JP2004025647A - Insert, mold, and manufacturing method for them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method which enables the easy manufacture of a mold etc., for use in the formation of a fine structure. <P>SOLUTION: A thin plate 10, where a fine uneven pattern 12 is provided on one surface, is formed, for example, by combining lithography and electro-casting together. An insert 2, which is to be mounted on the mold for the formation of the fine structure, is formed by bonding the thin plate 10 and a base plate 14 together via an adhesive 16. An epoxy resin adhesive, a ceramics adhesive, an inorganic heat-resistant adhesive, an adhesive for anaerobic impregnation, etc., are used as the adhesive 16. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
[Industrial applications]
The present invention relates to a mold used for molding a microstructure by attaching to a general molding machine such as an injection molding machine, a method for manufacturing a nest mounted on the mold, and a method for manufacturing by using these methods. Molds and nests.
[0002]
[Prior art]
Conventionally, an injection molding method and the like have been known as a general method for mass-producing molded articles such as plastics at low cost. In this injection molding method, a mold having a concavo-convex pattern corresponding to the shape of a molded product is used. Such a mold is manufactured by performing machining using an electric discharge machine, a lathe, a grinding machine, or the like, and engraving a predetermined uneven pattern on a metal member.
[0003]
[Problems to be solved by the invention]
By the way, in the case of manufacturing a mold by machining, the processing accuracy of a mechanical device used for the processing determines the dimensional accuracy limit of the concavo-convex pattern imprinted on the mold, but can be achieved by general machining. The processing accuracy is not so high, and is about several tens of μm at present. For this reason, it is not easy to manufacture a metal mold used for forming a fine structure (for example, an optical element or the like) requiring higher processing accuracy (for example, on the order of several tens of nm).
[0004]
Therefore, an object of the present invention is to provide a method for manufacturing a mold or the like that can easily manufacture a mold or the like used for forming a fine structure.
[0005]
Another object of the present invention is to provide a nest and a mold for forming a microstructure which are easy to manufacture.
[0006]
[Means for Solving the Problems]
In order to achieve the above object, the present invention is a method for manufacturing a nest which is mounted on a mold and plays a part in forming a shape of a molded body, wherein a fine pattern to be transferred to the molded body is formed on one surface of a thin plate. Forming a fine pattern, bonding a thin plate and a base material to integrate them, and removing the unnecessary portion of the bonded thin plate and the base material.
[0007]
A thin plate having a fine pattern (for example, a concavo-convex pattern on the order of several tens of nanometers) can be manufactured in the same manner as a so-called stamper used for forming an optical disk such as a CD or DVD. However, since a thin plate formed by such a method is about several mm at most, it is difficult to withstand high temperatures and high pressures, and it is difficult to use it by attaching it to a mold such as a general injection molding machine. It is. On the other hand, as described above, it is also difficult to form a mold having a fine uneven pattern, for example, on the order of tens of nm, by machining.
[0008]
Therefore, in the present invention, a thin plate having a fine pattern is bonded to a base material to increase the strength of the thin plate against high temperatures and high pressures, thereby forming a so-called nest. By mounting this nest on a mold, a fine pattern can be formed by a general injection molding machine or the like. Therefore, it is possible to easily manufacture a mold that can be used in a general injection molding machine or the like to form a molded article having fine irregularities, and a nest used by being mounted on the mold.
[0009]
Preferably, the fine pattern forming step includes a step of forming fine irregularities on the master by a photolithography method. Specifically, a photoresist is applied on a substrate, and the photoresist is intermittently irradiated (exposed) with a laser beam in accordance with the fine pattern, and then developed to reverse the fine pattern. A photoresist having a patterned pattern is prepared. Next, a conductive film is formed on the photoresist, electroforming is performed, and a metal such as nickel is deposited on the photoresist. This makes it possible to easily form a thin plate having a fine pattern and a thickness of about several mm.
[0010]
Preferably, the fine pattern forming step includes a step of forming fine irregularities on the master by mechanical processing. Here, the mechanical processing includes processing methods such as cutting using a cutting tool such as a cutting tool, laser beam processing, and electron beam processing. By such a mechanical processing method, an inverted pattern of a fine pattern is formed on the master, and electroforming is performed using the master, and a metal such as nickel is deposited, thereby forming a few mm having a fine uneven pattern. It is possible to easily form a thin plate of thickness. This mechanical processing method is particularly effective when the size of the concavo-convex pattern to be formed is relatively large (for example, about several μm to several tens μm).
