200936347 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種可使用於藉由 控制構件之模具構件、其製造方法及 的成形方法。 【先前技術】 將經加熱流動化的樹脂材料往模 使其在該模具內冷卻固化，接著打開 © 出成形法（包含射出壓縮成形法）係含 材料之加工方法，正廣泛地普及作爲 容易地進行成形的自動化之成形加工 但是在通常的射出成形法，在模 融樹脂的表面，會形成冷卻固化層。 礙成形品的微細凹凸的轉印性，又， 冷斑、流紋等之原因。 本申請人已提案（例如，專利文獻 φ 此種射出成形法的課題之一個例子。 載之樹脂成形品的成形方法，在模具 薄板構件或模具構件。該薄板構件係 及低熱傳導率構件所構成，其中該金 用以形成模槽的一面之模面，而該低 設在該薄板本體的背面之聚醯亞胺薄 裝有該薄板本體之模具在具有轉印開 熱塑性樹脂被導入至模槽部時，係以 轉印開始溫度以下的溫度之模具表面 射出成形法來製造光 使用它之光控制構件 具內的模槽射出，並 模具取出成形品之射 有熱塑性樹脂的樹脂 提升生產速度或能夠 法之一。 槽內所射出塡充的熔 此種冷卻固化層會阻 會成爲產生熔合痕、 1)揭示一個用以解決 在該專利文獻1所記 的模槽的一面安裝有 由金屬製的薄板本體 屬製的薄板本體具備 熱傳導率構件係由配 膜所構成。在此，安 始溫度以上的溫度之 被模具冷卻而下降至 附近的熱塑性樹脂， -4- 200936347 係以再次上升至大於轉印開始溫度的溫度之方式，來設定 薄板本體的熱容量。 使用此種模具，能夠將具有轉印開始溫度以上的溫s 之熱塑性樹脂導入至被保持在轉印開始溫度以下的溫度之 模具的模槽部。雖然在模槽部所導入的熱塑性樹脂被模具 的模槽面冷卻而暫時降低至轉印開始溫度以下的溫度’但 是藉由模槽的一面（模面）具有經設定的熱容量，接觸該模 面的熱塑性樹脂再次上升至大於轉印開始溫度的溫度。 0 依照此種樹脂成形品的成形方法，能夠減少在模槽內 所射出塡充的熔融樹脂的表面形成冷卻固化層，能夠提升 轉印性。又，能夠減少產生熔合痕、冷斑、流紋等。藉此， 此種樹脂成形品的成形方法係適合於生產導光板、i鏡薄 片等用以控制光線之光控制構件。 依照專利文獻1所記載之樹脂成形品的成形方法，藉 由交換在模面刻印有凹凸花紋或鏡面花紋之不同的薄板本 體，具有能夠使用同一模具來生產在表面具有不同的微細 ^ 形狀之樹脂成形品之優點。 Ο 但是，經過長期間製造樹脂成形品，又，重複交換薄 板本體時，會有可觀察到樹脂成形品的表面產生變形之情 況。硏討該原因時，推測其原因可能是配設或黏合於薄板 本體的背面之聚醯亞胺薄膜產生皺紋或折曲。 亦即，配設或黏合於薄板本體的背面之聚醯亞胺薄膜 在交換薄板本體會有產生皺紋或產生折曲之情形。在此， 專利文獻1提案所揭示之薄板本體，雖然接觸在模槽內投 入的模面之熱塑性樹脂的溫度係暫時降低至轉印開始溫度 以下，但是必須以再次上升至轉印開始溫度以上的方式且 -5- 200936347 熱容量爲規定容量的方式設定。因此，薄板本體的厚度受 到規定容量的熱容量之限制，通常係較薄而爲1毫米以下 (例如，0.3毫米〜0.6毫米左右的範圍內）’因此’若聚醯 亞胺產生皺紋或折曲時，發現會成爲無法避免在作爲薄板 本體的成形面之模面產生變形之新的課題。 [專利文獻1]特許第3686251號公報說明書（第6、8 圖及段落號0038) 【發明内容】 [發明所欲解決之課題] 因此，本發明之目的係提供一種模具構件，其係具備 藉由射出成形製造薄板狀的光控制構件所使用能夠交換之 薄板本體的模具構件，即便長時間使用亦能夠安定地生產。 [解決課題之手段] 本發明的一個實施例之模具構件，其係可使用於藉由 使用模具的射出成形法來製造光控制構件且能夠安裝著脫 於該模具上之模具構件，其係具備：金屬製的薄板本體， 其係具備模面且具有0.2毫米以上、0.6毫米以下的厚度； 低熱傳導率構件’其在係與前述模面呈相向的面，與前述 薄板本體整體化配設而成且具有0.1毫米以上、0.5毫米 以下的厚度；及增強材’其係在前述低熱傳導率構件的背 面來整體化設置而成。 【實施方式】 以下，說明用以實施本發明的一個實施例之最佳形 態。又，爲了說明的方便上’以下的圖示係藉由將各部分 的縱橫的縮尺隨意地變更而成之模式圖來說明。 -6- 200936347 在本發明之模具構件的槪略圖之一個例子係如第1圖 至第3圖所示。在此，第1圖係說明將模具構件10安裝 在模具的狀態。第2或第3圖係說明在此所安裝的模具構 件的詳細。 本發明的一個實施例之模具構件或薄板構件 1 0係使 用於藉由使用模具的射出成形法來製造光控制構件且能夠 安裝著脫於該模具上之模具構件10,其係具備：金屬製的 薄板本體20,其係具備模面或模槽面20a且具有0.2毫米 以上、0 · 6毫米以下的厚度；低熱傳導率構件3 0，其在係 與前述模面20a呈相向的面，與前述薄板本體整體化配設 而成且具有0.1毫米以上、0.5毫米以下的厚度；及增強 材40，其係在前述位熱傳導率構件30的背面來整體化設 置而成。 又，在本發明的一個實施例之模具構件或薄板構件10 係使用於藉由使用模具的射出成形法來製造光控制構件且 能夠安裝著脫於該模具上之模具構件，其係具備：金屬製的 薄板本體，其係具備模面或模槽面2 0a且具有0.3毫米以 上、0.6毫米以下的厚度；及低熱傳導率構件30,其在係與 前述模面呈相向的面，與前述薄板本體整體化配設而成且具 有0.1毫米以上、0.3毫米以下的範圍內的厚度而成。 在此，說明本發明的槪要。爲了解決前述的課題，本 發明者對於在薄板本體的成形面所產生的變形之原因，嘗 試詳細的考察。先前被認爲問題之課題係在薄板本體的背 面配設薄膜時，若小心謹慎地進行薄板本體交換’則在樹 脂成形品的大小較小的情況能夠避免。但是近年來，隨著 液晶顯示裝置的大畫面化，在其所使用之各種光控制用的 200936347 樹脂成形品亦必須變大。例如，配設 示面全面範圍之導光板、擴散板等的 邊的一邊變大而超過1公尺之情形。 在用以製造此種大型的光控制/ 具，使配設在背面之聚醯亞胺薄膜不 業，處理變爲困難且越來越需要熟^ 題。又，此種課題在直徑頂多爲20^ 成形品亦即如光碟基板之樹脂成形品 0 被視爲新的課題。 根據本發明者的分析，認爲即便 合作爲低熱傳導率構件之薄膜時，起 歷、#:壓經歷等，或黏合劑的一部分 爲通常的情況，即便使用與金屬的黏 能是由於在60秒左右的成形周期所 壓之熱經歷、保壓經歷會預料以上重 伸長、或薄板本體與黏合劑的線膨脹 A 劑與低熱傳導率構件的線膨脹係數的 0 會產生預料外的剝離。 因此’因爲本發明者認識該等黏 都不可以產生剝離，認爲爲了解決上 能是將薄板本體與配置在其背面之低 體化。 使此種薄板本體與低熱傳導率構 爲在薄板本體的背面使用熱固型的耐 傳導率構件整體化，或是在薄板本體 率構件而配設增強材來將預料會破損 在液晶顯示裝置的顯 光控制構件會產生長 目的樹脂成形品之模 產生皴紋或折曲之作 柬而成爲新的重要課 / 30公分左右的樹脂 係完全不被重視，而 在薄板本體的背面黏 因於成形周期的熱經 產生剝離。亦即，認 合充分之黏合劑，可 產生的高溫下的高保 大地反映在黏合劑的 係數的差異、或黏合 差異，結果，一部分 合劑必須即便一部分 述課題，最重要的可 熱傳導率構件加以整 件整體化之方法，認 熱性黏合劑來使低熱 的背面透過低熱傳導 之低熱傳導率構件製 -8- 200936347 成夾層結構，能夠解決上述課題。 在此’本發明者發現使用黏合劑而將薄板本體與低熱 傳導率構件整體化，所使用的黏合劑，使其維持耐熱性、 耐壓力性、耐剪切力性、耐熱劣化性（熱分解、發泡等）等 各種特性係重要的。 亦即，耐熱性係必須能夠經得起在射出成形條件的高 溫所塡充的樹脂溫度，而不會產生熱分解、或發泡等。又， 耐壓力性係必須能夠經得起用以維持微細凹凸的高轉印性 Φ 之高保壓。又，耐剪切力性係必須能夠經得起配合射出成 形的成形周期之高溫與常溫的重複熱經歷。使滿足該等的 任一條件之低熱傳導率構件配設在薄板本體的背面時，能 夠防止低熱傳導率構件產生熱分解、或發泡、又，能夠防 止一部分剝離等而在薄板本體產生變形。 亦即，本發明的一個實施例可以是一種模具構件，其 特徵係藉由將經加熱流動化之樹脂材料射出至模具內的模 槽，並在該模具內邊維持高壓邊使其冷卻固化或硬化，接 @ 著打開模具將已成形爲薄板狀之樹脂成形品取出之射出成 形法來製造光控制構件時所使用之模具構件，前述光控制 構件係其較大呈相對向薄片狀之2個面中的至少一面爲被 利用作爲將光線射出之射出面，且前述模具構件至少具 備：金屬製的薄板本體，其係具備用以形成模槽的一面之 模面厚度爲0.2毫米以上、0.6毫米以下的範圍內，較佳 是0.3毫米以上、0.6毫米以下的範圍內；及低熱傳導率 構件，其係配設在與前述模面呈相向的面亦即前述薄板本 體的背面而成且厚度爲0.1毫米以上、0.5毫米以下的範 圍內，較佳是0.1毫米以上' 0.3毫米以下的範圍內，前 -9- 200936347 述薄板本體與前述低熱傳導率構件的界面係被整體化，且 能夠安裝著脫作爲模具的模槽面。 該薄板本體與低熱傳導率構件係使用熱固型的耐熱性 黏合劑來加以整體化時，能夠更加抑制低熱傳導率構件產 生剝離。在此，該耐熱性黏合劑以不會生成硬化副產物者 爲佳。 又，在該低熱傳導率構件的背面，若增強材被整體化， 即便低熱傳導率構件的一部分產生剝離，亦不會使薄板本 0 體產生變形。又，此種增強材能夠提升薄板構件的操作性， 且能夠使薄板本體在模具的模槽面之安裝、著脫操作變爲 容易。 本發明之較佳模具構件，其低熱傳導率構件具備厚度 爲10微米以上、200微米以下的範圍內之低熱傳導性的第 1耐熱性黏合劑層；厚度爲1〇微米以上、2 00微米以下的 範圍內之低熱傳導層；及厚度爲1〇微米以上、200微米以 下的範圍內之低熱傳導性的第2耐熱性黏合劑層。 Ο 又’裱褙上述增強材而成之模具構件，雖然薄板本體 與增強材若爲同一材料時不會產生翹曲，但是選擇不同材 料時亦能夠藉由減小互相的線膨脹係數差異，又，藉由使 增強材的厚度爲必要最小限度的厚度，能夠減少由於在成 形周期過程產生的溫度差異所引起的翹曲。 此種模具例如能夠藉由將耐熱性黏合劑層（第1耐熱 性黏合劑層、前述第2耐熱性黏合劑層）及低熱傳導層作爲 薄膜由來而製造。 例如’薄板本體與低熱傳導率構件的界面係使用薄膜 狀的黏合劑作爲熱固型的耐熱性黏合劑來整體化時，該整 -10- 200936347 體化步驟能夠藉由進行包含第1步驟及第2步驟來將薄板 本體及低熱傳導性薄膜加以整體化之步驟，來製造在本發 明所使用之較佳模具構件，其中該第1步驟係使前述薄板 本體與作爲前述低熱傳導層的耐熱性薄膜層壓，而該第2 步驟係以比第1步驟更高的溫度使其熱固化。 藉由採用此種條件，能夠提供一種模具構件，其具有 充分的交聯度且具備不會產生厚度變動的硬度、耐壓力性 及樹脂之對剪切的耐剪切力性。藉此，即便在成形周期的 φ 苛刻條件（來自射出成形所使用高溫的流動熔融樹脂之受 熱）下進行重複使用，在黏合部分不會產生分解’能夠確保 充分的耐熱劣化性。在此，層壓條件或硬化條件能夠考慮 所使用的樹脂材料、製造設備等而適當地決定。 使用裝著有上述的模具構件而成的模具時，模具構件 係將具有轉印開始溫度以上的溫度之熱塑性樹脂導入至由 保持在轉印開始溫度以下的溫度的模具所構成之模槽部， 且以被該模具冷卻而下降至轉印開始溫度以下的溫度之模 & 具表面附近的熱塑性樹脂，在熱塑性樹脂被塡充至模槽部 ❹ 後，再次上升至高於轉印開始溫度的方式來設定模槽部側 的表面部分之熱容量。藉此，使用此種模具且將較大呈相 對向薄片狀之2個面中的至少一面利用作爲射出光線的射 出面，來形成光控制構件時，即便長時間使用亦能夠安定 地製造光控制構件。又，因爲該模具構件能夠交換，所以 若準備複數個不同模面的凹凸花紋之模具構件時，能夠使 用於製造少量多品牌的光控制構件。 如此進行而成形的光控制構件，可例示導光板、透鏡 薄片及光擴散板等。在該等光控制構件的一面係形成有微 -11- 200936347 細的凹凸圖案，該微細的凹凸圖案係再現被刻印在模具構 件的表面之凹凸面。 在第2圖所示之模具構件1〇，其係具備：金屬製的薄 板本體20，其係具備形成模槽的一面之模面20a ;及低熱 傳導率構件30,其係配設在與模面20a呈相向之面亦即薄 板本體20的背面20b。該低熱傳導率構件30係由第1耐 熱性黏合劑層3 2及低熱傳導率構件層3 1所構成，其中該 第1耐熱性黏合劑層3 2係由耐熱性的熱固型黏合劑所構 φ 成，而該低熱傳導率構件層31係透過耐熱性黏合劑層3 2 來與薄板本體20整體化。 在本發明的一個實施例之模具構件10，薄板本體20 及低熱傳導率構件30的各厚度係以成爲根據熱容量等的 關係之規定値的方式設定。其特徵係薄板本體20的厚度係 極薄而爲0.2毫米以上、0.6毫米以下的範圍內，以0.3 毫米以上、0.6毫米以下的範圍內爲佳。 另一方面，低熱傳導率構件3 0的厚度係若在能夠絕熱 的範圍時沒有特別限制，太薄時絕熱性不充分，又’會產 生必須增長成形周期’另一方面，若厚度不必要地太厚時 難以製造，又’在苛刻的成形周期之過程，會有難以安定 地製造光控制構件之情形。通常其厚度係在能夠確保充分 的絕熱性之範圍內，以較薄地構成爲佳，通常爲0 · 1毫米 以上、0.5毫米以下的範圍內，以在〇·1毫米以上、0·3 毫米以下的範圍內設定爲佳，與薄板本體同樣地具有極薄 的特徵。 該低熱傳導率構件30係如第2圖所示’由第1耐熱 性黏合劑層32及低熱傳導率構件層31所構成時之各厚 -12- 200936347 度’例如係由厚度10微米以上、200微米以下的範圍內的 低熱傳導性之第1耐熱性黏合劑層、及厚度1〇微米以上、 200微米以下的範圍內的低熱傳導層之組合。此時，第1 耐熱性黏合劑層與低熱傳導率構件層31被整體化後的合 計厚度爲0.1毫米以上、03毫米以下的範圍內而具有極 薄的特徵。 在本發明的一個實施例所使用的熱固型黏合劑係屬於 樹脂系的材料，與金屬材料比較，熱傳導率顯著地較小。 0 因此’藉由熱固型黏合劑所形成的薄層（熱固型黏合劑層 32)係符合在本發明的一個實施例所定義之低熱傳導率構 件。藉此’如第2圖所示，低熱傳導率構件3 0係由熱固 型黏合劑層32及低熱ί專導率構件層31所構成。 在此’在本發明的一個實施例所使用的低熱傳導率構 件’雖然通常的塑膠材料能夠廣泛地應用，但是必須耐熱 性、耐壓力性優良。此種材料例如可例示聚醯亞胺、聚醯 胺醯亞胺’若具有充分的厚度及耐久性時，亦能夠只使用 0 熱固型黏合劑本身來構成低熱傳導率構件。但是，因爲具 備能夠整體化程度之黏合性及耐熱性之材料且能夠確保絕 熱性程度的厚度係難以從單一材料取得，以將耐熱性薄膜 透過熱固型黏合劑使其與薄板本體整體化之第2圖的構成 爲佳。 此種薄板構件10係如第1圖所示，在模具1〇〇的背 板50形成相當於薄板構件10的厚度之深度程度之刻入凹 部’並在該凹部以薄板構件1 0的模面20a係在表面側（模 槽面側）的方式安裝。 在凹部安裝薄板構件10’係能夠進行卸下（著脫）之構 -13- 200936347 成時沒有特別限定。簡易地，若能夠對凹部表面維持黏著 性或吸附性時，則能夠使其安裝。又，其構成亦可以是藉 由嵌合結構來進行安裝、著脫。 此種薄板構件10，因爲低熱傳導率構件30與薄板本 體2 0被整體化，所以將模具構件1 0安裝在背板5 0時之 處理操作亦變爲容易，且經過長時間的成形周期後亦不會 產生成形品表面變形。 接著，說明藉由透過熱固型黏合劑而將低熱傳導率構 0 件3 0與薄板本體2 0整體化，能夠消除成形品產生變形之 理由。 雖然熱固型黏合劑對於低熱傳導率構件30與薄板本 體2 0沾整體化係特別優良的理由之詳細並不清楚，本發明 者對其理由進行以下的推測。 亦即，因爲通常要求耐熱性，低熱傳導率構件以採用 聚醯亞胺系的構件爲佳。但是，如聚醯亞胺的塑膠材料具 有比構成薄板本體的金屬材料顯著地更大的線膨脹係數。 0 因此，使用通常的黏著劑等來使聚醯亞胺薄膜黏合於薄板 本體時，由於熱（線）膨脹係數的差異，聚醯亞胺薄膜產生 偏離而難以經得起重複的成形周期。又，其構成係藉由塗 布法等使聚醯亞胺或聚醯胺醯亞胺等的耐熱性薄膜材料的 先質之薄層以未硬化形態賦予在薄板本體的背面時，難以 確保在本發明所採用的成形條件所能夠確保的程度之絕熱 性。亦即，塗布法難以確保必要的厚度。 又，使用具有耐熱性之通常的黏合劑使聚醯亞胺薄膜 或聚醯胺醯亞胺薄膜黏合時，因爲黏合劑與金屬製的薄板 材料之熱膨脹係數不同，長期間使用時無法避免部分的剝 -14- 200936347 離。雖然剝離產生的原因不明，依照本發明者細心觀察， 亦可指出從黏合劑產生之極少量的氣體（分解物）的產生有 成爲原因之可能性。 相對地，使用具有耐熱性之熱固型性黏合劑作爲黏合 劑時，藉由設定充分的加熱溫度及加熱時間作爲硬化條 件，不會產生極微少量的氣體而能夠使其黏合，推測這是 相當有助於消除成形品產生變形之一個原因。 在本發明，較佳耐熱性之熱固型黏著劑可舉出例如耐 熱性橡膠（例如丁腈橡膠）與作爲結構用黏合劑等之黏合強 度強且具有耐熱性的熱固型黏合劑（例如，酚樹脂系）之混 合物。使此種耐熱性橡膠材料調配黏合強度優良的耐熱性 的熱固型黏合劑，能夠重大地改變其黏合特性。特別是因 爲丁腈橡膠系在分子中具有極性高的CN基，能夠賦予高 剝離強度及強韌性。藉此，能夠對熱固性黏合劑賦予耐剪 切力性。 上述黏合劑係例如苯酚系的脫水縮合系黏合劑、或醯 亞胺系、苯酚系、丙烯酸橡膠系樹脂的混合物，亦可以使 用該等的自交聯性黏合劑、或是加成反應性黏合劑。 此種較佳黏合劑的一個例子係TESA公司提供之熱活 性薄膜（商品名爲tesa HAF)。該tesa HAF(熱活性薄膜） 係以丁腈橡膠及酚樹脂作爲主原料，且以在雙面使用脫模 紙保護而成之薄膜狀提供。藉由將雙面脫模紙剝下，因爲 具有輕黏著性，能夠與其他薄板材料暫時黏合。又，該熱 活性薄膜在例如8 0 °C〜1 0 0 °C左右的低溫度被軟化而顯現 熱可逆的黏著性。又’高於1 2 0 r的高溫度，例如1 2 0 °c 〜220 °C左右的範圍內時，藉由不可逆的化學反應而脫水 -15- 200936347 交聯，能夠使其發揮堅強的黏合力。 亦即，藉由橡膠成分與強力黏合劑成分之脫水交聯， 能夠使其顯現高強韌性與高強力。又，該交聯反應係不可 逆的’藉由充分的硬化溫度及花費硬化時間在高壓力下使 其交聯，能夠使其發揮1 5 0 °C以上的耐熱性及1 2 N / mm2 以上的高黏合強度且非常優良的滲泌（oozing)特性。藉由 該優良的滲泌特性，在本發明之成形周期條件，係實質上 不會使其產生揮發成分。 ϋ 在此，製造本發明的模具構件之較佳條件係經由至少 第1步驟及第2步驟的2個步驟來將薄板本體20與低熱 傳導性薄膜貼合，其中該第1步驟係在低溫度使前述薄板 本體20與作爲低熱傳導層31的耐熱性薄膜層壓，而該第 2步驟係以比第1步驟更高的溫度使其熱固化。在此，以 在加壓下進行該等的第1步驟及第2步驟爲更佳。 藉由在加壓下花費充分時間（例如0.1 Μ P a、6小時）來 進行該等第1步驟（層壓步驟）及第2步驟（硬化步驟），熱活 性薄膜能夠在高壓下且被壓縮的狀態熱交聯。藉由在高溫 0 及高壓下使其黏合，即便在高溫及高壓（保壓）重複進行之 成形周期應用本發明，亦能夠抑制作爲黏合劑層之熱活性 薄膜的變形，結果，在薄板本體20與低熱傳導率構件31 的界面係非常堅固，且能夠發揮具有耐久性的黏合力。 在此，例如本發明之較佳材料係使用熱活性薄膜（tesa H AF薄膜）時，薄膜提供公司推薦的硬化溫度和硬化時間係 例如在130°C〜22CTC、1〇分鐘〜30分鐘左右的範圍內， 並說明在該等條件範圍內時能夠得到拉伸斷裂強度爲 490N/cm2〜2530N/cm2(速度：300毫米/分鐘、溫度： -16- 200936347 23 °C)左右的範圍內的物性之硬化膜。 相對地，在本發明所提案之硬化條件係至少1 3 0 °C以 上且1小時以上，以2小時以上爲佳，通常爲3小時左右。 藉此，能夠得到經充分交聯之硬化膜，結果，在本發明的 一個實施例之高溫、高壓的射出成形周期條件下，能夠確 保未產生厚度變動、耐壓力性及對樹脂的剪切力之耐剪切 力性。 (模具構件10的變形例） U 接著，在第3圖的模具構件10係具備有：金屬製的 薄板本體20，其係具備用以形成模槽的一面之模面20a; 低熱傳導率構件30,其係配設在與模面20a呈相向的面亦 即薄板本體20的背面20b ;及增強材40，其係配設在°前 述低熱傳導率構件3 0的背面。 該低熱傳導率構件30係由第1耐熱性黏著劑層32、 低熱傳導率構件層31及第2耐熱性黏著劑層33所構成， 該第1耐熱性黏著劑層3 2係由耐熱性的熱固型黏合劑所 & 構成’而該第2耐熱性黏著劑層33係由耐熱性的熱固型 〇 黏合劑所構成，該低熱傳導率構件31層係透過第1耐熱 性黏著劑層32而與薄板本體20整體化，又，該低熱傳導 率構件層31係透過第2耐熱性黏著劑層33而與配設在背 面之增強材40整體化。 在此，因爲熱固型黏合劑與金屬比較，熱傳導率顯著 地較小，所以藉由該熱固型黏合劑所形成的薄層（熱固型黏 合劑層32、33)及低熱傳導率構件層31，能夠構成低熱傳 導率構件3 0。 藉此，在該第3圖的模具構件1〇，藉由透過熱固型黏 -17- 200936347 合劑黏合低熱傳導率構件，使薄板本體20與低熱傳導率構 件30及薄板本體20與增強材40的界面整體化。 模具構件1 0係與第2圖所示的模具構件同樣地，薄 板本體20的厚度係以成爲根據熱容量等的關係之規定値 的方式設定，通常係0.3毫米以上、0.6毫米以下的範圍 內而具有極薄的特徵。 又，低熱傳導率構件30係例如由厚度1 0微米以上、 2 0 0微米以下的範圍內的低熱傳導性之第1耐熱性黏合劑 φ 層、與厚度1〇微米以上、200微米以下的範圍內的低熱傳 導層及厚度1〇微米以上、200微米以下的範圍內的低熱傳 導性之第2耐熱性黏合劑層之組合，該等的各層係整體化 後的合計厚度爲0.1毫米以上、0.3毫朵以下的範圍內而 具有極薄的特徵。 此種薄板本體1 〇係同樣地如第1圖所示，能夠在模 具1 0 0的背板5 0形成相當於薄板構件1 〇的厚度之深度程 度之刻入凹部，並在該凹部以薄板構件10的模面20a係 0 在表面側（模槽面側）的方式安裝。此種薄板本體10與第2 圖的模具構件10比較，藉由進而在背面具有增強材40, 模具構件10的處理操作變爲更加容易，重複的安裝、著脫 變爲容易。 又，增強材40係具有充分的厚度時，亦可將用以支撐 模具構件10的背面之背板50的部分省略。此種典型例係 例如與放入薄板構件1 0並使其黏合於套件模具的模槽面 時同一或均等。能夠從後述之實施例2確認，此時亦以使 用具有耐熱性的熱固型黏合劑爲佳。通常，低熱傳導率構 件由於係塑膠材料比金屬材料柔軟，因此，藉由黏合劑的 -18- 200936347 選擇，亦能夠預測在薄板本體2 0 a產生變形之情況。 在此’增強材4 0若具有增強作用時沒有特別限定，考 慮經濟性時能夠使用不鏽鋼材。 在此’雖然增強材40亦可使用與薄板本體20同一材 料’但是因爲通常構成模槽面之薄板本體20能夠使用藉由 電鍍等方法形成的鎳或鉻，或在經得起切削加工之銅、黃 銅等的材料施加鍍鉻等的電鍍而成之比較昂貴的材料。因 此’使用該等昂貴的薄板材料作爲增強材係不經濟的。特 0 別是使用在本發明所希望的大型模具構件時，必須考慮經 濟性。 但是在選擇增強材時，任意地選擇增強材時，由本發 明者在隨後的硏究，清楚 >月白在大型的模具構件，於高溫、 高壓下的黏合製造過程會有產生翹曲的課題。亦即，使用 耐熱性的熱固型黏著劑時，於高溫、高壓下進行交聯時， 在硬化結束後的放冷時，若在增強材與薄板本體之間，熱 膨脹係數的差異大時，會有在所得到的薄板構件（模具構件 ^ 10)產生翹曲之情況。