JP2012060141A - Transfer mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a transfer mold which transfers a minute pattern to an object to be shaped by pushing the mold to the object to be shaped and is produced easily.SOLUTION: A transferring mold 41 transfers a minute pattern to an object 13 to be shaped by pushing the mold to the object 13 to be shaped. The transferring mold 41 comprises: a base member 103 which is attachable/detachable to/from a transfer device 1 for carrying out transfer and has rigidity against receiving force while being attached to the transfer device 1 and receiving force when attached/pushed to the transfer device 1; and a mold member 104 low in rigidity in which a minute transfer pattern is formed and which is stuck integrally to the base member 103.

Description

  The present invention relates to a transfer mold, and more particularly, to a transfer mold constituted by a base member and a mold member on which a fine transfer mold is formed.

  In recent years, a mold (template, stamper) is produced by forming an ultra-fine transfer pattern on a quartz substrate or the like by an electron beam drawing method, etc., which is formed on the surface of the substrate to be transferred (molded product) as a molded product (substrate). Research and development has been made on a nanoimprint technique in which the mold is pressed against the resist film with a predetermined pressure to transfer a transfer pattern formed on the mold (see Non-Patent Document 1).

  Further, as a device for executing the nanoimprint, for example, a transfer device described in Patent Document 1 is known. In this transfer device, an X stage and a Y stage are provided at the lower horizontal portion of an L-shaped frame, and a substrate table as a support portion for a molded product is mounted thereon, and an upper and lower direction is placed above the vertical portion of the frame. A mold support (mold holder) is provided via a moving mechanism. The mold holding body includes a flat portion, and the flat portion holds a mold on which an ultra fine transfer pattern for transfer is formed.

  Then, the substrate table is appropriately positioned in the X-axis direction and the Y-axis direction using the X stage and the Y stage, the mold holder is lowered, and the flat substrate (the object to be molded) is pressed with the mold to the substrate. The transfer of ultra-fine transfer patterns is performed.

JP 2004-34300 A

Precision Engineering Journal of the International Societies for Precision Engineering and Nanotechnology

  By the way, the mold used for the transfer described above must have a certain degree of rigidity (for example, a certain thickness) so as not to be easily deformed by the force received by the pressing during the transfer.

  However, there is a problem that it is generally difficult to form a fine transfer pattern on a mold having a certain thickness.

  That is, a transparent mold such as quartz glass is generally produced by a process similar to the semiconductor manufacturing process. More specifically, a fine pattern is formed on a quartz surface by using an electron beam drawing apparatus or the like, and a mold is created by etching. However, a fine pattern is formed by using a semiconductor manufacturing apparatus that forms a semiconductor pattern on a wafer. Since the pattern for transfer is generated, it becomes difficult to create the pattern when the mold becomes thick.

  The present invention has been made in view of the above problems, and is a transfer mold for transferring a fine pattern to a molding target by pressing it against the molding target, which is easy to manufacture. The purpose is to provide a type.

  The invention according to claim 1 is detachable from a transfer device for performing the transfer in a transfer mold for transferring a fine pattern to the object to be molded by being pressed against the object to be molded, and A base member having rigidity with respect to a force received when attached to the transfer device and a force received when pressed against the transfer device and the fine transfer pattern are formed, and the base It is a transfer mold having a mold member with low rigidity that is integrally attached to the member.

  According to a second aspect of the present invention, in the transfer mold according to the first aspect, the mold member is affixed to the base member using an adhesive, and the affixing is performed on the transfer device. It is a mold for transfer which is performed by using.

  According to a third aspect of the present invention, in the transfer mold for transferring a fine pattern to the molding target by being pressed against the molding target, the transfer mold for performing the transfer is detachable from the mold. A thick plate-like transparent base member having sufficient rigidity with respect to the force received when it is attached to the transfer device and pressed, and the fine transfer pattern is formed, and the base member is UV-cured. And a plate-shaped transparent mold member which is integrally attached with a transparent adhesive of the formula and formed thinner than the base member.

  A fourth aspect of the present invention is the transfer mold according to the third aspect, wherein the attaching is performed by using the transfer device.

  According to the present invention, it is possible to provide a transfer mold that transfers a fine pattern onto the molding target by pressing against the molding target and can be easily manufactured. Play.