[0011]
Preferably, in the mechanical processing described above, the concave / convex shape is formed by cutting the master into a concave shape. In general, in a mechanical processing method, higher processing accuracy tends to be obtained when performing concave shape processing than when performing convex shape processing. For example, currently, it is possible to obtain a processing accuracy of about 1 μm. Therefore, by processing the concave / convex shape by cutting the master into a concave shape, it is possible to obtain higher processing accuracy even in the case of mechanical processing.
[0012]
Preferably, the fine pattern forming step includes a step of forming a thin plate by performing electroforming using a master having an uneven shape. As described above, in the case of using the photolithography method, an uneven shape is formed in the photoresist on the master, and a thin plate having an uneven pattern is obtained by performing electroforming (electroforming) using the master. Can be easily formed. Similarly, when a mechanical processing method is used, a thin plate having a concavo-convex pattern can be easily formed by forming a concavo-convex shape on the master itself and performing electroforming using the master.
[0013]
Preferably, in the bonding step described above, after applying an adhesive to at least one of the bonding surfaces of the thin plate and the base material, the bonding surfaces are brought into contact with each other to integrate the thin plate and the base material. The use of the adhesive makes it possible to easily attach the thin plate and the base material. Further, with the adhesive interposed between the thin plate and the base material, it is possible to reduce contraction and expansion of the entire nest due to heat.
[0014]
It is more preferable to mix a material having good thermal conductivity into the adhesive. Thereby, heat is easily transmitted from the base material to the thin plate, and it is possible to more accurately transfer a fine pattern of the thin plate during molding of a molded product.
[0015]
Preferably, the above-mentioned adhesive contains at least one of an epoxy resin-based adhesive, a ceramics adhesive, an inorganic heat-resistant adhesive, and an anaerobic impregnating adhesive. By using any of these adhesives, the thin plate and the base material can be securely bonded and integrated.
[0016]
Preferably, the application of the adhesive in the bonding step is performed by either a spray coating method or a spin coating method. According to these methods, it becomes possible to apply the adhesive uniformly over the entire surface to be bonded. These application methods are particularly suitable when the viscosity of the adhesive is low.
[0017]
Preferably, the application of the adhesive in the bonding step is performed by directly dropping the adhesive on the bonding surface, or by spreading the adhesive on the bonding surface using a coating tool. Do. According to these methods, even when the viscosity of the adhesive is high, the adhesive can be surely spread over the bonding surface.
[0018]
Preferably, in the bonding step, after applying the adhesive, air bubbles are removed from the adhesive by placing the thin plate and the base material in a vacuum atmosphere. By removing bubbles contained in the adhesive after application, it becomes possible to further enhance the adhesion between the thin plate and the base material. Further, it is possible to avoid a decrease in the quality of the molded product due to the transfer of the bubbles contained in the adhesive to the molded product through the thin plate.
[0019]
Preferably, in the bonding step, after the air bubbles are removed, the thin plate and the base material are bonded in a vacuum atmosphere. This makes it possible to minimize the entry of foreign matter between the thin plate and the base material.
[0020]
Preferably, in the above-described removing step, the thin plate and the base member are electrically connected to each other, and unnecessary portions are removed by wire-cut electric discharge machining. This makes it possible to easily perform high-precision processing. Further, it is possible to reduce the physical impact applied to the bonded portion between the thin plate and the base material, and to avoid the separation between the thin plate and the base material.
[0021]
Preferably, the thin plate and the base material include a conductive material and are electrically connected by a connection formed to contact each of the thin plate and the base material. Such a connection portion can be easily formed by, for example, applying a silver paste or the like so as to contact both the thin plate and the base material.
[0022]
Preferably, the thin plate and the base are electrically connected by mixing a conductive substance into the adhesive and interposing the thin plate and the base. In this case, a conductive substance may be mixed in the adhesive used in the bonding step in advance, and the process can be simplified.
