WO2009066950A2 - Heat-radiating substrate and method of manufacturing the same - Google Patents

Heat-radiating substrate and method of manufacturing the same Download PDF

Info

Publication number
WO2009066950A2
WO2009066950A2 PCT/KR2008/006865 KR2008006865W WO2009066950A2 WO 2009066950 A2 WO2009066950 A2 WO 2009066950A2 KR 2008006865 W KR2008006865 W KR 2008006865W WO 2009066950 A2 WO2009066950 A2 WO 2009066950A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
pattern
radiating
copper thin
radiating plate
Prior art date
Application number
PCT/KR2008/006865
Other languages
English (en)
French (fr)
Other versions
WO2009066950A3 (en
Inventor
Byung Chong Kim
Original Assignee
Byung Chong Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Byung Chong Kim filed Critical Byung Chong Kim
Publication of WO2009066950A2 publication Critical patent/WO2009066950A2/en
Publication of WO2009066950A3 publication Critical patent/WO2009066950A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09054—Raised area or protrusion of metal substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0323—Working metal substrate or core, e.g. by etching, deforming
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
PCT/KR2008/006865 2007-11-22 2008-11-21 Heat-radiating substrate and method of manufacturing the same WO2009066950A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0119864 2007-11-22
KR1020070119864A KR100919539B1 (ko) 2007-11-22 2007-11-22 방열기판 및 그 제조방법

Publications (2)

Publication Number Publication Date
WO2009066950A2 true WO2009066950A2 (en) 2009-05-28
WO2009066950A3 WO2009066950A3 (en) 2009-07-09

Family

ID=40668002

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/006865 WO2009066950A2 (en) 2007-11-22 2008-11-21 Heat-radiating substrate and method of manufacturing the same

Country Status (3)

Country Link
KR (1) KR100919539B1 (ko)
TW (1) TW200939909A (ko)
WO (1) WO2009066950A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101233086B1 (ko) * 2012-09-04 2013-02-18 주식회사 썬닉스 엘이디 조명용 반사판 및 그의 제조 방법
KR102659135B1 (ko) * 2015-12-30 2024-04-18 엘지디스플레이 주식회사 피시비 기판 및 이를 포함하는 표시장치
US10381562B1 (en) * 2018-05-17 2019-08-13 Qualcomm Incorporated Method and apparatus for cooling of an electronic device
KR20220060943A (ko) 2020-11-05 2022-05-12 우리산전 주식회사 방열소재 소결체 제조방법
KR20220101523A (ko) 2021-01-11 2022-07-19 (주) 미래이피 방열기판 및 이의 제조방법

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391841A (en) * 1992-12-08 1995-02-21 Quick; Nathaniel R. Laser processed coatings on electronic circuit substrates
JPH10261847A (ja) * 1997-03-19 1998-09-29 Matsushita Electric Ind Co Ltd 電子部品搭載用放熱基板
KR20040086679A (ko) * 2003-04-03 2004-10-12 대한민국(서울대학교 총장) 다양한 단차 구조를 형성하기 위한 기판 식각 방법 및이를 이용한 3차원 마이크로시스템용 방열판 제조 방법
US7161806B2 (en) * 2003-09-18 2007-01-09 Fuji Electric Systems Co., Ltd. Heat sink and method for its production

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040021040A (ko) * 2002-09-02 2004-03-10 박종진 고출력 증폭기용 알에프 피씨비 기판 제조방법

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5391841A (en) * 1992-12-08 1995-02-21 Quick; Nathaniel R. Laser processed coatings on electronic circuit substrates
JPH10261847A (ja) * 1997-03-19 1998-09-29 Matsushita Electric Ind Co Ltd 電子部品搭載用放熱基板
KR20040086679A (ko) * 2003-04-03 2004-10-12 대한민국(서울대학교 총장) 다양한 단차 구조를 형성하기 위한 기판 식각 방법 및이를 이용한 3차원 마이크로시스템용 방열판 제조 방법
US7161806B2 (en) * 2003-09-18 2007-01-09 Fuji Electric Systems Co., Ltd. Heat sink and method for its production

Also Published As

Publication number Publication date
WO2009066950A3 (en) 2009-07-09
KR20090053170A (ko) 2009-05-27
TW200939909A (en) 2009-09-16
KR100919539B1 (ko) 2009-10-01

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