1 illustrates an overall configuration of a transfer apparatus according to an embodiment of the present invention. 1 illustrates an overall configuration of a transfer apparatus according to an embodiment of the present invention. 1 illustrates an overall configuration of a transfer apparatus according to an embodiment of the present invention. It is a figure which shows the detail of the gimbal mechanism 45. FIG. It is a figure which shows the detail of the gimbal mechanism 45. FIG. It is a figure which shows the detail of the gimbal mechanism 45. FIG. It is a figure which shows schematic structure etc. of the type | mold 41 for transcription | transfer. FIG. 8 is a view taken along arrow VIII in FIG.

  1 to 3 illustrate the overall configuration of a transfer device 1 according to an embodiment of the present invention. In FIGS. 1 and 2, reference numeral 1 denotes a transfer device, and 3 denotes a main body frame. As shown in FIG. 1, the body frame 3 is generally L-shaped when viewed from the side, and a rectangular lower frame 7 as a base frame is integrally attached to the lower side. At the four corners of the lower frame 7, tie bars 9 are erected in parallel with the vertical portion of the main body frame 3, and at the upper end of the tie bar 9, a rectangular upper frame 5 as a support frame for supporting the driving means. Is attached. The tie bar 9 is movable between the upper frame 5 and the lower frame 7 in a direction along which the quadrangular movable body 19 is along the tie bar 9 (a direction toward or away from a table 11 described later), that is, up and down. Are loosely fitted.

  The upper part of the main body frame 3 protrudes forward (to the right in FIG. 1) so as to reach the position of approximately half (middle) in the front-rear direction on both the left and right side surfaces of the upper frame 5 and the movable body 19, and vertically extends at the tip An extending linear guide (guide means) 21 is attached. Sliders 23 and 24 are attached to the left and right side surfaces of the upper frame 5 and the movable body 19 so as to engage with the linear guide 21 and to be accurately guided up and down with, for example, zero clearance.

  As understood from the above description, the main body frame 3 is provided with a frame support portion 3A for supporting the lower frame (base frame) 7 on one end side (lower end side), so that when viewed from the side, FIG. As shown in FIG. 2, it is generally L-shaped. And, by providing the guide frames 3B provided with the linear guides 21 on the left and right sides (both sides in the direction perpendicular to the paper surface in FIG. 1) on the other end side (upper end side) of the main body frame 3, It is the structure which formed the recessed part in the upper end side (other end side).

  As shown in FIG. 3, the upper frame 5 and the movable body 19 are disposed between the left and right guide frames 3B in the main body frame 3, and the upper frame 5 and the movable body 19 are provided with the The sliders 23 and 24 are centered on the center of the upper frame 5 and the movable body 19 in the front-rear direction (left-right direction in FIGS. 1 and 3) and left-right direction (direction perpendicular to the paper surface in FIG. 1, up-down direction in FIG. 3). The linear guide 21 is movably engaged at a symmetrical position. In FIG. 1, the linear guide 21 is shared by the sliders 23 and 24. However, linear guides corresponding to the sliders 23 and 24 can be provided separately. However, considering the ease of processing and the processing accuracy of the parallelism, it is desirable to provide the linear guide 21 in common for the sliders 23 and 24.

  Here, the upper frame 5 is fixed to the lower frame 7 and the main body frame 3 via the tie bars 9, but when the tie bar 9 expands and contracts due to a pressing force of a mold or a temperature change described later, the upper frame 5 The linear guide 21 and the slider 23 are provided in order to allow the movement and to prevent a positional shift (lateral shift) of the upper frame 5 in a plane perpendicular to the tie bar 9 caused by bending or expansion / contraction of the tie bar 9. This is for more reliably preventing the positional deviation (lateral deviation) of the upper frame 5, and the upper frame 5 may be separated from the main body frame 3 and connected and fixed to the lower frame 7 by the tie bar 9.

  Since the movable body 19 is loosely fitted to the tie bar 9 as described above, the movement in the vertical direction is precisely guided by the linear guide 21 and the slider 24.

  The linear guide 21 and the sliders 23 and 24 are symmetrical with respect to the front, rear, left and right centers of the upper frame 5 and the movable body 19 in order to prevent positional displacement (lateral deviation) due to temperature changes of the upper frame 5 and the movable body 19 itself. It is preferable to arrange in a position.

  A fixed base 10 extending vertically upward is attached to the center of the upper surface of the lower frame 7. As shown in FIG. 2, a movable table 11 that can be moved in the X and Y directions (front and rear, left and right directions) and that can be finely positioned is provided on the fixed base 10. On the table 11, a support base 15 for supporting the product 13 is provided. A substrate (molded product) 13 supplied with the molding material is mounted on the movable table 11. The movable table 11 is guided by a linear guide and a slider and is driven by a servo motor. Since the movable table 11 has a known configuration, detailed description is avoided.