[0023]
Preferably, the method further includes a polishing step of polishing the bonding surface of the thin plate prior to the bonding step described above. This makes it possible to appropriately adjust the thickness unevenness and warpage of the thin plate or the surface roughness of the back surface of the thin plate (the surface opposite to the surface on which the fine pattern is formed) to improve the flatness of the insert.
[0024]
Preferably, after the above-mentioned bonding step, the method further includes a pressing step of pressing the thin plate and the base material so as to be in close contact with each other. This makes it possible to further increase the degree of adhesion between the thin plate and the base material.
[0025]
Preferably, in the pressing step, the pressing is performed by pressing a resin film forming surface of the embossing plate against one surface having a thin plate fine pattern, using a pressing plate having a resin film formed on at least one surface. Do. This makes it possible to reliably prevent the fine pattern formed on the thin plate from being damaged by the pressing using the embossing plate.
[0026]
Preferably, after the pressing step, the method further includes a holding step of holding the pressed thin plate and the base material in a temperature environment of room temperature or higher. This makes it possible to further increase the degree of adhesion between the thin plate and the base material.
[0027]
Preferably, after the fine pattern forming step, the method further includes a protective layer forming step of forming a protective layer for protecting the fine pattern on the thin plate. This makes it possible to reliably prevent the fine pattern formed on the thin plate from being damaged during the subsequent steps.
[0028]
Preferably, the above-mentioned nest is mounted on a mold used for injection molding or sheet molding.
[0029]
In the method for manufacturing a mold according to the present invention, a nest is formed by the above-described method for manufacturing a nest, a mold for forming the entire shape of the molded body is formed, and the nest is mounted on the mold. This makes it possible to easily manufacture a mold capable of forming a molded body having fine irregularities.
[0030]
The present invention is also a nest manufactured by the manufacturing method described above. Specifically, the nest of the present invention is a nest that is mounted on a mold and plays a role in forming a part of the shape of the molded body, and a base material and a fine pattern to be transferred to the molded body are formed on one surface. And a laminated sheet, and is configured by laminating the sheet and the base material.
[0031]
As described above, a thin plate having a fine pattern can be formed relatively easily by using a conventional technique. Therefore, by adopting a structure in which the thin plate thus formed and the base material are bonded, it is possible to realize nesting that is easy to manufacture.
[0032]
Preferably, the thin plate and the base material constituting the nest are bonded together using an adhesive. The adhesive interposed between the thin plate and the base material can reduce the shrinkage and expansion of the entire nest due to heat.
[0033]
Preferably, the adhesive includes at least one of an epoxy resin-based adhesive, a ceramics adhesive, an inorganic heat-resistant adhesive, and an anaerobic impregnating adhesive. Also, preferably, the adhesive contains a conductive material.
[0034]
Preferably, the above-mentioned nest is mounted on a mold used for injection molding or sheet molding.
[0035]
Further, the present invention is also a mold including the above-described nest. Specifically, the mold of the present invention is configured by attaching the above-described nest to a mold for forming the entire shape of the molded body. This makes it possible to realize a mold that is easy to manufacture.
[0036]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0037]
FIG. 1 is an explanatory diagram illustrating a mold for forming a fine structure according to the present embodiment. FIG. 1A is a perspective view illustrating an appearance of a mold according to the present embodiment, and FIG. 1B is a cross-sectional view along AA ′ illustrated in FIG. 1A.
[0038]
As shown in FIG. 1, a mold 1 of the present embodiment includes a detachable insert 2. The nest 2 has a fine pattern on one surface. The mold 1 including the nest 2 is attached to an injection molding machine (not shown), and the cavity 3 is filled with a molten resin or the like, pressurized, cooled, and solidified. It is possible to obtain a molded product which is formed and in which the fine pattern provided in the nest 2 is partially transferred.
[0039]
Next, a method of manufacturing the insert 2 forming the mold 1 of the above-described embodiment will be described. 2 to 6 are explanatory diagrams illustrating a method for manufacturing the nest 2 of the present embodiment.
[0040]
First, as shown in FIG. 2, a thin plate 10 having a fine uneven pattern 12 on one surface is formed. FIG. 2A is a plan view of the thin plate 10, and FIG. 2B is a cross-sectional view taken along the line BB 'shown in FIG. 2A. In FIG. 2, the concave / convex pattern 12 is schematically shown.
