WO2009084615A1 - Élément de dé, procédé de fabrication d'élément de dé et procédé de formation d'un élément de commande de lumière par utilisation de l'élément de dé - Google Patents

Élément de dé, procédé de fabrication d'élément de dé et procédé de formation d'un élément de commande de lumière par utilisation de l'élément de dé Download PDF

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Publication number
WO2009084615A1
WO2009084615A1 PCT/JP2008/073687 JP2008073687W WO2009084615A1 WO 2009084615 A1 WO2009084615 A1 WO 2009084615A1 JP 2008073687 W JP2008073687 W JP 2008073687W WO 2009084615 A1 WO2009084615 A1 WO 2009084615A1
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WIPO (PCT)
Prior art keywords
mold
thin plate
low thermal
thermal conductivity
heat
Prior art date
Application number
PCT/JP2008/073687
Other languages
English (en)
Japanese (ja)
Inventor
Ichiro Matsuzaki
Yoshinori Osanai
Takumi Yagi
Masakatsu Sugasaki
Original Assignee
Kuraray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co., Ltd. filed Critical Kuraray Co., Ltd.
Priority to CN200880123006.0A priority Critical patent/CN101909847B/zh
Priority to JP2009548078A priority patent/JP5610770B2/ja
Priority to KR1020127026037A priority patent/KR101473680B1/ko
Publication of WO2009084615A1 publication Critical patent/WO2009084615A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3828—Moulds made of at least two different materials having different thermal conductivities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms

Definitions

  • the present invention relates to a mold member used for manufacturing a light control member by an injection molding method, a manufacturing method thereof, and a molding method of a light control member using the same.
  • An injection molding method (including an injection compression molding method) in which a heat-fluidized resin material is injected into a cavity in a mold, cooled and solidified in the mold, and then the mold is opened to take out a molded product.
  • a processing method of a resin material containing a thermoplastic resin it is widely used as one of molding methods that can easily improve production speed and automate molding.
  • a cooling solidified layer may be formed on the surface of the molten resin injected and filled into the cavity in a general injection molding method.
  • Such a cooling and solidifying layer hinders transferability of fine unevenness of a molded product, and causes generation of a weld mark, a cold mark, a flow mark, and the like.
  • a thin plate member or a mold member is mounted on one surface of a mold cavity.
  • the thin plate member is composed of a metal thin plate main body having a mold surface that forms one surface of a cavity, and a low thermal conductivity member made of a polyimide film disposed on the back surface of the thin plate main body.
  • a thermoplastic resin having a temperature higher than the transfer start temperature is introduced into the cavity, the mold is cooled by the mold and lowered to a temperature lower than the transfer start temperature.
  • the heat capacity of the thin plate body is set so that the thermoplastic resin near the surface of the mold rises again to a temperature exceeding the transfer start temperature.
  • thermoplastic resin having a temperature equal to or higher than the transfer start temperature is introduced into the mold cavity held at a temperature equal to or lower than the transfer start temperature.
  • the thermoplastic resin introduced into the cavity portion is cooled on the cavity surface of the mold and temporarily falls to a temperature not higher than the transfer start temperature.
  • one surface of the cavity has a set heat capacity, the mold The thermoplastic resin in contact with the surface can rise again to a temperature exceeding the transfer start temperature.
  • the molding method of such a resin molded product is suitable for production of a light control member that controls light such as a light guide plate and a lens sheet.
  • a resin molded product having a different fine shape on the surface is replaced with the same metal by exchanging thin plate bodies with different concave and convex patterns or mirror surface patterns engraved on the mold surface. It has the advantage that it can be manufactured using a mold.
  • the polyimide film disposed or adhered to the back surface of the thin plate main body may be wrinkled or broken when the thin plate main body is replaced.
  • the temperature of the thermoplastic resin in contact with the mold surface put into the cavity once falls below the transfer start temperature, but again rises above the transfer start temperature.
  • the heat capacity must be set to be a predetermined capacity. Therefore, the thickness of the thin plate main body is limited to a predetermined heat capacity, and is generally as thin as 1 mm or less (for example, within a range of about 0.3 mm to 0.6 mm).
  • an object of the present invention is a mold member having a replaceable thin plate body used for manufacturing a thin plate-like light control member by injection molding, and can be stably produced even when used for a long period of time.
  • the object is to provide a mold member.
  • a mold member according to an embodiment of the present invention is a mold member that is used for manufacturing a light control member by an injection molding method using a mold, and that can be attached to and detached from the mold, and includes a mold surface.
  • a metal thin plate body having a thickness of 0.2 mm or more and 0.6 mm or less, and a thickness of 0.1 mm or more and 0.5 mm or less disposed on a surface facing the mold surface,
  • FIG.1 (a) is a side view seen from the side surface
  • FIG.1 (b) is the plane seen from the cavity surface side.
  • FIG. It is a figure explaining the structure of the thin-plate member in one Example of this invention by a cross section. It is a figure explaining the structure of the thin-plate member in one Example of this invention by a cross section. It is a figure which shows the result of having measured the relationship between the temperature of a polymethylmethacrylate resin, and a longitudinal elastic modulus. It is a figure which shows the conditions of the simulation about a light-guide plate.
  • FIG. 1 illustrates a state where the mold member 10 is mounted on the mold.
  • FIG. 2 or FIG. 3 the details of the mold member mounted thereon are described.
  • a mold member or thin plate member 10 according to an embodiment of the present invention is a mold member 10 that is used in the manufacture of a light control member by an injection molding method using a mold and is detachable from the mold.
  • a metal thin plate body 20 having a mold surface or cavity surface 20a and having a thickness of 0.2 mm or more and 0.6 mm or less, and a surface opposed to the mold surface 20a integrated with the thin plate body.
  • the mold member or the thin plate member 10 is a mold member that is used for manufacturing a light control member by an injection molding method using a mold and can be attached to and detached from the mold.
  • a metal thin plate body having a mold surface or cavity surface 20a and having a thickness in the range of 0.3 mm or more and 0.6 mm or less, and the thin plate body integrated with the thin plate body on the surface facing the mold surface.
  • a low thermal conductivity member having a thickness in the range of 0.1 mm or more and 0.3 mm or less.
  • the present inventor integrates the thin plate main body and the low thermal conductivity member disposed on the back surface thereof from the recognition that a structure that does not cause even a part of the peeling of the bonded portion is necessary.
  • a low thermal conductivity member is integrated on the back of the thin plate main body using a thermosetting heat-resistant adhesive, or a low heat is applied to the back of the thin plate main body. It has been recognized that the above-described problems can be solved by disposing a reinforcing material via a conductivity member to form a sandwich structure with a low thermal conductivity member that is expected to break.
  • the adhesive to be used is heat resistance, pressure resistance, shear resistance, heat deterioration resistance (no thermal decomposition, no foaming) It has been found by the present inventors that it is important to maintain various characteristics such as
  • the heat resistance needs to withstand the resin temperature filled at a high temperature as an injection molding condition, and to prevent thermal decomposition or foaming. Further, the pressure resistance is necessary to withstand a high holding pressure for maintaining high transferability of fine unevenness. In addition, the shear resistance needs to withstand repeated thermal histories at high and normal temperatures in accordance with the injection molding cycle. If any of these conditions is satisfied and the low thermal conductivity member is disposed on the back surface of the thin plate body, the low thermal conductivity member may be thermally decomposed, foamed, or partially peeled, etc. It is possible to prevent distortion from occurring.
  • a heat-fluidized resin material is injected into a cavity in a mold, solidified or cured while maintaining a high pressure in the mold, and then the mold is opened to form a thin plate.
  • the mold member is used as an injection surface to be injected, and the mold member has a mold surface that forms one surface of the cavity and has a thickness of 0.2 mm or more and 0.6 mm or less.
  • the thin plate body and the low thermal conductivity member are integrated with a thermosetting heat-resistant adhesive, the occurrence of peeling of the low thermal conductivity member can be further suppressed.
  • the heat resistant adhesive does not generate a cured byproduct.
  • a reinforcing material is integrated on the back surface of the low thermal conductivity member, even if peeling occurs in a part of the low thermal conductivity member, the thin plate main body is not distorted. Further, such a reinforcing material can improve the operability of the thin plate member, and facilitates the mounting and demounting operations of the thin plate body on the cavity surface of the mold.
  • the low thermal conductivity member includes a first heat-resistant adhesive layer having a low thermal conductivity within a range of 10 ⁇ m to 200 ⁇ m and a low heat within a range of 10 ⁇ m to 200 ⁇ m.
  • a conductive layer and a second heat-resistant adhesive layer having a low thermal conductivity in a range of 10 ⁇ m or more and 200 ⁇ m or less are provided.