200936347 VI. Description of the Invention: [Technical Field] The present invention relates to a mold member which can be used for a control member, a method for manufacturing the same, and a molding method. [Prior Art] A method in which a resin material which has been heated and fluidized is cooled in a mold to be solidified in the mold, and then a method of forming a material containing a material (including injection compression molding) is opened, which is widely spread as easily. Automated forming processing for forming, but in the usual injection molding method, a cooling solidified layer is formed on the surface of the mold-molding resin. The transfer property of the fine unevenness of the molded article is hindered, and the cold spot, the flow pattern, and the like are also caused. The present applicant has proposed (for example, an example of the problem of the injection molding method of the patent document φ. The method of molding the resin molded article is formed by a thin plate member or a mold member, the thin plate member and the low thermal conductivity member. Wherein the gold is used to form a mold surface of one side of the cavity, and the polyimine which is disposed on the back side of the thin plate body is thinly loaded with a mold of the thin plate body and is introduced into the cavity with a transfer-opening thermoplastic resin In the case of a mold surface injection molding method using a temperature lower than the transfer start temperature to produce a cavity in which the light is used in the light control member, and the mold is taken out, and the resin coated with the thermoplastic resin is used to increase the production speed or One of the methods can be used. The molten solidified layer which is melted in the groove is prevented from being formed into a fusion mark, and 1) one is disclosed to solve the problem that one side of the cavity described in Patent Document 1 is made of metal. The thin plate body of the thin plate body is provided with a thermal conductivity member composed of a film. Here, the temperature above the temperature is cooled by the mold and lowered to the nearby thermoplastic resin, and -4-200936347 is set so as to rise again to a temperature higher than the transfer start temperature to set the heat capacity of the thin plate body. With such a mold, a thermoplastic resin having a temperature s equal to or higher than the transfer start temperature can be introduced into the cavity portion of the mold held at a temperature lower than the transfer start temperature. The thermoplastic resin introduced in the cavity portion is cooled by the cavity surface of the mold and temporarily lowered to a temperature lower than the transfer start temperature. However, the mold surface is contacted by one side (die surface) of the cavity having a set heat capacity. The thermoplastic resin rises again to a temperature greater than the transfer start temperature. According to the molding method of the resin molded article, it is possible to reduce the formation of the cooling and solidifying layer on the surface of the molten resin which is injected into the cavity, and to improve the transfer property. Moreover, it is possible to reduce occurrence of fusion marks, cold spots, flow patterns, and the like. Thereby, the molding method of such a resin molded article is suitable for producing a light control member such as a light guide plate, an i mirror sheet, or the like for controlling light. According to the method for molding a resin molded article described in Patent Document 1, by exchanging a thin plate body having a different uneven pattern or a mirror pattern on the die surface, it is possible to produce a resin having a different micro shape on the surface using the same mold. The advantages of molded products. Ο However, when the resin molded article is produced for a long period of time and the sheet body is repeatedly exchanged, the surface of the resin molded article can be observed to be deformed. When the reason is bet, it is presumed that the reason may be that the polyimide film disposed or bonded to the back surface of the sheet body is wrinkled or bent. That is, the polyimide film disposed or bonded to the back surface of the sheet body may be wrinkled or buckled in the body of the exchange sheet. Here, in the thin plate main body disclosed in the patent document 1, the temperature of the thermoplastic resin contacting the die surface introduced in the cavity is temporarily lowered to the transfer start temperature or lower, but it is necessary to rise again to the transfer start temperature or higher. Mode and -5 - 200936347 The heat capacity is set to the specified capacity. Therefore, the thickness of the thin plate body is limited by the heat capacity of a predetermined capacity, and is usually thinner than 1 mm (for example, in the range of about 0.3 mm to 0.6 mm). Therefore, if the polyimine is wrinkled or bent, It has been found that it is a new problem that deformation of the molding surface of the forming surface of the thin plate body cannot be avoided. [Patent Document 1] Japanese Patent No. 3864251 (PTL 6, 8 and Paragraph No. 0038) [Problem to be Solved] [The present invention] Accordingly, an object of the present invention is to provide a mold member which is provided with A mold member in which a thin plate body that can be exchanged is produced by injection molding to produce a thin plate-shaped light control member can be stably produced even after long-term use. [Means for Solving the Problem] A mold member according to an embodiment of the present invention can be used for manufacturing a light control member by an injection molding method using a mold and capable of mounting a mold member that is detached from the mold, which is provided with a thin metal plate body having a mold surface and having a thickness of 0.2 mm or more and 0.6 mm or less; and a low thermal conductivity member which is disposed on a surface facing the mold surface and integrated with the thin plate body And having a thickness of 0.1 mm or more and 0.5 mm or less; and a reinforcing material 'which is integrally formed on the back surface of the low thermal conductivity member. [Embodiment] Hereinafter, the best mode for carrying out an embodiment of the present invention will be described. Further, for convenience of explanation, the following drawings are described by a pattern diagram in which the vertical and horizontal scales of the respective portions are arbitrarily changed. -6- 200936347 An example of a schematic diagram of a mold member of the present invention is shown in Figs. 1 to 3. Here, Fig. 1 illustrates a state in which the mold member 10 is attached to a mold. The second or third drawing illustrates the details of the mold member installed here. A mold member or a thin plate member 10 according to an embodiment of the present invention is used for manufacturing a light control member by an injection molding method using a mold, and is capable of attaching a mold member 10 that is detached from the mold, and is provided with a metal The thin plate body 20 is provided with a die surface or a cavity surface 20a and has a thickness of 0.2 mm or more and 0.6 mm or less; and a low thermal conductivity member 30 which faces the surface of the die face 20a, and The thin plate body is integrally formed and has a thickness of 0.1 mm or more and 0.5 mm or less, and the reinforcing material 40 is integrally formed on the back surface of the positional thermal conductivity member 30. Further, the mold member or the thin plate member 10 according to an embodiment of the present invention is used for manufacturing a light control member by an injection molding method using a mold and capable of mounting a mold member that is detached from the mold, and is provided with: a metal The thin plate body having a die face or a groove surface 20a and having a thickness of 0.3 mm or more and 0.6 mm or less; and a low thermal conductivity member 30 which faces the face opposite to the die face, and the thin plate The main body is integrally formed and has a thickness in a range of 0.1 mm or more and 0.3 mm or less. Here, a summary of the present invention will be described. In order to solve the above problems, the inventors of the present invention have tried to examine in detail the causes of deformation occurring on the molding surface of the thin plate main body. The problem that has been previously considered to be a problem is that when the film is placed on the back surface of the thin plate body, if the thin plate body is exchanged carefully, the size of the resin molded article can be avoided. However, in recent years, with the increase in the size of the liquid crystal display device, the 200936347 resin molded article for various light control used therein must also be large. For example, it is possible to increase the side of the side of the light guide plate, the diffusion plate, etc., which is a full range of the display surface, to more than one meter. In the manufacture of such a large-sized light control device, the polyimide film disposed on the back side is unworked, and handling becomes difficult and an increase in the need for familiarity. Further, such a problem is considered to be a new problem in the case where the molded article, that is, the resin molded article of the optical disk substrate, is 20% in diameter. According to the analysis by the inventors, it is considered that even if a film of a low thermal conductivity member is cooperating, a history, a pressure history, or the like, or a part of the adhesive is a usual case, even if the adhesion to the metal is used due to The thermal experience and the pressure holding experience of the forming cycle of about two seconds are expected to cause the above-mentioned heavy elongation, or the linear expansion coefficient of the thin plate body and the adhesive linear expansion agent A and the low thermal conductivity member to produce an unexpected peeling. Therefore, the inventors of the present invention have not known that the adhesion can be peeled off, and it is considered that in order to solve the problem, the thin plate body and the back surface are disposed on the back side. The thin plate body and the low thermal conductivity are configured to be integrated with a thermosetting type of conductivity-resistant member on the back surface of the thin plate body, or a reinforcing material is disposed on the thin plate body rate member to be expected to be damaged in the liquid crystal display device. The glare control member produces a long-term resin molded product, which is embossed or buckled, and becomes a new important class. The resin system of about 30 cm is not taken seriously, but is adhered to the forming on the back side of the thin plate body. The cycle heat is stripped. That is, the well-adhesive agent can be used to reflect the difference in the coefficient of the adhesive or the difference in the adhesion of the adhesive at a high temperature. As a result, some of the components must be completely covered by the most important thermal conductivity member. The above-mentioned problem can be solved by a method of integrating the heat-sensitive adhesive to make the low-heat back surface pass through a low-heat-conducting low-heat conductivity member-made structure of -8-200936347. Here, the inventors have found that a thin plate body and a low thermal conductivity member are integrated by using a binder, and the adhesive used is maintained to maintain heat resistance, pressure resistance, shear resistance, and heat deterioration resistance (thermal decomposition). Various characteristics such as foaming, foaming, etc. are important. That is, the heat resistance must be able to withstand the resin temperature which is filled at a high temperature in the injection molding conditions without causing thermal decomposition, foaming or the like. Further, the pressure resistance property must be able to withstand the high holding pressure of the high transfer property Φ for maintaining the fine unevenness. Further, the shear resistance is required to withstand the repeated heat history of the high temperature and normal temperature in the molding cycle in which the injection molding is formed. When the low thermal conductivity member satisfying any of the above conditions is disposed on the back surface of the thin plate main body, it is possible to prevent thermal decomposition or foaming of the low thermal conductivity member, and to prevent deformation of the thin plate main body by preventing partial peeling or the like. That is, an embodiment of the present invention may be a mold member characterized by ejecting a heated fluidized resin material into a cavity in a mold, and maintaining a high pressure inside the mold to cool or solidify or After hardening, the mold member used in the production of the light control member