TW201321161A - Insert molded article and heat dissipation structure - Google Patents

Insert molded article and heat dissipation structure Download PDF

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Publication number
TW201321161A
TW201321161A TW101127128A TW101127128A TW201321161A TW 201321161 A TW201321161 A TW 201321161A TW 101127128 A TW101127128 A TW 101127128A TW 101127128 A TW101127128 A TW 101127128A TW 201321161 A TW201321161 A TW 201321161A
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Taiwan
Prior art keywords
metal member
resin member
molded body
joint
resin
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TW101127128A
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Chinese (zh)
Inventor
Hidemi Kondo
Shinji Kiboshi
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Polyplastics Co
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Publication of TW201321161A publication Critical patent/TW201321161A/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486Details, accessories and auxiliary operations
    • B29C2045/14868Pretreatment of the insert, e.g. etching, cleaning
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2081/00Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
    • B29K2081/04Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00Use of unspecified macromolecular compounds as moulding material
    • B29K2101/12Thermoplastic materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2705/00Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
    • B29K2705/02Aluminium
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0013Conductive

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention is to provide an insert molded article that can be manufactured by a method having high productivity, in which the adhesive force between a resin member and a metal member is enough, and the heat transmission between the resin member and the metal member is smooth. The insert molded article includes the resin member and the metal member, wherein the metal member has two or more joining holes formed to be scattered on the faying surface with the resin member, the resin member has projections inserted in the joining holes, the area of at least one opening of the joining hole is at least 0.44 mm<SP>2</SP> and at most 19.63 mm<SP>2</SP>, when the area of the surface enclosed by the periphery of the faying surface of the resin member and the metal member is S1, and the all total of the areas of the openings of the joining holes is S2, the proportion S2/S1 satisfies a specific inequality (I).

Description

嵌入成形體及散熱構造體 Embedded molded body and heat dissipation structure

本發明係關於嵌入成形體及散熱構造體。 The present invention relates to an insert molded body and a heat dissipation structure.

鋁或鋁合金等之金屬構件,與由熱可塑性樹脂組成物所構成之樹脂構件一體化而成之複合品,從以往即使用於儀表板周邊之控制盒等之汽車的內裝構件、室內裝潢零件、數位相機或行動電話等之電子機器之外裝構件等。 A composite product in which a metal member such as aluminum or an aluminum alloy is integrated with a resin member composed of a thermoplastic resin composition, and a built-in member or interior decoration of a vehicle such as a control box used for an instrument panel External components such as parts, digital cameras, or mobile phones.

做為使樹脂構件與金屬構件一體化之方法,有使用接著劑或雙面膠帶接著之方法;或在金屬構件及/或樹脂構件上設置折返片或卡勾等固定構件,使用此固定構件將兩者固著之方法;使用螺絲等接合之方法等。在其中,使用接著劑之方法為簡便的方法,而被頻繁地實行。 As a method of integrating the resin member and the metal member, there is a method of using an adhesive or a double-sided tape; or a fixing member such as a folded piece or a hook is provided on the metal member and/or the resin member, and the fixing member is used. The method of fixing the two; the method of joining using screws or the like. Among them, the method using an adhesive is a simple method and is frequently carried out.

在此,為了使金屬構件等與樹脂構件一體化之接著劑價格高昂。又,在上述之複合品的製造中,由於分別進行樹脂構件與金屬構件之成形加工,之後,有一體化之必要,因此也有複合品之生產性低下的問題。 Here, the adhesive for integrating a metal member or the like with the resin member is expensive. Further, in the production of the above-described composite product, since the molding process of the resin member and the metal member is performed separately, it is necessary to integrate it later, and thus the productivity of the composite product is lowered.

做為為了解決上述問題點之複合品的製造方法,已知有將金屬構件等配置於射出成形用的模具之模腔內,將熔融狀態之熱可塑性樹脂組成物射出於模腔內,而製造金屬構件與樹脂構件成為一體之複合品的方法。此製造法,係做為嵌入成形法而已知,以此方法所製造之複合品為嵌入成形體。 In order to solve the above-mentioned problem, it is known that a metal member or the like is placed in a cavity of a mold for injection molding, and a thermoplastic resin composition in a molten state is emitted into a cavity to be manufactured. A method of integrating a metal member and a resin member into a composite product. This manufacturing method is known as an insert molding method, and the composite produced by this method is an insert molding.

藉由上述嵌入成形法,由於沒有必要使用接著劑,而可減低複合品之製造成本。又,在嵌入成形體中樹脂構件之成形加工時由於樹脂構件與金屬構件一體化,因此相較於使用接著劑之方法,生產性也優良。 According to the above-described insert molding method, since it is not necessary to use an adhesive, the manufacturing cost of the composite can be reduced. Moreover, since the resin member and the metal member are integrated in the molding process of the resin member in the insert molded body, the productivity is also superior to the method using the adhesive.

然而,,嵌入成形體,相較於使用接著劑等而製造之複合品,樹脂構件與金屬構件之密著力小這點會成為問題。因此,已知將嵌入成形前之金屬構件的表面粗化,藉由使此粗面與樹脂構件相接而嵌入成形,而使金屬構件與樹脂構件之間的密著力提升之技術(例如,參照專利文獻1)。 However, the embedded molded body has a problem that the adhesion between the resin member and the metal member is small compared to the composite manufactured by using an adhesive or the like. Therefore, it is known to roughen the surface of the metal member before the insert molding, and insert the molding by bringing the rough surface into contact with the resin member, thereby improving the adhesion between the metal member and the resin member (for example, refer to Patent Document 1).

先行專利文獻:【專利文獻】 First patent document: [patent literature]

【專利文獻1】日本專利特開2001-225352號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2001-225352

專利文獻1所記載之技術,藉由將金屬構件粗面化,而可提高樹脂構件與金屬構件之密著性。然而,粗面化之工程為必要,嵌入成形體之生產性低下。 According to the technique described in Patent Document 1, the adhesion between the resin member and the metal member can be improved by roughening the metal member. However, the roughening process is necessary, and the productivity of the embedded molded body is low.

又,在專利文獻1所記載之方法之情況,若僅為嵌入成形則密著性不足,而有為了提高密著性而要求退火處理之情況。由於退火處理為耗時之工程,因此使嵌入成形體之生產性低下。 Further, in the case of the method described in Patent Document 1, the adhesion is insufficient only for the insert molding, and the annealing treatment is required to improve the adhesion. Since the annealing treatment is a time-consuming process, the productivity of the insert molded body is lowered.

又,在專利文獻1所記載之方法的情況,由於樹脂構件與金屬構件之間的熱難以傳達,因此在樹脂構件與金屬構件之間要求高熱傳導性之用途上,專利文獻1所記載之方法並不能說是很適合。 In the case of the method described in Patent Document 1, the heat between the resin member and the metal member is difficult to be transmitted, and therefore, the method described in Patent Document 1 is used for the application of high thermal conductivity between the resin member and the metal member. It can't be said that it is very suitable.

本發明係為解決以上課題而做成,其目的在於,提供:可以生產性高之方法來製造之同時,在樹脂構件與金屬構件之間之密著力充分,且樹脂構件與金屬構件之間的熱傳導順利之嵌入成形體。 The present invention has been made to solve the above problems, and an object of the invention is to provide a method for producing a product having high productivity and a sufficient adhesion between a resin member and a metal member, and between the resin member and the metal member. The heat transfer is smoothly embedded in the molded body.

本發明者們,為解決上述課題而反覆進行精心銳意的研究。其結果,發現一種包括樹脂構件與金屬構件之嵌入成形體,上述金屬構件具有散在於與上述樹脂構件之接合面而形成之2個以上的接合孔,上述樹脂構件具有插入上述接合孔之凸部,至少1個接合孔之開口部分的面積為0.44mm2以上19.63mm2以下,樹脂構件與金屬構件之接合面的外圍所圍繞的面之面積為S1,在上述接合面中上述接合孔之開口的面積總和為S2時,藉由使比率S2/S1,滿足下述的不等式(I),而可解決上述課題,而得以完成本發明。更具體而言,本發明係提供以下內容。 The inventors of the present invention have repeatedly conducted intensive research to solve the above problems. As a result, it has been found that an embedded molded body including a resin member having two or more joining holes formed by a joint surface with the resin member, and a metal member having a convex portion inserted into the joint hole. at least one engagement opening portion of the aperture area of 0.44mm 2 or less than 19.63mm 2, the peripheral area of the surface of the bonding surface of the resin member and the metal member is surrounded S 1, in the above-described bonding surface of the bonding hole When the sum of the areas of the openings is S 2 , the above problem can be solved by satisfying the following inequality (I) by setting the ratio S 2 /S 1 , and the present invention can be completed. More specifically, the present invention provides the following.