[0041]
The thin plate 10 is preferably formed with a thickness in the range of about 0.1 mm to 3.0 mm. Further, it is preferable that the uneven pattern 12 is formed so that the height of the unevenness is in the range of about 30 nm to 100 μm. Such a thin plate 10 can be manufactured in the same manner as a so-called stamper manufacturing method used for forming an optical disk or the like.
[0042]
A specific method of manufacturing the thin plate 10 will be described with reference to FIG. As shown in FIG. 3A, at least one surface (pattern forming surface) of the glass master 50 is polished and washed, and then, a photoresist 52 is applied on the polished surface of the glass master 50 to form the uneven pattern 12. Correspondingly, laser light is intermittently irradiated (exposed).
[0043]
Next, as shown in FIG. 3B, a fine pattern is formed on the photoresist 52 by developing the exposed portion of the photoresist 52.
[0044]
Next, as shown in FIG. 3C, silver (Ag), nickel (Ni), or the like is formed on the fine pattern formed on the photoresist 52 by a method such as a sputtering method, an evaporation method, or an electroless plating method. A conductive film is formed, and using the conductive film formed on the photoresist 52 as one electrode, electroforming (electroforming) using a plating solution such as a nickel sulfamate solution is performed to reduce nickel to a desired thickness. To be deposited.
[0045]
Thereafter, the nickel deposited on the photoresist 52 is peeled from the glass master 50, and the resist is removed and washed. As a result, as shown in FIG. 3D, a thin plate 10 made of nickel and having a fine uneven pattern 12 formed thereon is formed.
[0046]
The thin plate 10 formed as described above is used as a master, a mother (female type) having a pattern obtained by inverting the pattern formed on the master is duplicated, and further, the master is A sun (male type) having the same pattern may be duplicated, and the duplicated sun may be used as the thin plate 10. Alternatively, a mother that duplicates the master may be used as the thin plate 10. In this case, a master having an inverted pattern of the pattern to be formed may be formed, and the mother may be duplicated from the master.
[0047]
After the thin plate 10 is formed as described above, the thin plate 10 and the base member 14 are bonded together with the adhesive 16 interposed therebetween, as shown in FIG. In the example shown in FIG. 4, the adhesive 16 is applied to both the bonding surfaces of the thin plate 10 and the base member 14, but only one of the bonding surfaces of the thin plate 10 and the base member 14 is applied. The adhesive 16 may be applied.
[0048]
More preferably, the surface roughness, thickness unevenness, and warpage of the thin plate 10 are adjusted by polishing the bonding surface of the thin plate 10 (the back surface of the surface on which the uneven pattern 12 is formed) prior to the bonding step. In this polishing step, it is preferable that the bonded surface of the thin plate 10 is polished so that the surface roughness Ra is about 0.05 μm to 0.1 μm, the thickness unevenness is 5 μm or less, and the warpage is 300 μm or less.
[0049]
The adhesive 16 described above includes (1) an epoxy resin-based adhesive mainly containing modified epoxy or modified polyamine, and (2) a silica-, mica-, or alumina-based adhesive having high heat resistance (for example, about 600 (3) an inorganic heat-resistant adhesive mainly composed of a powder mainly composed of alumina oxide, zirconium oxide, manganese dioxide, inorganic borate and a solvent of a silicate compound; ) An anaerobic impregnating adhesive having a low viscosity (for example, about 40 to 600 mPa · s at 25 ° C.) containing methacrylic acid diester as a main component can be used.
[0050]
As for the method of applying the adhesive 16, when the adhesive 16 has a low viscosity, it is preferable to use a spray coating method or a spin coating method (rotation coating method). By using these methods, it is possible to increase the uniformity of the thickness of the adhesive 16 on the application surface (for example, to set the thickness range to about ± 2 μm). More preferably, after the thin plate 10 and the base material 14 to which the adhesive 16 has been applied by a spray coating method or the like are put into a vacuum chamber to remove air bubbles (defoaming), the thin plate 10 and the base material are directly kept in the vacuum chamber. It is preferable that the adhesive 14 is bonded so that the adhesive 16 does not contain air bubbles, foreign matter, or the like.