by the injection molding method in which the resin molded article which has been formed into a thin plate shape is taken out is opened, and the light control member is relatively large in the shape of two sheets. At least one surface of the surface is used as an emitting surface for emitting light, and the mold member includes at least a metal thin plate main body having a mold surface having a thickness of 0.2 mm or more and 0.6 mm for forming a cavity. In the following range, it is preferably in a range of 0.3 mm or more and 0.6 mm or less; and a low thermal conductivity member is disposed on a surface facing the mold surface, that is, a back surface of the thin plate main body, and has a thickness of In the range of 0.1 mm or more and 0.5 mm or less, preferably 0.1 mm or more and 0.3 mm or less, the former -9-200936347 describes the thin plate body and the aforementioned low heat Based interface conductivity member is integrated, and can be mounted off the surface of the cavity as the mold. When the thin plate main body and the low thermal conductivity member are integrated by using a thermosetting heat-resistant adhesive, peeling of the low thermal conductivity member can be further suppressed. Here, the heat resistant adhesive is preferably one which does not form hardened by-products. Further, when the reinforcing member is integrated on the back surface of the low thermal conductivity member, even if a part of the low thermal conductivity member is peeled off, the thin plate body is not deformed. Further, such a reinforcing material can improve the operability of the thin plate member, and can facilitate the attachment and detachment of the thin plate main body on the cavity surface of the mold. In the preferred mold member of the present invention, the low thermal conductivity member has a first heat-resistant adhesive layer having a low thermal conductivity in a range of 10 μm or more and 200 μm or less; and a thickness of 1 μm or more and 200 μm or less; a low heat conduction layer in the range of the first heat resistant layer; and a second heat resistant adhesive layer having a low thermal conductivity in a range of 1 μm or more and 200 μm or less. Ο 'The mold member made of the above-mentioned reinforcing material, although the thin plate body and the reinforcing material are not warped if they are the same material, but when different materials are selected, the difference in linear expansion coefficient between each other can be reduced, and By making the thickness of the reinforcing material a necessary minimum thickness, it is possible to reduce the warpage caused by the temperature difference generated during the forming cycle. Such a mold can be produced, for example, by using a heat-resistant adhesive layer (a first heat-resistant adhesive layer, the second heat-resistant adhesive layer) and a low heat-conductive layer as a film. For example, when the interface between the thin plate body and the low thermal conductivity member is integrated by using a film-like adhesive as a thermosetting heat-resistant adhesive, the entire -10-200936347 physicalizing step can be performed by including the first step and The second step is to form a preferred mold member for use in the present invention by integrating the thin plate body and the low thermal conductive film, wherein the first step is to heat the thin plate body and the low heat conductive layer. The film is laminated, and the second step is thermally cured at a higher temperature than the first step. By adopting such a condition, it is possible to provide a mold member which has a sufficient degree of crosslinking and which has hardness and pressure resistance which do not cause thickness variation and shear resistance of the resin against shear. By this, even if it is repeatedly used under severe conditions of φ in the molding cycle (heating from the molten resin of a high temperature used for injection molding), decomposition does not occur at the bonded portion, and sufficient heat deterioration resistance can be ensured. Here, the lamination conditions or the curing conditions can be appropriately determined in consideration of the resin material to be used, the manufacturing equipment, and the like. When the mold having the above-described mold member is used, the mold member introduces a thermoplastic resin having a temperature equal to or higher than the transfer start temperature to a cavity portion formed by a mold held at a temperature lower than the transfer start temperature. Further, the thermoplastic resin having a temperature near the transfer start temperature which is cooled by the mold and lowered to a temperature lower than the transfer start temperature is raised to a temperature higher than the transfer start temperature after the thermoplastic resin is charged to the cavity portion ❹. The heat capacity of the surface portion on the side of the cavity portion is set. Therefore, when such a mold is used and at least one of the two faces that are relatively opposed to the sheet shape is used as the emitting surface of the emitted light to form the light control member, the light control can be stably manufactured even after long-term use. member. Further, since the mold members can be exchanged, it is possible to manufacture a small number of multi-brand light control members when preparing a plurality of mold members having irregular patterns of different mold faces. The light control member formed in this manner can be exemplified by a light guide plate, a lens sheet, a light diffusion plate, and the like. On the one surface of the light control member, a fine concavo-convex pattern of micro-11-200936347 is formed, and the fine concavo-convex pattern reproduces the uneven surface imprinted on the surface of the mold member. The mold member 1A shown in Fig. 2 includes a metal thin plate main body 20 having a mold surface 20a that forms one side of the cavity, and a low thermal conductivity member 30 that is disposed in the mold. The face 20a is in the opposite direction, that is, the back surface 20b of the thin plate body 20. The low thermal conductivity member 30 is composed of a first heat resistant adhesive layer 32 and a low thermal conductivity member layer 31, wherein the first heat resistant adhesive layer 32 is made of a heat resistant thermosetting adhesive. The structure of the φ is formed, and the low thermal conductivity member layer 31 is integrated with the thin plate main body 20 through the heat resistant adhesive layer 3 2 . In the mold member 10 of one embodiment of the present invention, the respective thicknesses of the thin plate main body 20 and the low thermal conductivity member 30 are set so as to be defined in accordance with the relationship between the heat capacity and the like. The thickness of the thin plate main body 20 is extremely thin, and is preferably in the range of 0.2 mm or more and 0.6 mm or less, and preferably 0.3 mm or more and 0.6 mm or less. On the other hand, the thickness of the low thermal conductivity member 30 is not particularly limited in the range in which the heat can be insulated, and when the thickness is too thin, the heat insulating property is insufficient, and 'there is a necessity to increase the molding cycle'. On the other hand, if the thickness is unnecessarily It is difficult to manufacture when it is too thick, and it is difficult to stably manufacture the light control member during the severe molding cycle. Usually, the thickness is preferably in a range that can ensure sufficient heat insulation, and is preferably in a range of from 0.1 mm to 0.5 mm, and is more than 1 mm to less than 0.3 mm. The range is set to be excellent, and it has extremely thin features similarly to the thin plate body. The low thermal conductivity member 30 is a thickness of 10 μm or more, for example, when the first heat-resistant adhesive layer 32 and the low thermal conductivity member layer 31 are formed as shown in Fig. 2, for example, the thickness is 10 μm or more. A combination of a first heat-resistant adhesive layer having a low thermal conductivity in a range of 200 μm or less and a low heat-conductive layer having a thickness of 1 μm or more and 200 μm or less. In this case, the total thickness of the first heat-resistant adhesive layer and the low thermal conductivity member layer 31 after being integrated is 0.1 mm or more and 03 mm or less, and has an extremely thin characteristic. The thermosetting adhesive used in one embodiment of the present invention belongs to a resin-based material, and the thermal conductivity is remarkably small as compared with the metallic material. 0 Thus, the thin layer (thermosetting adhesive layer 32) formed by the thermosetting adhesive conforms to the low thermal conductivity member defined in one embodiment of the present invention. Thus, as shown in Fig. 2, the low thermal conductivity member 30 is composed of a thermosetting adhesive layer 32 and a low heat grading member layer 31. Here, the low thermal conductivity member used in one embodiment of the present invention is excellent in heat resistance and pressure resistance, although a general plastic material can be widely used. Such a material can be exemplified by the fact that, for example, a polyimide or a polyimide having a sufficient thickness and durability can be used to form a low thermal conductivity member using only the 0 thermosetting adhesive itself. However, it is difficult to obtain a thickness which is capable of ensuring a good degree of adhesion and heat resistance, and a degree of heat insulation can be ensured from a single material, and the heat-resistant film is passed through a thermosetting adhesive to be integrated with the thin plate body. The composition of Fig. 2 is better. As shown in Fig. 1, the thin plate member 10 is formed in the back plate 50 of the mold 1 to form a recess portion corresponding to the depth of the thickness of the thin plate member 10, and the mold surface of the thin plate member 10 is formed in the concave portion. 