(1)一種嵌入成形體,為包括樹脂構件與金屬構件之嵌入成形體,其特徵在於:前述金屬構件具有散在於與前述樹脂構件之接合面而形成之2個以上的接合孔,至少1個前述接合孔之開口部分的面積為0.44mm2以上19.63mm2以 下,前述樹脂構件具有插入上述接合孔之凸部,前述樹脂構件與前述金屬構件之接合面的外圍所圍繞的面之面積為S1,在上述接合面側之前述接合孔之開口的面積總和為S2時,比率S2/S1,滿足以下的不等式(I)。 (1) An insert molded body comprising an insert molded body comprising a resin member and a metal member, wherein the metal member has two or more joining holes formed by a joint surface with the resin member, and at least one the engagement hole of the opening portion of an area of 0.44mm 2 or less than 2 19.63mm, the resin member has a convex portion is inserted into the engaging hole, the area of the peripheral surface of the bonding surface of the resin member and the metal member is surrounded by the S 1. When the total area of the openings of the joint holes on the joint surface side is S 2 , the ratio S 2 /S 1 satisfies the following inequality (I).

0.04≦S2/S1≦0.80 (I) 0.04≦S 2 /S 1 ≦0.80 (I)

(2)如(1)所記載之嵌入成形體,其中,至少1個的前述接合孔的開口部分的面積為0.64mm2以上3.14mm2以下。 (2) to (1) described in the insert molded, wherein, at least a portion of the area of the opening of the engaging holes is 0.64 mm 2 or less than 2 3.14mm.

(3)如(1)或(2)所記載之嵌入成形體,其中,前述接合孔,係分布在前述接合面之略全體而形成。 (3) The insert molded body according to the above aspect, wherein the joint hole is formed to be distributed over the entire joint surface.

(4)如(1)至(3)所記載之任一嵌入成形體,其中,對於前述面積S1,全部的接合孔內中樹脂構件與金屬構件的接合面積總和之面積S3的比率S3/S1,係滿足以下的不等式(II)。 (4) (1) to (3) described in any one of a molded insert, wherein the sum of the bonding area to the area of the area S 1, all of the engagement hole of the resin member and the metal member is a ratio of S S 3 3 / S 1, lines satisfy the following inequality (II).

0.3≦S3/S1≦3 (II) 0.3≦S 3 /S 1 ≦3 (II)

(5)如(1)至(4)所記載之任一嵌入成形體,其中,前述接合孔,為貫通前述金屬構件之貫通孔。 (5) The insert molding according to any one of (1) to (4), wherein the joint hole is a through hole penetrating the metal member.

(6)如(1)至(5)所記載之任一嵌入成形體,其中,至少一部分之前述接合孔之在前述接合孔的既定深度之深度方向的剖面積,較比前述既定深度還深之位置之前述深度方向之剖面積小。 (6) The insert molded body according to any one of (1) to (5), wherein a cross-sectional area of at least a part of the joint hole in a depth direction of a predetermined depth of the joint hole is deeper than the predetermined depth The cross-sectional area of the aforementioned depth direction is small.

(7)如(1)至(6)所記載之任一嵌入成形體,其中,前述金屬構件是由鋁壓鑄所構成。 (7) The insert molding according to any one of (1) to (6) wherein the metal member is formed by aluminum die casting.

(8)如(1)至(7)所記載之任一嵌入成形體,其中,前述樹脂構件,係由熱可塑性樹脂構成,在前述熱可塑性樹脂 之玻璃轉換溫度(Tg)-0℃以上Tg+180℃以下之條件進行退火處理。 (8) The insert molding according to any one of (1) to (7) wherein the resin member is made of a thermoplastic resin, and the thermoplastic resin is The glass transition temperature (Tg) - 0 ° C or more Tg + 180 ° C or less is annealed.

(9)一種散熱構造體,係包括熱源與如(1)至(8)所記載之任一嵌入成形體,其特徵在於:前述樹脂構件,為受熱來自前述熱源之熱的受熱部,前述金屬構件,為將前述樹脂構件受熱之熱散熱之散熱部,前述樹脂構件之熱傳導率為1W/(mk)以上20W/(mk)以下,前述金屬構件之熱傳導率為20W/(mk)以上300W/(mk)以下。 (9) A heat dissipating structure, comprising: a heat source according to any one of (1) to (8), wherein the resin member is a heat receiving portion that receives heat from the heat source, and the metal The member is a heat radiating portion that dissipates heat of the resin member by heat, and the thermal conductivity of the resin member is 1 W/(mk) or more and 20 W/(mk) or less, and the thermal conductivity of the metal member is 20 W/(mk) or more and 300 W/ (mk) below.

本發明之嵌入成形體,可以生產性高之方法來製造之同時,在樹脂構件與金屬構件之間之密著力充分,且樹脂構件與金屬構件之間的熱傳導順利。 The insert molding of the present invention can be produced by a method of high productivity, and the adhesion between the resin member and the metal member is sufficient, and the heat conduction between the resin member and the metal member is smooth.

以下,說明本發明之實施形態。又,本發明不限定於以下之實施形態。 Hereinafter, embodiments of the present invention will be described. Further, the present invention is not limited to the following embodiments.

<第一實施形態> <First Embodiment>

第1圖係模示地表示第一實施形態之嵌入成形體之圖,(a)為立體圖,(b)為MM剖面圖。 Fig. 1 is a view schematically showing the insert molded body of the first embodiment, wherein (a) is a perspective view and (b) is a MM cross-sectional view.

如第1圖所示,本實施形態之嵌入成形體1,係包括金屬構件10與樹脂構件20。如第1圖所示,樹脂構件20係層積在金屬構件10上而形成。又,如第1圖(b)所示,樹脂構件20進入形成於金屬構件10之孔(後述的接合孔) 中。 As shown in Fig. 1, the insert molded body 1 of the present embodiment includes the metal member 10 and the resin member 20. As shown in FIG. 1, the resin member 20 is formed by laminating the metal member 10. Further, as shown in FIG. 1(b), the resin member 20 enters a hole formed in the metal member 10 (joining hole to be described later) in.

第2圖係模示地表示金屬構件10之圖,(a)為立體圖,(b)為平面圖,(c)為NN剖面圖。 Fig. 2 is a view schematically showing the metal member 10, (a) is a perspective view, (b) is a plan view, and (c) is a NN sectional view.

如第2圖所示,金屬構件10為板狀的構件。又,金屬構件10,係構成金屬構件10的一個面,具有後述之與樹脂構件20相接之接合面11,和散在於該接合面11上而形成之2個以上的接合孔12。 As shown in Fig. 2, the metal member 10 is a plate-shaped member. Further, the metal member 10 constitutes one surface of the metal member 10, and has a joint surface 11 which is in contact with the resin member 20, which will be described later, and two or more joint holes 12 which are formed by the joint surface 11.

接合面11係與樹脂構件20相接之面,且為接合孔12所形成之面。在本實施形態中,接合面11係構成板的一個面,為平面狀。然而,接合面11之形狀只要與樹脂構件20相接,形成了接合孔12,即並沒有特別限制,也可為曲面狀。 The joint surface 11 is a surface that is in contact with the resin member 20 and is a surface formed by the joint hole 12. In the present embodiment, the joint surface 11 is a flat surface of the plate. However, the shape of the joint surface 11 is formed so as to be in contact with the resin member 20, and the joint hole 12 is formed, that is, it is not particularly limited, and may have a curved shape.

接合孔12,係散在而形成於上述接合面11之孔,為後述樹脂構件20之凸部插入之部位。在本實施形態中,接合孔12係在接合面11上形成了9個,9個接合孔12全部具有相同的形狀。在本實施形態中,接合孔12的形狀係形成於接合面11之圓柱狀的凹部。 The joint hole 12 is a hole formed in the joint surface 11 and is a portion into which the convex portion of the resin member 20 to be described later is inserted. In the present embodiment, nine engagement holes 12 are formed on the joint surface 11, and all of the nine joint holes 12 have the same shape. In the present embodiment, the shape of the joint hole 12 is formed in a cylindrical recessed portion of the joint surface 11.

又,接合孔12,係散在於接合面11而形成。所謂「散在」,係指在接合面11上接合孔12以適當的間隔而配置,並非一定要是均等的間隔。又,在本實施形態中,係分布在接合面11之略全體而形成,在本發明中,接合孔12係以分布在接合面11之略全體而形成為佳。 Further, the joint hole 12 is formed by being scattered on the joint surface 11. The term "scattered" means that the joint holes 12 are arranged at appropriate intervals on the joint surface 11, and are not necessarily equal intervals. Further, in the present embodiment, it is preferably distributed over the entire joint surface 11. In the present invention, it is preferable that the joint hole 12 is formed to be distributed over the entire joint surface 11.

又,在本發明中,滿足後述不等式(I),至少1個接合孔12之開口面積為0.44mm2以上19.63mm2以下。接合孔 12的數量,接合孔12的形狀,並沒有特別限定。又,不管接合孔12是以何種間隔形成在接合面11上皆可。又,2個以上之接合孔12的形狀,也可分別相異。 Further, in the present invention, the above inequality (I) satisfies the at least one engagement hole 12 of the opening area of 0.44mm 2 or less than 2 19.63mm. The number of the engagement holes 12 and the shape of the engagement holes 12 are not particularly limited. Further, it is sufficient that the engagement holes 12 are formed on the joint surface 11 at any interval. Further, the shapes of the two or more joining holes 12 may be different from each other.