  • the thin plate body and the reinforcing material will not be warped if they are the same material, but even when different materials are selected, the difference in mutual linear expansion coefficient is reduced.
  • the thickness of the reinforcing material it is possible to reduce warpage due to a temperature difference generated in the molding cycle process.
  • Such a mold can be manufactured by, for example, using a heat-resistant adhesive layer (first heat-resistant adhesive layer, the second heat-resistant adhesive layer) and a low heat conductive layer as a film. .
  • the integration process is performed as the thin plate main body and the low thermal conductive layer.
  • a step including a step of integrating the thin plate body and the low thermal conductive film through at least two steps of a first step of laminating the heat resistant film and a second step of thermosetting at a temperature higher than the first step is performed.
  • a mold member preferable for use in the present invention can be manufactured.
  • the mold member is composed of a mold in which a thermoplastic resin having a temperature equal to or higher than the transfer start temperature is held at a temperature equal to or lower than the transfer start temperature. After the thermoplastic resin in the vicinity of the mold surface, which has been introduced into the cavity and cooled by the mold to a temperature lower than the transfer start temperature, is filled with the thermoplastic resin, the transfer start temperature is again measured. The heat capacity of the surface portion on the cavity portion side is set so as to increase to a temperature exceeding. As a result, if a light control member that uses at least one of the two opposing large plate-like surfaces as an emission surface to emit light is molded using such a mold, it is stable even during long-term use. A light control member can be manufactured. Further, since this mold member can be exchanged, if a plurality of mold members having different concavo-convex patterns on the mold surface are prepared, it can be used for manufacturing a small amount of brand-name light control members.
  • Examples of the light control member molded in this way include a light guide plate, a lens sheet, a light diffusion plate, and the like.
  • a fine uneven pattern is formed on one surface of these light control members, and the fine unevenness reproduces the uneven surface stamped on the surface of the mold member.
  • the metal thin plate body 20 having a mold surface 20a that forms one surface of the cavity and the back surface 20b of the thin plate body 20 that is a surface facing the mold surface 20a are disposed.
  • a low thermal conductivity member 30 is composed of a first heat resistant adhesive layer 32 composed of a heat-resistant thermosetting adhesive and a low thermal conductivity member layer 31, and the low thermal conductivity member layer 31 is the first.
  • the thin plate main body 20 is integrated with the heat resistant adhesive layer 32.
  • the thicknesses of the thin plate body 20 and the low thermal conductivity member 30 are set to be a predetermined value from the relationship of the heat capacity and the like.
  • the thickness of the thin plate main body 20 has a characteristic that it is extremely thin within a range of 0.2 mm to 0.6 mm, preferably within a range of 0.3 mm to 0.6 mm.
  • the thickness of the low thermal conductivity member 30 is not particularly limited as long as it can be insulated. However, if it is too thin, the heat insulating property is not sufficient, and it is necessary to take a long molding cycle. In some cases, it is difficult to manufacture light control parts stably in the course of a severe molding cycle. In general, it is desirable to make the thickness thin within a range that can ensure sufficient heat insulation, and is usually set within a range of 0.1 mm to 0.5 mm, preferably within a range of 0.1 mm to 0.3 mm. As with the thin plate body, it is extremely thin.
  • each thickness is, for example, 10 ⁇ m or more and 200 ⁇ m or less.
  • the total thickness in which the first heat-resistant adhesive layer and the low thermal conductivity member layer 31 are integrated has a feature that it is extremely thin within a range of 0.1 mm to 0.3 mm.
  • thermosetting adhesive used in one embodiment of the present invention belongs to a resin material and has a significantly lower thermal conductivity than a metal material. Therefore, the thin layer (thermosetting adhesive layer 32) formed of the thermosetting adhesive corresponds to the low thermal conductivity member defined in one embodiment of the present invention. Thereby, the low heat conductivity member 30 is comprised by the heat resistant adhesive bond layer 32 and the low heat conductivity member layer 31 which are shown in FIG.
  • the low thermal conductivity member used in one embodiment of the present invention a general plastic material can be widely applied, but it is necessary to have excellent heat resistance and pressure resistance.
  • a general plastic material examples include polyimide and polyamideimide.
  • the low thermal conductivity member can be constituted only by the thermosetting adhesive itself.
  • the structure of FIG. 2 integrated through a thermosetting adhesive is preferable.
  • such a thin plate member 10 is formed by forming a recess in the back plate 50 of the mold 100 by a depth corresponding to the thickness of the thin plate member 10, and forming the mold surface of the thin plate member 10 in the recess. It is attached so that 20a is on the surface side (cavity surface side).
  • the mounting of the thin plate member 10 in the recess is not particularly limited as long as it can be removed (detached). In simple terms, it can be mounted if the surface of the recess is kept sticky or adsorbable. Moreover, you may comprise so that attachment and detachment
  • thermosetting adhesive is particularly excellent in the integration of the low thermal conductivity member 30 and the thin plate body 20.
  • a polyimide-based member is preferred and adopted.
  • a plastic material such as polyimide has a significantly larger linear expansion coefficient than the metal material constituting the thin plate body. Therefore, if the polyimide film is bonded to the thin plate main body with a normal pressure-sensitive adhesive or the like, it is difficult to withstand repeated molding cycles because the polyimide film is displaced due to the difference in thermal (linear) expansion coefficient.
  • the molding conditions employed in the present invention can be secured. It is difficult to ensure sufficient heat insulation. That is, it is difficult to secure a necessary thickness by the coating method.
  • thermosetting adhesive having heat resistance as an adhesive
  • thermosetting time as curing conditions, without generating a very small amount of gas. It can be presumed that this contributes greatly as a factor in eliminating the occurrence of distortion in the molded product.
  • thermosetting adhesives for the present invention include, for example, heat-resistant rubber (for example, nitrile rubber) and thermosetting adhesive that has strong adhesive strength as a structural adhesive and the like and has heat resistance. And a mixture with an agent (for example, a phenol resin).
  • heat-resistant rubber for example, nitrile rubber
  • thermosetting adhesive that has strong adhesive strength as a structural adhesive and the like and has heat resistance.
  • a mixture with an agent for example, a phenol resin.
  • the adhesive is, for example, a phenol-based dehydration-condensation adhesive, a mixture of an imide-based, phenol-based, or acrylic rubber-based resin, and these self-crosslinking adhesives or addition-reactive adhesives are used. May be.
  • An example of such a preferred adhesive is a thermally active film (trade name Tessa HAF) provided by TESA.
  • Tessa HAF thermally active film
  • thermoactive film is softened at a low temperature of about 80 ° C. to 100 ° C., for example, and exhibits thermoreversible adhesiveness. Further, it can be dehydrated and cross-linked by an irreversible chemical reaction at a high temperature exceeding 120 ° C., for example, within a range of about 120 ° C. to 220 ° C., and can exert a strong bonding force.
  • high toughness and high strength are expressed by dehydration crosslinking between the rubber component and the strong adhesive component.
  • this crosslinking reaction is irreversible, and it exhibits a heat resistance of 150 ° C. or higher and a high adhesive strength of 12 N / mm 2 or higher by crosslinking under high pressure with sufficient curing temperature and curing time. And exhibit very good waving characteristics. Due to the excellent waving characteristics, volatile components are not substantially generated under the conditions of the molding cycle according to the present invention.
  • the preferable conditions for producing the mold member according to the present invention are the first step of laminating the thin plate body 20 and the heat-resistant film as the low thermal conductive layer 31 at a low temperature, and the heat at a temperature higher than the first step.
  • the thin plate body 20 and the low thermal conductive film are bonded to each other through two steps including the second step of curing.