20a is attached to the surface side (the side of the cavity surface). The attachment of the thin plate member 10' to the recess portion is not particularly limited as long as it can be removed (off). In simple case, if the adhesion or the adhesion can be maintained on the surface of the concave portion, it can be attached. Further, the configuration may be such that it is attached and detached by a fitting structure. In the thin plate member 10, since the low thermal conductivity member 30 and the thin plate main body 20 are integrated, the handling operation when the mold member 10 is mounted on the back plate 50 becomes easy, and after a long molding cycle There is also no surface deformation of the molded article. Next, the reason why the low thermal conductivity member 30 and the thin plate body 20 are integrated by the transmission of the thermosetting adhesive can be explained, and the reason why the molded article is deformed can be eliminated. Although the details of the reason why the thermosetting binder is particularly excellent in the low thermal conductivity member 30 and the thin plate body 20 are integrated, the inventors of the present invention have the following assumptions. That is, since heat resistance is generally required, a member having a low thermal conductivity member is preferably a polyimide-based member. However, a plastic material such as polyimide has a significantly larger coefficient of linear expansion than a metal material constituting a thin plate body. Therefore, when a polyimide film is bonded to a thin plate body by a usual adhesive or the like, the polyimide film is deviated due to a difference in thermal (linear) expansion coefficient and it is difficult to withstand repeated molding cycles. In addition, it is difficult to ensure that the thin layer of the heat-resistant film material such as polyimide or polyamidoximine is applied to the back surface of the thin plate main body in an unhardened form by a coating method or the like. The degree of thermal insulation that can be ensured by the molding conditions employed in the invention. That is, it is difficult to ensure the necessary thickness by the coating method. Moreover, when a polyimide film or a polyimide film is bonded by using a usual heat-resistant adhesive, since the thermal expansion coefficient of the adhesive and the metal thin plate material are different, a part of the long-term use cannot be avoided. Peeling -1436347 away. Although the cause of the peeling is unknown, according to the inventors' careful observation, it is also possible to indicate that the generation of a very small amount of gas (decomposed matter) generated from the binder is a cause. In contrast, when a heat-resistant thermosetting adhesive is used as the binder, by setting a sufficient heating temperature and heating time as the curing conditions, it is possible to bond a very small amount of gas without causing a small amount of gas, which is supposed to be equivalent. It helps to eliminate the cause of deformation of the molded article. In the present invention, a heat-resistant adhesive which is preferably heat-resistant is, for example, a heat-resistant adhesive (for example, a nitrile rubber) and a heat-curable adhesive having a strong adhesive strength as a structural adhesive or the like (for example, , a mixture of phenolic resin). The heat-resistant adhesive which is excellent in the heat resistance of the heat-resistant rubber material can significantly change its adhesive properties. In particular, since the nitrile rubber has a highly polar CN group in the molecule, it can impart high peel strength and toughness. Thereby, the shear resistance can be imparted to the thermosetting adhesive. The binder may be, for example, a phenol-based dehydration condensation-based adhesive or a mixture of a quinone-based, phenol-based or acryl-based resin, or such a self-crosslinking adhesive or an addition reactive adhesive may be used. Agent. An example of such a preferred adhesive is a heat active film (trade name tesa HAF) supplied by TESA. The tesa HAF (thermically active film) is made of a nitrile rubber and a phenol resin as a main raw material, and is provided in the form of a film which is protected by a release paper on both sides. By peeling off the double-sided release paper, it is temporarily adhered to other sheet materials because of its light adhesion. Further, the thermally active film is softened at a low temperature of, for example, about 80 ° C to 100 ° C to exhibit thermally reversible adhesion. Also, when the temperature is higher than 1 2 0 r, for example, in the range of about 120 ° C to 220 ° C, the cross-linking by dehydration -15-200936347 by irreversible chemical reaction enables strong adhesion. force. That is, by dehydration crosslinking of the rubber component and the strong binder component, it is possible to exhibit high strength and toughness and high strength. Further, the crosslinking reaction is irreversible, and it can be crosslinked under high pressure by a sufficient curing temperature and a curing time, and can exhibit heat resistance of 150 ° C or more and 1 2 N / mm 2 or more. High adhesion strength and very good oozing characteristics. With the excellent osmotic characteristics, the molding cycle conditions of the present invention do not substantially cause volatile components.较佳 Here, a preferred condition for producing the mold member of the present invention is to bond the thin plate body 20 to the low thermal conductive film via at least two steps of the first step and the second step, wherein the first step is at a low temperature. The thin plate main body 20 is laminated with a heat resistant film as the low heat conductive layer 31, and the second step is thermally cured at a higher temperature than the first step. Here, it is more preferable to carry out the first step and the second step, which are carried out under pressure. By performing the first step (lamination step) and the second step (hardening step) under a sufficient time (for example, 0.1 Μ P a, 6 hours) under pressure, the thermally active film can be compressed under high pressure. The state is thermally crosslinked. By applying the present invention at a high temperature and a high pressure, even if the present invention is applied to a molding cycle in which the high temperature and the high pressure (holding pressure) are repeated, deformation of the thermally active film as the adhesive layer can be suppressed, and as a result, the thin plate body 20 is The interface with the low thermal conductivity member 31 is very strong and can exert a durable adhesive force. Here, for example, when a preferred material of the present invention is a thermally active film (tesa H AF film), the film provides the company's recommended hardening temperature and hardening time, for example, at 130 ° C to 22 CTC, for about 1 minute to 30 minutes. In the range, it is explained that physical properties in the range of about 490 N/cm 2 to 2530 N/cm 2 (speed: 300 mm/min, temperature: -16 to 200936347 23 ° C) can be obtained within the range of these conditions. Hardened film. On the other hand, the curing conditions proposed in the present invention are at least 130 ° C or more and 1 hour or longer, preferably 2 hours or longer, and usually about 3 hours. Thereby, a cured film which is sufficiently crosslinked can be obtained, and as a result, under the conditions of high temperature and high pressure injection molding cycle of one embodiment of the present invention, thickness variation, pressure resistance, and shearing force to the resin can be ensured. Shear resistance. (Modification of Mold Member 10) U Next, the mold member 10 of Fig. 3 is provided with a thin metal plate body 20 having a mold face 20a for forming one side of a cavity; and a low thermal conductivity member 30. The back surface 20b of the thin plate main body 20, which is a surface facing the die surface 20a, and the reinforcing material 40 are disposed on the back surface of the low thermal conductivity member 30. The low thermal conductivity member 30 is composed of a first heat resistant adhesive layer 32, a low thermal conductivity member layer 31, and a second heat resistant adhesive layer 33, and the first heat resistant adhesive layer 32 is made of heat resistant. The thermosetting adhesive layer is composed of a heat-resistant thermosetting adhesive layer 33, and the low thermal conductivity member 31 is transmitted through the first heat-resistant adhesive layer. 32 is integrated with the thin plate main body 20, and the low thermal conductivity member layer 31 is transmitted through the second heat resistant adhesive layer 33 to be integrated with the reinforcing material 40 disposed on the back surface. Here, since the thermosetting adhesive is significantly smaller in thermal conductivity than the metal, the thin layer (the thermosetting adhesive layer 32, 33) and the low thermal conductivity member formed by the thermosetting adhesive are formed. Layer 31 can constitute a low thermal conductivity member 30. Thereby, in the mold member 1A of FIG. 3, the thin plate body 20 and the low thermal conductivity member 30 and the thin plate body 20 and the reinforcing member 40 are bonded by a low heat conductivity member through a thermosetting adhesive -17-200936347 mixture. The interface is integrated. In the same manner as the mold member shown in FIG. 2, the thickness of the thin plate main body 20 is set so as to be in accordance with the relationship between the heat capacity and the like, and is usually in the range of 0.3 mm or more and 0.6 mm or less. Has a very thin feature. Further, the low thermal conductivity member 30 is, for example, a first heat-resistant adhesive φ layer having a low thermal conductivity in a range of 10 μm or more and 200 μm or less, and a thickness of 1 μm or more and 200 μm or less. The combination of the low heat conduction layer and the second heat resistant adhesive layer having a low thermal conductivity in the range of 1 μm or more and 200 μm or less, and the total thickness of each of the layers after integration is 0.1 mm or more and 0.3 It has extremely thin features within a range of less than one millimeter. Similarly, as shown in Fig. 1, the thin plate main body 1 can be formed into a concave portion at a depth corresponding to the thickness of the thin plate member 1 背 at the back plate 50 of the mold 100, and a thin plate is formed in the concave portion. The die face 20a of the member 10 is attached to the surface side (the side of the die face). Compared with the mold member 10 of Fig. 2, the thin plate main body 10 has a reinforcing member 40 on the back surface, and the processing operation of the mold member 10 becomes easier, and repeated mounting and detachment become easy. Further, when the reinforcing member 40 has a sufficient thickness, the portion of the backing plate 50 for supporting the back surface of the mold member 10 may be omitted. Such a typical example is, for example, the same or equal to when the sheet member 10 is placed and bonded to the cavity surface of the kit mold. It can be confirmed from Example 2 which will be described later, and in this case, it is preferred to use a heat-resistant adhesive having heat resistance. Generally, since the low thermal conductivity member is softer than the metal material, the deformation of the thin plate body 20 a can also be predicted by the selection of the adhesive -18-200936347. Here, the reinforcing material 40 is not particularly limited as long as it has an reinforcing action, and a stainless steel material can be used in consideration of economy. Here, although the reinforcing material 40 can also use the same material as the thin plate body 20, but since the thin plate body 20 which normally constitutes the cavity surface can use nickel or chromium formed by plating or the like, or copper which can withstand cutting processing A material such as brass is a relatively expensive material which is plated by chrome plating or the like. Therefore, it is uneconomical to use such expensive sheet materials as reinforcing materials. In particular, when using a large mold member desired in the present invention, economics must be considered. However, when the reinforcing material is selected arbitrarily, the inventors of the present invention will be aware of the problem that warpage may occur in the bonding process of a large mold member under high temperature and high pressure. . That is, when a heat-resistant thermosetting adhesive is used, when crosslinking is performed at a high temperature and a high pressure, when the cooling is completed after the completion of the hardening, if the difference in thermal expansion coefficient between the reinforcing material and the thin plate body is large, There is a case where warpage occurs in the obtained thin plate member (mold member ^ 10).