接合孔12,有必要滿足下述不等式(I)而在接合面11上形成。在不等式(I)中,金屬構件10與樹脂構件20之接合面的外圍所圍繞的面積為S1,接合面側之接合孔之開口的面積總和為S2The joint hole 12 needs to be formed on the joint surface 11 by satisfying the following inequality (I). In the inequality (I), the area surrounded by the outer periphery of the joint surface of the metal member 10 and the resin member 20 is S 1 , and the sum of the areas of the openings of the joint holes on the joint surface side is S 2 .

0.04≦S2/S1≦0.80 (I) 0.04≦S 2 /S 1 ≦0.80 (I)

「面積S1」係指接合面的外圍所圍繞之面的面積,為想定沒有接合孔12之情況之金屬構件10與樹脂構件20相接的面積。在本實施形態中面積S1,係從接合面11之面積除去後述接合孔12之開口的總面積S2之面積(第2圖(b)之網狀部分的面積),加上全部的接合孔12之內壁面(亦即,構成接合孔12之凹部的內表面)之面積的總和。面積S1,即使接合面11為曲面等複雜的形狀,或是形成接合孔12之凹部的內表面即使為複雜的情狀之情況,也可如上述而導出。 The "area S 1 " refers to the area of the surface surrounded by the outer periphery of the joint surface, and is an area in which the metal member 10 and the resin member 20 are in contact with each other without the joint hole 12 being considered. In the present embodiment, the area S 1 is the area of the total area S 2 of the opening of the joint hole 12 (the area of the mesh portion of Fig. 2(b)), which is removed from the area of the joint surface 11, and all the joints are added. The sum of the areas of the inner wall faces of the holes 12 (i.e., the inner surfaces of the recesses constituting the engaging holes 12). The area S 1 can be derived as described above even if the joint surface 11 has a complicated shape such as a curved surface or the inner surface of the concave portion forming the joint hole 12 is a complicated situation.

「接合孔12之開口的面積」,係指在接合面11,接合孔12之開口緣所圍繞之面積。因此,「接合孔12之開口的總面積S2」,係指各接合孔12之開口緣所圍繞的面積相加後之面積。 The "area of the opening of the joint hole 12" means the area around the opening edge of the joint hole 11 at the joint surface 11. Therefore, the "total area S 2 of the opening of the joint hole 12" means the area after the area surrounded by the opening edge of each of the joint holes 12 is added.

在本實施形態中,如上述,至少1個接合孔12之開口的面積,為0.44mm2以上19.63mm2以下,至少1個接合孔12之開口的面積在0.64mm2以上3.14mm2以下而更佳。又, 愈多的接合孔12之開口的面積在上述範圍內愈佳,全部的接合孔12之開口的面積在上述範圍最佳。 In the present embodiment, as described above, at least one opening hole 12 of the engagement area of 0.44mm 2 or less than 2 19.63mm, at least one area of the opening of the engagement hole 12 in the 3.14mm 2 or less than 0.64 mm 2 Better. Further, the more the area of the opening of the joint hole 12 is in the above range, the area of the opening of all the joint holes 12 is the best in the above range.

又,在本發明中,對於面積S1,全部的接合孔12內之樹脂構件20與金屬構件10之接合面積的總和之面積S3之比率S3/S1,滿足以下不等式(III)為佳。 Further, in the present invention, the area S 1, the sum of the bonded area of the resin member within all of the engaging hole 1220 and the metal member 10 of the area S 3 of the ratio S 3 / S 1, satisfy the following inequality (III) is good.

0.3≦S3/S1≦3 (III) 0.3≦S 3 /S 1 ≦3 (III)

「全部的接合孔12內中樹脂構件20與金屬構件10之接合面積之總和之面積S3」,係指樹脂構件20進入之全部的接合孔12之內壁面(亦即,構成接合孔12之凹部的內表面)之面積的總合。 The area S 3 of the sum of the joint areas of the resin member 20 and the metal member 10 in all the joint holes 12 means the inner wall surface of all the joint holes 12 into which the resin member 20 enters (that is, the joint hole 12 is formed). The sum of the areas of the inner surfaces of the recesses.

又,構成上述金屬構件10之金屬的種類並沒有特別限定,可根據用途等而適當使用較佳之種類的金屬。例如,鋼、鑄鐵、不鏽鋼、鋁、銅、金、銀、黃銅等金屬,也可使用鋁合金、鋅合金、鎂合金、錫合金等之合金。 Moreover, the type of the metal constituting the metal member 10 is not particularly limited, and a preferable metal can be suitably used depending on the application and the like. For example, metals such as steel, cast iron, stainless steel, aluminum, copper, gold, silver, and brass may be alloys such as aluminum alloys, zinc alloys, magnesium alloys, and tin alloys.

上述金屬構件之製造方法並沒有特別限定,可採用已知的方法。例如,可舉出藉由在模具中壓入熔融之金屬,而可在短時間大量生產高尺寸精度之鑄物之鑄造方式之高壓鑄造法。又,為了使所製造之金屬構件10成形成所希望的形狀,也可使用藉由工作機械之切削加工等。 The method for producing the above metal member is not particularly limited, and a known method can be employed. For example, a high-pressure casting method in which a casting method of a high-precision casting can be mass-produced in a short time by pressing a molten metal into a mold can be cited. Further, in order to form the metal member 10 to be formed into a desired shape, cutting by a working machine or the like may be used.

一般而言,以高壓鑄造法所製造之鋁壓鑄品而構成之金屬構件,已知難以提高與後述之樹脂構件之密著性,但在本發明中,也可適當採用由鋁壓鑄品構成之金屬構件。 In general, it is known that it is difficult to improve the adhesion to a resin member to be described later by a metal die-cast product produced by a high-pressure casting method. However, in the present invention, an aluminum die-cast product may be suitably used. Metal components.

第3圖係模示地表示樹脂構件20之圖,(a)為立體圖,(b)為底面圖,(c)為OO剖面圖。樹脂構件20,係由熱可 塑性樹脂組成物構成,而形成於金屬構件10上之部位。如第1、3圖所示,在本實施形態中,樹脂構件20為板狀的構件。樹脂構件20,係構成板狀之一個面,具有與上述金屬構件10之接合面11相接之樹脂側接合面21,與形成於該樹脂側接合面21上之凸部22。 Fig. 3 is a view schematically showing the resin member 20, (a) is a perspective view, (b) is a bottom view, and (c) is an OO sectional view. The resin member 20 is made of heat The plastic resin composition is formed to be formed on the metal member 10. As shown in Figs. 1 and 3, in the present embodiment, the resin member 20 is a plate-shaped member. The resin member 20 is formed as one surface of a plate shape, and has a resin side joint surface 21 that is in contact with the joint surface 11 of the metal member 10, and a convex portion 22 formed on the resin side joint surface 21.

樹脂側接合面21,係在樹脂構件20中,與金屬構件10之接合面11相接之部位。在本實施形態中,樹脂側接合面21為平面狀,但在本發明中樹脂側接合面21之形狀並沒有特別限定,例如,也可為曲面狀。 The resin side joint surface 21 is a portion of the resin member 20 that is in contact with the joint surface 11 of the metal member 10. In the present embodiment, the resin-side joint surface 21 is formed in a planar shape. However, the shape of the resin-side joint surface 21 in the present invention is not particularly limited, and may be, for example, a curved surface.

凸部22,係形成於上述樹脂接合面21之凸部,複數之凸部22係形成於上述樹脂側接合面21。凸部22,係在嵌入成形時熔融狀態之熱可塑性樹脂組成物進入上述接合孔12而形成。因此,凸部22的形狀為圓柱狀。又,在本實施形態中,全部的凸部22,係幾乎沒有間隙地插入上述接合孔12內。 The convex portion 22 is formed on the convex portion of the resin joint surface 21, and a plurality of convex portions 22 are formed on the resin side joint surface 21. The convex portion 22 is formed by entering the thermoplastic resin composition in a molten state at the time of insert molding into the joint hole 12. Therefore, the shape of the convex portion 22 is cylindrical. Further, in the present embodiment, all of the convex portions 22 are inserted into the joint hole 12 with almost no gap.

在本發明中,至少2個的凸部22插入接合孔12即可,插入接合孔12之凸部22之數量在3以上也可,一部分的接合孔12中沒有插入凸部22也可。又,在本發明中,凸部22之形狀並沒有特別限定,如上述,由於凸部22係在嵌入成形時形成的,凸部22之形狀會成為對應形成接合孔12之凹部的形狀之形狀。 In the present invention, at least two convex portions 22 may be inserted into the joint hole 12, and the number of the convex portions 22 inserted into the joint hole 12 may be three or more, and the convex portion 22 may not be inserted into a part of the joint holes 12. Further, in the present invention, the shape of the convex portion 22 is not particularly limited. As described above, since the convex portion 22 is formed at the time of insert molding, the shape of the convex portion 22 may be a shape corresponding to the shape of the concave portion forming the joint hole 12. .