  The molded product (molded object) 13 is a molded layer (not shown; molding material) using a resist made of an ultraviolet curable resin or the like on the upper surface of a substrate made of an appropriate material such as silicon, glass, or ceramic. Is provided with a thin film coated with a thickness of several tens nm to several μm.

  As shown in FIG. 2, a load cell which is an example of a detecting means for detecting a pressing force of the mold 41 against the molded product 13 is provided at the center of the lower surface of the movable body 19 (the center of the facing surface facing the base frame). A swivel base 47 is attached via 46 so that it can turn around the center of the lower surface of the movable body 19 and can be fixed at a predetermined angular position. A mold support plate (mold holder) 43 is attached to the swivel base 47 via a gimbal mechanism 45, and the mold 41 is detachably attached to the mold support plate 43.

  The gimbal mechanism 45 has a spherical surface centered on the center of the mold surface (lower surface in FIG. 2) of the mold 41, and the mold 41 can freely tilt around the center of the mold surface. As will be described in detail later, the mold 41 has a fine uneven pattern formed on the mold surface (the lower surface in FIG. 2) using a lithography technique. Each of the mold support plate 43, the gimbal mechanism 45, the swivel base 47, and the load cell 46 has a through-hole for allowing ultraviolet rays to pass through in the center.

  A servo motor 33 as an example of a driving means for moving the movable body 19 (moving forward and backward in the vertical direction) is mounted and supported on the upper frame 5 as a support frame. The output shaft 35 of the servo motor 33 is connected to a hollow shaft 31 that is rotatably attached to the upper frame 5 by a bearing 29. A ball screw nut 26 constituting the ball screw mechanism 25 is provided at the lower end of the hollow shaft 31. It is attached. The ball screw nut 26 engages with a ball screw shaft 27 that is vertically attached and fixed to the center (center) of the front, rear, left, and right of the movable body 19 to move the movable body 19 up and down at a predetermined speed and torque. It is like that. Reference numeral 33 </ b> A is a rotary encoder that detects the rotational position of the servomotor 33.

  The upper frame 5 is provided with a plurality of balance cylinders 50 as an example of balancing means at symmetrical positions with the center of the movable body 19 as shown in FIG. The piston rods 52 of these balance cylinders 50 are respectively connected to the movable body 19 so as to cancel the downward load of the movable body 19 due to gravity.

  A ring-shaped upper cover 54 surrounding the mold support plate 43 and the like is attached to the lower surface of the movable body 19. On the other hand, on the lower frame 7 side, the lower end is movably engaged with the peripheral surface of the fixed base 10, and the upper end is formed so as to be able to abut on the lower end of the upper cover 54 so as to surround the movable table 11 and the like. A lower cover 56 is attached. The lower cover 56 is moved up and down by a plurality of cylinders 58 as an example of vertical movement actuators attached to the lower frame 7, and can be opened and closed around the mold support plate 43 and the movable table 11 by the upper cover 54. A molding chamber 60 is formed.

  Next, the operation of this transfer device will be described. The lower cover 56 is lowered by a cylinder 58 serving as a vertical movement actuator to open the molding chamber 60, the mold 41 is attached to the mold support plate 43, and the mounting angle in the horizontal rotation direction around the center of the mold 41 (the direction of the mold) ) Is finely adjusted by the turntable 47. The mounting angle adjustment of the mold 41 is automatically performed not only when the mold is mounted but also every time according to the molded product 13 set on the support base 15 by a known positioning means using a mark. Fine adjustment may be made.

  After the mold 41 is set as described above, the molded product 13 having the molding layer coated on the upper surface is set on the support base 15.

  Next, the lower cover 56 is raised by the cylinder 58 to close the molding chamber 60, the movable body 19 is lowered with the torque of the servo motor 33 set to a relatively small value, and the die 41 is moved closer to the product 13. The mold 41 is pressed against the upper surface of the product 13 with a relatively small pressing force.

  At this time, the movable body 19 is lowered by the linear guides 21 and the sliders 24 arranged on both the left and right sides, and the position shift (lateral shift) in the direction orthogonal to the moving direction is suppressed to a lower level. It is pressed toward 13 predetermined positions. At this time, since the movable body 19 is offset by the balance cylinder 50 with the downward load due to gravity, the servo motor 33 can be operated with a smaller torque, and the torque and speed are controlled more accurately and lowered. To do.