G 例如，從在線膨脹係數爲13x1 0_6/°C的鎳製的薄板本 體（厚度爲0.3毫米）的背面，透過TESA公司製的熱活性 薄膜作爲低熱傳導率構件且使用線膨脹係數爲 17.2χ 10_6/°C的SUS304的薄板（厚度爲0.3毫米）作爲增強材時 之實驗，能夠實際地觀測到翹曲。在此，熱活性薄膜的交 聯反應係從1 0 6 °C附近開始且最後係在1 5 (TC附近的高溫 結束時，在交聯反應後進行放置並冷卻，能夠確認起因於 鎳與不鏽鋼的線膨脹係數差異而在模面20a產生之凸起翹 曲。 -19- 200936347 亦即，將鎳作爲薄板材料而以線膨脹係數不同的 製造模具構件時之翹曲，例如即便薄板本體係2 8 0 > 200毫米左右之較小的材料，亦如表1所示。 [表1] 構件 線膨脹係數 結果 (xl〇-6/°C ) 鐵板 12 凹翹曲（-1.3毫米） NSSC450MS 12.1 凹翹曲（-2.0毫米） Ni 13 - NSSC270 14 凸翹曲（+ 1.4毫米} SUS304 H 17.2 凸翹曲（ + 3.5毫米）G For example, from the back side of a nickel-made thin plate body (thickness: 0.3 mm) having an in-line expansion coefficient of 13x1 0_6/° C., a thermally active film made of TESA is used as a low thermal conductivity member and a linear expansion coefficient of 17.2 χ 10_6 is used. When the thin plate of SUS304 (thickness: 0.3 mm) of /C is used as a reinforcing material, warpage can be actually observed. Here, the crosslinking reaction of the thermally active film starts from around 10 6 ° C and finally at 15 (at the end of the high temperature near TC, it is placed and cooled after the crosslinking reaction, and it can be confirmed that it is caused by nickel and stainless steel. The difference in the coefficient of linear expansion and the warpage generated in the die face 20a. -19- 200936347 That is, when nickel is used as a thin plate material, the warpage is made when the mold member is manufactured with different linear expansion coefficients, for example, even the thin plate system 2 8 0 > The smaller material of about 200 mm is also shown in Table 1. [Table 1] Component linear expansion coefficient result (xl〇-6/°C) Iron plate 12 concave warp (-1.3 mm) NSSC450MS 12.1 Concave warp (-2.0 mm) Ni 13 - NSSC270 14 warp warp (+ 1.4 mm) SUS304 H 17.2 warp warp (+ 3.5 mm)
在此，雖然以不會產生此種翹曲爲佳，但是例如藉由 後述的實施例能夠證實，若增強材的厚度充分薄時，在本 發明之保壓條件下，若翹曲係在此程度的範圍內時，能夠 製造充分地符合規格之成形品。 此種增強材的厚度沒有特別限定，通常係〇 . 5毫米以 上時能夠發揮補強效果，認爲例如從經實證之後述的實施 例所選擇之2.5毫米的SUS不鏽鋼，至3毫米左右。亦即， 因爲藉由背板支撐背面，模具構件10之較少的翹曲能夠藉 由成形周期的保壓而實質地減輕，能夠形成外觀良好的成 形品。Here, although it is preferable that such warpage does not occur, it can be confirmed, for example, by the examples described later that when the thickness of the reinforcing material is sufficiently thin, under the pressure holding condition of the present invention, warpage is performed here. When it is within the range of the degree, it is possible to manufacture a molded article that satisfies the specifications sufficiently. The thickness of such a reinforcing material is not particularly limited, and it is usually 〇. When the thickness is 5 mm or more, the reinforcing effect can be exerted, and it is considered to be, for example, about 2.5 mm of SUS stainless steel selected from the examples described later, to about 3 mm. That is, since the back surface is supported by the backing plate, less warpage of the mold member 10 can be substantially reduced by the holding pressure of the forming cycle, and a molded article having a good appearance can be formed.
較佳增強材係與薄板本體的材料之線膨脹係數差異爲 ±6(xlO-6/°C)的範圍內’以±3(xl〇-6/°c)的範圍內爲更佳。 此種與鎳的線膨脹係數差異較小的材料，例如可例示N S S C -20- 200936347 系的不鏽鋼（特別是肥粒鐵（ferrite)系列），但是未限定 等。 薄板本體與低熱傳導率構件的接合方法及接合條 低熱傳導率構件與增強材的接合方法及接合條件，因 第2圖所示之模具構件的製造條件均等或相同，省略 細的說明。 接著’將以上說明的模具100安裝在射出成形機 用。藉由該射出成形法能夠製造成形爲薄膜狀之光控 ❹件。 此種光控制構件係包含薄片狀形態、薄膜狀形態 薄板狀的樹脂成形品，構成薄板狀的樹脂成形品之互 I) 向2個較大的面（以下，將該面稱爲主面）的至少一面 利用作爲將光線射出之射出面。 此種光控制構件係入射光從控制構件的主面或側 的至少一面入射入射光。所入射的光線於光控制構件 部，係隨著在與平面方向及/或平面交叉的方向（包含 ❹ 方向）折射或反射而被傳播。在該折射或反射過程，入 光線之進行方向被控制而從至少一方的主面射出。在 光控制構件，在二個主面的至少一方，被賦予用以控 光光線的方向之微細的凹凸面。在另外的主面亦可以 同樣或不同形態的凹凸面，亦可以是平滑面。又，藉 在本發明的一個實施例的模具構件的模面2 0a，係| 應於該光控制構件的微細凹凸面之凹凸面或鏡面。 入射面爲側面之光控制構件的一個例子係導光枝 導光板係使用於液晶等的顯示裝置之側端面型的背3 件。側端面型的背光，係將導光板之厚度較薄的一端 於該 件或 爲與 其詳 而利 制構 等之 相相 爲被 面等 的內 垂直 射的 此種 制射 具有 此， 備對 :，該 ;之組 面（一 -21- 200936347 側面）作爲入射端面而入射光線。入射到導光板之光線係朝 向與入射端面相向的側面（另一端面），邊反射及/或折射邊 在2個主面間進行。在該傳播過程所入射的光線係以一方 的主面作爲射出面而射出，而能夠利用作爲液晶顯示裝置 的背光。 又，入射面爲主面之光控制構件的一個例子係作爲液 晶顯示裝置的組件之擴散板。該擴散板係光線從薄板形狀 之互相相向較大的面之一方的主面入射。入射的光線係朝 Q 向與入射面（一方的主面）相向的主面（另一方的主面）進 行，並從另一方的主面射出。在該入射及射出的過程，入 射的光線藉由擴散板的作用效果，光線被擴散。亦即，在 光透射擴散板之過程光線的方向被擴散。 此種光控制構件的具體例除了使用於上述的液晶顯示 裝置之導光板或擴散板以外，不只是在其他目的所使用的 導光板、擴散板，亦可以是將光線朝特定方向射出之稜鏡 薄片、菲湼耳透鏡、雙凸型透鏡等的透鏡薄片。任一種情 φ 況均是射出光線之射出面爲主面，本發明的一個實施例之 光控制構件（射出成形品）係在至少一方的主面被賦予微細 的凹凸。 近年來，對應液晶顯示裝置或電漿電視等的大型化， 在此所使用的導光板、擴散板、稜鏡薄片等的各種光控制 構件，被要求係無縫的大型整體成形品。此種大型整體成 形品其大型係遠大於光碟等的直徑，例如一邊長度爲大於 50公分，特別是以對應長邊爲大於80公分的顯示畫面之 大型成形品爲佳。此種光控制構件與光碟等比較，具有每 一種品牌的生產量少之特徵。因此，必須麻煩地進行交換 -22- 200936347 * 模具。 在此，本發明的一個實施例的模具構件，因爲具有非 常良好的處理性，即便此種麻類的品牌交換亦應夠對應， 具有能夠應用在大型的成形品之特徵。而且，當然在製造 小型的成形品時，亦可使用本發明的模具構件。 藉由使用此種模具並依照專利文獻1所記載之射出成 形法，能夠成形成光控制構件。 亦即’此種模具係將具有轉印開始溫度以上的溫度之 0 熱塑性樹脂導入至由保持於轉印開始溫度以下的溫度的模 具所構成之模槽部，該被模具冷卻而下降至轉印開始溫度 以下的溫度之模具表面附近的熱塑性樹脂，係以在將熱塑 性樹脂塡充至模槽部後，再次上升至大於轉印開始溫度的 溫度之方式設定模槽部側的表面部分的熱容量。 藉此，藉由準備複數個凹凸花紋不同之模面20a的模 具構件1 0 ’即便麻煩的品牌交換時，亦能夠迅速且適當地 對應。 0 亦即’欲成形導光板時，該導光板若是在表面具有凹 凸圖案’則在構成薄板構件的模槽部之模面2 0 a，係設計 有與在導光板的表面應形成的凹凸圖案相反的凹凸。又， 欲成形之導光板係在表面具有壓紋加工者，係在構成薄板 構件的模槽部之模面2 0 a施加壓紋加工。而且，若成形的 導光板係被印刷有點狀等的圖案時，薄板構件模面20a係 維持鏡面（平面）。 若應成形的導光板係在表背的兩面具有凹凸圖案或壓 紋加工者時，將薄板構件設置在模具的模槽之兩面而成形 即可。若凹凸圖案或壓紋加工只有在導光板的—面時，可 -23- 200936347 以將薄板構件設置在模槽的一面（具有凹凸圖案或壓紋加 工之面），而另外一面維持鏡面。但是亦可以將薄板構件設 置在兩面（此時，一側的薄板構件的表面係鏡面）。 又，依照本發明的一個實施例，即使在成形透鏡薄片 之情形下，亦可安裝具備適合透鏡薄片的模面20a之模具 構件。 任一種情形均能夠提升轉印性，能夠減少熔合痕、樹 脂冷斑、流紋等的產生。 0 又，在本發明的方法所使用的熱塑性樹脂沒有特別限 制，可舉出例如聚甲基丙烯酸甲酯、聚碳酸酯、聚苯乙烯、 聚丙烯、聚對酞酸乙二酯、聚氯乙烯、熱塑性彈性體或該 等的共聚物等。 ° 接著，對於依照本發明的樹脂成形品之成形方法，能 夠提升轉印性，能夠減少產生溶合痕、樹脂冷斑、流紋等 的理由，摘錄、歸納專利文獻1的一部分而說明，詳細請 參照專利文獻 1。在此，樹脂係使用聚甲基丙烯酸甲酯樹 A 脂（101尺八尺八丫股份公司製、商品名PARAPET HR- 1000LC) p 時且使用marc(marc公司製）的非穩定熱傳導解析之模 擬結果作爲一個例子來說明。 從所使用的聚甲基丙烯酸甲酯樹脂的溫度與縱彈性模 數（彎曲模式）的關係之測定結果（第4圖），求取儲藏彈性模 數的溫度依存性。曲線圖的傾斜度重大變化的溫度係本說 明書所稱之轉印開始溫度°該轉印開始溫度能夠從相轉變 區域的曲線圖之切線與膠狀的平坦區域之曲線圖的交點求 得，從該第4圖所求得之轉印開始溫度爲128 °C。 接著，在模擬所採用的射出成形裝置（模具 100)、光 -24- 200936347 控制構件亦即成形品60及成形條件的主要規格如下（參照 第5圖）。It is more preferable that the linear expansion coefficient of the material of the preferred reinforcing material and the sheet body is within a range of ±6 (xlO-6/°C) in the range of ±3 (xl〇-6/°c). Such a material having a small difference in coefficient of linear expansion from nickel may, for example, be a stainless steel (particularly a ferrite series) of N S S C -20-200936347, but is not limited thereto. Method of joining thin plate main body and low thermal conductivity member and joining strip The joining method and joining conditions of the low thermal conductivity member and the reinforcing material are the same or the same as the manufacturing conditions of the mold member shown in Fig. 2, and a detailed description thereof will be omitted. Next, the mold 100 described above is mounted on an injection molding machine. The optical control member formed into a film shape can be produced by the injection molding method. Such a light control member includes a resin molded article in a sheet-like form or a film-like form, and the mutual shape of the resin molded article in the form of a thin plate is made to two large faces (hereinafter, the face is referred to as a main face). At least one side is utilized as an exit surface for emitting light. Such a light control member is incident light incident on at least one side of the main surface or side of the control member. The incident light is propagated in the light control member portion as it is refracted or reflected in a direction intersecting the plane direction and/or the plane (including the ❹ direction). In the refraction or reflection process, the direction in which the incoming light is directed is controlled to be emitted from at least one of the main faces. In the light control member, at least one of the two main faces is provided with a fine uneven surface for controlling the direction of the light. On the other main surface, the same or different irregularities may be used, or a smooth surface may be used. Further, the mold surface 20a of the mold member according to the embodiment of the present invention is applied to the uneven surface or the mirror surface of the fine uneven surface of the light control member. An example of a light control member whose side surface is a side surface is a light guide light guide plate which is used for a back side type of a side end type of a display device such as a liquid crystal. The backlight of the side end type has such a thinner end of the light guide plate that the surface of the light guide plate is thinner than that of the surface or the like. , the face of the group (one side of the 21-200936347) enters the light as the incident end face. The light incident on the light guide plate faces the side surface (the other end surface) facing the incident end surface, and the side reflection and/or the refracting edge are performed between the two main faces. The light incident on the propagation process is emitted by using one main surface as an emission surface, and a backlight as a liquid crystal display device can be used. Further, an example of the light control member whose incident surface is the main surface is a diffusion plate which is a component of the liquid crystal display device. The diffusing plate is incident on the main surface of one of the faces of the thin plate which face each other. The incident light is emitted toward the main surface (the other main surface) facing the incident surface (one main surface) in the Q direction, and is emitted from the other main surface. During the incident and outgoing processes, the incident light is diffused by the action of the diffusing plate. That is, the direction of the light is diffused during the transmission of the light through the diffusing plate. Specific examples of such a light control member may be used not only for the light guide plate or the diffusion plate of the liquid crystal display device described above, but also for the light guide plate or the diffusion plate used for other purposes, or the light may be emitted in a specific direction. A lens sheet such as a sheet, a Fresnel lens, or a lenticular lens. In any case, the light-emitting surface of the light-emitting member (the injection-molded article) of the embodiment of the present invention is provided with fine irregularities on at least one of the main surfaces. In recent years, in order to increase the size of liquid crystal display devices, plasma TVs, and the like, various light control members such as a light guide plate, a diffusion plate, and a ruthenium sheet used here are required to be seamless large-sized integrally molded articles. Such a large-sized integrally formed product is much larger than the diameter of a disc or the like, and for example, a side having a length of more than 50 cm, particularly a large molded article having a display screen having a long side of more than 80 cm is preferable. Such a light control member has a feature that the production amount of each brand is small compared with a compact disc or the like. Therefore, it must be troublesome to exchange -22- 200936347 * mold. Here, the mold member of one embodiment of the present invention has a very good handleability, and even if such a type of hemp is exchanged, it has a feature that can be applied to a large-sized molded article. Further, of course, the mold member of the present invention can also be used in the production of a small molded article. The light control member can be formed by using the mold according to the injection molding method described in Patent Document 1. That is, the mold is a mold portion in which a thermoplastic resin having a temperature higher than the transfer start temperature is introduced into a mold formed by a mold held at a temperature lower than the transfer start temperature, and the mold is cooled to be transferred to the transfer. The thermoplastic resin in the vicinity of the surface of the mold at a temperature lower than the temperature is set to a heat capacity of the surface portion on the side of the cavity portion so as to be raised to a temperature higher than the transfer start temperature after the thermoplastic resin is filled into the cavity portion. As a result, it is possible to quickly and appropriately respond to the mold member 10' of a plurality of mold faces 20a having a plurality of embossed patterns, even when troublesome brand exchange is performed. 