又,構成樹脂構件20之熱可塑性樹脂組成物並沒有特別限定,可根據用途等,使用含有所選擇之熱可塑性樹脂之熱可塑性樹脂組成物。做為熱可塑性樹脂之具體例,可 舉出烴烯系樹脂、聚酯系樹脂、聚縮醛系樹脂、聚芳硫醚系樹脂、液晶性樹脂等。又,本發明所使用之熱可塑性樹脂組成物也可含有複數的熱可塑性樹脂。 Further, the thermoplastic resin composition constituting the resin member 20 is not particularly limited, and a thermoplastic resin composition containing the selected thermoplastic resin can be used depending on the application and the like. As a specific example of a thermoplastic resin, A hydrocarbon-based resin, a polyester-based resin, a polyacetal-based resin, a polyarylene sulfide-based resin, a liquid crystalline resin, or the like is exemplified. Further, the thermoplastic resin composition used in the present invention may contain a plurality of thermoplastic resins.

又,熱可塑性樹脂組成物中,只要是在不妨害本發明之效果的範圍,也可含有玻璃纖維等之強化劑、氧化防止劑、安定劑、可塑劑、顏料等已知之添加劑等做為熱可塑性樹脂以外之其他成分。 In addition, the thermoplastic resin composition may contain a known agent such as a reinforcing agent such as glass fiber, an oxidation inhibitor, a stabilizer, a plasticizer, or a pigment, as long as it does not impair the effects of the present invention. Other components than plastic resins.

<嵌入成形體之製造方法> <Method of Manufacturing Inserted Shaped Body>

本發明之嵌入成形體之製造方法,並沒有特別限定,可採用將金屬構件配置於模具內,將熱可塑性樹脂組成物射出於模具內之一般的嵌入成形法。又,射出成形的條件,可根據含有於熱可塑性樹脂組成物之成分等來適宜設定。 The method for producing the insert molded body of the present invention is not particularly limited, and a general insert molding method in which a metal member is placed in a mold and the thermoplastic resin composition is projected into the mold can be employed. Further, the conditions for the injection molding can be appropriately set depending on the components contained in the thermoplastic resin composition and the like.

又,在本發明中,嵌入成形體之樹脂構件,也可在構成樹脂構件之熱可塑性樹脂之玻璃轉換溫度(Tg)-0℃以上Tg+180℃以下之條件進行退火處理。 Further, in the present invention, the resin member embedded in the molded body may be annealed under the conditions of a glass transition temperature (Tg) of -0 ° C or more and Tg + 180 ° C or less of the thermoplastic resin constituting the resin member.

<效果> <effect>

本實施形態之嵌入成形體1,係包括樹脂構件20與金屬構件10之嵌入成形體。上述金屬構件10,係在與上述樹脂構件20之接合面11上具有接合孔12,在接合孔12中,插入樹脂構件20所具有之凸部22。在本實施形態之嵌入成形體1中金屬構件10,由於具有以下之(α)~(γ)之構成,樹脂構件20與金屬構件10之密著力提升。 The insert molded body 1 of the present embodiment includes an insert molded body of the resin member 20 and the metal member 10. The metal member 10 has an engagement hole 12 formed in the joint surface 11 with the resin member 20, and the convex portion 22 of the resin member 20 is inserted into the joint hole 12. In the insert molded body 1 of the present embodiment, the metal member 10 has the following configuration of (α) to (γ), and the adhesion between the resin member 20 and the metal member 10 is improved.

(α)2個以上之接合孔12散在於接合面11而形成 (α) Two or more engagement holes 12 are formed by the joint surface 11

(β)至少1個之接合孔12之開口的面積為0.44mm2以 上19.63mm2以下。 (beta]) at least one opening of the engaging hole 12 of an area of 0.44mm 2 or less than 2 19.63mm.

(γ)樹脂構件20與金屬構件10之接合面的外圍所圍繞的面之面積為S1,在接合面11側之接合孔12之開口的面積總和為S2時,比率S2/S1,滿足以下的不等式(I)。 The area of the surface surrounded by the periphery of the joint surface of the (γ) resin member 20 and the metal member 10 is S 1 , and when the total area of the opening of the joint hole 12 on the joint surface 11 side is S 2 , the ratio S 2 /S 1 , the following inequality (I) is satisfied.

0.04≦S2/S1≦0.80 (I) 0.04≦S 2 /S 1 ≦0.80 (I)

即,在接合面11上,藉由形成滿足不等式(I)之個數之具有特定開口面積之接合孔12,而可使金屬構件10與樹脂構件20之密著力提升。 That is, on the joint surface 11, by forming the joint hole 12 having a specific opening area satisfying the number of inequalities (I), the adhesion between the metal member 10 and the resin member 20 can be improved.

又,嵌入成形體藉由包括上述構成,金屬構件10與樹脂構件20之間之熱傳達順利。 Further, the embedded molded body includes the above-described configuration, and heat transfer between the metal member 10 and the resin member 20 is smooth.

特別是,形成於接合面11之複數的接合孔12,係藉由分布於接合面11之全體而略均一地形成,可使上述金屬構件10與樹脂構件20之密著力提高之效果更提升。又,金屬構件10與樹脂構件20之間的熱傳達也更均一。 In particular, the plurality of joint holes 12 formed in the joint surface 11 are formed slightly uniformly over the entire joint surface 11, and the effect of improving the adhesion between the metal member 10 and the resin member 20 can be further enhanced. Moreover, the heat transfer between the metal member 10 and the resin member 20 is also more uniform.

特別是,接合孔12之開口面積,若為0.64mm2以上3.14mm2以下,則上述金屬構件10與樹脂構件20之密著力提高的效果,熱傳導優良之效果更為提升。 In particular, the engagement hole 12 of the opening area, when the density is more than 0.64 mm 2 3.14 mm 2 or less, then the metal member 10 and the resin member 20 of the focus on improving effect, excellent in thermal conduction effect is more improved.

特別是,樹脂構件20之凸部22插入之接合孔12內之樹脂構件20與金屬構件10之接合面積的總合之面積S3之對於上述面積S1之比率S3/S1,只要滿足以下不等式(II),可使上述金屬構件10與樹脂構件20之密著力提高的效果,熱傳導優良之效果更為提升。 In particular, the sum of the area of the bonded area of the resin component within the resin member projection 20 of the engagement hole 22 is inserted into the 1220 and the metal member 10 of the S. 3 of the ratio of the above-described area S of 1 S 3 / S 1, as long as In the following inequality (II), the adhesion between the metal member 10 and the resin member 20 can be improved, and the effect of excellent heat conduction can be further improved.

0.3≦S3/S1≦3 (II) 0.3≦S 3 /S 1 ≦3 (II)

實施形態之嵌入成形體1,可不使用接著劑等,而可 使嵌入成形體中金屬構件10與樹脂構件20之密著力提高。因此,本實施形態之嵌入成形體1,較使用接著劑等而製造之嵌入成形體生產性高。 The insert molded body 1 of the embodiment can be used without using an adhesive or the like. The adhesion between the metal member 10 and the resin member 20 in the embedded molded body is improved. Therefore, the insert molded body 1 of the present embodiment has higher productivity than the insert molded body produced by using an adhesive or the like.

又,本發明之嵌入成形體,嵌入成形體之製造時即使不進行退火處理,金屬構件10與樹脂構件20之密著力高。如此由於可刪減退火工程,因此本發明之嵌入成形體,可以非常高的生產性製造。 Further, in the insert molding of the present invention, the adhesion between the metal member 10 and the resin member 20 is high even in the production of the insert molded body without performing the annealing treatment. Thus, since the annealing process can be omitted, the insert molded body of the present invention can be manufactured with high productivity.

又,通常之嵌入成形後也可施以退火處理,藉由對於嵌入成形體施以退火處理,更可提高樹脂構件與金屬構件之密著力。 Further, in general, after the insert molding, an annealing treatment may be applied, and by applying an annealing treatment to the insert molded body, the adhesion between the resin member and the metal member can be further improved.

又,提高金屬構件10與樹脂構件20之密著力等之上述效果,在金屬構件10是由鋁壓鑄品構成之情況也有效。在以往所使用之方法的情況,金屬構件10若由鋁壓鑄品構成,則對於鋁壓鑄品之藉由化學蝕刻等之粗面化有困難,因此要提高樹脂構件20與金屬構件10之密著力特別困難。然而,如上述,根據本發明,即使金屬構件10為鋁壓鑄品構成的情況,也可使樹脂構件與金屬構件之密著力提高。 Moreover, the above-described effects of improving the adhesion between the metal member 10 and the resin member 20 and the like are also effective when the metal member 10 is made of an aluminum die-cast product. In the case of the conventionally used method, when the metal member 10 is made of an aluminum die-cast product, it is difficult to roughen the aluminum die-casting product by chemical etching or the like. Therefore, the adhesion between the resin member 20 and the metal member 10 is increased. Particularly difficult. However, as described above, according to the present invention, even when the metal member 10 is formed of an aluminum die-cast product, the adhesion between the resin member and the metal member can be improved.

