'antennes-cadres
US10700432B2 (en) 2016-03-15 2020-06-30 Nippon Telegraph And Telephone Corporation Loop antenna array
WO2017163453A1 (fr) * 2016-03-22 2017-09-28 日本電信電話株式会社 Appareil de commande d'antenne, programme de commande d'antenne et système de commande d'antenne
US10177823B2 (en) 2016-03-22 2019-01-08 Nippon Telegraph And Telephone Corporation Antenna control apparatus, antenna control program, and antenna control system

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