0, that is, when the light guide plate is to be formed, if the light guide plate has a concave-convex pattern on the surface, the mold surface 20 a of the cavity portion constituting the thin plate member is designed to have a concave-convex pattern to be formed on the surface of the light guide plate. The opposite bump. Further, the light guide plate to be formed is embossed on the surface, and embossing is applied to the mold surface 20 a of the cavity portion constituting the thin plate member. Further, when the formed light guide plate is printed with a pattern such as a dot shape, the thin plate member mold surface 20a maintains a mirror surface (planar surface). When the light guide plate to be formed has a concave-convex pattern or a embossing machine on both sides of the front and back, the thin plate member may be formed on both sides of the cavity of the mold. If the concave-convex pattern or embossing is only on the surface of the light guide plate, -23-200936347 may be used to place the thin plate member on one side of the cavity (having a concave-convex pattern or an embossed surface) while maintaining the mirror surface on the other side. However, it is also possible to arrange the thin plate members on both sides (in this case, the surface of the thin plate member on one side is a mirror surface). Further, according to an embodiment of the present invention, a mold member having a die face 20a suitable for a lens sheet can be attached even in the case of forming a lens sheet. In either case, the transfer property can be improved, and the occurrence of fusion marks, cold spots of the resin, flow lines, and the like can be reduced. Further, the thermoplastic resin used in the method of the present invention is not particularly limited, and examples thereof include polymethyl methacrylate, polycarbonate, polystyrene, polypropylene, polyethylene terephthalate, and polyvinyl chloride. , thermoplastic elastomers or copolymers of these. In the method of forming a resin molded article according to the present invention, the transfer property can be improved, and the cause of occurrence of a melt mark, a resin cold spot, a flow pattern, and the like can be reduced, and a part of Patent Document 1 can be extracted and summarized. Please refer to Patent Document 1. Here, the resin is a simulation of the unsteady heat conduction analysis using a polymethyl methacrylate tree A grease (manufactured by the company, PARAPET HR-1000LC, manufactured by 101-foot-eight-foot yam Co., Ltd.) and using marc (manufactured by Marc). The result is illustrated as an example. From the measurement results of the relationship between the temperature of the polymethyl methacrylate resin used and the longitudinal elastic modulus (bending mode) (Fig. 4), the temperature dependence of the storage elastic modulus was obtained. The temperature at which the inclination of the graph changes greatly is the transfer start temperature referred to in the present specification. The transfer start temperature can be obtained from the intersection of the tangent of the graph of the phase transition region and the graph of the colloidal flat region. The transfer start temperature determined in Fig. 4 was 128 °C. Next, the main specifications of the injection molding apparatus (mold 100), the light-24-200936347 control member, and the molding conditions used in the simulation are as follows (see Fig. 5).
成形品6 0的厚度：3毫米 模具1〇〇(碳鋼製）的厚度：25毫米 薄板本體20 (鎳製）的厚度：0.3毫米 塡充時間：1.4秒 成形周期：6 0秒 模具100的溫度：85 °CThickness of molded article 60: 3 mm Mold 1 〇〇 (made of carbon steel) Thickness: 25 mm Thin plate body 20 (made of nickel) Thickness: 0.3 mm Filling time: 1.4 seconds Forming period: 60 seconds Mold 100 Temperature: 85 °C
U 冷卻水側的熱傳導係數：1.0x10-3 cal/mm2 · sec · °C 在模槽所射出塡充之聚甲基丙烯酸甲酯樹脂的溫度：U Heat transfer coefficient on the cooling water side: 1.0x10-3 cal/mm2 · sec · °C The temperature of the polymethyl methacrylate resin injected in the cavity:
2 8 0〇C 該模擬係如第5圖所示，係使用模具100，其在與模 槽呈相向的面（背面）1 00b具備有用以流動冷卻水之冷卻設 備7 0。在該模具1 0 〇的模槽側的一面係安裝有薄板構件 10。該薄板構件10具備配設在模槽面（模面）20a之薄板本 體20及配設在其背面20b之低熱傳導率構件30。在薄板 0 本體2 0的模面2 0 a所形成的凹凸結構係高度h爲1 3微 米、間距P爲3 0微米。該凹凸結構係使用於液晶顯示裝 置的側端面型背光的導光板的射出面之圖案。 模擬的結果係如第6及7圖所示，第7圖係第6圖的 時間軸延伸而表現的。在該等第6、7圖，符號（a)、（b)、 (c)係表示射出後的時間（秒）與聚甲基丙烯酸甲酯樹脂之接 觸模具的面的溫度之模擬結果，符號（d)係表示射出後的時 間（秒）與聚甲基丙烯酸甲酯樹脂的模槽內的樹脂的中心部 的溫度之關係之模擬結果。 在此’符號（a)係對照例的模擬結果，該對照例係除了 -25- 200936347 未安裝低熱傳導率構件30以外，使用與第2圖所示相同 的模具（碳鋼製）。 又，符號（b)係使用厚度爲0.1毫米的聚對酞酸乙二酯 製的薄膜作爲低熱傳導率構件30之例子，符號（c)係使用 厚度爲0.15毫米的聚對酞酸乙二酯製的薄膜作爲低熱傳 導率構件30之例子。在此，聚對酞酸乙二酯薄膜的熱傳導 率爲 0.126kcal/m«hf°C ，而薄板本體的熱傳導率爲 79.2kcal / m»hr*°C ° φ 如第6圖的符號（b)、（c)的曲線所示，使用在薄板本體 2 0的背面安裝低熱傳導率構件而成的模具1 0 0時，在模槽 部導入設定在280 °C的聚甲基丙烯酸甲酯樹脂時，接觸模 具1 00的模~槽面之聚甲基丙烯酸甲酯樹脂快速地被與模具 1〇〇的溫度大致相同溫度的模槽面 20a的模面（模槽 面）2 0 a冷卻而暫時下降至轉印開始溫度以下。但是，如第 7圖的符號（d)所示，藉由所塡充的樹脂的中心部的溫度係 充分高且適當地設定薄板本體20的熱容量，而且在薄板本 Ο 體20的背面配設有低熱傳導率構件30，轉瞬間（在該等例 子係1秒以內）高於轉印開始溫度（1 2 8 °C )。藉此，雖然在 模槽內所塡充的樹脂在模具表面（模面20a)附近轉瞬間形 成冷卻固化層，但是之後藉由樹脂溫度係再次高於轉印開 始溫度’該冷卻固化層消失。在該狀態下，模槽內的樹脂 在保壓步驟被施加壓力，具有轉印開始溫度以上的溫度之 樹脂被壓入凹凸圖案中。成形周期60秒係如第7圖所示， 因爲係在槽內所塡充的樹脂的中心部的溫度係充分地低於 轉印開始溫度之充分的時間，能夠得到在聚甲基丙嫌酸甲 酯樹脂轉印微細的凹凸圖案而成之成形品（導光板）。又， •26- 200936347 '因爲此種成形品係會成爲配向變形、冷卻變形等的原因之 冷卻固化層在轉瞬間消失，所以能夠抑制熔合痕、樹脂冷 斑、流紋等的產生。 相對地，如第6圖的符號（a)的曲線所示，在薄板本體 20的背面未配置低熱傳導率構件30之對照例時，模具100 的表面附近的聚甲基丙烯酸甲酯樹脂在剛塡充樹脂後立刻 成爲轉印開始溫度以下的溫度，且隨後亦未高於轉印開始 溫度。因此，由於在模面20a附近之聚甲基丙烯酸甲酯樹 φ 脂所形成的冷卻固化層被來自內部的壓力（保壓）壓入凹凸 圖案，所以產生配向變形、冷變形等，且產生熔合痕、樹 脂冷斑、流紋等。 ' 以上說明的模具1〇〇係在薄板本體20的背面20b配 設有低熱傳導率構件30，但是該低熱傳導率構件30係使 用薄膜。在此，該模擬係使用聚對酞酸乙二酯薄膜作爲低 熱傳導率構件3 0，但是若所塡充的樹脂溫度爲2 8 (TC之高 溫時，考慮工業上之耐熱性時，以聚醯亞胺薄膜爲實用。 _ 專利文獻1係說明在薄板本體20的背面黏合聚醯亞胺薄 〇 膜作爲耐熱性構件30時之具體的實驗例。 [實施例] 以下，藉由實施例來詳細地說明本發明。 (實施例1) 薄板本體係使用熱傳導率爲79.2kcal/m. hr· °C、 厚度爲0.3毫米、大小爲250毫米x220毫米之鎳製的薄 板。在薄板本體的模槽側表面係配列有間距p爲50微米、 高度h爲25微米之二等邊稜鏡狀的凹凸圖案。 在薄板本體的背面（與模槽相反的面）側，係透過熱傳 -27- 200936347 導率爲0.3kcal/m· hr· t、厚度爲0.125毫米之TESA 公司製的熱活性薄膜（商品名 tesaHAF 8402)黏合熱傳導 率爲0.3kcal/m· hr· °C、厚度爲0.125毫米之聚醯亞胺 薄膜{低熱傳導率構件）而使其整體化。 黏合整體化係以第1步驟（層壓步驟）及第2步驟（硬化 步驟）來進行。層壓步驟係使用層壓輥並加熱至1 1 0°C，以 壓力爲0.5MPa、輸送速度爲0.4公尺/分來進行。該條件 係熱活性薄膜爲被熔融狀態而能夠充分地滲透被黏合物的 φ 表面的凹凸之條件。 接著，硬化步驟係藉由在壓力爲0.2MPa的壓力下且 1 30°C保持3小時，能夠使熱活性薄膜作爲可充分耐久性 地將聚醯亞胺薄膜與薄板本體加以整體化之黏合劑層。 另一方面，藉由進行以相當於該薄板本體的厚度的深 度從模具的分模面（parting face)刻入，並將所得到的薄板 本體安裝在該凹部，且使用聚甲基丙烯酸甲酯樹脂依照射 出成形法而形成導光板。 此時的圓筒溫度爲2 7 0 °C，成形周期爲7 0秒。稜鏡形 狀被轉印的內壓（保壓）爲38M Pa附近，所得到的稜鏡高度 係與所刻印的凹凸深度相同亦即2 5微米，確認任一者均能 夠形成良好的凹凸花紋。 即便重複射出成形，在來自樹脂之受熱較多的射出部 位，完全未觀察到有因熱劣化而剝落、或起因於硬度不足 之衝壓模的偏離或厚度變化。藉此，能夠重複使用 5 0 00 次注料〜20000次注料。 (實施例2) 使用背面係貫穿至模具背板之套件模具。在該套件模 -28- 200936347 具的模槽面形成凹部，並在該凹部配設實施例1所得到的 熱活性薄膜。 接著在該熱活性薄膜的表面，將實施例1所得到的薄 板構件的背面以與實施例1同一條件進行熱壓黏。藉此， 使薄板構件以分模面係與模面20a同一平面的方式來將薄 板構件埋設在套件模具的模槽面。 使用與實施例1同一條件進行射出成形時，與實施例 1同樣地，能夠得到良好的射出成形品。 · 藉此，確認藉由將套件模具的模槽面作爲本發明的一 個實施例之模具構件，能夠得到同樣良好的成形品。 (實施例3) 在實施例1所得到薄板構件的背面，透過與實施例1 所使用者同一熱活性薄膜而使其黏合作爲增強材之厚度爲 2.0毫米的不鏽鋼材（SUS304)。黏合條件係與實施例1同 一條件。 因爲此種薄板構件在背面具備增強材且厚度較薄，將 薄板構件直接大型化時，使其安裝在模具時，亦具有良好 的操作性。 使用與實施例1同一條件進行射出成形時，與實施例 1同樣地，能夠得到良好的射出成形品。 (實施例4) 薄板本體係使用熱傳導率爲 79.2kcal/m· hr. °C、 厚度爲0.3毫米、大小爲335毫米x230毫米之鎳製的薄 板。在薄板本體的模槽側表面係配列有間距p爲2 4微米、 高度h爲8.5微米之二等邊稜鏡狀的凹凸圖案。 在薄板本體的背面（與模槽相反的面）側，係透過熱傳 -29- 200936347 導率爲0.3kcal/m· hr.。〇、厚度爲0.015毫米 紙所公司製的熱活性薄膜（商品名S J 4 1 )黏合熱 0.3kcal/m.hr*°C、厚度爲0.125毫米之聚醯亞月 熱傳導率構件）而使其整體化。 黏合整體化係以第1步驟（層壓步驟）及第2 j 步驟）來進行。層壓步驟係使用層壓輥並加熱至1 壓力爲0.5M Pa、輸送速度爲0.4公尺/分來進行 係熱活性薄膜爲被熔融狀態而能夠充分地滲透被 φ 表面的凹凸之條件。 接著，硬化步驟係1 5 0 °C保持3小時，能夠 薄膜作爲可充分耐久性地將聚醯亞胺薄膜與薄板 整體化之黏合劑層。 另一方面’藉由進行以相當於該薄板構件的 度從模具的分模面刻入，並將所得到的薄板構件 凹部，且使用聚甲基丙烯酸甲酯樹脂依照射出成 成導光板。 0 此時的圓筒溫度爲295 °C，成形周期爲40秒 狀被轉印之內壓（保壓）係在200MPa附近，所得 高度係與所刻印的凹凸深度相同亦即8.5微米， 者均能夠形成良好的凹凸花紋。 即便重複射出成形，在來自樹脂之受熱較多 位，完全未觀察到有因熱劣化而剝落、或起因於 等之衝壓模的偏離或厚度變化。藉此，能夠重複使 次注料〜50000次注料。 (實施例5) 使用背面係貫穿至背板之套件模具。在該套 之巴川製 傳導率爲 安薄膜（低 友驟（硬化 10°c，以 。該條件 黏合物的 使熱活性 本體加以 厚度之深 安裝在該 形法而形 ^。稜鏡形 到的稜鏡 確認任一 的射出部 硬度不足 用 10000 件模具的 -30- 200936347 模槽面形成凹部，並在該凹部配設實施例4所得到的熱活 性薄膜。 接著在該熱活性薄膜的表面，將實施例4所得到的薄 板構件的背面以與實施例4同一條件進行熱壓黏。藉此， 使薄板構件以分模面係與模面20a同一平面的方式來將薄 板構件埋設在套件模具的模槽面並黏合。 使用與實施例4同一條件進行射出成形時，與實施例 4同樣地，能夠得到良好的射出成形品。 0 藉此，確認藉由將套件模具的模槽面作爲本發明的一 個實施例之模具構件，能夠得到同樣良好的成形品。 (實施例6) 在實施例4所得到薄板會件的背面，透過與實施例4 所使用者同一熱活性薄膜而使其黏合作爲增強材之厚度爲 0.8毫米的不鏽鋼材（SUS304)。黏合條件係與實施例4同 一條件。 因爲此種薄板構件在背面具備增強材且厚度較薄，將 ©薄板構件直接大型化時，使其安裝在模具時，亦具有良好 的操作性。 使用與實施例4同一條件進行射出成形時，與實施例 4同樣地，能夠得到良好的射出成形品。 (實施例7) 在實施例4所得到薄板構件的背面，透過與實施例4 所使用者同一熱活性薄膜而使其黏合作爲增強材之厚度爲 0.8毫米的不鏽鋼材（SUS304)後，進而透過在實施例4所 使用者同一的熱活性薄膜，使其黏合與在實施例4所使用 者同一厚度、尺寸之鏡面狀的鎳薄板黏合。黏合條件係與 -31- 200936347 實施例4同一條件。 此種薄板構件，藉由在表背面均使用同一鎳板，能夠 降低使其黏合後之板的翹曲，且對模具的安裝性變爲良好。 使用與實施例4同一條件進行射出成形時，與實施例 4同樣地，能夠得到良好的射出成形品。 (實施例8) 在與實施例4所使用者同一鎳薄板，透過在實施例4 所使用者同一的熱活性薄膜，使其黏合與在實施例4所使 0 用者同一低熱傳導率構件，隨後藉由電鑄背面來將鎳薄板 整體化。 此種製造方法係例如能夠由特開200 1-07 1354等得 知，但是得知"依照特開200 1-07 1354的製造方法在低熱 傳導率構件的背面直接電鏟鎳之方法時，因爲鎳與低熱傳 導率構件之黏附性差，會有無法形成鎳層之情形。在實施 例9’係藉由在低熱傳導率層與藉由電鍍形成的鎳層之間 透過使用與實施例4所使用者同一的熱活性薄膜來提高黏 ^ 附性，這點係與特開2001-071354不同。 ❹ 因爲此種薄板構件係以低熱傳導率構件作爲中心而表 背的構成係同一，能夠降低因熱膨脹係數所產生之板的翹 曲’且對模具的安裝性變爲良好。 使用與實施例4同一條件進行射出成形時，與實施例 4同樣地，能夠得到良好的射出成形品。 從實施例4至實施例6所使用的巴川製紙所公司製的 熱活性薄膜（商品名SJ4 1)係在高溫下所產生的氣體較少， 例如與同樣的熱活性薄膜之TESA公司製（tesaHAF8402) 比較’能夠得到進而在射出成形時重複使用時的劣化少之 -32- 200936347 ' 良好的結果。 (對照例1) 使用曰東電工的黏著薄膜（商品名：MC2030)及（商品 名：5919P)代替在實施例1所使用之TESA公司製的熱活 性薄膜，來使鎳製的薄板與聚醯亞胺薄膜黏合。 使用與實施例1同一條件進行射出成形時，在高溫射 出成形的部位之黏合劑薄膜產生剝落。又，在成形步驟， 能夠確認衝壓模產生偏離或污染。又，所得到的成形品的 φ 厚度方向所產生的變動大。 推測該原因係黏合劑薄膜的硬度不足或剪切力不足， 因此，認爲使用黏著薄膜黏合時，即便黏合薄板本體與絕 ^熱薄膜，亦不適合繼續進行連續成形。 (對照例2) 嘗試在薄板本體的背面將聚醯胺酸溶液旋轉塗布之例 子’但是使用該方法時，難以確保作爲本發明必要的低熱 傳導率構件之必要的厚度。 ^ [產業上的利用領域] 依本發明，能夠製造具有大面積的導光板、擴散板、 菲湼耳透鏡、雙凸型透鏡等的透鏡薄片等。亦即，菲湼耳 透鏡或雙凸型透鏡等大型的透鏡薄片，先前有提案揭示藉 由在樹脂板抵接經加熱的平板狀透鏡模具並加壓而使透鏡 模具表面的凹凸轉印成爲樹脂模之方法：或是藉由在透鏡 模具塗布紫外線硬化樹脂並在其上面載置樹脂板，且照射 紫外線來形成透鏡之技術。 但是，轉印方法中存在有成形周期長，致使生產性不 高之課題。 -33- 200936347 依照本發明，因爲即便尺寸比較大的光控制構件亦能 夠藉由射出成形來形成，預料生產性將能夠飛躍性地提高。 [發明之效果] 依照本發明，能夠提供一種模具構件，其係一種能夠 交換的模具構件，即便長期間使用亦能夠安定地生產。 又’依照本發明，能夠以比光碟基板更大的尺寸，生 產性良好地製造能夠控制光線之樹脂成形品 (優先權主張） 0 本申請案係主張基於2007年12月27日向日本國特 許廳提出的特願2007-336514號之優先權，其內容係以 引用的方式入本文。 【圖式簡單說明】 第1圖係表示本發明的一實施例的薄板構件安裝在模 具之狀態之圖，第1 (a)圖係從側面觀看之側面側，第1(b) 圖係從模槽面側觀看的平面圖。 第2圖係藉由剖面說明本發明的一實施例的薄板構件 © 的結構之圖。 第3圖係藉由剖面說明本發明的一實施例的薄板構件 的結構之圖。 第4圖係表示測定聚甲基丙烯酸甲酯樹脂的溫度與縱 彈性模數的關係之結果圖。 第5圖係表示關於導光板的模擬條件之圖。 第6圖係表示藉由使用MARC的非穩定熱傳導解析之 模擬求取射出後的時間（秒）與接觸聚甲基丙烯酸甲酯樹脂 的模具之面的溫度之關係的結果圖。 -34- 200936347 '第7圖係表示藉由使用MARC的非穩定熱傳導解析之 模擬求取射出後的時間（秒）與接觸聚甲基丙烯酸甲酯樹脂 的模具之面的溫度之關係的結果圖。 【主要元件符號說明】2 800 〇C As shown in Fig. 5, the mold is a mold 100 having a cooling device 70 for flowing cooling water on a surface (back surface) 100b facing the cavity. A thin plate member 10 is attached to one side of the mold 10 side of the mold. The thin plate member 10 includes a thin plate body 20 disposed on a cavity surface (mold surface) 20a and a low thermal conductivity member 30 disposed on the back surface 20b thereof. The height h of the uneven structure formed on the die face 20 a of the body 0 of the thin plate 0 is 13 μm, and the pitch P is 30 μm. This uneven structure is a pattern used for the exit surface of the light guide plate of the side end type backlight of the liquid crystal display device. The results of the simulation are shown in Figures 6 and 7, and Figure 7 shows the time axis extension of Figure 6. In the sixth and seventh figures, the symbols (a), (b), and (c) show the simulation results of the time (seconds) after the injection and the temperature of the surface of the polymethyl methacrylate resin contacting the mold. (d) shows a simulation result of the relationship between the time (seconds) after the injection and the temperature of the central portion of the resin in the cavity of the polymethyl methacrylate resin. Here, the symbol (a) is a simulation result of the comparative example, and the same mold (manufactured by carbon steel) as that shown in Fig. 2 was used except that the low thermal conductivity member 30 was not attached to -25-200936347. Further, the symbol (b) is a film made of polyethylene terephthalate having a thickness of 0.1 mm as an example of the low thermal conductivity member 30, and the symbol (c) is a polyethylene terephthalate having a thickness of 0.15 mm. The resulting film is exemplified as the low thermal conductivity member 30. Here, the thermal conductivity of the polyethylene terephthalate film is 0.126 kcal/m «hf ° C , and the thermal conductivity of the thin plate body is 79.2 kcal / m»hr * ° C ° φ as shown in Fig. 6 (b) As shown in the graph of (c), when a mold 1000 having a low thermal conductivity member attached to the back surface of the thin plate main body 20 is used, a polymethyl methacrylate resin set at 280 ° C is introduced into the cavity portion. At this time, the polymethyl methacrylate resin contacting the die-groove surface of the mold 100 is rapidly cooled by the die face (cavity face) of the cavity face 20a at substantially the same temperature as the temperature of the die 1〇〇. Temporarily drops below the transfer start temperature. However, as shown by the symbol (d) in Fig. 7, the temperature of the center portion of the resin to be charged is sufficiently high, and the heat capacity of the thin plate main body 20 is appropriately set, and the back surface of the thin plate body 20 is disposed. There is a low thermal conductivity member 30 which is instantaneously (within 1 second in these examples) higher than the transfer start temperature (1 2 8 ° C). Thereby, although the resin filled in the cavity is formed into a cooling solidified layer instantaneously in the vicinity of the mold surface (die face 20a), the cooled solidified layer disappears again after the resin temperature is higher than the transfer start temperature. In this state, the resin in the cavity is pressurized at the pressure holding step, and the resin having a temperature equal to or higher than the transfer start temperature is pressed into the concave-convex pattern. The molding cycle of 60 seconds is as shown in Fig. 7, because the temperature at the center portion of the resin filled in the groove is sufficiently lower than the transfer start temperature, and the polymethyl propylene acid can be obtained. A molded article (light guide plate) obtained by transferring a fine uneven pattern to a methyl ester resin. Further, • 26-200936347 'The cooling solidified layer disappears in the blinking direction because the molded product is deformed or cooled, so that generation of weld marks, resin cold spots, and flow marks can be suppressed. On the other hand, as shown by the graph of the symbol (a) in Fig. 6, when the comparative example of the low thermal conductivity member 30 is not disposed on the back surface of the thin plate main body 20, the polymethyl methacrylate resin near the surface of the mold 100 is just Immediately after filling the resin, it becomes a temperature below the transfer start temperature, and is not subsequently higher than the transfer start temperature. Therefore, since the cooling solidified layer formed of the polymethyl methacrylate tree φ grease in the vicinity of the die face 20a is pressed into the concave-convex pattern by the pressure (holding pressure) from the inside, the alignment deformation, the cold deformation, and the like are generated, and fusion occurs. Traces, resin cold spots, flow lines, etc. The mold 1 described above is provided with a low thermal conductivity member 30 on the back surface 20b of the thin plate main body 20, but the low thermal conductivity member 30 is a thin film. Here, the simulation uses a polyethylene terephthalate film as the low thermal conductivity member 30, but if the temperature of the resin to be charged is 28 (at the high temperature of TC, when industrial heat resistance is considered, The quinone imine film is practical. _ Patent Document 1 describes a specific experimental example when a polyimide film is bonded to the back surface of the thin plate main body 20 as the heat-resistant member 30. [Embodiment] Hereinafter, by way of example The present invention will be described in detail. (Example 1) Thin plate This system uses a thin plate made of nickel having a thermal conductivity of 79.2 kcal/m.hr·°C, a thickness of 0.3 mm, and a size of 250 mm x 220 mm. The groove side surface is provided with a concavo-convex pattern having a pitch p of 50 μm and a height h of 25 μm. On the back side of the thin plate body (the surface opposite to the cavity), the heat transmission is transmitted -27- 200936347 The thermal activity film (trade name tesaHAF 8402) made by TESA Co., Ltd. with a conductivity of 0.3kcal/m·hr·t and 0.125 mm has a thermal conductivity of 0.3kcal/m·hr·°C and a thickness of 0.125 mm. Polyimine film {low thermal conductivity member) Integrated. The adhesion integration is carried out in the first step (lamination step) and the second step (hardening step). The laminating step was carried out using a laminating roll and heating to 110 ° C at a pressure of 0.5 MPa and a conveying speed of 0.4 m/min. This condition is a condition in which the thermally active film is in a molten state and can sufficiently penetrate the unevenness of the surface of the φ of the adherend. Next, the hardening step is carried out by a pressure of 0.2 MPa and maintained at 1 30 ° C for 3 hours, whereby the thermally active film can be used as a binder capable of integrating the polyimide film and the sheet body with sufficient durability. Floor. On the other hand, by performing a parting face of the mold at a depth corresponding to the thickness of the sheet body, and mounting the obtained sheet body in the recess, and using polymethyl methacrylate The resin is formed into a light guide plate by a molding method. The cylinder temperature at this time was 270 ° C, and the molding cycle was 70 seconds. The internal pressure (holding pressure) to be transferred in the shape of a crucible was around 38 M Pa, and the obtained crucible height was the same as the depth of the indentation to be printed, i.e., 25 μm, and it was confirmed that any of them was able to form a good uneven pattern. Even if the injection molding was repeated, no deviation or thickness change of the press die due to thermal deterioration or peeling due to insufficient hardness was observed at the portion where the resin was heated. Thereby, it is possible to reuse 50000 shots to 20,000 shots. (Example 2) A kit mold having a back surface penetrating through a mold backing plate was used. A concave portion was formed in the cavity surface of the kit -28-200936347, and the thermally active film obtained in Example 1 was placed in the concave portion. Next, the back surface of the sheet member obtained in Example 1 was thermally pressure-bonded under the same conditions as in Example 1 on the surface of the thermally active film. Thereby, the thin plate member is embedded in the cavity surface of the kit mold such that the split plate surface is flush with the die face 20a. When injection molding was carried out under the same conditions as in Example 1, a good injection-molded article was obtained in the same manner as in Example 1. In this way, it was confirmed that the mold member having the mold of the mold can be used as the mold member of one embodiment of the present invention, whereby a molded article of the same good quality can be obtained. (Example 3) On the back surface of the sheet member obtained in Example 1, the same thermal active film as that of the user of Example 1 was passed through to form a stainless steel material (SUS304) having a thickness of 2.0 mm. The bonding conditions were the same as in Example 1. Since such a thin plate member is provided with a reinforcing material on the back surface and has a small thickness, when the thin plate member is directly enlarged, it is also excellent in operability when it is mounted on a mold. When injection molding was carried out under the same conditions as in Example 1, a good injection-molded article was obtained in the same manner as in Example 1. (Example 4) Sheet This system used a sheet made of nickel having a thermal conductivity of 79.2 kcal/m·hr. ° C, a thickness of 0.3 mm, and a size of 335 mm x 230 mm. On the cavity side surface of the thin plate main body, a concavo-convex pattern in which a pitch p is 24 μm and a height h is 8.5 μm is arranged. On the back side of the thin plate body (the side opposite to the cavity), the transmission rate of heat transmission -29-200936347 is 0.3 kcal/m·hr.