[0051]
When the adhesive 16 has a high viscosity, it is preferable that the adhesive 16 is applied by using an applicator such as a brush, or is applied directly by dropping. Also in this case, the thin plate 10 coated with the adhesive 16 and the base material 14 are placed in a vacuum chamber to remove bubbles, and the adhesive 16 is spread over the entire bonding surface. It is more preferable that the base material 14 and the base material 14 are bonded to each other so that the adhesive 16 does not include air bubbles and foreign matter.
[0052]
Next, as shown in FIG. 5, the embossed plate 20 having the resin film 22 formed on one surface is used, and the surface of the embossed plate 20 where the resin film 22 is formed is brought into contact with the thin plate 10. Then, the thin plate 10 is pressed so as to be in close contact with the base material 14. Here, it is preferable that the above-mentioned resin film 22 is formed using an organic material containing polyimide, fluorine, or the like.
[0053]
Next, while maintaining the pressed state, the adhesive 16 interposed between the thin plate 10 and the base member 14 is cured by drying the thin plate 10 and the base member 14 in an atmosphere at a temperature equal to or higher than room temperature. In the drying treatment, it is preferable to set the temperature within a range of about 50C to 150C. In addition, the processing time may be appropriately set according to the type and properties of the adhesive 16. For example, when an epoxy resin-based adhesive is used as the adhesive 16, it is preferable to perform a heat treatment at 150 ° C. for about 1.5 hours.
[0054]
Next, as shown in FIG. 6, a conductive material such as a silver paste is applied so as to be in contact with the respective side surfaces of the thin plate 10 and the base member 14, thereby electrically connecting the thin plate 10 and the base member 14. Forming a connecting portion 24 for connecting to
[0055]
Next, unnecessary portions of the thin plate 10 and the base member 14, specifically, peripheral portions thereof except a predetermined range including the fine pattern 12 are removed by wire cut electric discharge machining.
[0056]
As described above, since the thin plate 10 and the base member 14 are bonded together in a state including the unnecessary portion, and the unnecessary portion is thereafter removed, the contact area between the thin plate 10 and the base member 14 is large, and the strong adhesive force is obtained. Can be secured. This makes it possible to prevent the thin plate 10 and the base member 14 from peeling off at the time of removing the unnecessary portion.
[0057]
FIG. 7 is a diagram showing the structure of the nest 2 formed through the above-described steps. As shown in the figure, a nest 2 having a structure in which a thin plate 10 having a fine uneven pattern 12 on one surface and a base material 14 are bonded via an adhesive 16 is formed. By attaching the mold 1 including the nest 2 thus formed to a general injection molding machine or sheet molding machine, injection molding and sheet molding of resin products and plastic products can be performed. In fact, according to an experiment conducted by the inventor of the present application, a mold including a nest manufactured by the above-described method was attached to a general injection molding machine, and a mold temperature of 105 ° C., a resin temperature of 300 ° C., and an injection speed of 100 mm / s or more, Holding pressure 1000kg / cm ² It has been confirmed that injection molding of a good molded body (microstructure) is possible by performing the molding in the above.
[0058]
As described above, in the present embodiment, the nest 2 is formed by forming the thin plate 10 having the fine concavo-convex pattern 12 and bonding the thin plate 10 and the base member 14 together. It can be easily formed. Further, by combining the nest 2 thus formed and the mold 1 for forming the entire shape of the molded body, a mold capable of forming a molded body having fine irregularities can be easily manufactured. It is possible to do.
[0059]
Next, another embodiment of the present invention will be described. In the embodiment described above, as shown in FIG. 6, when performing the wire cut electric discharge machining, the connection portion 24 is formed between the thin plate 10 and the base member 14 prior to the wire cut electric discharge machining, so that the electrical connection between the two is established. Although an attempt has been made, an electrical connection may be made between the thin plate 10 and the base material 14 by mixing a conductive material into the adhesive 16 used for the bonding. As described above, by electrically connecting the thin plate 10 and the base member 14 with the adhesive 16 mixed with the conductive material, it is not necessary to provide the connecting portion 24, and the process can be simplified.