  • the first step (lamination step) and the second step (curing step) are performed under pressure for a sufficient time (for example, 0.1 MPa, 6 hours) to compress the thermally active film under high pressure. In this state, it is thermally crosslinked.
  • a sufficient time for example, 0.1 MPa, 6 hours
  • deformation of the thermally active film as an adhesive layer is suppressed, As a result, an extremely strong and durable bonding force can be exhibited at the interface between the thin plate body 20 and the low thermal conductivity member layer 31.
  • the curing time and curing temperature recommended by the film provider are, for example, 130 ° C. to 220 ° C. for about 10 minutes to 30 minutes.
  • a cured film having physical properties in the range of about 490 N / cm 2 to 2530 N / cm 2 (rate: 300 mm / min, temperature: 23 ° C.) is obtained. It is explained that it can.
  • the curing conditions proposed in the present invention are at least 130 ° C. or higher for 1 hour or longer, preferably 2 hours or longer, usually about 3 hours.
  • a fully crosslinked cured film is obtained, and as a result, there is no variation in thickness under high temperature and high pressure injection molding cycle conditions according to an embodiment of the present invention. Shear resistance against shearing can be ensured.
  • (Modification of mold member 10) Next, in the mold member 10 of FIG. 3, the metal thin plate body 20 having the mold surface 20a that forms one surface of the cavity and the back surface 20b of the thin plate body 20 that is the surface facing the mold surface 20a are arranged.
  • the low thermal conductivity member 30 is provided, and a reinforcing member 40 disposed on the back surface of the low thermal conductivity member 30.
  • the low thermal conductivity member 30 includes a first heat resistant adhesive layer 32 composed of a heat resistant thermosetting adhesive, a low thermal conductivity member layer 31, and a heat resistant thermosetting adhesive. 2, the low thermal conductivity member layer 31 is integrated with the thin plate main body 20 via the first heat resistant adhesive layer 32, and the low thermal conductivity member layer 31 is the second thermal conductivity member layer 31.
  • the heat-resistant adhesive layer 33 is integrated with a reinforcing member 40 disposed on the back surface.
  • thermosetting adhesive since the thermosetting adhesive has a remarkably small thermal conductivity compared to metal, the thin layers (thermosetting adhesive layers 32 and 33) formed by this thermosetting adhesive and the low thermal conductivity member are used.
  • the layer 31 constitutes the low thermal conductivity member 30.
  • the low thermal conductivity member is bonded by the thermosetting adhesive, whereby the thin plate main body 20 and the low thermal conductivity member 30 and the interface between the thin plate main body 20 and the reinforcing material 40. Are integrated.
  • the thickness of the thin plate body 20 is set to be a predetermined value from the relationship of the heat capacity and the like, and is usually 0.3 mm or more and 0.6 mm or less. It is characterized by being extremely thin within the range.
  • the low thermal conductivity member 30 includes, for example, a low heat conductive first heat-resistant adhesive layer having a thickness of 10 ⁇ m or more and 200 ⁇ m or less, a low heat conductive layer having a thickness of 10 ⁇ m or more and 200 ⁇ m or less, and a thickness of 10 ⁇ m.
  • the combination with the low heat conductive second heat-resistant adhesive layer within the range of 200 ⁇ m or less, and the total thickness of these layers integrated is within the range of 0.1 mm or more and 0.3 mm or less. It is very thin.
  • such a thin plate member 10 is carved into the back plate 50 of the mold 100 by a depth corresponding to the thickness of the thin plate member 10, so that the mold of the thin plate member 10 is formed in the recess.
  • the surface 20a can be mounted with the surface side (cavity surface side).
  • the reinforcing member 40 is further provided on the back surface as compared with the mold member 10 of FIG. 2, whereby the handling operation of the mold member 10 is further facilitated, and repeated mounting and demounting are facilitated. .
  • the part of the back plate 50 which supports the back surface of the mold member 10 may be omitted.
  • the typical example of such an example is the same as or equivalent to the case where the thin plate member 10 is bonded to the cavity surface of the nested mold.
  • a low thermal conductivity member is softer than a metal material due to plastic or the like. Therefore, it may be assumed that distortion occurs in the mold surface 20a of the thin plate body due to the selection of the adhesive.
  • the reinforcing material 40 is not particularly limited as long as it has a reinforcing action, but a stainless steel material can be used in consideration of economy.
  • the same material as that of the thin plate body 20 may be used.
  • the thin plate body 20 generally constituting the cavity surface is nickel or chrome formed by a technique such as electroplating or cutting.
  • Relatively expensive materials such as chrome plating are applied to materials such as copper and brass that can withstand processing. Therefore, it is not economical to use these expensive thin plate materials as the reinforcing material.
  • the crosslinking reaction of the thermally active film starts from around 106 ° C., but when terminated at a high temperature around 150 ° C., the linear expansion coefficient between nickel and stainless steel is allowed to cool after leaving the crosslinking reaction. Due to the difference, the convex warpage of the mold surface 20a could be confirmed.
  • the warpage when a die member is manufactured with a material having a different linear expansion coefficient using nickel as a thin plate material is as shown in Table 1 even when the thin plate body has a small material of about 280 mm ⁇ 200 mm.
  • warping does not occur.
  • the thickness of the reinforcing material is sufficiently thin, warping is performed under the pressure holding condition in the present invention. Is within this range, it is possible to produce a molded product that fully meets the specifications.
  • the thickness of such a reinforcing material is not particularly limited, but normally, the reinforcing effect is exhibited at 0.5 mm or more.
  • the reinforcing effect is exhibited at 0.5 mm or more.
  • 2.5 mm SUS stainless steel is selected and demonstrated in the examples described later. Therefore, it is considered to be up to about 3 mm. That is, since the back surface is lined (supported) by the back plate, a small warp of the mold member 10 is substantially reduced by holding pressure in the molding cycle, and a molded product having a good appearance can be formed.
  • the difference in linear expansion coefficient from the material of the thin plate body is within a range of ⁇ 6 ( ⁇ 10 ⁇ 6 / ° C.), more preferably ⁇ 3 ( ⁇ 10 ⁇ 6 / ° C.). Within range.
  • a material having a small difference in linear expansion coefficient from nickel include NSSC stainless steel (particularly ferrite), but are not limited thereto.
  • the joining method and joining conditions of the thin plate body and the low thermal conductivity member or the joining method and joining conditions of the low thermal conductivity member and the reinforcing material are equal to or the same as the manufacturing conditions of the mold member shown in FIG. Detailed description is omitted.
  • the mold 100 described above is used by being attached to an injection molding machine.
  • a light control member molded into a thin plate shape can be manufactured by this injection molding method.
  • Such a light control member is a thin plate-like resin molded product including a sheet-like form, a film-like form, etc., and has two large opposing surfaces constituting the thin plate-like resin molded product (hereinafter, this surface is the main surface). At least one surface is used as an exit surface for emitting light.
  • incident light is incident from at least one surface such as a main surface or a side surface of the control member.
  • the incident light is propagated through the inside of the light control member with refraction or reflection in a plane direction and / or a direction (including a vertical direction) intersecting the plane.
  • the traveling direction of the incident light is controlled and emitted from at least one main surface.
  • at least one of the two main surfaces is provided with a fine uneven surface for controlling the direction of the emitted light.
  • the other main surface may be an uneven surface having the same or different form, or may be a smooth surface.
  • the mold surface 20a of the mold member according to the embodiment of the present invention is provided with an uneven surface or a mirror surface corresponding to the fine uneven surface of the light control member.
  • An example of the light control member whose incident surface is a side surface is a light guide plate, and this light guide plate is a component of a side edge type backlight used in a display device such as a liquid crystal.