<第二實施形態> <Second embodiment>

接著,對於本發明之嵌入成形體之第二實施形態,一邊參照第4圖一邊說明。本實施形態之嵌入成形體1A,係同於第一實施形態之嵌入成形體1,為直方體狀,第4圖係模式地顯示第二實施形態之嵌入成形體1A之剖面之圖。又,關於第二實施形態以後之說明,對於同一構成要 件賦予同一符號,省略或簡略化其說明。 Next, a second embodiment of the insert molded body of the present invention will be described with reference to Fig. 4 . The insert molded body 1A of the present embodiment is a rectangular parallelepiped shape as in the insert molded body 1 of the first embodiment, and Fig. 4 is a view schematically showing a cross section of the insert molded body 1A of the second embodiment. Further, with regard to the description of the second embodiment, the same configuration is required. The same reference numerals are given to the same symbols, and the description thereof is omitted or simplified.

第二實施形態之嵌入成形體1A,主要是形成於金屬構件10A之接合面11A之接合孔12A為貫通接合面11A與其裡側的面之貫通孔之構成與第一實施形態不同。 The insert molded body 1A of the second embodiment is mainly different from the first embodiment in that the joint hole 12A formed in the joint surface 11A of the metal member 10A is a through hole that penetrates the joint surface 11A and the inner surface thereof.

又,接合孔12A,貫通接合面11A與其裡側的面之結果,樹脂構件20與金屬構件10之面積S1、樹脂構件20A之凸部22A插入之接合孔12A內的樹脂構件20A與金屬構件10A之接合面積之總和之面積S3,在第一實施形態與第二實施形態不同,但可藉由同於上述第一實施形態所說明之方法,來決定這些面積。 Further, the engaging holes 12A, 11A through the results of its bonding face of the back side of the resin member 20 and the metal member 10 of the area S 1, the resin member 20A of the projecting portion 22A of the insert 20A and the metal member bonding resin member within bore 12A The area S 3 of the sum of the joint areas of 10A is different from that of the second embodiment in the first embodiment, but these areas can be determined by the method described in the first embodiment.

第二實施形態之嵌入成形體1A,可以同於第一實施形態之嵌入成形體1之方法來製造。 The insert molded body 1A of the second embodiment can be produced in the same manner as the method of inserting the molded body 1 of the first embodiment.

藉由第二實施形態之嵌入成形體1A,除了具有上述第一實施形態之嵌入成形體1之效果以外,還具有以下效果。 According to the insert molding 1A of the second embodiment, in addition to the effect of the insert molding 1 of the first embodiment, the following effects are obtained.

在第二實施形態之嵌入成形體1A,形成於金屬構件10A之接合面11A之接合孔12A,由於貫通接合面11A與其裡側之面,因此金屬構件10與樹脂構件20之接合面的面積變大,而更可使金屬構件10A與樹脂構件20A密著之效果提高。 In the insert molding 1A of the second embodiment, the joint hole 12A formed in the joint surface 11A of the metal member 10A penetrates the surface of the joint surface 11A and the back side thereof, so that the area of the joint surface of the metal member 10 and the resin member 20 becomes The effect of making the metal member 10A and the resin member 20A adhere to each other is improved.

<第三實施形態> <Third embodiment>

接著,對於本發明之嵌入成形體之第三實施形態,一邊參照第5圖一邊說明。本實施形態之嵌入成形體1B,係同於第一實施形態之嵌入成形體1、第二實施形態之嵌入成形體1A,為直方體狀,第5圖係模式地顯示第三實施形 態之嵌入成形體1B之剖面之圖。 Next, a third embodiment of the insert molded body of the present invention will be described with reference to Fig. 5. The insert molding 1B of the present embodiment is the same as the insert molding 1 of the first embodiment, and the insert molding 1A of the second embodiment has a rectangular parallelepiped shape, and the fifth embodiment schematically shows the third embodiment. A diagram of a cross section of the molded body 1B.

第三實施形態之嵌入成形體1B,主要是形成於金屬構件10B之接合面11B之接合孔12B為貫通接合面11B與其裡側的面之貫通孔之構成,至少在一部分之接合孔12B中,在接合孔12B之既定深度方之深度方向的剖面積,較在較上述之既定位置還深之位置的上度深度方向的剖面積小之構成與第一實施形態不同。 The insert molding 1B of the third embodiment is mainly configured such that the joint hole 12B formed in the joint surface 11B of the metal member 10B is a through hole penetrating through the joint surface 11B and the back surface thereof, at least in a part of the joint hole 12B. The cross-sectional area in the depth direction of the predetermined depth of the joint hole 12B is smaller than the cross-sectional area in the upper depth direction at a position deeper than the predetermined position described above, and is different from the first embodiment.

接合孔12B之形狀,為兩個延伸於貫通方向(接合孔12B之深度方向)之圓柱狀的孔連在一起的形狀。接合面11B側之圓柱狀的孔之貫通方向的剖面的半徑,較接合面11B之裡側的面側之圓柱狀的孔之貫通方向的剖面之半徑小。因此,兩個圓柱狀之孔連結的部分,存在著段差狀的錨部13B。 The shape of the engaging hole 12B is a shape in which two cylindrical holes extending in the through direction (depth direction of the engaging hole 12B) are joined together. The radius of the cross section of the columnar hole on the joint surface 11B side in the penetration direction is smaller than the radius of the cross section of the columnar hole in the back side of the joint surface 11B. Therefore, in the portion where the two cylindrical holes are joined, there is a stepped anchor portion 13B.

在以一般的嵌入成形法製造嵌入成形體1B之情況,樹脂構件20B之凸部22B,係藉由在接合孔12B中流入熔融狀態之熱可塑性樹脂組成物而形成。因此,接合部12B上若形成錨部13B,則凸部22B,係如第5圖所示,具有在凸部22B之延伸方向兩個延伸之圓柱連在一起之形狀。 In the case where the insert molded body 1B is produced by a general insert molding method, the convex portion 22B of the resin member 20B is formed by flowing a thermoplastic resin composition in a molten state in the joint hole 12B. Therefore, when the anchor portion 13B is formed in the joint portion 12B, the convex portion 22B has a shape in which two columns extending in the extending direction of the convex portion 22B are joined together as shown in Fig. 5.

第三實施形態之嵌入成形體1B,可用同於第一實施形態之嵌入成形體1之方法來製造。 The insert molded body 1B of the third embodiment can be produced by the same method as the insert molded body 1 of the first embodiment.

藉由第三實施形態之嵌入成形體1B,除了具有上述第一實施形態之嵌入成形體1之效果以外,還具有以下效果。 According to the insert molded body 1B of the third embodiment, in addition to the effect of the insert molded body 1 of the first embodiment described above, the following effects are obtained.

第三實施形態之嵌入成形體1B之金屬構件10B,如上述,具有錨部13B。因此,如第5圖所示,在嵌入成形體 1B之接合孔12B內,樹脂構件20B的凸部22B,如勾住錨部13B而形成。其結果,金屬構件10B與樹脂構件20B變得難以分離。 The metal member 10B of the insert molded body 1B of the third embodiment has the anchor portion 13B as described above. Therefore, as shown in Fig. 5, in the embedded molded body In the joint hole 12B of 1B, the convex portion 22B of the resin member 20B is formed by hooking the anchor portion 13B. As a result, the metal member 10B and the resin member 20B become difficult to separate.

如上述之錨部13B,係勾住凸部22B之部分,如本實施形態,勾住的部分若為環狀,則金屬構件10B與樹脂構件20B之不易分開的效果更提高。 As described above, the anchor portion 13B is a portion that hooks the convex portion 22B. As in the present embodiment, if the hooked portion is annular, the effect of the metal member 10B and the resin member 20B being separated from each other is further improved.

<其他變形例> <Other Modifications>

以上,對於本發明之嵌入成形體之較佳之各實施形態做了說明,但本發明並非限制於上述實施形態,而可以各種的形態實施。 Although the preferred embodiments of the insert molded body of the present invention have been described above, the present invention is not limited to the above embodiment, and can be implemented in various forms.

在第一實施形態,接合孔12雖為圓柱狀的凹部,但可如第6圖(a)所示,接合孔12之深度方向的剖面積在不同深度而不同也可。例如,在第6圖(a),接合孔12之深度方向的形狀成斜坡狀。又,在第二實施形態中,也可使接合孔12之深度方向之剖面積在不同深度而不同。 In the first embodiment, the engagement hole 12 is a cylindrical recess. However, as shown in Fig. 6(a), the cross-sectional area in the depth direction of the joint hole 12 may be different at different depths. For example, in Fig. 6(a), the shape of the joint hole 12 in the depth direction is sloped. Further, in the second embodiment, the cross-sectional area in the depth direction of the joint hole 12 may be different at different depths.

又,如第三實施形態,在接合孔12之既定深度之深度方向的剖面積,即使不是如上述,在較既定深度還深的位置之上述深度方向的剖面積變得更小之構成,為使凸部22勾在接合孔12內,可形成錨部13。例如,如第6圖(b)所示,接合孔12之形狀,為往接合孔12之深度方向延伸之圓柱狀的孔錯開而連在一起的形狀。如第6圖(b)所示,在兩個圓柱連結之部分形成錨部13。 Further, in the third embodiment, the cross-sectional area in the depth direction of the predetermined depth of the joint hole 12 is smaller than the cross-sectional area in the depth direction at a position deeper than the predetermined depth as described above. The anchor portion 13 can be formed by hooking the convex portion 22 into the joint hole 12. For example, as shown in Fig. 6(b), the shape of the joint hole 12 is a shape in which the cylindrical holes extending in the depth direction of the joint hole 12 are shifted and joined together. As shown in Fig. 6(b), the anchor portion 13 is formed in a portion where the two cylinders are joined.