[0060]
Further, prior to the pressing step using the embossing plate 20, a protective film for protecting the uneven pattern 12 may be formed on the thin plate 10. FIG. 8 is an explanatory diagram for explaining a case where a protective film for protecting the uneven pattern 12 is formed. As shown in FIG. 1, after forming the thin plate 10 having the uneven pattern 12 (see FIG. 1), a protective film 26 is formed on the upper surface of the thin plate 10 so as to cover the uneven pattern 12. As the protective film 26, for example, a polyimide film or the like can be considered. After the formation of the protective film 26, the same steps as in the above-described embodiment are performed. In this case, the protective film 26 may be peeled off before performing the wire cut electric discharge machining (shaping step), or may be peeled off after the wire cut electric discharge machining.
[0061]
In the above-described embodiment, the thin plate 10 having the fine concavo-convex pattern 12 is formed by using the photolithography method. However, a similar thin plate can be formed by a mechanical processing method.
[0062]
FIG. 9 is an explanatory diagram for explaining a manufacturing method when a thin plate having a fine uneven pattern is formed by a mechanical processing method.
[0063]
First, as shown in FIG. 9A, mechanical processing using a cutting tool such as a cutting tool 160 is performed, and a predetermined portion of the metal master 150 is cut into a concave shape to form a concave portion 152. The concave portion 152 is a pattern obtained by inverting a concave / convex pattern to be formed on a thin plate. In addition to using a cutting tool such as a cutting tool, the concave portion 152 may be formed by laser beam processing, electron beam processing, or other various mechanical processing methods.
[0064]
Next, as shown in FIG. 9B, nickel is deposited on the metal master 150 to a desired thickness by performing electroforming. Since the specific contents of this step are the same as those of the above-described embodiment (see FIG. 3), detailed description is omitted here.
[0065]
Thereafter, nickel deposited on the metal master 150 is peeled off from the metal master 150, and resist removal and cleaning are performed. As a result, as shown in FIG. 9C, a thin plate 110 made of nickel on which a fine uneven pattern 112 is formed is formed.
[0066]
Thus, a thin plate having a fine concavo-convex pattern can be formed also by using a mechanical processing method. In particular, by forming a concave pattern on the metal master to form a pattern, relatively high-precision processing can be performed even when mechanical processing is used.
[0067]
Note that the present invention is not limited to the contents of the above-described embodiments, and various modifications can be made within the scope of the present invention. For example, in the above-described embodiment, the fine rugged pattern 12 (or 112) is provided on one surface of the nest 2 constituting a part of the mold 1, but the thin plate having the rugged pattern is directly formed in the mold. At a predetermined position.
[0068]
【The invention's effect】
As described above, according to the present invention, a thin plate having a fine concavo-convex pattern is formed separately from the nest body, and the nest is formed by laminating the formed thin plate and the base material. A nest having a pattern can be easily formed. Further, by combining the nest formed in this way and a mold for forming the entire shape of the molded body, it is possible to easily produce a mold capable of forming a molded body having fine irregularities. Becomes possible.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram illustrating a mold for forming a fine structure according to an embodiment.
FIG. 2 is an explanatory view illustrating a method of manufacturing a nest forming a mold.
FIG. 3 is an explanatory view illustrating a method of manufacturing a nest forming a mold.
FIG. 4 is an explanatory diagram illustrating a method of manufacturing a nest forming a mold.
FIG. 5 is an explanatory diagram illustrating a method of manufacturing a nest forming a mold.
FIG. 6 is an explanatory view illustrating a method of manufacturing a nest forming a mold.
FIG. 7 is a diagram showing a nested structure.
FIG. 8 is an explanatory diagram illustrating a case where a protective film for protecting a fine uneven pattern is formed.
FIG. 9 is an explanatory diagram for explaining a manufacturing method when a thin plate having a fine uneven pattern is formed by a mechanical processing method.
