JP2016002665A - Method for producing structure for producing mold, and method for producing mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a structure for producing molds, in which method pressing force can be exerted appropriately on the outer peripheral surface of a joined body.SOLUTION: The method for producing the structure for producing molds, which structure has a pattern formation surface on which a rugged pattern for imprints is formed, comprises: a joining step of opposing the joint surface of a first tabular body to that of a second tabular body and joining the first tabular body to the second tabular body to obtain the joined body; and a level difference removal step of removing a level difference on the outer peripheral surface of the joined body.

Description

  The present invention relates to a method for manufacturing a mold manufacturing structure and a method for manufacturing a mold.

  An imprint method has attracted attention as an alternative technique to the photolithography method. The imprint method is a technique in which a transfer material is sandwiched between a mold and a substrate, and the uneven pattern of the mold is transferred to the transfer material. The imprint method can be applied to the manufacture of various products such as antireflection sheets, biochips, magnetic recording media as well as semiconductor elements.

  The mold has a recess formed on the first main surface of the plate-like body and a mesa portion formed on the second main surface opposite to the first main surface of the plate-like body (see, for example, Patent Document 1). ). The bottom surface of the concave portion is covered with a lid portion, and the mesa portion projects from the surface of the lid portion opposite to the bottom surface of the concave portion. The periphery of the mesa portion is surrounded by steps, and an uneven pattern is formed on the surface of the mesa portion.

  When the transfer material is sandwiched between the mold and the base material, the lid part is elastically bent by pressing the outer peripheral surface of the mold or the bottom surface of the concave part, and the surface of the mesa part becomes a convex curved surface toward the base material. Deformed. Gas between the mesa portion and the base material can easily escape, and gas confinement can be suppressed.

  The mold may be a joined body obtained by joining a plurality of plate-like bodies (see, for example, Patent Document 2). A concave portion can be formed by joining the first plate-like body in which the through hole is formed and the second plate-like body closing the through hole.

Special table 2009-536591 JP 2011-148227 A

  Conventionally, due to misalignment of a plurality of plate-like bodies constituting the joined body, a step is generated on the outer peripheral surface of the joined body, and it has been difficult to appropriately apply a pressing force to the outer peripheral surface of the joined body.

  This invention is made | formed in view of the said subject, Comprising: It mainly aims at provision of the manufacturing method of the structure for mold manufacture which can apply a pressing force appropriately to the outer peripheral surface of a joined body.

In order to solve the above problems, according to one aspect of the present invention,
A method for manufacturing a mold manufacturing structure having a pattern forming surface on which an uneven pattern for imprinting is formed,
A joining step of facing the joining surface of the first plate-like body and the joining surface of the second plate-like body, joining the first plate-like body and the second plate-like body, and obtaining a joined body;
There is provided a method for manufacturing a mold manufacturing structure, including a step removing step of removing a step on an outer peripheral surface of the joined body.

  According to one aspect of the present invention, there is provided a method for manufacturing a mold manufacturing structure capable of appropriately applying a pressing force to the outer peripheral surface of a joined body.

It is a flowchart which shows the manufacturing method of the mold by one Embodiment of this invention. It is sectional drawing which shows the state of the 1st glass plate at the time of completion of the through-hole formation process of FIG. It is sectional drawing which shows the state of the 2nd glass plate at the time of completion of the mesa part formation process of FIG. It is sectional drawing which shows the state of the joined body at the time of completion of the joining process of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of the completion | finish of the level | step difference removal process of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of completion of the etching protective film formation process of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of completion of the resist film formation process among the uneven | corrugated pattern formation processes of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of completion of the opening pattern formation process among the uneven | corrugated pattern formation processes of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of the primary etching process completion of the uneven | corrugated pattern formation process of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of the resist film removal process completion of the uneven | corrugated pattern formation process of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of the secondary etching process completion of the uneven | corrugated pattern formation process of FIG. It is sectional drawing which shows the state of the conjugate | zygote at the time of the etching protective film removal process completion of the uneven | corrugated pattern formation process of FIG. It is a top view of a mold by one embodiment of the present invention. It is sectional drawing which shows the imprint method using the mold by one Embodiment of this invention. It is sectional drawing which shows the state of the conjugate | zygote at the time of the level | step difference removal process completion by a modification.

  Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof is omitted. In this specification, “to” representing a numerical range means a range including numerical values before and after the numerical range.

  FIG. 1 is a flowchart illustrating a mold manufacturing method according to an embodiment of the present invention. As shown in FIG. 1, the mold manufacturing method includes a through-hole forming step S11, a mesa portion forming step S12, a joining step S13, a step removing step S14, an etching protective film forming step S15, and an uneven pattern forming step S16.

  FIG. 2 is a cross-sectional view showing a state of the first glass plate when the through hole forming step of FIG. 1 is completed. In the through hole forming step S11, the through hole 14 penetrating the first glass plate 10 as the first plate-like body is formed.

The first glass plate 10 may be formed of SiO ₂ glass or TiO ₂ —SiO ₂ glass. SiO ₂ glass and TiO ₂ —SiO ₂ have higher ultraviolet transmittance than general soda lime glass. In addition, SiO ₂ glass and TiO ₂ —SiO ₂ have a smaller coefficient of linear expansion and a smaller dimensional change of the concavo-convex pattern due to temperature changes than general soda lime glass. The TiO ₂ —SiO ₂ glass preferably contains 5 to 12% by mass of TiO ₂ . When the TiO ₂ content is 5 to 12% by mass, the linear expansion coefficient near room temperature is substantially zero, and the dimensional change near room temperature hardly occurs.

  The shape of the first glass plate 10 in plan view (viewed in the thickness direction of the glass plate) is a rectangle in the present embodiment, but may be a circle, an ellipse, a polygon, or the like.

  The through hole 14 penetrates the first glass plate 10 in the plate thickness direction. The through hole 14 may be formed by excavating either the joint surface 11 or the surface 12 opposite to the joint surface 11. The through hole 14 may be either a straight hole or a tapered hole.

  A grinding machine such as a machining center is used to form the through hole 14. The grinding machine may form the through hole 14 so that the center of the first glass plate 10 and the center of the through hole 14 coincide. After grinding, the inner surface of the through hole may be polished.

  The shape of the through hole 14 in plan view is circular in FIG. 13, but may be oval, rectangular, polygonal, or the like.

  In the present embodiment, a glass plate is used as the first plate-like body, but a metal plate, a resin plate, a ceramic plate, or the like may be used.

  FIG. 3 is a cross-sectional view showing a state of the second glass plate when the mesa portion forming step of FIG. 1 is completed. In FIG. 3, the two-dot chain line indicates the state of the second glass plate at the start of the mesa portion forming process.

  In the mesa portion forming step S12, a mesa portion 24 whose periphery is surrounded by a step is formed on the surface 22 opposite to the bonding surface 21 of the second glass plate 20 as the second plate-like body. In the mesa portion forming step S12, an etching mask is formed on the surface 22 opposite to the bonding surface 21 of the second glass plate 20, and the mesa portion 24 is formed by performing etching using the etching mask. The etching mask is formed by a photolithography method, an electron beam lithography method, an imprint method, an etching method, or the like.

The second glass plate 20 may be thinner than the first glass plate 10. Similar to the first glass plate 10, the second glass plate 20 may be formed of SiO ₂ glass or TiO ₂ —SiO ₂ glass. SiO ₂ glass and TiO ₂ —SiO ₂ glass have higher ultraviolet transmittance than general soda lime glass. In addition, SiO ₂ glass and TiO ₂ —SiO ₂ glass have a smaller linear expansion coefficient and a smaller dimensional change of the concavo-convex pattern due to a temperature change than general soda lime glass. The TiO ₂ —SiO ₂ glass preferably contains 5 to 12% by mass of TiO ₂ . When the TiO ₂ content is 5 to 12% by mass, the linear expansion coefficient near room temperature is substantially zero, and the dimensional change near room temperature hardly occurs.

  The shape of the second glass plate 20 in plan view is a rectangle in the present embodiment, but may be an ellipse, a rectangle, a polygon, or the like.

  The mesa portion 24 is formed so that the center of the mesa portion 24 and the center of the second glass plate 20 coincide. As shown in FIG. 13 after the joining step S <b> 13, the mesa portion 24 is formed smaller than the through hole 14 in a plan view and is formed so as not to protrude from the through hole 14.