<散熱構造體> <heat dissipation structure>

本發明之散熱構造體,係具有上述本發明之嵌入成形 體與熱源。做為散熱構造體之一例,使用第7圖,說明包括第一實施形態之嵌入成形體1之散熱構造體2。第7圖係模式地顯示本實施形態之散熱構造體2之立體圖。 The heat dissipating structure of the present invention has the above-described insert molding of the present invention Body and heat source. As an example of the heat dissipation structure, the heat dissipation structure 2 including the insert molded body 1 of the first embodiment will be described with reference to Fig. 7. Fig. 7 is a perspective view showing the heat dissipation structure 2 of the present embodiment.

本實施形態之散熱構造體2,係包括嵌入成形體1與熱源3,嵌入成形體1之樹脂構件20與熱源3接觸。 The heat dissipation structure 2 of the present embodiment includes the molded body 1 and the heat source 3, and the resin member 20 embedded in the molded body 1 is in contact with the heat source 3.

熱源3,只要為發熱者即可而沒有特別限定。例如,可舉出積體電路(IC)、CPU等電子零件、電池等。又,在本實施形態熱源3與樹脂構件20接觸,但熱源3與樹脂構件20也可不接觸。 The heat source 3 is not particularly limited as long as it is a fever. For example, an integrated circuit (IC), an electronic component such as a CPU, a battery, or the like can be given. Further, in the present embodiment, the heat source 3 is in contact with the resin member 20, but the heat source 3 and the resin member 20 may not be in contact with each other.

樹脂構件20,係受熱來自熱源3之熱的受熱部。又,樹脂構件20,係將從熱源3受到的熱傳送到金屬構件10。為了使熱傳達順利進行,樹脂構件20之熱傳導率為1W/m.K以上,20W/m.K以下。又,做為為了滿足上述之熱傳導率之修件而使用之熱可塑性樹脂組成物,可舉例在一般的熱可塑性樹脂中,添加為了賦予熱傳導率之配合劑之物。 The resin member 20 is a heat receiving portion that receives heat from the heat source 3. Further, the resin member 20 transfers heat received from the heat source 3 to the metal member 10. In order to make the heat transfer smoothly, the thermal conductivity of the resin member 20 is 1 W/m. K or more, 20W/m. Below K. Moreover, as a thermoplastic resin composition used for satisfying the above-mentioned heat conductivity repairing material, a compound for imparting a heat conductivity to a compounding agent can be added to a general thermoplastic resin.

在此,做為賦予熱傳導率之配合劑,可舉例金、銀、銅、鋁、鐵、鎂、鎳等之金屬及這些金屬之合金,氧化鋁、氧化鎂、氧化矽、氧化鋅、氧化鈹、氧化酮、氧化亞銅等之金屬氧化物,氮化硼、氮化鋁、氮化矽等之金屬氮化物、碳化矽等之金屬碳化物,碳、石墨、鑽石等之碳材料等。 Here, as a compounding agent for imparting thermal conductivity, metals such as gold, silver, copper, aluminum, iron, magnesium, nickel, and the like, and alloys of these metals, alumina, magnesia, cerium oxide, zinc oxide, and cerium oxide can be exemplified. Metal oxides such as oxidized ketone and cuprous oxide; metal nitrides such as boron nitride, aluminum nitride, and tantalum nitride; metal carbides such as tantalum carbide; and carbon materials such as carbon, graphite, and diamond.

金屬構件10,係將從樹脂構件20受到之熱散熱之散熱部。金屬構件10,只要為對於金屬構件10之外部散出熱之物即可。因此,金屬構件10與其他零件接觸,將熱送 至該零件也可。為了順利進行熱的傳達,金屬構件10之熱傳導率在20 W/m.K以上400 W/m.K以下。更佳的情況為在100 W/m.K以上400 W/m.K以下。又,做為滿足上述熱傳導率之條件之金屬,可舉出鋁壓鑄品、銅等。 The metal member 10 is a heat radiating portion that dissipates heat received from the resin member 20. The metal member 10 may be any one that radiates heat to the outside of the metal member 10. Therefore, the metal member 10 is in contact with other parts, and the heat is sent It is also possible to the part. In order to smoothly carry out the heat transfer, the thermal conductivity of the metal member 10 is 20 W/m. K above 400 W/m. Below K. A better case is at 100 W/m. K above 400 W/m. Below K. Moreover, as a metal which satisfies the conditions of the above thermal conductivity, aluminum die-casting products, copper, etc. are mentioned.

此外,本發明之散熱構造體係包括樹脂構件20,在樹脂構件20上形成肋或塑膠柱之情況很多。本發明之散熱構造體,由於可藉由嵌入成形法來製造散熱構造體,可在形成樹脂構件20之同時,形成塑膠柱或肋。 Further, the heat dissipation structure system of the present invention includes the resin member 20, and a large number of ribs or plastic columns are formed on the resin member 20. In the heat dissipation structure of the present invention, since the heat dissipation structure can be manufactured by the insert molding method, the resin member 20 can be formed and a plastic column or rib can be formed.

又,即使不添加如上述之配合劑,在滿足上述熱傳導率之情況,樹脂構件20也可不含有如上述之配合劑。 Further, even if the above-mentioned compounding agent is not added, the resin member 20 may not contain the above-mentioned compounding agent in the case where the above thermal conductivity is satisfied.

又,金屬構件10,樹脂構件20之形狀,並沒有特別限定,可根據散熱構造體之用途等來決定。 Further, the shape of the metal member 10 and the resin member 20 is not particularly limited, and can be determined depending on the use of the heat dissipation structure or the like.

最後對於散熱構造體之用途例說明。本發明之散熱構造體之較佳的用途為直流轉直流電源轉換器。直流轉直流電源轉換器,係包括線圈,此線圈成為熱源3。此線圈,係如捲付在樹脂構件上而接觸。在線圈發生的熱,會傳達至樹脂構件,更且,從樹脂構件傳達至金屬構件,最後散出於散熱構造體之外部。 Finally, an example of the use of the heat dissipation structure will be described. A preferred use of the heat dissipation structure of the present invention is a DC to DC power converter. The DC-to-DC power converter includes a coil that becomes a heat source 3. This coil is attached as a roll to a resin member. The heat generated in the coil is transmitted to the resin member, and is transmitted from the resin member to the metal member, and finally to the outside of the heat dissipation structure.

在直流轉直流電源轉換器之樹脂構件20之形狀,並沒有特別限定,可考慮線圈的容易捲取程度等來決定。又,構成樹脂構件20之熱可塑性樹脂之種類,係考慮耐熱性、耐熱衝擊性、耐電痕性等而決定,在本用途中,做為熱可塑性樹脂,以聚芳硫醚系樹脂、聚對苯二甲酸丁二酯系樹脂之使用為佳。 The shape of the resin member 20 of the DC-to-DC power converter is not particularly limited, and can be determined in consideration of the degree of easy coiling of the coil and the like. Moreover, the type of the thermoplastic resin constituting the resin member 20 is determined in consideration of heat resistance, thermal shock resistance, electric tracking resistance, etc., and in the present application, it is a thermoplastic resin, a polyarylene sulfide-based resin, and a poly-pair. The use of a butyl phthalate-based resin is preferred.

在直流轉直流電源轉換器中金屬構件10為散熱片為佳。散熱片,係為了使表面積大而包括劍山狀或蛇腹狀之突起物。為了形成如此之突起物,對於構成金屬構件10之材料,除了要求高熱傳導性以外,還要求優良的成形性。做為兼具高熱傳導性與優良成形性之材料,可舉出鋁壓鑄品。 In the DC-to-DC power converter, the metal member 10 is preferably a heat sink. The heat sink is a protrusion of a sword-like or bell-shaped shape in order to make the surface area large. In order to form such a projection, excellent materiality is required for the material constituting the metal member 10 in addition to high thermal conductivity. As a material which has both high thermal conductivity and excellent formability, aluminum die-casting products are mentioned.

【實施例】 [Examples]

以下,顯示實施例及比較例,而更具體說明本發明,但本發明並非限定於這些的實施例。 Hereinafter, the present invention will be more specifically described by showing examples and comparative examples, but the present invention is not limited to the examples.

<嵌入成形體之製造方法> <Method of Manufacturing Inserted Shaped Body>

在實施例及比較例所使用之嵌入成形體之模式圖示於第8圖。(a)為分解立體圖,(b)為立體圖,(c)為金屬構件。此嵌入成形體係以以下方法製造。又,圖中尺寸的單位為mm。 The mode of the insert molded body used in the examples and the comparative examples is shown in Fig. 8. (a) is an exploded perspective view, (b) is a perspective view, and (c) is a metal member. This insert molding system was produced in the following manner. Also, the unit of the size in the figure is mm.