[Explanation of symbols]
1 Mold
2 nesting
3 cavities
10 Thin plate
12 Uneven pattern
14 base materials
16 adhesive
20 embossed plate
22 Resin film
24 Connection
26 Protective film

Claims (28)

A method for manufacturing a nest that is attached to a mold and plays a part in forming a shape of a molded body,
A fine pattern forming step of forming a fine pattern to be transferred to the molded body on one surface of a thin plate,
A laminating step of laminating the thin plate and the base material and integrating them together,
A removing step of removing unnecessary portions of the laminated thin plate and the base material;
A method for manufacturing a nest. The method for manufacturing a nest according to claim 1, wherein the fine pattern forming step includes a step of forming fine irregularities on the master by a photolithography method. The method for manufacturing a nest according to claim 1, wherein the fine pattern forming step includes a step of forming fine irregularities on the master by mechanical processing. The method for manufacturing a nest according to claim 3, wherein the mechanical processing performs the processing of the uneven shape by cutting the master into a concave shape. The method for manufacturing a nest according to claim 2, wherein the fine pattern forming step includes a step of forming the thin plate by performing electroforming using the master on which the uneven shape is formed. The bonding step, after applying an adhesive to at least one of the bonding surfaces of the thin plate and the base material, the bonding surfaces are brought into contact with each other to integrate the thin plate and the base material. Item 6. The method for producing a nest according to any one of Items 1 to 5. The method according to claim 6, wherein the adhesive includes at least one of an epoxy resin-based adhesive, a ceramics adhesive, an inorganic heat-resistant adhesive, and an anaerobic impregnating adhesive. The method for manufacturing a nest according to claim 6, wherein the application of the adhesive in the bonding step is performed by one of a spray coating method and a spin coating method. The method of manufacturing a nest according to claim 6 or 7, wherein the application of the adhesive in the bonding step is performed by directly dropping the adhesive onto the bonding surface. The method for manufacturing a nest according to claim 6, wherein the application of the adhesive in the bonding step is performed by spreading the adhesive on the bonding surface using a coating tool. The nest production according to any one of claims 6 to 10, wherein, in the bonding step, after applying the adhesive, the thin plate and the base material are placed in a vacuum atmosphere to remove bubbles from the adhesive. Method. The method of manufacturing a nest according to claim 11, wherein in the bonding step, after the air bubbles are removed, the thin plate and the base material are bonded in a vacuum atmosphere. The method of manufacturing a nest according to claim 1, wherein in the removing step, the thin plate and the base material are electrically connected to each other, and the unnecessary portion is removed by wire-cut electric discharge machining. The method for manufacturing a nest according to claim 13, wherein the thin plate and the base member include a conductive material, and are electrically connected by a connection portion formed to contact each of the thin plate and the base member. . The method for manufacturing a nest according to claim 13, wherein the thin plate and the base member are electrically connected by mixing a conductive substance into the adhesive and interposing the thin plate and the base member between the thin plate and the base member. . The method of manufacturing a nest according to any one of claims 1 to 15, further comprising: a polishing step of polishing a bonding surface of the thin plate before the bonding step. The method for manufacturing a nest according to any one of claims 1 to 16, further comprising, after the bonding step, a pressing step of pressing the thin plate and the base material so as to be in close contact with each other. In the pressing step, a pressing plate having a resin film formed on at least one surface thereof is pressed by pressing a forming surface of the resin film of the pressing plate against one surface of the thin plate having the fine pattern. 18. The method for manufacturing a nest according to claim 17, wherein 19. The method of manufacturing a nest according to claim 17, further comprising a holding step of holding the pressed thin plate and the base material in a temperature environment equal to or higher than room temperature after the pressing step. 20. The method according to claim 1, further comprising, after the fine pattern forming step, a protective layer forming step of forming a protective layer for protecting the fine pattern on the thin plate. The method for manufacturing a nest according to any one of claims 1 to 20, wherein the nest is mounted on a mold used for injection molding or sheet molding. A mold for producing the nest by the manufacturing method according to any one of claims 1 to 21, producing a mold for forming the entire shape of the molded body, and mounting the nest on the mold. Manufacturing method. A nest that is attached to a mold and plays a part in forming the shape of the molded body,
A base material attached to the mold,
A thin plate on which a fine pattern to be transferred to the molded body is formed on one surface,
A nest formed by laminating the thin plate and the base material. 24. The nest according to claim 23, wherein the thin plate and the base material are bonded using an adhesive. The nest according to claim 24, wherein the adhesive includes at least one of an epoxy resin-based adhesive, a ceramics adhesive, an inorganic heat-resistant adhesive, and an anaerobic impregnating adhesive. The nest according to claim 24 or 25, wherein the adhesive comprises a conductive material. The nest according to any one of claims 22 to 26, wherein the nest is mounted on a mold used for injection molding or sheet molding. A mold comprising the nest according to any one of claims 23 to 27.

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