  When the mold 41 is pressed against the molded product 13, if there is a deviation in the parallelism between the contact surfaces (contact surfaces) of the two, the mold 41 is supported by the gimbal mechanism 45 so as to be tiltable. The entire surface of the mold 41 is pressed with a uniform surface pressure following the upper surface of the mold. At this time, the gimbal mechanism 45 is tilted about the center of the mold surface by the spherical surface centered on the mold surface (lower surface in FIG. 2) of the mold 41, so that no lateral (horizontal) misalignment occurs. .

  The pressing force is detected by the load cell 46, fed back to the servo motor 33, and kept at a predetermined value. Also at this time, the load of the movable body 19 is canceled by the balance cylinder 50, and the torque of the servo motor 33 is a smaller value, so that the torque control is performed more accurately.

  When the pressing with the relatively small pressing force is completed in this way, the air bearing of the gimbal mechanism 45 is set to, for example, a negative pressure (specifically, by vacuum suction or the like as described later in the detailed description of the gimbal mechanism 45). After fixing the posture in the immobile state, the torque of the servo motor 33 is increased. Due to this torque increase, the mold 41 is strongly pressed against the molding layer applied to the upper surface of the molded product 13, and the fine uneven pattern formed on the surface of the mold 41 is transferred to the molding layer of the molded product 13. To do.

  Due to the strong pressing force of the mold 41, the tie bar 9 extends slightly but displaces the upper frame 5 upward. The displacement of the upper frame 5 is absorbed by the linear guide 21 and the slider 23, and there is no problem that the upper part of the main body frame 3 is bent leftward in FIG. Therefore, a positional shift (lateral shift) in a direction orthogonal to the moving direction of the mold 41 due to the pressing of the mold 41 is suppressed.

  Further, since the upper frame 5 is supported by the linear guide 21 and the slider 23, even when there is a difference in the elongation of the plurality of tie bars 9, the positional deviation (lateral deviation) of the upper frame 5 is suppressed to a small level. The positional deviation (lateral deviation) of the mold 41 is kept small.

  The difference in elongation of the tie bar 9 is very small when the pressing force of the die 41 is relatively small. Therefore, the guide means for the upper frame 5 by the linear guide 21 and the slider 23 may be omitted. .

  After the transfer, the molding layer is cured and the molding layer is cured, and then the movable body 19 is raised by the servomotor 33 while the posture of the mold 41 is fixed, and the mold 41 is separated from the molded article 13. Next, the lower cover 56 is lowered by the cylinder 58, the molding chamber 60 is opened, the molded product 13 is taken out, and a series of transfer operations is completed.

  Here, the gimbal mechanism 45 will be described in detail.

  4 to 6 are diagrams showing details of the gimbal mechanism 45, FIG. 4 is a vertical sectional view in the vertical direction of the gimbal mechanism 45, FIG. 5 is an enlarged view of the spherical portion of the gimbal mechanism 45 and its vicinity, and FIG. FIG. 6 is a view showing a spherical surface portion of the second gimbal member 203 and a view taken along arrow VI in FIG. 5.

  In FIG. 4, a lower gimbal member (first gimbal member) 201 having a through hole at the center and having a convex spherical portion upward, and an upper gimbal having a through hole at the center and having a concave spherical portion below. A member (second gimbal member) 203 is disposed in contact with the member. The lower gimbal member 201 may be provided with a concave spherical surface portion, and the upper gimbal member 203 may be provided with a convex spherical surface portion.

  A mold holder (mold support plate) 43 is fixed (held) to the lower part of the lower gimbal member 201. A through hole is also provided in the center of the mold support plate 43, and the mold 41 is attached to the lower surface of the mold holding body 43 (the surface side of the table 11).

  And the ultraviolet-ray which the ultraviolet-ray generator (not shown) generate | occur | produced reaches | attains the type | mold 41 through each gimbal member 201,203 and the through-hole of the type | mold holding body 43, and also permeate | transmits the type | mold 41, and to-be-molded goods It reaches to 13.

  The gimbal mechanism 45 is provided with posture adjusting and holding means for adjusting and holding the posture of the lower gimbal member 201.

  The posture adjusting and holding means includes an air ejection pipe 213 for injecting air from the upper gimbal member 203 toward the lower gimbal member 201, and an air source (compressed air) connected to the pipe 213. Supply source) 217. The pipe line 213 is formed inside the upper gimbal member 203 and opens to the concave spherical surface portion of the upper gimbal member 203.

  Further, the posture adjusting and holding means includes a evacuation pipe 211 for evacuating the lower gimbal member 201 toward the upper gimbal member 203, and a vacuum evacuation device connected to the pipe 211 ( Negative pressure generating means) 215. The pipe line 211 is formed inside the upper gimbal member 203 and opens to the concave spherical surface portion of the upper gimbal member 203.