做為構成樹脂構件之熱可塑性樹脂組成物,使用聚芳硫醚系樹脂組成物1(寶理塑料(polyplastics)公司製,「RSF-10719」,熱傳導率:0.4W/m.K,以下稱為「0.4W材」),聚芳硫醚系樹脂組成物2(寶理塑料(polyplastics)公司製,「RSF-10387」,熱傳導率:2.0W/m.K,以下稱為「2W材」)。 As the thermoplastic resin composition constituting the resin member, a polyarylene sulfide-based resin composition 1 ("RSF-10719" manufactured by Polyplastics Co., Ltd.) was used, and the thermal conductivity was 0.4 W/m.K, hereinafter referred to as "0.4W material"), polyarylene sulfide resin composition 2 ("RSF-10387" manufactured by Polyplastics Co., Ltd., thermal conductivity: 2.0W/m.K, hereinafter referred to as "2W material" ).

做為金屬構件,使用由鋁壓鑄物ADC-12(熱傳導率:96 W/m.K)構成之板狀物。這些板狀的金屬構件,具有第8圖(a)之斜線所示部分之接合面。接合面上8個接合孔排 成兩列。所使用之金屬構件,為以下的6種類,僅有接合孔之形狀不同。 As the metal member, a plate composed of an aluminum die-casting ADC-12 (thermal conductivity: 96 W/m.K) was used. These plate-shaped metal members have joint faces of the portions indicated by oblique lines in Fig. 8(a). 8 joint holes on the joint surface In two columns. The metal members used are the following six types, and only the shapes of the joint holes are different.

金屬構件1:為第2圖所示之沒有貫通的接合孔,接合孔之凹部的形狀為圓柱狀。接合孔之開口緣所形成之圓的直徑為0.5mm。凹部的底部位置在接合孔深度方向(孔延伸的方向)之中間。 The metal member 1 is an engagement hole that does not penetrate as shown in Fig. 2, and the concave portion of the engagement hole has a cylindrical shape. The diameter of the circle formed by the opening edge of the engaging hole was 0.5 mm. The bottom position of the recess is in the middle of the depth direction of the joint hole (the direction in which the hole extends).

金屬構件2:為第4圖所示之貫通的接合孔,接合孔之貫通孔的形狀為圓柱狀。接合孔之開口緣所形成之圓的直徑為0.5mm。 The metal member 2 is a through hole penetrating as shown in Fig. 4, and the through hole of the joint hole has a cylindrical shape. The diameter of the circle formed by the opening edge of the engaging hole was 0.5 mm.

金屬構件3:為第5圖所示之具有錨部的接合孔,而貫通。貫通孔之形狀,同於第5圖,為兩個圓柱連在一起的形狀,在接合面側接合孔之開口緣所形成之圓的直徑為0.5mm。錨部的底部位置在接合孔深度方向(孔延伸的方向)之中間。 The metal member 3 is a joint hole having an anchor portion as shown in Fig. 5 and penetrates. The shape of the through hole is the same as that of Fig. 5, in which the two cylinders are joined together, and the diameter of the circle formed by the opening edge of the joint surface side engagement hole is 0.5 mm. The bottom position of the anchor portion is in the middle of the depth direction of the joint hole (the direction in which the hole extends).

金屬構件4:為第2圖所示之沒有貫通的接合孔,接合孔之凹部的形狀為圓柱狀。接合孔之開口緣所形成之圓的直徑為1mm。凹部的底部位置在接合孔深度方向(孔延伸的方向)之中間。 The metal member 4 is an engagement hole that does not penetrate as shown in Fig. 2, and the concave portion of the engagement hole has a cylindrical shape. The circle formed by the opening edge of the engaging hole has a diameter of 1 mm. The bottom position of the recess is in the middle of the depth direction of the joint hole (the direction in which the hole extends).

金屬構件5:為第4圖所示之貫通的接合孔,接合孔之貫通孔的形狀為圓柱狀。接合孔之開口緣所形成之圓的直徑為1mm。 The metal member 5 is a through hole penetrating as shown in Fig. 4, and the through hole of the joint hole has a cylindrical shape. The circle formed by the opening edge of the engaging hole has a diameter of 1 mm.

金屬構件6:為第5圖所示之具有錨部的接合孔,而貫通。貫通孔之形狀,同於第5圖,為兩個圓柱連在一起的形狀,在接合面側接合孔之開口緣所形成之圓的直徑為 1mm。錨部位置在接合孔深度方向(孔延伸的方向)之中間。 The metal member 6 is a joint hole having an anchor portion as shown in Fig. 5 and penetrates. The shape of the through hole is the same as that of Fig. 5, and the diameter of the circle formed by the opening edge of the joint hole on the joint surface side is 1mm. The anchor position is in the middle of the joint hole depth direction (the direction in which the hole extends).

對於各金屬構件,面積S1、S2、S3以及比率S2/S1、S3/S1示於表1。又,如上述,由於面積S1係指在金屬構件中與樹脂構件之接合面的外圍所圍繞的面積,因此不會因為接合孔的開口面積而不同。 The area S 1 , S 2 , S 3 and the ratios S 2 /S 1 and S 3 /S 1 are shown in Table 1 for each metal member. Further, as described above, since the area S1 refers to the area surrounded by the outer periphery of the joint surface of the metal member and the resin member, it does not differ depending on the opening area of the joint hole.

將這些金屬構件分別配置於模具中,進行嵌入成形。成形條件為下述。嵌入成形體之形狀係如第8圖所示。 These metal members are placed in a mold separately for insert molding. The molding conditions are as follows. The shape of the embedded molded body is as shown in Fig. 8.

[成形條件] [forming conditions]

成形機:Sodick TR-40VR(縱型成形機) Forming machine: Sodick TR-40VR (longitudinal forming machine)

加熱筒溫度:310℃-320℃-310℃-290℃ Heating cylinder temperature: 310 ° C - 320 ° C - 310 ° C - 290 ° C

模具溫度:160℃ Mold temperature: 160 ° C

射出速度:100mm/s Injection speed: 100mm/s

保壓力:98MPa×5秒 Pressure: 98MPa × 5 seconds

<評價> <evaluation>

對於以上述方法所做成之嵌入成形體,進行接合部分 之密著強度,以及熱傳導性之評價。具體的評價方法係如下述。 For the insert molded body formed by the above method, the joint portion is joined The adhesion strength and the evaluation of thermal conductivity. The specific evaluation method is as follows.

[密著強度] [tightness strength]

密著強度的評價,係使用萬能拉力試驗機UTA-50kN(Orientek公司製)做為測定機器,以測定速度為1mm/分之條件進行。又,評價係如第9圖所示,將嵌入成形體或接著體配置於台座上,藉由往箭號方向(相對於台座的表面為垂直方向)拉伸來測定接著強度。測定結果示於表2(3次的平均)。密著強度之單位為N。又,表2將樹脂構件為2W材者與0.4W材者分開彙整。表中之金屬構件,表示使用於試料之嵌入成形體之金屬構件。例如,表中之金屬構件1係指使用金屬構件1製作嵌入成形體。 The evaluation of the adhesion strength was carried out using a universal tensile tester UTA-50kN (manufactured by Orientek Co., Ltd.) as a measuring device at a measurement speed of 1 mm/min. Further, as shown in Fig. 9, the evaluation was carried out by arranging the embedded molded body or the bonded body on the pedestal and stretching in the direction of the arrow (the direction perpendicular to the surface of the pedestal) to measure the adhesion strength. The measurement results are shown in Table 2 (average of 3 times). The unit of adhesion strength is N. Further, in Table 2, the resin member was made into a 2W material and the 0.4W material was separately collected. The metal member in the table indicates a metal member used for inserting a molded body into a sample. For example, the metal member 1 in the table refers to the use of the metal member 1 to produce an insert molded body.

※將嵌入成形體從模具脫模時,樹脂構件之一部分殘留在模具側而剝離,因此沒有進行測定。 * When the insert molded body was released from the mold, one of the resin members remained on the mold side and peeled off, so that measurement was not performed.

如表2所示,藉由在金屬構件形成特定大小之接合孔,可使金屬構件與樹脂構件之密著性提高。又,此密著力提高的效果,即使不將嵌入成形體進行退火處理也有效。又,接合孔為貫通孔之情況,只要為形成了錨部的接合孔,密著力更為提升。 As shown in Table 2, by forming a joint hole of a specific size in the metal member, the adhesion between the metal member and the resin member can be improved. Moreover, the effect of improving the adhesion is effective even if the embedded molded body is not subjected to annealing treatment. Further, the joint hole is a through hole, and the adhesion is further increased as long as the joint hole is formed.

[熱傳導性之評價] [Evaluation of Thermal Conductivity]

如第10圖所示將樹脂構件切斷,在樹脂構件之切斷面塗布高熱傳導散熱膏(AS-04/Ainex公司製),使其接觸加熱器。又,使金屬部與加熱器之最短距離成為10mm來製作試料。 The resin member was cut as shown in Fig. 10, and a high heat conduction heat-dissipating paste (manufactured by AS-04/Ainex Co., Ltd.) was applied to the cut surface of the resin member to contact the heater. Further, a sample was prepared by setting the shortest distance between the metal portion and the heater to 10 mm.