  The shape of the mesa portion 24 in plan view is a rectangle in FIG. 13, but may be a circle, an ellipse, a polygon, or the like.

  In the present embodiment, a glass plate is used as the second plate-like body, but a metal plate, a resin plate, a ceramic plate, or the like may be used.

  In addition, since glass has a small coefficient of thermal expansion, a high ultraviolet (i-line) transmittance, and high durability against repeated operations of imprinting, at least one of the first plate and the second plate is It is preferable that it is a glass body, and it is preferable that both a 1st plate-shaped body and a 2nd plate-shaped body are glass bodies from the ease of joining.

  In FIG. 1, the mesa portion forming step S12 is performed after the through-hole forming step S11, but may be performed first or simultaneously. The through hole forming step S <b> 11 may not be provided, and the through hole 14 may not be formed in the first glass plate 10. Further, the mesa portion forming step S <b> 12 may not be performed, and the mesa portion 24 may not be formed on the second glass plate 20.

  FIG. 4 is a cross-sectional view showing a state of the joined body when the joining process of FIG. 1 is completed. In joining process S13, the joining surface 11 of the 1st glass plate 10 and the joining surface 21 of the 2nd glass plate 20 are faced, the 1st glass plate 10 and the 2nd glass plate 20 are joined, and the joined body 30 is obtained. . The second glass plate 20 closes the through hole 14 of the first glass plate 10, thereby forming a recess 34. The first glass plate 10 and the second glass plate 20 are joined so that the center of the recess 34 (that is, the center of the through hole 14) and the center of the mesa portion 24 coincide.

  As the bonding method, for example, a welding method, an adhesion method, an anodic bonding method, a hydrofluoric acid bonding method, an optical contact method, a room temperature bonding method, or the like is used. The welding method is a method for integrating the melted joint surfaces. The adhesion method is a method using an adhesive such as a photocurable resin. The anodic bonding method is used for bonding glass and a conductor (metal or semiconductor), and is a method in which glass and a conductor are overlapped, a voltage is applied while heating, and bonding is performed by covalent bonding. The hydrofluoric acid bonding method is a method in which hydrofluoric acid is dropped onto a bonding surface and the bonding surfaces are overlapped and bonded. The optical contact method is a method in which polished bonded surfaces are superposed and bonded by intermolecular force. The room temperature bonding method may be either a surface activation method in which activated bonding surfaces are overlapped and bonded, or an atomic diffusion method in which bonding surfaces on which a metal thin film is formed are overlapped and bonded.

  In FIG. 4, two glass plates are joined, but three or more glass plates may be joined.

  FIG. 5 is a cross-sectional view showing a state of the joined body when the step removing process of FIG. 1 is completed. In FIG. 5, a two-dot chain line indicates the state of the joined body at the start of the step removing process.

  In the step removing step S14, the step 36 on the outer peripheral surface of the joined body 30 is removed. The level difference 36 is a level difference between the outer peripheral surface of the first glass plate 10 and the outer peripheral surface of the second glass plate 20, and is caused by a positional deviation between the first glass plate 10 and the second glass plate 20 during bonding.

  In the step removing step S14, the step 36 is removed by, for example, grinding the outer peripheral surface of the joined body 30. A grinding machine such as a machining center is used for grinding the outer peripheral surface of the joined body 30. The grinding machine grinds the outer peripheral surface of the joined body 30 so that the center of the concave portion 34 or the center of the mesa 24 matches the center of the joined body 30 after grinding. The outer peripheral surface after grinding may be perpendicular to the joint surfaces 11 and 21.

  Further, in the step removing step S14, the outer peripheral surface of the joined body 30 may be ground and then polished. By polishing, the surface roughness can be improved. Thereby, the following effects (1) to (3) are obtained. (1) The adhesion of foreign matter can be prevented. (2) Pressurization of the outer peripheral surface of the joined body 30 is stabilized. (3) The holding of the outer peripheral surface of the joined body 30 is stabilized.

  FIG. 6 is a cross-sectional view showing a state of the joined body when the etching protective film forming step of FIG. 1 is completed. In the etching protective film forming step S15, an etching protective film 51 for forming a concavo-convex pattern is formed.