  • the side-edge type backlight light is incident with one end face (one side face) having a small thickness of the light guide plate as an incident end face.
  • the light incident on the light guide plate travels while being reflected and / or refracted between the two main surfaces toward the side surface (the other end surface) facing the incident end surface.
  • Light incident in this propagation process is emitted with one main surface as an emission surface, and is used as a backlight of a liquid crystal display device.
  • An example of the light control member whose incident surface is the main surface is a diffusion plate as a component of a liquid crystal display device.
  • a diffusion plate as a component of a liquid crystal display device.
  • incident light enters from one main surface which is a large opposing surface of a thin plate shape.
  • the incident light travels toward the main surface (the other main surface) opposite to the incident surface (the one main surface), and is emitted from the other main surface.
  • incident light is diffused by the effect of the diffusion plate. That is, in the diffusion plate, the direction of light is diffused in the process of light passing through the diffusion plate.
  • a light control member are not limited to the light guide plate and the diffusion plate used for other purposes in addition to the light guide plate and the diffusion plate used in the above-described liquid crystal display device, and light is transmitted in a specific direction. It may be a lens sheet such as a prism sheet, a Fresnel lens, or a lenticular lens.
  • the emission surface from which light is emitted is the main surface, and in the light control member (injection molded product) according to one embodiment of the present invention, at least one main surface is provided with fine irregularities.
  • the mold member according to an embodiment of the present invention has a feature that it can be applied to a large-sized molded product that can cope with such a complicated brand exchange because the handleability is extremely good.
  • the mold member according to the present invention may be used when manufacturing a small molded article.
  • the light control member can be molded by the injection molding method described in Patent Document 1.
  • thermoplastic resin having a temperature equal to or higher than the transfer start temperature is introduced into a cavity portion constituted by a mold held at a temperature equal to or lower than the transfer start temperature, and is cooled by the mold.
  • Cavity side of the mold so that the thermoplastic resin near the mold surface that has fallen below the transfer start temperature rises again to a temperature exceeding the transfer start temperature after the cavity is filled with the thermoplastic resin.
  • the light guide plate when forming the light guide plate, if the light guide plate has an uneven pattern on the surface, it should be formed on the surface of the light guide plate on the mold surface 20a constituting the cavity portion of the thin plate member. Concavities and convexities opposite to the concavity and convexity pattern are provided. Further, if the light guide plate to be molded has a texture on the surface, the mold surface 20a constituting the cavity portion of the thin plate member is textured. Further, if the light guide plate to be molded is printed with a dot-like pattern, the mold surface 20a of the thin plate member remains a mirror surface (plane).
  • a thin plate member may be provided on both sides of the mold cavity. If the concavo-convex pattern or texture is only on one side of the light guide plate, a thin plate member may be provided on one side of the cavity (surface with the concavo-convex pattern or texture), and the other surface may remain a mirror surface. You may provide (in this case, the surface of one thin-plate member is a mirror surface).
  • a mold member having a mold surface 20a suitable for the lens sheet may be attached.
  • thermoplastic resin used in the method of the present invention is not particularly limited, and examples thereof include polymethyl methacrylate, polycarbonate, polystyrene, polypropylene, polyethylene terephthalate, polyvinyl chloride, thermoplastic elastomer, and copolymers thereof. .
  • Patent Document 1 the reason why the transferability is improved and the occurrence of weld marks, cold resin marks, flow marks and the like is reduced by the molding method of the resin molded product of the present invention will be described in a part of Patent Document 1.
  • MARC made by MARC
  • polymethyl methacrylate resin made by Kuraray Co., Ltd., trade name: Parapet HR-1000LC
  • the temperature dependence of the storage modulus is obtained from the measurement result (FIG. 4) of the relationship (bending mode) between the temperature and the longitudinal elastic modulus of the polymethyl methacrylate resin used.
  • the temperature at which the slope of the graph changes greatly is the transfer start temperature in this specification. This transfer start temperature is determined by the intersection of the tangent line of the graph of the phase transition region and the tangent line of the graph of the rubber-like flat region, and the transfer start temperature determined by this FIG.
  • Thickness of molded product 60 3 mm Mold 100 (carbon steel) thickness: 25mm Thin plate body 20 (nickel) thickness: 0.3 mm Filling time: 1.4 seconds Molding cycle: 60 seconds Temperature of mold 100: 85 ° C Heat transfer coefficient on the cooling water side: 1.0 ⁇ 10 ⁇ 3 cal / mm 2 ⁇ sec ⁇ ° C. Temperature of polymethyl methacrylate resin injected and filled into the cavity: 280 ° C In this simulation, as shown in FIG. 5, a mold 100 provided with a cooling facility 70 for passing cooling water through a surface (back surface) 100b facing the cavity is used. A thin plate member 10 is mounted on one surface of the mold 100 on the cavity side.
  • the thin plate member 10 includes a thin plate main body 20 disposed on the cavity surface (mold surface) 20a and a low thermal conductivity member 30 disposed on the back surface 20b.
  • the uneven structure formed on the mold surface 20a of the thin plate main body 20 has a height h of 13 ⁇ m and a pitch p of 30 ⁇ m.
  • This concavo-convex structure is a pattern of the exit surface of the light guide plate used for the side edge type backlight of the liquid crystal display device.
  • FIGS. 6 and 7 The results of the simulation are shown in FIGS. 6 and 7.
  • FIG. 7 the time axis of FIG. 6 is extended.
  • reference numerals (a), (b), and (c) indicate simulation results of the time (seconds) after injection and the temperature of the surface in contact with the mold of the polymethyl methacrylate resin.
  • (D) shows the simulation result of the relationship between the time (second) after injection and the temperature of the central part of the resin in the cavity of the polymethylmethacrylate resin.
  • symbol (a) is a simulation result which concerns on a control example, and in this control example, the same metal mold
  • the symbol (b) is an example in which a film made of polyethylene terephthalate having a thickness of 0.1 mm is used as the low thermal conductivity member 30, and the symbol (c) is a thickness as the low thermal conductivity member 30.
  • This is an example in which a film made of polyethylene terephthalate having a thickness of 0.15 mm was used.
  • the thermal conductivity of the polyethylene terephthalate film is 0.126 kcal / m ⁇ hr ⁇ ° C.
  • the thermal conductivity of the thin plate body 20 is 79.2 kcal / m ⁇ hr ⁇ ° C.
  • the transfer start temperature (128 ° C.) is exceeded instantaneously (within 1 second in these examples).
  • the resin filled in the cavity forms a cooling solidified layer instantaneously in the vicinity of the mold surface (mold surface 20a), but this cooling is caused by the resin temperature again exceeding the transfer start temperature.
  • the solidified layer disappears.
  • pressure is applied to the resin in the cavity in the pressure holding process, and the resin having a temperature equal to or higher than the transfer start temperature is pushed into the concavo-convex pattern.
  • the molding cycle of 60 seconds is a time sufficient for the temperature of the center of the resin filled in the cavity to be sufficiently lower than the transfer start temperature.
  • the uneven pattern is transferred to obtain a molded product (light guide plate). Further, in such a molded article, since the cooling solidified layer that causes orientation strain, cooling strain, and the like disappears instantaneously, generation of weld marks, cold resin marks, flow marks, and the like can be suppressed.
  • the low thermal conductivity member 30 is disposed on the back surface 20b of the thin plate body 20, and the low thermal conductivity member 30 is a film.
  • a polyethylene terephthalate film is used as the low thermal conductivity member 30, but when the resin temperature to be filled is as high as 280 ° C., the polyimide film is industrially considered in consideration of heat resistance. It is practical.
