WO2009072603A1 - パターン描画方法および装置 - Google Patents
パターン描画方法および装置 Download PDFInfo
- Publication number
- WO2009072603A1 WO2009072603A1 PCT/JP2008/072151 JP2008072151W WO2009072603A1 WO 2009072603 A1 WO2009072603 A1 WO 2009072603A1 JP 2008072151 W JP2008072151 W JP 2008072151W WO 2009072603 A1 WO2009072603 A1 WO 2009072603A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid droplet
- substrate
- wettability
- suppressed
- fine
- Prior art date
Links
- 239000007788 liquid Substances 0.000 abstract 7
- 239000000758 substrate Substances 0.000 abstract 5
- 238000005516 engineering process Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/111—Preheating, e.g. before soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/745,295 US8398227B2 (en) | 2007-12-06 | 2008-12-05 | Pattern drawing method and pattern drawing apparatus |
JP2009544735A JP5187913B2 (ja) | 2007-12-06 | 2008-12-05 | パターン描画方法および装置 |
KR1020107012949A KR101220628B1 (ko) | 2007-12-06 | 2008-12-05 | 패턴 묘화 방법 및 장치 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007316154 | 2007-12-06 | ||
JP2007-316154 | 2007-12-06 | ||
JP2008-195512 | 2008-07-29 | ||
JP2008195512 | 2008-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009072603A1 true WO2009072603A1 (ja) | 2009-06-11 |
Family
ID=40717781
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/072151 WO2009072603A1 (ja) | 2007-12-06 | 2008-12-05 | パターン描画方法および装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US8398227B2 (ja) |
JP (1) | JP5187913B2 (ja) |
KR (1) | KR101220628B1 (ja) |
WO (1) | WO2009072603A1 (ja) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011005404A (ja) * | 2009-06-25 | 2011-01-13 | Dainippon Screen Mfg Co Ltd | 配線形成装置、配線形成方法および配線形成用材料 |
JP2011204748A (ja) * | 2010-03-24 | 2011-10-13 | Fukuoka Univ | 配線パターン形成方法、及び配線基板 |
JP2014022149A (ja) * | 2012-07-17 | 2014-02-03 | Dainippon Screen Mfg Co Ltd | 電池用電極製造装置、電池用電極製造のためのノズルおよび電池用電極の製造方法 |
WO2014050252A1 (ja) | 2012-09-26 | 2014-04-03 | 富士フイルム株式会社 | パターン形成方法、電子配線基板、光学デバイスおよびパターン形成装置 |
WO2014069350A1 (ja) * | 2012-10-30 | 2014-05-08 | 独立行政法人産業技術総合研究所 | 基材上に形成した構造体、構造体の製造方法および線パターン |
JP2014185358A (ja) * | 2013-03-22 | 2014-10-02 | M&M Research Inst | レーザを用いる焼結体膜形成方法及び焼結体膜形成装置 |
JP2015030010A (ja) * | 2013-08-02 | 2015-02-16 | 株式会社タムラ製作所 | フラックス塗布方法、フラックス塗布装置及びはんだ付システム |
US9120335B2 (en) | 2012-08-30 | 2015-09-01 | Advantest Corporation | Pattern printing apparatus, pattern printing method, and test apparatus |
WO2018180803A1 (ja) * | 2017-03-29 | 2018-10-04 | 住友重機械工業株式会社 | 膜形成装置及び膜形成方法 |
WO2023074507A1 (ja) * | 2021-10-25 | 2023-05-04 | 富士フイルム株式会社 | 電子デバイスの製造方法 |
JP7404695B2 (ja) | 2019-07-30 | 2023-12-26 | 株式会社リコー | インク吐出装置、インク吐出システム及びインク吐出方法 |
JP7436262B2 (ja) | 2020-03-30 | 2024-02-21 | 本田技研工業株式会社 | 配線印刷ヘッド及び配線印刷装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015147124A1 (ja) * | 2014-03-28 | 2015-10-01 | トッパン・フォームズ株式会社 | 積層体 |
US10390433B2 (en) * | 2015-03-31 | 2019-08-20 | Texas Instruments Incorporated | Methods of forming conductive and resistive circuit structures in an integrated circuit or printed circuit board |
US10744540B2 (en) * | 2018-04-12 | 2020-08-18 | The Regents Of The University Of California | Reversing coffee-ring effect by laser-induced differential evaporation |
CN113207235A (zh) * | 2021-04-28 | 2021-08-03 | 北京航空航天大学 | 一种基于Leidenfrost现象的纳米微粒沉积方法 |
CN115213051B (zh) * | 2022-07-20 | 2023-08-15 | 郭鋆 | 一种线材实时全彩色染色机构及其使用方法和应用 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006239899A (ja) * | 2005-02-28 | 2006-09-14 | Seiko Epson Corp | パターン形成方法、識別コード形成方法、液滴吐出装置、電気光学装置の製造方法及び電気光学装置 |
JP2007042689A (ja) * | 2005-07-29 | 2007-02-15 | Fujifilm Holdings Corp | 金属アルコキシド溶液、それを用いた半導体デバイスの製造方法及び半導体デバイス |