  The etching protection film 51 may be formed of chromium or a chromium compound. The etching protective film 51 may be a multilayer film, and may be composed of, for example, a thin film of chromium or a chromium compound and a thin film of tantalum or a tantalum compound. Instead of a tantalum or tantalum compound thin film, a silicon or silicon compound thin film may be used. The etching protective film 51 is formed by, for example, a sputtering method.

  The bonded body 30 and the etching protection film 51 constitute a mold manufacturing structure. Note that the mold manufacturing structure may be configured only by the bonded body 30.

  In FIG. 1, the etching protective film forming step S15 is a step different from the concave / convex pattern forming step S16, but may be a part of the concave / convex pattern forming step S16. In addition, the etching protective film 51 may include a resist film. In this case, the resist film forming process is unnecessary in the concavo-convex pattern forming process S16.

  In the concavo-convex pattern forming step S16, for example, as shown in FIGS. 7 to 12, an concavo-convex pattern for imprinting is formed on the pattern forming surface 24a of the mesa portion 24. The concavo-convex pattern forming step S16 includes a resist film forming step shown in FIG. 7, an opening pattern forming step shown in FIG. 8, a primary etching step shown in FIG. 9, a resist film removing step shown in FIG. 10, and a secondary etching step shown in FIG. And an etching protective film removing step shown in FIG.

  In the resist film forming step shown in FIG. 7, a resist film 52 is formed on the etching protective film 51. The resist film 52 is a positive type in this embodiment, but may be a negative type. The resist film 52 is formed by, for example, a spin coat method.

  In the opening pattern forming step shown in FIG. 8, an opening pattern corresponding to the concavo-convex pattern is formed in the resist film 52. The opening pattern of the resist film 52 is formed by a photolithography method, an electron beam lithography method, an imprint method, or the like.

  In the primary etching step shown in FIG. 9, the etching protection film 51 is etched using the resist film 52 with the opening pattern. Etching may be either dry etching or wet etching. An opening pattern corresponding to the opening pattern of the resist film 52 is formed in the etching protective film 51.

  In the resist film removal step shown in FIG. 10, the resist film 52 that is no longer needed is removed.

  In the secondary etching step shown in FIG. 11, the first glass plate 10 is etched using the etching protective film 51 with the opening pattern as an etching mask. Etching may be either dry etching or wet etching. An uneven pattern corresponding to the opening pattern of the etching protective film 51 is formed on the pattern forming surface 24 a of the mesa portion 24.

  In the etching protective film removing step shown in FIG. 12, the etching protective film 51 that is no longer needed is removed.

  In this way, a bonded body 30 with a concavo-convex pattern is obtained. The joined body 30 with the uneven pattern is used as a mold. The uneven pattern of the mold may be various, and is not limited to the line and space pattern shown in FIG.

  FIG. 14 is a diagram illustrating an imprint method using a mold according to an embodiment of the present invention. In the imprint method, the transfer material 70 is sandwiched between the joined body 30 as a mold and the substrate 60, and the uneven pattern of the joined body 30 is transferred to the transfer material 70. The concavo-convex pattern of the transfer material 70 is obtained by substantially inverting the concavo-convex pattern of the bonded body 30.

  For example, a wafer is used as the substrate 60. The wafer may be formed with elements, circuits, terminals, etc., and the transfer material 70 may be applied to the elements formed on the wafer. Note that a glass plate, a ceramic plate, a resin plate, a metal plate, or the like may be used as the substrate 60.

  As the transfer material 70, for example, a photocurable resin is used. As the photocurable resin, a general resin used in the photoimprint method can be used.

  The transfer material 70 is sandwiched between the joined body 30 and the base material 60 in a liquid state, and is solidified in that state. The solidification method is appropriately selected according to the type of the transfer material 70. When the transfer material 70 is a photocurable resin, light (for example, ultraviolet rays) is used.

  The photocurable resin changes from a liquid to a solid upon irradiation with light. The photocurable resin may be a non-Newtonian fluid or a viscoelastic liquid. The light may pass through the bonded body 30 and be applied to the transfer material 70. In addition, when the base material 60 has a light transmittance, light may be irradiated to the transfer material 70 from the base material 60 side. In this case, the joined body 30 may not have a light transmittance. The transfer material 70 may be irradiated with light from both sides of the bonded body 30 and the base material 60.