  • Patent Document 1 describes a specific experimental example in which a polyimide film is bonded to the back surface of the thin plate body 20 as a heat resistant member 30.
  • Example 1 As the thin plate main body, a nickel thin plate having a thermal conductivity of 79.2 kcal / m ⁇ hr ⁇ ° C., a thickness of 0.3 mm, and a size of 250 mm ⁇ 220 mm was used. On the cavity side surface of the thin plate main body, an isosceles prism-shaped uneven pattern having a pitch p of 50 ⁇ m and a height h of 25 ⁇ m is arranged.
  • a thermal activation film (trade name) manufactured by Tesa with a thermal conductivity of 0.3 kcal / m ⁇ hr ⁇ ° C. and a thickness of 0.125 mm
  • a polyimide film (low thermal conductivity member) having a thermal conductivity of 0.3 kcal / m ⁇ hr ⁇ ° C. and a thickness of 0.125 mm was integrated by adhesion via tesaHAF8402).
  • Bonding integration was performed in two stages, a first process (laminating process) and a second process (curing process).
  • the laminating process was carried out using a laminating roll, heated to 110 ° C., at a pressure of 0.5 MPa, and a feed rate of 0.4 m / min. Under these conditions, the thermally active film is in a molten state and can sufficiently penetrate into the irregularities on the surface of the adherend.
  • the curing step is to maintain the heat-active film at 130 ° C. for 3 hours under a pressure of 0.2 MPa to form an adhesive layer that integrates the polyimide film and the thin plate main body with sufficient durability. did it.
  • the cylinder temperature at this time was 270 ° C., and the molding cycle was 70 seconds.
  • the internal pressure (holding pressure) at which the prism shape is transferred is around 38 MPa, and the height of the obtained prism is 25 ⁇ m, which is the same as the depth of the engraved irregularities, and each has a good irregular pattern. It was confirmed that
  • Example 2 A nested mold was used in which the back surface penetrated to the back plate of the mold. A recess was formed in the cavity surface of the insert mold, and the thermally active film obtained in Example 1 was disposed in the recess.
  • Example 1 the back surface of the thin plate member obtained in Example 1 was thermocompression bonded to the surface of this thermally activated film under the same conditions as in Example 1. As a result, the thin plate member was embedded in the cavity surface of the nest so that the parting surface was flush with the mold surface 20a.
  • Example 1 When injection molding was performed under the same conditions as in Example 1, a good injection molded product could be obtained as in Example 1.
  • Example 3 A stainless steel material (SUS304) having a thickness of 2.0 mm as a reinforcing material was adhered to the back surface of the thin plate member obtained in Example 1 through the same thermally active film as used in Example 1. The bonding conditions are the same as in Example 1.
  • Such a thin plate member has a reinforcing material on the back surface and is thin, even when the thin plate member itself becomes large, it can be mounted on a mold and has good operability. there were.
  • Example 4 As the thin plate main body, a nickel thin plate having a thermal conductivity of 79.2 kcal / m ⁇ hr ⁇ ° C., a thickness of 0.3 mm, and a size of 335 mm ⁇ 230 mm was used. On the cavity side surface of the thin plate main body, an isosceles prism-shaped uneven pattern having a pitch p of 24 ⁇ m and a height h of 8.5 ⁇ m is arranged.
  • a thermally active film manufactured by Yodogawa Paper Mill Co., Ltd. having a thermal conductivity of 0.3 kcal / m ⁇ hr ⁇ ° C. and a thickness of 0.015 mm.
  • a polyimide film low thermal conductivity member having a thermal conductivity of 0.3 kcal / m ⁇ hr ⁇ ° C. and a thickness of 0.125 mm was integrated by bonding via a trade name SJ41).
  • Bonding integration was performed in two stages, a first process (laminating process) and a second process (curing process).
  • the laminating process was carried out using a laminating roll, heated to 110 ° C., at a pressure of 0.5 MPa, and a feed rate of 0.4 m / min. Under these conditions, the thermally active film is in a molten state and can sufficiently penetrate into the irregularities on the surface of the adherend.
  • thermoactive film was maintained at 150 ° C. for 3 hours, whereby the thermoactive film could be made into an adhesive layer that integrated the polyimide film and the thin plate main body with sufficient durability.
  • the cylinder temperature at this time was 295 ° C., and the molding cycle was 40 seconds.
  • the internal pressure (holding pressure) at which the prism shape is transferred is around 200 MPa, and the height of the obtained prism is 8.5 ⁇ m, which is the same as the depth of the engraved irregularities. It has been confirmed that.
  • Example 5 A nested mold was used in which the back surface penetrated to the back plate of the mold. A recess was formed in the cavity surface of the insert mold, and the thermally active film obtained in Example 4 was disposed in the recess.
  • Example 4 the back surface of the thin plate member obtained in Example 4 was thermocompression bonded to the surface of this thermally activated film under the same conditions as in Example 4. As a result, the thin plate member was embedded in the cavity surface of the nest so that the parting surface was flush with the mold surface 20a.
  • Example 6 A stainless steel material (SUS304) having a thickness of 0.8 mm as a reinforcing material was adhered to the back surface of the thin plate member obtained in Example 4 through the same thermally active film as used in Example 4. The bonding conditions are the same as those in Example 4.
  • Such a thin plate member has a reinforcing material on the back surface and is thin, even when the thin plate member itself becomes large, it can be mounted on a mold and has good operability. there were.
  • Example 7 When injection molding was performed under the same conditions as in Example 4, a good injection molded product could be obtained as in Example 4. (Example 7) After bonding a 0.8 mm thick stainless steel material (SUS304) as a reinforcing material to the back surface of the thin plate member obtained in Example 4 through the same thermally active film as used in Example 4, A mirror-like nickel thin plate having the same thickness and size as those used in Example 4 was bonded via the same thermally active film as used in Example 4. The bonding conditions are the same as those in Example 4.
  • SUS304 stainless steel material
  • Such a thin plate member has the same nickel plate as the front and back thin plates, so that the warpage of the plate after bonding is reduced and the mounting property to the mold is good.
  • Example 8 Adhering the same low thermal conductivity member as used in Example 4 to the same nickel thin plate as used in Example 4 via the same thermally active film as used in Example 4, and then The nickel thin plate was integrated by electroforming the back surface.
  • a manufacturing method is known, for example, from Japanese Patent Laid-Open No. 2001-071354.
  • nickel and low thermal conductivity are used in the method of directly plating nickel on the back surface of the low thermal conductivity member by the manufacturing method of Japanese Patent Laid-Open No. 2001-071354. It was found that the adhesion with the rate member was poor and the nickel layer could not be formed.
  • the adhesiveness is improved by using the same thermally active film as used in Example 4 between the low thermal conductivity layer and the nickel layer formed by plating. Different from 2001-071354.
  • Such a thin plate member has the same front and back configurations with a low thermal conductivity member as the center, it is possible to reduce the warpage of the plate caused by the difference in thermal expansion coefficient, and the mounting property to the mold is good. It was.
  • the heat activated film (trade name SJ41) manufactured by Yodogawa Mill used in Examples 4 to 6 generates less gas at high temperatures, and is compared with, for example, TESA (tesa HAF8402) which is a similar heat active film. Furthermore, there was little deterioration during repeated use during injection molding, and good results were obtained.
  • TESA tesa HAF8402
  • Nitto Denko's adhesive film (trade name: MC2030) and (trade name: 5919P) were used to bond the nickel thin plate and the polyimide film.
  • a lens sheet such as a light guide plate, a diffusion plate, a Fresnel lens sheet, and a lenticular lens sheet having a large area
  • a large lens sheet such as a Fresnel lens sheet or a lenticular sheet contacts a heated plate lens mold with a resin plate and pressurizes it to transfer the uneven lens surface of the lens mold surface to the resin mold.
  • the transfer method has a problem that the molding cycle is long and the productivity is not high.
  • a resin molded product capable of controlling light in a size larger than that of the optical disk substrate can be manufactured with high productivity.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Ophthalmology & Optometry (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