  Then, under the control of a control device (not shown), during the molding of the molded product 13, the pressing force of the mold 41 against the substrate (molded product 13) is detected by the load cell 46, and the pressing force is a predetermined value. If the pressure is smaller than the above, the vacuuming (evacuation from the pipe 211) is stopped and the air is ejected, and the pressing force detected by the load cell 46 becomes larger than a predetermined value. In addition, the air evacuation (air blast from the pipe 213) is stopped and the evacuation is started.

  More specifically, the upper gimbal member 203 is provided with an air release conduit 216 that opens to the contact surface (concave spherical surface portion).

  Further, as shown in FIG. 6, ring-shaped grooves 301, 303, 305, 307, and 309 are provided on the spherical surface portion of the upper gimbal member 203. Each of these ring-shaped grooves has a concentric circle centered on the center of the spherical surface portion of the upper gimbal member 203 and is provided away from each other. Further, the suction pipe 211 connected to the vacuuming device 215 communicates with the innermost groove 301 and the outermost groove 309, and each of the grooves 301, An air opening conduit 216 communicates with the grooves 303 and 307 positioned between the grooves 309, and a compressed air supply source 217 is connected to the grooves 305 positioned between the grooves 303 and 307. The connected levitation pipeline 213 communicates.

  As described above, the groove 303 is provided between the groove 301 and the groove 305, and the groove 307 is provided between the groove 305 and the groove 309, so that the air blown from the pipe 213 enters the pipe 211. Intrusion can be prevented.

  On the convex spherical surface portion of the lower gimbal member 201, an inclined surface 219 of a protruding portion is formed adjacent to the convex spherical surface portion. As shown in FIG. 4, the inclined surface 219 is formed as an inclined surface inclined so that the upper side is separated from the axis of the lower gimbal member 201 or a tapered surface having a large diameter on the upper side. The upper gimbal member 203 is also formed with an inclined surface (tapered surface) 220 facing the inclined surface 219. The inclined surface 219 and the inclined surface 220 are slightly separated from each other.

  Reference numeral 218 denotes an adjustment liner that adjusts the distance between the inclined surface 219 of the lower gimbal member 201 and the opposing surface (inclined surface) 220 of the upper gimbal member 203.

  A rotating member 235 is fixed to the upper surface of the upper gimbal member 203, and an inner fixing member 239 is disposed on the inner peripheral side of the rotating member 235 via a rotating bearing 237. Further, a plate 241 is attached and fixed to the upper surface of the inner fixing member 239. The plate 241 and the inner fixing member 239 are formed with a conduit (for example, a conduit connected to the compressed air supply source 217) 243 for introducing compressed air. As shown in the figure, this compressed air causes the rotating member 235 to float statically in the vertical direction.

  The rotating member 235 can be rotated clockwise and counterclockwise by a pair of piezo hammers 221A and 221B. The frames of the piezo hammers 221A and 221B are fixed to the plate 241.

  The above-described piezo hammers 221A and 221B can each be provided as an option. That is, when the gimbal mechanism 45 does not need to be rotated and rotated as in the case of forming a product having fine irregularities on the circumference such as a CD or DVD, the rotating member is used. 235, the inner fixing member 239, and the piezo hammers 221A and 221B can be omitted.

  In FIG. 4, a load cell 46 is integrally provided on the upper surface of the plate 241. Reference numeral 46A is a signal extraction terminal. The upper surface of the load cell 46 is integrally installed on the movable body 9.

  Instead of injecting air from the upper gimbal member 203 toward the lower gimbal member 201, air may be injected from the lower gimbal member 201 toward the upper gimbal member 203. Further, when evacuating the lower gimbal member 201 toward the upper gimbal member 203, a vacuum evacuation conduit may be provided in the lower gimbal member 201.

  Next, the operation of the gimbal mechanism 45 and the like when performing transfer with the transfer apparatus 1 will be described.

  First, as an initial state, it is assumed that the movable body 19 is raised and the mold 41 and the molded product 13 are set. Further, it is assumed that evacuation and air ejection using the pipes 211 and 213 are stopped.

  From this initial state, under the control of a control means (not shown), the movable body 19 descends at a high speed to a predetermined position (a position where the mold 41 and the product 13 are slightly separated).