JP2008085345A (ja) * | 2006-09-27 | 2008-04-10 | Samsung Electro Mech Co Ltd | 微細配線形成方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3975272B2 (ja) | 2002-02-21 | 2007-09-12 | 独立行政法人産業技術総合研究所 | 超微細流体ジェット装置 |
TWI562380B (en) * | 2005-01-28 | 2016-12-11 | Semiconductor Energy Lab Co Ltd | Semiconductor device, electronic device, and method of manufacturing semiconductor device |
JP2006247495A (ja) * | 2005-03-09 | 2006-09-21 | Kitakyushu Foundation For The Advancement Of Industry Science & Technology | 微細パターンの描画方法およびその装置 |
JP2007296426A (ja) * | 2006-04-27 | 2007-11-15 | Seiko Epson Corp | パターン形成方法、液滴吐出装置及び回路モジュール |
-
2008
- 2008-12-05 JP JP2009544735A patent/JP5187913B2/ja active Active
- 2008-12-05 WO PCT/JP2008/072151 patent/WO2009072603A1/ja active Application Filing
- 2008-12-05 US US12/745,295 patent/US8398227B2/en active Active
- 2008-12-05 KR KR1020107012949A patent/KR101220628B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006239899A (ja) * | 2005-02-28 | 2006-09-14 | Seiko Epson Corp | パターン形成方法、識別コード形成方法、液滴吐出装置、電気光学装置の製造方法及び電気光学装置 |
JP2007042689A (ja) * | 2005-07-29 | 2007-02-15 | Fujifilm Holdings Corp | 金属アルコキシド溶液、それを用いた半導体デバイスの製造方法及び半導体デバイス |
JP2008085345A (ja) * | 2006-09-27 | 2008-04-10 | Samsung Electro Mech Co Ltd | 微細配線形成方法 |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011005404A (ja) * | 2009-06-25 | 2011-01-13 | Dainippon Screen Mfg Co Ltd | 配線形成装置、配線形成方法および配線形成用材料 |
JP2011204748A (ja) * | 2010-03-24 | 2011-10-13 | Fukuoka Univ | 配線パターン形成方法、及び配線基板 |
JP2014022149A (ja) * | 2012-07-17 | 2014-02-03 | Dainippon Screen Mfg Co Ltd | 電池用電極製造装置、電池用電極製造のためのノズルおよび電池用電極の製造方法 |
US9120335B2 (en) | 2012-08-30 | 2015-09-01 | Advantest Corporation | Pattern printing apparatus, pattern printing method, and test apparatus |
WO2014050252A1 (ja) | 2012-09-26 | 2014-04-03 | 富士フイルム株式会社 | パターン形成方法、電子配線基板、光学デバイスおよびパターン形成装置 |
US9596758B2 (en) | 2012-09-26 | 2017-03-14 | Fujifilm Corporation | Pattern forming method, electronic wiring substrate, and optical device |
JPWO2014069350A1 (ja) * | 2012-10-30 | 2016-09-08 | 国立研究開発法人産業技術総合研究所 | 基材上に形成した構造体、構造体の製造方法および線パターン |
JP2016163888A (ja) * | 2012-10-30 | 2016-09-08 | 国立研究開発法人産業技術総合研究所 | 基材上に形成した構造体、構造体の製造方法および線パターン |
WO2014069350A1 (ja) * | 2012-10-30 | 2014-05-08 | 独立行政法人産業技術総合研究所 | 基材上に形成した構造体、構造体の製造方法および線パターン |
US9807887B2 (en) | 2012-10-30 | 2017-10-31 | National Institute Of Advanced Industrial Science And Technology | Structure formed on substrate, structure manufacturing method and line pattern |
US10212822B2 (en) | 2012-10-30 | 2019-02-19 | National Institute Of Advanced Industrial Science And Technology | Structure formed on substrate, structure manufacturing method and line pattern |
JP2014185358A (ja) * | 2013-03-22 | 2014-10-02 | M&M Research Inst | レーザを用いる焼結体膜形成方法及び焼結体膜形成装置 |
JP2015030010A (ja) * | 2013-08-02 | 2015-02-16 | 株式会社タムラ製作所 | フラックス塗布方法、フラックス塗布装置及びはんだ付システム |
WO2018180803A1 (ja) * | 2017-03-29 | 2018-10-04 | 住友重機械工業株式会社 | 膜形成装置及び膜形成方法 |
CN110446558A (zh) * | 2017-03-29 | 2019-11-12 | 住友重机械工业株式会社 | 膜形成装置及膜形成方法 |
JPWO2018180803A1 (ja) * | 2017-03-29 | 2020-02-06 | 住友重機械工業株式会社 | 膜形成装置及び膜形成方法 |
JP7404695B2 (ja) | 2019-07-30 | 2023-12-26 | 株式会社リコー | インク吐出装置、インク吐出システム及びインク吐出方法 |
JP7436262B2 (ja) | 2020-03-30 | 2024-02-21 | 本田技研工業株式会社 | 配線印刷ヘッド及び配線印刷装置 |
WO2023074507A1 (ja) * | 2021-10-25 | 2023-05-04 | 富士フイルム株式会社 | 電子デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US8398227B2 (en) | 2013-03-19 |
KR101220628B1 (ko) | 2013-01-21 |
JPWO2009072603A1 (ja) | 2011-04-28 |
US20100302319A1 (en) | 2010-12-02 |
KR20100087378A (ko) | 2010-08-04 |
JP5187913B2 (ja) | 2013-04-24 |
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