L'invention porte sur un élément de dé, qui doit être utilisé pour fabriquer un élément de commande de lumière par un procédé de moulage par injection, dans lequel un dé est utilisé, et qui peut être fixé à ou démonté du dé. L'élément de dé comporte un corps principal en panneau métallique mince ayant une surface de matrice et une épaisseur de 0,2 mm, ou plus, mais d'au plus 0,6 mm ; un élément de faible conductivité thermique, qui est disposé sur une surface faisant face à la surface de dé, et une épaisseur de 0,1 mm, ou plus, mais d'au plus 0,5 mm, et intégré au corps principal en panneau mince ; et un élément de renfort disposé d'un seul tenant sur la surface arrière de l'élément à faible conductivité thermique.
PCT/JP2008/073687 2007-12-27 2008-12-26 Élément de dé, procédé de fabrication d'élément de dé et procédé de formation d'un élément de commande de lumière par utilisation de l'élément de dé WO2009084615A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880123006.0A CN101909847B (zh) 2007-12-27 2008-12-26 金属模部件与其制造方法以及采用该金属模部件的光控部件的成形方法
JP2009548078A JP5610770B2 (ja) 2007-12-27 2008-12-26 金型部材、その製造方法
KR1020127026037A KR101473680B1 (ko) 2007-12-27 2008-12-26 금형 부재, 그 제조 방법 및 그것을 사용한 광 제어 부재의 성형방법