热, thickness of 0.015 mm paper company's thermal active film (trade name SJ 4 1) bonding heat 0.3kcal / m.hr * ° C, thickness of 0.125 mm polythene sub-monthly thermal conductivity components) and its overall Chemical. The adhesion integration is carried out in the first step (lamination step) and the second step j). The laminating step was carried out by using a laminating roll and heating to a pressure of 0.5 MPa and a conveying speed of 0.4 m/min to carry out the condition that the thermally active film was in a molten state and sufficiently penetrated the unevenness on the surface of φ. Next, the curing step was maintained at 150 ° C for 3 hours, and the film was used as an adhesive layer capable of integrating the polyimide film and the sheet with sufficient durability. On the other hand, the concave portion of the obtained thin plate member was inscribed by a portion corresponding to the thin plate member, and the obtained thin plate member was irradiated with a polymethyl methacrylate resin to form a light guide plate. 0 The cylinder temperature at this time is 295 ° C, and the molding cycle is 40 seconds. The internal pressure (pressure holding) to be transferred is around 200 MPa, and the height obtained is the same as the depth of the unevenness of the mark, that is, 8.5 μm. A good embossing pattern can be formed. Even if the injection molding was repeated, there was a large amount of heat from the resin, and no deviation or thickness change of the stamping die due to thermal deterioration or peeling or the like was observed. Thereby, it is possible to repeat the injection of ~50000 times of the secondary injection. (Example 5) A kit mold having a back surface penetrating through a back sheet was used. The conductivity of the set of Bachuan is as good as the film (the low-friends step (hardening 10 °c, to the condition that the viscosity of the thermal active body is deepened in the shape of the shape and shape)稜鏡 Confirm that the hardness of any of the injection portions is less than that of the -30-200936347 cavity surface of the 10000-piece mold, and the heat-active film obtained in Example 4 is disposed in the concave portion. Next, on the surface of the thermally active film, The back surface of the thin plate member obtained in Example 4 was thermocompression-bonded under the same conditions as in Example 4. Thereby, the thin plate member was embedded in the kit mold so that the split surface system was flush with the mold surface 20a. When the injection molding was carried out under the same conditions as in Example 4, a good injection-molded article was obtained in the same manner as in Example 4. Thus, it was confirmed that the cavity surface of the kit mold was used as the present. According to the mold member of one embodiment of the invention, a molded article of the same quality can be obtained. (Example 6) The back surface of the thin plate member obtained in Example 4 was passed through the same heat work as the user of Example 4. The film was bonded to a stainless steel material (SUS304) having a thickness of 0.8 mm. The bonding conditions were the same as those of Example 4. Since the thin plate member was provided with a reinforcing material on the back side and the thickness was thin, the © thin plate member was directly When it is increased in size, it is also excellent in workability when it is attached to a mold. When injection molding is carried out under the same conditions as in Example 4, a good injection-molded article can be obtained in the same manner as in Example 4. (Example 7) The back surface of the thin plate member obtained in Example 4 was passed through the same thermal active film as that of the user of Example 4, and bonded to a stainless steel material (SUS304) having a thickness of 0.8 mm as a reinforcing material, and then passed through the fourth embodiment. The same thermal active film of the user is bonded to the mirror-shaped nickel sheet of the same thickness and size as the user of Example 4. The bonding conditions are the same as those of the embodiment of -31-200936347. By using the same nickel plate on both the front and back sides of the watch, it is possible to reduce the warpage of the plate after bonding, and the mountability to the mold becomes good. When the injection molding was carried out under the same conditions, a good injection-molded article was obtained in the same manner as in Example 4. (Example 8) The same heat as the user of Example 4 was obtained in the same manner as the nickel thin plate of the user of Example 4. The active film is bonded to the same low thermal conductivity member as the one used in Example 4, and then the nickel thin plate is integrated by electroforming the back surface. Such a manufacturing method can be, for example, a special opening 200 1-07 1354 I have learned that, however, I know that according to the manufacturing method of JP-A-200 1-07 1354, when the method of directly shoveling nickel on the back side of the low thermal conductivity member, the adhesion between nickel and the low thermal conductivity member may be poor. The case of the nickel layer. In Example 9', the adhesion is improved by using the same thermal active film as the user of Example 4 between the low thermal conductivity layer and the nickel layer formed by electroplating. 2001-071354 is different.此种 Since such a thin plate member has the same structure as the center of the low thermal conductivity member, the warpage of the plate due to the coefficient of thermal expansion can be reduced and the mountability to the mold becomes good. When injection molding was carried out under the same conditions as in Example 4, a good injection-molded article was obtained in the same manner as in Example 4. The heat-active film (trade name: SJ4 1) manufactured by Bachuan Paper Co., Ltd. used in Example 4 to Example 6 has a small amount of gas generated at a high temperature, for example, TESA Co., Ltd. (tesaHAF8402) which is the same thermal active film. )Compared with '32-200936347' with good deterioration when it was used repeatedly during injection molding. (Comparative Example 1) An adhesive film (trade name: MC2030) and (trade name: 5919P) of Nippon Electric Co., Ltd. were used instead of the thermally active film manufactured by TESA Co., Ltd. used in Example 1 to form a sheet made of nickel and polyfluorene. The imine film is bonded. When the injection molding was carried out under the same conditions as in Example 1, the adhesive film at the portion where the high-temperature injection molding was formed was peeled off. Further, in the forming step, it was confirmed that the stamping die was deviated or contaminated. Further, the obtained molded article has a large variation in the thickness direction of φ. It is presumed that the reason is that the hardness of the adhesive film is insufficient or the shearing force is insufficient. Therefore, it is considered that even when the adhesive film is bonded, even if the thin film main body and the heat-insulating film are bonded, continuous molding is not suitable. (Comparative Example 2) An example in which a polyamic acid solution was spin-coated on the back surface of a thin plate body was attempted. However, when this method is used, it is difficult to secure the necessary thickness of the low thermal conductivity member which is essential to the present invention. [Industrial Applicability] According to the present invention, it is possible to manufacture a lens sheet having a large area such as a light guide plate, a diffusion plate, a Fresnel lens, and a lenticular lens. That is, a large lens sheet such as a Fresnel lens or a lenticular lens has been previously proposed to transfer the unevenness of the surface of the lens mold into a resin by abutting the heated flat lens mold on the resin sheet and pressurizing it. Method of molding: A technique of forming a lens by applying a UV-curable resin to a lens mold and placing a resin plate thereon, and irradiating ultraviolet rays. However, in the transfer method, there is a problem that the molding cycle is long and the productivity is not high. -33- 200936347 According to the present invention, since even a relatively large-sized light control member can be formed by injection molding, productivity is expected to be drastically improved. [Effect of the Invention] According to the present invention, it is possible to provide a mold member which is a mold member which can be exchanged and which can be stably produced even when used for a long period of time. Further, according to the present invention, it is possible to manufacture a resin molded article capable of controlling light with a larger size than the optical disk substrate. (Priority claim) 0 This application claims to be based on the Japanese Patent Office on December 27, 2007. The priority of Japanese Patent Application No. 2007-336514, the disclosure of which is incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing a state in which a thin plate member according to an embodiment of the present invention is attached to a mold, and Fig. 1(a) is a side view from the side, and Fig. 1(b) is from A plan view of the side of the cavity. Fig. 2 is a view showing the structure of a thin plate member © according to an embodiment of the present invention. Fig. 3 is a view showing the structure of a thin plate member according to an embodiment of the present invention by a cross section. Fig. 4 is a graph showing the results of measuring the relationship between the temperature of the polymethyl methacrylate resin and the longitudinal elastic modulus. Fig. 5 is a view showing simulation conditions regarding a light guide plate. Fig. 6 is a graph showing the relationship between the time (seconds) after the injection and the temperature of the surface of the mold contacting the polymethyl methacrylate resin by simulation using the unstable heat conduction analysis of MARC. -34- 200936347 'Fig. 7 shows the result of the relationship between the time (seconds) after injection and the temperature of the surface of the mold contacting the polymethyl methacrylate resin by simulation using the unstable heat conduction analysis of MARC. . [Main component symbol description]
10 模 具 構 件 10b 模 具 構 件 的 背 面 20 薄 板 本 Odja 體 20a 模 槽 面 20b 薄 板 本 體 的 背 面 30 低 熱 傳 導 率 構 件 3 1 低 熱 傳 導 率 構 件層 32、33 耐 熱 性 黏 合 劑 層 40 增 強 材 50 背 板 60 成 形 品 70 冷 卻 設 備 100 模 具 h 高 度 P 間 距 -35-10 Mold member 10b Back side of the mold member 20 Thin plate Odja body 20a Mold groove surface 20b Back surface of thin plate body 30 Low thermal conductivity member 3 1 Low thermal conductivity member layer 32, 33 Heat resistant adhesive layer 40 Reinforcing material 50 Back sheet 60 Forming Product 70 Cooling Equipment 100 Mold h Height P Spacing -35-