  In the optical imprint method, molding at room temperature is possible, distortion due to a difference in linear expansion coefficient between the bonded body 30 and the base material 60 hardly occurs, and transfer accuracy is good. Note that the photocurable resin may be heated to accelerate the curing reaction.

  In this embodiment, the optical imprint method is used, but the thermal imprint method may be used. In the case of the thermal imprint method, a thermoplastic resin or a thermosetting resin is used as the transfer material 70. The thermoplastic resin is melted by heating and solidified by cooling. The thermosetting resin changes from a liquid to a solid by heating. The thermosetting resin may be a non-Newtonian fluid or a viscoelastic liquid.

  After the transfer material 70 is solidified, the transfer material 70 and the joined body 30 are separated. A product composed of the uneven layer formed by solidifying the transfer material 70 and the substrate 60 is obtained. The concavo-convex pattern of the product is obtained by substantially inverting the concavo-convex pattern of the bonded body 30.

  As shown in FIG. 14, when the transfer material 70 is sandwiched between the joined body 30 and the substrate 60, an external force is applied to the joined body 30, so that the pattern forming surface 24 a of the joined body 30 is elastically bent, and the pattern The forming surface 24 a is deformed into a convex curved surface toward the base material 60. Gas between the joined body 30 and the base material 60 can easily escape, and gas confinement can be suppressed.

  For example, the outer peripheral surface of the joined body 30 and the bottom surface of the concave portion 34 are pressed so that the pattern forming surface 24 a is deformed into a convex curved surface toward the base material 60. The bottom surface of the recess 34 may be pressed by the pressure of the gas chamber formed in the recess 34.

  The deformation of the pattern forming surface 24a may be released before the transfer material 70 is solidified, and may be performed again when the solidified transfer material 70 and the bonded body 30 are peeled off. The transfer material 70 can be sequentially peeled from the outer periphery toward the center.

  By the way, according to this embodiment, the level | step difference 36 of the outer peripheral surface of the 1st glass plate 10 and the outer peripheral surface of the 2nd glass plate 20 is removed by level | step difference removal process S14. Since the step 36 is eliminated, the outer peripheral surface of the joined body 30 can be appropriately pressed, and the mesa portion 24 can be appropriately deformed.

  The through hole forming step S11 may be performed after the joining step S13, but the yield can be improved by performing the through hole forming step S11 before the joining step S13 as shown in FIG. This is because if a defect occurs during the formation of the through hole 14, only the first glass plate 10 needs to be discarded. Further, the required accuracy of the formation position of the through hole 14 can be relaxed in the through hole forming step S11. The misalignment of the through hole 14 can be solved by matching the center of the through hole 14 with the center of the mesa portion 24 (the center of the second glass plate 20 when the mesa portion 24 is not formed) in the joining step S13. As a result, a step 36 is produced, but there is no problem because the step removing step S14 is performed after the joining step S13.

  Further, the mesa portion forming step S12 may be performed after the joining step S13, but the yield can be improved by performing the mesa portion forming step S12 before the joining step S13 as shown in FIG. This is because when a defect occurs during the formation of the mesa portion 24, only the second glass plate 20 needs to be discarded. Further, the required accuracy of the formation position of the mesa portion 24 in the mesa portion forming step S12 can be relaxed. The misalignment of the mesa portion 24 can be solved by making the center of the mesa portion 24 coincide with the center of the through hole 14 (the center of the first glass plate 10 when the through hole 14 is not formed) in the joining step S13. As a result, a step 36 is produced, but there is no problem because the step removing step S14 is performed after the joining step S13.

  As mentioned above, although embodiment of the manufacturing method of a mold and the manufacturing method of the structure for mold manufacture was described, this invention is not limited to the said embodiment etc., and is in the range of the summary of this invention described in the claim. Various modifications and improvements are possible.

  For example, in FIG. 1, the concave / convex pattern forming step S16 is performed after the bonding step S13, but may be performed before the bonding step S13. In the latter case, when a defect occurs during the formation of the uneven pattern, only the second glass plate 20 needs to be discarded, and the yield can be improved.