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JP2007-336514 2007-12-27
JP2007336514 2007-12-27

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Cited By (2)

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CN102729684A (zh) * 2011-04-11 2012-10-17 三星电子株式会社 印模及其制造方法
WO2013146985A1 (fr) * 2012-03-30 2013-10-03 コニカミノルタアドバンストレイヤー株式会社 Matrice de moulage et son procédé de fabrication

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EP3470202B1 (fr) * 2017-10-12 2021-08-18 Essilor International Moulage par injection comportant un cycle de chauffage/refroidissement pour la fabrication d'articles optiques avec surface fresnel
CN114603884B (zh) * 2022-02-25 2023-08-25 株洲时代新材料科技股份有限公司 一种制作车厢复合顶板时确保下模模面光滑的方法

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JP2004025647A (ja) * 2002-06-26 2004-01-29 Seiko Epson Corp 入れ子、金型及びこれらの製造方法
JP3686251B2 (ja) * 1997-03-31 2005-08-24 株式会社クラレ 樹脂成形品の成形方法およびその方法に用いる金型
JP2007237445A (ja) * 2006-03-06 2007-09-20 Mitsubishi Engineering Plastics Corp 光学部品の射出成形方法

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JP3011904B2 (ja) * 1997-06-10 2000-02-21 明久 井上 金属ガラスの製造方法および装置
JP2005288874A (ja) * 2004-03-31 2005-10-20 Mitsubishi Materials Corp 射出成形体の金型装置及び射出成形体の成形方法
JPWO2006046638A1 (ja) * 2004-10-28 2008-05-22 旭化成ケミカルズ株式会社 導光板及びその製造方法
JPWO2007077737A1 (ja) * 2005-12-28 2009-06-11 日本ゼオン株式会社 金型部品および平板成形品

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JP3686251B2 (ja) * 1997-03-31 2005-08-24 株式会社クラレ 樹脂成形品の成形方法およびその方法に用いる金型
JP2004025647A (ja) * 2002-06-26 2004-01-29 Seiko Epson Corp 入れ子、金型及びこれらの製造方法
JP2007237445A (ja) * 2006-03-06 2007-09-20 Mitsubishi Engineering Plastics Corp 光学部品の射出成形方法

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CN102729684A (zh) * 2011-04-11 2012-10-17 三星电子株式会社 印模及其制造方法
JP2012218435A (ja) * 2011-04-11 2012-11-12 Samsung Electronics Co Ltd スタンパ及びそれの製造方法
WO2013146985A1 (fr) * 2012-03-30 2013-10-03 コニカミノルタアドバンストレイヤー株式会社 Matrice de moulage et son procédé de fabrication

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JP5610770B2 (ja) 2014-10-22
KR20100096190A (ko) 2010-09-01
KR101261258B1 (ko) 2013-05-09
TW200936347A (en) 2009-09-01
CN101909847A (zh) 2010-12-08
KR101473680B1 (ko) 2014-12-18
CN101909847B (zh) 2014-08-13
KR20120127539A (ko) 2012-11-21
TWI457219B (zh) 2014-10-21

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