  When the movable body 19 is lowered to a predetermined position, the lowering speed of the movable body 19 is switched to a low speed, and air is blown out from the pipe 213 so that it is slightly between the spherical surface portion of the upper gimbal member 203 and the spherical surface portion of the lower gimbal member 201. A gap is formed so that the lower gimbal member 201 can easily turn with respect to the upper gimbal member 203. At this time, evacuation from the pipe 211 is stopped.

  Subsequently, it is detected whether or not the force detected by the load cell 46 exceeds a predetermined value. When the force detected by the load cell 46 exceeds a predetermined value, the mold 41 follows the posture of the product 13.

  When the force exceeds a predetermined value, the ejection of air from the pipe 213 is stopped and the vacuum from the pipe 211 is evacuated, and the spherical surface of the lower gimbal member 201 is vacuumed to the spherical surface of the upper gimbal member 203. The lower gimbal member 201 is fixed to the upper gimbal member 203 so that the lower gimbal member 201 does not rotate or swing (such as swing).

  Subsequently, the mold 41 is pressed against the molded product 13 with a predetermined force for a predetermined time, the molding material of the molded product 13 is cured with ultraviolet rays, and the transfer is performed. Preparing for the transfer of

  By the way, the pipe 211 for evacuation in the transfer device 1 is deleted and continuously during the molding operation of the molded product 13 (including during the adjustment of the posture of the lower gimbal member 201). Air may be ejected from the pipe 213. Further, when the pressing force detected by the load cell 46 is smaller than a predetermined value during the molding of the article 13, air is ejected, and the pressing force detected by the load cell 16 is lower than the predetermined value. You may comprise so that the ejection of the said air may be stopped when it becomes large.

  Further, the pipe 213 and the like for ejecting air in the transfer device 1 are deleted, and when the pressing force detected by the load cell 46 is smaller than a predetermined value during molding of the molded product 13, vacuuming is performed. May be stopped, and the evacuation may be started when the pressing force detected by the load cell 46 becomes larger than a predetermined value.

  In the operation of the transfer device 1 (gimbal mechanism 45) described above, the mold 41 is directly pressed against the molding surface of the molded product 13 to follow the mold 41. The mold 41 may be copied by pressing the mold 41 against this adjustment surface.

  Also, the configuration shown in FIGS. 1 and 2 can be turned upside down or horizontally. That is, in the above description, the case of the vertical configuration is exemplified, but the vertical configuration may be reversed upside down or the horizontal configuration, and various configurations can be adopted.

  Further, as shown by a two-dot chain line in FIG. 4, a fluid pressure cylinder (for example, a pneumatic cylinder) 257 is appropriately provided, and the inclined surface 219 of the lower gimbal member 201 is urged, and the spherical portion of the lower gimbal member 201 is moved upward. You may press against the spherical part of the gimbal member 203. Further, instead of or in addition to the fluid pressure cylinder 257, an elastic body (for example, a compression coil spring) is used to bias the inclined surface 219 of the lower gimbal member 201, and the spherical surface portion of the lower gimbal member 201 becomes the upper gimbal member. You may press against the spherical surface part 203.

  Next, the transfer mold 41 will be described in detail.

  FIG. 7 is a diagram showing a schematic configuration and the like of the transfer mold 41, and FIG. 8 is a view taken along arrow VIII in FIG.

  As described above, a fine pattern is transferred to the molding target 13 by pressing the transfer mold (mold) 41 against the molding target 13 with a predetermined force. The restraint member 101 is integrally attached to the mold holding body 43.

  The mold 41 includes a base member 103 and a mold member 104. The base member 103 is detachable from the transfer device 1 for transferring. The base member 103 receives a force when attached to the transfer device 1, a force received when attached to the transfer device 1, and is pressed against the molding target 13 attached to the transfer device 1 (press for transfer). It has sufficient rigidity against the force received when it is rubbed.

  More specifically, the base member 103 is formed in a square frustum shape having a predetermined height (thickness). In other words, it is formed in a thick flat plate shape. The restraining member 101 is engaged with the side surface (oblique side surface) of the base member 103. Further, a set screw 105 is screwed to the restraining member 101.

  Then, the restraining member 101 is fixed to the mold holding body 43 with a fastening member such as a bolt, and the base member 103 is pushed by the set screw 105 via the set shoe 107, whereby the side surface of the base member 103 is pushed against the restraining member 101. The bottom surface of the base member 103 (the surface having the larger area among both surfaces in the thickness direction; the surface existing above the base member 103 in FIG. 3) is pressed against the mold holder 43, and the base member 103 is The mold holder 43 is integrally attached (installed). Further, the base member 103 can be detached from the mold holding body 43 by loosening the set screw 105 and removing the restraining member 101 from the mold holding body 43.