  As shown in FIG. 3, the mesa portion 24 is formed on the surface 22 of the second glass plate 20 opposite to the bonding surface 21, but the mesa portion 24 may not be formed. In this case, an uneven pattern for imprinting may be formed on the flat surface 22.

  Instead of the step removing process shown in FIG. 5, a step removing process shown in FIG. 15 may be performed. In the step removing process shown in FIG. 15, a removal layer 38 for removing the step 36 is formed on the outer peripheral surface of the joined body 30. The removal layer 38 may be formed of a resin film, a metal film, a glass film, a ceramic film, or the like. The outer peripheral surface of the removal layer 38 may be perpendicular to the bonding surfaces 11 and 21.

DESCRIPTION OF SYMBOLS 10 1st glass plate 11 Joining surface 12 Surface 14 on the opposite side to a joining surface Through-hole 20 2nd glass plate 21 Joining surface 22 Surface 24 on the opposite side to a joining surface 24 Mesa part 24a Pattern formation surface 30 of mesa part 34 Concave portion 36 Step 38 on outer peripheral surface of joined body Removal layer 51 Etching protective film 52 for forming uneven pattern Resist film 60 for forming uneven pattern Base material 70 Transfer material

Claims (14)

A method for manufacturing a mold manufacturing structure having a pattern forming surface on which an uneven pattern for imprinting is formed,
A joining step of facing the joining surface of the first plate-like body and the joining surface of the second plate-like body, joining the first plate-like body and the second plate-like body, and obtaining a joined body;
The manufacturing method of the structure for mold manufacture which has a level | step difference removal process of removing the level | step difference of the outer peripheral surface of the said conjugate | zygote.   2. The mold manufacturing method according to claim 1, wherein in the step removing step, the step is removed by grinding an outer peripheral surface of the joined body or by grinding an outer peripheral surface of the joined body and then polishing. Manufacturing method of structure.   The method for manufacturing a mold manufacturing structure according to claim 1, wherein, in the step removing step, a removal layer for removing the step is formed on an outer peripheral surface of the joined body.   The manufacturing method of the structure for mold manufacture of any one of Claims 1-3 which has the through-hole formation process which forms the through-hole which penetrates a said 1st plate-shaped object before the said joint process.   5. The mesa part forming step of forming a mesa part surrounded by a step on the surface opposite to the joining surface of the second plate-like body before the joining step. A method for producing a mold manufacturing structure according to claim 1.   The method for manufacturing a mold manufacturing structure according to claim 1, wherein at least one of the first plate-like body and the second plate-like body is a glass plate.   The manufacturing method of the structure for mold manufacture of any one of Claims 1-6 which further has the etching protective film formation process which forms the etching protective film for formation of the said uneven | corrugated pattern. A method for producing a mold having an uneven pattern for imprinting,
A joining step of facing the joining surface of the first plate-like body and the joining surface of the second plate-like body, joining the first plate-like body and the second plate-like body, and obtaining a joined body;
A step removing step of removing a step on the outer peripheral surface of the joined body;
The manufacturing method of a mold which has a concavo-convex pattern formation process which forms the concavo-convex pattern in the field on the opposite side to the joined surface of the 2nd plate-shaped object.   The mold production according to claim 8, wherein in the step removing step, the step is removed by grinding an outer peripheral surface of the joined body or by grinding an outer peripheral surface of the joined body and then polishing. Method.   The mold manufacturing method according to claim 8, wherein a removal layer for removing the step is formed on the outer peripheral surface of the joined body in the step removing step.   The method for manufacturing a mold according to any one of claims 8 to 10, further comprising a through hole forming step of forming a through hole penetrating the first plate-like body before the joining step. Before the joining step, a mesa portion forming step of forming a mesa portion surrounded by a step on the surface opposite to the joining surface of the second plate-like body,
The method for producing a mold according to claim 8, wherein in the uneven pattern forming step, an uneven pattern is formed on the surface of the mesa portion.   The mold manufacturing method according to claim 8, wherein the uneven pattern forming step is performed before the joining step.   The method for manufacturing a mold according to any one of claims 8 to 13, wherein at least one of the first plate-like body and the second plate-like body is a glass plate.

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