如第10圖所示,測定在150℃、20分之條件下加熱後之試料全體之溫度。測定係使用紅外線熱影像(股份有限公司Chino製,「ThermaCAM CPA-7800」)。結果示於第11圖。 As shown in Fig. 10, the temperature of the entire sample after heating at 150 ° C for 20 minutes was measured. Infrared thermal imaging ("ThermaCAM CPA-7800", manufactured by Chino Co., Ltd.) was used for the measurement. The results are shown in Figure 11.

從第11圖的結果,可確認到藉由形成特定的接合孔,樹脂構件與金屬構件之間的熱傳導性為可滿足的程度(與使用接著體為同等程度),而使用熱傳導性良好之材料做為樹脂材料,熱傳導也良好。 From the results of Fig. 11, it was confirmed that the thermal conductivity between the resin member and the metal member was satisfactory (to the same extent as the use of the adherend) by forming a specific joint hole, and a material having good thermal conductivity was used. As a resin material, heat conduction is also good.

1、1A、1B‧‧‧嵌入成形體 1, 1A, 1B‧‧‧ embedded molded body

10、10A、10B‧‧‧金屬構件 10, 10A, 10B‧‧‧Metal components

11、11B‧‧‧接合面 11, 11B‧‧‧ joint surface

12、12B‧‧‧接合孔 12, 12B‧‧‧ joint hole

13、13B‧‧‧錨部 13, 13B‧‧‧ anchor

20、20A、20B‧‧‧樹脂構件 20, 20A, 20B‧‧‧ resin components

21‧‧‧樹脂側接合面 21‧‧‧Resin side joint

22、22B‧‧‧凸部 22, 22B‧‧‧ convex

2‧‧‧散熱構造體 2‧‧‧heating structure

3‧‧‧熱源 3‧‧‧heat source

第1圖係模示地表示第一實施形態之嵌入成形體之圖,(a)為立體圖,(b)為MM剖面圖。 Fig. 1 is a view schematically showing the insert molded body of the first embodiment, wherein (a) is a perspective view and (b) is a MM cross-sectional view.

第2圖係模示地表示第一實施形態之嵌入成形體之金屬構件之圖,(a)為立體圖,(b)為平面圖,(c)為NN剖面圖。 Fig. 2 is a view schematically showing a metal member of an insert molded body according to the first embodiment, wherein (a) is a perspective view, (b) is a plan view, and (c) is a NN cross-sectional view.

第3圖係模示地表示第一實施形態之嵌入成形體之樹脂構件之圖,(a)為立體圖,(b)為底面圖,(c)為OO剖面圖。 Fig. 3 is a view schematically showing a resin member of the insert molding of the first embodiment, wherein (a) is a perspective view, (b) is a bottom view, and (c) is an OO cross-sectional view.

第4圖係模示地表示第二實施形態之嵌入成形體之 圖。 Fig. 4 is a view schematically showing the insert molded body of the second embodiment Figure.

第5圖係模示地表示第三實施形態之嵌入成形體之圖。 Fig. 5 is a view schematically showing the insert molded body of the third embodiment.

第6圖(a)、(b)係模式地表示變形例之嵌入成形體之圖。 Fig. 6(a) and Fig. 6(b) are diagrams schematically showing an insert molded body according to a modification.

第7圖係模式地表示本實施形態之散熱構造體之立體圖。 Fig. 7 is a perspective view schematically showing a heat dissipation structure of the embodiment.

第8圖係模式地表示在實施例及比較例所使用之嵌入成形體之圖,(a)為分解立體圖,(b)為立體圖,(c)為金屬構件。 Fig. 8 is a view schematically showing an insert molded body used in the examples and the comparative examples, wherein (a) is an exploded perspective view, (b) is a perspective view, and (c) is a metal member.

第9圖係表示密著強度之評價方法之圖。 Fig. 9 is a view showing a method of evaluating the adhesion strength.

第10圖(a)、(b)係表示熱傳導性之評價方法及評價試料之圖。 Fig. 10 (a) and (b) are views showing a method of evaluating thermal conductivity and an evaluation sample.

第11圖係表示在熱傳導性之評價被加熱之試料的溫度之圖。 Fig. 11 is a graph showing the temperature of a sample heated by evaluation of thermal conductivity.

1‧‧‧嵌入成形體 1‧‧‧Insert molded body

10‧‧‧金屬構件 10‧‧‧Metal components

20‧‧‧樹脂構件 20‧‧‧Resin components

Claims (9)

一種嵌入成形體,包括樹脂構件與金屬構件,其中,前述金屬構件具有散在於與前述樹脂構件之接合面而形成之2個以上的接合孔,至少1個前述接合孔之開口部分的面積為0.44mm2以上19.63mm2以下,前述樹脂構件具有插入上述接合孔之凸部,前述樹脂構件與前述金屬構件之接合面的外圍所圍繞的面之面積為S1,在上述接合面側之前述接合孔之開口的面積總和為S2時,比率S2/S1,滿足以下的不等式(I):0.04≦S2/S1≦0.80 (I)。 An insert molded body comprising a resin member and a metal member, wherein the metal member has two or more joining holes formed by a joint surface with the resin member, and an opening portion of at least one of the joint holes has an area of 0.44 2 mm 2 or more or less 19.63mm, the resin member has a convex portion is inserted into the engaging hole, the area of the peripheral surface of the bonding surface of the resin member and the metal member is surrounded by the S 1, engaged in the bonding surface side of the above-described When the sum of the areas of the openings of the holes is S 2 , the ratio S 2 /S 1 satisfies the following inequality (I): 0.04 ≦ S 2 / S 1 ≦ 0.80 (I). 如申請專利範圍第1項之嵌入成形體,其中,至少1個的前述接合孔的開口部分的面積為0.64mm2以上3.14mm2以下。 The patentable scope of application of the insert molded item 1, wherein at least a portion of the area of the opening of the engaging holes is 0.64 mm 2 or less than 2 3.14mm. 如申請專利範圍第1或2項之嵌入成形體,其中,前述接合孔,係分布在前述接合面之略全體而形成。 The insert molded body according to claim 1 or 2, wherein the joint hole is formed to be distributed over the entire joint surface. 如申請專利範圍第1或2項之嵌入成形體,其中,對於前述面積S1,全部的接合孔內中樹脂構件與金屬構件的接合面積總和之面積S3的比率S3/S1,係滿足以下的不等式(II):0.3≦S3/S1≦3 (II)。 The patentable scope of application of the two embedded or molded into 1, wherein the sum of the bonding area to the area of the area S 1, all of the engagement hole in a resin member and a metal member of a ratio S 3 S 3 / S 1, line The following inequality (II) is satisfied: 0.3 ≦ S 3 / S 1 ≦ 3 (II). 如申請專利範圍第1或2項之嵌入成形體,其中,前述接合孔,為貫通前述金屬構件之貫通孔。 The insert molded body according to claim 1 or 2, wherein the joint hole is a through hole penetrating the metal member. 如申請專利範圍第1或2項之嵌入成形體,其中,至少一部分之前述接合孔之在前述接合孔的既定深度之深 度方向的剖面積,較比前述既定深度還深之位置之前述深度方向之剖面積小。 An insert molded body according to claim 1 or 2, wherein at least a part of said joint hole has a depth of a predetermined depth of said joint hole The cross-sectional area in the degree direction is smaller than the cross-sectional area in the depth direction at a position deeper than the predetermined depth. 如申請專利範圍第1或2項之嵌入成形體,其中,前述金屬構件是由鋁壓鑄所構成。 The insert molded body according to claim 1 or 2, wherein the metal member is made of aluminum die-casting. 如申請專利範圍第1或2項之嵌入成形體,其中,前述樹脂構件,係由熱可塑性樹脂構成,在前述熱可塑性樹脂之玻璃轉換溫度(Tg)-0℃以上Tg+180℃以下之條件進行退火處理。 The insert molded body according to claim 1 or 2, wherein the resin member is made of a thermoplastic resin, and the glass transition temperature (Tg) of the thermoplastic resin is -0 ° C or more and Tg + 180 ° C or less. Annealing is performed. 一種散熱構造體,包括熱源與申請專利範圍第1或2項之嵌入成形體,其中,前述樹脂構件,為受熱來自前述熱源之熱的受熱部,前述金屬構件,為將前述樹脂構件受熱之熱散熱之散熱部,前述樹脂構件之熱傳導率為1W/m.K以上20W/m.K以下,前述金屬構件之熱傳導率為20W/m.K以上300W/m.K以下。 A heat dissipating structure comprising a heat source and an insert molded body according to claim 1 or 2, wherein the resin member is a heat receiving portion that receives heat from the heat source, and the metal member is a heat that heats the resin member. The heat dissipation portion of the heat dissipating portion has a thermal conductivity of 1 W/m. K above 20W/m. Below K, the thermal conductivity of the aforementioned metal member is 20 W/m. K above 300W/m. Below K.
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