  When the mold 41 (base member 103) is attached to or attached to the transfer device 1, the base member 103 is deformed because a force is applied to or applied to the base member 103, but the amount of deformation is very small. There is no adverse effect on the accuracy of the fine transfer pattern transferred to the molding target 13 even if such slight deformation occurs.

  As can be understood from FIGS. 7 and 8, when the base member 103 installed on the mold holder 43 is viewed from the thickness direction, the base member 103 is irradiated with ultraviolet rays provided on the mold holder 43. The base member 103 is installed on the mold holding body 43 by covering the through hole for the lid and contacting the annular peripheral portion of the base member 103 with the mold holding body 43.

  As described above, since the base member 103 is supported by the mold holding body 43 at the annular peripheral portion, force is applied to the base member 103 by pressing for transfer (pressing the mold 41 against the molding target 13). However, the base member 103 is easily deformed at the portion of the through hole. However, since the base member 103 is formed thick, the amount of deformation is very small, and even if this slight deformation occurs, the base member 103 is covered. The precision of the fine transfer pattern transferred to the molding object 13 is not adversely affected.

  A fine transfer pattern is formed on a part of the mold member 104, and the mold member 104 is integrated with the base member 103 at another part of the mold member 104 via, for example, an ultraviolet curable adhesive 109. Pasted.

  More specifically, the mold member 104 is formed in a rectangular flat plate shape that is thinner than the base member 103, for example, corresponding to the form of the base member 103, and one surface in the thickness direction (the lower side in FIG. 7). A fine transfer pattern is formed on the surface. Further, the entire surface of the other surface in the thickness direction (the upper surface in FIG. 7) is the upper surface of the base member 103 of the quadrangular pyramid via the adhesive 109 (the surface having the smaller area of both surfaces in the thickness direction). A surface existing below the base member 103 in FIG.

  Note that the mold member 104 formed in a thin flat plate shape has a small rigidity and easily deforms so that the flat surface becomes a curved surface with respect to an external force. However, the mold member 104 is integrated with the base member 103 via an adhesive 109. As a result of being affixed, the external force is deformed only slightly as in the case of the base member 103.

  That is, when only the mold member 104 is attached to the transfer apparatus 1 and pressed so as to perform transfer using only the mold member 104, the mold member 104 is applied by the force applied by the attachment to the transfer apparatus 1 or the pressing for transfer. However, it is greatly deformed especially at the through-hole for ultraviolet irradiation, and accurate transfer cannot be performed. However, since it is attached to the base member 103 integrally, Even when force is applied to the mold member 104, the mold member 104 is hardly deformed like the base member 103. The transfer can be performed without adversely affecting the accuracy of the fine transfer pattern.

  As shown in FIG. 8, when the transfer mold 41 in which the mold member 104 is attached to the base member 103 is viewed from the thickness direction, the mold member 104 is smaller than the base member 103. The mold member 104 is accommodated inside, but the base member 103 and the mold member 104 may be overlapped with the base member 103 and the mold member 104 being substantially the same in size and being substantially the same.

  The base member 103 and the mold member 104 are made of a transparent material such as quartz glass, other glass, or a resin material so as to transmit ultraviolet rays. The adhesive 109 also transmits ultraviolet rays. As the adhesive, for example, an optical path coupling adhesive used for joining optical fibers, or a precision adhesive that becomes transparent upon curing can be employed.

  Further, the base member 103 and the mold member 104 shown in FIGS. 7 and 8 are formed in a rectangular shape when viewed in the thickness direction, but may be formed in other shapes such as a circular shape. Furthermore, it is not limited to a flat plate shape, and for example, a configuration in which the mold member 104 is attached to a curved surface such as a cylindrical side surface shape or a spherical shape of the base member 103 may be employed.

  The mold member 104 is attached to the base member 103 using the transfer device 1 as in the case of the transfer described above. For example, if the base member 103 is installed on the mold holding body 43, the mold member 104 coated with ultraviolet curable resin is set on the support base 15, the mold member 104 is pressed by the base member 103, and ultraviolet rays are irradiated. Then, the mold member 104 is attached to the base member 103.

  According to the transfer mold 41, the mold 41 includes the thick base member 103 having rigidity and the thin mold member 104. Therefore, when the thin mold member 104 is formed, a semiconductor manufacturing apparatus is used. The mold 41 can be easily manufactured, and the mold 41 is hardly deformed even when a pressing force is applied to the mold 41 (the mold member 104 and the base member 103) to be transferred to the object 13 to be molded. Transfer can be performed.

  Further, since a fine transfer pattern is provided on the mold member 104, which is thin because of its low material cost, even if a failure occurs in the process of providing this fine transfer pattern, the loss of material cost can be kept small.

  Further, according to the transfer mold 41, there is a thin layer of adhesive 109 between the base member 103 and the mold member 104, and the rigidity of the layer of adhesive 109 is that of the base member 103 and the mold member 104. In other words, since the adhesive 109 is more elastic than the base member 103 and the mold member 104, the adhesive 109 becomes a subtle cushion, and when pressing for transfer, for example, the gimbal is lower than the rigidity. Even if the mechanism 45 is not used, the parallelism between the transfer target surface of the molding target 13 and the surface on which the fine pattern of the mold 41 is formed can be made good, and accurate transfer can be performed. Can do.

  In addition, since the base member 103 and the mold member 104 are attached to each other with the adhesive 109, when changing the form of the fine transfer pattern, the mold member 104 is peeled off from the base member 103 and another fine transfer is performed. A mold member on which a pattern is formed may be affixed to the base member 103, so that material costs can be reduced.

  Further, if the mold member 104 is attached to the base member 103 using the transfer apparatus 1, the mold member 104 can be easily attached to the base member 103 without the need for a separate apparatus. it can.

  Furthermore, in the base member 103, a portion for holding the mold 41 of the transfer apparatus 1 (a portion of the die holding body 43) has an ultraviolet irradiation hole, but the base member 103 has a sufficient thickness. When pressing for transferring, not only the part (peripheral part of the mold 41) that is not opposed to the hole even if force is applied to the mold 41, but the part that is opposed to the hole (central part of the mold 41) However, the mold 41 hardly deforms and can perform accurate transfer.

  In the transfer device 1, ultraviolet rays are applied from above the mold 41. However, when the molding target 13 is transparent, the ultraviolet rays may be applied to the molding target 13 from below the molding target 13. . Alternatively, a molding layer using a resist made of a thermosetting resin may be formed on the molding target 13 and transferred by heat instead of ultraviolet rays. In these cases, the penetration of the mold holder 43 and the ultraviolet irradiation device are not necessary, and a thermosetting adhesive may be adopted as the adhesive 109.

DESCRIPTION OF SYMBOLS 1 Transfer apparatus 13 Molding object 41 Transfer mold 43 Mold holder 101 Restraining member 103 Base member 104 Mold member 109 Adhesive

According to a first aspect of the present invention, there is provided a transfer die manufacturing method for transferring a fine pattern onto a molding target by pressing the molding target, and a frustum-shaped base member having a predetermined thickness. This is a transfer mold manufacturing method including an attaching step of attaching a plate-shaped mold member having a fine transfer pattern formed on the upper bottom surface with a smaller area and thinner than the base member.

The invention described in claim 2 is the method for manufacturing a transfer mold according to claim 1 , wherein the attaching step is a step performed using an adhesive.

The invention described in claim 3 is the method for manufacturing a transfer mold according to claim 2, wherein the base member, the mold member, and the adhesive are transparent.

According to a fourth aspect of the present invention, in the method for manufacturing a transfer mold according to any one of the first to third aspects, the pasting step is performed on the object to be molded using the mold. A method for producing a transfer mold, which is a process performed by placing the base member and the mold member in a transfer device used when transferring a simple pattern and pressing the mold member with the base member. is there.

Claims (4)

In a transfer mold for transferring a fine pattern to the molding target by pressing against the molding target,
The transfer device is detachable from the transfer device for performing the transfer, and has rigidity with respect to the force received when attached to the transfer device and the force received when pressed against the transfer device. A base member;
A mold member having a small rigidity, in which the fine transfer pattern is formed and integrally attached to the base member;
A transfer mold characterized by comprising: The transfer mold according to claim 1,
The mold member is affixed to the base member using an adhesive,
The transfer mold, wherein the pasting is performed using the transfer device. In a transfer mold for transferring a fine pattern to the molding target by pressing against the molding target,
A thick plate-like transparent base member that is detachable from a transfer device for performing the transfer, and has sufficient rigidity with respect to the force that is applied to the transfer device when pressed. ;
A plate-shaped transparent mold member formed with the fine transfer pattern, which is integrally attached to the base member with an ultraviolet curable transparent adhesive, and formed thinner than the base member;
A transfer mold characterized by comprising: In the transfer mold according to claim 3,
The transfer mold, wherein the pasting is performed using the transfer device.

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